TWI285955B - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- TWI285955B TWI285955B TW090108948A TW90108948A TWI285955B TW I285955 B TWI285955 B TW I285955B TW 090108948 A TW090108948 A TW 090108948A TW 90108948 A TW90108948 A TW 90108948A TW I285955 B TWI285955 B TW I285955B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- semiconductor substrate
- type
- impurity
- electrode
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 285
- 239000000758 substrate Substances 0.000 claims abstract description 249
- 239000012535 impurity Substances 0.000 claims abstract description 240
- 238000002347 injection Methods 0.000 claims abstract description 56
- 239000007924 injection Substances 0.000 claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 claims description 67
- 239000002184 metal Substances 0.000 claims description 67
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 claims description 48
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 150000001622 bismuth compounds Chemical class 0.000 claims 1
- 229910021332 silicide Inorganic materials 0.000 abstract description 4
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 abstract description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 47
- 229910052796 boron Inorganic materials 0.000 description 45
- 229910015900 BF3 Inorganic materials 0.000 description 40
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 40
- 238000005468 ion implantation Methods 0.000 description 37
- 238000009792 diffusion process Methods 0.000 description 32
- 230000001133 acceleration Effects 0.000 description 23
- 229910052782 aluminium Inorganic materials 0.000 description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 23
- 239000012299 nitrogen atmosphere Substances 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 229910052732 germanium Inorganic materials 0.000 description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 6
- 238000005507 spraying Methods 0.000 description 6
- 230000002079 cooperative effect Effects 0.000 description 5
- 229910001507 metal halide Inorganic materials 0.000 description 5
- 150000005309 metal halides Chemical class 0.000 description 5
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 description 4
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Chemical compound [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 102100027203 B-cell antigen receptor complex-associated protein beta chain Human genes 0.000 description 3
- 101710166261 B-cell antigen receptor complex-associated protein beta chain Proteins 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 3
- 229910001632 barium fluoride Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- SCCCLDWUZODEKG-UHFFFAOYSA-N germanide Chemical compound [GeH3-] SCCCLDWUZODEKG-UHFFFAOYSA-N 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- BYMUNNMMXKDFEZ-UHFFFAOYSA-K trifluorolanthanum Chemical compound F[La](F)F BYMUNNMMXKDFEZ-UHFFFAOYSA-K 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- VTYDSHHBXXPBBQ-UHFFFAOYSA-N boron germanium Chemical compound [B].[Ge] VTYDSHHBXXPBBQ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/60—Impurity distributions or concentrations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/141—Anode or cathode regions of thyristors; Collector or emitter regions of gated bipolar-mode devices, e.g. of IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/834—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge further characterised by the dopants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
Landscapes
- Electrodes Of Semiconductors (AREA)
- Thyristors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000141914A JP3727827B2 (ja) | 2000-05-15 | 2000-05-15 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI285955B true TWI285955B (en) | 2007-08-21 |
Family
ID=18648965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090108948A TWI285955B (en) | 2000-05-15 | 2001-04-13 | Semiconductor device |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20010040255A1 (enExample) |
| EP (1) | EP1156532A3 (enExample) |
| JP (1) | JP3727827B2 (enExample) |
| KR (1) | KR100391560B1 (enExample) |
| CN (1) | CN1218399C (enExample) |
| TW (1) | TWI285955B (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7348227B1 (en) * | 1995-03-23 | 2008-03-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| DE10250575B4 (de) * | 2002-10-30 | 2010-04-15 | Infineon Technologies Ag | IGBT mit monolithisch integrierter antiparalleler Diode |
| JP2005057235A (ja) | 2003-07-24 | 2005-03-03 | Mitsubishi Electric Corp | 絶縁ゲート型バイポーラトランジスタ及びその製造方法、並びに、インバータ回路 |
| JP2005333055A (ja) * | 2004-05-21 | 2005-12-02 | Toyota Central Res & Dev Lab Inc | 半導体装置 |
| CN100461619C (zh) * | 2004-12-24 | 2009-02-11 | 立积电子股份有限公司 | 功率放大器及其形成方法 |
| JP2006210606A (ja) * | 2005-01-27 | 2006-08-10 | Mitsubishi Electric Corp | 半導体装置および半導体装置の製造方法 |
| JP2006228961A (ja) * | 2005-02-17 | 2006-08-31 | Toyota Central Res & Dev Lab Inc | 半導体装置 |
| DE102005032074B4 (de) * | 2005-07-08 | 2007-07-26 | Infineon Technologies Austria Ag | Halbleiterbauelement mit Feldstopp |
| JP2008042013A (ja) * | 2006-08-08 | 2008-02-21 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
| DE102007057728B4 (de) * | 2007-11-30 | 2014-04-30 | Infineon Technologies Ag | Verfahren zur Herstellung eines Halbleiterbauelements mit einer Kurzschlusstruktur |
| US8507352B2 (en) * | 2008-12-10 | 2013-08-13 | Denso Corporation | Method of manufacturing semiconductor device including insulated gate bipolar transistor and diode |
| TWI402985B (zh) * | 2009-06-02 | 2013-07-21 | Anpec Electronics Corp | 絕緣閘雙極電晶體與二極體之整合結構及其製作方法 |
| WO2012042640A1 (ja) * | 2010-09-30 | 2012-04-05 | 株式会社日立製作所 | 半導体装置 |
| WO2012056536A1 (ja) | 2010-10-27 | 2012-05-03 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| JP5621621B2 (ja) * | 2011-01-24 | 2014-11-12 | 三菱電機株式会社 | 半導体装置と半導体装置の製造方法 |
| US9478646B2 (en) * | 2011-07-27 | 2016-10-25 | Alpha And Omega Semiconductor Incorporated | Methods for fabricating anode shorted field stop insulated gate bipolar transistor |
| JP5979993B2 (ja) * | 2012-06-11 | 2016-08-31 | ルネサスエレクトロニクス株式会社 | 狭アクティブセルie型トレンチゲートigbtの製造方法 |
| WO2015049788A1 (ja) * | 2013-10-04 | 2015-04-09 | 株式会社日立製作所 | 半導体装置およびその製造方法、並びに電力変換器 |
| JP2016201563A (ja) * | 2016-07-26 | 2016-12-01 | ルネサスエレクトロニクス株式会社 | 狭アクティブセルie型トレンチゲートigbt |
| JP7361634B2 (ja) * | 2020-03-02 | 2023-10-16 | 三菱電機株式会社 | 半導体装置及び半導体装置の製造方法 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4053924A (en) * | 1975-02-07 | 1977-10-11 | California Linear Circuits, Inc. | Ion-implanted semiconductor abrupt junction |
| JPS6223170A (ja) | 1985-07-23 | 1987-01-31 | Nec Corp | 電力用縦型電界効果トランジスタの製造方法 |
| US5166770A (en) * | 1987-04-15 | 1992-11-24 | Texas Instruments Incorporated | Silicided structures having openings therein |
| JPS6447066U (enExample) | 1987-09-17 | 1989-03-23 | ||
| JP2706120B2 (ja) * | 1988-02-12 | 1998-01-28 | アゼア ブラウン ボヴェリ アクチェンゲゼルシャフト | Gtoパワーサイリスタ |
| EP0330122B1 (de) | 1988-02-24 | 1995-10-25 | Siemens Aktiengesellschaft | Verfahren zur Herstellung eines durch Feldeffekt steuerbaren Bipolartransistors |
| JPH0691263B2 (ja) * | 1988-10-19 | 1994-11-14 | 株式会社東芝 | 半導体装置の製造方法 |
| EP0416805B1 (en) * | 1989-08-30 | 1996-11-20 | Siliconix, Inc. | Transistor with voltage clamp |
| JP2663679B2 (ja) * | 1990-04-20 | 1997-10-15 | 富士電機株式会社 | 伝導度変調型mosfet |
| US5270230A (en) | 1990-04-20 | 1993-12-14 | Fuji Electric Co., Ltd. | Method for making a conductivity modulation MOSFET |
| JPH0548111A (ja) * | 1991-08-12 | 1993-02-26 | Toshiba Corp | 半導体装置およびその製造方法 |
| JPH05152574A (ja) * | 1991-11-29 | 1993-06-18 | Fuji Electric Co Ltd | 半導体装置 |
| JPH0661495A (ja) * | 1992-08-07 | 1994-03-04 | Hitachi Ltd | 半導体装置及びその製法 |
| JP2984478B2 (ja) * | 1992-08-15 | 1999-11-29 | 株式会社東芝 | 伝導度変調型半導体装置及びその製造方法 |
| JPH06318706A (ja) * | 1993-03-08 | 1994-11-15 | Fuji Electric Co Ltd | 半導体装置 |
| JPH06310725A (ja) * | 1993-04-21 | 1994-11-04 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| DE4313170A1 (de) * | 1993-04-22 | 1994-10-27 | Abb Management Ag | Leistungshalbleiterbauelement |
| JPH0758322A (ja) | 1993-08-13 | 1995-03-03 | Toshiba Corp | 半導体装置及びその製造方法 |
| EP0696066A3 (en) * | 1994-06-30 | 1998-06-24 | Hitachi, Ltd. | Semiconductor switching device and power converter |
| DE19534388B4 (de) * | 1994-09-19 | 2009-03-19 | International Rectifier Corp., El Segundo | IGBT-Transistorbauteil |
| JP3488772B2 (ja) * | 1996-01-16 | 2004-01-19 | 三菱電機株式会社 | 半導体装置 |
| DE19710487A1 (de) * | 1996-03-13 | 1997-09-18 | Toshiba Kawasaki Kk | Halbleitervorrichtung |
| DE19710731B4 (de) | 1996-03-15 | 2006-02-16 | Fairchild Korea Semiconductor Ltd., Puchon | Leistungshalbleiterbauteil und Verfahren zu dessen Herstellung |
| US5851857A (en) * | 1996-09-04 | 1998-12-22 | Ixys Corporation | High voltage power MOS device |
| DE19731495C2 (de) * | 1997-07-22 | 1999-05-20 | Siemens Ag | Durch Feldeffekt steuerbarer Bipolartransistor und Verfahren zu seiner Herstellung |
| KR100505562B1 (ko) * | 1998-08-10 | 2005-10-26 | 페어차일드코리아반도체 주식회사 | 다층 버퍼 구조를 갖는 절연게이트 바이폴라 트랜지스터 및 그제조방법 |
| US6482681B1 (en) * | 2000-05-05 | 2002-11-19 | International Rectifier Corporation | Hydrogen implant for buffer zone of punch-through non epi IGBT |
| JP2003069019A (ja) | 2001-08-29 | 2003-03-07 | Toshiba Corp | 半導体装置およびその製造方法 |
| JP3984227B2 (ja) | 2004-01-15 | 2007-10-03 | 株式会社東芝 | 半導体装置 |
-
2000
- 2000-05-15 JP JP2000141914A patent/JP3727827B2/ja not_active Expired - Lifetime
-
2001
- 2001-04-13 TW TW090108948A patent/TWI285955B/zh not_active IP Right Cessation
- 2001-05-10 KR KR10-2001-0025564A patent/KR100391560B1/ko not_active Expired - Fee Related
- 2001-05-14 US US09/853,661 patent/US20010040255A1/en not_active Abandoned
- 2001-05-15 CN CN011190094A patent/CN1218399C/zh not_active Expired - Fee Related
- 2001-05-15 EP EP01111239A patent/EP1156532A3/en not_active Withdrawn
-
2006
- 2006-02-06 US US11/347,321 patent/US7271040B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR100391560B1 (ko) | 2003-07-12 |
| US20060125005A1 (en) | 2006-06-15 |
| EP1156532A2 (en) | 2001-11-21 |
| CN1218399C (zh) | 2005-09-07 |
| KR20010106231A (ko) | 2001-11-29 |
| JP3727827B2 (ja) | 2005-12-21 |
| CN1324111A (zh) | 2001-11-28 |
| US7271040B2 (en) | 2007-09-18 |
| EP1156532A3 (en) | 2003-11-26 |
| US20010040255A1 (en) | 2001-11-15 |
| JP2001326353A (ja) | 2001-11-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI285955B (en) | Semiconductor device | |
| US10763351B2 (en) | Vertical trench DMOSFET having integrated implants forming enhancement diodes in parallel with the body diode | |
| US4079402A (en) | Zener diode incorporating an ion implanted layer establishing the breakdown point below the surface | |
| TWI284925B (en) | High voltage power MOSFET having a voltage sustaining region that includes doped columns formed by trench etching using an etchant gas that is also a doping source | |
| JP2002110978A (ja) | 電力用半導体素子 | |
| US6426248B2 (en) | Process for forming power MOSFET device in float zone, non-epitaxial silicon | |
| TW386314B (en) | Structure of low power, high efficiency programmable erasable non-volatile memory cell and production method thereof | |
| JPS5932172A (ja) | シヨツトキ−障壁mosデバイスからなる集積回路及びその製造方法 | |
| JPS583278A (ja) | 極小領域pnpラテラルトランジスタおよびその製造方法 | |
| US4764799A (en) | Stud-defined integrated circuit structure | |
| CN109755322A (zh) | 碳化硅mosfet器件及其制备方法 | |
| TW541630B (en) | Manufacture of trench-gate semiconductor devices | |
| TWI305927B (en) | Semiconductor device and method of making the same | |
| CN104051524B (zh) | 半导体器件 | |
| TWI286773B (en) | Field emission type electron source | |
| CN214203693U (zh) | 一种功率半导体、晶体管及电子器件 | |
| JP4765175B2 (ja) | 炭化珪素半導体装置の製造方法 | |
| CN101442008B (zh) | 绝缘栅半导体器件及其新型自对准制造方法 | |
| CN1825519B (zh) | 电场放射型电子源 | |
| JP2712098B2 (ja) | 半導体装置 | |
| TW295721B (en) | Manufacturing process of silicide for improving FET | |
| TWI226709B (en) | Two mask Schottky barrier diode with LOCOS structure | |
| TW392365B (en) | Structure and manufacturing method for high voltage device | |
| JPH06275821A (ja) | Mosトランジスタとその製造方法 | |
| CN118039671A (zh) | 一种具有交错式p柱结构的超结mosfet器件及制备方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |