519772 五、發明說明（1) 1 ·本技藝適用領域 本技藝適用於發光二極體（light emitting diode，LED) 之表面黏著式封裝。 2·背景說明 習知技藝如圖1所示’發光二極體晶片1 〇安置在金屬i 2 上’發光二極體晶片1 〇的底面電極接觸耦合於金屬丨2，發 光二極體晶片1 〇的表面電極以打線1 3耦合於金屬11。保護 膠體14封裝保護金屬11· 12·上方個元件，保護膠體14在發 光二極體晶片1 〇的光線出射區域形成凸出面，構成凸透鏡 效果，提供光線聚集增強的功能。這種習知技藝的缺點便 疋凸出面’使得吸取裝置無法輕易吸取此一元件。為了克 服此一問題，本技藝首先構想，將具有透鏡之LED表面黏 耆封裝之上表面，製作成為平面狀，而克服習知技藝的前 述缺點。 3 · 本技藝的摘要說明 本技藝主要目的為設計一個具有聚光透鏡之LED表面黏著 元件封裝，且該封裝的上表面製作成為平面狀，便於吸取 裝置之吸取用。 4 . 本技藝之詳細說明519772 V. Description of the invention (1) 1 · Field of application of this technology This technology is suitable for surface-adhesive packaging of light emitting diodes (LEDs). 2. Background Description The conventional technique is shown in Fig. 1. 'Light-emitting diode wafer 1 0 is placed on metal i 2' The bottom electrode of light-emitting diode wafer 1 0 is contact-coupled to metal 2 and light-emitting diode wafer 1 The surface electrode of 〇 is coupled to the metal 11 by wiring 13. The protective colloid 14 encapsulates and protects the upper components of the metal 11 · 12 ·. The protective colloid 14 forms a convex surface in the light emitting area of the light emitting diode wafer 10, forming a convex lens effect, and providing a function of enhancing light concentration. The disadvantage of this conventional technique is that the protruding surface 'makes the suction device unable to easily suck such a component. In order to overcome this problem, this technology first conceives that the surface of the LED with the lens is adhered to the top surface of the package to make it planar, thereby overcoming the disadvantages of the conventional technology. 3 · A brief description of this technology The main purpose of this technology is to design an LED surface-adhesive component package with a condenser lens, and the upper surface of the package is made flat to facilitate the suction of the suction device. 4. Detailed description of this skill
第4頁 519772 五、發明說明（2) 圖2 · 本技藝實施例一 本實施例與圖丨習知技藝不同之處，在於 的平頂帽蓋20，覆蓋在保護膠體“形成的：：用透光 顯示帽蓋20覆蓋在圖1之封裝外部，如此，便？方。圖示 個頂端為平面的LED表面黏著封裝。頂：：：以提供-於吸取工具對於LED封裝產品之吸取用。千面區域，便 圖3 · 本技藝實施例二 顯示保護膠體14製作成為具有 覆蓋-片透光平板2〇1，如此邊便土可二：狀：然後上面 面的led表面黏著封裝。 k仏一個頂端為平 圖4 ·本技藝實施例三 圖不顯示具有凸出面的保護膠體i 4的 體14的折射率之透光填充材 成頂面平面。如此，便可以提供一工 使構 面黏著封裝。 頁食而為平面的LED表 圖5 ·本技藝實施例四 顯示具有凸出面的保護膠體14製 狀’然後在邊壁⑷所包圍的區域内成為上有邊二”的形 護膠體1 4的拙μ圭夕、泰ι_ 士 &用折射率小於保 又/ 的折射率之透光填充材料 面平面。W匕，便可以提供一個工 構成頂 著封裝。 1口頂立而為平面的LED表面黏 519772Page 4 519772 V. Description of the invention (2) Figure 2 · Embodiment 1 of this technique The difference between this embodiment and the known technique is that the flat top cap 20 covers the protective colloid "formed by :: The light-transmitting display cap 20 covers the outside of the package in FIG. 1, so it is convenient. The figure shows a flat LED surface with an adhesive package on the top. Top:: To provide-the suction tool for the suction of LED packaging products. Thousand-face area, Figure 3 · The second embodiment of this technology shows that the protective colloid 14 is made to have a cover-sheet light-transmissive flat plate 201, so that the side can be easily shaped: then: the upper surface of the led is adhered to the package. K 仏A top is a flat figure 4. The third embodiment of the present technique does not show the transparent filling material of the refractive index of the body 14 of the protective colloid i 4 with a convex surface to form a top surface plane. In this way, a work can be provided to make the structural surface adhere Encapsulated. The flat LED table is shown in Fig. 5. The fourth embodiment of this technology shows the shape of the protective colloid 14 with a convex surface, and then it is formed into a protective colloid 1 with an edge 2 "in the area surrounded by the side niches. 4's 圭 μ Gui Xi, Thai _ Shi & Use a light-transmissive filling material with a refractive index lower than the refractive index of /. W dagger, it can provide a structure to face the package. 1 mouthful of flat and flat LED surface 519772
圖6 ·本技藝實施例五 ，不顯f具有凹下面的保護膠體142的上方，採用折射率 於保護膠體142的折射率之透光填充材料2〇4填充之，使 成頂面平面。如此，便可以提供一個頂 表面黏著封裝。 丁 ®日几μ 圖7 ·本技藝實施例六 =示具有凹下面的保護膠體142製作成為具有邊壁143的形 ^ :然後在邊壁143所包圍的區域内，採用折射率大於 3膠體142的折射率之透光填充材料2〇5填充之，使構成頂 ，=，。如此，便可以提供一個頂端為平面的led表面黏 t ^ ί之晶片以具有一個表面電極以及一個底面電極為I 八f之i其他以雙表面電極採用雙打線分別耦合至兩J :或是LED晶片具有雙底面電極，以接觸耦合 ΐ 兩：金屬之技藝，也是此-行業所熟知的;Fig. 6 · Embodiment 5 of the present technique, the protective colloid 142 having a concave surface is not shown above, and it is filled with a light-transmitting filling material 204 having a refractive index which is the refractive index of the protective colloid 142, so that the top surface is flat. In this way, a top surface adhesive package can be provided. Ding day μ Figure 7 · Example 6 of this technique = shows that the protective colloid 142 with a concave bottom is made into a shape with a side wall 143 ^: Then in the area surrounded by the side wall 143, a colloid with a refractive index greater than 3 is used. The refractive index of the light-transmissive filling material 205 is filled to make the top, = ,. In this way, it is possible to provide a chip with a flat top surface and a tacked LED surface with one surface electrode and one bottom surface electrode, which can be coupled to two J with double surface electrodes using double wires: or LED. The chip has double bottom electrodes for contact coupling ΐ two: the technology of metal, which is also well known in the industry;
=，其如同本技藝所描述之方法所為之技藝也 欲保護之範圍。 疋个孜a / w述描述揭示了本發明之較佳 較佳實施例以及設計圖式僅是 發明技藝之權利範圍於此，凡 實施例以及設計圖式，惟， 舉例說明，並非用於限制本 是以均等之技藝手段實施本=, The scope of which the technique as described in this technique is also intended to be protected. The following description reveals that the preferred and preferred embodiments of the present invention and the design drawings are only the scope of the right of the invention. All the embodiments and design drawings are for illustration only and are not intended to limit the scope. This is implemented by means of equal skill
519772 五、發明說明（4) 發明技藝者、或是以下述之「申請專利範圍」所涵蓋之權 利範圍而實施者，均不脫離本發明之精神而為申請人之權 利範圍。519772 5. Description of the invention (4) The inventor or the implementer of the scope of rights covered by the “Scope of Patent Application” described below shall not deviate from the spirit of the present invention and shall be the scope of the applicant's rights.
519772 圖式簡單說明 5.圖式的簡單說明 圖1.先前技藝 圖2. 本技藝實施例一 圖3 . 本技藝實施例二 圖4. 本技藝實施例三 圖5 · 本技藝實施例四 圖6. 本技藝實施例五 圖7. 本技藝實施例六519772 Simple illustration of the diagram 5. Simple illustration of the diagram Figure 1. The prior art Figure 2. The first embodiment of the technology Figure 3. The second embodiment of the technology Figure 4. The third embodiment of the technology Figure 5 The fourth embodiment of the technology 6. The fifth embodiment of the technique Figure 7. The sixth embodiment of the technique
6 · 兀件編號表 晶片1 0 第一金屬1 1 第二金屬1 2 打線1 3 保護膠體1 4. 1 4 2 . 邊壁 141. 143.6 · Numbering Table of Wafer 1 Wafer 1 1st Metal 1 1 2nd Metal 1 2 Wired 1 3 Protective Gel 1 4. 1 4 2. Side Wall 141. 143.
帽蓋20 平板蓋2 0 1 填充料202. 2 0 3. 204. 20 5Cap 20 Flat cover 2 0 1 Filler 202. 2 0 3. 204. 20 5