TW200518897A - Cutting apparatus and cutting method - Google Patents
Cutting apparatus and cutting methodInfo
- Publication number
- TW200518897A TW200518897A TW093120991A TW93120991A TW200518897A TW 200518897 A TW200518897 A TW 200518897A TW 093120991 A TW093120991 A TW 093120991A TW 93120991 A TW93120991 A TW 93120991A TW 200518897 A TW200518897 A TW 200518897A
- Authority
- TW
- Taiwan
- Prior art keywords
- cutting
- cutting blade
- trigger signal
- laminated block
- ceramic laminated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/04—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00
Abstract
To provide a cutting apparatus and a cutting method having high working efficiency in comparison with conventional ones and capable of performing high speed processing. When a disk-like cam 15 rotates by 180[deg.], a cutting blade 23 reaches the lowest point and cuts a ceramic laminated block 30. When a motor 9 for driving cutting means rotates, the cutting blade 23 is changed from fall to rise. When an edge of the cutting blade 23 is exposed from the ceramic laminated block 30, a trigger signal is transmitted from a trigger signal generating part to an image processing part. When the image processing part receives the trigger signal, both end faces of the ceramic laminated block 30 are picked up by CCD cameras 5a, 5b, respectively, and a picked-up image for detecting a cut predetermined position is obtained. During the period, the cutting blade 23 continues to rise.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003327648A JP4311144B2 (en) | 2003-09-19 | 2003-09-19 | CUTTING DEVICE AND CUTTING METHOD |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200518897A true TW200518897A (en) | 2005-06-16 |
TWI252148B TWI252148B (en) | 2006-04-01 |
Family
ID=34457462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093120991A TWI252148B (en) | 2003-09-19 | 2004-07-14 | Cutting apparatus and cutting method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4311144B2 (en) |
KR (1) | KR100721325B1 (en) |
CN (1) | CN100336142C (en) |
TW (1) | TWI252148B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI594311B (en) * | 2012-06-20 | 2017-08-01 | 三星顯示器有限公司 | Cell cutting device and cell cutting method |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3835479B1 (en) * | 2005-05-23 | 2006-10-18 | 株式会社村田製作所 | Ceramic green block cutting apparatus and method |
CN100423913C (en) * | 2005-11-21 | 2008-10-08 | 吴金炎 | Plastic lens shearing device |
JP5278664B2 (en) * | 2008-07-11 | 2013-09-04 | 株式会社村田製作所 | Work positioning apparatus and work positioning method |
JP5457014B2 (en) * | 2008-11-19 | 2014-04-02 | 三星ダイヤモンド工業株式会社 | Resin film cutting method and apparatus, and cutter used therefor |
WO2011012925A1 (en) * | 2009-07-29 | 2011-02-03 | Sidel S.P.A. | Cutting unit for labelling machines with a multiple-blade rotary drum |
JP5724697B2 (en) * | 2011-07-08 | 2015-05-27 | 住友電装株式会社 | Corrugated tube cutting device and method for manufacturing cut corrugated tube |
KR102026822B1 (en) * | 2012-07-23 | 2019-10-01 | 삼성디스플레이 주식회사 | Cell cutting apparatus for display device and method for manufacturing display device |
CN102873768B (en) * | 2012-10-25 | 2015-08-19 | 河南天丰节能板材科技股份有限公司 | Composite plate surface trimming method and special cutter sweep thereof |
CN103224160B (en) * | 2013-03-28 | 2016-06-29 | 陈伟勇 | Guillotine |
JP6136451B2 (en) * | 2013-03-28 | 2017-05-31 | 日本電気株式会社 | Cutting method and cutting apparatus |
JP6191557B2 (en) * | 2013-10-25 | 2017-09-06 | 株式会社村田製作所 | Manufacturing method of electronic parts |
JP6264168B2 (en) * | 2014-04-15 | 2018-01-24 | 株式会社村田製作所 | Cutting device |
CN105798955A (en) * | 2014-12-30 | 2016-07-27 | 山东建筑大学 | Automatic plate cutting device |
KR102348927B1 (en) * | 2015-11-13 | 2022-01-11 | 한국전자통신연구원 | Apparatus and method for controlling photographing of cut surface |
CN108214605B (en) * | 2017-11-17 | 2019-10-11 | 宁夏丰通新材料科技有限公司 | A kind of follow-on environment-friendly sheet processing equipment |
CN108214604B (en) * | 2017-11-17 | 2019-09-03 | 南京南化建设有限公司 | A kind of novel environment-friendly sheet processing equipment |
CN107962140B (en) * | 2017-11-27 | 2020-08-18 | 宁波中和汽配有限公司 | Cutting machine |
CN109967660A (en) * | 2017-12-27 | 2019-07-05 | 核工业西南物理研究院 | A kind of device of automatic cutting heating wire |
CN108232319A (en) * | 2018-02-06 | 2018-06-29 | 深圳市诚捷智能装备股份有限公司 | A kind of lithium battery production equipment |
CN108793713B (en) * | 2018-06-27 | 2021-07-23 | 武汉华星光电技术有限公司 | Cutting machine for cutting glass substrate and cutting method of glass substrate |
KR102230687B1 (en) * | 2019-11-25 | 2021-03-22 | (주)우남기공 | Waste fish net cutting machine |
CN111086042B (en) * | 2019-12-09 | 2020-12-08 | 博兴兴博投资有限公司 | Intermittent plate cutting system |
CN114986574A (en) * | 2022-06-10 | 2022-09-02 | 昆山联滔电子有限公司 | Auxiliary jig for film cutting and film cutting process |
CN115360016B (en) * | 2022-09-13 | 2023-10-13 | 国巨电子(中国)有限公司 | MLCC water system manufacturing process lamination process |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07123098B2 (en) * | 1990-07-13 | 1995-12-25 | 株式会社村田製作所 | Method and device for manufacturing ceramic laminate |
CN1079581A (en) * | 1992-06-02 | 1993-12-15 | 国营第七九八厂 | The manufacturing process of multi-layer ceramic capacitor core assembly block |
JP3215193B2 (en) * | 1992-10-26 | 2001-10-02 | 株式会社不二越 | Method and apparatus for measuring blade shape of rotary tool |
JP2000021680A (en) * | 1998-07-06 | 2000-01-21 | Tdk Corp | Manufacture of multilayer chip component and device |
JP3647675B2 (en) * | 1999-06-16 | 2005-05-18 | ローム株式会社 | Manufacturing method of laminated electronic component |
DE19961840C1 (en) * | 1999-12-21 | 2001-07-05 | Epcos Ag | Method for producing a regular multilayer structure for in particular electrical double-layer capacitors and device therefor |
JP2002299153A (en) * | 2001-03-29 | 2002-10-11 | Tdk Corp | Method for manufacturing laminated ceramic electronic component |
JP2003139510A (en) | 2001-11-05 | 2003-05-14 | Nippon Reliance Kk | Length measuring method and device for sheet like cut object |
-
2003
- 2003-09-19 JP JP2003327648A patent/JP4311144B2/en not_active Expired - Lifetime
-
2004
- 2004-07-14 TW TW093120991A patent/TWI252148B/en active
- 2004-08-06 KR KR1020040061903A patent/KR100721325B1/en active IP Right Grant
- 2004-09-20 CN CNB2004100119178A patent/CN100336142C/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI594311B (en) * | 2012-06-20 | 2017-08-01 | 三星顯示器有限公司 | Cell cutting device and cell cutting method |
US10640413B2 (en) | 2012-06-20 | 2020-05-05 | Samsung Display Co., Ltd. | Cell cutting device and cell cutting method |
Also Published As
Publication number | Publication date |
---|---|
TWI252148B (en) | 2006-04-01 |
JP4311144B2 (en) | 2009-08-12 |
CN1597270A (en) | 2005-03-23 |
JP2005088161A (en) | 2005-04-07 |
CN100336142C (en) | 2007-09-05 |
KR20050029111A (en) | 2005-03-24 |
KR100721325B1 (en) | 2007-05-25 |
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