KR100459050B1 - 반도체 접촉자를 평탄화하기 위한 방법 및 장치 - Google Patents

반도체 접촉자를 평탄화하기 위한 방법 및 장치 Download PDF

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Publication number
KR100459050B1
KR100459050B1 KR10-2002-7001511A KR20027001511A KR100459050B1 KR 100459050 B1 KR100459050 B1 KR 100459050B1 KR 20027001511 A KR20027001511 A KR 20027001511A KR 100459050 B1 KR100459050 B1 KR 100459050B1
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KR
South Korea
Prior art keywords
delete delete
substrate
probe card
region
control member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2002-7001511A
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English (en)
Korean (ko)
Other versions
KR20020095151A (ko
Inventor
매튜개탄엘.
엘드리지벤자민엔.
그루베게리더블유.
Original Assignee
폼팩터, 인크.
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27062552&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100459050(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US09/528,064 external-priority patent/US6509751B1/en
Application filed by 폼팩터, 인크. filed Critical 폼팩터, 인크.
Publication of KR20020095151A publication Critical patent/KR20020095151A/ko
Application granted granted Critical
Publication of KR100459050B1 publication Critical patent/KR100459050B1/ko
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR10-2002-7001511A 2000-03-17 2001-03-16 반도체 접촉자를 평탄화하기 위한 방법 및 장치 Expired - Fee Related KR100459050B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US52793100A 2000-03-17 2000-03-17
US09/528,064 2000-03-17
US09/528,064 US6509751B1 (en) 2000-03-17 2000-03-17 Planarizer for a semiconductor contactor
US09/527,931 2000-03-17

Publications (2)

Publication Number Publication Date
KR20020095151A KR20020095151A (ko) 2002-12-20
KR100459050B1 true KR100459050B1 (ko) 2004-12-03

Family

ID=27062552

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2002-7001511A Expired - Fee Related KR100459050B1 (ko) 2000-03-17 2001-03-16 반도체 접촉자를 평탄화하기 위한 방법 및 장치

Country Status (7)

Country Link
EP (1) EP1266230B1 (enExample)
JP (4) JP2003528459A (enExample)
KR (1) KR100459050B1 (enExample)
AU (1) AU2001250876A1 (enExample)
DE (1) DE60142030D1 (enExample)
TW (2) TW588404B (enExample)
WO (1) WO2001071779A2 (enExample)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
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WO2001071779A2 (en) * 2000-03-17 2001-09-27 Formfactor, Inc. Method and apparatus for planarizing a semiconductor contactor
US6911835B2 (en) 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
US6965244B2 (en) 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
JP3621938B2 (ja) 2002-08-09 2005-02-23 日本電子材料株式会社 プローブカード
US7071715B2 (en) 2004-01-16 2006-07-04 Formfactor, Inc. Probe card configuration for low mechanical flexural strength electrical routing substrates
WO2005083773A1 (ja) * 2004-02-27 2005-09-09 Advantest Corporation プローブカード及びその製造方法
DE102004027887B4 (de) * 2004-05-28 2010-07-29 Feinmetall Gmbh Prüfeinrichtung zur elektrischen Prüfung eines Prüflings
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
JP4704426B2 (ja) 2005-05-23 2011-06-15 株式会社日本マイクロニクス 電気的接続装置、その製造方法および電気的接続装置
JP4634867B2 (ja) 2005-06-03 2011-02-16 株式会社ミツトヨ 画像測定システム及び方法
US7471094B2 (en) * 2005-06-24 2008-12-30 Formfactor, Inc. Method and apparatus for adjusting a multi-substrate probe structure
JP4791473B2 (ja) 2005-08-02 2011-10-12 株式会社日本マイクロニクス 電気的接続装置
JP4642603B2 (ja) * 2005-08-25 2011-03-02 東京エレクトロン株式会社 プローブカード
WO2007046153A2 (ja) 2005-10-24 2007-04-26 Nihon Micronics Kk 電気的接続装置の組み立て方法
US7671614B2 (en) * 2005-12-02 2010-03-02 Formfactor, Inc. Apparatus and method for adjusting an orientation of probes
WO2007066622A1 (ja) 2005-12-05 2007-06-14 Nhk Spring Co., Ltd. プローブカード
JP4823667B2 (ja) 2005-12-05 2011-11-24 日本発條株式会社 プローブカード
US7365553B2 (en) * 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
CN101467051B (zh) 2006-06-08 2012-03-28 日本发条株式会社 探针卡
KR100821996B1 (ko) * 2006-09-08 2008-04-15 윌테크놀러지(주) 평탄도 조절 가능한 프로브 유닛
JP2008134170A (ja) * 2006-11-29 2008-06-12 Micronics Japan Co Ltd 電気的接続装置
JP5190195B2 (ja) * 2006-11-29 2013-04-24 株式会社日本マイクロニクス 電気的接続装置
JP2008216060A (ja) 2007-03-05 2008-09-18 Micronics Japan Co Ltd 電気的接続装置
EP2128630A4 (en) 2007-03-14 2014-05-14 Nhk Spring Co Ltd Probe card
KR101242004B1 (ko) 2007-03-19 2013-03-11 (주) 미코티엔 프로브 카드
KR101029697B1 (ko) 2007-03-20 2011-04-18 가부시키가이샤 니혼 마이크로닉스 전기적 접속장치
KR100806736B1 (ko) * 2007-05-11 2008-02-27 주식회사 에이엠에스티 프로브 카드 및 그 제조방법
KR100911661B1 (ko) * 2007-07-11 2009-08-10 (주)엠투엔 평탄화 수단을 구비한 프로브 카드
US8149008B2 (en) 2007-07-19 2012-04-03 Nhk Spring Co., Ltd. Probe card electrically connectable with a semiconductor wafer
JP4941169B2 (ja) * 2007-08-15 2012-05-30 横河電機株式会社 プローブカード機構
JP5326240B2 (ja) * 2007-08-24 2013-10-30 富士通株式会社 プローブボードおよび電子デバイスの検査方法
EP2249167A4 (en) 2008-02-29 2014-05-21 Nhk Spring Co Ltd WIRING PLATE AND NEEDLE CARD
US7923290B2 (en) * 2009-03-27 2011-04-12 Stats Chippac Ltd. Integrated circuit packaging system having dual sided connection and method of manufacture thereof
KR100954451B1 (ko) * 2009-06-19 2010-04-27 박영주 반도체 웨이퍼 테스트용 프로브 카드의 평탄화 장치 및 평탄화 장치의 평탄 조절체 인서트 적층방법
DE202009014987U1 (de) * 2009-10-28 2010-02-18 Feinmetall Gmbh Prüfvorrichtung zur elektrischen Prüfung von elektrischen Prüflingen
KR101108726B1 (ko) * 2010-01-26 2012-02-29 삼성전기주식회사 수평도 조절부재
KR101148635B1 (ko) * 2011-07-25 2012-05-25 삼성전기주식회사 프로브 카드
WO2013108759A1 (ja) 2012-01-18 2013-07-25 日本発條株式会社 スペーストランスフォーマおよびプローブカード
JP5991823B2 (ja) * 2012-02-14 2016-09-14 株式会社日本マイクロニクス 電気的接続装置及びその組立方法
WO2022180700A1 (ja) 2021-02-24 2022-09-01 株式会社アドバンテスト 半導体ウェハ試験装置、半導体ウェハ試験システム、平坦度測定装置、及び、配線板の平坦度の調整方法
JP2024017497A (ja) * 2022-07-28 2024-02-08 株式会社日本マイクロニクス 電気的接続装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07109471B2 (ja) * 1986-12-23 1995-11-22 株式会社コパル ストロボ発光制御方式
JPH0680716B2 (ja) * 1990-10-11 1994-10-12 日本電子材料株式会社 プローブカードの位置決め機構
US5094536A (en) * 1990-11-05 1992-03-10 Litel Instruments Deformable wafer chuck
JP2802849B2 (ja) * 1992-03-16 1998-09-24 日立電子エンジニアリング株式会社 プローブカードの反り補正機構
DE69535629T2 (de) * 1994-11-15 2008-07-31 Formfactor, Inc., Livermore Montage von elektronischen komponenten auf einer leiterplatte
JP2900240B2 (ja) * 1995-10-09 1999-06-02 日本電子材料株式会社 異方性導電シートの製造方法
JP2737774B2 (ja) * 1996-03-15 1998-04-08 日本電気株式会社 ウェハテスタ
JPH1031034A (ja) * 1996-07-17 1998-02-03 Denki Kagaku Kogyo Kk 平行度調整器付きプローブカード
JPH11163059A (ja) * 1997-11-25 1999-06-18 Yamamoto Isamu 集積回路用半導体薄板検査装置およびその検査方法
WO2001071779A2 (en) * 2000-03-17 2001-09-27 Formfactor, Inc. Method and apparatus for planarizing a semiconductor contactor

Also Published As

Publication number Publication date
WO2001071779A3 (en) 2002-03-14
JP2006343350A (ja) 2006-12-21
TW588404B (en) 2004-05-21
KR20020095151A (ko) 2002-12-20
EP1266230B1 (en) 2010-05-05
TW588400B (en) 2004-05-21
AU2001250876A1 (en) 2001-10-03
DE60142030D1 (de) 2010-06-17
JP2005164601A (ja) 2005-06-23
JP2003528459A (ja) 2003-09-24
WO2001071779A2 (en) 2001-09-27
JP2005164600A (ja) 2005-06-23
EP1266230A2 (en) 2002-12-18

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