TWI492792B - Substrate manufacturing method and substrate manufacturing apparatus - Google Patents
Substrate manufacturing method and substrate manufacturing apparatus Download PDFInfo
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- TWI492792B TWI492792B TW102126455A TW102126455A TWI492792B TW I492792 B TWI492792 B TW I492792B TW 102126455 A TW102126455 A TW 102126455A TW 102126455 A TW102126455 A TW 102126455A TW I492792 B TWI492792 B TW I492792B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Compression, Expansion, Code Conversion, And Decoders (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
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Description
本發明係有關一種平面形狀被定義之薄膜形成在基板上之基板製造方法及基板製造裝置。The present invention relates to a substrate manufacturing method and a substrate manufacturing apparatus in which a film having a defined planar shape is formed on a substrate.
已知有如下技術,即從噴嘴頭吐出包含薄膜材料之液滴來在基板的表面形成薄膜(例如專利文獻1)。A technique is known in which a droplet containing a film material is discharged from a nozzle head to form a film on the surface of the substrate (for example, Patent Document 1).
以上薄膜形成技術中,例如在基板上使用有印刷基板,薄膜材料使用焊罩。印刷基板包含基材及配線,在規定的位置上焊接有電子零件等。焊罩露出對電子零件等進行焊接之導體部份,覆蓋不需要焊接之部份。與將焊罩塗佈於整個面之後,使用光刻技術形成開口之方法相比能夠降低製造成本。In the above film forming technique, for example, a printed substrate is used for the substrate, and a solder mask is used for the film material. The printed circuit board includes a substrate and wiring, and electronic parts and the like are soldered at predetermined positions. The solder mask exposes a portion of the conductor that is soldered to the electronic component or the like, covering the portion that does not need to be soldered. After the solder mask is applied to the entire surface, the manufacturing cost can be reduced as compared with the method of forming the opening using photolithography.
專利文獻1:日本特開2004-104104號公報Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-104104
因在基板製造階段中進行之熱處理等而在印刷基板上發生變形。根據在基板上所發生之變形,對在其表面上形成之薄膜的圖案進行修正為較佳。一般來說,焊罩的圖案由蓋伯格式(Gerber format)的圖像資料獲得。從噴嘴頭吐出薄膜材料液滴形成薄膜時,由對薄膜的圖案進行定義之蓋伯格式的圖像資料生成光柵格式的圖像資料。噴嘴頭的控制根據該光柵格式的圖像資料進行。The deformation occurs on the printed substrate due to heat treatment or the like performed in the substrate manufacturing stage. It is preferable to correct the pattern of the film formed on the surface thereof in accordance with the deformation occurring on the substrate. In general, the pattern of the solder mask is obtained from image data in the Gerber format. When a thin film material droplet is ejected from the nozzle tip to form a thin film, image data in a raster format is generated from the image data of the Geber format which defines the pattern of the thin film. The control of the nozzle head is performed based on the image data of the raster format.
在將基板搬入到薄膜形成裝置之後且薄膜形成之前,檢測出基板上的定位標記,從而進行基板的對位。由複數個定位標記位置計算基板的變形量。根據計算出之變形,校正蓋伯格式的圖像資料或光柵格式的圖像資料。After the substrate is carried into the thin film forming apparatus and before the film formation, the positioning marks on the substrate are detected, thereby aligning the substrates. The amount of deformation of the substrate is calculated from a plurality of positioning mark positions. Correcting the image data of the Gabriel format or the image data of the raster format according to the calculated deformation.
作為一例,對邊長為500mm的正方形的區域內的圖案進行定義之2400dpi圖像資料大約由22.3億個像素構成。光柵格式的圖像資料為2維連續資料,因此改變1個像素的值時,產生改變其他幾乎所有的像素的影響。即使對1像素分配1位元的資料時,圖像資料的尺寸亦成為約266MB。因此,進行圖像資料校正處理時需要很長時間。因進行圖像資料的校正處理而導致薄膜形成裝置所佔用之時間延長。As an example, the 2400 dpi image data defining a pattern in a square area having a side length of 500 mm is composed of approximately 2.23 billion pixels. The image data in the raster format is 2-dimensional continuous data, so when the value of one pixel is changed, the influence of changing almost all other pixels is generated. Even when 1 bit of data is allocated to 1 pixel, the size of the image data becomes about 266 MB. Therefore, it takes a long time to perform image data correction processing. The time taken up by the film forming apparatus is prolonged due to the correction processing of the image data.
在將基板搬入到薄膜形成裝置之前,測定基板的變形量,進行圖像資料的校正,從而能夠縮短因圖像資料的校正處理而薄膜形成裝置所佔用之時間。然而,該方法中,除了裝備於薄膜形成裝置之定位標記的檢測裝置之外,還 需要設置用於測定變形量的另一定位標記檢測裝置。因此,導致裝置整體的成本上升。Before the substrate is carried into the thin film forming apparatus, the amount of deformation of the substrate is measured, and the image data is corrected, whereby the time taken by the thin film forming apparatus due to the correction processing of the image data can be shortened. However, in this method, in addition to the detecting device equipped with the positioning mark of the film forming device, It is necessary to provide another positioning mark detecting device for measuring the amount of deformation. Therefore, the cost of the entire device is increased.
本發明的目的在於提供一種能夠抑制因圖像資料的校正處理而裝置所佔用之時間延長及成本增加之同時,考慮到基板的變形來形成薄膜之基板製造方法及基板製造裝置。An object of the present invention is to provide a substrate manufacturing method and a substrate manufacturing apparatus capable of suppressing the time consuming and cost increase of the apparatus due to the correction processing of image data, and forming a thin film in consideration of deformation of the substrate.
根據本發明的一觀點提供一種基板製造方法,具有:準備壓縮資料之製程,該壓縮資料係把對將要形成在基板上之薄膜的形狀進行定義之光柵格式的圖像資料予以壓縮而成;測定前述基板的在平面方向(in-plane direction)上之變形量之製程;根據測定出的前述變形量,藉由對前述壓縮資料以壓縮過的格式狀態實施像素的插入或去除處理來生成變形修正資料之製程;及根據前述變形修正資料在前述基板上形成薄膜之製程。According to an aspect of the present invention, a substrate manufacturing method includes: a process for preparing a compressed material, wherein the compressed data is obtained by compressing image data of a raster format defining a shape of a film to be formed on a substrate; a process of deforming the amount of the substrate in the in-plane direction; and generating distortion correction by performing pixel insertion or removal processing on the compressed data in a compressed format state according to the measured deformation amount The process of the data; and the process of forming a thin film on the substrate according to the deformation modification data described above.
根據本發明的另一觀點提供一種基板製造裝置,具有:載物台,用以保持基板;噴嘴單元,設置有複數個朝向保持在前述載物台上之基板吐出薄膜材料液滴之噴嘴孔; 移動機構,使前述載物台及前述噴嘴單元中的其中一方相對於另一方移動;位置檢測裝置,對在保持於前述載物台之基板上形成之標記的位置進行檢測;及控制裝置,控制前述移動機構及前述噴嘴單元;前述控制裝置進行如下控制:記憶對將要形成在前述基板上之薄膜的形狀進行定義之光柵格式的圖像資料予以壓縮而成之壓縮資料,根據以前述位置檢測裝置所檢測出之前述標記的位置,計算前述基板的平面方向的變形量,根據計算出的前述變形量,藉由對前述壓縮資料以壓縮過的格式狀態實施像素的插入或去除處理來生成變形修正資料,根據前述變形修正資料,藉由對前述移動機構及前述噴嘴單元進行控制,來在前述基板上形成薄膜。According to another aspect of the present invention, a substrate manufacturing apparatus includes: a stage for holding a substrate; and a nozzle unit provided with a plurality of nozzle holes for discharging a film material droplet toward a substrate held on the stage; The moving mechanism moves one of the stage and the nozzle unit relative to the other; the position detecting device detects a position of the mark formed on the substrate held by the stage; and a control device controls The moving mechanism and the nozzle unit; the control device performs control for compressing compressed data obtained by compressing image data of a raster format defining a shape of a film to be formed on the substrate, according to the position detecting device Calculating a deformation amount in a plane direction of the substrate by detecting a position of the mark, and generating a distortion correction by performing insertion or removal processing of the pixel on the compressed data in a compressed format state based on the calculated deformation amount According to the deformation correction data, the film is formed on the substrate by controlling the moving mechanism and the nozzle unit.
藉由對定義薄膜圖案之壓縮資料以壓縮格式狀態實施像素的插入或去除處理,從而能夠縮短處理時間。The processing time can be shortened by performing pixel insertion or removal processing in a compressed format state on the compressed material defining the thin film pattern.
20‧‧‧平板20‧‧‧ tablet
21‧‧‧移動機構21‧‧‧Mobile agencies
22‧‧‧載物台22‧‧‧stage
24‧‧‧支撐構件24‧‧‧Support members
27‧‧‧基板27‧‧‧Substrate
28‧‧‧拍攝裝置28‧‧‧Photographing device
29‧‧‧定位標記29‧‧‧ Positioning Mark
30‧‧‧噴嘴單元30‧‧‧Nozzle unit
31‧‧‧噴嘴單元支撐機構31‧‧‧Nozzle unit support mechanism
32‧‧‧印刷電路板32‧‧‧Printed circuit board
33‧‧‧薄膜33‧‧‧film
34‧‧‧噴嘴頭34‧‧‧Nozzle head
35‧‧‧噴嘴夾具35‧‧‧Nozzle fixture
36‧‧‧固化用光源36‧‧‧Solution light source
37‧‧‧噴嘴孔37‧‧‧Nozzle hole
38‧‧‧噴嘴面38‧‧‧Nozzle surface
39‧‧‧開口39‧‧‧ openings
40、41‧‧‧校正單位區域40, 41‧‧‧corrected unit area
42‧‧‧光柵格式的圖像資料42‧‧‧Image data in raster format
43‧‧‧像素43‧‧‧ pixels
43a‧‧‧被插入之像素43a‧‧‧Pixed pixels
43v‧‧‧去除像素之區域43v‧‧‧Removal of pixels
43L‧‧‧像素行左端的像素43L‧‧‧ pixels at the left end of the pixel row
45‧‧‧x方向壓縮資料45‧‧‧x direction compression data
46‧‧‧y方向壓縮資料46‧‧‧Y direction compression data
50‧‧‧以未實施變形修正處理之x方向壓縮資料定義之圖案 的外形50‧‧‧The pattern defined by the x-direction compressed data without the deformation correction processing Shape
51‧‧‧已發生變形之基板的外形51‧‧‧The shape of the deformed substrate
52‧‧‧重新建立校正單位區域之圖案的外形52‧‧‧Re-establishing the shape of the pattern of the correction unit area
53‧‧‧以x方向變形修正資料定義之圖案的外形53‧‧‧The shape of the pattern defined by the x-direction deformation correction data
54‧‧‧插入“W”像素之區域54‧‧‧Insert "W" pixel area
55‧‧‧路徑區域55‧‧‧Path area
56‧‧‧以y方向壓縮資料定義之圖案的外形56‧‧‧Compressing the shape of the pattern defined by the data in the y direction
57‧‧‧重新建立校正單位區域之圖案的外形57‧‧‧Re-establishing the shape of the pattern of the correction unit area
58‧‧‧插入“W”像素之區域58‧‧‧Insert "W" pixel area
59‧‧‧已變形之校正單位區域的外形59‧‧‧ Shape of the corrected unit area
60、61‧‧‧區域60, 61‧‧‧ areas
70‧‧‧控制裝置70‧‧‧Control device
71‧‧‧輸入裝置71‧‧‧ Input device
72‧‧‧輸出裝置72‧‧‧ Output device
80‧‧‧姿勢調整機構80‧‧‧ posture adjustment mechanism
第1圖係根據實施例1之基板製造裝置的示意圖。Fig. 1 is a schematic view showing a substrate manufacturing apparatus according to Embodiment 1.
第2圖係噴嘴單元的立體圖。Fig. 2 is a perspective view of the nozzle unit.
第3圖中,第3圖A係未發生變形之基板及噴嘴單元 的平面圖,第3圖B係表示在1個印刷電路板上形成之薄膜圖案的一例之平面圖。In Fig. 3, Fig. 3A shows the substrate and nozzle unit without deformation. FIG. 3 is a plan view showing an example of a thin film pattern formed on one printed circuit board.
第4圖係已發生變形之基板的平面圖。Figure 4 is a plan view of a substrate on which deformation has occurred.
第5圖係根據實施例1之基板製造方法的流程圖。Fig. 5 is a flow chart showing a method of manufacturing a substrate according to Embodiment 1.
第6圖中,第6圖A係表示光柵格式的圖像資料的局部的一例之線圖。第6圖B係表示將光柵格式的圖像資料沿x方向壓縮而成之x方向壓縮資料的格式之圖表。In Fig. 6, Fig. 6A is a line diagram showing an example of a part of image data in a raster format. Fig. 6B is a diagram showing a format of compressed data in the x direction obtained by compressing image data of a raster format in the x direction.
第7圖中,第7圖A係簡化表示以未實施變形修正處理之x方向壓縮資料定義之圖案的外形、及已發生變形之基板的外形之線圖,第7圖B係一同簡化表示假定y方向上未發生變形而僅在與x方向平行之1維方向上發生變形時的基板的外形、及以未實施變形修正處理之x方向壓縮資料定義之圖案的外形之線圖。In Fig. 7, Fig. 7A is a simplified diagram showing the outer shape of the pattern defined by the x-direction compressed data in which the distortion correction processing is not performed and the outer shape of the deformed substrate, and Fig. 7B is a simplified representation together. The outer shape of the substrate when the deformation is not performed in the y direction and is deformed only in the one-dimensional direction parallel to the x direction, and the outer shape of the pattern defined by the x-direction compression data without performing the distortion correction processing.
第8圖中,第8圖A係表示1個校正單位區域內的像素及已發生變形之校正單位區域的外形之線圖,第8圖B係表示像素的插入及去除之後的像素分佈和已發生變形之校正單位區域的外形之線圖。In Fig. 8, Fig. 8A is a line diagram showing the outlines of pixels in one correction unit area and the correction unit area in which deformation has occurred, and Fig. 8B shows the pixel distribution after insertion and removal of pixels. A line drawing of the shape of the unit area where the distortion is corrected.
第9圖中,第9圖A及第9圖B係表示1個像素行的局部定位標記的圖像資料和壓縮資料之圖表。In Fig. 9, Fig. 9A and Fig. 9B are diagrams showing image data and compressed data of local positioning marks of one pixel row.
第10圖係表示1個像素行的局部定位標記的圖像資料和壓縮資料之圖表。Fig. 10 is a diagram showing image data and compressed data of local positioning marks of one pixel row.
第11圖中,第11圖A係表示以對x方向上的變形進行修正之後的x方向壓縮資料定義之校正單位區域的各個外形之線圖,第11圖B係表示以在校正單位區域的像素 行中相同像素行連結之方式重新建立複數個校正單位區域之圖案的外形之線圖。In Fig. 11, Fig. 11A is a line diagram showing the respective shapes of the correction unit area defined by the x-direction compressed data after the correction in the x direction, and Fig. 11B is shown in the correction unit area. Pixel A line graph of the shape of the pattern of the plurality of correction unit areas is re-established in the same pixel row connection in the row.
第12圖中,第12圖A係表示以x方向變形修正資料定義之圖案的外形及已發生變形之基板的外形之線圖,第12圖B係表示按路徑區域使用x方向變形校正資料定義之圖案的外形沿y方向延伸之後的圖案的外形之線圖。In Fig. 12, Fig. 12A is a line diagram showing the outer shape of the pattern defined by the x-direction deformation correction data and the outer shape of the deformed substrate, and Fig. 12B shows the definition of the distortion correction data by the x-direction by the path region. A line drawing of the outline of the pattern after the outline of the pattern extends in the y direction.
第13圖中,第13圖A及第13圖B係表示在實施例1的變形例1中採用之x方向壓縮資料的格式之圖表。In Fig. 13, Fig. 13 and Fig. 13B are diagrams showing the format of the x-direction compressed material used in the first modification of the first embodiment.
第14圖中,第14圖A及第14圖B係表示以根據實施例1之方法追加像素之前和之後的像素的配置之線圖,第14圖C及第14圖D係表示以根據實施例1的變形例2之方法追加像素之前和之後的像素的配置之線圖。In Fig. 14, Fig. 14A and Fig. 14B are line diagrams showing the arrangement of pixels before and after the pixel is added by the method according to the first embodiment, and Figs. 14C and 14D show the implementation according to Fig. 14 The method of the second modification of the first embodiment adds a line diagram of the arrangement of pixels before and after the pixel.
第15圖中,第15圖A係將以x方向變形修正資料定義之圖案的外形與發生變形之基板的外形一同示出之線圖,第15圖B係一同表示假定為在基板上未產生x方向的變形而僅在與y方向平行之1維方向上已發生變形時的基板的外形、及以x方向變形修正資料定義之圖案的外形之線圖。In Fig. 15, Fig. 15A is a line diagram showing the outer shape of the pattern defined by the x-direction deformation correction data together with the outer shape of the deformed substrate, and Fig. 15B is assuming that the substrate is not produced on the substrate. A line diagram of the outer shape of the substrate when the deformation in the x direction is deformed in the one-dimensional direction parallel to the y direction, and the outer shape of the pattern defined by the x-direction deformation correction data.
第16圖係表示y方向壓縮資料的一例之圖表。Fig. 16 is a diagram showing an example of compressed data in the y direction.
第17圖係表示以藉由對y方向壓縮資料進行像素的插入及去除處理來得到之xy方向變形修正資料定義之圖案的外形之線圖。Fig. 17 is a line diagram showing the outline of a pattern defined by the xy-direction deformation correction data obtained by performing pixel insertion and removal processing on the y-direction compressed material.
第18圖係根據實施例3之基板製造裝置的載物台及噴嘴單元的平面圖。Fig. 18 is a plan view showing a stage and a nozzle unit of the substrate manufacturing apparatus according to the third embodiment.
第1圖中示出根據實施例1之基板製造裝置的示意圖。在平板20上藉由移動機構21支撐有載物台22。在載物台22的上面(保持面)保持有印刷基板等基板27。將與載物台22的保持面平行之方向設為x方向及y方向且將保持面的法線方向設為z方向之xyz直角坐標系進行定義。移動機構21使載物台22沿x方向及y方向移動。A schematic view of a substrate manufacturing apparatus according to Embodiment 1 is shown in Fig. 1. The stage 22 is supported by the moving mechanism 21 on the flat plate 20. A substrate 27 such as a printed board is held on the upper surface (holding surface) of the stage 22 . The direction parallel to the holding surface of the stage 22 is defined as the x-direction and the y-direction, and the xyz rectangular coordinate system in which the normal direction of the holding surface is the z direction is defined. The moving mechanism 21 moves the stage 22 in the x direction and the y direction.
在平板20的上方藉由支撐構件24支撐噴嘴單元30及拍攝裝置28。噴嘴單元30經由噴嘴單元支撐機構31可升降地支撐在支撐構件24上。噴嘴單元30及拍攝裝置28與保持在載物台22上的基板27相向。拍攝裝置28對形成於基板27的表面上之配線圖案、定位標記、形成於基板27上之薄膜圖案等進行拍攝。拍攝而得到之圖像資料輸入到控制裝置70。噴嘴單元30從複數個噴嘴孔朝向基板27吐出光固化性(例如紫外線固化性)的薄膜材料液滴(例如焊罩等的液滴)。所吐出之薄膜材料附著於基板27的表面。The nozzle unit 30 and the imaging device 28 are supported by the support member 24 above the flat plate 20. The nozzle unit 30 is supported on the support member 24 so as to be movable up and down via the nozzle unit support mechanism 31. The nozzle unit 30 and the imaging device 28 face the substrate 27 held on the stage 22. The imaging device 28 images a wiring pattern, a positioning mark, a thin film pattern formed on the substrate 27, and the like formed on the surface of the substrate 27. The image data obtained by the shooting is input to the control device 70. The nozzle unit 30 discharges a photocurable (for example, ultraviolet curable) film material droplet (for example, a droplet of a solder mask or the like) from the plurality of nozzle holes toward the substrate 27. The discharged film material adheres to the surface of the substrate 27.
控制裝置70對移動機構21、噴嘴單元30、及拍攝裝置28進行控制。在控制裝置70中記憶有對將要形成在基板27上之薄膜圖案的形狀進行定義之光柵格式的圖像資料或將其壓縮之圖像資料(壓縮資料)等。操作員藉由輸入裝置71對控制裝置70輸入各種指令(command)和控 制所需之數值資料。控制裝置70從輸出裝置72對操作員輸出各種資訊。The control device 70 controls the moving mechanism 21, the nozzle unit 30, and the imaging device 28. In the control device 70, image data of a raster format defining a shape of a thin film pattern to be formed on the substrate 27 or image data (compressed data) to be compressed is stored. The operator inputs various commands and controls to the control device 70 through the input device 71. The numerical data required for the system. The control device 70 outputs various information to the operator from the output device 72.
第2圖中示出噴嘴單元30(第1圖)的立體圖。在噴嘴夾具35上沿y方向排列安裝有複數個例如4個噴嘴頭34。複數個噴嘴孔37在每個噴嘴頭34的與載物台22(第1圖)相向之噴嘴面38上開口。複數個噴嘴孔37沿x方向排列成2列。4個噴嘴頭34的複數個噴嘴孔37配置於在x方向上的不同之位置,整體來看在x方向上等間隔分佈。Fig. 2 is a perspective view showing the nozzle unit 30 (first drawing). A plurality of, for example, four nozzle heads 34 are arranged in the y direction on the nozzle jig 35. A plurality of nozzle holes 37 are opened in the nozzle face 38 of each nozzle head 34 facing the stage 22 (Fig. 1). A plurality of nozzle holes 37 are arranged in two rows in the x direction. The plurality of nozzle holes 37 of the four nozzle heads 34 are disposed at different positions in the x direction, and are distributed at equal intervals in the x direction as a whole.
在噴嘴頭34之間及兩端噴嘴頭34的外側分別安裝有固化用光源36。固化用光源36對基板27(第1圖)照射固化用光例如紫外線光。A curing light source 36 is attached to each of the nozzle heads 34 and the outside of the nozzle heads 34 at both ends. The curing light source 36 irradiates the substrate 27 (first drawing) with curing light such as ultraviolet light.
第3圖A中,示出未發生變形的基板27及噴嘴單元30的平面圖。在1個基板27上配置有複數個印刷電路板32。基板27為所謂拼板。第3圖A中8個印刷電路板32配置成4行2列的行列狀。在基板27上形成有複數個定位標記29。第3圖A中示出在基板27的四角、4邊的各個大致中央、及基板27的大致中心配置有定位標記29之例子。In Fig. 3A, a plan view of the substrate 27 and the nozzle unit 30 which have not been deformed is shown. A plurality of printed circuit boards 32 are disposed on one substrate 27. The substrate 27 is a so-called puzzle. In Fig. 3A, the eight printed circuit boards 32 are arranged in a matrix of four rows and two columns. A plurality of positioning marks 29 are formed on the substrate 27. In the third drawing A, an example in which the positioning marks 29 are disposed at substantially the center of the four corners and four sides of the substrate 27 and substantially at the center of the substrate 27 is shown.
在噴嘴單元30上設置有複數個噴嘴孔37。複數個噴嘴孔37在x方向上以等間隔分佈。第3圖A中簡化表示成噴嘴孔37排列成一列,但實際上如第2圖所示,噴嘴孔37構成為複數個列。A plurality of nozzle holes 37 are provided in the nozzle unit 30. A plurality of nozzle holes 37 are distributed at equal intervals in the x direction. Although the nozzle holes 37 are arranged in a line in a simplified manner in Fig. 3A, actually, as shown in Fig. 2, the nozzle holes 37 are formed in a plurality of rows.
第3圖B中示出在1個印刷電路板32上形成之薄膜 33的圖案的一例。在第3圖B的劃有陰影線的區域形成有焊罩的薄膜33。在薄膜33中分佈有複數個開口39。開口39與安裝有電子零件之部位和形成有通孔之部位等對應配置。A film formed on one printed circuit board 32 is shown in FIG. 3B. An example of the pattern of 33. A film 33 of a solder mask is formed in the hatched area of FIG. A plurality of openings 39 are distributed in the film 33. The opening 39 is disposed corresponding to a portion where the electronic component is mounted and a portion where the through hole is formed.
接著,對薄膜的形成方法進行說明。使基板27沿y方向移動之同時,根據對將要形成之薄膜的平面形狀進行定義之圖像資料,從噴嘴孔37吐出薄膜材料液滴。將該動作稱作“掃描”。從噴嘴孔37吐出之薄膜材料液滴彈著到基板27上。從固化用光源36(第2圖)對彈著到基板27上之薄膜材料照射固化用光。藉此,至少薄膜材料的表層部進行固化。在1次掃描中,在x方向上分佈有噴嘴孔37之範圍內,能夠形成薄膜33。改變基板27與噴嘴單元30在x方向上的相對位置而進行複數次掃描,從而能夠在基板27表面的幾乎整個區域形成薄膜33。Next, a method of forming a film will be described. While moving the substrate 27 in the y direction, the film material droplets are ejected from the nozzle holes 37 in accordance with the image data defining the planar shape of the film to be formed. This action is called "scanning." The film material droplets ejected from the nozzle holes 37 are bounced onto the substrate 27. The film material that has been bounced onto the substrate 27 is irradiated with curing light from the curing light source 36 (Fig. 2). Thereby, at least the surface layer portion of the film material is cured. In the single scanning, the film 33 can be formed in the range in which the nozzle holes 37 are distributed in the x direction. The film 33 is formed by changing the relative position of the substrate 27 and the nozzle unit 30 in the x direction, so that the film 33 can be formed in almost the entire surface of the substrate 27.
第4圖中示出已發生變形之基板27的平面圖。根據基板27的變形,複數個定位標記29的相對位置發生變化。藉由檢測定位標記29的位置,能夠計算基板27在x方向及y方向的變形量。例如在x方向及y方向上,變形量能夠在2個定位標記29之間近似線形變化。在基板27的整個區域內均勻變形時,亦可將定位標記29僅配置在基板27的四角。藉由增加定位標記29的個數,能夠檢測出複雜的變形。Fig. 4 is a plan view showing the substrate 27 on which deformation has occurred. According to the deformation of the substrate 27, the relative positions of the plurality of positioning marks 29 are changed. By detecting the position of the positioning mark 29, the amount of deformation of the substrate 27 in the x direction and the y direction can be calculated. For example, in the x direction and the y direction, the amount of deformation can be approximately linearly changed between the two positioning marks 29. When the entire surface of the substrate 27 is uniformly deformed, the positioning marks 29 may be disposed only at the four corners of the substrate 27. By increasing the number of positioning marks 29, complex deformation can be detected.
基板27的表面被劃分成複數個校正單位區域40。第4圖中示出校正單位區域40配置成4行4列的行列狀之 例子。根據基板27的變形,按校正單位區域40進行圖像資料的校正。The surface of the substrate 27 is divided into a plurality of correction unit regions 40. In Fig. 4, the correction unit area 40 is arranged in a matrix of 4 rows and 4 columns. example. The correction of the image data is performed in accordance with the correction unit area 40 in accordance with the deformation of the substrate 27.
第5圖中示出根據實施例1之基板製造方法的流程圖。步驟SA1中壓縮對將要形成之薄膜的平面形狀進行定義之光柵格式的圖像資料來準備壓縮資料。該壓縮資料例如藉由控制裝置70(第1圖)的上位處理裝置生成。所生成之壓縮資料輸入到控制裝置70。A flowchart of a substrate manufacturing method according to Embodiment 1 is shown in FIG. In step SA1, image data in a raster format defining the planar shape of the film to be formed is compressed to prepare compressed data. This compressed data is generated, for example, by a higher-level processing device of the control device 70 (Fig. 1). The generated compressed data is input to the control device 70.
第6圖A中示出光柵格式的圖像資料42的局部的一例。光柵格式的圖像資料42由沿x方向及y方向排列之複數個像素43構成。在各像素43中分配有“W”及“B”的值中的一個。“B”及“W”分別表示使薄膜材料液滴彈著之像素、及未彈著之像素。第6圖A中示出形成有大致圓形的開口39之區域附近。An example of a part of the image data 42 of the raster format is shown in Fig. 6A. The image data 42 of the raster format is composed of a plurality of pixels 43 arranged in the x direction and the y direction. One of the values of "W" and "B" is assigned to each pixel 43. "B" and "W" respectively indicate pixels that cause the film material to be dropped, and pixels that are not bombed. The vicinity of the area where the opening 39 having a substantially circular shape is formed is shown in Fig. 6A.
第6圖B中示出將第6圖A所示之光柵格式的圖像資料42沿x方向壓縮而成之x方向壓縮資料45。光柵格式的圖像資料42的由在x方向上連續之像素構成之資料列被壓縮,並以複數個要素標記。各要素包括對像素43的值“W”和“B”進行區分之識別符號、及表示分配識別符號的值之像素連續之次數之數值。Fig. 6B shows an x-direction compressed material 45 obtained by compressing the image data 42 of the raster format shown in Fig. 6 in the x direction. The data sequence of the image data 42 of the raster format, which is composed of pixels continuous in the x direction, is compressed and marked with a plurality of elements. Each element includes an identification code for distinguishing the values "W" and "B" of the pixel 43, and a numerical value indicating the number of consecutive pixels of the value to which the identification symbol is assigned.
步驟SA2(第5圖)中,使將要形成薄膜之基板27保持在載物台22上(第1圖)。步驟SA3中,由拍攝裝置28(第1圖)對基板27的定位標記29(第4圖)進行拍攝。被拍攝之圖像資料輸入到控制裝置70。步驟SA4(第5圖)中,控制裝置70藉由對定位標記29的圖像資 料進行分析來計算定位標記位置29的位置。拍攝裝置28起到作為對定位標記29的位置進行檢測之位置檢測裝置的作用。In step SA2 (Fig. 5), the substrate 27 on which the thin film is to be formed is held on the stage 22 (Fig. 1). In step SA3, the positioning mark 29 (Fig. 4) of the substrate 27 is imaged by the imaging device 28 (Fig. 1). The captured image data is input to the control device 70. In step SA4 (Fig. 5), the control device 70 passes the image of the positioning mark 29 The analysis is performed to calculate the position of the positioning mark position 29. The imaging device 28 functions as a position detecting device that detects the position of the positioning mark 29.
步驟SA5中,根據已計算之定位標記29的位置計算基板27的x方向及y方向的變形量。步驟SA6中,對x方向壓縮資料45(第6圖B)進行插入像素或去除像素之處理,從而生成變形修正資料。參閱第7圖A~第11圖B,對步驟SA6的處理進行說明。In step SA5, the amount of deformation of the substrate 27 in the x direction and the y direction is calculated based on the calculated position of the positioning mark 29. In step SA6, the process of inserting pixels or removing pixels is performed on the x-direction compressed material 45 (Fig. 6B), thereby generating distortion correction data. The processing of step SA6 will be described with reference to Figs. 7A to 11B.
第7圖A中以線圖簡化表示以未實施變形修正處理之x方向壓縮資料45(第6圖B)定義之圖案的外形50、及已發生變形之基板27的外形51。第7圖A中,誇張表示變形。變形修正前的圖案的外形50例如以具有與x方向及y方向平行之邊之長方形表示。基板27的外形51沿x方向及y方向變形。變形修正前的圖案的外形50的內部區分成複數個校正單位區域40。校正單位區域40配置成由例如從第1行到第4行的4行及A列~D列的4列構成之行列狀。對列的識別碼A~D、及行號進行排列而特定1個校正單位區域40。例如,將B列的第3行的校正單位區域40標記成“B3”。The outline of the pattern defined by the x-direction compressed material 45 (Fig. 6B) in which the distortion correction processing is not performed, and the outer shape 51 of the deformed substrate 27 are simplified in a line diagram in Fig. 7A. In Fig. 7A, the exaggeration indicates the deformation. The outer shape 50 of the pattern before the deformation correction is expressed, for example, by a rectangle having sides parallel to the x direction and the y direction. The outer shape 51 of the substrate 27 is deformed in the x direction and the y direction. The inside of the outer shape 50 of the pattern before the distortion correction is divided into a plurality of correction unit regions 40. The correction unit area 40 is arranged in an array of, for example, four rows from the first row to the fourth row and four columns from the A column to the D column. The identification code A to D of the column and the line number are arranged to specify one correction unit area 40. For example, the correction unit area 40 of the third row of the B column is marked as "B3".
如第7圖B所示,假定為在y方向上未發生變形而僅在與x方向平行之1維方向上發生變形。已發生變形之基板的外形51由與x方向平行之2個緣部及對該緣部的端部彼此進行連接之沿y方向延伸之緣部構成。與x方向平行之緣部與變形修正前的圖案的外形50的與x方向平行 之緣部重合。各校正單位區域40的外形59亦包括與x方向平行之2個緣部。As shown in Fig. 7B, it is assumed that deformation does not occur in the y direction and only in the one-dimensional direction parallel to the x direction. The outer shape 51 of the deformed substrate is composed of two edge portions parallel to the x direction and an edge portion extending in the y direction to which the end portions of the edge portions are connected to each other. The edge portion parallel to the x direction and the outer shape 50 of the pattern before the deformation correction are parallel to the x direction The edges are coincident. The outer shape 59 of each correction unit area 40 also includes two edges parallel to the x direction.
第8圖A中示出1個校正單位區域40內的像素43及已發生變形之校正單位區域40的外形59。在1個校正單位區域40中,沿x方向排列之像素43的數量為N個。已發生變形之校正單位區域40的外形59以具有與x方向平行之上底和下底的梯形表示。Fig. 8A shows the outline 43 of the pixel 43 in one correction unit area 40 and the corrected unit area 40 in which deformation has occurred. In one correction unit area 40, the number of pixels 43 arranged in the x direction is N. The outer shape 59 of the corrected unit area 40 in which deformation has occurred is represented by a trapezoid having a bottom and a lower bottom parallel to the x direction.
由外形59的上底的位置上之x方向的變形量及下底的位置上的x方向的變形量計算像素43的每一行的x方向的變形量。作為一例,在上底與下底之間,變形量在y方向上近似線形變化。第8圖A中作為一例示出了上底被壓縮成相當於(N-2)個量的像素之長度,下底延伸成相當於(N+3)個量的像素之長度之例子。The amount of deformation in the x direction of each row of the pixels 43 is calculated from the amount of deformation in the x direction at the position of the upper base of the outer shape 59 and the amount of deformation in the x direction at the position of the lower base. As an example, between the upper bottom and the lower bottom, the amount of deformation changes approximately linearly in the y direction. In Fig. 8A, an example in which the upper base is compressed to a length corresponding to (N-2) pixels and the lower base is extended to correspond to the length of (N + 3) pixels is shown as an example.
按由沿x方向排列之像素43構成之像素行進行像素的插入或去除,以使接近已發生變形之外形59的尺寸。具體而言,將校正單位區域40沿高度方向進行n等分。在此,“n”與在像素的個數加1之值相等,其中前述像素的個數相當於上底長度與下底的長度的差量。第8圖A所示之例子中n=6。按已n等分之區域確定像素的插入個數或去除個數。在最下方的區域內,按像素行插入有3個像素。在最上方的區域內,按像素行去除2個像素。The insertion or removal of the pixels is performed in a pixel row constituted by the pixels 43 arranged in the x direction so as to approach the size of the deformed outer shape 59. Specifically, the correction unit area 40 is equally divided into n in the height direction. Here, "n" is equal to the value of the number of pixels plus one, wherein the number of the aforementioned pixels corresponds to the difference between the length of the upper base and the length of the lower base. In the example shown in Fig. 8A, n=6. The number of pixels inserted or removed is determined by the area where n is equally divided. In the lowermost area, 3 pixels are inserted in the pixel row. In the uppermost area, 2 pixels are removed in pixel rows.
第8圖B中示出像素的插入及去除之後的像素分佈和已發生變形之校正單位區域40的外形59。插入有像素43a並去除區域43v的像素。關於每個像素行,像素的插 入部位及去除部位在x方向上均等分散。插入有像素43a之像素行沿x方向延伸,去除像素之像素行沿x方向縮小。藉此,像素所分佈之區域的外形與已發生變形之校正單位區域40的外形59接近。The pixel distribution after the insertion and removal of the pixel and the outline 59 of the corrected unit area 40 in which the distortion has occurred are shown in FIG. A pixel in which the pixel 43a is inserted and the area 43v is removed. About each pixel row, the insertion of pixels The entry site and the removal site are equally dispersed in the x direction. The row of pixels in which the pixel 43a is inserted extends in the x direction, and the row of pixels from which the pixel is removed is reduced in the x direction. Thereby, the outer shape of the region in which the pixels are distributed is close to the outer shape 59 of the corrected unit region 40 in which the distortion has occurred.
參閱第9圖A,對在像素行上插入像素之處理進行說明。第9圖A中,示出1個像素行的局部定位標記的圖像資料和壓縮資料。5個“B”像素、4個“W”像素、7個“B”像素、及6個“W”像素沿x方向依次連結。該像素行的壓縮資料標記為“B5W4B7W6”。Referring to Fig. 9A, a process of inserting pixels on a pixel row will be described. In Fig. 9A, image data and compressed data of local positioning marks of one pixel row are shown. Five "B" pixels, four "W" pixels, seven "B" pixels, and six "W" pixels are sequentially connected in the x direction. The compressed data of this pixel row is labeled "B5W4B7W6".
對在從左第13個像素43與第14個像素43之間插入像素43a之情況進行說明。插入像素43a之位置的兩側的像素43的值均為“B”,因此所插入之像素43a的值亦設為“B”。從左第13個及第14個的像素43包含於以壓縮資料“B7”表示之連續之7個像素43。在壓縮資料中,僅將要素“B7”校正為“B8”來及進行像素的插入。A case where the pixel 43a is inserted between the 13th pixel 43 and the 14th pixel 43 on the left side will be described. The value of the pixel 43 on both sides of the position where the pixel 43a is inserted is "B", so the value of the inserted pixel 43a is also set to "B". The 13th and 14th pixels 43 from the left are included in the continuous 7 pixels 43 indicated by the compressed material "B7". In the compressed data, only the element "B7" is corrected to "B8" and the pixel is inserted.
如第9圖B所示,當插入像素43a之位置(從左第16個像素43與第17個像素43之間)的兩側的像素43的其中一方的值為“B”,另一個的值為“W”時,所插入之像素43a的值可設為“B”及“W”中的任一個。此時,藉由將壓縮資料的要素“B7”修正為“B8”或將要素“W6”修正為“W7”來進行像素43a的追加。As shown in FIG. 9B, the value of one of the pixels 43 on both sides of the position where the pixel 43a is inserted (between the left 16th pixel 43 and the 17th pixel 43) is "B", and the other is When the value is "W", the value of the inserted pixel 43a can be set to any of "B" and "W". At this time, the addition of the pixel 43a is performed by correcting the element "B7" of the compressed material to "B8" or the element "W6" to "W7".
參閱第10圖,對從像素行去除像素的處理進行說明。第10圖中示出1個像素行的局部定位標記的圖像資料和壓縮資料。對去除從左第13個像素43之例子進行說 明。從左第13個像素為在壓縮資料中以“B7”表示之連續之7個“B”像素中的1個。為了去除從左第13個像素43,將壓縮資料的要素“B7”校正為“B6”即可。Referring to Fig. 10, a process of removing pixels from a pixel row will be described. Fig. 10 shows image data and compressed data of local positioning marks of one pixel row. Said to remove the example of the 13th pixel from the left 43 Bright. The 13th pixel from the left is one of the 7 consecutive "B" pixels indicated by "B7" in the compressed material. In order to remove the 13th pixel 43 from the left, the element "B7" of the compressed material is corrected to "B6".
如上述,無需展開x方向壓縮資料45(第6圖B),就能夠以壓縮格式狀態按簡便的順序進行像素的插入及去除處理。As described above, it is possible to perform pixel insertion and removal processing in a simple order in a compressed format state without expanding the x-direction compressed material 45 (Fig. 6B).
第11圖A中示出以對x方向上的變形進行校正之後的x方向壓縮資料45(第9圖A、第9圖B、第10圖)定義之校正單位區域40的各個外形。若固定像素行的左端的像素43的位置,則校正單位區域40的外形成為左側邊與y軸平行之梯形。FIG. 11A shows the respective outer shapes of the correction unit area 40 defined by the x-direction compressed material 45 (FIG. 9, FIG. 9B, FIG. 10) after the correction in the x direction. When the position of the pixel 43 at the left end of the pixel row is fixed, the outer shape of the correction unit region 40 becomes a trapezoid whose left side is parallel to the y-axis.
如第11圖B所示,重新建立複數個校正單位區域40,以使校正單位區域40的像素行中,相同的像素行連續。重新建立時,使最左側(A列)的校正單位區域40的左端的像素43L的位置與第7圖B所示之已發生變形之基板27的外形51的左側邊一致。藉由重新建立以在x方向進行變形的校正之壓縮資料定義之校正單位區域40來得到之圖案的外形52,包括與x方向平行之2個邊和將該2個邊的端部彼此沿y方向連接之一緣部。一般來說,重新建立之圖案的外形52沿y方向延伸之一對緣部各自不與y軸平行,並且亦不是1條直線。As shown in Fig. 11B, a plurality of correction unit regions 40 are newly created so that the same pixel row is continuous in the pixel row of the correction unit region 40. At the time of re-establishment, the position of the left end pixel 43L of the leftmost (A column) correction unit area 40 coincides with the left side of the outer shape 51 of the deformed substrate 27 shown in Fig. 7B. The outline 52 of the pattern obtained by re-establishing the corrected unit area 40 defined by the compressed data defined by the deformation in the x direction includes two sides parallel to the x direction and ends of the two sides along the y One of the directions is connected to the edge. In general, the shape 52 of the re-established pattern extends in the y direction, one pair of edges are not parallel to the y-axis, and are not one straight line.
對內含有已重新建立之圖案的外形52的長方形進行定義。該長方形的一對邊與已重新建立之圖案的外形52的與x方向平行之緣部重合。該長方形的內部區域內,在 比已重新建立之圖案的外形52更靠近外側的區域54插入“W”像素。為了在區域54內“W”插入像素,在重新建立之後的壓縮資料(對外形52進行定義之壓縮資料)中,在各像素行的左端和右端追加要素“Bi”(i為自然數)即可。將插入“W”像素之圖像資料稱為“x方向變形修正資料”。以x方向變形修正資料定義之圖案的外形53為長方形。A rectangle defining the shape 52 of the recreated pattern is defined. The pair of sides of the rectangle coincide with the edge of the outer shape 52 of the re-established pattern that is parallel to the x-direction. In the inner area of the rectangle, in A "W" pixel is inserted in a region 54 closer to the outside than the outer shape 52 of the re-established pattern. In order to insert a pixel into the "W" in the area 54, in the compressed data (the compressed data defined for the outer shape 52) after the re-establishment, the element "Bi" (i is a natural number) is added to the left and right ends of each pixel row. can. The image data in which the "W" pixel is inserted is referred to as "x-direction deformation correction data". The outer shape 53 of the pattern defined by the x-direction deformation correction data is a rectangle.
步驟SA7(第5圖)中,根據y方向的變形量確定來自噴嘴孔37(第2圖)的薄膜材料液滴的吐出時機(吐出頻率)、或者基板27(第1圖)朝向y方向(掃描方向)的移動速度。參閱第12圖A及第12圖B,對步驟SA7的處理進行說明。In step SA7 (Fig. 5), the discharge timing (discharge frequency) of the film material droplet from the nozzle hole 37 (Fig. 2) or the substrate 27 (Fig. 1) is oriented in the y direction based on the amount of deformation in the y direction ( The moving speed of the scanning direction). The processing of step SA7 will be described with reference to Fig. 12A and Fig. 12B.
第12圖A中,示出以x方向變形修正資料定義之圖案的外形53及已發生變形之基板的外形51。在以x方向變形修正資料定義之圖案的外形53的內部表示像素43。以x方向修正資料定義之像素43的x方向的間距與y方向的間距相等。In Fig. 12A, the outer shape 53 of the pattern defined by the x-direction deformation correction data and the outer shape 51 of the deformed substrate are shown. The pixel 43 is shown inside the outer shape 53 of the pattern defined by the deformation correction data in the x direction. The pitch of the pixel 43 defined by the x-direction correction data is equal to the pitch of the y direction.
將以x方向修正資料定義之圖案的外形53的內部劃分成在x方向上的複數個路徑區域55。每個路徑區域55在x方向的尺寸被設定為能夠以噴嘴單元30的1次掃描使薄膜材料附著之區域的x方向的寬度以下。The inside of the outer shape 53 of the pattern defined by the x-direction correction data is divided into a plurality of path regions 55 in the x direction. The dimension of each of the path regions 55 in the x direction is set to be equal to or less than the width of the region in which the film material is adhered by the primary scanning of the nozzle unit 30 in the x direction.
如第12圖B所示,按路徑區域55,使以x方向變形修正資料定義之圖案的外形53沿y方向伸縮,從而將路徑區域55的y方向的尺寸設為比已發生變形之基板的外 形51的所對應之區域的y方向的尺寸大。若使路徑區域55沿y方向伸縮,則在路徑區域55內的像素43的在y方向上的間距發生變化。在y方向上的像素43的間距與將噴嘴單元30沿y方向進行掃描時的掃描速度、或者從噴嘴孔37吐出薄膜材料液滴之頻率(時機)對應。在每個路徑區域55中,能夠由伸縮後的y方向的像素的間距確定來自噴嘴孔37的薄膜材料液滴之吐出時機及朝向基板27(第1圖)的y方向(掃描方向)的移動速度。固定吐出時機及移動速度中的其中一方,亦可設為調整吐出時機及移動速度中未固定之一方。As shown in FIG. 12B, in the path region 55, the outer shape 53 of the pattern defined by the x-direction deformation correction data is expanded and contracted in the y direction, so that the size of the path region 55 in the y direction is set to be larger than that of the substrate which has been deformed. outer The size of the corresponding region of the shape 51 in the y direction is large. When the path region 55 is expanded and contracted in the y direction, the pitch of the pixel 43 in the path region 55 in the y direction changes. The pitch of the pixels 43 in the y direction corresponds to the scanning speed when the nozzle unit 30 is scanned in the y direction or the frequency (timing) at which the film material droplets are ejected from the nozzle holes 37. In each of the path regions 55, the timing of discharge of the thin film material droplets from the nozzle holes 37 and the movement in the y direction (scanning direction) toward the substrate 27 (first drawing) can be determined by the pitch of the pixels in the y direction after expansion and contraction. speed. One of the fixed discharge timing and the moving speed may be set to adjust one of the discharge timing and the moving speed.
步驟SA8(第5圖)中,根據在步驟SA6中生成之x方向變形修正資料,在步驟SA7中確定之吐出時機或基板27(第1圖)朝向y方向移動之速度的條件下,進行薄膜的形成。In step SA8 (Fig. 5), based on the x-direction deformation correction data generated in step SA6, the film is ejected under the condition that the discharge timing or the substrate 27 (Fig. 1) in step SA7 moves in the y direction. Formation.
參閱第13圖A及第13圖B,對如下順序進行說明,即在根據實施例1的變形例1之基板製造方法中所適用之x方向壓縮資料45的形式及對x方向壓縮資料45進行插入像素或去除像素之處理之順序。如第6圖B所示,藉由在實施例1中所採用之x方向壓縮資料45中藉由“W”或“B”的識別符號和取該識別符號的值之像素沿x方向連續之次數來構成1個要素。Referring to FIGS. 13A and 13B, the following sequence will be described, that is, the form of the x-direction compressed material 45 and the x-direction compressed material 45 applied in the substrate manufacturing method according to the first modification of the first embodiment. The order in which pixels are inserted or removed. As shown in FIG. 6B, the identification symbol by "W" or "B" in the x-direction compressed data 45 used in Embodiment 1 and the pixel taking the value of the identification symbol are continuous in the x direction. The number of times constitutes one element.
第13圖A中示出在實施例1之變形例1中採用之x 方向壓縮資料45的格式。按沿x方向排列之像素列,對像素列從左端依次附加序列號#1、#2、#3、……。在實施例1的變形例1中,x方向壓縮資料45的各要素包括“W”或“B”的識別符號及像素的序列號。像素43的序列號表示取識別符號的值之連續之像素的左端及右端的像素43。例如“B1-5”係指分配在從序列號#1到#5的5個像素的值為“B”。The x used in the modification 1 of the first embodiment is shown in Fig. 13A. The direction compresses the format of the data 45. The pixel columns are arranged in the x direction, and the pixel columns are sequentially appended with serial numbers #1, #2, #3, ... from the left end. In the first modification of the first embodiment, each element of the x-direction compressed material 45 includes an identification code of "W" or "B" and a serial number of the pixel. The sequence number of the pixel 43 indicates the pixel 43 at the left end and the right end of the consecutive pixels taking the value of the identification symbol. For example, "B1-5" means that the value of five pixels assigned from the serial numbers #1 to #5 is "B".
第13圖B中示出在序列號#13的像素43與序列號#14的像素43之間插入像素43a之處理。壓縮資料的要素“B10-16”中包括序列號#13及#14的像素43。插入像素43a時,將“B10-16”改寫成“B10-17”即可。此時,由於比序列號#14更靠右側的像素43的序列號依次減小,因此在x方向壓縮資料45中,包含於各要素之序列號亦依次減小。例如,要素“W17-22”改寫成“W18-23”。去除像素43時,包含大於被去除之像素43的序列號之序列號之要素中,將各序列號依次加大即可。The process of inserting the pixel 43a between the pixel 43 of the serial number #13 and the pixel 43 of the serial number #14 is shown in Fig. 13B. The element "B10-16" of the compressed material includes the pixels 43 of the serial numbers #13 and #14. When the pixel 43a is inserted, "B10-16" may be rewritten as "B10-17". At this time, since the serial number of the pixel 43 on the right side of the serial number #14 is sequentially decreased, the serial number included in each element in the compressed data 45 in the x direction is also sequentially decreased. For example, the element "W17-22" is rewritten as "W18-23". When the pixel 43 is removed, each of the elements having a serial number larger than the serial number of the removed pixel 43 may be sequentially increased.
實施例1及其變形例1中的任一個,均著眼於在x方向排列之像素的43中設定有相同值之連續之像素43來進行像素資料的壓縮。在被壓縮之圖像資料(壓縮資料)中,定義有相同值的像素連續的個數或相同值的像素連續之部份的左端和右端的位置。In either of the first embodiment and the first modification, attention is paid to the compression of the pixel data by the continuous pixels 43 having the same value set in the pixels 43 arranged in the x direction. In the compressed image data (compressed data), the number of consecutive pixels of the same value or the positions of the left and right ends of the continuous portion of the pixels of the same value are defined.
在實施例1及變形例1中,根據基板27(第4圖)的x方向的變形量來校正對薄膜的平面形狀進行定義之壓縮資料。另外,根據基板27(第4圖)的y方向的變形 量來確定薄膜材料液滴的吐出時機或基板27的移動速度。其結果,基板27在x方向及y方向上變形時,亦能夠使所形成之薄膜的平面形狀與變形後的基板27的導電圖案整合。藉此,在根據實施例1及其變形例1之基板製造方法中,能夠緩和基板變形的影響。In the first embodiment and the first modification, the compressed data defining the planar shape of the film is corrected based on the amount of deformation in the x direction of the substrate 27 (fourth drawing). In addition, according to the deformation of the substrate 27 (Fig. 4) in the y direction The amount is determined to determine the ejection timing of the droplets of the film material or the moving speed of the substrate 27. As a result, when the substrate 27 is deformed in the x direction and the y direction, the planar shape of the formed thin film can be integrated with the conductive pattern of the deformed substrate 27. Thereby, in the substrate manufacturing method according to the first embodiment and the modification 1, the influence of the substrate deformation can be alleviated.
另外,實施例1及其變形例1中,如第9圖A、第9圖B、第10圖所示,為了緩和基板27(第4圖)的在x方向上的變形的影響,無需展開由x方向上連續之像素構成之資料列被壓縮之壓縮資料,在被壓縮之狀態下進行像素的插入及去除處理。為了緩和在y方向上的變形的影響,無需對壓縮資料進行像素的插入及去除處理。因此,與對蓋伯格式的圖像資料或被壓縮之前的光柵格式的圖像資料進行像素的插入及去除處理時相比,能夠縮短用於緩和變形的影響的處理時間。Further, in the first embodiment and the first modification, as shown in FIG. 9A, FIG. 9B, and FIG. 10, in order to alleviate the influence of the deformation of the substrate 27 (fourth diagram) in the x direction, it is not necessary to expand. The compressed data compressed by the data columns consisting of consecutive pixels in the x direction is subjected to pixel insertion and removal in a compressed state. In order to alleviate the influence of the deformation in the y direction, it is not necessary to perform pixel insertion and removal processing on the compressed data. Therefore, the processing time for mitigating the influence of the deformation can be shortened compared to when the image data of the Gabor format or the image data of the raster format before compression is subjected to pixel insertion and removal processing.
參閱第14圖A~第14圖D,對實施例1的變形例2進行說明。在實施例1中,如第8圖B所示,按1個校正單位區域40內的像素行使已插入之像素43a沿x方向均等分散。A modification 2 of the first embodiment will be described with reference to FIGS. 14A to 14D. In the first embodiment, as shown in Fig. 8B, the pixels 43a inserted in one correction unit area 40 are equally dispersed in the x direction.
如第14圖A所示,關於在將要形成之薄膜中含有正方形的開口39進行研究。假定為將校正單位區域40(第8圖A)沿y方向進行n等分時的邊界線通過開口39的內部,並且比邊界線靠上方的區域60在x方向的變形量與 靠下方的區域61在x方向的變形量相比小。將插入像素之位置沿x方向均等分配時,例如第14圖A的箭頭的位置被選定為插入部位。在靠上方的區域60中,插入像素之部位與開口39重合,在靠下方的區域61中,插入像素之部位從開口39偏離。As shown in Fig. 14A, a study was conducted on the opening 39 containing a square in the film to be formed. It is assumed that the boundary line when the correction unit region 40 (Fig. 8A) is n-divided in the y direction passes through the inside of the opening 39, and the amount of deformation in the x direction of the region 60 above the boundary line is The amount of deformation in the x direction of the lower region 61 is small. When the positions of the inserted pixels are equally distributed in the x direction, for example, the position of the arrow of FIG. 14A is selected as the insertion portion. In the upper region 60, the portion where the pixel is inserted coincides with the opening 39, and in the region 61 below, the portion where the pixel is inserted is deviated from the opening 39.
第14圖B中示出以插入像素之後的x方向壓縮資料定義之像素的配置。在靠上方的區域60中,開口39在x方向上的尺寸增大,在靠下方的區域61中,開口39在x方向的尺寸無變化。因此,作為正方形的開口39的平面形狀從正方形走樣。另外,成為變形量相對較大的區域61中,不使開口39變形,而在變形量相對較小的區域60中,將開口39沿x方向延伸之結果。The configuration of the pixel defined by the compressed data in the x direction after the pixel is inserted is shown in FIG. 14B. In the upper region 60, the size of the opening 39 in the x direction is increased, and in the lower region 61, the size of the opening 39 in the x direction is unchanged. Therefore, the planar shape of the opening 39 as a square is aliased from the square. Further, in the region 61 where the amount of deformation is relatively large, the opening 39 is not deformed, and in the region 60 where the amount of deformation is relatively small, the opening 39 is extended in the x direction.
如第14圖C所示,在根據實施例1的變形例2的方法中,插入像素之部位與開口39重合時,將像素所插入之部位偏離至開口39的緣部。As shown in Fig. 14C, in the method according to the second modification of the first embodiment, when the portion where the pixel is inserted overlaps the opening 39, the portion where the pixel is inserted is shifted to the edge of the opening 39.
第14圖D中示出以根據實施例1的變形例2之方法插入像素之後的x方向壓縮資料定義之像素的配置。靠上方的區域60及靠下方的區域61中的任一個中,開口39在x方向的尺寸均不會發生變化。因此,能夠防止開口39的形狀走樣。The configuration of the pixel defined by the x-direction compressed material after the pixel is inserted according to the method of the second modification of the first embodiment is shown in FIG. 14D. In either of the upper region 60 and the lower region 61, the size of the opening 39 in the x direction does not change. Therefore, the shape of the opening 39 can be prevented from being aliased.
參閱第15圖A~第17圖,對根據實施例2之基板製造方法進行說明。以下,對與實施例1的不同點進行說 明,關於相同的結構省略說明。從第5圖所示之步驟SA1到步驟SA6的製程在實施例1與實施例2中共同使用。The substrate manufacturing method according to the second embodiment will be described with reference to Figs. 15A to 17th. Hereinafter, the difference from the first embodiment will be described. The description of the same structure is omitted. The processes from step SA1 to step SA6 shown in Fig. 5 are used in the same manner in the first embodiment and the second embodiment.
第15圖A中一同表示將以在步驟SA6(第5圖)中生成之x方向變形修正資料定義之圖案的外形53與已發生變形之基板的外形51。外形53與以根據第11圖B所示之實施例1的方法中得到之x方向變形修正資料定義之圖案的外形53相同。Fig. 15A together shows the outer shape 53 of the pattern defined by the x-direction deformation correction data generated in step SA6 (Fig. 5) and the outer shape 51 of the deformed substrate. The outer shape 53 is the same as the outer shape 53 of the pattern defined by the x-direction deformation correction data obtained in the method of the first embodiment shown in Fig. 11B.
如第15圖B所示,假定為在基板27(第4圖)中未發生x方向的變形,僅在與y方向平行之1維方向上發生變形。已發生變形之基板的外形51沿y方向延伸之緣部成為與y軸平行之直線。在x方向變形修正資料中,如第9圖A、第9圖B、第10圖所示,由沿x方向連續之像素構成之資料列被壓縮。將該x方向變形修正資料轉換成相對於由沿y方向連續之像素構成之資料列被壓縮之y方向壓縮資料。As shown in Fig. 15B, it is assumed that deformation in the x direction does not occur in the substrate 27 (Fig. 4), and deformation occurs only in the one-dimensional direction parallel to the y direction. The edge portion of the outer shape 51 of the deformed substrate extending in the y direction is a straight line parallel to the y axis. In the x-direction distortion correction data, as shown in FIG. 9A, FIG. 9B, and FIG. 10, the data column composed of pixels continuous in the x direction is compressed. The x-direction deformation correction data is converted into a y-direction compressed material that is compressed with respect to a data sequence composed of pixels continuous in the y direction.
第16圖中示出由沿y方向連續之像素43構成之資料列及被壓縮之y方向壓縮資料46的一例。y方向壓縮資料46的各要素包括對像素43的值“W”與“B”進行區別之識別符號及表示識別符號的值被分配之像素43沿y方向連續之次數之數值。Fig. 16 shows an example of a data sequence composed of pixels 43 continuous in the y direction and compressed y-direction compressed data 46. Each element of the y-direction compressed material 46 includes an identification code for distinguishing the values "W" and "B" of the pixel 43 and a value indicating the number of times the pixel 43 to which the value of the identification symbol is assigned is continuous in the y direction.
如第15圖B所示,以y方向壓縮資料46(第16圖)定義之圖案的外形56與以x方向變形修正資料定義之圖案的外形53相同。將以y方向壓縮資料46定義之圖案的外形56內的區域重新區分成複數個校正單位區域 41。As shown in Fig. 15B, the outer shape 56 of the pattern defined by the compressed data 46 (Fig. 16) in the y direction is the same as the outer shape 53 of the pattern defined by the x-direction deformation correction data. The area within the outline 56 of the pattern defined by the compressed data 46 in the y direction is re-divided into a plurality of correction unit areas. 41.
如第17圖所示,按校正單位區域41,根據y方向的變形量對y方向壓縮資料46(第16圖B)進行像素的插入及去除處理。該處理與像素相對於對實施例1的第8圖A及第8圖B所示之x方向壓縮資料45的插入及去除處理相同。如實施例1的第11圖A及第11圖B所示,重新建立進行像素的插入及去除的校正單位區域41。沿重新建立校正單位區域41之圖案的外形57沿x方向延伸之緣部無法成為相對於x軸平行之1條直線。As shown in Fig. 17, in the correction unit area 41, the pixel insertion and removal processing is performed on the y-direction compressed material 46 (Fig. 16B) based on the amount of deformation in the y direction. This processing is the same as the insertion and removal processing of the pixel with respect to the x-direction compressed material 45 shown in FIGS. 8A and 8B of the first embodiment. As shown in FIG. 11 and FIG. 11B of the first embodiment, the correction unit area 41 for performing pixel insertion and removal is newly established. The edge portion extending in the x direction along the outer shape 57 of the pattern in which the correction unit area 41 is newly established cannot be a straight line parallel to the x-axis.
在重新建立之圖案的外形57沿x方向延伸之緣部的外側的區域58插入“W”像素。對重新建立之圖案的外形57與區域58進行合成之區域的外形成為長方形。藉由在區域58插入“W”像素得到xy方向變形修正資料。A "W" pixel is inserted in a region 58 outside the edge portion of the reshaped pattern 57 that extends in the x direction. The outer shape of the region where the outer shape 57 and the region 58 of the re-established pattern are combined is a rectangle. The xy direction deformation correction data is obtained by inserting a "W" pixel in the area 58.
根據xy方向變形修正資料,在已發生變形之基板27(第4圖)上形成薄膜。實施例2中,在y方向上進行與x方向相同的變形校正處理。在實施例2中,亦能夠與實施例1相同地縮短為緩和基板27(第4圖)的變形的影響所需之處理時間。The film is formed on the deformed substrate 27 (Fig. 4) based on the xy direction deformation correction data. In the second embodiment, the same distortion correction processing as in the x direction is performed in the y direction. Also in the second embodiment, the processing time required to alleviate the influence of the deformation of the substrate 27 (Fig. 4) can be shortened in the same manner as in the first embodiment.
第18圖中示出根據實施例3之基板製造裝置的載物台22及噴嘴單元30的平面圖。以下對與實施例1的不同點進行說明,關於相同的結構省略說明。根據實施例3之基板製造裝置具有對噴嘴單元30的姿勢進行調整,以使 噴嘴孔37的排列方向改變之姿勢調整機構80。若將噴嘴孔37的排列方向相對於x方向傾斜,則噴嘴孔37的間距的x方向成份產生變化。在載物台22的上方保持有基板27。Fig. 18 is a plan view showing the stage 22 and the nozzle unit 30 of the substrate manufacturing apparatus according to the third embodiment. The differences from the first embodiment will be described below, and the description of the same configurations will be omitted. The substrate manufacturing apparatus according to Embodiment 3 has an adjustment to the posture of the nozzle unit 30 so that The posture adjustment mechanism 80 in which the arrangement direction of the nozzle holes 37 is changed. When the arrangement direction of the nozzle holes 37 is inclined with respect to the x direction, the component of the x-direction of the pitch of the nozzle holes 37 changes. A substrate 27 is held above the stage 22 .
控制裝置70根據基板27在x方向上的變形量,使噴嘴單元30的姿勢改變成噴嘴孔37的排列方向相對於x方向傾斜。藉由該姿勢變化,噴嘴孔37的間距的x成份根據變形量改變。其結果,能夠緩和基板27在x方向上的變形的影響。The control device 70 changes the posture of the nozzle unit 30 so that the arrangement direction of the nozzle holes 37 is inclined with respect to the x direction in accordance with the amount of deformation of the substrate 27 in the x direction. By this posture change, the x component of the pitch of the nozzle holes 37 is changed in accordance with the amount of deformation. As a result, the influence of the deformation of the substrate 27 in the x direction can be alleviated.
根據以上實施例對本發明進行了說明,但本發明並不限定於此,例如本領域技術人員顯然可知能夠例如進行各種改變、改良、組合等。The present invention has been described based on the above embodiments, but the present invention is not limited thereto, and it is obvious to those skilled in the art that various changes, improvements, combinations, and the like can be made, for example.
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