SG10201501865PA - Device For Testing Electronic Components - Google Patents

Device For Testing Electronic Components

Info

Publication number
SG10201501865PA
SG10201501865PA SG10201501865PA SG10201501865PA SG10201501865PA SG 10201501865P A SG10201501865P A SG 10201501865PA SG 10201501865P A SG10201501865P A SG 10201501865PA SG 10201501865P A SG10201501865P A SG 10201501865PA SG 10201501865P A SG10201501865P A SG 10201501865PA
Authority
SG
Singapore
Prior art keywords
electronic components
testing electronic
testing
components
electronic
Prior art date
Application number
SG10201501865PA
Inventor
Volker Leikermoser
Gerhard Gschwendtberger
Original Assignee
Multitest Elektronische Syst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multitest Elektronische Syst filed Critical Multitest Elektronische Syst
Publication of SG10201501865PA publication Critical patent/SG10201501865PA/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/3181Functional testing
    • G01R31/319Tester hardware, i.e. output processing circuits
    • G01R31/31903Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools, brushes, or analogous members
SG10201501865PA 2014-03-11 2015-03-11 Device For Testing Electronic Components SG10201501865PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014103262.4A DE102014103262B3 (en) 2014-03-11 2014-03-11 Device for testing electronic components

Publications (1)

Publication Number Publication Date
SG10201501865PA true SG10201501865PA (en) 2015-10-29

Family

ID=52633166

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201501865PA SG10201501865PA (en) 2014-03-11 2015-03-11 Device For Testing Electronic Components

Country Status (6)

Country Link
US (1) US9933457B2 (en)
EP (1) EP2918351A1 (en)
CN (1) CN104914323A (en)
DE (1) DE102014103262B3 (en)
MY (1) MY182110A (en)
SG (1) SG10201501865PA (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10545173B2 (en) * 2013-11-26 2020-01-28 Commscope Connectivity Uk Limited Balunless test fixture
US10267847B2 (en) * 2016-06-15 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Probe head structure of probe card and testing method
KR20200135363A (en) 2018-02-23 2020-12-02 인터내셔널 테스트 솔루션즈, 인코포레이티드 New materials and hardware to automatically clean flexible electronic web rolls
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US10792713B1 (en) * 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6118290A (en) * 1997-06-07 2000-09-12 Tokyo Electron Limited Prober and method for cleaning probes provided therein
JP2000180469A (en) * 1998-12-18 2000-06-30 Fujitsu Ltd Contactor for semiconductor device, tester using contactor for semiconductor device, testing method using contactor for semiconductor device and method for cleaning contactor for semiconductor device
JP4832664B2 (en) * 2001-05-21 2011-12-07 日本ミクロコーティング株式会社 Contact cleaning sheet and method
US6817052B2 (en) * 2001-11-09 2004-11-16 Formfactor, Inc. Apparatuses and methods for cleaning test probes
US6840374B2 (en) * 2002-01-18 2005-01-11 Igor Y. Khandros Apparatus and method for cleaning test probes
US6870382B2 (en) * 2002-05-03 2005-03-22 Texas Instruments Incorporated System and method for evaluating the planarity and parallelism of an array of probe tips
US7492172B2 (en) * 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7772830B2 (en) * 2006-03-03 2010-08-10 Texas Instruments Incorporated Test handler automatic contactor cleaner methods and surrogate cleaning device
JP4800874B2 (en) 2006-08-11 2011-10-26 株式会社日本マイクロニクス Inspection device for display panel, probe unit and probe assembly
JP2009152264A (en) 2007-12-19 2009-07-09 Sharp Corp Probe card
DE102008029129B4 (en) * 2008-06-19 2010-04-29 Multitest Elektronische Systeme Gmbh Contacting device and method for cleaning contact springs
US8371316B2 (en) * 2009-12-03 2013-02-12 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
CN202676721U (en) * 2012-07-17 2013-01-16 杭州东邦科技有限公司 Sensor probe cleaning protector

Also Published As

Publication number Publication date
US20150260758A1 (en) 2015-09-17
US9933457B2 (en) 2018-04-03
DE102014103262B3 (en) 2015-06-11
EP2918351A1 (en) 2015-09-16
MY182110A (en) 2021-01-18
CN104914323A (en) 2015-09-16

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