M415406 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種利用基板對位孔測量基板變形量之測量袭 置，主要是在一承載平台上設置一透明板體，並在該透明板體鄰 近其四邊中央的位置分別設置一基準圖樣，當該承載平台推升一 待測之基板抵靠該透明板體後，該基板的四個對位孔能分別對應 至各該基準圖樣，使架設在該透明板體上方的四部影像操取單 凡，能各別拍攝各該對位孔及基準圖樣，以供計算出該基板的變 形狀況。 【先前技術】 按’印刷電路板（以下稱基板），又稱印製電路板、印刷線路M415406 V. New description: [New technical field] This creation is about measuring the deformation of the substrate using the substrate alignment hole, mainly by setting a transparent plate on a carrying platform and on the transparent plate. A reference pattern is respectively disposed at a position adjacent to a central portion of the four sides of the body. When the carrying platform pushes up a substrate to be tested against the transparent plate body, the four alignment holes of the substrate can respectively correspond to the reference patterns, so that The four images mounted above the transparent plate body can be photographed separately, and the alignment holes and the reference pattern can be separately photographed for calculating the deformation state of the substrate. [Prior Art] Press 'Printed circuit board (hereinafter referred to as the substrate), also known as printed circuit board, printed circuit
板’韦見的英文縮寫為PCB (Printed circuit board)或PWB (Printed wire board)，是重要的電子元件，也是各種電子零件 的支撐體，用以使電子零件能根據設計需求達成電氣連接。在— 般的基板中，大多是採用印刷敲刻阻劑的工法，製作出電路的線 路及圖面，因此基板又被稱為印刷電路板或印刷線路板。目前大 多數的基板都是採用貼附蝕刻阻劑，並經過曝光顯影後，再以蝕 刻完成基板。 在基板的製作過程中，製造廠商會先利用電鍍或其他物理方 式在一絕緣板上佈設一層鋼箔，以形成基板的雛形，再以曝光、 顯影及侧等方式處理該鋪，以在該基板上形成預先設計的電 路。然而，在基板的製作過程中，該絕緣板及銅箔會經過各種溫 度條件的處理程序，而為了因應產品需求及後續製程等因素，基 M415406 板經常會被浸泡在各種酸性或其他性質的溶液中，且基板在加工 處理的過私中’亦；^會文到各種應力（如：拉伸應力、壓縮應力、 $應力等）。基独上眾多因素，基板在正式進人曝光顯影程序之 前’可能已有變形等情況發生，根據創作人長年的實務經驗與研 究發現，基板常會有騎、長度（或寬度）方向收縮、伸張等 況發生。 _免已發生變_基錢人祕絲频構後，曝光顯影 鲁機構無法正確地將曝光圖樣曝光至基板上，製造廠商必須收集變 形狀況相近的基板，並校正曝光，以便使校正後的曝光圖樣 ，確地曝光至綠上。植社述航，製造_需針縣板進 吁變开刀則量以便收集變形狀況相近的基板，通常製造廠商會以 測量裝置進行變形測量’傳統的測量裝置主要包括-玻璃板體及 四台相機（影像榻取元件），請參閱第i圖所示，在玻璃板體1〇 上鄰，四個角落的位置，分別設置有一基準圖樣100，在過去常見 的測量裝置中，每—個基準圖樣分別包括四個基準點⑻，且在每 ❿一基準圖樣中’該等基_ 1()1係呈矩形排列。四台相機（圖 中未不）係”又置在該玻璃板體10的上方，且各相機分別對應於玻 璃板體10的各個基準圖樣⑽。另一方面，請參閱第2圖所示， 基板20上鄰近四個角落的位置，分別開設有-對位孔200，且各 ^位孔200分別貫穿該基板2〇。測量基板變形的主要原理即是測 量對位孔200之間的距離⑽、HU、DL、DR、VR、VL) ’當測量裝 置取得，等距離⑽、冊、DL、DR、VR、VL)後，即可對該等距 離進行幾何分析，以明碟地得知基板20的變形情況。 承上，測量裝置會先疊合基板2〇與玻璃板體1〇，使各對位孔 5 M415406 200分別對應至各基準圖樣削，如此，四台相機便能分別拍攝各 對位孔2GG及基準騎⑽，以取得影像。然而，請參閱第3圖所 示:當基板20a變形程度較大的情況下，部分對位孔施將會過 份遠離各基糊樣⑽，在此情況τ，相機即無法順利地拍攝各對 位孔2GGa與基準_⑽，而導刺量失敗。為避免上述問題， 各該相機必須移動，方能拍攝到各該對位孔2GGa及基準圖樣謂 的相對位置_ ’因此’製造廠商在設計製造測量裝置時，必須 在相機上㈣加裝帶動機構，使帶動機觀帶動相機移動，以拍 攝對位孔200a及基準圖樣議。然而，額外加裝帶動機構的作法， =大幅提升測量裝置的結構設計複雜程度，更增加測量裝置的 雜度，且大幅提高生錢本，相當獨。不僅如此，由於 =機^須驅動相機移動，方能拍攝到所需的影像，不僅增加 ，、里所需耗費時間’更嚴重降低測量作業之效率，非常不理相。 如何改善現有測量裝置的諸多缺失，簡化測量裝置的 降_量裝置_裝複雜度及生產成本，並有效提 乍業的效率’即成為本創作在此欲探討的-重要課題。 【新型内容】 研究=前測f裝置的諸多問題，創作人經過長久努力 變形量之^ =於開發本創作之湘基板對位孔測量基板 變量裝置，期藉由改良習知測量裝置的輯，降低測量 度’並有效料⑸啦裝置效率不料問題。 量之料係提供一種利用基板對位孔測量基板變形 m裝台、1降機構、一透明板體、四 M415406 部影像擷取單元及-處理單元’其巾該升降機構係與該承載平台 相連接，而能帶動該承載平台上升，使該承餅台承載並帶動一 基板上升’該基板鄰近其四邊中央之位置上分別開設有一對位 孔；該透明板麟設置在該承齡㈣上方，咖板體鄰近 其四邊中央的位置分別設有-基準，該承载平台帶動該基板 上升後，該承餅台能將該基板之頂面推升絲在該透明板體之 ^，使該等對位孔分別對應於各該基準圖樣，以便進行後續測 篁作業；各該影像操取單元係設在該透明板體之上方，且分別對 應於各該基準圖樣雜置，各該影細取單元係分珊各該基準 圖樣及各該難孔進行拍攝1分觀得—_影像；該處理翠 =係與該等影賴取單元相連接，錄自各該影侧取單元取得 各該測量影像，並對該等測量影像進行分析，以計算出各該對位 孔分別與對絲相樣的位置_，進而推算岭基板的變形狀 本創作是在該透明板體鄰近其四邊中央的位置分別設 置基準圖樣，以對應於鄰近基板四邊中央位置上的各對位孔，因 =、=基_變形減鼓，各騎魏仍不會册遠離各該 L如此，錢影像摘取單元不需作任何移動，便能完整 樣，完全不需在該等影細取單元 加裝㈣機構，大關化測量裝置的結構設計，並降 篁裝置的組裴複雜度。 _ 送機目的’乃該测量裝置尚包括—輸送機構，該輸 於該承載平台的位置後，_機構能帶 。升’使該承載平台承載該基板，並帶動該基板上 7 M415406 升。 一本創作之又一目的，乃該輸送機構係由至少一輸送帶及至少 j輪所構成，該輸送帶縣設在該等雜上，該等滾輪能旋轉 ▼該輪送帶’使該輸送帶能將基板運送到對應於該承載平台的 位 為便責審查委員能對本創作之目的、技術特徵及其功效， 做更進纟之認識與瞭解，兹舉實施例配合圖式，詳細說明如下： 【實施方式】 創作人在長期投入基板測量裝置等相關產品的研發與製造 中知的測量裳置常有測量效率低、結構複雜等問題，且 過去測夏裝置需在影細取單元上額外加裝帶動機構，使得測量 =的製造成本大幅提高，並不理想。目前大多數的製造廠商雖 奴=由改良測量裝置的整體結構，以化解上述問題，然而至今仍 未件到妥善畴決方案。有鑑於此，㈣人乃思及改良測量裝置 的結構’期翻增加測量效率，且降低製造成本的效果。 本創作係—種_基板對位孔測量基板變形量之測量褒置， 在本創作之較佳實施例中，請參閱第4圖所示，該測量裝置4包 2承、二升降機構4卜一輸送機構42、-透明板體 43、四部影像操取單元44 (如第6圖所示）及一處理單元.其 中各該升降機構41分別為一氣虹（亦可為升降馬達或其他元件）’ 升降機構41分顺該承載平台40相連接，而能帶動該承 旦:台40上升或下降，在本較佳實施财，該升降機構制數 兩個*本創作並不以此為限，製造廒商在根據本創作設 M415406 、、1=該測x裝置4時’亦可根據實際設計或成本需求，增加或 二降機構41的數量，例如：僅使用—個升降機構41，同樣 此達成本創相欲追求之目的，合先_。 ’The board's English abbreviation is PCB (Printed circuit board) or PWB (Printed wire board). It is an important electronic component and a support for various electronic components, so that electronic components can be electrically connected according to design requirements. In the general substrate, the circuit and the surface of the circuit are mostly formed by a method of printing a photoresist, and the substrate is also called a printed circuit board or a printed wiring board. At present, most of the substrates are coated with an etch resist, and after exposure and development, the substrate is etched. In the manufacturing process of the substrate, the manufacturer first uses a plating or other physical means to lay a layer of steel foil on an insulating plate to form a prototype of the substrate, and then treat the substrate by exposure, development, and side, etc., on the substrate. A pre-designed circuit is formed on it. However, during the fabrication of the substrate, the insulating plate and the copper foil are subjected to various temperature conditions, and the M415406 plate is often immersed in various acidic or other properties in response to product requirements and subsequent processes. In the middle of the process, and the substrate is in the process of processing, it also has various stresses (such as tensile stress, compressive stress, $stress, etc.). There are many factors on the basis of the substrate, and the substrate may have been deformed before the official exposure and development process. According to the creator's long-term practical experience and research, the substrate often has a ride, length (or width) direction contraction, stretching, etc. The situation happened. _ exemption has changed _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The pattern is indeed exposed to the green. Plantation, sailing, manufacturing _ Needle County board into the mouth to change the amount of the knife in order to collect the substrate with similar deformation, usually the manufacturer will use the measuring device for deformation measurement 'traditional measuring device mainly includes - glass plate and four cameras (image pickup component), please refer to the figure i, on the glass plate body 1 邻 adjacent, four corners of the position, respectively, set a reference pattern 100, in the past common measurement device, each of the reference pattern Each of the four reference points (8) is included, and in each of the reference designs, the bases _ 1() 1 are arranged in a rectangular shape. Four cameras (not shown) are placed above the glass plate 10, and each camera corresponds to each of the reference patterns (10) of the glass plate 10. On the other hand, as shown in Fig. 2, A position adjacent to the four corners of the substrate 20 is respectively provided with a - alignment hole 200, and each of the holes 200 penetrates the substrate 2. The main principle of measuring the deformation of the substrate is to measure the distance between the alignment holes 200 (10) , HU, DL, DR, VR, VL) 'When the measuring device is acquired, equidistant (10), volume, DL, DR, VR, VL), geometric analysis can be performed on the equidistant distance to know the substrate The deformation of 20. The measuring device will first stack the substrate 2〇 and the glass plate 1〇, so that the alignment holes 5 M415406 200 respectively correspond to the respective reference patterns, so that four cameras can respectively shoot each The alignment hole 2GG and the reference ride (10) are used to obtain an image. However, please refer to FIG. 3: when the substrate 20a is deformed to a large extent, some of the alignment holes will be excessively far from the respective base pastes (10). In this case τ, the camera cannot smoothly capture each of the registration holes 2GGa and the reference _(10). In order to avoid the above problem, each camera must be moved to capture the relative position of each of the alignment holes 2GGa and the reference pattern _ 'so the manufacturer must design the manufacturing of the measuring device, must be in the camera The upper (4) is equipped with a driving mechanism to move the camera with the motive view to shoot the alignment hole 200a and the reference pattern. However, the additional installation of the driving mechanism greatly increases the structural design complexity of the measuring device and increases the measurement. The complexity of the device, and greatly increase the cost of money, quite unique. Not only that, because the machine must drive the camera to move, in order to capture the desired image, not only increase, but also take time to 'more seriously reduce the measurement The efficiency of the operation is very disregarded. How to improve the many defects of the existing measuring device, simplify the measuring device's _ quantity device _ loading complexity and production cost, and effectively improve the efficiency of the industry' - important topics. [New content] Research = many problems in the pre-measurement f device, the creator has been working hard for a long time The substrate substrate measuring device of the Xiang substrate is measured by a modified conventional measuring device, which reduces the measurement degree and effectively reduces the efficiency of the device. The measuring material provides a substrate deformation using the substrate alignment hole. The loading platform, the 1 lowering mechanism, the transparent plate body, the four M415406 image capturing unit and the processing unit 'the towel lifting mechanism are connected with the carrying platform, and can drive the carrying platform to rise, so that the bearing platform Carrying and driving a substrate to rise 'the substrate is respectively adjacent to the center of the four sides thereof and is provided with a pair of bit holes respectively; the transparent plate is disposed above the bearing age (four), and the position of the coffee plate body adjacent to the center of the four sides thereof is respectively provided with a reference. After the carrying platform drives the substrate to rise, the receiving table can push the top surface of the substrate to the transparent plate body, so that the matching holes respectively correspond to the reference patterns for subsequent testing. Each of the image manipulation units is disposed above the transparent plate body and is respectively disposed corresponding to each of the reference patterns, and each of the image capture units is divided into the reference patterns and each of the hard patterns. The hole is photographed for 1 minute to view the image, and the processing is connected to the image capturing unit, and each of the image capturing units is taken to obtain each of the measured images, and the measured images are analyzed to calculate The position of each of the alignment holes is opposite to that of the pair of wires, and then the shape of the ridge substrate is estimated. The original pattern is set at a position adjacent to the center of the four sides of the transparent plate body to correspond to the central position of the four sides of the adjacent substrate. Each of the alignment holes on the upper side, because of the =, = base _ deformation minus the drum, each riding Wei will not be away from each of the L so, the money image extraction unit does not need to make any movement, can be complete, completely without The image capture unit is equipped with a (4) mechanism, the structural design of the large-scale measurement device, and the complexity of the device of the device. _ The purpose of the delivery is that the measuring device further includes a conveying mechanism, and after the position of the carrying platform, the _ mechanism can carry.升' enables the carrier platform to carry the substrate and drive 7 M415406 liters on the substrate. A further object of the creation is that the conveying mechanism is composed of at least one conveyor belt and at least j wheels, the conveyor belt county is disposed on the impurities, and the rollers can rotate ▼ the wheel conveyor belt to make the conveyor The belt can transport the substrate to the position corresponding to the carrying platform. The responsible reviewing committee can make a better understanding and understanding of the purpose, technical features and functions of the present creation, and the embodiment is combined with the drawing, and the details are as follows: [Embodiment] The creators of the long-term investment in the development and manufacture of related products such as substrate measuring devices often have problems such as low measurement efficiency and complicated structure, and in the past, the summer measuring device needs to be extra on the shadow taking unit. The installation of the driving mechanism makes the manufacturing cost of the measurement = greatly improved, which is not ideal. At present, most manufacturers, although slaves, have improved the overall structure of the measuring device to solve the above problems, but still have not yet reached a proper solution. In view of this, (4) the structure of the human and the improved measuring device is increased, and the measurement efficiency is increased, and the manufacturing cost is reduced. In the preferred embodiment of the present invention, please refer to FIG. 4, the measuring device 4 includes 2 bearings and 2 lifting mechanisms 4b. A conveying mechanism 42, a transparent plate body 43, four image capturing units 44 (shown in FIG. 6) and a processing unit. Each of the lifting mechanisms 41 is a gas rainbow (which may also be a lifting motor or other components). The lifting mechanism 41 is connected to the carrying platform 40, and can drive the bearing: the platform 40 rises or falls. In the preferred implementation, the lifting mechanism is not limited to this. When manufacturing M415406, 1=the x device 4 according to the present invention, the number of the mechanism 41 can be increased or decreased according to the actual design or cost requirement, for example, only one lifting mechanism 41 is used, and the same To achieve the purpose of this creation, the first _. ’
播=上’錢參_ 4崎*，在本雛實施财，該輸送機 州处t由至少—輪送帶420及至少二滾輪421所構成，該等滾輪 月匕旋轉帶動該輪送帶420 ’使該輸送帶420能將基板W運送到 ，應於該承載平台4Q的位置。惟，本創作並不此為限，製造廄商 艮據本創作製造該測量裝置4時，亦可改變該輸送機構42的設 计凡本創作領域之人士所能輕易思及之變化與修飾，均應涵蓋 在本創作之申請專利範财，合先陳明。該輸送機構42係設置在 ^應於該承载平台4〇的位置，且該輸送機構42鄰近一端的位置 叹有-基板送人感測器422。當該輸送機構42將-待測量之基板 運送到對應於該承載平台4〇的位置後，該基板送入感測器422 能谓測到該基板W已被運送到制位置，樣發出—送入確認訊 號使該升降機構41帶動該承載平台4〇上升，如此，請參閱第$ 圖所不’該承餅台40便能承載絲板W，並帶動絲板w上升。 在本較佳實施例中，請參閱第6圖所示’該基板w主要是由一絕 緣板I及一銅洛C所組成，該銅箔C係披覆在該絕緣板丨之一側 面，該基板W鄰近其四邊中央之位置上分別開設有一對位孔 請參閱第4圖所示，該透明板體43係由玻璃材質所製成，惟， 本創作並不以此為限，製造廠商亦可利用其他透明材質（如：聚 甲基丙烯酸甲酯（Polymethylmethacrylate，簡稱ΡΜΜΑ))製作該 透明板體43。該透明板體43係設置在該承載平台4〇的上方，請 參閱第6圖所示，該透明板體43鄰近其四邊中央的位置分別設有 9 M415406 一基準圖樣430,各該基準圖樣430分別由複數個基準點431所組 成’該承載平台40帶動該基板W上升後’該承載平台4〇能將該 基板W之頂面推升抵靠在該透明板體43之底面，此時，請參閱第 7圖所示，各該對位孔p即能分別對應於各該基準圖樣43〇，以便 進行後續測量作業。 復請參閱第6圖所示，各該影像擷取單元44分別為一相機， 製造廠商可選用具備USB (Universal Serial Bus，通用序列匯流 排）介面之相機’作為該影像擷取單元44，各該影像擷取單元44 係設在該透明板體43之上方，且分別對應於各該基準圖樣43〇的 位置，各該影像擷取單元44係分別對各該基準圖樣430及各該對 位孔P進行拍攝，以分別取得一測量影像。請參閱第4、6圖所示， 該處理單元45係與該等影像擷取單元44相連接，且能自各該影 像擷=單元44取得各該測量影像，並對該等測量影像進行分析了 以計算出各該對位孔p分別與對應之該等基準點431㈤的距離， 進而推算出該基板W的變形狀況。在本創作中，該處理單元奶在 分析各該測量影像後，能夠以幾何分析等數學運算方式，計算出 基板W偏斜之纽，以及魏w在長度方向及寬度方 度’並能紀錄基板丨_雜況。 ▲ 藉由本創作之設計，該處理單元45在分析出基板w的變形狀 況後，便能根據變雜況，雌板W予以分類，域由分類結果 控制後續的-分送機構（财未示），使該分送機構能在接收該 达機構42 it來的基板w後，將變雜況相近的基板w各別收集成 群如此，使用者在後續操作曝光顯影機構（圖中未示），以對該 銅箱C進行曝絲影健前，僅鎌據變形狀況，先對曝光圖= M415406 進行一次校正’便能使校正後的曝光圖樣適用在變形狀況相近的 基板W上。 综上所述，復請參閱第6圖所示，本創作是在該透明板體43 鄰近其四邊中央的位置分別設置基準圖樣43〇，以對應於基板w 鄰近四邊中央位置上的各對位孔P，藉由此一技術特徵，縱令基板 W的變形程度較大，各該對位孔p仍不會過份遠離各該基準圖樣 430，和習知的基板相較之下，對位孔p的偏離程度大約只有過去 • 的二分之一，如此，各該影像擷取單元44不需作任何移動，便能 完整地拍攝到各該對位孔p及基準圖樣43〇，完全不需在該等影像 擷取單元44上額外加裝帶動機構，不僅大幅簡化測量裝置4的結 構設計，降低測量裝置4的組裝複雜度，更能節省生產成本。當 使用者完成某一規格基板的測量後，而欲測量其他規格尺寸的基 板時，僅需以手動微調該等影像擷取單元44的位置，即可快速地 凡成大量的測量工作。由此可知，利用本創作之測量裝置4進行 ，量作鱗’ _該縣像齡單元’故補能有效 籲節省測量時間及處理單元45的運算時間，更能大幅提升測量 業效率。 按’以上所述’僅為本創作之較佳實施例，惟本創作之技術 特徵並不侷限於此，在上述較佳實施例中，該升降機構Μ係與該 承載平台40相連接’以推升該承載平台40，但製造廠商亦可改變 此一設計’例如：將一升降機構與該透明板體43相連接，以帶動 該透明板體43下降，使該透體43之底面能抵靠在該基板w 之頂面上，凡任何熟悉本技術領域之人士，在本創作之技術領域 内’可輕易狀的變化或修飾，皆應涵蓋在以下本創作的申請專 M415406 利範圍中。 【圖式簡單說明】 第1圖係習知測量裝置中，玻璃板體的平面示意圖； 第2圖係習知基板之平面示意圖； 第3圖係習知測量裂置中，玻璃板體與基板相疊合之平面示意圖； 第4圖係本創作之較佳實施例之示意圖； 第5圖係本創作之較佳實施例之另一示意圖； 第6圖係本創作之較佳實施例之影像擷取單元、透明板體及基板 之立體示意圖；及 第7圖係本創作之透明板體與基板相疊合之平面示意圖。 【主要元件符號說明】 測量裝置 ............ 4 承載平台 ............ 4〇 升降機構 ............ 41 輸送機構 ............ 42 輸送帶 ............ 420 滾輪 421 基板送入感測器 ............ 422 透明板體 ............ 43 基準圖樣 ............ 430 基準點 431 影像擷取單元 ............ 44 12 M415406 處理單元 基板 絕緣板 銅領 對位孔Broadcast = on the 'Qianshen _ 4 Saki*, in the implementation of the young, the conveyor state t consists of at least - the wheel belt 420 and at least two rollers 421, the wheel rotation of the wheel to drive the wheel belt 420 'The conveyor belt 420 is capable of transporting the substrate W to the position of the load bearing platform 4Q. However, this creation is not limited to this. When manufacturing the measuring device 4 according to the present creation, the manufacturer can also change the design of the conveying mechanism 42 to be easily changed and modified by those in the field of creation. Both should cover the patent application for this creation, and the first Chen Ming. The transport mechanism 42 is disposed at a position corresponding to the load bearing platform 4'', and the transport mechanism 42 is adjacent to one end of the sigh-substrate feed sensor 422. After the transport mechanism 42 transports the substrate to be measured to a position corresponding to the carrying platform 4〇, the substrate feeding sensor 422 can detect that the substrate W has been transported to the manufacturing position, and the sample is sent out. The confirmation signal causes the lifting mechanism 41 to drive the carrying platform 4 to rise. Thus, please refer to the figure No. 40. The receiving table 40 can carry the wire W and drive the wire w to rise. In the preferred embodiment, please refer to FIG. 6 'the substrate w is mainly composed of an insulating plate I and a copper C, which is coated on one side of the insulating plate. The substrate W is respectively provided with a pair of bit holes adjacent to the center of the four sides thereof. Referring to FIG. 4, the transparent plate body 43 is made of glass material, but the creation is not limited thereto. The transparent plate body 43 can also be made of other transparent materials such as polymethylmethacrylate (abbreviated as methyl). The transparent plate body 43 is disposed above the carrying platform 4A. Referring to FIG. 6, the transparent plate body 43 is respectively provided with a 9 M415406-reference pattern 430 adjacent to the center of the four sides thereof, and each of the reference patterns 430 The bottom surface of the substrate W can be pushed up against the bottom surface of the transparent plate body 43 by the plurality of reference points 431 respectively. Referring to FIG. 7, each of the alignment holes p can respectively correspond to each of the reference patterns 43A for subsequent measurement operations. For example, as shown in FIG. 6, each of the image capturing units 44 is a camera, and the manufacturer can select a camera having a USB (Universal Serial Bus) interface as the image capturing unit 44. The image capturing unit 44 is disposed above the transparent plate body 43 and corresponds to the position of each of the reference patterns 43A. Each of the image capturing units 44 is respectively associated with each of the reference patterns 430 and each of the alignments. The hole P is photographed to obtain a measurement image, respectively. Referring to FIGS. 4 and 6, the processing unit 45 is connected to the image capturing unit 44, and each of the measurement images can be obtained from each of the image detection units 44, and the measurement images are analyzed. The distance between each of the alignment holes p and the corresponding reference points 431 (f) is calculated, and the deformation state of the substrate W is further estimated. In the present invention, after analyzing the measurement images, the processing unit milk can calculate the skew of the substrate W and the length and width of the substrate by geometric calculation and geometric calculation, and can record the substrate.丨 _ _. ▲ With the design of the present creation, after analyzing the deformation state of the substrate w, the processing unit 45 can classify the female board W according to the variable condition, and control the subsequent-distributing mechanism by the classification result (financial not shown) After the substrate w is received by the dispensing mechanism, the substrates w having similar densities can be collected into groups. The user subsequently operates the exposure developing mechanism (not shown). Before the copper box C is exposed to the shadow, only the exposure map = M415406 is corrected once according to the deformation condition, so that the corrected exposure pattern can be applied to the substrate W having a similar deformation condition. In summary, as shown in FIG. 6, the present invention is to provide a reference pattern 43 位置 at a position adjacent to the center of the four sides of the transparent plate body 43 to correspond to the alignment positions of the substrate w adjacent to the center of the four sides. The hole P, by means of this technical feature, causes the deformation degree of the substrate W to be large, and the alignment holes p are not excessively distant from the reference patterns 430, compared with the conventional substrate, the alignment holes The degree of deviation of p is only about one-half of the past. Therefore, each of the image capturing units 44 can completely capture the alignment holes p and the reference pattern 43 without any movement. The additional loading mechanism is added to the image capturing unit 44, which not only greatly simplifies the structural design of the measuring device 4, but also reduces the assembly complexity of the measuring device 4 and saves production costs. When the user finishes measuring the substrate of a certain specification and wants to measure the substrate of other specifications, it is only necessary to manually fine-tune the position of the image capturing unit 44, so that a large amount of measurement work can be quickly performed. From this, it can be seen that the measurement device 4 of the present invention performs the measurement of the scale _ _ the county age unit. Therefore, the compensation can effectively save the measurement time and the calculation time of the processing unit 45, and the measurement industry efficiency can be greatly improved. The above description is only a preferred embodiment of the present invention, but the technical features of the present invention are not limited thereto. In the above preferred embodiment, the lifting mechanism is connected to the carrying platform 40. The carrier platform 40 is pushed up, but the manufacturer can also change the design. For example, a lifting mechanism is connected to the transparent plate body 43 to drive the transparent plate body 43 down, so that the bottom surface of the transparent body 43 can be abutted. Relying on the top surface of the substrate w, any person skilled in the art, in the technical field of the present invention, can be easily changed or modified, and should be included in the scope of the application for the following creations M415406. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic plan view of a glass plate body in a conventional measuring device; Fig. 2 is a plan view of a conventional substrate; Fig. 3 is a conventional glass plate body and substrate in a measuring cracking process 4 is a schematic view of a preferred embodiment of the present invention; FIG. 5 is another schematic view of a preferred embodiment of the present invention; FIG. 6 is an image of a preferred embodiment of the present invention A schematic view of the capture unit, the transparent plate body and the substrate; and the seventh figure is a schematic plan view of the transparent plate body and the substrate overlapped. [Explanation of main component symbols] Measuring device............ 4 Carrying platform............ 4〇 Lifting mechanism.............. . 41 Conveying Mechanism............ 42 Conveyor Belt............ 420 Roller 421 Substrate Feeding Sensor.......... .. 422 Transparent board............ 43 Reference pattern............ 430 Reference point 431 Image capture unit......... ... 44 12 M415406 Processing unit substrate insulation plate copper collar alignment hole