SG11201607219PA - Probe card for a testing apparatus of electronic devices, particularly for extreme temperature applications - Google Patents
Probe card for a testing apparatus of electronic devices, particularly for extreme temperature applicationsInfo
- Publication number
- SG11201607219PA SG11201607219PA SG11201607219PA SG11201607219PA SG11201607219PA SG 11201607219P A SG11201607219P A SG 11201607219PA SG 11201607219P A SG11201607219P A SG 11201607219PA SG 11201607219P A SG11201607219P A SG 11201607219PA SG 11201607219P A SG11201607219P A SG 11201607219PA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic devices
- probe card
- testing apparatus
- temperature applications
- extreme temperature
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI20140350 | 2014-03-06 | ||
PCT/IB2015/051606 WO2015132748A1 (en) | 2014-03-06 | 2015-03-05 | Probe card for a testing apparatus of electronic devices, particularly for extreme temperature applications |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201607219PA true SG11201607219PA (en) | 2016-09-29 |
Family
ID=50733156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201607219PA SG11201607219PA (en) | 2014-03-06 | 2015-03-05 | Probe card for a testing apparatus of electronic devices, particularly for extreme temperature applications |
Country Status (10)
Country | Link |
---|---|
US (1) | US10509056B2 (en) |
EP (1) | EP3114489B1 (en) |
JP (1) | JP6637909B2 (en) |
KR (1) | KR102251299B1 (en) |
CN (1) | CN107533100B (en) |
MY (1) | MY177187A (en) |
PH (1) | PH12016501753A1 (en) |
SG (1) | SG11201607219PA (en) |
TW (1) | TWI655438B (en) |
WO (1) | WO2015132748A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015132747A1 (en) * | 2014-03-06 | 2015-09-11 | Technoprobe S.P.A. | High-planarity probe card for a testing apparatus for electronic devices |
TWI783074B (en) * | 2017-11-09 | 2022-11-11 | 義大利商探針科技公司 | Contact probe for a testing head for testing high-frequency devices |
JP7129261B2 (en) * | 2018-07-27 | 2022-09-01 | キオクシア株式会社 | test equipment |
TWI679427B (en) * | 2018-10-01 | 2019-12-11 | 巨擘科技股份有限公司 | Probe card device |
US11933816B2 (en) * | 2019-03-20 | 2024-03-19 | Celadon Systems, Inc. | Portable probe card assembly |
DE102019002342A1 (en) * | 2019-03-29 | 2020-10-01 | Yamaichi Electronics Deutschland Gmbh | Test device and use of the test device |
EP3959524A4 (en) | 2019-04-26 | 2023-01-18 | FormFactor, Inc. | Probe on carrier architecture for vertical probe arrays |
TWI750552B (en) * | 2019-12-16 | 2021-12-21 | 旺矽科技股份有限公司 | Positionable probe card and manufacturing method thereof |
KR102342806B1 (en) * | 2020-03-30 | 2021-12-23 | (주)포인트엔지니어링 | Probe head and probe card having the same |
KR102393600B1 (en) * | 2020-09-11 | 2022-05-03 | 스테코 주식회사 | Probe card |
KR102210841B1 (en) * | 2020-10-27 | 2021-02-02 | (주)샘씨엔에스 | Ceramic substrate for probe card with low thermal expansion characteristic |
CN116811040B (en) * | 2023-08-26 | 2023-11-10 | 江苏鹏利芝达恩半导体有限公司 | Method, apparatus and storage medium for manufacturing ceramic rod for manufacturing vertical probe card |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3715160B2 (en) * | 1999-12-02 | 2005-11-09 | 株式会社ルネサステクノロジ | Probing apparatus and semiconductor device manufacturing method |
US6756797B2 (en) * | 2001-01-31 | 2004-06-29 | Wentworth Laboratories Inc. | Planarizing interposer for thermal compensation of a probe card |
US6677771B2 (en) * | 2001-06-20 | 2004-01-13 | Advantest Corp. | Probe contact system having planarity adjustment mechanism |
US7640651B2 (en) * | 2003-12-31 | 2010-01-05 | Microfabrica Inc. | Fabrication process for co-fabricating multilayer probe array and a space transformer |
JP2005010052A (en) * | 2003-06-19 | 2005-01-13 | Japan Electronic Materials Corp | Probe card |
JP2005345443A (en) * | 2004-06-07 | 2005-12-15 | Japan Electronic Materials Corp | Contact pin for probe card and probe card employing it |
US7285968B2 (en) * | 2005-04-19 | 2007-10-23 | Formfactor, Inc. | Apparatus and method for managing thermally induced motion of a probe card assembly |
WO2007142204A1 (en) * | 2006-06-08 | 2007-12-13 | Nhk Spring Co., Ltd. | Probe card |
US7471078B2 (en) * | 2006-12-29 | 2008-12-30 | Formfactor, Inc. | Stiffener assembly for use with testing devices |
KR100806736B1 (en) * | 2007-05-11 | 2008-02-27 | 주식회사 에이엠에스티 | Probe card and method for fabricating the same |
US20100207652A1 (en) * | 2007-10-08 | 2010-08-19 | Amst Co., Ltd. | Method for wafer test and probe card for the same |
DE102008034918B4 (en) * | 2008-07-26 | 2012-09-27 | Feinmetall Gmbh | Electrical test equipment for testing an electrical device under test and electrical test method |
US8305101B2 (en) * | 2009-02-19 | 2012-11-06 | Advantest America, Inc | Microelectronic contactor assembly, structures thereof, and methods of constructing same |
JP2012047674A (en) * | 2010-08-30 | 2012-03-08 | Advantest Corp | Dicing substrate for test, probe, and semiconductor wafer testing apparatus |
JP2012093328A (en) * | 2010-10-22 | 2012-05-17 | Isao Kimoto | Probe card |
JP5629723B2 (en) * | 2012-04-12 | 2014-11-26 | 株式会社アドバンテスト | Semiconductor wafer testing method |
-
2015
- 2015-03-05 WO PCT/IB2015/051606 patent/WO2015132748A1/en active Application Filing
- 2015-03-05 JP JP2016572932A patent/JP6637909B2/en active Active
- 2015-03-05 EP EP15714643.2A patent/EP3114489B1/en active Active
- 2015-03-05 MY MYPI2016703207A patent/MY177187A/en unknown
- 2015-03-05 KR KR1020167027650A patent/KR102251299B1/en active IP Right Grant
- 2015-03-05 SG SG11201607219PA patent/SG11201607219PA/en unknown
- 2015-03-05 CN CN201580011931.4A patent/CN107533100B/en active Active
- 2015-03-06 TW TW104107166A patent/TWI655438B/en active
-
2016
- 2016-09-06 US US15/257,443 patent/US10509056B2/en active Active
- 2016-09-06 PH PH12016501753A patent/PH12016501753A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20160130464A (en) | 2016-11-11 |
JP2017515126A (en) | 2017-06-08 |
MY177187A (en) | 2020-09-09 |
CN107533100B (en) | 2021-01-22 |
TWI655438B (en) | 2019-04-01 |
US20160377656A1 (en) | 2016-12-29 |
KR102251299B1 (en) | 2021-05-13 |
PH12016501753B1 (en) | 2016-11-07 |
EP3114489A1 (en) | 2017-01-11 |
WO2015132748A1 (en) | 2015-09-11 |
US10509056B2 (en) | 2019-12-17 |
CN107533100A (en) | 2018-01-02 |
PH12016501753A1 (en) | 2016-11-07 |
JP6637909B2 (en) | 2020-01-29 |
EP3114489B1 (en) | 2018-08-01 |
TW201534931A (en) | 2015-09-16 |
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