IT201700100522A1 - Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione - Google Patents
Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazioneInfo
- Publication number
- IT201700100522A1 IT201700100522A1 IT102017000100522A IT201700100522A IT201700100522A1 IT 201700100522 A1 IT201700100522 A1 IT 201700100522A1 IT 102017000100522 A IT102017000100522 A IT 102017000100522A IT 201700100522 A IT201700100522 A IT 201700100522A IT 201700100522 A1 IT201700100522 A1 IT 201700100522A1
- Authority
- IT
- Italy
- Prior art keywords
- manufacturing
- interface element
- electronic device
- test device
- device test
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/025—General constructional details concerning dedicated user interfaces, e.g. GUI, or dedicated keyboards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102017000100522A IT201700100522A1 (it) | 2017-09-07 | 2017-09-07 | Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione |
PCT/EP2018/073187 WO2019048299A1 (en) | 2017-09-07 | 2018-08-29 | INTERFACE MEMBER FOR ELECTRONIC DEVICE TESTING APPARATUS AND METHOD FOR MANUFACTURING THE SAME |
SG11202001687YA SG11202001687YA (en) | 2017-09-07 | 2018-08-29 | Interface element for a testing apparatus of electronic devices and corresponding manufacturing method |
CN201880058238.6A CN111051897B (zh) | 2017-09-07 | 2018-08-29 | 用于电子器件的测试设备的接合元件及相应的制造方法 |
JP2020513536A JP2020533571A (ja) | 2017-09-07 | 2018-08-29 | 電子デバイスの試験装置用のインターフェース要素、および対応する製造方法 |
EP18759326.4A EP3679381A1 (en) | 2017-09-07 | 2018-08-29 | Interface element for a testing apparatus of electronic devices and corresponding manufacturing method |
KR1020207009666A KR102608053B1 (ko) | 2017-09-07 | 2018-08-29 | 전자 소자 테스트 장치용 인터페이스 요소 및 그에 대응하는 제조방법 |
TW107130331A TWI717632B (zh) | 2017-09-07 | 2018-08-30 | 用於電子裝置的測試設備的介面元件、其對應的製造方法及包含其之探針卡 |
US16/808,305 US11293941B2 (en) | 2017-09-07 | 2020-03-03 | Interface element for a testing apparatus of electronic devices and corresponding manufacturing method |
PH12020500440A PH12020500440A1 (en) | 2017-09-07 | 2020-03-05 | Interface element for a testing apparatus of electronic devices and corresponding manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102017000100522A IT201700100522A1 (it) | 2017-09-07 | 2017-09-07 | Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione |
Publications (1)
Publication Number | Publication Date |
---|---|
IT201700100522A1 true IT201700100522A1 (it) | 2019-03-07 |
Family
ID=61024852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT102017000100522A IT201700100522A1 (it) | 2017-09-07 | 2017-09-07 | Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione |
Country Status (10)
Country | Link |
---|---|
US (1) | US11293941B2 (it) |
EP (1) | EP3679381A1 (it) |
JP (1) | JP2020533571A (it) |
KR (1) | KR102608053B1 (it) |
CN (1) | CN111051897B (it) |
IT (1) | IT201700100522A1 (it) |
PH (1) | PH12020500440A1 (it) |
SG (1) | SG11202001687YA (it) |
TW (1) | TWI717632B (it) |
WO (1) | WO2019048299A1 (it) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI638168B (zh) * | 2018-04-03 | 2018-10-11 | 中華精測科技股份有限公司 | 探針卡裝置及探針座 |
EP3761347A1 (en) * | 2019-07-04 | 2021-01-06 | Hypertac S.p.a. | Open web electrical support for contact pad and method of manufacture |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
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EP1156707A1 (en) * | 1999-11-26 | 2001-11-21 | Matsushita Electric Industrial Co., Ltd. | Wiring board and production method thereof |
WO2002015653A1 (en) * | 2000-08-10 | 2002-02-21 | 3M Innovative Properties Company | Compliant interconnect assembly |
US20020127893A1 (en) * | 2001-03-06 | 2002-09-12 | Brodsky William L. | Particle distribution interposer and method of manufacture thereof |
US20020191406A1 (en) * | 2001-05-10 | 2002-12-19 | Fujitsu Limited | Anisotropic conductive sheet, production process, contact structure, electronic device and inspection apparatus for operation test |
US6574114B1 (en) * | 2002-05-02 | 2003-06-03 | 3M Innovative Properties Company | Low contact force, dual fraction particulate interconnect |
WO2004039135A1 (en) * | 2002-10-24 | 2004-05-06 | International Business Machines Corporation | Land grid array fabrication using elastomer core and conducting metal shell or mesh |
US20070298626A1 (en) * | 2004-12-16 | 2007-12-27 | Hougham Gareth G | Metalized Elastomeric Electrical Contacts |
US20110074455A1 (en) * | 2009-09-25 | 2011-03-31 | Yoshirou Nakata | Probe card and semiconductor wafer inspection method using the same |
US20110121847A1 (en) * | 2008-06-02 | 2011-05-26 | Advantest Corporation | Probe, electronic device test apparatus, and method of producing the same |
US20140370727A1 (en) * | 2013-06-12 | 2014-12-18 | Ironwood Electronics, Inc. | Adapter apparatus with suspended conductive elastomer interconnect |
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SU1187229A1 (ru) * | 1982-12-20 | 1985-10-23 | Akopyan Robert A | Электрический соединитель |
JP3400051B2 (ja) * | 1993-11-10 | 2003-04-28 | ザ ウィタカー コーポレーション | 異方性導電膜、その製造方法及びそれを使用するコネクタ |
JP3640268B2 (ja) * | 1995-10-06 | 2005-04-20 | ザ ウィタカー コーポレーション | コネクタ及びコネクタ製造方法 |
US5785538A (en) * | 1995-11-27 | 1998-07-28 | International Business Machines Corporation | High density test probe with rigid surface structure |
US5892245A (en) * | 1996-11-11 | 1999-04-06 | Emulation Technology, Inc. | Ball grid array package emulator |
US6280207B1 (en) * | 1999-05-10 | 2001-08-28 | Hirose Electric Co., Ltd. | Intermediate electrical connector |
JP3350479B2 (ja) * | 1999-05-10 | 2002-11-25 | ヒロセ電機株式会社 | 中間電気コネクタ |
JP4607417B2 (ja) * | 2001-11-15 | 2011-01-05 | 株式会社フジクラ | 両面接点コネクタ |
JP3649239B2 (ja) * | 2002-10-28 | 2005-05-18 | Jsr株式会社 | シート状コネクターの製造方法 |
JP3753145B2 (ja) * | 2003-04-21 | 2006-03-08 | Jsr株式会社 | 異方導電性シートおよびその製造方法、アダプター装置およびその製造方法並びに回路装置の電気的検査装置 |
US6994570B2 (en) * | 2004-01-28 | 2006-02-07 | International Business Machines Corporation | High performance interposer for a chip package using deformable button contacts |
US7442049B2 (en) * | 2005-02-09 | 2008-10-28 | International Business Machines Corporation | Electrical connecting device and method of forming same |
TWI406449B (zh) * | 2005-02-16 | 2013-08-21 | Jsr Corp | Composite conductive sheet and manufacturing method thereof, electrical inspection device for an electrically conductive connector, a connector device, and a circuit device |
US7825512B2 (en) * | 2005-09-12 | 2010-11-02 | Hewlett-Packard Development Company, L.P. | Electronic package with compliant electrically-conductive ball interconnect |
JP5426161B2 (ja) * | 2006-06-08 | 2014-02-26 | 日本発條株式会社 | プローブカード |
US7759951B2 (en) * | 2007-05-29 | 2010-07-20 | Touchdown Technologies, Inc. | Semiconductor testing device with elastomer interposer |
JP2009074823A (ja) * | 2007-09-19 | 2009-04-09 | Ngk Spark Plug Co Ltd | 電子部品検査装置用配線基板およびその製造方法 |
KR100952712B1 (ko) * | 2007-12-27 | 2010-04-13 | 주식회사 아이에스시테크놀러지 | 판형 도전입자를 포함한 실리콘 콘택터 |
KR100978549B1 (ko) * | 2007-12-28 | 2010-08-27 | 티에스씨멤시스(주) | 프로브 구조물 및 프로브 구조물 제조 방법 |
KR20100135746A (ko) * | 2008-03-14 | 2010-12-27 | 후지필름 가부시키가이샤 | 프로브 카드 |
JP5253972B2 (ja) * | 2008-04-28 | 2013-07-31 | 富士フイルム株式会社 | 構造体およびその製造方法 |
US20100276188A1 (en) * | 2009-05-04 | 2010-11-04 | Russell James V | Method and apparatus for improving power gain and loss for interconect configurations |
TWI534432B (zh) * | 2010-09-07 | 2016-05-21 | 瓊斯科技國際公司 | 用於微電路測試器之電氣傳導針腳 |
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US9459285B2 (en) * | 2013-07-10 | 2016-10-04 | Globalfoundries Inc. | Test probe coated with conductive elastomer for testing of backdrilled plated through holes in printed circuit board assembly |
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MY179750A (en) * | 2014-03-06 | 2020-11-12 | Technoprobe Spa | High-planarity probe card for a testing apparatus for electronic devices |
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JP2016178121A (ja) * | 2015-03-18 | 2016-10-06 | タツタ電線株式会社 | ストレッチャブルケーブルおよびストレッチャブル回路基板 |
EP3278120A1 (en) * | 2015-03-31 | 2018-02-07 | Technoprobe S.p.A | Vertical contact probe and corresponding testing head with vertical contact probes, particularly for high frequency applications |
JP6918518B2 (ja) * | 2017-02-27 | 2021-08-11 | デクセリアルズ株式会社 | 電気特性の検査冶具 |
-
2017
- 2017-09-07 IT IT102017000100522A patent/IT201700100522A1/it unknown
-
2018
- 2018-08-29 KR KR1020207009666A patent/KR102608053B1/ko active IP Right Grant
- 2018-08-29 SG SG11202001687YA patent/SG11202001687YA/en unknown
- 2018-08-29 EP EP18759326.4A patent/EP3679381A1/en active Pending
- 2018-08-29 JP JP2020513536A patent/JP2020533571A/ja active Pending
- 2018-08-29 CN CN201880058238.6A patent/CN111051897B/zh active Active
- 2018-08-29 WO PCT/EP2018/073187 patent/WO2019048299A1/en unknown
- 2018-08-30 TW TW107130331A patent/TWI717632B/zh active
-
2020
- 2020-03-03 US US16/808,305 patent/US11293941B2/en active Active
- 2020-03-05 PH PH12020500440A patent/PH12020500440A1/en unknown
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1156707A1 (en) * | 1999-11-26 | 2001-11-21 | Matsushita Electric Industrial Co., Ltd. | Wiring board and production method thereof |
WO2002015653A1 (en) * | 2000-08-10 | 2002-02-21 | 3M Innovative Properties Company | Compliant interconnect assembly |
US20020127893A1 (en) * | 2001-03-06 | 2002-09-12 | Brodsky William L. | Particle distribution interposer and method of manufacture thereof |
US20020191406A1 (en) * | 2001-05-10 | 2002-12-19 | Fujitsu Limited | Anisotropic conductive sheet, production process, contact structure, electronic device and inspection apparatus for operation test |
US6574114B1 (en) * | 2002-05-02 | 2003-06-03 | 3M Innovative Properties Company | Low contact force, dual fraction particulate interconnect |
WO2004039135A1 (en) * | 2002-10-24 | 2004-05-06 | International Business Machines Corporation | Land grid array fabrication using elastomer core and conducting metal shell or mesh |
US20070298626A1 (en) * | 2004-12-16 | 2007-12-27 | Hougham Gareth G | Metalized Elastomeric Electrical Contacts |
US20110121847A1 (en) * | 2008-06-02 | 2011-05-26 | Advantest Corporation | Probe, electronic device test apparatus, and method of producing the same |
US20110074455A1 (en) * | 2009-09-25 | 2011-03-31 | Yoshirou Nakata | Probe card and semiconductor wafer inspection method using the same |
US20140370727A1 (en) * | 2013-06-12 | 2014-12-18 | Ironwood Electronics, Inc. | Adapter apparatus with suspended conductive elastomer interconnect |
Also Published As
Publication number | Publication date |
---|---|
EP3679381A1 (en) | 2020-07-15 |
TWI717632B (zh) | 2021-02-01 |
TW201930892A (zh) | 2019-08-01 |
JP2020533571A (ja) | 2020-11-19 |
PH12020500440A1 (en) | 2021-01-25 |
CN111051897B (zh) | 2023-01-24 |
US11293941B2 (en) | 2022-04-05 |
CN111051897A (zh) | 2020-04-21 |
KR102608053B1 (ko) | 2023-11-29 |
KR20200051007A (ko) | 2020-05-12 |
US20200200795A1 (en) | 2020-06-25 |
SG11202001687YA (en) | 2020-03-30 |
WO2019048299A1 (en) | 2019-03-14 |
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