JP6191557B2 - 電子部品の製造方法 - Google Patents
電子部品の製造方法 Download PDFInfo
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- JP6191557B2 JP6191557B2 JP2014168325A JP2014168325A JP6191557B2 JP 6191557 B2 JP6191557 B2 JP 6191557B2 JP 2014168325 A JP2014168325 A JP 2014168325A JP 2014168325 A JP2014168325 A JP 2014168325A JP 6191557 B2 JP6191557 B2 JP 6191557B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 238000005520 cutting process Methods 0.000 claims description 121
- 239000004020 conductor Substances 0.000 claims description 25
- 238000010030 laminating Methods 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 45
- 238000000034 method Methods 0.000 description 33
- 238000012545 processing Methods 0.000 description 17
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 11
- 230000004048 modification Effects 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000005187 foaming Methods 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000003985 ceramic capacitor Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910002367 SrTiO Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- -1 rare earth compound Chemical class 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49075—Electromagnet, transformer or inductor including permanent magnet or core
- Y10T29/49078—Laminated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49789—Obtaining plural product pieces from unitary workpiece
- Y10T29/49798—Dividing sequentially from leading end, e.g., by cutting or breaking
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Thermistors And Varistors (AREA)
- Coils Or Transformers For Communication (AREA)
Description
セラミック層150を構成する材料としては、BaTiO3、CaTiO3、SrTiO3またはCaZrO3などを主成分とする誘電体セラミックスを用いることができる。また、これらの主成分に、副成分として、Mn化合物、Co化合物、Si化合物または希土類化合物などが添加された材料を用いてもよい。
まず、セラミック粉末を含むセラミックペーストを、ダイコータ法、グラビアコータ法またはマイクログラビアコータ法などによりシート状に塗布して乾燥させることにより、セラミックグリーンシートを作製する。
ブロックの歪み量においては、マザーブロック、マザーブロックを2分割して作製された中間ブロック、および、マザーブロックを3分割して作製された中間ブロックの、各ブロックの25箇所について測定した。
Claims (3)
- 内部導体が埋設された素体と、該素体の表面上に設けられて前記内部導体に電気的に接続された外部電極とを備える電子部品の製造方法であって、
前記素体となる複数のグリーンシートが積層されて構成された第1ブロックを準備する工程と、
前記内部導体において前記外部電極と接続される部分が切断面に露出するように前記第1ブロックを第1の方向に切断して複数の第2ブロックに分割する工程と、
前記複数の第2ブロックの各々にて、両方の前記第1の方向の前記切断面を撮像して露出している前記内部導体を検出し、検出した前記内部導体の位置に基づいて、両方の前記第1の方向の前記切断面に露出した前記内部導体が前記第1の方向において各前記素体となる部分の中央に位置するように、かつ、前記内部導体が前記第1の方向と交差する第2の方向の切断面に露出しないように、前記第2ブロックを前記第2の方向に切断する工程とを備える、電子部品の製造方法。 - 前記第2ブロックに分割する工程にて、前記第1の方向において前記第2ブロックに前記素体となる部分が1列に並ぶように前記第1ブロックを切断し、
前記第2の方向に切断する工程にて前記素体となる部分を個片化する、請求項1に記載の電子部品の製造方法。 - 前記第2ブロックに分割する工程にて、前記第1の方向において前記第2ブロックに前記素体となる部分が複数列で並ぶように前記第1ブロックを切断し、
前記複数の第2ブロックの各々を、前記第1の方向および前記第2の方向に切断して前記素体となる部分を個片化する、請求項1に記載の電子部品の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014168325A JP6191557B2 (ja) | 2013-10-25 | 2014-08-21 | 電子部品の製造方法 |
US14/509,495 US9576736B2 (en) | 2013-10-25 | 2014-10-08 | Method of manufacturing electronic component |
KR1020140139105A KR101709285B1 (ko) | 2013-10-25 | 2014-10-15 | 전자부품의 제조방법 |
CN201410578768.7A CN104576054B (zh) | 2013-10-25 | 2014-10-24 | 电子元器件的制造方法 |
Applications Claiming Priority (3)
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---|---|---|---|
JP2013222154 | 2013-10-25 | ||
JP2013222154 | 2013-10-25 | ||
JP2014168325A JP6191557B2 (ja) | 2013-10-25 | 2014-08-21 | 電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2015109413A JP2015109413A (ja) | 2015-06-11 |
JP6191557B2 true JP6191557B2 (ja) | 2017-09-06 |
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JP2014168325A Active JP6191557B2 (ja) | 2013-10-25 | 2014-08-21 | 電子部品の製造方法 |
Country Status (4)
Country | Link |
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US (1) | US9576736B2 (ja) |
JP (1) | JP6191557B2 (ja) |
KR (1) | KR101709285B1 (ja) |
CN (1) | CN104576054B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6855688B2 (ja) | 2016-05-19 | 2021-04-07 | 株式会社村田製作所 | グラビア印刷版、グラビア印刷方法および電子部品の製造方法 |
US11525739B2 (en) * | 2018-05-08 | 2022-12-13 | Texas Instruments Incorporated | Thermistor die-based thermal probe |
CN110379624B (zh) * | 2019-06-27 | 2021-08-03 | 成都宏科电子科技有限公司 | 一种多层芯片电容器的模块化制备方法 |
US20230320220A1 (en) | 2020-07-03 | 2023-10-05 | Kyocera Corporation | Piezoelectric element |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0655233U (ja) * | 1992-12-28 | 1994-07-26 | 京セラ株式会社 | チップ状電子部品 |
JP3531887B2 (ja) * | 1995-10-30 | 2004-05-31 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
JP2003039418A (ja) * | 2001-08-02 | 2003-02-13 | Matsushita Electric Ind Co Ltd | セラミック電子部品の製造方法 |
JP2003257782A (ja) * | 2002-02-27 | 2003-09-12 | Kyocera Corp | 積層セラミックコンデンサの製造方法 |
JP2003158376A (ja) * | 2002-09-02 | 2003-05-30 | Ibiden Co Ltd | セラミックス多層基板の製造方法 |
JP4311144B2 (ja) * | 2003-09-19 | 2009-08-12 | 株式会社村田製作所 | カット装置およびカット方法 |
JP4492138B2 (ja) * | 2004-01-30 | 2010-06-30 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
KR20090099275A (ko) * | 2008-03-17 | 2009-09-22 | 삼성전기주식회사 | 적층형 전자부품용 그린시트 및 이를 이용한 그린칩의제조방법 |
JP5429067B2 (ja) * | 2010-06-17 | 2014-02-26 | 株式会社村田製作所 | セラミック電子部品およびその製造方法 |
KR20130070098A (ko) | 2011-12-19 | 2013-06-27 | 삼성전기주식회사 | 적층 세라믹 전자부품의 제조방법 |
JP5590055B2 (ja) | 2012-02-13 | 2014-09-17 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法及び積層セラミックコンデンサ |
-
2014
- 2014-08-21 JP JP2014168325A patent/JP6191557B2/ja active Active
- 2014-10-08 US US14/509,495 patent/US9576736B2/en active Active
- 2014-10-15 KR KR1020140139105A patent/KR101709285B1/ko active IP Right Grant
- 2014-10-24 CN CN201410578768.7A patent/CN104576054B/zh active Active
Also Published As
Publication number | Publication date |
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JP2015109413A (ja) | 2015-06-11 |
KR20150048036A (ko) | 2015-05-06 |
US9576736B2 (en) | 2017-02-21 |
KR101709285B1 (ko) | 2017-02-22 |
CN104576054A (zh) | 2015-04-29 |
US20150113780A1 (en) | 2015-04-30 |
CN104576054B (zh) | 2017-11-14 |
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