TW201343020A - 焊盤加固印刷電路板 - Google Patents

焊盤加固印刷電路板 Download PDF

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Publication number
TW201343020A
TW201343020A TW101113967A TW101113967A TW201343020A TW 201343020 A TW201343020 A TW 201343020A TW 101113967 A TW101113967 A TW 101113967A TW 101113967 A TW101113967 A TW 101113967A TW 201343020 A TW201343020 A TW 201343020A
Authority
TW
Taiwan
Prior art keywords
pad
circuit board
pads
strenthen
print circuit
Prior art date
Application number
TW101113967A
Other languages
English (en)
Inventor
Hai-Dong Tang
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Publication of TW201343020A publication Critical patent/TW201343020A/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

本發明提供一焊盤加固的印刷電路板。該印刷電路板包括一第一表面及一第二表面，該第一表面包括至少一個第一焊盤，用於焊接電子元件，在第二表面上設置與該第一焊盤數量相同的第二焊盤，且每個第一焊盤對應一第二焊盤，形成一對焊盤，每對焊盤上設置至少一個電鍍孔，該電鍍孔連接該第一焊盤及第二焊盤。

Description

焊盤加固印刷電路板
本發明涉及一種焊盤加固的印刷電路板。
一般的電子元器件都通過焊盤（PAD）焊接在印刷電路板（PCB）上，但由於電子元器件突出於PCB，則焊接在PCB邊緣的元器件在產線轉運或組裝過程中，電子元器件容易被剮蹭到，則可能導致焊盤翹起甚至脫落而損壞PCB。
有鑒於此，故需要提供一種焊盤加固的電路板，可加固焊盤，防止焊盤受力翹起或脫落。
該印刷電路板包括一第一表面及一第二表面，該第一表面包括至少一個第一焊盤，用於焊接電子元件，在第二表面上設置與該第一焊盤數量相同的第二焊盤，且每個第一焊盤對應一第二焊盤，形成一對焊盤，每對焊盤上設置至少一個電鍍孔，該電鍍孔連接該第一焊盤及第二焊盤。
相較於現有技術，本發明通過在PCB焊盤所在面的背面設置一焊盤，並通過一電鍍孔將兩個焊盤連接起來，從而加固焊盤，防止焊盤翹起或脫落。
如圖1所示，一電路板1的第一表面10上設置有多個第一焊盤11，一電子元器件2的引腳21可焊接在該第一焊盤11上。本實施方式中，以三個焊盤11為例進行說明。
請同時參閱圖2，該電路板1的第一表面10的背面，即第二表面13上設置與該第一焊盤11數量相同的第二焊盤14，且每個第一焊盤11對應一第二焊盤14，形成一對焊盤。每對焊盤上設置至少一個電鍍孔15，該電鍍孔15連接該第一焊盤11及第二焊盤14，以加固該第一焊盤11。如此，在第一焊盤11受到焊接於其上的電子元器件2的拉力時，該第二焊盤14對第一焊盤11增加一牽引力，從而使第一焊盤11不容易翹起或脫落。本實施方式中，該第一焊盤11與該第二焊盤14大小相等，且位置相同。
1．．．印刷電路板
10．．．第一表面
11．．．第一焊盤
2．．．電子元器件
21．．．引腳
13．．．第二表面
14．．．第二焊盤
15．．．電鍍孔
圖1為本發明一實施方式中焊盤加固印刷電路板的俯視圖。
圖2為圖1所示電路板的剖視圖。
1．．．印刷電路板
10．．．第一表面
11．．．第一焊盤
2．．．電子元器件
21．．．引腳
13．．．第二表面
14．．．第二焊盤
15．．．電鍍孔

Claims (2)

  1. 一種印刷電路板，包括一第一表面及一第二表面，該第一表面包括至少一個第一焊盤，用於焊接電子元件，其改良在於，在第二表面上設置與該第一焊盤數量相同的第二焊盤，且每個第一焊盤對應一第二焊盤，形成一對焊盤，每對焊盤上設置至少一個電鍍孔，該電鍍孔連接該第一焊盤及第二焊盤。
  2. 如申請專利範圍第1項所述的印刷電路板，其特徵在於，該第一焊盤與該第二焊盤大小相等，且位置相同。
TW101113967A 2012-04-13 2012-04-19 焊盤加固印刷電路板 TW201343020A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210108032.4A CN103379732A (zh) 2012-04-13 2012-04-13 焊盘加固印刷电路板

Publications (1)

Publication Number Publication Date
TW201343020A true TW201343020A (zh) 2013-10-16

Family

ID=49324067

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101113967A TW201343020A (zh) 2012-04-13 2012-04-19 焊盤加固印刷電路板

Country Status (3)

Country Link
US (1) US20130269994A1 (zh)
CN (1) CN103379732A (zh)
TW (1) TW201343020A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9368427B2 (en) * 2013-02-01 2016-06-14 Mxtran Inc. Integrated circuit film and method of manufacturing the same
CN107548229B (zh) * 2016-06-27 2022-01-28 中兴通讯股份有限公司 Pcb及其制造方法
CN106102308B (zh) * 2016-06-28 2019-05-10 Oppo广东移动通信有限公司 移动终端的屏蔽支架的接地结构及移动终端
CN106376175A (zh) * 2016-08-31 2017-02-01 深圳天珑无线科技有限公司 印刷电路板及移动终端
CN107979914A (zh) * 2017-10-23 2018-05-01 努比亚技术有限公司 一种电路板及终端
CN110337177A (zh) * 2019-06-21 2019-10-15 广州金鹏源康精密电路股份有限公司 一种具有可承受高推力的焊盘的电路板及其制作方法

Also Published As

Publication number Publication date
US20130269994A1 (en) 2013-10-17
CN103379732A (zh) 2013-10-30

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