TWI390780B - 磁阻效應元件 - Google Patents
磁阻效應元件 Download PDFInfo
- Publication number
- TWI390780B TWI390780B TW094130390A TW94130390A TWI390780B TW I390780 B TWI390780 B TW I390780B TW 094130390 A TW094130390 A TW 094130390A TW 94130390 A TW94130390 A TW 94130390A TW I390780 B TWI390780 B TW I390780B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- strong magnetic
- magnetoresistance effect
- effect element
- magnetic layer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
- G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
- H01F41/302—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F41/305—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices applying the spacer or adjusting its interface, e.g. in order to enable particular effect different from exchange coupling
- H01F41/307—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices applying the spacer or adjusting its interface, e.g. in order to enable particular effect different from exchange coupling insulating or semiconductive spacer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/3204—Exchange coupling of amorphous multilayers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/18—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Magnetic Heads (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004259280A JP4292128B2 (ja) | 2004-09-07 | 2004-09-07 | 磁気抵抗効果素子の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200614556A TW200614556A (en) | 2006-05-01 |
| TWI390780B true TWI390780B (zh) | 2013-03-21 |
Family
ID=35326492
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094130390A TWI390780B (zh) | 2004-09-07 | 2005-09-05 | 磁阻效應元件 |
| TW104101069A TWI536624B (zh) | 2004-09-07 | 2005-09-05 | Magnetoresistive element |
| TW101135284A TWI504032B (zh) | 2004-09-07 | 2005-09-05 | Method for manufacturing magnetoresistance effect elements |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104101069A TWI536624B (zh) | 2004-09-07 | 2005-09-05 | Magnetoresistive element |
| TW101135284A TWI504032B (zh) | 2004-09-07 | 2005-09-05 | Method for manufacturing magnetoresistance effect elements |
Country Status (8)
| Country | Link |
|---|---|
| US (6) | US20060056115A1 (enExample) |
| EP (3) | EP1633007B1 (enExample) |
| JP (1) | JP4292128B2 (enExample) |
| KR (6) | KR20060051048A (enExample) |
| CN (2) | CN1755963B (enExample) |
| AT (1) | ATE431969T1 (enExample) |
| DE (1) | DE602005014526D1 (enExample) |
| TW (3) | TWI390780B (enExample) |
Families Citing this family (81)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4100025B2 (ja) * | 2002-04-09 | 2008-06-11 | ソニー株式会社 | 磁気抵抗効果素子及び磁気メモリ装置 |
| US7696169B2 (en) * | 2003-06-06 | 2010-04-13 | The Feinstein Institute For Medical Research | Inhibitors of the interaction between HMGB polypeptides and toll-like receptor 2 as anti-inflammatory agents |
| US7911832B2 (en) * | 2003-08-19 | 2011-03-22 | New York University | High speed low power magnetic devices based on current induced spin-momentum transfer |
| US7884403B2 (en) * | 2004-03-12 | 2011-02-08 | Japan Science And Technology Agency | Magnetic tunnel junction device and memory device including the same |
| WO2006022183A1 (ja) * | 2004-08-27 | 2006-03-02 | Japan Science And Technology Agency | 磁気抵抗素子及びその製造方法 |
| JP4292128B2 (ja) * | 2004-09-07 | 2009-07-08 | キヤノンアネルバ株式会社 | 磁気抵抗効果素子の製造方法 |
| JP2006210391A (ja) * | 2005-01-25 | 2006-08-10 | Japan Science & Technology Agency | 磁気抵抗素子及びその製造方法 |
| JP5096702B2 (ja) * | 2005-07-28 | 2012-12-12 | 株式会社日立製作所 | 磁気抵抗効果素子及びそれを搭載した不揮発性磁気メモリ |
| JP4782037B2 (ja) | 2006-03-03 | 2011-09-28 | キヤノンアネルバ株式会社 | 磁気抵抗効果素子の製造方法及び製造装置 |
| JP4731393B2 (ja) | 2006-04-28 | 2011-07-20 | 株式会社日立製作所 | 磁気再生ヘッド |
| JP2007305768A (ja) * | 2006-05-11 | 2007-11-22 | Tdk Corp | トンネル磁気抵抗効果素子の製造方法、薄膜磁気ヘッドの製造方法及び磁気メモリの製造方法 |
| US7535069B2 (en) * | 2006-06-14 | 2009-05-19 | International Business Machines Corporation | Magnetic tunnel junction with enhanced magnetic switching characteristics |
| JP4673274B2 (ja) * | 2006-09-11 | 2011-04-20 | ヒタチグローバルストレージテクノロジーズネザーランドビーブイ | 外部ストレス耐性の高い磁気抵抗効果型ヘッド |
| JP4923896B2 (ja) * | 2006-09-15 | 2012-04-25 | 富士通株式会社 | 交換結合膜及び磁気デバイス |
| JP2008078379A (ja) * | 2006-09-21 | 2008-04-03 | Alps Electric Co Ltd | トンネル型磁気検出素子の製造方法 |
| US7751156B2 (en) * | 2006-09-29 | 2010-07-06 | Hitachi Global Storage Technologies Netherlands, B.V. | Dual-layer free layer in a tunneling magnetoresistance (TMR) element |
| JP2008135432A (ja) * | 2006-11-27 | 2008-06-12 | Tdk Corp | トンネル磁気抵抗効果素子及びその製造方法 |
| US7695761B1 (en) | 2006-12-21 | 2010-04-13 | Western Digital (Fremont), Llc | Method and system for providing a spin tunneling magnetic element having a crystalline barrier layer |
| US7715156B2 (en) | 2007-01-12 | 2010-05-11 | Tdk Corporation | Tunnel magnetoresistive effect element and thin-film magnetic head with tunnel magnetoresistive effect read head element |
| JP2008192634A (ja) * | 2007-01-31 | 2008-08-21 | Fujitsu Ltd | トンネル磁気抵抗効果膜および磁気デバイス |
| JP4885769B2 (ja) * | 2007-03-09 | 2012-02-29 | 株式会社アルバック | 磁気抵抗素子の製造方法、磁気デバイスの製造方法、磁気抵抗素子の製造装置および磁気デバイスの製造装置 |
| JP2008306169A (ja) * | 2007-05-07 | 2008-12-18 | Canon Anelva Corp | 磁気抵抗素子、磁気抵抗素子の製造方法及び磁性多層膜作成装置 |
| US8174800B2 (en) | 2007-05-07 | 2012-05-08 | Canon Anelva Corporation | Magnetoresistive element, method of manufacturing the same, and magnetic multilayered film manufacturing apparatus |
| US8559141B1 (en) | 2007-05-07 | 2013-10-15 | Western Digital (Fremont), Llc | Spin tunneling magnetic element promoting free layer crystal growth from a barrier layer interface |
| US8679301B2 (en) * | 2007-08-01 | 2014-03-25 | HGST Netherlands B.V. | Repeatability for RF MgO TMR barrier layer process by implementing Ti pasting |
| JP2009065040A (ja) * | 2007-09-07 | 2009-03-26 | National Institute Of Advanced Industrial & Technology | 磁性材料及びそれを用いた磁気抵抗素子 |
| WO2009044473A1 (ja) | 2007-10-04 | 2009-04-09 | Canon Anelva Corporation | 高周波スパッタリング装置 |
| JP4619450B2 (ja) * | 2007-10-04 | 2011-01-26 | キヤノンアネルバ株式会社 | 真空薄膜形成加工装置 |
| US8133745B2 (en) * | 2007-10-17 | 2012-03-13 | Magic Technologies, Inc. | Method of magnetic tunneling layer processes for spin-transfer torque MRAM |
| KR101706192B1 (ko) * | 2007-11-28 | 2017-02-13 | 가부시키가이샤 아루박 | 스퍼터 장치 및 성막방법 |
| US8545999B1 (en) | 2008-02-21 | 2013-10-01 | Western Digital (Fremont), Llc | Method and system for providing a magnetoresistive structure |
| WO2009110119A1 (ja) * | 2008-03-06 | 2009-09-11 | 富士電機ホールディングス株式会社 | 強磁性トンネル接合素子および強磁性トンネル接合素子の駆動方法 |
| JP4527806B2 (ja) | 2008-03-07 | 2010-08-18 | キヤノンアネルバ株式会社 | 磁気抵抗素子の製造方法及び磁気抵抗素子の製造装置 |
| US8077436B2 (en) | 2008-03-20 | 2011-12-13 | Tdk Corporation | CPP-type magnetoresistance effect element having three magnetic layers |
| KR20110002878A (ko) * | 2008-09-01 | 2011-01-10 | 캐논 아네르바 가부시키가이샤 | 자기 저항 소자와 그 제조 방법, 그 제조 방법에 이용되는 기억 매체 |
| WO2010026667A1 (en) | 2008-09-03 | 2010-03-11 | Canon Anelva Corporation | Ferromagnetic preferred grain growth promotion seed layer for amorphous or microcrystalline mgo tunnel barrier |
| JP2010062353A (ja) * | 2008-09-04 | 2010-03-18 | Fujitsu Ltd | 磁気抵抗効果素子 |
| WO2010026705A1 (ja) * | 2008-09-08 | 2010-03-11 | キヤノンアネルバ株式会社 | 磁気抵抗素子とその製造方法、該製造方法に用いる記憶媒体 |
| KR20110040894A (ko) * | 2008-09-09 | 2011-04-20 | 캐논 아네르바 가부시키가이샤 | 자기 저항 소자의 제조 방법, 그 제조 방법에 이용되는 기억 매체 |
| JP2010080806A (ja) * | 2008-09-29 | 2010-04-08 | Canon Anelva Corp | 磁気抵抗素子の製造法及びその記憶媒体 |
| JP2010109319A (ja) * | 2008-09-30 | 2010-05-13 | Canon Anelva Corp | 磁気抵抗素子の製造法および記憶媒体 |
| JP2010102805A (ja) * | 2008-10-27 | 2010-05-06 | Hitachi Global Storage Technologies Netherlands Bv | トンネル接合型磁気抵抗効果ヘッド |
| JP5133232B2 (ja) * | 2008-12-26 | 2013-01-30 | 株式会社アルバック | 成膜装置及び成膜方法 |
| KR101584747B1 (ko) * | 2009-01-20 | 2016-01-13 | 삼성전자주식회사 | 자기 메모리 소자 |
| KR101266778B1 (ko) | 2009-06-24 | 2013-05-22 | 캐논 아네르바 가부시키가이샤 | 진공 가열/냉각 장치 및 자기저항 요소의 제조 방법 |
| US8183653B2 (en) | 2009-07-13 | 2012-05-22 | Seagate Technology Llc | Magnetic tunnel junction having coherent tunneling structure |
| US8498084B1 (en) | 2009-07-21 | 2013-07-30 | Western Digital (Fremont), Llc | Magnetoresistive sensors having an improved free layer |
| JP5588642B2 (ja) * | 2009-09-02 | 2014-09-10 | エイチジーエスティーネザーランドビーブイ | トンネル接合型磁気抵抗効果ヘッド及びその製造方法 |
| US8194365B1 (en) | 2009-09-03 | 2012-06-05 | Western Digital (Fremont), Llc | Method and system for providing a read sensor having a low magnetostriction free layer |
| WO2011030826A1 (ja) * | 2009-09-11 | 2011-03-17 | 株式会社 アルバック | 薄膜形成方法及び薄膜形成装置 |
| JP2011123923A (ja) | 2009-12-08 | 2011-06-23 | Hitachi Global Storage Technologies Netherlands Bv | 磁気抵抗効果ヘッド、磁気記録再生装置 |
| JP5576643B2 (ja) | 2009-12-10 | 2014-08-20 | エイチジーエスティーネザーランドビーブイ | トンネル接合型磁気抵抗効果素子、トンネル接合型磁気抵抗効果ヘッド、磁気記録再生装置、及びその製造方法 |
| RU2451769C2 (ru) * | 2009-12-22 | 2012-05-27 | Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Уральский федеральный университет имени первого Президента России Б.Н.Ельцина" | Способ, устройство для получения многослойных пленок и многослойная структура, полученная с их использованием |
| JP5502900B2 (ja) | 2009-12-28 | 2014-05-28 | キヤノンアネルバ株式会社 | 磁気抵抗素子の製造方法 |
| US8692343B2 (en) * | 2010-04-26 | 2014-04-08 | Headway Technologies, Inc. | MR enhancing layer (MREL) for spintronic devices |
| KR20130041089A (ko) * | 2010-06-21 | 2013-04-24 | 가부시키가이샤 알박 | 기판 반전 장치, 진공 성막 장치 및 기판 반전 방법 |
| WO2012056808A1 (ja) | 2010-10-25 | 2012-05-03 | 日本碍子株式会社 | セラミックス材料、半導体製造装置用部材、スパッタリングターゲット部材及びセラミックス材料の製造方法 |
| WO2012056807A1 (ja) | 2010-10-25 | 2012-05-03 | 日本碍子株式会社 | セラミックス材料、積層体、半導体製造装置用部材及びスパッタリングターゲット部材 |
| JP5574350B2 (ja) * | 2010-12-22 | 2014-08-20 | 株式会社アルバック | トンネル磁気抵抗素子の製造方法 |
| KR101522992B1 (ko) | 2010-12-28 | 2015-05-26 | 캐논 아네르바 가부시키가이샤 | 제조장치 |
| US8503135B2 (en) | 2011-09-21 | 2013-08-06 | Seagate Technology Llc | Magnetic sensor with enhanced magnetoresistance ratio |
| US8710602B2 (en) | 2011-12-20 | 2014-04-29 | Samsung Electronics Co., Ltd. | Method and system for providing magnetic junctions having improved characteristics |
| JP5856490B2 (ja) | 2012-01-20 | 2016-02-09 | ルネサスエレクトロニクス株式会社 | 磁気抵抗効果素子及び磁気メモリ |
| TWI514373B (zh) * | 2012-02-15 | 2015-12-21 | Ind Tech Res Inst | 上固定型垂直磁化穿隧磁阻元件 |
| JP5895610B2 (ja) * | 2012-03-07 | 2016-03-30 | 富士通株式会社 | 磁気抵抗メモリおよび磁気抵抗メモリの製造方法 |
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