JP2002299153A - Method for manufacturing laminated ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To calculate a position with high precision, where a ceramic laminate is desired to be cut, and cut the ceramic laminate accurately as a laminated ceramic element assembly of component unit, even if irregularities due to deformation or the like exist among ceramic laminates. SOLUTION: A visible light is irradiated to the ceramic laminate 1 from a light source 2, and an image formed by the visible light-penetrating a body of the ceramic laminate 1 is captured by an imaging camera 3. Cutting position data per column are obtained from an image of an internal electrode for every one column in the captured image, by using an image analysis processing device 4. A cutting device 5 is moved and controlled, by using the cutting position data for every column, and the ceramic laminate 1 is cut.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer ceramic electronic component which is applied to cutting a ceramic laminate for obtaining a plurality of components into a multilayer ceramic body for each component.

[0002]

2. Description of the Related Art In general, in the case of a multilayer ceramic capacitor, for example, a plurality of internal electrodes are vertically and horizontally printed on a plane of the same ceramic green sheet, and the ceramic green sheets are alternately laminated with the internal electrodes to obtain a plurality of components. A ceramic laminated body for each component is manufactured, and the ceramic laminated body is aligned with the center of the width between the edges of adjacent internal electrodes and cut in the XY direction to obtain a laminated ceramic body for each component. ing.

[0003] The laminated ceramic body is fed to a firing step and subjected to a firing process, which is sent to a terminal electrode forming step as a component body, and terminal electrodes electrically connected to alternately alternating internal electrodes are provided at both ends of the component body. This is manufactured as a multilayer ceramic capacitor by providing it in a portion.

Conventionally, in order to cut a ceramic laminate for taking out a plurality of components into parts during the manufacturing process, a positioning mark preprinted on the outermost layer surface of the ceramic laminate or an outer peripheral edge of the ceramic laminate is used as a reference. In addition, the cutting position of the ceramic laminate is determined by assuming the center position between the edges of adjacent internal electrodes, and several test cuttings are performed to adjust the actual internal electrodes and the cutting position to obtain a margin. The specified value is ensured.

[0005] However, this not only wastes the ceramic laminate used for the test cutting, but also presupposes that the positions of the internal electrodes do not vary so much. No matter how many test cuts are made, the cutting position cannot be determined.
If the specified value of the margin is not ensured, it causes insulation failure or the like due to the exposure of the internal electrode. Therefore, it is necessary to cut the ceramic laminate into parts while maintaining the specified value of the margin accurately.

In order to ensure the accuracy of the cutting, a transmitted light such as an X-ray or an ultrasonic light is directed toward the ceramic laminate, and the transmitted light is irradiated from a light irradiation device, and an image of the internal electrode obtained by the transmitted light is obtained. Measuring the cutting position in the X and Y directions of cutting the ceramic laminate from the image analysis processing device, and operating the cutting device based on the measurement data of the image analysis processing device to cut the ceramic laminate into a multilayer ceramic body in component units Has been proposed (JP-A-2000-2168).
No. 0).

In the method for cutting a ceramic laminate, in order to centrally manage a plurality of ceramic laminates, measurement data of an image analysis processing device is input to a data recording medium, and the measurement data is transferred using the data recording medium. It is set so as to be input to the terminal of the cutting device and to control the operation of the cutting device based on measurement data output from the terminal.

Also, since it is necessary to input the measurement data of the image analysis processing device to the data recording medium and reproduce the measurement data of the image analysis processing device to control the operation of the cutting device, an image processing device is provided. The target mark formed on the outermost layer of the laminate is captured by an imaging camera, and the coordinates X and Y in the XY directions on the plane of the ceramic laminate are obtained in advance. Based on the coordinates X and Y, the XY directions in the transfer table of the ceramic laminate are determined. The cutting is performed by correcting the positional deviation in the θ direction.

However, in the above-described method for cutting a ceramic laminate, since X-rays, ultrasonic beams and the like are used as transmitted beams, it is necessary to consider the safety of the device, and the device as a whole becomes mechanically complicated. . Further, since the cutting position is calculated based on the coordinates X and Y based on the target mark, and the cutting is performed while correcting the positional deviation in the XY direction and the θ direction, the cutting includes an assumed element.

In addition to the image pickup of the internal electrodes, an eddy current type, a capacitance type, or an ultrasonic type electric sensor is moved on the ceramic laminate, and the voltage generated at the portion where the internal electrodes exist and the internal electrode Voltage generated in the area where no
Further, it has been proposed to detect a cutting position by a waveform obtained from a voltage difference generated at a stage of moving between the two (Japanese Patent Publication No. 7-97537).

By electrically detecting the cutting position, the cutting position must be determined from a subtly changing waveform. For this reason, skilled techniques are required, and it is particularly difficult to cut small multilayer ceramic electronic components with high precision.

[0012]

SUMMARY OF THE INVENTION According to the present invention, a position to be cut of a ceramic laminate is determined with high precision.
An object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component capable of accurately cutting a ceramic laminate.

[0013]

According to a first aspect of the present invention, there is provided a method of manufacturing a multilayer ceramic electronic component, wherein a plurality of internal electrodes are arranged vertically and horizontally and printed on a plane of the same ceramic green sheet. Are alternately laminated with internal electrodes to form a ceramic laminate for obtaining a plurality of components, and the ceramic laminate is cut in accordance with the electrode positions of the internal electrodes to obtain a multilayer ceramic body for each component. Then, the visible light is emitted from the light source toward the ceramic laminate, an image of the visible light transmitted through the body of the ceramic laminate is captured by an imaging camera, and the internal electrodes of each row in the image captured by the imaging camera are captured. From the image, the cutting position data for one row is obtained by the image analysis processing device, and the cutting is performed using the cutting position data for each row obtained by the image analysis processing device. Device movement is controlled by being adapted to cut the ceramic laminate.

In the method for manufacturing a multilayer ceramic electronic component according to a second aspect of the present invention, the center position of the width between the edges is determined by the image of the internal electrodes in each adjacent row in the image captured by the imaging camera. Is obtained by the image analysis processing device as the cutting position data.

According to a third aspect of the present invention, in the method of manufacturing a multilayer ceramic electronic component, the edge position is determined from the image of the internal electrodes in each row in the image captured by the imaging camera as cutting position data for the single row. It is required to be determined by the processing device.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the accompanying drawings, FIG. 1 shows a laminated ceramic laminate 1 for taking a plurality of components in order to manufacture a multilayer ceramic electronic component such as a multilayer ceramic capacitor. The process of cutting as a ceramic body is shown. In the cutting process of the ceramic laminated body, side cutting of the laminated ceramic body taking a margin by the ceramic layer and end cutting of the laminated ceramic body exposing the internal electrodes are individually performed.

The ceramic laminate 1 as the object to be cut
Are printed in a plane of a ceramic green sheet by arranging a plurality of internal electrodes vertically and horizontally, and laminating a plurality of the ceramic green sheets alternately with the internal electrodes, and laminating a ceramic green sheet having no internal electrodes formed on the outermost layer. It is formed before the cutting process step by pressing under pressure.

In the cutting step of the ceramic laminate 1,
The ceramic laminate 1 is placed on a table of a cutting table (not shown), and visible light is emitted from the light source 2 toward the ceramic laminate 1 from the back side, and the visible light is transmitted through the body of the ceramic laminate 1. The image is captured by the imaging camera 3, and the cutting position data for one row is obtained from the image of the internal electrode for each row in the image by the image analysis processing device 4, and the movement of the cutting apparatus 5 is controlled by the cutting position data for each row. The ceramic laminate 1 is cut in this way.

The visible light used here is 380 nm to 7 nm.
When the visible light is applied to the ceramic laminate 1, the internal electrode 10 is made of visible light transmitted through the body of the ceramic laminate 1 as shown in FIG.
are obtained by clearly separating the images of a, 10b,... from the image of the ceramic layer 11. Also, according to this visible light, as the wavelength becomes shorter, red, orange, yellow,
Images with green, blue, indigo and purple tones can be obtained.

When cutting the side of the laminated ceramic body taking a margin by the ceramic layer based on the image of the imaging camera 3, images 10a, 10b, 10c, The inter-edge width W is determined from the edge points f ₁ , f ₂ , f ₃ , f _{4 at} 10d..., And the center position C ₁ of the inter-edge width W is determined by the image analysis processing device 4 as the cutting position data for one row. . The movement of the cutting device 5 is controlled based on the cutting position data for each row, and the cutting is performed between the internal electrodes arranged in the cutting direction for each row.

When cutting both ends of the laminated ceramic body exposing the internal electrodes, the images 10a, 10b, 1
.. 0c, 10d,..., Each edge position C ₂ , C ₃ is determined by the image analysis processing device 4 as the cutting position data for one row. In this case as well, similarly, the movement of the cutting device 5 is controlled based on the cutting position data for each row, and the cutting is performed along the edges of the internal electrodes lined up in the direction desired to be cut row by row.

The cutting device 5 is mounted on a control table having a drive shaft in the X and Y directions rotated by a pulse motor or the like and a rotation axis in the θ direction, so that the images 10a, 10b, 10
c, the center position _{C 1} or the edge of the 10d ... position _C 2, _{C 3}
The position is moved according to the cutting position data. In addition,
As the cutting device 5, a dicing saw that cuts with a rotary blade or a knife cutter that cuts with a pressing blade can be applied.

By cutting the ceramic laminate in this manner, the cutting position of the ceramic laminate can be determined with high accuracy from the image of the internal electrode. Further, since the cutting position is determined for each row, the cutting position between the ceramic laminates can be reduced. Therefore, even if there is a variation due to deformation or the like, the ceramic laminate 1 can be cut accurately. For this reason, it can be cut as a multilayer ceramic body in component units that reliably secures a specified value margin.

[0024]

As described above, according to the method for manufacturing a multilayer ceramic electronic component of the present invention, visible light is emitted from a light source toward a ceramic laminate, and visible light transmitted through the body of the ceramic laminate. Captured by the camera,
In order to cut the ceramic laminated body by controlling the movement of the cutting device according to the cutting position data for each row from the image of the internal electrodes in each row in this image by the image analysis processing device, and controlling the cutting device based on the cutting position data for each row, The cutting position of the ceramic laminate can be determined stably and with high precision, and it can be cut accurately as a laminated ceramic body with a specified value margin, and since the cutting position is determined for each row, deformation between the ceramic laminates Even if there are variations due to the above, the ceramic laminate can be cut accurately and the yield can be improved.

[Brief description of the drawings]

FIG. 1 is an explanatory view schematically showing an apparatus to which a method for manufacturing a multilayer ceramic electronic component according to the present invention is applied.

FIG. 2 is an explanatory diagram showing images of internal electrodes and a ceramic layer obtained by an imaging camera of the device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Ceramic laminated body 2 Visible light source 3 Imaging camera 4 Image analysis processing apparatus 5 Cutting apparatus 10a, 10b ... Image of an internal electrode 11 Image of a ceramic layer W Width between edges of adjacent electrode images C ₁ Center of adjacent electrode images Position C ₂ , C ₃ Electrode image edge position

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Tsuyoshi Takashima 151 Maeda, Hirasawa, Nikaho-cho, Yuri-gun, Akita Prefecture Inside TDCMC C.C. Within TDK Corporation (72) Inventor Masaaki Kaneko 1-1-13 Nihonbashi, Chuo-ku, Tokyo F-term within TDK Corporation 5E001 AB03 AH01 AH06 AJ01 5E082 AB03 BC38 EE04 EE35 FG06 FG26 LL01 LL03 MM04 MM21

Claims (3)

[Claims] 1. A plurality of internal electrodes are vertically and horizontally arranged and printed on a plane of a ceramic green sheet, and the plurality of ceramic green sheets are alternately laminated with the internal electrodes to form a ceramic laminate for obtaining a plurality of components. In order to obtain a multilayer ceramic body for each component by cutting the ceramic multilayer body according to the electrode position of the internal electrode, visible light is irradiated from a light source toward the ceramic multilayer body, and the inside of the ceramic multilayer body is illuminated. An image by the transmitted visible light is captured by the imaging camera, and the cutting position data for the one row is obtained by the image analysis processing apparatus from the image of the internal electrode of each row in the image captured by the imaging camera, and the image analysis processing apparatus performs the processing. The ceramic laminate is characterized by cutting the ceramic laminate by controlling the movement of the cutting device based on the obtained cutting position data for each row. Click method of manufacturing an electronic component. 2. The method according to claim 1, wherein the center position of the width between the edges is obtained from the image of the internal electrodes in each adjacent row in the image captured by the imaging camera as cutting position data for the single row by the image analysis processing device. The method for manufacturing a multilayer ceramic electronic component according to claim 1. 3. The image analysis processing device according to claim 1, wherein an edge position is obtained from the image of the internal electrode in each row in the image captured by the imaging camera as cutting position data for the row. A manufacturing method of the multilayer ceramic electronic component according to the above.