WO2016041455A1 - 一种基带处理单元 - Google Patents

一种基带处理单元 Download PDF

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Publication number
WO2016041455A1
WO2016041455A1 PCT/CN2015/089186 CN2015089186W WO2016041455A1 WO 2016041455 A1 WO2016041455 A1 WO 2016041455A1 CN 2015089186 W CN2015089186 W CN 2015089186W WO 2016041455 A1 WO2016041455 A1 WO 2016041455A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
pad
optical port
optical
cage
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PCT/CN2015/089186
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English (en)
French (fr)
Inventor
罗贻静
章浩亮
张影
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华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP15842313.7A priority Critical patent/EP3174366B1/en
Publication of WO2016041455A1 publication Critical patent/WO2016041455A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
    • H04W88/08—Access point devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4278—Electrical aspects related to pluggable or demountable opto-electronic or electronic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present application relates to the field of communications technologies, and in particular, to a baseband processing unit.
  • the BBU baseband processing unit includes a PCB circuit board, an optical port cage for plugging the SFP optical module crimped on the PCB circuit board, and an SFP optical module inserted in the optical port cage.
  • the baseband processing unit When the baseband processing unit adopts the design method of the double-sided pair of calendering cages on the circuit board, the baseband processing unit has two optical port cages on the circuit board, and the two optical port cages are arranged along the thickness direction of the circuit board, and the above
  • the circuit board is located between the two optical port cages; each of the optical port cages is disposed at an edge of the circuit board, and each of the optical port cages is used for plugging the optical module into a socket, and the optical port cage is perpendicular to the circuit board.
  • each of the optical port cages is crimped into the crimping hole of the circuit board, and each optical port cage is inserted with an optical module, and the two optical modules are along the circuit board. Arranged in the thickness direction.
  • the thickness of the board of the circuit board is constant, the spacing between the two optical modules is small, and the operation space when the two optical modules are disassembled and assembled is small, in the case of a pair of optical modules.
  • the optical port cage is inserted and removed, there is a risk of mutual interference between the optical module and another optical module.
  • the present invention provides a baseband processing unit.
  • the baseband processing unit adopts a double-sided design of a light-receiving cage on a double-sided circuit board, and the two optical modules have a large disassembly and assembly operation space, which facilitates disassembly and assembly of the two optical modules. .
  • a baseband processing unit includes a circuit board, a first optical port cage, a second optical port cage, a first optical module, and a second optical module; the first optical port cage and the second light
  • the port cages are arranged along the thickness direction of the circuit board, and the first optical port cage and the second optical port cage are each provided with a plurality of pins; the second optical port cage is mounted on the circuit board;
  • the optical module is inserted into the first optical port cage, the second optical module is inserted into the second optical port cage, and the pull ring of the first optical module and the pull ring of the second optical module are Located on the same side of the circuit board; a side of the circuit board facing away from the second optical port cage is provided with a first pad, the first pad is fixed to the circuit board, and the first pad
  • the plate is provided with a crimping hole at the surface of the first pad facing away from the circuit board, and the pin of the first optical port cage is inserted into the crimping hole of the first pad.
  • the first pad is fixed to the circuit board, and specifically includes:
  • the first pad has a circuit board structure, and the first pad is soldered to the circuit board.
  • the first pad is soldered to the circuit board, and specifically includes:
  • a first pad is disposed on a side of the circuit board facing the first pad, and a second pad is disposed on a side of the first pad toward the circuit board; the circuit board and the first pad
  • the plates are soldered between the first pad and the second pad.
  • the circuit board has a crimping opening at a surface of the circuit board facing away from the first pad, the second optical port cage The pins are inserted into the crimping holes of the circuit board.
  • the thickness of the first pad is greater than or equal to the length of the pin of the first optical port cage; The thickness is greater than or equal to the length of the stitch of the second optical cage.
  • a side of the circuit board facing the first pad is a soldering surface of the circuit board, and the circuit board is away from the One side of the first pad is the mating face of the circuit board.
  • a side of the first pad toward the circuit board is a soldering surface of the first pad,
  • One side of the first pad facing away from the circuit board is a mating face of the first pad.
  • the fixing the first pad to the circuit board specifically includes:
  • the first pad is bonded to the circuit board.
  • the first possible aspect of the first aspect, the first possible implementation of the first aspect, the second possible implementation of the first aspect, the third possible implementation of the first aspect, and the fourth possible aspect of the first aspect The implementation of the first aspect, the fifth possible implementation of the first aspect, the sixth possible implementation of the first aspect, and the seventh possible implementation of the first aspect, in an eighth possible implementation manner,
  • the second optical port cage is mounted on the circuit board, and specifically includes:
  • a second backing plate is disposed on a side of the circuit board facing away from the first backing plate, the second backing plate is fixed to the circuit board, and the second backing plate has an opening at the backing of the backing plate a crimping hole on a surface of one side of the circuit board, and a pin of the second optical port cage is inserted into the crimping hole of the second pad.
  • the second pad is fixed to the circuit board, and specifically includes:
  • the second pad is bonded to the circuit board.
  • the first pad is disposed on a side of the circuit board facing away from the second optical port cage a pin of the first optical port is inserted into the crimping hole of the first pad, the first optical module is inserted into the first optical port cage, and the second optical module is inserted into the second optical port cage;
  • the portion of the circuit board for mounting the first optical port cage and the second optical port cage is locally thickened; therefore, the spacing between the first optical module and the second optical module can be made with a certain thickness of the circuit board. The detachment of the first optical module and the second optical module is facilitated, and the disassembly and assembly of the first optical module and the second optical module is facilitated.
  • FIG. 1 is a schematic structural diagram of a baseband processing unit according to an embodiment of the present application.
  • FIG. 2 is a schematic structural view of a circuit board in a baseband processing unit facing away from a first pad in a baseband processing unit according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural view of a circuit board facing a first pad in a baseband processing unit according to an embodiment of the present disclosure
  • FIG. 4 is a schematic structural view of a first pad in a baseband processing unit facing a circuit board according to an embodiment of the present disclosure
  • FIG. 5 is a schematic structural diagram of a first pad facing away from a circuit board in a baseband processing unit according to an embodiment of the present disclosure.
  • FIG. 1 is a schematic structural diagram of a baseband processing unit according to an embodiment of the present disclosure
  • FIG. 5 is a side view of a first backplane of a baseband processing unit according to an embodiment of the present application. Schematic diagram of the structure.
  • the baseband processing unit provided in this embodiment includes a circuit board 1, a first optical port cage 2, a second optical port cage 6, a first optical module 4, and a second optical module 5.
  • the first optical port cage 2 and the second optical port cage 6 are arranged along the thickness direction of the circuit board 1.
  • the first optical port cage 2 is provided with a plurality of pins 21
  • the second optical port cage 6 is provided with a plurality of pins 61; and the second optical port cage 6 is installed.
  • the first optical module 4 is inserted into the first optical port cage 2, and the second optical module 5 is The first optical module 4 is inserted into the second optical port cage 6 and the pull ring of the first optical module 4 and the pull ring of the second optical module 5 are located on the same side of the circuit board 1, as shown in FIG.
  • the pull ring and the pull ring of the second optical module 5 are located on the left side of the circuit board 1; the first backing plate 3 is disposed on the side of the circuit board 1 facing away from the second optical port cage 6, and the first backing plate 3 is fixed on the circuit board 1. As shown in FIG.
  • the first pad 3 is provided with a crimping hole 32 having an opening on a surface of the first pad 3 facing away from the circuit board 1, and the pin 21 of the first optical port cage 2 is inserted into the first pad.
  • the crimping hole 32 of the plate 3 is inside.
  • a first pad 3 is disposed on a side of the circuit board 1 facing away from the second optical port cage 6, and the pin 21 of the first optical port cage 2 is inserted into the crimping hole 32 of the first pad 3.
  • the first optical module 4 is inserted into the first optical port cage 2, and the second optical module 5 is inserted into the second optical port cage 6. Therefore, the first optical port cage 2 and the first board are installed in the circuit board 1.
  • the portion of the two-port cage 6 is locally thickened; therefore, the distance between the first optical module 4 and the second optical module 5 can be made larger when the thickness of the circuit board 1 is constant, thereby increasing the first
  • the disassembly and assembly space of the optical module 4 and the second optical module 5 facilitates disassembly and assembly of the first optical module 4 and the second optical module 5.
  • the circuit board 1 has a crimping hole 11 having an opening on a surface of the circuit board 1 facing away from the first pad 3, and a pin 61 of the second optical port cage 6 is inserted. Connected to the crimping hole 11 of the circuit board 1.
  • the thickness of the first pad 3 is greater than or equal to the length of the stitch 21 of the first optical cage 2; the thickness of the circuit board 1 is greater than or equal to the length of the stitch 61 of the second optical cage 6.
  • the stitch 21 of the first optical port cage 2 does not pass through the first pad 3, and at the same time, the stitch 61 of the second optical port cage 6 does not pass through the circuit board 1, and therefore, the first optical port cage 2 and the first
  • the side of the circuit board 1 facing away from the first optical port cage 2 may also be provided with a second pad, and the pin 61 of the second optical port cage 6 may be inserted into the circuit board 1 away from the first
  • the second pad disposed on one side of the optical cage 2 has a crimping hole (not shown); the baseband processing unit of the above structure can further increase the space between the first optical module 4 and the second optical module 5 Operating space.
  • the upper second pad and the circuit board 1 can be fixed by welding, and of course, can also be fixed by bonding, and will not be described again here.
  • connection between the first pad 3 and the circuit board 1 described above can also be implemented in various ways:
  • the first pad 3 disposed on the side of the circuit board 1 facing away from the second optical port cage 6 is fixed to the circuit board 1.
  • the method may include:
  • the first pad 3 has a circuit board structure, and the first pad 3 is soldered to the circuit board 1.
  • the first pad 12 is disposed on one side of the circuit board 1 facing the first pad 3
  • the second pad 3 is disposed on a side of the circuit board 1 .
  • the disk 31; the circuit board 1 and the first pad 3 are soldered by the first pad 12 and the second pad 31.
  • one side of the circuit board 1 facing the first pad 3 is the soldering surface of the circuit board 1.
  • the side of the circuit board 1 facing away from the first pad 3 is the mating surface of the circuit board 1.
  • the one side of the first pad 3 facing the circuit board 1 is the soldering surface of the first pad 3, and the side of the first pad 3 facing away from the circuit board 1 is the mating face of the first pad 3.
  • first pad 3 described above can also be bonded to the circuit board 1 to achieve a fixed connection between the first pad 3 and the circuit board 1.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

本申请涉及通信技术领域，公开一种基带处理单元，包括电路板、第一光口笼子、第二光口笼子、第一光模块和第二光模块；第一光口笼子和第二光口笼子沿电路板的厚度方向排列，第一光口笼子和第二光口笼子均设有多个针脚；第二光口笼子安装于电路板；第一光模块插接于第一光口笼子，第二光模块插接于第二光口笼子；电路板背离第二光口笼子的一侧设有第一垫板，第一垫板固定于电路板，且第一垫板设有开口位于第一垫板背离电路板一侧表面的压接孔，第一光口笼子的针脚插接于第一垫板的压接孔内。上述基带处理单元采用电路板双面对压光口笼子时两个光模块的拆装操作空间较大，便于实现对两个光模块的拆装。

Description

一种基带处理单元 技术领域
本申请涉及通信技术领域，特别涉及一种基带处理单元。
背景技术
在通信技术领域，BBU基带处理单元包括PCB电路板、压接在PCB电路板上的用于插接SFP光模块的光口笼子、插接在光口笼子中的SFP光模块。
当基带处理单元采用电路板双面对压光口笼子的设计方式时，基带处理单元具有的电路板上设有两个光口笼子，两个光口笼子沿电路板的厚度方向排列，且上述电路板位于两个光口笼子之间；每一个光口笼子设置于上述电路板的边缘处，且每一个光口笼子用于插接光模块的插接口位于光口笼子与电路板垂直的一个侧面上；每一个光口笼子通过压接的方式将其引脚插接在电路板的压接孔内，每一个光口笼子内插接有一个光模块，且两个光模块沿电路板的厚度方向排列。
现有技术中的基带处理单元中，由于电路板的板体厚度一定，导致两个光模块之间的间距很小，两个光模块拆装时的操作空间较小，在对一个光模块与光口笼子之间进行插拔时，该光模块与另一个光模块之间存在相互干涉的风险。
发明内容
本申请提供了一种基带处理单元，该基带处理单元采用电路板双面对压光口笼子的设计方式时两个光模块的拆装操作空间较大，便于实现对两个光模块的拆装。
第一方面，提供一种基带处理单元，包括电路板、第一光口笼子、第二光口笼子、第一光模块和第二光模块；所述第一光口笼子和所述第二光口笼子沿所述电路板的厚度方向排列，所述第一光口笼子和第二光口笼子均设有多个针脚；所述第二光口笼子安装于所述电路板；所述第一光模块插接于所述第一光口笼子，所述第二光模块插接于所述第二光口笼子，且所述第一光模块的拉环和所述第二光模块的拉环位于所述电路板的同一侧；所述电路板背离所述第二光口笼子的一侧设有第一垫板，所述第一垫板固定于所述电路板，且所述第一垫板设有开口位于所述第一垫板背离所述电路板一侧表面的压接孔，所述第一光口笼子的针脚插接于所述第一垫板的压接孔内。
结合上述第一方面，在第一种可能的实现方式中，所述第一垫板固定于所述电路板，具体包括：
所述第一垫板具有电路板结构，且所述第一垫板与所述电路板之间焊接。
结合上述第一方面的第一种可能的实现方式，在第二种可能的实现方式中，所述第一垫板与所述电路板之间焊接，具体包括：
所述电路板朝向所述第一垫板的一面设有第一焊盘，所述第一垫板朝向所述电路板的一面设有第二焊盘；所述电路板与所述第一垫板之间通过所述第一焊盘和所述第二焊盘焊接。
结合上述第一方面，在第三种可能的实现方式中，所述电路板具有开口位于所述电路板背离所述第一垫板一侧表面的压接孔，所述第二光口笼子的针脚插接于所述电路板的压接孔内。
结合上述第一方面的第三种可能的实现方式，在第四种可能的实现方式中，所述第一垫板的厚度大于等于所述第一光口笼子的针脚的长度；所述电路板的厚度大于等于所述第二光口笼子的针脚的长度。
结合上述第一方面的第一种可能的实现方式，在第五种可能的实现方式中，所述电路板朝向所述第一垫板的一面为电路板的焊接面，所述电路板背离所述第一垫板的一面为所述电路板的插接面。
结合上述第一方面的第五种可能的实现方式，在第六种可能的实现方式中，所述第一垫板朝向所述电路板的一面为所述第一垫板的焊接面，所述第一垫板背离所述电路板的一面为所述第一垫板的插接面。
结合上述第一方面，在第七种可能的实现方式中，所述第一垫板固定于所述电路板具体包括：
所述第一垫板与所述电路板粘接。
结合上述第一方面、第一方面的第一种可能的实现方式、第一方面的第二种可能的实现方式、第一方面的第三种可能的实现方式、第一方面的第四种可能的实现方式、第一方面的第五种可能的实现方式、第一方面的第六种可能的实现方式、第一方面的第七种可能的实现方式，在第八种可能的实现方式中，所述第二光口笼子安装于所述电路板，具体包括：
所述电路板背离所述第一垫板的一侧设有第二垫板，所述第二垫板固定于所述电路板，所述第二垫板具有开口位于所述垫板背离所述电路板一侧表面的压接孔，所述第二光口笼子的针脚插接于所述第二垫板的压接孔中。
结合上述第一方面的第八种可能的实现方式，在第九种可能的实现方式中，所述第二垫板固定于所述电路板，具体包括：
所述第二垫板与所述电路板焊接；或者，
所述第二垫板与所述电路板粘结。
上述第一方面提供的基带处理单元中，电路板背离第二光口笼子的一侧设有第一垫 板，第一光口笼子的针脚插接于第一垫板的压接孔中，第一光模块插接于第一光口笼子，第二光模块插接于第二光口笼子；因此，电路板中用于安装第一光口笼子和第二光口笼子的部位得到局部加厚；因此，在电路板的厚度一定的情况下能够使第一光模块与第二光模块之间的间距较大，进而增大了第一光模块和第二光模块的拆装空间，便于实现对第一光模块以及第二光模块的拆装。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本申请一种实施例提供的基带处理单元的结构示意图；
图2为本申请一种实施例提供的基带处理单元中电路板背离第一垫板一侧的结构示意图；
图3为本申请一种实施例提供的基带处理单元中电路板朝向第一垫板一侧的结构示意图；
图4为本申请一种实施例提供的基带处理单元中第一垫板朝向电路板一侧的结构示意图；
图5为本申请一种实施例提供的基带处理单元中第一垫板背离电路板一侧的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参考图1和图5，图1为本申请一种实施例提供的基带处理单元的结构示意图；图5为本申请一种实施例提供的基带处理单元中第一垫板背离电路板一侧的结构示意图。
如图1所示，本实施例提供的基带处理单元包括电路板1、第一光口笼子2、第二光口笼子6、第一光模块4和第二光模块5；第一光口笼子2和第二光口笼子6沿电路板1的厚度方向排列，第一光口笼子2设有多个针脚21，第二光口笼子6设有多个针脚61；第二光口笼子6安装于电路板1；第一光模块4插接于第一光口笼子2内，第二光模块5 插接于第二光口笼子6内，且第一光模块4的拉环和第二光模块5的拉环位于电路板1的同一侧，如图1中所示方位，第一光模块4的拉环和第二光模块5的拉环位于电路板1的左侧；电路板1背离第二光口笼子6的一侧设有第一垫板3，第一垫板3固定于电路板1，如图5所示，第一垫板3设有开口位于第一垫板3背离电路板1一侧表面的压接孔32，第一光口笼子2的针脚21插接于第一垫板3的压接孔32内。
上述基带处理单元中，电路板1背离第二光口笼子6的一侧设有第一垫板3，第一光口笼子2的针脚21插接于第一垫板3的压接孔32中，第一光模块4插接于第一光口笼子2内，第二光模块5插接于第二光口笼子6内；因此，电路板1中用于安装第一光口笼子2和第二光口笼子6的部位得到局部加厚；因此，在电路板1的厚度一定的情况下能够使第一光模块4与第二光模块5之间的间距较大，进而增大了第一光模块4和第二光模块5的拆装空间，便于实现对第一光模块4以及第二光模块5的拆装。
如图1和图2所示，一种优选实施方式中，电路板1具有开口位于电路板1背离第一垫板3一侧表面的压接孔11，第二光口笼子6的针脚61插接于电路板1的压接孔11内。
优选地，第一垫板3的厚度大于等于第一光口笼子2的针脚21的长度；电路板1的厚度大于等于第二光口笼子6的针脚61的长度。这样，第一光口笼子2的针脚21不会透过第一垫板3，同时，第二光口笼子6的针脚61不会透过电路板1，因此，第一光口笼子2和第二光口笼子6在安装时，第一光口笼子2的针脚21与第二光口笼子6的针脚61之间不会产生干涉，无需设置避让位置。
当然，上述基带处理单元中，电路板1背离第一光口笼子2的一侧也可以设置有第二垫板，而第二光口笼子6的针脚61可以插接到电路板1背离第一光口笼子2一侧设置的第二垫板具有的压接孔内(图中未示出)；上述结构的基带处理单元能够进一步增大第一光模块4和第二光模块5之间的操作空间。
上第二垫板与电路板1之间可以通过焊接方式固定，当然还可以通过粘接方式固定，这里不再赘述。
当然，上述第一垫板3与电路板1之间的连接也可以有多种方式实现：
一种优选实施方式中，电路板1背离第二光口笼子6的一侧设置的第一垫板3固定于电路板1，具体可以包括：
第一垫板3具有电路板结构，且第一垫板3与电路板1之间焊接。
具体地，如图1、图3和图4所示，电路板1朝向第一垫板3的一面设有第一焊盘12，第一垫板3朝向电路板1的一面设有第二焊盘31；电路板1与第一垫板3之间通过第一焊盘12和第二焊盘31焊接。
一种优选实施方式中，电路板1朝向第一垫板3的一面为电路板1的焊接面，电路板1背离第一垫板3的一面为电路板1的插接面。
同时，当第一垫板3具有电路板结构时：
第一垫板3朝向电路板1的一面为第一垫板3的焊接面，第一垫板3背离电路板1的一面为第一垫板3的插接面。
当然，上述第一垫板3还可以与电路板1之间粘接，以实现第一垫板3与电路板1之间的固定连接。
显然，本领域的技术人员可以对本申请实施例进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (10)

  1. 一种基带处理单元，包括电路板、第一光口笼子、第二光口笼子、第一光模块和第二光模块；所述第一光口笼子和所述第二光口笼子沿所述电路板的厚度方向排列，所述第一光口笼子和第二光口笼子均设有多个针脚；所述第二光口笼子安装于所述电路板；所述第一光模块插接于所述第一光口笼子，所述第二光模块插接于所述第二光口笼子，且所述第一光模块的拉环和所述第二光模块的拉环位于所述电路板的同一侧；其特征在于，所述电路板背离所述第二光口笼子的一侧设有第一垫板，所述第一垫板固定于所述电路板，且所述第一垫板设有开口位于所述第一垫板背离所述电路板一侧表面的压接孔，所述第一光口笼子的针脚插接于所述第一垫板的压接孔内。
  2. 根据权利要求1所述的基带处理单元，其特征在于，所述第一垫板固定于所述电路板，具体包括：
    所述第一垫板具有电路板结构，且所述第一垫板与所述电路板之间焊接。
  3. 根据权利要求2所述的基带处理单元，其特征在于，所述第一垫板与所述电路板之间焊接，具体包括：
    所述电路板朝向所述第一垫板的一面设有第一焊盘，所述第一垫板朝向所述电路板的一面设有第二焊盘；所述电路板与所述第一垫板之间通过所述第一焊盘和所述第二焊盘焊接。
  4. 根据权利要求1所述的基带处理单元，其特征在于，所述电路板具有开口位于所述电路板背离所述第一垫板一侧表面的压接孔，所述第二光口笼子的针脚插接于所述电路板的压接孔内。
  5. 根据权利要求4所述的基带处理单元，其特征在于，所述第一垫板的厚度大于等于所述第一光口笼子的针脚的长度；所述电路板的厚度大于等于所述第二光口笼子的针脚的长度。
  6. 根据权利要求2所述的基带处理单元，其特征在于，所述电路板朝向所述第一垫板的一面为电路板的焊接面，所述电路板背离所述第一垫板的一面为所述电路板的插接面。
  7. 根据权利要求6所述的基带处理单元，其特征在于，所述第一垫板朝向所述电路板的一面为所述第一垫板的焊接面，所述第一垫板背离所述电路板的一面为所述第一垫板的插接面。
  8. 根据权利要求1所述的基带处理单元，其特征在于，所述第一垫板固定于所述电路板具体包括：
    所述第一垫板与所述电路板粘接。
  9. 根据权利要求1～8任一项所述的基带处理单元，其特征在于，所述第二光口笼子安装于所述电路板，具体包括：
    所述电路板背离所述第一垫板的一侧设有第二垫板，所述第二垫板固定于所述电路板，所述第二垫板具有开口位于所述垫板背离所述电路板一侧表面的压接孔，所述第二光口笼子的针脚插接于所述第二垫板的压接孔中。
  10. 根据权利要求9所述的基带处理单元，其特征在于，所述第二垫板固定于所述电路板，具体包括：
    所述第二垫板与所述电路板焊接；或者，
    所述第二垫板与所述电路板粘结。
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