TWI313788B - Pattern replication with intermediate stamp - Google Patents

Pattern replication with intermediate stamp Download PDF

Info

Publication number
TWI313788B
TWI313788B TW094140365A TW94140365A TWI313788B TW I313788 B TWI313788 B TW I313788B TW 094140365 A TW094140365 A TW 094140365A TW 94140365 A TW94140365 A TW 94140365A TW I313788 B TWI313788 B TW I313788B
Authority
TW
Taiwan
Prior art keywords
polymer
substrate
layer
radiation
template
Prior art date
Application number
TW094140365A
Other languages
English (en)
Chinese (zh)
Other versions
TW200643613A (en
Inventor
Babak Heidari
Anette Lofstrand
Erik Bolmsjo
Erik Theander
Marc Bcek
Original Assignee
Obducat Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP05105100A external-priority patent/EP1731961B1/en
Application filed by Obducat Ab filed Critical Obducat Ab
Publication of TW200643613A publication Critical patent/TW200643613A/zh
Application granted granted Critical
Publication of TWI313788B publication Critical patent/TWI313788B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B29C33/3857—Manufacturing moulds, e.g. shaping the mould surface by machining by making impressions of one or more parts of models, e.g. shaped articles and including possible subsequent assembly of the parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Steroid Compounds (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Credit Cards Or The Like (AREA)
  • Color Printing (AREA)
TW094140365A 2005-06-10 2005-11-15 Pattern replication with intermediate stamp TWI313788B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US59515405P 2005-06-10 2005-06-10
EP05105100A EP1731961B1 (en) 2005-06-10 2005-06-10 Template replication method
PCT/EP2005/055729 WO2006131153A1 (en) 2005-06-10 2005-11-03 Pattern replication with intermediate stamp

Publications (2)

Publication Number Publication Date
TW200643613A TW200643613A (en) 2006-12-16
TWI313788B true TWI313788B (en) 2009-08-21

Family

ID=35717449

Family Applications (2)

Application Number Title Priority Date Filing Date
TW094140365A TWI313788B (en) 2005-06-10 2005-11-15 Pattern replication with intermediate stamp
TW095120590A TWI416280B (zh) 2005-06-10 2006-06-09 含有環烯烴共聚物之壓印壓模

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW095120590A TWI416280B (zh) 2005-06-10 2006-06-09 含有環烯烴共聚物之壓印壓模

Country Status (11)

Country Link
US (1) US7704425B2 (https=)
EP (2) EP1731962B1 (https=)
JP (1) JP5276436B2 (https=)
KR (1) KR101229100B1 (https=)
CN (1) CN101198903B (https=)
AT (1) ATE419560T1 (https=)
DE (1) DE602005012068D1 (https=)
ES (1) ES2317159T3 (https=)
MY (1) MY152606A (https=)
TW (2) TWI313788B (https=)
WO (1) WO2006131153A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI396622B (zh) * 2009-10-07 2013-05-21 Asml Netherlands Bv 壓印微影裝置及方法
TWI551386B (zh) * 2010-01-27 2016-10-01 分子壓模公司 移除材料及轉印圖案的方法及系統

Families Citing this family (130)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1542074A1 (en) * 2003-12-11 2005-06-15 Heptagon OY Manufacturing a replication tool, sub-master or replica
US9040090B2 (en) 2003-12-19 2015-05-26 The University Of North Carolina At Chapel Hill Isolated and fixed micro and nano structures and methods thereof
US20070228608A1 (en) * 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
EP1731965B1 (en) * 2005-06-10 2012-08-08 Obducat AB Imprint stamp comprising cyclic olefin copolymer
US7854873B2 (en) 2005-06-10 2010-12-21 Obducat Ab Imprint stamp comprising cyclic olefin copolymer
EP1896805A4 (en) 2005-06-14 2010-03-31 Steven M Ebstein USES OF LASER-TREATED SUBSTRATE FOR MOLECULAR DIAGNOSIS
US8184284B2 (en) 2005-06-14 2012-05-22 Ebstein Steven M Laser-processed substrate for molecular diagnostics
US7715003B2 (en) 2005-06-14 2010-05-11 President & Fellows Of Harvard College Metalized semiconductor substrates for raman spectroscopy
CN101443884B (zh) * 2005-09-15 2011-07-27 陶氏康宁公司 纳米模塑方法
JP2007133970A (ja) * 2005-11-10 2007-05-31 Canon Inc 光記録媒体およびその製造方法
EP1795497B1 (en) * 2005-12-09 2012-03-14 Obducat AB Apparatus and method for transferring a pattern with intermediate stamp
US7500431B2 (en) * 2006-01-12 2009-03-10 Tsai-Wei Wu System, method, and apparatus for membrane, pad, and stamper architecture for uniform base layer and nanoimprinting pressure
US7377765B2 (en) * 2006-02-14 2008-05-27 Hitachi Global Storage Technologies System, method, and apparatus for non-contact and diffuse curing exposure for making photopolymer nanoimprinting stamper
US7862756B2 (en) * 2006-03-30 2011-01-04 Asml Netherland B.V. Imprint lithography
US20070257396A1 (en) * 2006-05-05 2007-11-08 Jian Wang Device and method of forming nanoimprinted structures
US7998651B2 (en) 2006-05-15 2011-08-16 Asml Netherlands B.V. Imprint lithography
US8318253B2 (en) * 2006-06-30 2012-11-27 Asml Netherlands B.V. Imprint lithography
US20080047930A1 (en) * 2006-08-23 2008-02-28 Graciela Beatriz Blanchet Method to form a pattern of functional material on a substrate
US20080152835A1 (en) * 2006-12-05 2008-06-26 Nano Terra Inc. Method for Patterning a Surface
US8608972B2 (en) 2006-12-05 2013-12-17 Nano Terra Inc. Method for patterning a surface
WO2008091858A2 (en) 2007-01-23 2008-07-31 President & Fellows Of Harvard College Non-invasive optical analysis using surface enhanced raman spectroscopy
WO2008091852A2 (en) * 2007-01-23 2008-07-31 President & Fellows Of Harvard College Polymeric substrates for surface enhanced raman spectroscopy
EP1982757A1 (de) * 2007-04-10 2008-10-22 Stichting Voor De Technische Wetenschappen Ionendurchlässige Membran und ihre Herstellung
JP5456465B2 (ja) * 2007-06-04 2014-03-26 丸善石油化学株式会社 微細加工品およびその製造方法
JP4448868B2 (ja) 2007-06-29 2010-04-14 株式会社日立産機システム インプリント用スタンパとその製造方法
KR101415570B1 (ko) * 2007-07-26 2014-07-04 삼성디스플레이 주식회사 임프린트 장치 및 이를 이용한 임프린트 방법
WO2009017846A1 (en) 2007-07-30 2009-02-05 President And Fellows Of Harvard College Substrates for raman spectroscopy having discontinuous metal coatings
US20090056575A1 (en) * 2007-08-31 2009-03-05 Bartman Jon A Pattern transfer apparatus
CN101795961B (zh) * 2007-09-06 2013-05-01 3M创新有限公司 用于制备微结构化制品的工具
CN101795838B (zh) * 2007-09-06 2014-02-12 3M创新有限公司 形成模具的方法以及使用所述模具形成制品的方法
US8322874B2 (en) 2007-09-06 2012-12-04 3M Innovative Properties Company Lightguides having light extraction structures providing regional control of light output
US8451457B2 (en) 2007-10-11 2013-05-28 3M Innovative Properties Company Chromatic confocal sensor
EP2207820A4 (en) * 2007-10-11 2011-10-26 3M Innovative Properties Co HIGHLY FUNCTIONAL REACTIVE SPECIES WITH MULTIPHOTONIC HARDENING
EP2232531B1 (en) * 2007-12-12 2018-09-19 3M Innovative Properties Company Method for making structures with improved edge definition
WO2009094773A1 (en) * 2008-01-31 2009-08-06 Genesis Group Inc. Method of depositing a polymer micropattern on a substrate
EP2257854B1 (en) * 2008-02-26 2018-10-31 3M Innovative Properties Company Multi-photon exposure system
CN101960559A (zh) * 2008-03-07 2011-01-26 昭和电工株式会社 Uv纳米压印方法、树脂制复制模及其制造方法、磁记录介质及其制造方法和磁记录再生装置
JP4815464B2 (ja) * 2008-03-31 2011-11-16 株式会社日立製作所 微細構造転写スタンパ及び微細構造転写装置
JP5121549B2 (ja) * 2008-04-21 2013-01-16 株式会社東芝 ナノインプリント方法
TWI416514B (zh) * 2008-05-23 2013-11-21 Showa Denko Kk 樹脂模製作用疊層體、疊層體、樹脂模、及磁性記錄媒體的製造方法
EP2138896B1 (en) 2008-06-25 2014-08-13 Obducat AB Nano imprinting method and apparatus
US8833430B2 (en) * 2008-06-26 2014-09-16 President And Fellows Of Harvard College Versatile high aspect ratio actuatable nanostructured materials through replication
WO2009154571A1 (en) * 2008-07-17 2009-12-23 Agency For Science, Technology And Research A method of making an imprint on a polymer structure
JP2010080680A (ja) * 2008-09-26 2010-04-08 Bridgestone Corp 凹凸パターンの形成方法及び凹凸パターンの製造装置
TW201022017A (en) * 2008-09-30 2010-06-16 Molecular Imprints Inc Particle mitigation for imprint lithography
TWI421162B (zh) * 2008-11-03 2014-01-01 Molecular Imprints Inc 母模板複製方法
US9122148B2 (en) 2008-11-03 2015-09-01 Canon Nanotechnologies, Inc. Master template replication
TWI508846B (zh) * 2008-12-12 2015-11-21 麻省理工學院 不規則表面之楔形壓印圖案化
EP2199854B1 (en) 2008-12-19 2015-12-16 Obducat AB Hybrid polymer mold for nano-imprinting and method for making the same
EP2199855B1 (en) 2008-12-19 2016-07-20 Obducat Methods and processes for modifying polymer material surface interactions
JP2010171338A (ja) * 2009-01-26 2010-08-05 Toshiba Corp パターン生成方法及びパターン形成方法
JP2010218597A (ja) * 2009-03-13 2010-09-30 Toshiba Corp パターン転写用樹脂スタンパ、及びこれを用いた磁気記録媒体の製造方法
JP4543117B1 (ja) * 2009-03-13 2010-09-15 株式会社東芝 パターン転写用紫外線硬化性樹脂材料、及びこれを用いた磁気記録媒体の製造方法
JP2010218605A (ja) * 2009-03-13 2010-09-30 Toshiba Corp パターン転写用紫外線硬化性樹脂材料、及びこれを用いた磁気記録媒体の製造方法
JP4729114B2 (ja) * 2009-03-18 2011-07-20 株式会社東芝 磁気記録媒体の製造方法
CN101900936A (zh) * 2009-05-26 2010-12-01 鸿富锦精密工业（深圳）有限公司 压印模具及其制作方法
US8178011B2 (en) * 2009-07-29 2012-05-15 Empire Technology Development Llc Self-assembled nano-lithographic imprint masks
JP5558772B2 (ja) * 2009-10-08 2014-07-23 東レエンジニアリング株式会社 マイクロニードルシートのスタンパー及びその製造方法とそれを用いたマイクロニードルの製造方法
JP5542404B2 (ja) * 2009-10-08 2014-07-09 東レエンジニアリング株式会社 マイクロニードルスタンパーの製造方法
DK2496989T3 (da) * 2009-11-02 2014-01-20 Univ Danmarks Tekniske Fremgangsmåde og indretning til nanotryknings-litografi
WO2011095217A1 (en) 2010-02-05 2011-08-11 Obducat Ab Method and process for metallic stamp replication for large area nanopatterns
JP2011216808A (ja) * 2010-04-02 2011-10-27 Toshiba Mach Co Ltd 転写装置、転写システム及び転写方法
MX2012012317A (es) 2010-04-28 2012-11-21 Kimberly Clark Co Arreglo de microagujas moldeado por inyeccion y metodo para formar el arreglo de microagujas.
EP2567603A2 (en) * 2010-05-04 2013-03-13 Uni-Pixel Displays, Inc. Method of fabricating micro structured surfaces with electrically conductive patterns
US9168679B2 (en) * 2010-07-16 2015-10-27 Northwestern University Programmable soft lithography: solvent-assisted nanoscale embossing
JP5546066B2 (ja) * 2010-09-01 2014-07-09 東芝機械株式会社 転写システムおよび転写方法
US9034233B2 (en) * 2010-11-30 2015-05-19 Infineon Technologies Ag Method of processing a substrate
TWI409161B (zh) * 2010-12-10 2013-09-21 Chenming Mold Ind Corp 均壓成型模具及其均壓成型方法
KR101200562B1 (ko) * 2011-01-17 2012-11-13 부산대학교 산학협력단 광정렬 일체형 대면적 금속 스탬프의 제조 방법 그리고 그를 이용한 고분자 광소자의 제조 방법
KR101919643B1 (ko) * 2011-06-30 2018-11-16 쓰리엠 이노베이티브 프로퍼티즈 캄파니 미세-접촉 인쇄를 위한 스탬프의 제조, 잉킹, 및 장착 방법
JP6228918B2 (ja) * 2011-08-18 2017-11-08 モーメンテイブ・パーフオーマンス・マテリアルズ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング 照射および成型ユニット
KR20140079429A (ko) 2011-10-27 2014-06-26 킴벌리-클라크 월드와이드, 인크. 생체활성 제제를 전달하기 위한 이식형 기구
US9159925B2 (en) * 2011-11-14 2015-10-13 Orthogonal, Inc. Process for imprint patterning materials in thin-film devices
JP5891075B2 (ja) 2012-03-08 2016-03-22 東京応化工業株式会社 ブロックコポリマー含有組成物及びパターンの縮小方法
US10391485B2 (en) 2013-09-25 2019-08-27 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Microfluidic electrocage device and cell medium for trapping and rotating cells for live-cell computed tomography (CT)
US9513543B2 (en) 2013-11-20 2016-12-06 Eastman Kodak Company Method for forming a non-deformable patterned template
US9193199B2 (en) 2013-11-20 2015-11-24 Eastman Kodak Company PDMS imprinting stamp with embedded flexure
KR101617952B1 (ko) * 2014-07-31 2016-05-09 한국과학기술원 소프트리소그래피를 이용한 경사진 관통 구멍을 구비한 구조체의 제조방법
US10162162B2 (en) 2014-09-24 2018-12-25 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Microfluidic systems and methods for hydrodynamic microvortical cell rotation in live-cell computed tomography
JP2016164977A (ja) * 2015-02-27 2016-09-08 キヤノン株式会社 ナノインプリント用液体材料、ナノインプリント用液体材料の製造方法、硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、および電子部品の製造方法
WO2017056894A1 (ja) * 2015-09-30 2017-04-06 富士フイルム株式会社 モールドの作製方法、パターンシートの製造方法、電鋳金型の作製方法、及び電鋳金型を用いたモールドの作製方法
CN105399046A (zh) * 2015-11-02 2016-03-16 中国科学院重庆绿色智能技术研究院 无机微光学元件批量化制作方法
CN105372734B (zh) * 2015-11-02 2018-01-19 中国科学院重庆绿色智能技术研究院 微棱镜反光材料制作方法
EP3988282B1 (en) 2016-05-09 2024-08-21 Dexerials Corporation Replica master mold
JP6924006B2 (ja) 2016-05-09 2021-08-25 デクセリアルズ株式会社 レプリカ原盤の製造方法、および被形成体の製造方法
CN106500886B (zh) * 2016-09-22 2019-05-10 太原理工大学 一种基于纳米导电材料的柔性应力传感器的制备方法
US10969680B2 (en) * 2016-11-30 2021-04-06 Canon Kabushiki Kaisha System and method for adjusting a position of a template
US10224224B2 (en) 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
US10847360B2 (en) 2017-05-25 2020-11-24 Applied Materials, Inc. High pressure treatment of silicon nitride film
JP7190450B2 (ja) 2017-06-02 2022-12-15 アプライド マテリアルズ インコーポレイテッド 炭化ホウ素ハードマスクのドライストリッピング
KR102246631B1 (ko) * 2017-07-10 2021-04-30 주식회사 엘지화학 리튬 금속 전극용 3d 패턴 타발기
US10234630B2 (en) * 2017-07-12 2019-03-19 Applied Materials, Inc. Method for creating a high refractive index wave guide
JP6947914B2 (ja) 2017-08-18 2021-10-13 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧高温下のアニールチャンバ
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
SG11202001450UA (en) 2017-09-12 2020-03-30 Applied Materials Inc Apparatus and methods for manufacturing semiconductor structures using protective barrier layer
JP2019056025A (ja) 2017-09-19 2019-04-11 東芝メモリ株式会社 パターン形成材料及びパターン形成方法
CN107814353A (zh) * 2017-10-26 2018-03-20 武汉大学 在透明柔性衬底上制备纳米针尖阵列的方法
US10643867B2 (en) 2017-11-03 2020-05-05 Applied Materials, Inc. Annealing system and method
EP4321649B1 (en) 2017-11-11 2025-08-20 Micromaterials LLC Gas delivery system for high pressure processing chamber
JP7330181B2 (ja) 2017-11-16 2023-08-21 アプライド マテリアルズ インコーポレイテッド 高圧蒸気アニール処理装置
JP2021503714A (ja) 2017-11-17 2021-02-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧処理システムのためのコンデンサシステム
KR102649241B1 (ko) 2018-01-24 2024-03-18 어플라이드 머티어리얼스, 인코포레이티드 고압 어닐링을 사용한 심 힐링
SG11202008256WA (en) 2018-03-09 2020-09-29 Applied Materials Inc High pressure annealing process for metal containing materials
RU183906U1 (ru) * 2018-03-23 2018-10-08 Акционерное общество "Центральный научно-исследовательский технологический институт "Техномаш" Устройство для формирования планарной микроструктуры с рельефной поверхностью из фотоотверждаемой полимерной композиции методом контактного копирования
US10714331B2 (en) 2018-04-04 2020-07-14 Applied Materials, Inc. Method to fabricate thermally stable low K-FinFET spacer
CN112041744B (zh) 2018-05-04 2024-08-13 Ev集团E·索尔纳有限责任公司 印模和用于压印的方法
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10566188B2 (en) 2018-05-17 2020-02-18 Applied Materials, Inc. Method to improve film stability
KR102083308B1 (ko) * 2018-05-23 2020-04-23 한국표준과학연구원 탐침형 원자 현미경을 이용한 리소그래피 방법
US10704141B2 (en) 2018-06-01 2020-07-07 Applied Materials, Inc. In-situ CVD and ALD coating of chamber to control metal contamination
CN109110728A (zh) * 2018-07-25 2019-01-01 江西理工大学 基于离心力的微纳结构复制方法及制备得到的聚合物微纳结构
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
KR102528076B1 (ko) 2018-10-30 2023-05-03 어플라이드 머티어리얼스, 인코포레이티드 반도체 응용들을 위한 구조를 식각하기 위한 방법들
US11281094B2 (en) * 2018-11-15 2022-03-22 Applied Materials, Inc. Method for via formation by micro-imprinting
WO2020101935A1 (en) 2018-11-16 2020-05-22 Applied Materials, Inc. Film deposition using enhanced diffusion process
CN109765687B (zh) * 2018-12-04 2021-12-14 上海安翰医疗技术有限公司 曲面外壳上疏水涂层的制作方法及内窥镜
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
DE102019101346A1 (de) 2019-01-18 2020-07-23 Osram Opto Semiconductors Gmbh Nanostempelverfahren und nanooptisches bauteil
KR102237716B1 (ko) * 2019-07-19 2021-04-08 한국과학기술원 미세 금속 마스크를 제작하는 방법
CN116256829A (zh) * 2019-08-01 2023-06-13 国家纳米科学中心 一种近眼显示器衍射光栅波导的制备方法
CN111081624A (zh) * 2019-11-28 2020-04-28 北京纳米能源与系统研究所 电子器件的柔性化方法
CN111142329A (zh) * 2019-12-16 2020-05-12 合肥元旭创芯半导体科技有限公司 一种非破坏性的半导体材料sem监控方法
KR102217103B1 (ko) * 2019-12-31 2021-02-18 전북대학교산학협력단 미세복합 표면구조의 제조방법 및 이를 이용한 미세복합 표면 탄성 폴리머 필름의 제조방법
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
DE102020204766A1 (de) * 2020-04-15 2021-10-21 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung von Dämpferstrukturen an einem mikromechanischen Wafer
EP4057066A1 (en) 2021-03-11 2022-09-14 Obducat AB Apparatus and method for surface treatment of an imprint stamp
EP4646630A1 (de) * 2023-01-03 2025-11-12 EV Group E. Thallner GmbH Vorrichtung und verfahren zum bearbeiten eines substrats in einem evakuierten bearbeitungsraum
EP4714396A1 (en) 2024-09-24 2026-03-25 Obducat AB Devices and methods associated with a tube suitable for medical use

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2305433A (en) * 1940-09-11 1942-12-15 Jesse B Hawley Method and apparatus for molding articles of thermoplastic, thermosetting, or resinous materials
BE479683A (https=) * 1947-01-17
JPS5772823A (en) * 1980-10-27 1982-05-07 Mitsui Toatsu Chem Inc Production of duplicate disk for information recording
JPS62178309A (ja) * 1986-01-31 1987-08-05 Tanazawa Hatsukoushiya:Kk マスタ除去方法
DD251847A1 (de) * 1986-07-31 1987-11-25 Zeiss Jena Veb Carl Verfahren und anordnung zum bildvergleich
JP2760381B2 (ja) * 1988-12-09 1998-05-28 大日本印刷株式会社 スタンパ
JPH02192045A (ja) * 1989-01-20 1990-07-27 Fujitsu Ltd 光ディスク基板の製造方法
JPH05114174A (ja) * 1991-10-21 1993-05-07 Ricoh Co Ltd 光デイスク基板製造装置
US5312794A (en) * 1992-12-29 1994-05-17 Shell Oil Company Catalyst system for olefin polymerization
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
JPH09330864A (ja) * 1996-06-10 1997-12-22 Ge Yokogawa Medical Syst Ltd 複合圧電物質製造方法及び複合圧電物質製造用マスク
JP3888485B2 (ja) * 1997-06-27 2007-03-07 大日本インキ化学工業株式会社 紫外線硬化性組成物
JP3577903B2 (ja) * 1997-08-12 2004-10-20 セイコーエプソン株式会社 樹脂板製造用鋳型の製造方法および樹脂板の製造方法
JP2000071257A (ja) * 1998-09-02 2000-03-07 Kuraray Co Ltd 成形品の製造方法
US6334960B1 (en) 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
SE515607C2 (sv) * 1999-12-10 2001-09-10 Obducat Ab Anordning och metod vid tillverkning av strukturer
KR100694036B1 (ko) * 2000-06-01 2007-03-12 삼성전자주식회사 그루브와 피트의 깊이가 다른 디스크 및 그 제조방법
JP4192414B2 (ja) 2000-09-14 2008-12-10 凸版印刷株式会社 レンズシートの製造方法
US6953332B1 (en) * 2000-11-28 2005-10-11 St. Jude Medical, Inc. Mandrel for use in forming valved prostheses having polymer leaflets by dip coating
US6422528B1 (en) * 2001-01-17 2002-07-23 Sandia National Laboratories Sacrificial plastic mold with electroplatable base
US6815739B2 (en) * 2001-05-18 2004-11-09 Corporation For National Research Initiatives Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
US20030071016A1 (en) * 2001-10-11 2003-04-17 Wu-Sheng Shih Patterned structure reproduction using nonsticking mold
TWI258142B (en) * 2002-01-08 2006-07-11 Tdk Corp Manufacturing method of stamper for manufacturing data medium, the stamper, and the stamper spacer with template
JP3749520B2 (ja) 2002-01-08 2006-03-01 Ｔｄｋ株式会社 情報媒体製造用スタンパの製造方法、スタンパ、及び原盤付スタンパ中間体
US6759180B2 (en) * 2002-04-23 2004-07-06 Hewlett-Packard Development Company, L.P. Method of fabricating sub-lithographic sized line and space patterns for nano-imprinting lithography
US6849558B2 (en) * 2002-05-22 2005-02-01 The Board Of Trustees Of The Leland Stanford Junior University Replication and transfer of microstructures and nanostructures
US20030230817A1 (en) * 2002-06-13 2003-12-18 Agere Systems, Inc. Mold for UV curable adhesive and method of use therefor
US20040032063A1 (en) * 2002-08-16 2004-02-19 Peter Walther Process for shaping plate-shaped materials and an arrangement for carrying out the process
WO2004021083A1 (en) * 2002-08-27 2004-03-11 Obducat Ab Device for transferring a pattern to an object
JP2004109417A (ja) * 2002-09-18 2004-04-08 Dainippon Printing Co Ltd 光回折構造の製造方法、複製版材、及び媒体
JP4061220B2 (ja) * 2003-03-20 2008-03-12 株式会社日立製作所 ナノプリント装置、及び微細構造転写方法
EP1620205A2 (en) * 2003-04-04 2006-02-01 Tecan Trading AG Elastomeric tools for fabricating of polymeric devices and uses thereof
TW200507175A (en) * 2003-06-20 2005-02-16 Matsushita Electric Industrial Co Ltd Pattern forming method, and manufacturing method for semiconductor device
US7150844B2 (en) * 2003-10-16 2006-12-19 Seagate Technology Llc Dry passivation process for stamper/imprinter family making for patterned recording media
US20050084804A1 (en) * 2003-10-16 2005-04-21 Molecular Imprints, Inc. Low surface energy templates
US6939664B2 (en) * 2003-10-24 2005-09-06 International Business Machines Corporation Low-activation energy silicon-containing resist system
EP1533657B1 (en) * 2003-11-21 2011-03-09 Obducat AB Multilayer nano imprint lithography
DE102004005247A1 (de) * 2004-01-28 2005-09-01 Infineon Technologies Ag Imprint-Lithographieverfahren
EP1594001B1 (en) * 2004-05-07 2015-12-30 Obducat AB Device and method for imprint lithography
JP2008500914A (ja) 2004-05-28 2008-01-17 オブデュキャット、アクチボラグ インプリント方法に使用する変性された金属製成形型
US7163888B2 (en) * 2004-11-22 2007-01-16 Motorola, Inc. Direct imprinting of etch barriers using step and flash imprint lithography

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI396622B (zh) * 2009-10-07 2013-05-21 Asml Netherlands Bv 壓印微影裝置及方法
US9547235B2 (en) 2009-10-07 2017-01-17 Asml Netherlands B.V. Imprint lithography apparatus and method
TWI551386B (zh) * 2010-01-27 2016-10-01 分子壓模公司 移除材料及轉印圖案的方法及系統

Also Published As

Publication number Publication date
KR101229100B1 (ko) 2013-02-15
TWI416280B (zh) 2013-11-21
JP5276436B2 (ja) 2013-08-28
US20060279025A1 (en) 2006-12-14
KR20080023252A (ko) 2008-03-12
HK1096162A1 (en) 2007-05-25
TW200705123A (en) 2007-02-01
US7704425B2 (en) 2010-04-27
EP1959299A3 (en) 2010-10-06
MY152606A (en) 2014-10-31
EP1731962A1 (en) 2006-12-13
JP2008542081A (ja) 2008-11-27
EP1731962B1 (en) 2008-12-31
EP1959299A2 (en) 2008-08-20
EP1959299B1 (en) 2012-12-26
ES2317159T3 (es) 2009-04-16
DE602005012068D1 (de) 2009-02-12
CN101198903B (zh) 2011-09-07
HK1121243A1 (en) 2009-04-17
CN101198903A (zh) 2008-06-11
ATE419560T1 (de) 2009-01-15
WO2006131153A1 (en) 2006-12-14
TW200643613A (en) 2006-12-16

Similar Documents

Publication Publication Date Title
TWI313788B (en) Pattern replication with intermediate stamp
CN1979336B (zh) 具有中间模具的图案复制用装置
JP2008542081A5 (https=)
JP5409990B2 (ja) 環状オレフィン共重合体を含んでなるインプリントスタンプ
JP5646692B2 (ja) インプリント製法に使用される重合体スタンプの製造方法
US7997890B2 (en) Device and method for lithography
JP4580411B2 (ja) ソフトモールド及びその製造方法
TW201142546A (en) Imprint lithography
JP4879511B2 (ja) リソグラフィのための装置および方法
EP1731965B1 (en) Imprint stamp comprising cyclic olefin copolymer
JP2024509943A (ja) パターン転写時の離型を容易にするための方法
KR101270082B1 (ko) 인터미디어트 스탬프를 갖는 패턴 복제를 위한 장치
HK1121243B (en) Pattern replication with intermediate stamp
HK1096162B (en) Pattern replication with intermediate stamp
HK1107804B (en) Apparatus and method for transferring a pattern with intermediate stamp
HK1114185B (en) Method for imprint lithography at constant temperature

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent