WO2009011365A1 - プローブカード - Google Patents
プローブカード Download PDFInfo
- Publication number
- WO2009011365A1 WO2009011365A1 PCT/JP2008/062849 JP2008062849W WO2009011365A1 WO 2009011365 A1 WO2009011365 A1 WO 2009011365A1 JP 2008062849 W JP2008062849 W JP 2008062849W WO 2009011365 A1 WO2009011365 A1 WO 2009011365A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- interposer
- wiring board
- probe head
- wiring
- probe
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/452,716 US8149008B2 (en) | 2007-07-19 | 2008-07-16 | Probe card electrically connectable with a semiconductor wafer |
JP2009523661A JP5714817B2 (ja) | 2007-07-19 | 2008-07-16 | プローブカード |
CN200880025240XA CN101755216B (zh) | 2007-07-19 | 2008-07-16 | 探针卡 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-188546 | 2007-07-19 | ||
JP2007188546 | 2007-07-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009011365A1 true WO2009011365A1 (ja) | 2009-01-22 |
Family
ID=40259697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/062849 WO2009011365A1 (ja) | 2007-07-19 | 2008-07-16 | プローブカード |
Country Status (5)
Country | Link |
---|---|
US (1) | US8149008B2 (ja) |
JP (1) | JP5714817B2 (ja) |
CN (1) | CN101755216B (ja) |
TW (1) | TWI394953B (ja) |
WO (1) | WO2009011365A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI493195B (zh) * | 2013-11-04 | 2015-07-21 | Via Tech Inc | 探針卡 |
EP2587267A4 (en) * | 2010-06-25 | 2015-09-02 | Nhk Spring Co Ltd | CONTACT PROBE AND PROBE UNIT |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY147876A (en) * | 2005-12-05 | 2013-01-31 | Nhk Spring Co Ltd | Probe card |
JP5426365B2 (ja) * | 2007-03-14 | 2014-02-26 | 日本発條株式会社 | プローブカード |
US8970242B2 (en) * | 2008-09-30 | 2015-03-03 | Rohm Co, Ltd. | Method for manufacturing probe card, probe card, method for manufacturing semiconductor device, and method for forming probe |
KR101270591B1 (ko) * | 2011-06-02 | 2013-06-03 | (주)기가레인 | 프로브 카드 |
WO2013018809A1 (ja) * | 2011-08-02 | 2013-02-07 | 日本発條株式会社 | プローブユニット |
EP2765427B1 (en) * | 2011-10-07 | 2016-12-07 | NHK Spring Co., Ltd. | Probe unit |
KR101348204B1 (ko) * | 2012-12-28 | 2014-01-10 | 주식회사 아이에스시 | 테스트 소켓 및 소켓본체 |
JP6209376B2 (ja) * | 2013-07-08 | 2017-10-04 | 株式会社日本マイクロニクス | 電気的接続装置 |
CN103399225A (zh) * | 2013-07-26 | 2013-11-20 | 华进半导体封装先导技术研发中心有限公司 | 包含转接板的测试结构 |
KR102016427B1 (ko) | 2013-09-10 | 2019-09-02 | 삼성전자주식회사 | 포고 핀 및 이를 포함하는 프로브 카드 |
KR101738621B1 (ko) * | 2015-08-05 | 2017-06-09 | 주식회사 오킨스전자 | 보드 일체형 rf 인터포저 유닛 및 이의 설치방법 |
TWI663406B (zh) * | 2016-05-31 | 2019-06-21 | 巨擘科技股份有限公司 | 探針卡裝置 |
US10120020B2 (en) * | 2016-06-16 | 2018-11-06 | Formfactor Beaverton, Inc. | Probe head assemblies and probe systems for testing integrated circuit devices |
JP6855185B2 (ja) * | 2016-07-27 | 2021-04-07 | 株式会社日本マイクロニクス | 電気的接続装置 |
CN110462407B (zh) * | 2017-03-30 | 2022-03-11 | 日本发条株式会社 | 探针座及探针单元 |
IT201700051157A1 (it) * | 2017-05-11 | 2018-11-11 | Technoprobe Spa | Metodo di fabbricazione di un multistrato di una scheda di misura per un’apparecchiatura di test di dispositivi elettronici |
CN107389992A (zh) * | 2017-09-12 | 2017-11-24 | 洛阳冰岩激光设备有限公司 | 一种多功能自清洁探针板 |
CN110531125B (zh) * | 2018-05-23 | 2022-05-17 | 旺矽科技股份有限公司 | 空间转换器、探针卡及其制造方法 |
KR102228317B1 (ko) * | 2020-10-26 | 2021-03-16 | 주식회사 프로이천 | 웨이퍼 테스트용 프로브 카드 |
CN112462108A (zh) * | 2020-11-13 | 2021-03-09 | 上海华岭集成电路技术股份有限公司 | 一种新型探针卡装置 |
US11950378B2 (en) * | 2021-08-13 | 2024-04-02 | Harbor Electronics, Inc. | Via bond attachment |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006126279A1 (ja) * | 2005-05-23 | 2006-11-30 | Kabushiki Kaisha Nihon Micronics | プローブ組立体、その製造方法および電気的接続装置 |
JP2007003334A (ja) * | 2005-06-23 | 2007-01-11 | Micronics Japan Co Ltd | プローブ組立体およびこれを用いた電気的接続装置 |
WO2007015314A1 (ja) * | 2005-08-02 | 2007-02-08 | Kabushiki Kaisha Nihon Micronics | 電気的接続装置 |
WO2007046153A2 (ja) * | 2005-10-24 | 2007-04-26 | Nihon Micronics Kk | 電気的接続装置の組み立て方法 |
WO2007066622A1 (ja) * | 2005-12-05 | 2007-06-14 | Nhk Spring Co., Ltd. | プローブカード |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996038858A2 (en) | 1995-05-26 | 1996-12-05 | Formfactor, Inc. | Method and probe card for testing semiconductor devices |
WO1996016440A1 (en) | 1994-11-15 | 1996-05-30 | Formfactor, Inc. | Interconnection elements for microelectronic components |
DE60142030D1 (de) | 2000-03-17 | 2010-06-17 | Formfactor Inc | Verfahren und vorrichtung zum einebnen von einem halbleitersubstrat in einer testkartenanordnung |
US7307433B2 (en) * | 2004-04-21 | 2007-12-11 | Formfactor, Inc. | Intelligent probe card architecture |
KR101157449B1 (ko) * | 2004-07-07 | 2012-06-22 | 캐스케이드 마이크로테크 인코포레이티드 | 멤브레인 서스펜디드 프로브를 구비한 프로브 헤드 |
TWI294523B (en) * | 2004-07-28 | 2008-03-11 | Microelectonics Technology Inc | Integrated circuit probe card |
JP4823667B2 (ja) * | 2005-12-05 | 2011-11-24 | 日本発條株式会社 | プローブカード |
-
2008
- 2008-07-16 CN CN200880025240XA patent/CN101755216B/zh not_active Expired - Fee Related
- 2008-07-16 WO PCT/JP2008/062849 patent/WO2009011365A1/ja active Application Filing
- 2008-07-16 US US12/452,716 patent/US8149008B2/en not_active Expired - Fee Related
- 2008-07-16 JP JP2009523661A patent/JP5714817B2/ja not_active Expired - Fee Related
- 2008-07-18 TW TW097127267A patent/TWI394953B/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006126279A1 (ja) * | 2005-05-23 | 2006-11-30 | Kabushiki Kaisha Nihon Micronics | プローブ組立体、その製造方法および電気的接続装置 |
JP2007003334A (ja) * | 2005-06-23 | 2007-01-11 | Micronics Japan Co Ltd | プローブ組立体およびこれを用いた電気的接続装置 |
WO2007015314A1 (ja) * | 2005-08-02 | 2007-02-08 | Kabushiki Kaisha Nihon Micronics | 電気的接続装置 |
WO2007046153A2 (ja) * | 2005-10-24 | 2007-04-26 | Nihon Micronics Kk | 電気的接続装置の組み立て方法 |
WO2007066622A1 (ja) * | 2005-12-05 | 2007-06-14 | Nhk Spring Co., Ltd. | プローブカード |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2587267A4 (en) * | 2010-06-25 | 2015-09-02 | Nhk Spring Co Ltd | CONTACT PROBE AND PROBE UNIT |
US9404941B2 (en) | 2010-06-25 | 2016-08-02 | Nhk Spring Co., Ltd. | Contact probe and probe unit |
TWI493195B (zh) * | 2013-11-04 | 2015-07-21 | Via Tech Inc | 探針卡 |
Also Published As
Publication number | Publication date |
---|---|
CN101755216A (zh) | 2010-06-23 |
US8149008B2 (en) | 2012-04-03 |
CN101755216B (zh) | 2012-10-10 |
TWI394953B (zh) | 2013-05-01 |
JP5714817B2 (ja) | 2015-05-07 |
JPWO2009011365A1 (ja) | 2010-09-24 |
TW200912323A (en) | 2009-03-16 |
US20100219852A1 (en) | 2010-09-02 |
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