JP5778338B2 - チップ検査用プローブ装置 - Google Patents
チップ検査用プローブ装置 Download PDFInfo
- Publication number
- JP5778338B2 JP5778338B2 JP2014514808A JP2014514808A JP5778338B2 JP 5778338 B2 JP5778338 B2 JP 5778338B2 JP 2014514808 A JP2014514808 A JP 2014514808A JP 2014514808 A JP2014514808 A JP 2014514808A JP 5778338 B2 JP5778338 B2 JP 5778338B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- probe
- probe device
- chip inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
(b)は、両側に8個の接点を有しており、合計16個の接点を有するチップに対応したピンホールの配置を示したもので、
(c)は、四面に4個の接点を有しており、合計16個の接点を有するチップに対応したピンホールの配置を示したもので、
(d)は、四面に8個の接点を有しており、合計32個の接点を有するチップに対応したピンホールの配置を示したものである。
Claims (13)
- 中央に貫通孔を備える印刷回路基板;
前記印刷回路基板の前面に付着し、複数のピンホールを備えるピンホルダー;
垂直部と水平部がL字状に形成され、水平端部は前記印刷回路基板の前面に備えられる回路パターンの一側端部にそれぞれ連結され、垂直端部は前記ピンホールの上面に露出する複数のプローブピン;及び
前記印刷回路基板の背面に付着する背面カバー;を含み、
前記印刷回路基板と前記背面カバーとの間に離隔間隔が形成され、
前記プローブピンの垂直部は前記印刷回路基板の貫通孔を通過し、
前記プローブピンの水平部は前記印刷回路基板と前記背面カバーの間に配置され、
前記プローブピンの水平端部は、前記垂直部と同一の方向に折り曲げられて前記印刷回路基板に背面側から挿入されており、前記印刷回路基板の前面の前記回路パターンの一側端部に連結されることを特徴とするチップ検査用プローブ装置。 - 前記ピンホルダーと前記背面カバーは透明材質で形成されることを特徴とする、請求項1に記載のチップ検査用プローブ装置。
- 前記ピンホルダーはクリスタルガラス材質からなることを特徴とする、請求項2に記載のチップ検査用プローブ装置。
- 前記背面カバーは、静電気防止性能を有する透明合成樹脂材質からなることを特徴とする、請求項2に記載のチップ検査用プローブ装置。
- 前記ピンホルダーと前記背面カバーは着脱可能であることを特徴とする、請求項1に記載のチップ検査用プローブ装置。
- 前記プローブピンはベリリウム銅(BeCu)材質からなることを特徴とする、請求項1に記載のチップ検査用プローブ装置。
- 前記プローブピンの表面には銅めっき層、ニッケルめっき層、金めっき層が順次形成されていることを特徴とする、請求項6に記載のチップ検査用プローブ装置。
- 前記金めっき層の厚さは2μmないし4μmの範囲であることを特徴とする、請求項7に記載のチップ検査用プローブ装置。
- 前記チップ検査用プローブ装置は、
前記印刷回路基板の背面に結合される複数の支持台をさらに含むことを特徴とする、請求項1に記載のチップ検査用プローブ装置。 - 前記印刷回路基板と前記背面カバーとの間に離隔材を備えることを特徴とする、請求項1に記載のチップ検査用プローブ装置。
- 前記印刷回路基板の回路パターンの他側端部に連結されるアームコネクターをさらに含むことを特徴とする、請求項1に記載のチップ検査用プローブ装置。
- 前記アームコネクターは前記印刷回路基板の縁部に配列されることを特徴とする、請求項11に記載のチップ検査用プローブ装置。
- 前記印刷回路基板の回路パターンは、前記貫通孔の周辺から前記印刷回路基板の枠部まで形成されることを特徴とする、請求項1に記載のチップ検査用プローブ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2011-0055126 | 2011-06-08 | ||
KR1020110055126A KR101270036B1 (ko) | 2011-06-08 | 2011-06-08 | 칩 검사용 프로브 장치 |
PCT/KR2012/004545 WO2012169831A2 (ko) | 2011-06-08 | 2012-06-08 | 칩 검사용 프로브 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014523527A JP2014523527A (ja) | 2014-09-11 |
JP5778338B2 true JP5778338B2 (ja) | 2015-09-16 |
Family
ID=47296624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014514808A Expired - Fee Related JP5778338B2 (ja) | 2011-06-08 | 2012-06-08 | チップ検査用プローブ装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150130490A1 (ja) |
JP (1) | JP5778338B2 (ja) |
KR (1) | KR101270036B1 (ja) |
TW (1) | TWI486605B (ja) |
WO (1) | WO2012169831A2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6107234B2 (ja) * | 2013-03-01 | 2017-04-05 | 山一電機株式会社 | 検査用プローブ、および、それを備えるicソケット |
TWI495885B (zh) * | 2013-08-20 | 2015-08-11 | Chroma Ate Inc | 半導體測試裝置 |
WO2019116512A1 (ja) * | 2017-12-14 | 2019-06-20 | オムロン株式会社 | ソケット、検査治具、検査ユニットおよび検査装置 |
CN108107243B (zh) * | 2017-12-26 | 2020-10-13 | 深圳市道格特科技有限公司 | 快速拆装探针卡 |
CN111511939B (zh) | 2017-12-27 | 2021-09-14 | 株式会社德力本店 | 析出硬化型Ag-Pd-Cu-In-B系合金 |
JP2020034352A (ja) * | 2018-08-28 | 2020-03-05 | オムロン株式会社 | プローブピン用ハウジング、検査治具、検査ユニットおよび検査装置 |
CN110752193A (zh) * | 2019-10-30 | 2020-02-04 | 徐州恒永电子科技有限公司 | 电动车控制器mos管固定装置 |
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JPS5353265A (en) * | 1976-10-26 | 1978-05-15 | Citizen Watch Co Ltd | Prober |
JPS54143072A (en) * | 1978-04-28 | 1979-11-07 | Citizen Watch Co Ltd | Prober |
US4421118A (en) * | 1981-08-12 | 1983-12-20 | Smithkline Instruments, Inc. | Ultrasonic transducer |
JPS58165056A (ja) * | 1982-03-25 | 1983-09-30 | Nippon Denshi Zairyo Kk | プロ−ブカ−ド |
JPS61180461A (ja) * | 1985-02-06 | 1986-08-13 | Kimito Horie | Icカ−トリツジ及びicカ−トリツジ用ソケツト |
JP3095807B2 (ja) * | 1991-05-22 | 2000-10-10 | 東京エレクトロン株式会社 | 半導体デバイスの検査装置 |
JPH0769251B2 (ja) * | 1991-12-12 | 1995-07-26 | 株式会社東京カソード研究所 | プローブカード検査方法 |
JPH075228A (ja) * | 1993-06-18 | 1995-01-10 | Tokyo Electron Ltd | バーンインテスト用接触装置 |
US5977783A (en) * | 1994-10-28 | 1999-11-02 | Nitto Denko Corporation | Multilayer probe for measuring electrical characteristics |
JP2746869B2 (ja) * | 1996-07-05 | 1998-05-06 | 株式会社エンプラス | Icソケット |
JP3825527B2 (ja) * | 1997-03-27 | 2006-09-27 | 株式会社日本マイクロニクス | 平板状被検査体試験用ヘッド |
SG88739A1 (en) * | 1997-05-15 | 2002-05-21 | Nihon Micronics Kk | Auxiliary apparatus for testing device |
JPH11125646A (ja) * | 1997-10-21 | 1999-05-11 | Mitsubishi Electric Corp | 垂直針型プローブカード、その製造方法およびその不良プローブ針の交換方法 |
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JP2003322663A (ja) * | 2002-05-07 | 2003-11-14 | Rapiasu Denki Kk | プローブ及びプローブの製造方法 |
TW200525675A (en) * | 2004-01-20 | 2005-08-01 | Tokyo Electron Ltd | Probe guard |
KR100640632B1 (ko) * | 2005-01-29 | 2006-10-31 | 삼성전자주식회사 | 프로브 카드 및 그 제조방법 |
JP4860242B2 (ja) * | 2005-11-11 | 2012-01-25 | 東京エレクトロン株式会社 | プローブ装置 |
KR100847508B1 (ko) * | 2007-02-07 | 2008-07-21 | 윌테크놀러지(주) | 니들 및 이를 구비한 프로브 카드 |
JP2008268145A (ja) * | 2007-04-25 | 2008-11-06 | Micronics Japan Co Ltd | プローブ組立体 |
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SG171420A1 (en) * | 2008-11-26 | 2011-07-28 | Nhk Spring Co Ltd | Probe-unit base member and probe unit |
-
2011
- 2011-06-08 KR KR1020110055126A patent/KR101270036B1/ko active IP Right Grant
-
2012
- 2012-06-08 US US14/123,928 patent/US20150130490A1/en not_active Abandoned
- 2012-06-08 TW TW101120768A patent/TWI486605B/zh not_active IP Right Cessation
- 2012-06-08 JP JP2014514808A patent/JP5778338B2/ja not_active Expired - Fee Related
- 2012-06-08 WO PCT/KR2012/004545 patent/WO2012169831A2/ko active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2012169831A3 (ko) | 2013-03-07 |
TWI486605B (zh) | 2015-06-01 |
KR101270036B1 (ko) | 2013-06-10 |
KR20120136109A (ko) | 2012-12-18 |
WO2012169831A2 (ko) | 2012-12-13 |
TW201250266A (en) | 2012-12-16 |
US20150130490A1 (en) | 2015-05-14 |
JP2014523527A (ja) | 2014-09-11 |
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