TW588404B - Method for planarizing a semiconductor contactor - Google Patents

Method for planarizing a semiconductor contactor Download PDF

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Publication number
TW588404B
TW588404B TW091119279A TW91119279A TW588404B TW 588404 B TW588404 B TW 588404B TW 091119279 A TW091119279 A TW 091119279A TW 91119279 A TW91119279 A TW 91119279A TW 588404 B TW588404 B TW 588404B
Authority
TW
Taiwan
Prior art keywords
substrate
contact
space converter
base
probe card
Prior art date
Application number
TW091119279A
Other languages
English (en)
Chinese (zh)
Inventor
Gaetan L Mathieu
Benjamin N Eldridge
Gary W Grube
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27062552&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW588404(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US09/528,064 external-priority patent/US6509751B1/en
Application filed by Formfactor Inc filed Critical Formfactor Inc
Application granted granted Critical
Publication of TW588404B publication Critical patent/TW588404B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW091119279A 2000-03-17 2001-03-16 Method for planarizing a semiconductor contactor TW588404B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52793100A 2000-03-17 2000-03-17
US09/528,064 US6509751B1 (en) 2000-03-17 2000-03-17 Planarizer for a semiconductor contactor

Publications (1)

Publication Number Publication Date
TW588404B true TW588404B (en) 2004-05-21

Family

ID=27062552

Family Applications (2)

Application Number Title Priority Date Filing Date
TW091119279A TW588404B (en) 2000-03-17 2001-03-16 Method for planarizing a semiconductor contactor
TW090106263A TW588400B (en) 2000-03-17 2001-03-16 Apparatus for planarizing a semiconductor contactor

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW090106263A TW588400B (en) 2000-03-17 2001-03-16 Apparatus for planarizing a semiconductor contactor

Country Status (7)

Country Link
EP (1) EP1266230B1 (enExample)
JP (4) JP2003528459A (enExample)
KR (1) KR100459050B1 (enExample)
AU (1) AU2001250876A1 (enExample)
DE (1) DE60142030D1 (enExample)
TW (2) TW588404B (enExample)
WO (1) WO2001071779A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI512889B (zh) * 2009-03-27 2015-12-11 星科金朋有限公司 具有雙面連接之積體電路封裝系統及其製造方法

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2001250876A1 (en) * 2000-03-17 2001-10-03 Formfactor, Inc. Method and apparatus for planarizing a semiconductor contactor
US6965244B2 (en) 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
US6911835B2 (en) * 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
JP3621938B2 (ja) 2002-08-09 2005-02-23 日本電子材料株式会社 プローブカード
US7071715B2 (en) 2004-01-16 2006-07-04 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
JPWO2005083773A1 (ja) * 2004-02-27 2007-08-30 株式会社アドバンテスト プローブカード及びその製造方法
DE102004027887B4 (de) * 2004-05-28 2010-07-29 Feinmetall Gmbh Prüfeinrichtung zur elektrischen Prüfung eines Prüflings
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
DE112005003580B4 (de) * 2005-05-23 2013-05-16 Kabushiki Kaisha Nihon Micronics Sondenanordnung, Verfahren zu ihrer Herstellung und elektrische Verbindungsvorrichtung
JP4634867B2 (ja) 2005-06-03 2011-02-16 株式会社ミツトヨ 画像測定システム及び方法
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
JP4791473B2 (ja) 2005-08-02 2011-10-12 株式会社日本マイクロニクス 電気的接続装置
JP4642603B2 (ja) * 2005-08-25 2011-03-02 東京エレクトロン株式会社 プローブカード
DE112005003731B4 (de) 2005-10-24 2013-04-18 Kabushiki Kaisha Nihon Micronics Verfahren zur Montage einer elektrischen Verbindungsvorrichtung
US7671614B2 (en) * 2005-12-02 2010-03-02 Formfactor, Inc. Apparatus and method for adjusting an orientation of probes
JP5289771B2 (ja) 2005-12-05 2013-09-11 日本発條株式会社 プローブカード
JP4823667B2 (ja) 2005-12-05 2011-11-24 日本発條株式会社 プローブカード
US7365553B2 (en) 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
WO2007142204A1 (ja) * 2006-06-08 2007-12-13 Nhk Spring Co., Ltd. プローブカード
KR100821996B1 (ko) * 2006-09-08 2008-04-15 윌테크놀러지(주) 평탄도 조절 가능한 프로브 유닛
JP5190195B2 (ja) * 2006-11-29 2013-04-24 株式会社日本マイクロニクス 電気的接続装置
JP2008134170A (ja) * 2006-11-29 2008-06-12 Micronics Japan Co Ltd 電気的接続装置
JP2008216060A (ja) 2007-03-05 2008-09-18 Micronics Japan Co Ltd 電気的接続装置
US8456184B2 (en) 2007-03-14 2013-06-04 Nhk Spring Co., Ltd. Probe card for a semiconductor wafer
KR101242004B1 (ko) 2007-03-19 2013-03-11 (주) 미코티엔 프로브 카드
CN101583880B (zh) 2007-03-20 2011-05-18 日本麦可罗尼克斯股份有限公司 电连接装置
KR100806736B1 (ko) * 2007-05-11 2008-02-27 주식회사 에이엠에스티 프로브 카드 및 그 제조방법
KR100911661B1 (ko) * 2007-07-11 2009-08-10 (주)엠투엔 평탄화 수단을 구비한 프로브 카드
WO2009011365A1 (ja) 2007-07-19 2009-01-22 Nhk Spring Co., Ltd. プローブカード
JP4941169B2 (ja) * 2007-08-15 2012-05-30 横河電機株式会社 プローブカード機構
JP5326240B2 (ja) * 2007-08-24 2013-10-30 富士通株式会社 プローブボードおよび電子デバイスの検査方法
WO2009107747A1 (ja) 2008-02-29 2009-09-03 日本発條株式会社 配線基板およびプローブカード
KR100954451B1 (ko) * 2009-06-19 2010-04-27 박영주 반도체 웨이퍼 테스트용 프로브 카드의 평탄화 장치 및 평탄화 장치의 평탄 조절체 인서트 적층방법
DE202009014987U1 (de) * 2009-10-28 2010-02-18 Feinmetall Gmbh Prüfvorrichtung zur elektrischen Prüfung von elektrischen Prüflingen
KR101108726B1 (ko) * 2010-01-26 2012-02-29 삼성전기주식회사 수평도 조절부재
KR101148635B1 (ko) * 2011-07-25 2012-05-25 삼성전기주식회사 프로브 카드
US9341650B2 (en) 2012-01-18 2016-05-17 Nhk Spring Co., Ltd. Space transformer having a ceramic substrate with a wiring pattern for use in a probe card
JP5991823B2 (ja) * 2012-02-14 2016-09-14 株式会社日本マイクロニクス 電気的接続装置及びその組立方法
JP7618014B2 (ja) 2021-02-24 2025-01-20 株式会社アドバンテスト 半導体ウェハ試験装置、半導体ウェハ試験システム、平坦度測定装置、及び、配線板の平坦度の調整方法
JP2024017497A (ja) * 2022-07-28 2024-02-08 株式会社日本マイクロニクス 電気的接続装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07109471B2 (ja) * 1986-12-23 1995-11-22 株式会社コパル ストロボ発光制御方式
JPH0680716B2 (ja) * 1990-10-11 1994-10-12 日本電子材料株式会社 プローブカードの位置決め機構
US5094536A (en) * 1990-11-05 1992-03-10 Litel Instruments Deformable wafer chuck
JP2802849B2 (ja) * 1992-03-16 1998-09-24 日立電子エンジニアリング株式会社 プローブカードの反り補正機構
WO1996016440A1 (en) * 1994-11-15 1996-05-30 Formfactor, Inc. Interconnection elements for microelectronic components
JP2900240B2 (ja) * 1995-10-09 1999-06-02 日本電子材料株式会社 異方性導電シートの製造方法
JP2737774B2 (ja) * 1996-03-15 1998-04-08 日本電気株式会社 ウェハテスタ
JPH1031034A (ja) * 1996-07-17 1998-02-03 Denki Kagaku Kogyo Kk 平行度調整器付きプローブカード
JPH11163059A (ja) * 1997-11-25 1999-06-18 Yamamoto Isamu 集積回路用半導体薄板検査装置およびその検査方法
AU2001250876A1 (en) * 2000-03-17 2001-10-03 Formfactor, Inc. Method and apparatus for planarizing a semiconductor contactor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI512889B (zh) * 2009-03-27 2015-12-11 星科金朋有限公司 具有雙面連接之積體電路封裝系統及其製造方法

Also Published As

Publication number Publication date
EP1266230A2 (en) 2002-12-18
WO2001071779A3 (en) 2002-03-14
JP2005164600A (ja) 2005-06-23
KR100459050B1 (ko) 2004-12-03
TW588400B (en) 2004-05-21
EP1266230B1 (en) 2010-05-05
JP2006343350A (ja) 2006-12-21
JP2003528459A (ja) 2003-09-24
JP2005164601A (ja) 2005-06-23
DE60142030D1 (de) 2010-06-17
WO2001071779A2 (en) 2001-09-27
AU2001250876A1 (en) 2001-10-03
KR20020095151A (ko) 2002-12-20

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