TWI492792B - Substrate manufacturing method and substrate manufacturing apparatus - Google Patents

Description

Substrate manufacturing method and substrate manufacturing apparatus

The present invention relates to a substrate manufacturing method and a substrate manufacturing apparatus in which a film having a defined planar shape is formed on a substrate.

A technique is known in which a droplet containing a film material is discharged from a nozzle head to form a film on the surface of the substrate (for example, Patent Document 1).

In the above film forming technique, for example, a printed substrate is used for the substrate, and a solder mask is used for the film material. The printed circuit board includes a substrate and wiring, and electronic parts and the like are soldered at predetermined positions. The solder mask exposes a portion of the conductor that is soldered to the electronic component or the like, covering the portion that does not need to be soldered. After the solder mask is applied to the entire surface, the manufacturing cost can be reduced as compared with the method of forming the opening using photolithography.

(previous technical literature) (Patent Literature)

Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-104104

The deformation occurs on the printed substrate due to heat treatment or the like performed in the substrate manufacturing stage. It is preferable to correct the pattern of the film formed on the surface thereof in accordance with the deformation occurring on the substrate. In general, the pattern of the solder mask is obtained from image data in the Gerber format. When a thin film material droplet is ejected from the nozzle tip to form a thin film, image data in a raster format is generated from the image data of the Geber format which defines the pattern of the thin film. The control of the nozzle head is performed based on the image data of the raster format.

After the substrate is carried into the thin film forming apparatus and before the film formation, the positioning marks on the substrate are detected, thereby aligning the substrates. The amount of deformation of the substrate is calculated from a plurality of positioning mark positions. Correcting the image data of the Gabriel format or the image data of the raster format according to the calculated deformation.

As an example, the 2400 dpi image data defining a pattern in a square area having a side length of 500 mm is composed of approximately 2.23 billion pixels. The image data in the raster format is 2-dimensional continuous data, so when the value of one pixel is changed, the influence of changing almost all other pixels is generated. Even when 1 bit of data is allocated to 1 pixel, the size of the image data becomes about 266 MB. Therefore, it takes a long time to perform image data correction processing. The time taken up by the film forming apparatus is prolonged due to the correction processing of the image data.

Before the substrate is carried into the thin film forming apparatus, the amount of deformation of the substrate is measured, and the image data is corrected, whereby the time taken by the thin film forming apparatus due to the correction processing of the image data can be shortened. However, in this method, in addition to the detecting device equipped with the positioning mark of the film forming device, It is necessary to provide another positioning mark detecting device for measuring the amount of deformation. Therefore, the cost of the entire device is increased.

An object of the present invention is to provide a substrate manufacturing method and a substrate manufacturing apparatus capable of suppressing the time consuming and cost increase of the apparatus due to the correction processing of image data, and forming a thin film in consideration of deformation of the substrate.

According to an aspect of the present invention, a substrate manufacturing method includes: a process for preparing a compressed material, wherein the compressed data is obtained by compressing image data of a raster format defining a shape of a film to be formed on a substrate; a process of deforming the amount of the substrate in the in-plane direction; and generating distortion correction by performing pixel insertion or removal processing on the compressed data in a compressed format state according to the measured deformation amount The process of the data; and the process of forming a thin film on the substrate according to the deformation modification data described above.

According to another aspect of the present invention, a substrate manufacturing apparatus includes: a stage for holding a substrate; and a nozzle unit provided with a plurality of nozzle holes for discharging a film material droplet toward a substrate held on the stage; The moving mechanism moves one of the stage and the nozzle unit relative to the other; the position detecting device detects a position of the mark formed on the substrate held by the stage; and a control device controls The moving mechanism and the nozzle unit; the control device performs control for compressing compressed data obtained by compressing image data of a raster format defining a shape of a film to be formed on the substrate, according to the position detecting device Calculating a deformation amount in a plane direction of the substrate by detecting a position of the mark, and generating a distortion correction by performing insertion or removal processing of the pixel on the compressed data in a compressed format state based on the calculated deformation amount According to the deformation correction data, the film is formed on the substrate by controlling the moving mechanism and the nozzle unit.

The processing time can be shortened by performing pixel insertion or removal processing in a compressed format state on the compressed material defining the thin film pattern.

20‧‧‧ tablet

21‧‧‧Mobile agencies

22‧‧‧stage

24‧‧‧Support members

27‧‧‧Substrate

28‧‧‧Photographing device

29‧‧‧ Positioning Mark

30‧‧‧Nozzle unit

31‧‧‧Nozzle unit support mechanism

32‧‧‧Printed circuit board

33‧‧‧film

34‧‧‧Nozzle head

35‧‧‧Nozzle fixture

36‧‧‧Solution light source

37‧‧‧Nozzle hole

38‧‧‧Nozzle surface

39‧‧‧ openings

40, 41‧‧‧corrected unit area

42‧‧‧Image data in raster format

43‧‧‧ pixels

43a‧‧‧Pixed pixels

43v‧‧‧Removal of pixels

43L‧‧‧ pixels at the left end of the pixel row

45‧‧‧x direction compression data

46‧‧‧Y direction compression data

50‧‧‧The pattern defined by the x-direction compressed data without the deformation correction processing Shape

51‧‧‧The shape of the deformed substrate

52‧‧‧Re-establishing the shape of the pattern of the correction unit area

53‧‧‧The shape of the pattern defined by the x-direction deformation correction data

54‧‧‧Insert "W" pixel area

55‧‧‧Path area

56‧‧‧Compressing the shape of the pattern defined by the data in the y direction

57‧‧‧Re-establishing the shape of the pattern of the correction unit area

58‧‧‧Insert "W" pixel area

59‧‧‧ Shape of the corrected unit area

60, 61‧‧‧ areas

70‧‧‧Control device

71‧‧‧ Input device

72‧‧‧ Output device

80‧‧‧ posture adjustment mechanism

Fig. 1 is a schematic view showing a substrate manufacturing apparatus according to Embodiment 1.

Fig. 2 is a perspective view of the nozzle unit.

In Fig. 3, Fig. 3A shows the substrate and nozzle unit without deformation. FIG. 3 is a plan view showing an example of a thin film pattern formed on one printed circuit board.

Figure 4 is a plan view of a substrate on which deformation has occurred.

Fig. 5 is a flow chart showing a method of manufacturing a substrate according to Embodiment 1.

In Fig. 6, Fig. 6A is a line diagram showing an example of a part of image data in a raster format. Fig. 6B is a diagram showing a format of compressed data in the x direction obtained by compressing image data of a raster format in the x direction.

In Fig. 7, Fig. 7A is a simplified diagram showing the outer shape of the pattern defined by the x-direction compressed data in which the distortion correction processing is not performed and the outer shape of the deformed substrate, and Fig. 7B is a simplified representation together. The outer shape of the substrate when the deformation is not performed in the y direction and is deformed only in the one-dimensional direction parallel to the x direction, and the outer shape of the pattern defined by the x-direction compression data without performing the distortion correction processing.

In Fig. 8, Fig. 8A is a line diagram showing the outlines of pixels in one correction unit area and the correction unit area in which deformation has occurred, and Fig. 8B shows the pixel distribution after insertion and removal of pixels. A line drawing of the shape of the unit area where the distortion is corrected.

In Fig. 9, Fig. 9A and Fig. 9B are diagrams showing image data and compressed data of local positioning marks of one pixel row.

Fig. 10 is a diagram showing image data and compressed data of local positioning marks of one pixel row.

In Fig. 11, Fig. 11A is a line diagram showing the respective shapes of the correction unit area defined by the x-direction compressed data after the correction in the x direction, and Fig. 11B is shown in the correction unit area. Pixel A line graph of the shape of the pattern of the plurality of correction unit areas is re-established in the same pixel row connection in the row.

In Fig. 12, Fig. 12A is a line diagram showing the outer shape of the pattern defined by the x-direction deformation correction data and the outer shape of the deformed substrate, and Fig. 12B shows the definition of the distortion correction data by the x-direction by the path region. A line drawing of the outline of the pattern after the outline of the pattern extends in the y direction.

In Fig. 13, Fig. 13 and Fig. 13B are diagrams showing the format of the x-direction compressed material used in the first modification of the first embodiment.

In Fig. 14, Fig. 14A and Fig. 14B are line diagrams showing the arrangement of pixels before and after the pixel is added by the method according to the first embodiment, and Figs. 14C and 14D show the implementation according to Fig. 14 The method of the second modification of the first embodiment adds a line diagram of the arrangement of pixels before and after the pixel.

In Fig. 15, Fig. 15A is a line diagram showing the outer shape of the pattern defined by the x-direction deformation correction data together with the outer shape of the deformed substrate, and Fig. 15B is assuming that the substrate is not produced on the substrate. A line diagram of the outer shape of the substrate when the deformation in the x direction is deformed in the one-dimensional direction parallel to the y direction, and the outer shape of the pattern defined by the x-direction deformation correction data.

Fig. 16 is a diagram showing an example of compressed data in the y direction.

Fig. 17 is a line diagram showing the outline of a pattern defined by the xy-direction deformation correction data obtained by performing pixel insertion and removal processing on the y-direction compressed material.

Fig. 18 is a plan view showing a stage and a nozzle unit of the substrate manufacturing apparatus according to the third embodiment.

[Example 1]

A schematic view of a substrate manufacturing apparatus according to Embodiment 1 is shown in Fig. 1. The stage 22 is supported by the moving mechanism 21 on the flat plate 20. A substrate 27 such as a printed board is held on the upper surface (holding surface) of the stage 22 . The direction parallel to the holding surface of the stage 22 is defined as the x-direction and the y-direction, and the xyz rectangular coordinate system in which the normal direction of the holding surface is the z direction is defined. The moving mechanism 21 moves the stage 22 in the x direction and the y direction.

The nozzle unit 30 and the imaging device 28 are supported by the support member 24 above the flat plate 20. The nozzle unit 30 is supported on the support member 24 so as to be movable up and down via the nozzle unit support mechanism 31. The nozzle unit 30 and the imaging device 28 face the substrate 27 held on the stage 22. The imaging device 28 images a wiring pattern, a positioning mark, a thin film pattern formed on the substrate 27, and the like formed on the surface of the substrate 27. The image data obtained by the shooting is input to the control device 70. The nozzle unit 30 discharges a photocurable (for example, ultraviolet curable) film material droplet (for example, a droplet of a solder mask or the like) from the plurality of nozzle holes toward the substrate 27. The discharged film material adheres to the surface of the substrate 27.

The control device 70 controls the moving mechanism 21, the nozzle unit 30, and the imaging device 28. In the control device 70, image data of a raster format defining a shape of a thin film pattern to be formed on the substrate 27 or image data (compressed data) to be compressed is stored. The operator inputs various commands and controls to the control device 70 through the input device 71. The numerical data required for the system. The control device 70 outputs various information to the operator from the output device 72.

Fig. 2 is a perspective view showing the nozzle unit 30 (first drawing). A plurality of, for example, four nozzle heads 34 are arranged in the y direction on the nozzle jig 35. A plurality of nozzle holes 37 are opened in the nozzle face 38 of each nozzle head 34 facing the stage 22 (Fig. 1). A plurality of nozzle holes 37 are arranged in two rows in the x direction. The plurality of nozzle holes 37 of the four nozzle heads 34 are disposed at different positions in the x direction, and are distributed at equal intervals in the x direction as a whole.

A curing light source 36 is attached to each of the nozzle heads 34 and the outside of the nozzle heads 34 at both ends. The curing light source 36 irradiates the substrate 27 (first drawing) with curing light such as ultraviolet light.

In Fig. 3A, a plan view of the substrate 27 and the nozzle unit 30 which have not been deformed is shown. A plurality of printed circuit boards 32 are disposed on one substrate 27. The substrate 27 is a so-called puzzle. In Fig. 3A, the eight printed circuit boards 32 are arranged in a matrix of four rows and two columns. A plurality of positioning marks 29 are formed on the substrate 27. In the third drawing A, an example in which the positioning marks 29 are disposed at substantially the center of the four corners and four sides of the substrate 27 and substantially at the center of the substrate 27 is shown.

A plurality of nozzle holes 37 are provided in the nozzle unit 30. A plurality of nozzle holes 37 are distributed at equal intervals in the x direction. Although the nozzle holes 37 are arranged in a line in a simplified manner in Fig. 3A, actually, as shown in Fig. 2, the nozzle holes 37 are formed in a plurality of rows.

A film formed on one printed circuit board 32 is shown in FIG. 3B. An example of the pattern of 33. A film 33 of a solder mask is formed in the hatched area of FIG. A plurality of openings 39 are distributed in the film 33. The opening 39 is disposed corresponding to a portion where the electronic component is mounted and a portion where the through hole is formed.

Next, a method of forming a film will be described. While moving the substrate 27 in the y direction, the film material droplets are ejected from the nozzle holes 37 in accordance with the image data defining the planar shape of the film to be formed. This action is called "scanning." The film material droplets ejected from the nozzle holes 37 are bounced onto the substrate 27. The film material that has been bounced onto the substrate 27 is irradiated with curing light from the curing light source 36 (Fig. 2). Thereby, at least the surface layer portion of the film material is cured. In the single scanning, the film 33 can be formed in the range in which the nozzle holes 37 are distributed in the x direction. The film 33 is formed by changing the relative position of the substrate 27 and the nozzle unit 30 in the x direction, so that the film 33 can be formed in almost the entire surface of the substrate 27.

Fig. 4 is a plan view showing the substrate 27 on which deformation has occurred. According to the deformation of the substrate 27, the relative positions of the plurality of positioning marks 29 are changed. By detecting the position of the positioning mark 29, the amount of deformation of the substrate 27 in the x direction and the y direction can be calculated. For example, in the x direction and the y direction, the amount of deformation can be approximately linearly changed between the two positioning marks 29. When the entire surface of the substrate 27 is uniformly deformed, the positioning marks 29 may be disposed only at the four corners of the substrate 27. By increasing the number of positioning marks 29, complex deformation can be detected.

The surface of the substrate 27 is divided into a plurality of correction unit regions 40. In Fig. 4, the correction unit area 40 is arranged in a matrix of 4 rows and 4 columns. example. The correction of the image data is performed in accordance with the correction unit area 40 in accordance with the deformation of the substrate 27.

A flowchart of a substrate manufacturing method according to Embodiment 1 is shown in FIG. In step SA1, image data in a raster format defining the planar shape of the film to be formed is compressed to prepare compressed data. This compressed data is generated, for example, by a higher-level processing device of the control device 70 (Fig. 1). The generated compressed data is input to the control device 70.

An example of a part of the image data 42 of the raster format is shown in Fig. 6A. The image data 42 of the raster format is composed of a plurality of pixels 43 arranged in the x direction and the y direction. One of the values of "W" and "B" is assigned to each pixel 43. "B" and "W" respectively indicate pixels that cause the film material to be dropped, and pixels that are not bombed. The vicinity of the area where the opening 39 having a substantially circular shape is formed is shown in Fig. 6A.

Fig. 6B shows an x-direction compressed material 45 obtained by compressing the image data 42 of the raster format shown in Fig. 6 in the x direction. The data sequence of the image data 42 of the raster format, which is composed of pixels continuous in the x direction, is compressed and marked with a plurality of elements. Each element includes an identification code for distinguishing the values "W" and "B" of the pixel 43, and a numerical value indicating the number of consecutive pixels of the value to which the identification symbol is assigned.

In step SA2 (Fig. 5), the substrate 27 on which the thin film is to be formed is held on the stage 22 (Fig. 1). In step SA3, the positioning mark 29 (Fig. 4) of the substrate 27 is imaged by the imaging device 28 (Fig. 1). The captured image data is input to the control device 70. In step SA4 (Fig. 5), the control device 70 passes the image of the positioning mark 29 The analysis is performed to calculate the position of the positioning mark position 29. The imaging device 28 functions as a position detecting device that detects the position of the positioning mark 29.

In step SA5, the amount of deformation of the substrate 27 in the x direction and the y direction is calculated based on the calculated position of the positioning mark 29. In step SA6, the process of inserting pixels or removing pixels is performed on the x-direction compressed material 45 (Fig. 6B), thereby generating distortion correction data. The processing of step SA6 will be described with reference to Figs. 7A to 11B.

The outline of the pattern defined by the x-direction compressed material 45 (Fig. 6B) in which the distortion correction processing is not performed, and the outer shape 51 of the deformed substrate 27 are simplified in a line diagram in Fig. 7A. In Fig. 7A, the exaggeration indicates the deformation. The outer shape 50 of the pattern before the deformation correction is expressed, for example, by a rectangle having sides parallel to the x direction and the y direction. The outer shape 51 of the substrate 27 is deformed in the x direction and the y direction. The inside of the outer shape 50 of the pattern before the distortion correction is divided into a plurality of correction unit regions 40. The correction unit area 40 is arranged in an array of, for example, four rows from the first row to the fourth row and four columns from the A column to the D column. The identification code A to D of the column and the line number are arranged to specify one correction unit area 40. For example, the correction unit area 40 of the third row of the B column is marked as "B3".

As shown in Fig. 7B, it is assumed that deformation does not occur in the y direction and only in the one-dimensional direction parallel to the x direction. The outer shape 51 of the deformed substrate is composed of two edge portions parallel to the x direction and an edge portion extending in the y direction to which the end portions of the edge portions are connected to each other. The edge portion parallel to the x direction and the outer shape 50 of the pattern before the deformation correction are parallel to the x direction The edges are coincident. The outer shape 59 of each correction unit area 40 also includes two edges parallel to the x direction.

Fig. 8A shows the outline 43 of the pixel 43 in one correction unit area 40 and the corrected unit area 40 in which deformation has occurred. In one correction unit area 40, the number of pixels 43 arranged in the x direction is N. The outer shape 59 of the corrected unit area 40 in which deformation has occurred is represented by a trapezoid having a bottom and a lower bottom parallel to the x direction.

The amount of deformation in the x direction of each row of the pixels 43 is calculated from the amount of deformation in the x direction at the position of the upper base of the outer shape 59 and the amount of deformation in the x direction at the position of the lower base. As an example, between the upper bottom and the lower bottom, the amount of deformation changes approximately linearly in the y direction. In Fig. 8A, an example in which the upper base is compressed to a length corresponding to (N-2) pixels and the lower base is extended to correspond to the length of (N + 3) pixels is shown as an example.

The insertion or removal of the pixels is performed in a pixel row constituted by the pixels 43 arranged in the x direction so as to approach the size of the deformed outer shape 59. Specifically, the correction unit area 40 is equally divided into n in the height direction. Here, "n" is equal to the value of the number of pixels plus one, wherein the number of the aforementioned pixels corresponds to the difference between the length of the upper base and the length of the lower base. In the example shown in Fig. 8A, n=6. The number of pixels inserted or removed is determined by the area where n is equally divided. In the lowermost area, 3 pixels are inserted in the pixel row. In the uppermost area, 2 pixels are removed in pixel rows.

The pixel distribution after the insertion and removal of the pixel and the outline 59 of the corrected unit area 40 in which the distortion has occurred are shown in FIG. A pixel in which the pixel 43a is inserted and the area 43v is removed. About each pixel row, the insertion of pixels The entry site and the removal site are equally dispersed in the x direction. The row of pixels in which the pixel 43a is inserted extends in the x direction, and the row of pixels from which the pixel is removed is reduced in the x direction. Thereby, the outer shape of the region in which the pixels are distributed is close to the outer shape 59 of the corrected unit region 40 in which the distortion has occurred.

Referring to Fig. 9A, a process of inserting pixels on a pixel row will be described. In Fig. 9A, image data and compressed data of local positioning marks of one pixel row are shown. Five "B" pixels, four "W" pixels, seven "B" pixels, and six "W" pixels are sequentially connected in the x direction. The compressed data of this pixel row is labeled "B5W4B7W6".

A case where the pixel 43a is inserted between the 13th pixel 43 and the 14th pixel 43 on the left side will be described. The value of the pixel 43 on both sides of the position where the pixel 43a is inserted is "B", so the value of the inserted pixel 43a is also set to "B". The 13th and 14th pixels 43 from the left are included in the continuous 7 pixels 43 indicated by the compressed material "B7". In the compressed data, only the element "B7" is corrected to "B8" and the pixel is inserted.

As shown in FIG. 9B, the value of one of the pixels 43 on both sides of the position where the pixel 43a is inserted (between the left 16th pixel 43 and the 17th pixel 43) is "B", and the other is When the value is "W", the value of the inserted pixel 43a can be set to any of "B" and "W". At this time, the addition of the pixel 43a is performed by correcting the element "B7" of the compressed material to "B8" or the element "W6" to "W7".

Referring to Fig. 10, a process of removing pixels from a pixel row will be described. Fig. 10 shows image data and compressed data of local positioning marks of one pixel row. Said to remove the example of the 13th pixel from the left 43 Bright. The 13th pixel from the left is one of the 7 consecutive "B" pixels indicated by "B7" in the compressed material. In order to remove the 13th pixel 43 from the left, the element "B7" of the compressed material is corrected to "B6".

As described above, it is possible to perform pixel insertion and removal processing in a simple order in a compressed format state without expanding the x-direction compressed material 45 (Fig. 6B).

FIG. 11A shows the respective outer shapes of the correction unit area 40 defined by the x-direction compressed material 45 (FIG. 9, FIG. 9B, FIG. 10) after the correction in the x direction. When the position of the pixel 43 at the left end of the pixel row is fixed, the outer shape of the correction unit region 40 becomes a trapezoid whose left side is parallel to the y-axis.

As shown in Fig. 11B, a plurality of correction unit regions 40 are newly created so that the same pixel row is continuous in the pixel row of the correction unit region 40. At the time of re-establishment, the position of the left end pixel 43L of the leftmost (A column) correction unit area 40 coincides with the left side of the outer shape 51 of the deformed substrate 27 shown in Fig. 7B. The outline 52 of the pattern obtained by re-establishing the corrected unit area 40 defined by the compressed data defined by the deformation in the x direction includes two sides parallel to the x direction and ends of the two sides along the y One of the directions is connected to the edge. In general, the shape 52 of the re-established pattern extends in the y direction, one pair of edges are not parallel to the y-axis, and are not one straight line.

A rectangle defining the shape 52 of the recreated pattern is defined. The pair of sides of the rectangle coincide with the edge of the outer shape 52 of the re-established pattern that is parallel to the x-direction. In the inner area of the rectangle, in A "W" pixel is inserted in a region 54 closer to the outside than the outer shape 52 of the re-established pattern. In order to insert a pixel into the "W" in the area 54, in the compressed data (the compressed data defined for the outer shape 52) after the re-establishment, the element "Bi" (i is a natural number) is added to the left and right ends of each pixel row. can. The image data in which the "W" pixel is inserted is referred to as "x-direction deformation correction data". The outer shape 53 of the pattern defined by the x-direction deformation correction data is a rectangle.

In step SA7 (Fig. 5), the discharge timing (discharge frequency) of the film material droplet from the nozzle hole 37 (Fig. 2) or the substrate 27 (Fig. 1) is oriented in the y direction based on the amount of deformation in the y direction ( The moving speed of the scanning direction). The processing of step SA7 will be described with reference to Fig. 12A and Fig. 12B.

In Fig. 12A, the outer shape 53 of the pattern defined by the x-direction deformation correction data and the outer shape 51 of the deformed substrate are shown. The pixel 43 is shown inside the outer shape 53 of the pattern defined by the deformation correction data in the x direction. The pitch of the pixel 43 defined by the x-direction correction data is equal to the pitch of the y direction.

The inside of the outer shape 53 of the pattern defined by the x-direction correction data is divided into a plurality of path regions 55 in the x direction. The dimension of each of the path regions 55 in the x direction is set to be equal to or less than the width of the region in which the film material is adhered by the primary scanning of the nozzle unit 30 in the x direction.

As shown in FIG. 12B, in the path region 55, the outer shape 53 of the pattern defined by the x-direction deformation correction data is expanded and contracted in the y direction, so that the size of the path region 55 in the y direction is set to be larger than that of the substrate which has been deformed. outer The size of the corresponding region of the shape 51 in the y direction is large. When the path region 55 is expanded and contracted in the y direction, the pitch of the pixel 43 in the path region 55 in the y direction changes. The pitch of the pixels 43 in the y direction corresponds to the scanning speed when the nozzle unit 30 is scanned in the y direction or the frequency (timing) at which the film material droplets are ejected from the nozzle holes 37. In each of the path regions 55, the timing of discharge of the thin film material droplets from the nozzle holes 37 and the movement in the y direction (scanning direction) toward the substrate 27 (first drawing) can be determined by the pitch of the pixels in the y direction after expansion and contraction. speed. One of the fixed discharge timing and the moving speed may be set to adjust one of the discharge timing and the moving speed.

In step SA8 (Fig. 5), based on the x-direction deformation correction data generated in step SA6, the film is ejected under the condition that the discharge timing or the substrate 27 (Fig. 1) in step SA7 moves in the y direction. Formation.

[Modification 1 of Embodiment 1]

Referring to FIGS. 13A and 13B, the following sequence will be described, that is, the form of the x-direction compressed material 45 and the x-direction compressed material 45 applied in the substrate manufacturing method according to the first modification of the first embodiment. The order in which pixels are inserted or removed. As shown in FIG. 6B, the identification symbol by "W" or "B" in the x-direction compressed data 45 used in Embodiment 1 and the pixel taking the value of the identification symbol are continuous in the x direction. The number of times constitutes one element.

The x used in the modification 1 of the first embodiment is shown in Fig. 13A. The direction compresses the format of the data 45. The pixel columns are arranged in the x direction, and the pixel columns are sequentially appended with serial numbers #1, #2, #3, ... from the left end. In the first modification of the first embodiment, each element of the x-direction compressed material 45 includes an identification code of "W" or "B" and a serial number of the pixel. The sequence number of the pixel 43 indicates the pixel 43 at the left end and the right end of the consecutive pixels taking the value of the identification symbol. For example, "B1-5" means that the value of five pixels assigned from the serial numbers #1 to #5 is "B".

The process of inserting the pixel 43a between the pixel 43 of the serial number #13 and the pixel 43 of the serial number #14 is shown in Fig. 13B. The element "B10-16" of the compressed material includes the pixels 43 of the serial numbers #13 and #14. When the pixel 43a is inserted, "B10-16" may be rewritten as "B10-17". At this time, since the serial number of the pixel 43 on the right side of the serial number #14 is sequentially decreased, the serial number included in each element in the compressed data 45 in the x direction is also sequentially decreased. For example, the element "W17-22" is rewritten as "W18-23". When the pixel 43 is removed, each of the elements having a serial number larger than the serial number of the removed pixel 43 may be sequentially increased.

In either of the first embodiment and the first modification, attention is paid to the compression of the pixel data by the continuous pixels 43 having the same value set in the pixels 43 arranged in the x direction. In the compressed image data (compressed data), the number of consecutive pixels of the same value or the positions of the left and right ends of the continuous portion of the pixels of the same value are defined.

In the first embodiment and the first modification, the compressed data defining the planar shape of the film is corrected based on the amount of deformation in the x direction of the substrate 27 (fourth drawing). In addition, according to the deformation of the substrate 27 (Fig. 4) in the y direction The amount is determined to determine the ejection timing of the droplets of the film material or the moving speed of the substrate 27. As a result, when the substrate 27 is deformed in the x direction and the y direction, the planar shape of the formed thin film can be integrated with the conductive pattern of the deformed substrate 27. Thereby, in the substrate manufacturing method according to the first embodiment and the modification 1, the influence of the substrate deformation can be alleviated.

Further, in the first embodiment and the first modification, as shown in FIG. 9A, FIG. 9B, and FIG. 10, in order to alleviate the influence of the deformation of the substrate 27 (fourth diagram) in the x direction, it is not necessary to expand. The compressed data compressed by the data columns consisting of consecutive pixels in the x direction is subjected to pixel insertion and removal in a compressed state. In order to alleviate the influence of the deformation in the y direction, it is not necessary to perform pixel insertion and removal processing on the compressed data. Therefore, the processing time for mitigating the influence of the deformation can be shortened compared to when the image data of the Gabor format or the image data of the raster format before compression is subjected to pixel insertion and removal processing.

[Modification 2 of Embodiment 1]

A modification 2 of the first embodiment will be described with reference to FIGS. 14A to 14D. In the first embodiment, as shown in Fig. 8B, the pixels 43a inserted in one correction unit area 40 are equally dispersed in the x direction.

As shown in Fig. 14A, a study was conducted on the opening 39 containing a square in the film to be formed. It is assumed that the boundary line when the correction unit region 40 (Fig. 8A) is n-divided in the y direction passes through the inside of the opening 39, and the amount of deformation in the x direction of the region 60 above the boundary line is The amount of deformation in the x direction of the lower region 61 is small. When the positions of the inserted pixels are equally distributed in the x direction, for example, the position of the arrow of FIG. 14A is selected as the insertion portion. In the upper region 60, the portion where the pixel is inserted coincides with the opening 39, and in the region 61 below, the portion where the pixel is inserted is deviated from the opening 39.

The configuration of the pixel defined by the compressed data in the x direction after the pixel is inserted is shown in FIG. 14B. In the upper region 60, the size of the opening 39 in the x direction is increased, and in the lower region 61, the size of the opening 39 in the x direction is unchanged. Therefore, the planar shape of the opening 39 as a square is aliased from the square. Further, in the region 61 where the amount of deformation is relatively large, the opening 39 is not deformed, and in the region 60 where the amount of deformation is relatively small, the opening 39 is extended in the x direction.

As shown in Fig. 14C, in the method according to the second modification of the first embodiment, when the portion where the pixel is inserted overlaps the opening 39, the portion where the pixel is inserted is shifted to the edge of the opening 39.

The configuration of the pixel defined by the x-direction compressed material after the pixel is inserted according to the method of the second modification of the first embodiment is shown in FIG. 14D. In either of the upper region 60 and the lower region 61, the size of the opening 39 in the x direction does not change. Therefore, the shape of the opening 39 can be prevented from being aliased.

[Embodiment 2]

The substrate manufacturing method according to the second embodiment will be described with reference to Figs. 15A to 17th. Hereinafter, the difference from the first embodiment will be described. The description of the same structure is omitted. The processes from step SA1 to step SA6 shown in Fig. 5 are used in the same manner in the first embodiment and the second embodiment.

Fig. 15A together shows the outer shape 53 of the pattern defined by the x-direction deformation correction data generated in step SA6 (Fig. 5) and the outer shape 51 of the deformed substrate. The outer shape 53 is the same as the outer shape 53 of the pattern defined by the x-direction deformation correction data obtained in the method of the first embodiment shown in Fig. 11B.

As shown in Fig. 15B, it is assumed that deformation in the x direction does not occur in the substrate 27 (Fig. 4), and deformation occurs only in the one-dimensional direction parallel to the y direction. The edge portion of the outer shape 51 of the deformed substrate extending in the y direction is a straight line parallel to the y axis. In the x-direction distortion correction data, as shown in FIG. 9A, FIG. 9B, and FIG. 10, the data column composed of pixels continuous in the x direction is compressed. The x-direction deformation correction data is converted into a y-direction compressed material that is compressed with respect to a data sequence composed of pixels continuous in the y direction.

Fig. 16 shows an example of a data sequence composed of pixels 43 continuous in the y direction and compressed y-direction compressed data 46. Each element of the y-direction compressed material 46 includes an identification code for distinguishing the values "W" and "B" of the pixel 43 and a value indicating the number of times the pixel 43 to which the value of the identification symbol is assigned is continuous in the y direction.

As shown in Fig. 15B, the outer shape 56 of the pattern defined by the compressed data 46 (Fig. 16) in the y direction is the same as the outer shape 53 of the pattern defined by the x-direction deformation correction data. The area within the outline 56 of the pattern defined by the compressed data 46 in the y direction is re-divided into a plurality of correction unit areas. 41.

As shown in Fig. 17, in the correction unit area 41, the pixel insertion and removal processing is performed on the y-direction compressed material 46 (Fig. 16B) based on the amount of deformation in the y direction. This processing is the same as the insertion and removal processing of the pixel with respect to the x-direction compressed material 45 shown in FIGS. 8A and 8B of the first embodiment. As shown in FIG. 11 and FIG. 11B of the first embodiment, the correction unit area 41 for performing pixel insertion and removal is newly established. The edge portion extending in the x direction along the outer shape 57 of the pattern in which the correction unit area 41 is newly established cannot be a straight line parallel to the x-axis.

A "W" pixel is inserted in a region 58 outside the edge portion of the reshaped pattern 57 that extends in the x direction. The outer shape of the region where the outer shape 57 and the region 58 of the re-established pattern are combined is a rectangle. The xy direction deformation correction data is obtained by inserting a "W" pixel in the area 58.

The film is formed on the deformed substrate 27 (Fig. 4) based on the xy direction deformation correction data. In the second embodiment, the same distortion correction processing as in the x direction is performed in the y direction. Also in the second embodiment, the processing time required to alleviate the influence of the deformation of the substrate 27 (Fig. 4) can be shortened in the same manner as in the first embodiment.

[Example 3]

Fig. 18 is a plan view showing the stage 22 and the nozzle unit 30 of the substrate manufacturing apparatus according to the third embodiment. The differences from the first embodiment will be described below, and the description of the same configurations will be omitted. The substrate manufacturing apparatus according to Embodiment 3 has an adjustment to the posture of the nozzle unit 30 so that The posture adjustment mechanism 80 in which the arrangement direction of the nozzle holes 37 is changed. When the arrangement direction of the nozzle holes 37 is inclined with respect to the x direction, the component of the x-direction of the pitch of the nozzle holes 37 changes. A substrate 27 is held above the stage 22 .

The control device 70 changes the posture of the nozzle unit 30 so that the arrangement direction of the nozzle holes 37 is inclined with respect to the x direction in accordance with the amount of deformation of the substrate 27 in the x direction. By this posture change, the x component of the pitch of the nozzle holes 37 is changed in accordance with the amount of deformation. As a result, the influence of the deformation of the substrate 27 in the x direction can be alleviated.

The present invention has been described based on the above embodiments, but the present invention is not limited thereto, and it is obvious to those skilled in the art that various changes, improvements, combinations, and the like can be made, for example.

Claims (8)

A substrate manufacturing method comprising: a process for preparing a compressed data, wherein the compressed data is obtained by compressing image data of a raster format defining a shape of a film to be formed on a substrate; and determining a planar direction of the substrate ( a process of deforming the amount of the in-plane direction; generating a process of deforming the correction data by performing insertion or removal processing of the pixel in the compressed format state according to the measured deformation amount; and according to the foregoing The deformation correction data is a process for forming a thin film on the substrate. The method of manufacturing a substrate according to claim 1, wherein the process of forming the film comprises: forming a nozzle unit having a plurality of nozzle holes in a posture in which the nozzle holes are arranged in the first direction, and facing the substrate; and a process of forming the film by intermittently discharging the film material droplets while the one of the substrate and the nozzle unit moves in the second direction intersecting the first direction with respect to the other direction; the compressed material is The first direction is first compressed; and in the process of generating the distortion correction data, pixel insertion or removal processing is performed on the compressed material based on the amount of deformation of the substrate in the first direction. The substrate manufacturing method of claim 2, wherein Further, a process of determining a moving speed of moving one of the nozzle unit and the substrate in the second direction relative to the other of the nozzle unit and the substrate from the nozzle hole according to a deformation amount of the substrate in the second direction At least one of the discharge timing of the thin film material droplets; in the process of forming the thin film, the movement speed or the discharge timing determined in the process of determining at least one of the moving speed and the discharge timing is formed film. The substrate manufacturing method according to claim 2 or 3, wherein, after the process of measuring the amount of deformation and before the process of forming the film, the direction of arrangement of the nozzle holes is included according to the amount of deformation in the first direction The process of changing the posture of the nozzle unit in a manner inclined with respect to the first direction. A substrate manufacturing apparatus comprising: a stage for holding a substrate; and a nozzle unit provided with a plurality of nozzle holes for discharging a film material droplet toward a substrate held on the stage; and a moving mechanism for the stage And one of the nozzle units moves relative to the other; the position detecting device detects a position of the mark formed on the substrate held by the stage; and the control device controls the moving mechanism and the nozzle unit; The control device performs control for compressing compressed data obtained by compressing image data of a raster format defining a shape of a film to be formed on the substrate, Calculating a deformation amount in a plane direction of the substrate based on a position of the mark detected by the position detecting device, and performing pixel insertion in a compressed format state by the compressed data according to the calculated deformation amount The removal processing generates distortion correction data, and the film is formed on the substrate by controlling the movement mechanism and the nozzle unit based on the deformation correction data. The substrate manufacturing apparatus according to claim 5, wherein the nozzle holes are arranged in a first direction; the compressed material is compressed in the first direction; and the control device performs control such that the substrate is in the first direction The deformation amount is generated by inserting or removing a pixel into the compressed data to generate the deformation correction data, and one of the substrate and the nozzle unit is crossed with respect to the other along the first direction. The film is moved in a direction, and the film material droplets are intermittently discharged from the nozzle holes to form the film. The substrate manufacturing apparatus according to claim 6, wherein the control device further controls to control one of the nozzle unit and the substrate to be opposed to another one based on a deformation amount of the substrate in the second direction At least one of a moving speed of one of the moving directions in the second direction and a discharge timing of the film material droplets from the nozzle hole is determined by the moving speed or the timing of the discharge. Or the aforementioned nozzle unit is controlled to form the aforementioned film. The substrate manufacturing apparatus according to claim 6 or 7, further comprising: a posture adjustment mechanism that adjusts a posture of the nozzle unit to change an arrangement direction of the nozzle holes; and the control device is based on the first direction of the substrate The amount of deformation in the upper portion changes the posture of the nozzle unit such that the arrangement direction of the nozzle holes is inclined with respect to the first direction.