CN103379732A - 焊盘加固印刷电路板 - Google Patents

焊盘加固印刷电路板 Download PDF

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Publication number
CN103379732A
CN103379732A CN201210108032.4A CN201210108032A CN103379732A CN 103379732 A CN103379732 A CN 103379732A CN 201210108032 A CN201210108032 A CN 201210108032A CN 103379732 A CN103379732 A CN 103379732A
Authority
CN
China
Prior art keywords
pad
circuit board
printed circuit
pcb
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210108032.4A
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English (en)
Inventor
唐海东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201210108032.4A priority Critical patent/CN103379732A/zh
Priority to TW101113967A priority patent/TW201343020A/zh
Priority to US13/459,107 priority patent/US20130269994A1/en
Publication of CN103379732A publication Critical patent/CN103379732A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本发明提供一焊盘加固的印刷电路板。该印刷电路板包括一第一表面及一第二表面，该第一表面包括至少一个第一焊盘，用于焊接电子元件，在第二表面上设置与该第一焊盘数量相同的第二焊盘，且每个第一焊盘对应一第二焊盘，形成一对焊盘，每对焊盘上设置至少一个电镀孔，该电镀孔连接该第一焊盘及第二焊盘。使用本发明，可加固第一焊盘，防止第一焊盘翘起或脱落。

Description

焊盘加固印刷电路板
技术领域
本发明涉及一种焊盘加固的印刷电路板。
背景技术
一般的电子元器件都通过焊盘（PAD）焊接在印刷电路板（PCB）上，但由于电子元器件突出于PCB，则焊接在PCB边缘的元器件在产线转运或组装过程中，电子元器件容易被剐蹭到，则可能导致焊盘翘起甚至脱落而损坏PCB。
发明内容
有鉴于此，故需要提供一种焊盘加固的电路板，可加固焊盘，防止焊盘受力翘起或脱落。
该印刷电路板包括一第一表面及一第二表面，该第一表面包括至少一个第一焊盘，用于焊接电子元件，在第二表面上设置与该第一焊盘数量相同的第二焊盘，且每个第一焊盘对应一第二焊盘，形成一对焊盘，每对焊盘上设置至少一个电镀孔，该电镀孔连接该第一焊盘及第二焊盘。
相较于现有技术，本发明通过在PCB焊盘所在面的背面设置一焊盘，并通过一电镀孔将两个焊盘连接起来，从而加固焊盘，防止焊盘翘起或脱落。
附图说明
图1为本发明一实施方式中焊盘加固印刷电路板的俯视图。
图2为图1所示电路板的剖视图。
主要元件符号说明
印刷电路板 1
第一表面 10
第一焊盘 11
电子元器件 2
引脚 21
第二表面 13
第二焊盘 14
电镀孔 15
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
如图1所示，一电路板1的第一表面10上设置有多个第一焊盘11，一电子元器件2的引脚21可焊接在该第一焊盘11上。本实施方式中，以三个焊盘11为例进行说明。
请同时参阅图2，该电路板1的第一表面10的背面，即第二表面13上设置与该第一焊盘11数量相同的第二焊盘14，且每个第一焊盘11对应一第二焊盘14，形成一对焊盘。每对焊盘上设置至少一个电镀孔15，该电镀孔15连接该第一焊盘11及第二焊盘14，以加固该第一焊盘11。如此，在第一焊盘11受到焊接于其上的电子元器件2的拉力时，该第二焊盘14对第一焊盘11增加一牵引力，从而使第一焊盘11不容易翘起或脱落。本实施方式中，该第一焊盘11与该第二焊盘14大小相等，且位置相同。

Claims (2)

1.一种印刷电路板，该印刷电路板包括一第一表面及一第二表面，该第一表面包括至少一个第一焊盘，用于焊接电子元件，其特征在于，在第二表面上设置与该第一焊盘数量相同的第二焊盘，且每个第一焊盘对应一第二焊盘，形成一对焊盘，每对焊盘上设置至少一个电镀孔，该电镀孔连接该第一焊盘及第二焊盘。
2.如权利要求1所述的印刷电路板，其特征在于，该第一焊盘与该第二焊盘大小相等，且位置相同。
CN201210108032.4A 2012-04-13 2012-04-13 焊盘加固印刷电路板 Pending CN103379732A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201210108032.4A CN103379732A (zh) 2012-04-13 2012-04-13 焊盘加固印刷电路板
TW101113967A TW201343020A (zh) 2012-04-13 2012-04-19 焊盤加固印刷電路板
US13/459,107 US20130269994A1 (en) 2012-04-13 2012-04-28 Printed circuit board with strengthened pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210108032.4A CN103379732A (zh) 2012-04-13 2012-04-13 焊盘加固印刷电路板

Publications (1)

Publication Number Publication Date
CN103379732A true CN103379732A (zh) 2013-10-30

Family

ID=49324067

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210108032.4A Pending CN103379732A (zh) 2012-04-13 2012-04-13 焊盘加固印刷电路板

Country Status (3)

Country Link
US (1) US20130269994A1 (zh)
CN (1) CN103379732A (zh)
TW (1) TW201343020A (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106102308A (zh) * 2016-06-28 2016-11-09 广东欧珀移动通信有限公司 移动终端的屏蔽支架的接地结构及移动终端
CN106376175A (zh) * 2016-08-31 2017-02-01 深圳天珑无线科技有限公司 印刷电路板及移动终端
CN107548229A (zh) * 2016-06-27 2018-01-05 中兴通讯股份有限公司 Pcb及其制造方法
CN107979914A (zh) * 2017-10-23 2018-05-01 努比亚技术有限公司 一种电路板及终端
CN110337177A (zh) * 2019-06-21 2019-10-15 广州金鹏源康精密电路股份有限公司 一种具有可承受高推力的焊盘的电路板及其制作方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9368427B2 (en) * 2013-02-01 2016-06-14 Mxtran Inc. Integrated circuit film and method of manufacturing the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107548229A (zh) * 2016-06-27 2018-01-05 中兴通讯股份有限公司 Pcb及其制造方法
CN107548229B (zh) * 2016-06-27 2022-01-28 中兴通讯股份有限公司 Pcb及其制造方法
CN106102308A (zh) * 2016-06-28 2016-11-09 广东欧珀移动通信有限公司 移动终端的屏蔽支架的接地结构及移动终端
CN106102308B (zh) * 2016-06-28 2019-05-10 Oppo广东移动通信有限公司 移动终端的屏蔽支架的接地结构及移动终端
CN106376175A (zh) * 2016-08-31 2017-02-01 深圳天珑无线科技有限公司 印刷电路板及移动终端
CN107979914A (zh) * 2017-10-23 2018-05-01 努比亚技术有限公司 一种电路板及终端
CN110337177A (zh) * 2019-06-21 2019-10-15 广州金鹏源康精密电路股份有限公司 一种具有可承受高推力的焊盘的电路板及其制作方法

Also Published As

Publication number Publication date
TW201343020A (zh) 2013-10-16
US20130269994A1 (en) 2013-10-17

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Application publication date: 20131030