TWI473291B - 發光二極體元件 - Google Patents
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Description
本發明係關於照明(lighting)技藝。尤其關於單晶片和多晶片發光二極體元件及其製作方法,而且以其特別之參考加以說明。然而,本發明通常應用於發光封裝,而且可應用於封裝之單石發光二極體陣列晶粒、邊緣放射雷射晶粒、垂直空腔(cavity)發光晶粒或單石雷射陣列晶粒、有機發光裝置或有機發光陣列裝置等。實質上,本發明之發光封裝和元件將應用於利用一或更多光源之任何應用中。
發光二極體元件在小型、堅固、可靠之封裝中提供亮度。發光二極體已經以橫跨可見光譜之許多顏色加以發展,而且延伸至紅外和紫外光。雖然每一發光二極體通常在一狹窄之光譜範圍中發光,但主要的有色發光二極體可被組合以放射白光。在產生白光之另一途徑中,來自一藍、紫或紫外發光二極體之光與一適當之磷光體耦合而產生白光。類似地,可藉由適當選擇發光晶粒元件、磷光體以及二極體元件與磷光體之組合而產生其他顏色。
有關發光二極體元件或封裝的一課題係關於光輸出強度。早期之發光二極體具有低光輸出強度,而且通常無法與白熱或螢光光源匹敵。晶體成長、裝置加工、封裝方法、磷光體材料等之改良已實質改善現代之發光二極體封裝的光輸出強度。然而,依舊尋求光輸出強度之改良。
有關發光二極體元件和封裝之另一課題係關於堅固性。像是將晶粒接合至導線框架之普遍使用之封裝技術可產生相對較易碎的發光封裝。然而,發光二極體元件和封裝傾向於複雜。一典型單晶片封裝例如將包括:一發光二極體晶粒、一導線框架、佈置於該發光二極體晶粒和該導線框架其一部分之上的一封膠,以及嵌入該封膠中的一磷光體。
多晶片封裝通常更增添複雜性。此一多晶片封裝的一例示揭露於Lowery之美國專利案號6,504,301,其中出示各種安排,通常包含:在一種放置於包括一筒狀盒和一螢光板的一外殼中之支撐架上所佈置的複數個發光晶粒之絲焊互連。一類似之多晶片封裝揭露於Baretz等人之美國專利案號6,660,175。Baretz揭露:一種佈置於該外殼裡面之封膠中所包含的一磷光體。像是Lowery和Baretz等其多晶片封裝之複雜性將不利衝擊可製造性、可靠度和製造成本。
有關典型發光二極體封裝和元件之又另一課題為操作壽命。因為紫外或短波長可見光照射所造成之封膠或其他材料的變色或其他退化,利用紫外或短波長可見光之磷光體波長轉換的封裝其效能通常隨時間而退化。
本發明考慮用以克服上述限制以及其他之改良裝置和方法。
根據一方面,揭露一種發光封裝。一印刷電路板支撐架至少一發光晶粒和至少兩電氣端點。該印刷電路板之印刷電路連接該至少一發光晶粒與該至少兩電氣端點以提供其電力。一光傳輸蓋佈置於該至少一發光晶粒之上但不在該至少兩電氣端點之上。該蓋子具有一種定義與該印刷電路板連接的一蓋子周界之開放末端。該蓋子的一內表面與該印刷電路板一起定義用以包含該至少一發光晶粒的一內部容體。一封膠佈置於該內部容體中而且覆蓋該至少一發光晶粒。
根據另一方面,揭露一種發光封裝。一支撐架具有佈置於其上面之至少一發光晶粒。一玻璃蓋佈置於該支撐架上而且在該至少一發光晶粒之上。該玻璃蓋和該支撐架合作定義用以包含該至少一發光晶粒的一內部容體。一封膠佈置於該內部容體中而且囊封該至少一發光晶粒。
根據另一方面,揭露一種發光封裝。一支撐架具有佈置於其上面之至少一發光晶粒。一單片光傳輸蓋佈置於該支撐架上而且在該至少一發光晶粒之上。該單片蓋子和該支撐架合作定義用以包含該至少一發光晶粒的一實質關閉之內部容體。一封膠佈置於該內部容體中而且囊封該至少一發光晶粒。
根據又另一方面,提供一種製作一發光封裝之方法。將至少一發光晶粒電子及機械連接至一印刷電路板。將一光傳輸蓋緊閉於該印刷電路板。該光傳輸蓋覆蓋該至少一發光晶粒。該緊閉之光傳輸蓋和該印刷電路板合作定義一內部容體。將一封膠佈置於該內部容體中。
根據再又另一方面,提供一種在一表面上佈置一磷光體之方法。將一黏著劑佈置於該表面上。將一磷光體粉末施於該黏著劑上。使該黏著劑硬化。
當閱讀及了解本說明書時,熟習此項技藝者將明白本發明之許多優勢與好處。
參照圖1-3,一發光封裝8包括其上面佈置一或更多發光晶片或晶粒的一印刷電路板10。較佳者,該印刷電路板實質上為熱傳導。例如可利用一金屬芯印刷電路板。在圖解之具體實施例中,電路板10上佈置三發光晶片或晶粒12、14、16;然而,晶粒數可為一晶粒、兩晶粒或三晶粒以上。該或該等晶粒可為III氮化物群之藍或紫外發光二極體、紅色III磷化物群或III砷化物群之發光二極體、II-VI發光二極體、IV-VI發光二極體、矽或矽鍺發光二極體等。在某些考慮之具體實施例中,該或該等晶粒係邊緣放射雷射或垂直空腔表面放射雷射。發光晶片或晶粒亦可為有機發光二極體或裝置。每一發光晶粒或多個晶粒可為裸晶,或者每一晶粒或多個晶粒可包括個別封膠。又進一步,該或該等晶粒可為發光二極體凸形、垂直空腔表面放射雷射凸形等的一單石陣列。在圖解之具體實施例中,晶粒12、14、16佈置於對應反射井22、24、26中;然而,該或該等晶粒可裝載於印刷電路板10的一平面表面上,或者可裝載於凸起之臺座或其他架高之支撐架結構上。在某些具體實施例中,其上面佈置發光晶粒或晶片12、14、16之印刷電路板10所有邊的部分上佈置一反射層,用以改良來自封裝8之光萃取。
特別參照圖3,圖解之印刷電路板10包括夾在絕緣層32、34間的一或更多印刷電路層30。通常,電子焊墊係使用穿過絕緣層32之適當管道在印刷電路板10的晶粒附接表面上形成,以電子連接晶粒12、14、16與印刷電路30。該或該等晶粒12、14、16可以各種方式機械及電子附接至印刷電路板10,像是藉由將晶粒電極倒裝晶片接合至印刷電路板10之電子焊墊;藉由將晶粒焊接至板子10並使用絲焊電子連接晶粒電極與印刷電路板10之電子焊墊;藉由將晶粒焊接至裝載於印刷電路板10上的一導線框架(未出示)等。晶粒附接可包括佈置在一發光晶粒或晶片與印刷電路板或其他支撐架之間或者在晶片與一導線框架之間的一子裝載(未出示)。又進一步,取代如此處圖解之裝載的個別晶粒,考慮利用在一公用基板上形成的一單石發光二極體陣列。在此一考慮之具體實施例中,該公用基板係焊接抑或緊閉於印刷電路板10上,而且連至個別發光凸形或結構之電子連接係藉由絲焊、在該公用基板上所形成之傳導線跡等作成。替代上,可配置具有一透明公用基板的一單石陣列以用於將發光凸形或結構之電極直接接合至電子焊墊的一倒裝晶片裝載。
較佳者,印刷電路板10進一步包括像是一接地板或金屬芯38的一散熱結構,用以提供發光晶片或晶粒12、14、16之散熱。一絕緣背板(未出示)選擇性佈置於離開晶粒附接表面之金屬芯38其末梢的旁側。在具有較低功率之照明封裝、裝載於一散熱表面之封裝中選擇性省略散熱器。再者,在某些具體實施例中,印刷電路層30將提供充分散熱。在再又其他具體實施例中,選擇熱傳導材料形成絕緣層32、34,因而此等層提供散熱。
印刷電路板10選擇性支撐架關聯電子元件,像是一齊納(zener)二極體元件44,其包括藉由印刷電路30在發光晶粒12、14、16對面連接以提供該等晶粒之靜電放電防護的一或更多齊納二極體。類似地,可包括電子功率轉換電路、功率調整電路、整流電路等以作為印刷電路板10上之額外元件。這類元件可當作一或更多分離元件或當作一專用積體電路(ASIC)加以提供。再者,印刷電路板10上可佈置一電子插頭、配接器、電氣端點46等。在某些具體實施例中,考慮包括一組電氣端點以上,例如用以促成複數個發光封裝之串列、平行或串列平行互連。印刷電路30包括連接電氣端點46與發光晶粒或晶片12、14、16之線跡,其使施於電氣端點46之適當電子功率激發發光晶粒或晶片12、14、16和(如果有的話)像是齊納二極體元件44之關聯電路。印刷電路板10可包括像是一裝載插座、裝載開口50、52等用以機械式安裝或緊閉發光封裝8之其他特性。
所述印刷電路板10係一例示。亦可利用其他類型之印刷電路板或其他支撐架結構。例如,印刷電路線跡可佈置於晶粒附接表面與/或底面,取代夾在絕緣層32、34之間。因此,例如,該印刷電路板可為一種具有在該絕緣支撐架上蒸發及成型抑或形成的一傳導線跡之電子絕緣支撐架。再者,該印刷電路板的一散熱器可例如以焊接抑或機械緊閉至散熱器之發光晶粒及以絲焊至電子焊墊之晶粒電極加以替換。
繼續參照圖1-3,發光封裝8進一步包括佈置於發光晶粒或晶片12、14、16之上的一光傳輸蓋60。該光傳輸蓋具有一種定義與印刷電路板10連接的一蓋子周界62之開放末端。在圖解之具體實施例中,印刷電路板10包括用以接收發光封裝8中一半球形圓頂狀蓋子之光傳輸蓋60其周界62的一選擇性環狀溝槽66。溝槽66導引將蓋子60定位於印刷電路板10上,而且同時選擇性協助將蓋子緊閉至該板子。在某些具體實施例中,省略環狀溝槽66,該情況下,將蓋子60放置於印刷電路板10上係藉由像是使用一自動化組合機之其他構件加以定位。
光傳輸蓋60可像是藉由一黏著劑、藉由適於周界62與溝槽66間的一磨擦、藉由卡榫等以各種方式緊閉至印刷電路板10。光傳輸蓋60和印刷電路板10一起定義用以包含發光晶粒或晶片12、14、16的一內部容體70。在某些具體實施例中,實質上光傳輸蓋60之周界62與印刷電路板10間之連接係實質密閉式密封內部容體70的一不透氣密封連接。在其他具體實施例中,周界62與印刷電路板10間之連接並非一密閉式密封,而將包含一或更多間隙、開口等。
一磷光體72(在圖3中以一虛線指示)選擇性佈置於蓋子60的一內表面。如果提供,則選擇磷光體以產生由發光晶粒或晶片12、14、16產生之光其一部分或實質上全部的一希望波長轉換。術語"磷光體"據了解為包括選擇用來產生一選定波長轉換的一單一磷光體化合物,或者二或更多化學相異個別化合物之融接。表I中提供適當磷光體化合物之例示。熟習此項技藝者可很容易選擇適合用以執行特定光轉換之其他磷光體。在一具體實施例中,發光晶粒或晶片12、14、16係像是III氮化物群發光二極體之藍、紫或紫外放射器,而且磷光體72將晶片12、14、16所產生之大部分或實質上全部的光轉換成白光。在另一具體實施例中,發光晶粒或晶片12、14、16係像是III氮群發光二極體之藍發光器,而且磷光體72係將某些藍光轉換成黃光的一黃磷光體,其中直接藍光與間接黃磷光體產生光將組合而產生白光。在又另一具體實施例中,發光晶粒或晶片12、14、16係藍、紫或紫外放射器,而且磷光體72將大部分或實質上全部之放射光轉換成具有像是綠、黃、紅等的一選定顏色之光,因而發光封裝8產生一有色光。以上僅為例示,而且實質上由發光晶粒或晶片12、14、16產生之光的任何轉換可藉由以一選定波長輸出之發光晶粒或晶片12、14、16之適當選擇及磷光體72之適當選擇加以執行。某些具體實施例中,省略磷光體72,而且發光二極體12、14、16所產生之直接光即發光封裝之光輸出。
在某些具體實施例中,光傳輸蓋60係一玻璃蓋,其中"玻璃"不限於基於矽之材料,而且實質上含括任何無機、無定形光傳輸材料。製作玻璃之蓋子60具有優於塑膠或其他有機蓋子的某些優勢。玻璃通常具有優於大部分塑膠之熱穩定性。玻璃較易塗佈像是波長選擇反射塗層、波長選擇吸收塗料等光學塗層。相較於大部分塑膠,玻璃通常亦較耐刮。再者,在發光晶粒或晶片12、14、16產生紫外或短波長可見光之具體實施例中,玻璃具有特殊優勢,因為具有此等波長之光可使光傳輸塑膠的光學品質隨時間變色抑或退化。在其他具體實施例中,光傳輸蓋60係由塑膠或另一有機光傳輸材料所作成。在另外其他考慮之具體實施例中,蓋子60係由像是晶態石英的一晶態光傳輸材料所作成。這類晶態蓋子通常共享玻璃蓋之許多優勢。
再者,印刷電路板10可包括用以改良光萃取效率之各種反射塗層或反射表面。在某些具體實施例中,其上面實質佈置發光晶粒或晶片12、14、16和蓋子60之印刷電路板的整個表面同時反射由發光晶片產生之光和由磷光體72產生之光。在其他具體實施例中,由蓋子60所覆蓋之印刷電路板表面的部分或區域同時反射由發光晶片產生之光和由磷光體72產生之光,而蓋子60外面之印刷電路板表面的部分或區域主要反射由磷光體72產生之光。此等後者之具體實施例適合用於實質上由發光晶粒或晶片12、14、16產生之所有直接光係由磷光體加以轉換時,因而實質上輸出光完全因為磷光體。藉由在蓋子60裡面和外面使用不同之反射塗層或表面可獨立最佳化每一反射塗層或表面以反射希望之光譜。
將明白:如此處用以描述蓋子60之術語"光傳輸"指由發光封裝8所產生之希望的光輸出。該光輸出包括由磷光體72產生之光,如果出現,其響應發光晶粒或晶片12、14、16的光滲。在某些具體實施例中,光輸出包括由發光晶粒或晶片12、14、16所產生的一部分或所有直接光。後者之具體實施例的例示為一白光,其中該白輸出光係由發光晶粒或晶片12、14、16放射之藍光和由磷光體72放射之黃光的一融接;或為完全省略磷光體72之具體實施例。一旦由發光晶粒或晶片12、14、16產生之直接光貢獻給輸出光,則對於該直接光而言,蓋子60應為至少部分光傳輸。另一方面,在單獨由磷光體72產生輸出光之具體實施例中,對於磷光體輸出而言,蓋子60可為光傳輸,但對於由發光晶粒或晶片12、14、16產生之直接光而言,其係部分或完全之反射或吸收。此一發光封裝的一例示為一白發光封裝,其中輸出白光係由磷光體72所產生,以響應由發光晶粒或晶片12、14、16產生之紫或紫外光。
磷光體72可使用例如像是靜電塗佈、泥漿塗佈、噴灑塗佈等一適當磷光體塗佈處理施於光傳輸蓋60之內表面。再者,可將該磷光體佈置於蓋子60之內表面以外的其他地方。例如,該磷光體可使用像是噴灑塗佈、外表面塗佈等施於蓋子60之外表面,或者同時施於蓋子60之內和外表面。在又另一具體實施例中,將該磷光體嵌入光傳輸蓋60之材料中。然而,該磷光體不易嵌入大部分之玻璃或晶態材料中。在某些具體實施例中,將該磷光體佈置在旋塗於抑或塗佈於蓋子60之內與/或外表面的一玻璃連結物中。
在一適當之加磷處理中,藉由以作為黏膠的一液體或低黏度半固體材料加以處置而準備蓋子60之內表面。該液體材料例如可為液體環氧樹脂或矽基樹脂。該黏膠材料可以各式各樣方式施加,像是藉由將其工作配方或其一液溶噴灑、刷抹或浸泡於像是丙酮或甲基異丁基甲酮(MIBK)的一適當溶劑中。然後藉由將磷光體以粉末形式散撒、浸泡或傾倒而沉積該磷光體,沉積方法之選擇係根據蓋子60其內表面之本質。例如,傾倒之磷光體粉末適合倒入蓋子60的凹陷內表面。另一方面,浸泡通常係用以塗佈蓋子60之外表面的一較佳方法。然後藉由溶劑蒸發、熱或UV固化等使黏膠硬化,以形成磷光體層。
可執行上述示範之磷光體沉積和硬化處理的重複或各種組合以例如沉積一個以上之磷光體,或者磷光體的一融接,抑或依需要而達到一要求厚度或分層結構。該磷光體塗佈可選擇性以透明黏膠或其他適當材料的一最終層覆蓋,以提供機械防護,而過濾出周遭紫外光或來自發光晶粒12、14、16之過量輻射等。
光傳輸蓋60選擇性包括磷光體72以外的一或更多光學塗層。在某些具體實施例中,將一抗反射塗層施於蓋子60之內與/或外表面,以促進光傳輸。在由發光晶粒或晶片12、14、16產生之直接光未形成輸出光其一部分的具體實施例中,光傳輸蓋60選擇性包括一波長選擇反射塗層,用以將直接光反射回至具有與磷光體72交互作用之額外機會的內部容體70。
在較佳之具體實施例中,光傳輸蓋60係像是一單片玻璃蓋子、一單片鑄模塑膠蓋子等的一單片蓋子。將蓋子60製造成一單片可簡化照明封裝8之組合。一單片蓋子60之另一優勢為:藉由確保蓋子60之周界62與印刷電路板10間的一實質密閉式密封而獲得內部容體70的一實質密閉式密封。光傳輸蓋60可包括促進光散射以產生一較空間均勻之光輸出的小平面、菲涅耳(fresnel)透鏡等值線,或者其他光反射特性。類似地,光傳輸蓋60可由使用沙等加以蝕刻而產生光散射的一毛玻璃加以作成。
特別參照圖3,在照明封裝8中,內部容體70實質填充一封膠76。封膠76例如可為一矽基樹脂封膠、一環氧樹脂封膠等。封膠76對發光晶粒或晶片12、14、16所產生之光而言係透明,而且作為一折射指數匹配材料,用以促進來自發光晶粒或晶片12、14、16之光萃取,且較佳者同時促進與磷光體72之光耦合,而且如果由發光晶粒12、14、16產生之直接光直接貢獻給封裝光輸出,則較佳者同時促進進入蓋子60之光傳輸。
在某些具體實施例中,將該磷光體散布於與封膠76相同材料的一連結材料中。在其他具體實施例中,磷光體連結材料係一不同之材料,其具有與封膠76匹配良好的一折射指數。在又一其他具體實施例中,封膠76用來作為磷光體72之連結材料。將明白:雖然圖3中出示之磷光體72係實質上沿著蓋子60的內表面常駐,但在某些具體實施例中,磷光體72將離開蓋子60之內表面延伸某一距離,而且進入佈置於內部容體70中的封膠76。在某些考慮之具體實施例中’該磷光體實質上散布於封膠76中,且甚至均勻分散而遍佈封膠76。然而,如國際公告WO 2004/021461 A2中所述,空間上分離磷光體與發光晶粒或晶片具有效率優勢。因此,在較佳之具體實施例中,將該磷光體佈置於蓋子60之內表面,或者相較於發光晶粒或晶片12、14、16,其較接近蓋子60而佈置。
在發光晶粒或晶片12、14、16係裸晶(即非個別囊封)之具體實施例中,封膠76提供發光晶粒或晶片12、14、16的一公用囊封,用以防護晶片免於由暴露於濕氣或其他有害環境之效應所造成的損壞。封膠76亦可提供發光晶粒或晶片12、14、16之鑄封,用以改良照明封裝8之穩健性,而且使照明封裝8較能抵抗來自振動或其他機械擾動的損壞。
在某些具體實施例中,將蓋子60密封於印刷電路板10,而且於密封該光傳輸蓋後,將封膠76注入內部容體70中。為了促成封膠注射,在印刷電路板10中提供開口80、82。替代上,可在該光傳輸蓋中或在蓋子周界與印刷電路板間之介面上提供開口。較佳者,提供至少兩個這類開口80、82,以便當封膠材料注入一開口時,置換空氣可經由另一開口退出。在其他具體實施例中,一單一伸長抑或放大之開口用以提供流入之封膠和流出之置換空氣的空間。
在內部容體70係實質密閉式密封之具體實施例中,注入的封膠76可為包含於密閉式密封之內部容體70的一液體或非剛硬半固體封膠。在某些具體實施例中,可將該液體或非剛硬半固體封膠保持非固化,因為密閉式密封防止封膠洩漏。再者,在某種壓力下,一密閉式密封選擇性允許封膠之注入,使封膠具有高於大氣壓力的一壓力。在某些具體實施例中,內部容體70並非密閉式密封,而且某些注入之封膠材料將洩漏出來。將明白:對於具有合理高黏度之封膠材料,洩漏之封膠材料數量有限,而且如果當注入之封膠固化抑或硬化成一固態時,這類洩漏之封膠材料可協助密封內部容體70,則其甚至將為一優勢。
繼續參照圖1-3且進一步參照圖4,說明用以製造照明封裝8的一示範處理100。在一晶粒附接處理102中,機械及電子連接發光晶粒或晶片12、14、16與印刷電路板10。該晶粒附接可包含倒裝晶片接合、焊接、絲焊等。另外,如果封裝8中包括磷光體,則在一加磷處理104中以磷光體72塗佈光傳輸蓋60之內表面(與/或選擇性其外表面)。在該蓋子中嵌入磷光體之具體實施例中,省略加磷處理104,而且取而代之,於蓋子60的模鑄或其他成形期間合併該磷光體。然後在一密封處理106中,將該蓋子緊閉於而且選擇性密封於印刷電路板10。密封處理106定義內部容體70,其選擇性為一密閉式密封容體。然後在一封膠注入處理108中,封膠76透過開口80、82注入內部容體70。如果封膠材料必需固化,則在一固化處理110中使該封膠固化。於封膠76之注入及選擇性固化後,在一密封處理112中,以一適當之密封材料選擇性密封開口80、82。在某些具體實施例中,封膠76同時密封開口80、82,所以在此等具體實施例中,省略分開之密封處理112。
參照圖5,另一照明封裝8'包括圖解於圖5中而且分別對應於照明封裝8其印刷電路板10、蓋子60和蓋子周界62的一印刷電路板10'和一種具有定義一蓋子周界62'的一開放末端之光傳輸蓋60'。照明封裝8'亦包括在圖5之外部透視圖中無法見到之照明封裝8的大部分其他元件。照明封裝8'與圖1-3之照明封裝8不同,其中在照明封裝8'中,照明封裝8之電氣端點46係由佈置於印刷電路板10'背面的四個電氣端點46'加以取代。電氣端點46'藉由常駐於印刷電路板10'之適當印刷電路與佈置於蓋子60'中的發光晶粒電子連接。可配置背面之電氣端點46',用以例如插入一四叉尖表面裝載插口之插座的匹配開口。
參照圖6,另一照明封裝8"包括長條狀的一印刷電路板10",其上面有複數個發光晶粒或晶片12"以一雙列安排沿著板子條安排於反射井22"中。印刷電路板10"包括夾在絕緣層32"、34"與一接地板或金屬芯38"間的一或更多印刷電路層30"。佈置於印刷電路板10"上之電氣端點46"經由印刷電路30"將電子功率傳遞給發光晶粒或晶片12"。一光傳輸蓋60"係管狀,用以覆蓋長雙列發光晶粒或晶片12";而且具有一開放末端,其定義由印刷電路板10"中形成的一匹配溝槽66"加以接收的一周界62"。緊閉至印刷電路板10"之管狀蓋子60"與其一起定義用以包含發光晶粒或晶片12"的一伸長或管狀內部容體70"。一磷光體72"選擇性塗佈於管狀蓋子60"的一內表面。一封膠76"實質上填充內部容體70",以囊封及鑄封發光晶粒或晶片12"和選擇性磷光體72"。
參照圖7,又另一照明封裝208包括安排於其上面的一或更多(顯然圖解之具體實施例中為三)發光晶粒或晶片212的一印刷電路板210。在照明封裝208中,發光晶粒或晶片212並非佈置於反射井中;反而,其係表面裝載至印刷電路板210的一水平表面。印刷電路板210包括夾在絕緣層232、234與一接地板或金屬芯238間的一或更多印刷電路層230。一齊納元件244提供發光晶粒或晶片212之靜電放電防護。佈置於印刷電路板210上之電氣端點246經由印刷電路230將電子功率傳遞給發光晶粒或晶片212。一光傳輸蓋260覆蓋發光晶粒或晶片212,而且具有一開放末端,其定義一種與印刷電路板210連接以定義包含發光晶粒或晶片212的一內部容體270之周界262。一磷光體272選擇性塗佈於光傳輸蓋260的一內表面。照明元件或封裝208之上述元素類似於圖1-3中所示之照明元件或者封裝8之對應元素。
照明封裝208與照明封裝8之不同在於佈置於內部容體中之封膠的組態。在照明封裝208中,一第一封膠276囊封及選擇性鑄封發光晶粒或晶片212,但並未實質填充內部容體270。在某些具體實施例中,第一封膠276將僅囊封一或更多發光晶粒212。如果封裝208中包括此一磷光體,則一第二封膠278囊封磷光體272。在某些具體實施例中,第二封膠278為磷光體270之連結材料。例如,可將磷光體272施於蓋子260之內表面,而且此具體實施例中之封膠為所施磷光體的連結材料。通常,第一和第二封膠276、278可為不同材料。一實質間隙280在第一與第二封膠276、278間延伸。通常,間隙280包含空氣;然而,其亦考慮以一惰性氣體填充間隙280以便在照明封裝208中產生濕氣。在又另一具體實施例中,間隙280填滿不同於第一和第二封膠276、278中至少其一的一第三封膠。在照明封裝208中,印刷電路板210中不存在用以接收蓋子260之周界262的溝槽。然而,可選擇性提供類似於照明封裝8之溝槽66的此一溝槽,以調正及選擇性協助將蓋子260緊閉至印刷電路板210。
繼續參照圖7且進一步參照圖8,說明製造照明封裝208的一示範處理300。在一晶粒附接處理302中,將發光晶粒或晶片212與印刷電路板210機械及電子連接。該晶粒附接可包含倒裝晶片接合、焊接、絲焊等。在一第一囊封處理304中,將附接之發光晶粒212囊封或鑄封於印刷電路板210上,而且在應用於印刷電路板210的一第一固化處理306中使第一封膠276固化。
另外在一加磷處理310中以磷光體272塗佈光傳輸蓋260之內表面(與/或選擇性其外表面)。在蓋子中嵌入磷光體之具體實施例中,省略加磷處理310,而且取而代之,於蓋子260之模鑄或其他成形期間合併該磷光體。在一第二囊封處理312中,將該磷光體囊封於光傳輸蓋260上,而且在應用於光傳輸蓋314的一第二固化處理314中,使第二封膠278固化。如果從封裝208中省略磷光體272,則宜省略處理310、312和314。在某些具體實施例中,第二封膠278為磷光體272之連結材料;在此等具體實施例中,將整合加磷處理310與第二封膠處理312。然後在一緊閉處理316中,將光傳輸之加磷蓋子緊閉且選擇性密封至印刷電路板210上。緊閉處理316中定義內部容體270,其選擇性為一密閉式密封容體。
參照圖9,再又另一照明封裝408包括其上面有一單一發光晶粒或晶片412表面裝載至印刷電路板410其一水平表面的一印刷電路板410。印刷電路板410包括與發光晶粒412佈置於相同表面之兩印刷電路線跡430、431。兩傳導線跡430、431可藉由金屬蒸發等形成。導線接合436、437連接發光晶粒或晶片412之頂側電極與傳導線跡430、431。該印刷電路板包括在其上面形成兩印刷電路線跡430、431的一絕緣層432及一選擇性接地板或金屬芯438。一光傳輸蓋460覆蓋發光晶粒或晶片412,而且具有一開放末端,其定義一種與印刷電路板410連接以定義用以包含發光晶粒或晶片412的一內部容體470之周界462。兩印刷電路線跡430、431從蓋子460裡面延伸至蓋子460外面,以提供進入內部容體470之電子通信。一磷光體472選擇性塗佈於光傳輸蓋460的一內表面,而且一封膠476實質填充內部容體470。在光傳輸蓋460之周界462形成的半球形開口480、482允許封膠材料之注入及空氣之對應置換。亦即,照明封裝408之開口480、482用於與照明封裝8之印刷電路板開口80、82(見圖3)相同的用途。
繼續參照圖9,一反射塗層488塗佈於光傳輸蓋之內表面。反射塗層488實質反射由發光晶粒或晶片412產生之光,但實質傳輸響應發光晶粒或晶片412之亮度而由磷光體472產生之光。在照明封裝408中,磷光體472佈置於反射塗層488上,而且延伸一些距離而至封膠476中。
已參照較佳具體實施例說明本發明。顯然,於閱讀及了解前述之詳細說明時,他人將想到其修正和改變。希望:只要出現於附加請求項或其等價事物之範圍內,本發明將視同包括所有這類修正與改變。
8,8',8",208,408...發光封裝
10,10',10",210,410...印刷電路板
12,12",14,16,212,412...發光晶粒
22,22",24,26...反射井
30,30",230...印刷電路層
32,32",34,34",232,234,432...絕緣層
38,38",238,438...接地板或金屬芯
44,244...齊納(zener)二極體元件
46,46',46",246...電氣端點
50,52...裝載開口
60,60',60",260,460...光傳輸蓋
62,62',62",262,462...蓋子周界
66,66"...溝槽
70,70",270,470...內部容體
72,72",272,472...磷光體
76,76",276,278,476...封膠
80,82,480,482...開口
280...間隙
430,431...印刷電路線跡
436,437...導線接合
488...反射塗層
本發明可採用各種元件和元件安排以及各種處理作業和處理作業安排之形式。該等圖式僅作為圖解較佳具體實施例之用,不應被解釋成本發明之限制。
圖1出示一照明元件或封裝的一透視圖。
圖2出示其上面佈置發光晶粒或晶片和關聯電子元件之圖1的照明封裝之印刷電路板的一透視圖。
圖3出示圖1之照明元件或封裝的一透視圖,其中移除加磷光傳輸蓋的一部分以出示該照明封裝之內部元素。
圖4圖解一種製造圖1之照明封裝的示範處理。
圖5出示具有背面電氣端點之另一照明元件或封裝的一透視圖。
圖6出示具有安排成一長雙列之發光晶片之另一照明元件或封裝的一透視圖。在圖6中,移除加磷光傳輸蓋的一部分以出示某些發光晶粒或晶片和其他內部元件。
圖7出示又另一照明元件或封裝的一透視圖,其中發光晶粒和磷光體係以分離封膠加以囊封。在圖7中,移除加磷光傳輸蓋的一部分以出示該照明封裝之內部元素。
圖8圖解一種製造圖7之照明封裝的示範處理。
圖9出示再又另一照明元件或封裝的一透視圖,其中該印刷電路板包括兩蒸發傳導線跡。在圖9中,移除加磷光傳輸蓋的一部分以出示該照明封裝之內部元素。
8...發光封裝
10...印刷電路板
44...齊納(zener)二極體元件
46...電氣端點
50,52...裝載開口
60...光傳輸蓋
62...蓋子周界
Claims (10)
- 一種發光封裝,其包含:一印刷電路板,其支撐複數個裸發光晶粒且具有至少兩電氣端點,該印刷電路板之印刷電路連接該複數個裸發光晶粒與該至少兩電氣端點以提供其電力;一以一光傳輸材料製成之單片半球形圓頂狀光傳輸蓋,該單片半球形圓頂狀光傳輸蓋佈置於該複數個裸發光晶粒之上但不在該至少兩電氣端點之上的該印刷電路板上,該單片半球形圓頂狀光傳輸蓋具有一種用以定義與該印刷電路板連接的該單片半球形圓頂狀光傳輸蓋之一蓋子周界之開放末端,該單片半球形圓頂狀光傳輸蓋的一內表面與該印刷電路板一起定義用以包含該複數個裸發光晶粒的一內部容體;一封膠,其佈置於且至少實質上填充該內部容體中而且覆蓋該複數個裸發光晶粒,使得該等裸發光晶粒係藉由該封膠而共同地囊封且不包括分離囊封;及一磷光體,其佈置鄰近該單片半球形圓頂狀光傳輸蓋且遠離該複數個裸發光晶粒,至少實質上填充該內部容體之該封膠促進該複數個裸發光晶粒與遠端磷光體間之光耦合。
- 如請求項1之發光封裝,其中至少兩開口與該內部容體通信,該等開口成形於下列至少其一:(i)該印刷電路板,(ii)該單片半球形圓頂狀光傳輸蓋,以及(iii)該單片半球形圓頂狀光傳輸蓋與該印刷電路板間的一介面。
- 如請求項1之發光封裝,其中該封膠係一液體封膠和一非剛硬半固體封膠之一,其係被藉由單片半球形圓頂狀光傳輸蓋與印刷電路板合作定義之該內部容體所包含,以防止該封膠洩漏至該內部容體之外。
- 如請求項1之發光封裝,其中該印刷電路板包括一反射塗層。
- 如請求項1之發光封裝,其中該印刷電路板係包括一散熱芯。
- 如請求項1之發光封裝,其中該單片半球形圓頂狀光傳輸蓋包含:一無機無定形光傳輸蓋。
- 如請求項1之發光封裝,其中該單片半球形圓頂狀光傳輸蓋係一玻璃蓋。
- 如請求項1之發光封裝,其中該磷光體係佈置於該單片半球形圓頂狀光傳輸蓋之該內表面上。
- 如請求項1之發光封裝,其中該內部容體係藉由該蓋子周界與該印刷電路板之間的連接而實質密閉式密封。
- 如請求項1之發光封裝,其中該磷光體係分佈於該封膠的一部分,遠離該複數個裸發光晶粒且靠近該單片半球形圓頂狀光傳輸蓋。
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- 2005-04-25 EP EP05740241.4A patent/EP1743358B1/en active Active
- 2005-04-25 CN CN201310632677.2A patent/CN103633228A/zh active Pending
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- 2005-04-25 JP JP2007510852A patent/JP5503844B2/ja active Active
- 2005-04-25 KR KR1020067024601A patent/KR101161461B1/ko active IP Right Grant
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Also Published As
Publication number | Publication date |
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JP5503844B2 (ja) | 2014-05-28 |
KR20070013312A (ko) | 2007-01-30 |
TW200610189A (en) | 2006-03-16 |
CN103633228A (zh) | 2014-03-12 |
US7224000B2 (en) | 2007-05-29 |
EP1743358A2 (en) | 2007-01-17 |
AU2005239406B2 (en) | 2011-10-06 |
WO2005106926A3 (en) | 2006-06-01 |
EP1743358B1 (en) | 2019-05-15 |
CN1969369A (zh) | 2007-05-23 |
WO2005106926A2 (en) | 2005-11-10 |
KR101161461B1 (ko) | 2012-07-02 |
US20050239227A1 (en) | 2005-10-27 |
AU2005239406A1 (en) | 2005-11-10 |
EP1743358A4 (en) | 2014-03-26 |
JP2007535175A (ja) | 2007-11-29 |
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