TWI347985B - Silicon single crystal wafer for igbt and method for manufacturing silicon single crystal wafer for igbt - Google Patents

Silicon single crystal wafer for igbt and method for manufacturing silicon single crystal wafer for igbt

Info

Publication number
TWI347985B
TWI347985B TW096106183A TW96106183A TWI347985B TW I347985 B TWI347985 B TW I347985B TW 096106183 A TW096106183 A TW 096106183A TW 96106183 A TW96106183 A TW 96106183A TW I347985 B TWI347985 B TW I347985B
Authority
TW
Taiwan
Prior art keywords
igbt
single crystal
silicon single
crystal wafer
manufacturing
Prior art date
Application number
TW096106183A
Other languages
English (en)
Other versions
TW200738920A (en
Inventor
Toshiaki Ono
Shigeru Umeno
Wataru Sugimura
Masataka Hourai
Original Assignee
Sumco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumco Corp filed Critical Sumco Corp
Publication of TW200738920A publication Critical patent/TW200738920A/zh
Application granted granted Critical
Publication of TWI347985B publication Critical patent/TWI347985B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/261—Bombardment with radiation to produce a nuclear reaction transmuting chemical elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW096106183A 2006-02-21 2007-02-16 Silicon single crystal wafer for igbt and method for manufacturing silicon single crystal wafer for igbt TWI347985B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006043572 2006-02-21
JP2007034536A JP4760729B2 (ja) 2006-02-21 2007-02-15 Ｉｇｂｔ用のシリコン単結晶ウェーハ及びｉｇｂｔ用のシリコン単結晶ウェーハの製造方法

Publications (2)

Publication Number Publication Date
TW200738920A TW200738920A (en) 2007-10-16
TWI347985B true TWI347985B (en) 2011-09-01

Family

ID=38157985

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096106183A TWI347985B (en) 2006-02-21 2007-02-16 Silicon single crystal wafer for igbt and method for manufacturing silicon single crystal wafer for igbt

Country Status (9)

Country Link
US (2) US8617311B2 (zh)
EP (1) EP1881093B1 (zh)
JP (1) JP4760729B2 (zh)
KR (1) KR100928885B1 (zh)
CN (1) CN101054721B (zh)
DE (1) DE07003441T1 (zh)
MY (1) MY151924A (zh)
SG (2) SG170005A1 (zh)
TW (1) TWI347985B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI746400B (zh) * 2021-01-22 2021-11-11 大陸商上海新昇半導體科技有限公司 拉晶裝置

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CN106653561B (zh) * 2015-11-03 2021-03-30 有研半导体材料有限公司 一种具有背吸杂能力的300mm重掺硅片的加工方法
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DE07003441T1 (de) 2008-07-31
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US20070193501A1 (en) 2007-08-23
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SG135153A1 (en) 2007-09-28
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SG170005A1 (en) 2011-04-29
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