IT201700051157A1 - Metodo di fabbricazione di un multistrato di una scheda di misura per un’apparecchiatura di test di dispositivi elettronici - Google Patents

Metodo di fabbricazione di un multistrato di una scheda di misura per un’apparecchiatura di test di dispositivi elettronici

Info

Publication number
IT201700051157A1
IT201700051157A1 IT102017000051157A IT201700051157A IT201700051157A1 IT 201700051157 A1 IT201700051157 A1 IT 201700051157A1 IT 102017000051157 A IT102017000051157 A IT 102017000051157A IT 201700051157 A IT201700051157 A IT 201700051157A IT 201700051157 A1 IT201700051157 A1 IT 201700051157A1
Authority
IT
Italy
Prior art keywords
multilayer
manufacturing
electronic device
measurement card
test device
Prior art date
Application number
IT102017000051157A
Other languages
English (en)
Original Assignee
Technoprobe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe Spa filed Critical Technoprobe Spa
Priority to IT102017000051157A priority Critical patent/IT201700051157A1/it
Priority to TW107115433A priority patent/TWI739003B/zh
Priority to EP18724192.2A priority patent/EP3622304B1/en
Priority to PCT/EP2018/061718 priority patent/WO2018206506A1/en
Priority to CN201880030578.8A priority patent/CN110612452B/zh
Priority to JP2019557554A priority patent/JP2020519860A/ja
Priority to KR1020197036292A priority patent/KR20200006095A/ko
Publication of IT201700051157A1 publication Critical patent/IT201700051157A1/it
Priority to US16/677,581 priority patent/US12019111B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
IT102017000051157A 2017-05-11 2017-05-11 Metodo di fabbricazione di un multistrato di una scheda di misura per un’apparecchiatura di test di dispositivi elettronici IT201700051157A1 (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
IT102017000051157A IT201700051157A1 (it) 2017-05-11 2017-05-11 Metodo di fabbricazione di un multistrato di una scheda di misura per un’apparecchiatura di test di dispositivi elettronici
TW107115433A TWI739003B (zh) 2017-05-11 2018-05-07 電子裝置的測試設備的探針卡的多層的製造方法
EP18724192.2A EP3622304B1 (en) 2017-05-11 2018-05-07 Method for producing a multi-layer of a probe card for a testing apparatus of electronic devices
PCT/EP2018/061718 WO2018206506A1 (en) 2017-05-11 2018-05-07 Method for producing a multi-layer of a probe card for a testing apparatus of electronic devices
CN201880030578.8A CN110612452B (zh) 2017-05-11 2018-05-07 用于电子器件的测试设备的探针卡多层结构的制造方法
JP2019557554A JP2020519860A (ja) 2017-05-11 2018-05-07 電子機器の試験装置のためのプローブカードの多層を製造する方法
KR1020197036292A KR20200006095A (ko) 2017-05-11 2018-05-07 전자 디바이스들의 테스트 장치를 위한 프로브 카드의 다-층을 제조하는 방법
US16/677,581 US12019111B2 (en) 2017-05-11 2019-11-07 Manufacturing method of a multi-layer for a probe card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102017000051157A IT201700051157A1 (it) 2017-05-11 2017-05-11 Metodo di fabbricazione di un multistrato di una scheda di misura per un’apparecchiatura di test di dispositivi elettronici

Publications (1)

Publication Number Publication Date
IT201700051157A1 true IT201700051157A1 (it) 2018-11-11

Family

ID=60020319

Family Applications (1)

Application Number Title Priority Date Filing Date
IT102017000051157A IT201700051157A1 (it) 2017-05-11 2017-05-11 Metodo di fabbricazione di un multistrato di una scheda di misura per un’apparecchiatura di test di dispositivi elettronici

Country Status (8)

Country Link
US (1) US12019111B2 (it)
EP (1) EP3622304B1 (it)
JP (1) JP2020519860A (it)
KR (1) KR20200006095A (it)
CN (1) CN110612452B (it)
IT (1) IT201700051157A1 (it)
TW (1) TWI739003B (it)
WO (1) WO2018206506A1 (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11023394B2 (en) * 2019-02-19 2021-06-01 Western Digital Technologies, Inc. Socket interconnector with compressible ball contacts for high pad count memory cards
TWI706139B (zh) * 2019-10-25 2020-10-01 巨擘科技股份有限公司 金屬探針結構及其製造方法
JP2022108835A (ja) * 2021-01-14 2022-07-27 株式会社日本マイクロニクス 電気的接続装置および電気的接続装置の製造方法
TWI829063B (zh) * 2021-12-30 2024-01-11 漢民測試系統股份有限公司 測試基板及其製造方法及探針卡

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008089461A (ja) * 2006-10-03 2008-04-17 Tohoku Univ 半導体集積回路検査用プローバ
US20080107863A1 (en) * 2006-11-03 2008-05-08 Ibiden Co., Ltd Multilayered printed wiring board
US20090051041A1 (en) * 2007-08-24 2009-02-26 Ngk Spark Plug Co., Ltd. Multilayer wiring substrate and method for manufacturing the same, and substrate for use in ic inspection device and method for manufacturing the same
US20090321114A1 (en) * 2008-06-30 2009-12-31 Hiroyuki Takahashi Electrical inspection substrate unit and manufacturing method therefore
JP2010054323A (ja) * 2008-08-28 2010-03-11 Kyocera Corp プローブカード用配線基板およびこれを用いたプローブカード
US20110063066A1 (en) * 2009-09-17 2011-03-17 Samsung Electro-Mechanics Co., Ltd. Space transformer for probe card and method of repairing space transformer
US20170019990A1 (en) * 2014-03-31 2017-01-19 Murata Manufacturing Co., Ltd. Multilayer circuit board and probe card including the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0653277A (ja) * 1992-06-04 1994-02-25 Lsi Logic Corp 半導体装置アセンブリおよびその組立方法
TW565529B (en) * 2002-01-24 2003-12-11 Scs Hightech Inc Probe card and method for testing the proceed function or speed of electronic devices
US20060051948A1 (en) * 2003-02-04 2006-03-09 Microfabrica Inc. Microprobe tips and methods for making
KR100659521B1 (ko) * 2004-04-06 2006-12-20 가부시키가이샤 무라타 세이사쿠쇼 내부도체의 접속구조 및 다층기판
JP2006041333A (ja) * 2004-07-29 2006-02-09 Fujitsu Ltd プローブカード
KR100592214B1 (ko) * 2005-03-21 2006-06-26 주식회사 파이컴 프로브 카드 제조방법
JP5714817B2 (ja) * 2007-07-19 2015-05-07 日本発條株式会社 プローブカード
CN101865937B (zh) * 2009-04-20 2012-06-13 旺矽科技股份有限公司 多层探针组及其制造方法
US8878560B2 (en) * 2010-12-30 2014-11-04 Taiwan Semiconductor Manufacturing Company, Ltd. High frequency probing structure
US9244099B2 (en) * 2011-05-09 2016-01-26 Cascade Microtech, Inc. Probe head assemblies, components thereof, test systems including the same, and methods of operating the same
US9440135B2 (en) * 2012-05-29 2016-09-13 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic structures with integral vias extending in in-plane direction
US9615447B2 (en) * 2012-07-23 2017-04-04 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic support structure with integral constructional elements
JP5835282B2 (ja) * 2013-07-04 2015-12-24 株式会社村田製作所 多層配線基板の製造方法およびプローブカードの製造方法並びに多層配線基板およびプローブカード
DE102015004150A1 (de) * 2015-03-31 2016-10-06 Feinmetall Gmbh Verfahren zur Herstellung eines Kontaktabstandswandlers sowie Kontaktabstandswandler

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008089461A (ja) * 2006-10-03 2008-04-17 Tohoku Univ 半導体集積回路検査用プローバ
US20080107863A1 (en) * 2006-11-03 2008-05-08 Ibiden Co., Ltd Multilayered printed wiring board
US20090051041A1 (en) * 2007-08-24 2009-02-26 Ngk Spark Plug Co., Ltd. Multilayer wiring substrate and method for manufacturing the same, and substrate for use in ic inspection device and method for manufacturing the same
US20090321114A1 (en) * 2008-06-30 2009-12-31 Hiroyuki Takahashi Electrical inspection substrate unit and manufacturing method therefore
JP2010054323A (ja) * 2008-08-28 2010-03-11 Kyocera Corp プローブカード用配線基板およびこれを用いたプローブカード
US20110063066A1 (en) * 2009-09-17 2011-03-17 Samsung Electro-Mechanics Co., Ltd. Space transformer for probe card and method of repairing space transformer
US20170019990A1 (en) * 2014-03-31 2017-01-19 Murata Manufacturing Co., Ltd. Multilayer circuit board and probe card including the same

Also Published As

Publication number Publication date
CN110612452B (zh) 2021-12-24
US20200072873A1 (en) 2020-03-05
EP3622304A1 (en) 2020-03-18
WO2018206506A1 (en) 2018-11-15
US12019111B2 (en) 2024-06-25
KR20200006095A (ko) 2020-01-17
EP3622304B1 (en) 2021-04-28
CN110612452A (zh) 2019-12-24
TWI739003B (zh) 2021-09-11
TW201901157A (zh) 2019-01-01
JP2020519860A (ja) 2020-07-02

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