TWI252148B - Cutting apparatus and cutting method - Google Patents
Cutting apparatus and cutting method Download PDFInfo
- Publication number
- TWI252148B TWI252148B TW093120991A TW93120991A TWI252148B TW I252148 B TWI252148 B TW I252148B TW 093120991 A TW093120991 A TW 093120991A TW 93120991 A TW93120991 A TW 93120991A TW I252148 B TWI252148 B TW I252148B
- Authority
- TW
- Taiwan
- Prior art keywords
- cutting
- ceramic
- predetermined position
- cut
- detecting
- Prior art date
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 215
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000000919 ceramic Substances 0.000 claims abstract description 56
- 230000033001 locomotion Effects 0.000 claims description 29
- 238000001514 detection method Methods 0.000 claims description 21
- 230000000630 rising effect Effects 0.000 claims description 4
- 101001026137 Cavia porcellus Glutathione S-transferase A Proteins 0.000 claims 1
- 101001026109 Gallus gallus Glutathione S-transferase Proteins 0.000 claims 1
- 238000001467 acupuncture Methods 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 17
- 238000012937 correction Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 2
- 239000008267 milk Substances 0.000 description 2
- 210000004080 milk Anatomy 0.000 description 2
- 235000013336 milk Nutrition 0.000 description 2
- 101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 1
- 241000220259 Raphanus Species 0.000 description 1
- 235000006140 Raphanus sativus var sativus Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 239000010242 baoji Substances 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/04—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Control Of Cutting Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003327648A JP4311144B2 (ja) | 2003-09-19 | 2003-09-19 | カット装置およびカット方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200518897A TW200518897A (en) | 2005-06-16 |
TWI252148B true TWI252148B (en) | 2006-04-01 |
Family
ID=34457462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093120991A TWI252148B (en) | 2003-09-19 | 2004-07-14 | Cutting apparatus and cutting method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4311144B2 (ko) |
KR (1) | KR100721325B1 (ko) |
CN (1) | CN100336142C (ko) |
TW (1) | TWI252148B (ko) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3835479B1 (ja) * | 2005-05-23 | 2006-10-18 | 株式会社村田製作所 | セラミックグリーンブロックのカット装置およびカット方法 |
CN100423913C (zh) * | 2005-11-21 | 2008-10-08 | 吴金炎 | 塑料镜片的剪切装置 |
JP5278664B2 (ja) * | 2008-07-11 | 2013-09-04 | 株式会社村田製作所 | ワーク位置決め装置、およびワーク位置決め方法 |
JP5457014B2 (ja) * | 2008-11-19 | 2014-04-02 | 三星ダイヤモンド工業株式会社 | 樹脂フィルムの切断方法及び切断装置並びにそれらに用いるカッター |
US20120234152A1 (en) * | 2009-07-29 | 2012-09-20 | James Carmichael | Cutting unit for labelling machines with a multiple-blade rotary drum |
JP5724697B2 (ja) * | 2011-07-08 | 2015-05-27 | 住友電装株式会社 | コルゲートチューブの切断装置、および、切断されたコルゲートチューブの製造方法 |
KR102048921B1 (ko) * | 2012-06-20 | 2019-11-27 | 삼성디스플레이 주식회사 | 셀 절단 장치 및 셀 절단 방법 |
KR102026822B1 (ko) * | 2012-07-23 | 2019-10-01 | 삼성디스플레이 주식회사 | 표시 장치 셀 절단 장치 및 표시 장치 제조 방법 |
CN102873768B (zh) * | 2012-10-25 | 2015-08-19 | 河南天丰节能板材科技股份有限公司 | 复合板自动切割方法及其专用的切割装置 |
JP6136451B2 (ja) * | 2013-03-28 | 2017-05-31 | 日本電気株式会社 | 切断方法及び切断装置 |
CN103224160B (zh) * | 2013-03-28 | 2016-06-29 | 陈伟勇 | 裁切机 |
JP6191557B2 (ja) | 2013-10-25 | 2017-09-06 | 株式会社村田製作所 | 電子部品の製造方法 |
JP6264168B2 (ja) * | 2014-04-15 | 2018-01-24 | 株式会社村田製作所 | 切断装置 |
CN105798955A (zh) * | 2014-12-30 | 2016-07-27 | 山东建筑大学 | 一种板材自动切割装置 |
KR102348927B1 (ko) * | 2015-11-13 | 2022-01-11 | 한국전자통신연구원 | 절단면 촬영 제어 장치 및 방법 |
CN108214605B (zh) * | 2017-11-17 | 2019-10-11 | 宁夏丰通新材料科技有限公司 | 一种改进型的环保板材加工处理设备 |
CN108214604B (zh) * | 2017-11-17 | 2019-09-03 | 南京南化建设有限公司 | 一种新型的环保板材加工处理设备 |
CN107962140B (zh) * | 2017-11-27 | 2020-08-18 | 宁波中和汽配有限公司 | 一种切断机 |
CN109967660A (zh) * | 2017-12-27 | 2019-07-05 | 核工业西南物理研究院 | 一种自动切割电热丝的装置 |
CN108232319A (zh) * | 2018-02-06 | 2018-06-29 | 深圳市诚捷智能装备股份有限公司 | 一种锂电池生产设备 |
CN108793713B (zh) * | 2018-06-27 | 2021-07-23 | 武汉华星光电技术有限公司 | 一种用于切割玻璃基板的切割机及玻璃基板的切割方法 |
KR102230687B1 (ko) * | 2019-11-25 | 2021-03-22 | (주)우남기공 | 폐어망 절단기 |
CN111086042B (zh) * | 2019-12-09 | 2020-12-08 | 博兴兴博投资有限公司 | 一种间歇性板材切割系统 |
CN114986574B (zh) * | 2022-06-10 | 2024-06-25 | 昆山联滔电子有限公司 | 一种切膜辅助治具及切膜工艺 |
CN115360016B (zh) * | 2022-09-13 | 2023-10-13 | 国巨电子(中国)有限公司 | 一种mlcc水系制程压合工艺 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07123098B2 (ja) * | 1990-07-13 | 1995-12-25 | 株式会社村田製作所 | セラミック積層体の製造方法および装置 |
CN1079581A (zh) * | 1992-06-02 | 1993-12-15 | 国营第七九八厂 | 多层陶瓷电容器芯组块的制造工艺 |
JP3215193B2 (ja) * | 1992-10-26 | 2001-10-02 | 株式会社不二越 | 回転工具の刃部形状測定方法及びその装置 |
JP2000021680A (ja) * | 1998-07-06 | 2000-01-21 | Tdk Corp | 積層チップ部品の製造方法及びその装置 |
JP3647675B2 (ja) * | 1999-06-16 | 2005-05-18 | ローム株式会社 | 積層電子部品の製造方法 |
DE19961840C1 (de) * | 1999-12-21 | 2001-07-05 | Epcos Ag | Verfahren zur Herstellung eines regelmäßigen Mehrschichtsaufbaus für insbesondere elektrische Doppelschichtkondensatoren und Vorrichtung dafür |
JP2002299153A (ja) * | 2001-03-29 | 2002-10-11 | Tdk Corp | 積層セラミック電子部品の製造方法 |
JP2003139510A (ja) | 2001-11-05 | 2003-05-14 | Nippon Reliance Kk | シート状の切断物測長方法および装置 |
-
2003
- 2003-09-19 JP JP2003327648A patent/JP4311144B2/ja not_active Expired - Lifetime
-
2004
- 2004-07-14 TW TW093120991A patent/TWI252148B/zh active
- 2004-08-06 KR KR1020040061903A patent/KR100721325B1/ko active IP Right Grant
- 2004-09-20 CN CNB2004100119178A patent/CN100336142C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN100336142C (zh) | 2007-09-05 |
TW200518897A (en) | 2005-06-16 |
KR100721325B1 (ko) | 2007-05-25 |
KR20050029111A (ko) | 2005-03-24 |
CN1597270A (zh) | 2005-03-23 |
JP4311144B2 (ja) | 2009-08-12 |
JP2005088161A (ja) | 2005-04-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI252148B (en) | Cutting apparatus and cutting method | |
WO2006126354A1 (ja) | セラミックグリーンブロックのカット装置およびカット方法 | |
TWI295064B (en) | The laminating apparatus for the ceramic green sheet and the laminating method for the same | |
JP2005050583A (ja) | 電極積層装置及びゲージング装置 | |
JP2004319941A (ja) | セラミック電子部品の製造方法及びグラビア印刷方法 | |
CN113448182B (zh) | 一种提高fpcb曝光速度的装置及加工方法 | |
JP4457712B2 (ja) | カット装置及びカット方法 | |
JP7307570B2 (ja) | セラミックチップ部品の処理方法 | |
JPH08162364A (ja) | 積層型電子部品の積層方法及びその装置 | |
JP3647675B2 (ja) | 積層電子部品の製造方法 | |
JP2810010B2 (ja) | カード製造用打ち抜き装置 | |
JP2004039906A (ja) | セラミックスチップコンデンサーシートの分割方法 | |
JPH0536568A (ja) | 積層セラミツク電子部品の製造方法 | |
JP2008113023A (ja) | セラミック電子部品の製造方法及びグラビア印刷方法 | |
TWM415406U (en) | Facilitate for Substrate Alignment Holes Measurement Substrate deformation of the measuring device | |
JP2005231009A (ja) | 光学フィルムの切断配列システム | |
JP4178924B2 (ja) | セラミックグリーン成形体の切断方法 | |
JPH09104018A (ja) | セラミックスグリーンシートの積層・切断方法 | |
TWI578348B (zh) | Method for manufacturing ceramic electronic parts, position measuring apparatus and method, and marking forming apparatus and method | |
JPH09104016A (ja) | セラミックスグリーンシートの仮積層方法 | |
JPS6331104A (ja) | 積層セラミツクコンデンサの製造方法 | |
JP4356868B2 (ja) | セラミックシート積層体の位置決め方法、及び、位置決め装置 | |
JP5418063B2 (ja) | 剥離装置 | |
JP2004284322A (ja) | セラミックグリーンシート積層体の切断方法 | |
JP6489026B2 (ja) | モータ用積層鋼板の反り検出方法 |