WO2012169831A3 - 칩 검사용 프로브 장치 - Google Patents

칩 검사용 프로브 장치 Download PDF

Info

Publication number
WO2012169831A3
WO2012169831A3 PCT/KR2012/004545 KR2012004545W WO2012169831A3 WO 2012169831 A3 WO2012169831 A3 WO 2012169831A3 KR 2012004545 W KR2012004545 W KR 2012004545W WO 2012169831 A3 WO2012169831 A3 WO 2012169831A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe apparatus
circuit board
printed circuit
testing
chips
Prior art date
Application number
PCT/KR2012/004545
Other languages
English (en)
French (fr)
Other versions
WO2012169831A2 (ko
Inventor
Shigeo SUDO (수도시게오)
Original Assignee
수도겐조
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 수도겐조 filed Critical 수도겐조
Priority to US14/123,928 priority Critical patent/US20150130490A1/en
Priority to JP2014514808A priority patent/JP5778338B2/ja
Publication of WO2012169831A2 publication Critical patent/WO2012169831A2/ko
Publication of WO2012169831A3 publication Critical patent/WO2012169831A3/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)

Abstract

반도체 칩의 품질을 검사하기 위한 프로브 장치에 관한 것으로，신뢰성과 내구성이 우수한 첩 검사용 프로브 장치에 관하여 개시한다. 본 발명은 중앙에 관통공을 구비하는 인쇄회로기판; 상기 인쇄회로기판의 전면에 부착되며 복수개의 핀홀을 구비하는 핀홀더; L자 형상으로 형성되어 수평단부는 상기 인쇄회로기판에 구비되는 회로패턴의 일측단부에 각각 연결되고, 수직단부는상기 핀홀의 상면으로 노출되는 복수개의 프로브핀;및 상기 인쇄회로기판의 배면에 부착되는 배면커버;를 포함하는 칩 검사용 프로브 장치를 제공한다.
PCT/KR2012/004545 2011-06-08 2012-06-08 칩 검사용 프로브 장치 WO2012169831A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US14/123,928 US20150130490A1 (en) 2011-06-08 2012-06-08 Probe apparatus for testing chips
JP2014514808A JP5778338B2 (ja) 2011-06-08 2012-06-08 チップ検査用プローブ装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0055126 2011-06-08
KR1020110055126A KR101270036B1 (ko) 2011-06-08 2011-06-08 칩 검사용 프로브 장치

Publications (2)

Publication Number Publication Date
WO2012169831A2 WO2012169831A2 (ko) 2012-12-13
WO2012169831A3 true WO2012169831A3 (ko) 2013-03-07

Family

ID=47296624

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/004545 WO2012169831A2 (ko) 2011-06-08 2012-06-08 칩 검사용 프로브 장치

Country Status (5)

Country Link
US (1) US20150130490A1 (ko)
JP (1) JP5778338B2 (ko)
KR (1) KR101270036B1 (ko)
TW (1) TWI486605B (ko)
WO (1) WO2012169831A2 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6107234B2 (ja) * 2013-03-01 2017-04-05 山一電機株式会社 検査用プローブ、および、それを備えるｉｃソケット
TWI495885B (zh) * 2013-08-20 2015-08-11 Chroma Ate Inc 半導體測試裝置
WO2019116512A1 (ja) * 2017-12-14 2019-06-20 オムロン株式会社 ソケット、検査治具、検査ユニットおよび検査装置
CN108107243B (zh) * 2017-12-26 2020-10-13 深圳市道格特科技有限公司 快速拆装探针卡
CN111511939B (zh) 2017-12-27 2021-09-14 株式会社德力本店 析出硬化型Ag-Pd-Cu-In-B系合金
JP2020034352A (ja) * 2018-08-28 2020-03-05 オムロン株式会社 プローブピン用ハウジング、検査治具、検査ユニットおよび検査装置
CN110752193A (zh) * 2019-10-30 2020-02-04 徐州恒永电子科技有限公司 电动车控制器mos管固定装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165056A (ja) * 1982-03-25 1983-09-30 Nippon Denshi Zairyo Kk プロ−ブカ−ド
JPH08321368A (ja) * 1996-07-05 1996-12-03 Enplas Corp Ｉｃソケット
KR19980087034A (ko) * 1997-05-15 1998-12-05 요시에이 하세가와 피검사체 시험용 보조장치
KR20100018181A (ko) * 2008-08-06 2010-02-17 윌테크놀러지(주) 프로브와 이를 포함하는 프로브 카드

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JPS5353265A (en) * 1976-10-26 1978-05-15 Citizen Watch Co Ltd Prober
JPS54143072A (en) * 1978-04-28 1979-11-07 Citizen Watch Co Ltd Prober
US4421118A (en) * 1981-08-12 1983-12-20 Smithkline Instruments, Inc. Ultrasonic transducer
JPS61180461A (ja) * 1985-02-06 1986-08-13 Kimito Horie Ｉｃカ−トリツジ及びｉｃカ−トリツジ用ソケツト
JP3095807B2 (ja) * 1991-05-22 2000-10-10 東京エレクトロン株式会社 半導体デバイスの検査装置
JPH0769251B2 (ja) * 1991-12-12 1995-07-26 株式会社東京カソード研究所 プローブカード検査方法
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JP4860242B2 (ja) * 2005-11-11 2012-01-25 東京エレクトロン株式会社 プローブ装置
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165056A (ja) * 1982-03-25 1983-09-30 Nippon Denshi Zairyo Kk プロ−ブカ−ド
JPH08321368A (ja) * 1996-07-05 1996-12-03 Enplas Corp Ｉｃソケット
KR19980087034A (ko) * 1997-05-15 1998-12-05 요시에이 하세가와 피검사체 시험용 보조장치
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Also Published As

Publication number Publication date
TWI486605B (zh) 2015-06-01
KR101270036B1 (ko) 2013-06-10
JP5778338B2 (ja) 2015-09-16
KR20120136109A (ko) 2012-12-18
WO2012169831A2 (ko) 2012-12-13
TW201250266A (en) 2012-12-16
US20150130490A1 (en) 2015-05-14
JP2014523527A (ja) 2014-09-11

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