TWI456052B - 銅清潔及保護調配物 - Google Patents

銅清潔及保護調配物 Download PDF

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TWI456052B
TWI456052B TW098135669A TW98135669A TWI456052B TW I456052 B TWI456052 B TW I456052B TW 098135669 A TW098135669 A TW 098135669A TW 98135669 A TW98135669 A TW 98135669A TW I456052 B TWI456052 B TW I456052B
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acid
group
cleaning composition
ribose
triazole
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TW201026848A (en
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Jeffrey A Barnes
Brian Benac
Karl E Boggs
Lin Feng
Jun Liu
Melissa Petruska
Xiaodong Yan
Peng Zhang
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Advanced Tech Materials
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    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/30—Amines; Substituted amines ; Quaternized amines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
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    • C—CHEMISTRY; METALLURGY
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    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
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    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
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    • C—CHEMISTRY; METALLURGY
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    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2096—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/24—Organic compounds containing halogen
    • C11D3/245—Organic compounds containing halogen containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/28—Heterocyclic compounds containing nitrogen in the ring
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/33—Amino carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • C23G1/20—Other heavy metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
    • C11D2111/22—

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Claims (14)

  1. 一種清潔組合物，其包含至少一種溶劑、至少一種腐蝕抑制劑、至少一種胺、及至少一種第四鹼，其中該腐蝕抑制劑包含選自由以下組成之群之一種類：N-核糖嘌呤、鳥苷、2-胺基嘌呤核糖苷、2-甲氧基腺苷、N-甲基腺苷、N,N-二甲基腺苷、三甲基化腺苷、三甲基N-甲基腺苷、C-4'-甲基腺苷、3-脫氧腺苷；甲基化腺嘌呤、二甲基化腺嘌呤、N4,N4-二甲基嘧啶-4,5,6-三胺、4,5,6-三胺基嘧啶、尿囊素、羥基化C-O-O-C二聚體、C-C橋聯二聚體、核糖、甲基化核糖、四甲基化核糖、木糖、葡萄糖經胺基取代的嘧啶；及其組合，及其中該組合物實質上沒有腐蝕抑制金屬鹵化物。
  2. 如請求項1之清潔組合物，其中該至少一種腐蝕抑制劑包含選自由以下組成之群之一種類：腺苷降解產物、及其衍生物。
  3. 如請求項1之清潔組合物，其中該溶劑包含水。
  4. 如請求項1之清潔組合物，其進一步包含殘留物及污染物，其中該殘留物包含CMP後殘留物、蝕刻後殘留物、灰化後殘留物、或其組合。
  5. 如請求項1之清潔組合物，其中該組合物係以約5：1至約200：1之範圍經稀釋。
  6. 如請求項1之清潔組合物，其中該組合物實質上沒有以下物質中之至少一者：氧化劑、含氟化物之來源、研磨材料、分子中含有醚鍵之醇、烷基吡咯啶酮、表面相互 作用增強劑、鹼金屬及鹼土金屬鹼、糖醇、及其組合，且其中該清潔組合物不會固化形成聚合固體。
  7. 如請求項1之清潔組合物，其中該胺包含選自由以下組成之群之至少一種：胺乙基乙醇胺、N-甲基胺基乙醇、胺基乙氧基乙醇、二甲胺基乙氧基乙醇、二乙醇胺、N-甲基二乙醇胺、單乙醇胺、三乙醇胺、1-胺基-2-丙醇、2-胺基-1-丁醇、異丁醇胺、三伸乙二胺、其它C1 -C8 烷醇胺、四伸乙五胺(TEPA)、4-(2-羥乙基)嗎啉(HEM)、N-胺乙基哌嗪(N-AEP)、乙二胺四乙酸(EDTA)、1,2-環己二胺-N,N,N',N'-四乙酸(CDTA)、甘胺酸/抗壞血酸、亞胺二乙酸(IDA)、2-(羥乙基)亞胺二乙酸(HIDA)、氮基三乙酸、硫脲、1,1,3,3-四甲基脲、尿素、尿素衍生物、尿酸、甘胺酸、丙胺酸、精胺酸、天冬醯胺酸、天冬胺酸、半胱胺酸、麩胺酸、麩醯胺、組胺酸、異白胺酸、白胺酸、離胺酸、甲硫胺酸、苯丙胺酸、脯胺酸、絲胺酸、蘇胺酸、色胺酸、酪胺酸、纈胺酸、1-甲氧基-2-胺基乙烷、及其組合，及其中該至少一種第四鹼具有式NR1 R2 R3 R4 OH，其中R1 、R2 、R3 及R4 彼此可相同或不同及係選自由以下組成之群：氫、直鏈C1 -C6 烷基、支鏈C1 -C6 烷基、經取代之C6 -C10 芳基、及未經取代的C6 -C10 芳基。
  8. 如請求項1之清潔組合物，其進一步包含至少一種選自由以下組成之群之額外組分：至少一種還原劑、至少一種錯合劑、至少一種補充腐蝕抑制劑、至少一種醇、至 少一種表面活性劑、及NR1 R2 R3 R4 OH，其中R1 、R2 、R3 及R4 彼此可相同或不同及係選自由以下組成之群：氫、甲基及乙基，其限制條件為R1 、R2 、R3 及R4 中之至少一者必須為氫。
  9. 如請求項1之清潔組合物，其進一步包含至少一種還原劑，其中該至少一種還原劑包含選自由以下組成之群之一種類：抗壞血酸、L(+)-抗壞血酸、異抗壞血酸、抗壞血酸衍生物、五倍子酸、乙二醛、及其組合。
  10. 如請求項1之清潔組合物，其進一步包含至少一種錯合劑，其係選自由以下組成之群：醋酸、丙酮肟、丙烯酸、己二酸、丙胺酸、精胺酸、天冬醯胺酸、天冬胺酸、甜菜鹼、二甲基乙二醛二肟、甲酸、延胡索酸、葡萄糖酸、麩胺酸、麩醯胺、戊二酸、甘油酸、甘油、羥乙酸、乙醛酸、組胺酸、亞胺二乙酸、間苯二甲酸、亞甲基丁二酸、乳酸、白胺酸、離胺酸、順丁烯二酸、順丁烯二酸酐、羥丁二酸、丙二酸、杏仁酸、2,4-戊二酮、苯乙酸、苯丙胺酸、酞酸、脯胺酸、丙酸、兒茶酚、苯均四酸、金雞納酸、絲胺酸、山梨醇、琥珀酸、酒石酸、對苯二甲酸、偏苯三甲酸、對稱苯三甲酸、酪胺酸、纈胺酸、木糖醇、其鹽及衍生物、及其組合。
  11. 如請求項1之清潔組合物，進一步包含至少一種補充腐蝕抑制劑其係選自由以下組成之群：抗壞血酸、L(+)-抗壞血酸、異抗壞血酸、抗壞血酸衍生物、苯并三唑、檸檬酸、乙二胺、五倍子酸、草酸、鞣酸、1,2,4-三唑 (TAZ)、甲苯基三唑、5-苯基苯并三唑、5-硝基-苯并三唑、3-胺基-5-巰基-1,2,4-三唑、1-胺基-1,2,4-三唑、羥基苯并三唑、2-(5-胺基戊基)-苯并三唑、1,2,3-三唑、1-胺基-1,2,3-三唑、1-胺基-5-甲基-1,2,3-三唑、3-胺基-1,2,4-三唑、3-巰基-1,2,4-三唑、3-異丙基-1,2,4-三唑、5-苯硫醇-苯并三唑、鹵基-苯并三唑(鹵基=氟、氯、溴、碘)、萘并三唑、2-巰基苯并咪唑(MBI)、2-巰基苯并噻唑、、4-甲基-2-苯基咪唑、2-巰基噻唑啉、5-胺基四唑、5-胺基-1,3,4-噻二唑-2-硫醇、2,4-二胺基-6-甲基-1,3,5-三、噻唑、三、甲基四唑、1,3-二甲基-2-咪唑啶酮、1,5-伸戊基四唑、1-苯基-5-巰基四唑、二胺甲基三、咪唑啉硫酮、巰基苯并咪唑、4-甲基-4H-1,2,4-三唑-3-硫醇、5-胺基-1,3,4-噻二唑-2-硫醇、苯并噻唑、磷酸三甲苯酯、咪唑、吲二唑(indiazole)、安息酸、苯甲酸銨、兒茶酚、五倍子酚、間苯二酚、氫醌、三聚氰酸、巴比妥酸及衍生物(例如1,2-二甲基巴比妥酸)、丙酮酸、膦酸及其衍生物、1-羥基亞乙基-1,1-二膦酸(HEDP)、丙硫醇、苯甲羥肟酸、雜環氮抑制劑、乙基黃原酸鉀、及其組合。
  12. 一種套組，其包含存於一或多個容器中之一或多種用於形成清潔組合物之下列試劑，其中該清潔組合物包含至少一種溶劑、至少一種腐蝕抑制劑、至少一種胺、及至少一種第四鹼，其中該腐蝕抑制劑包含選自由以下組成之群之一種類：N-核糖嘌呤、鳥苷、2-胺基嘌呤核糖 苷、2-甲氧基腺苷、N-甲基腺苷、N,N-二甲基腺苷、三甲基化腺苷、三甲基N-甲基腺苷、C-4'-甲基腺苷、3、脫氧腺苷；甲基化腺嘌呤、二甲基化腺嘌呤、N4,N4-二甲基嘧啶-4,5,6-三胺、4,5,6-三胺基嘧啶、尿囊素、羥基化C-O-O-C二聚體、C-C橋聯二聚體、核糖、甲基化核糖、四甲基化核糖、木糖、葡萄糖經胺基取代的嘧啶；及其組合，及其中該組合物實質上沒有腐蝕抑制金屬鹵化物。
  13. 一種自其上含有殘留物及污染物之微電子裝置移除該殘留物及污染物的方法，該方法包含使該微電子裝置與清潔組合物接觸足夠的時間以自該微電子裝置至少部份地清潔該殘留物及污染物，其中該清潔組合物包含至少一種溶劑、至少一種腐蝕抑制劑、至少一種胺、及至少一種第四鹼，其中該腐蝕抑制劑包含選自由以下組成之群之一種類：N-核糖嘌呤、鳥苷、2-胺基嘌呤核糖苷、2-甲氧基腺苷、N-甲基腺苷、N,N-二甲基腺苷、三甲基化腺苷、三甲基N-甲基腺苷、C-4'-甲基腺苷、3-脫氧腺苷；甲基化腺嘌呤、二甲基化腺嘌呤、N4,N4-二甲基嘧啶-4,5,6-三胺、4,5,6-三胺基嘧啶、尿囊素、羥基化C-O-O-C二聚體、C-C橋聯二聚體、核糖、甲基化核糖、四甲基化核糖、木糖、葡萄糖經胺基取代的嘧啶；及其組合，及其中該組合物實質上沒有腐蝕抑制金屬鹵化物。
  14. 如請求項13之方法，其進一步包含在使用時或使用前用溶劑稀釋該清潔組合物，其中該溶劑包含水。
TW098135669A 2008-10-21 2009-10-21 銅清潔及保護調配物 TWI456052B (zh)

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US10731908P 2008-10-21 2008-10-21
US11822108P 2008-11-26 2008-11-26

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US20120283163A1 (en) 2012-11-08
JP6133959B2 (ja) 2017-05-24
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US9074170B2 (en) 2015-07-07
US20160032221A1 (en) 2016-02-04
TW201026848A (en) 2010-07-16
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JP5873718B2 (ja) 2016-03-01
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