KR20180084819A - 반도체 장치, 상기 반도체 장치를 가지는 표시 장치, 및 상기 반도체 장치를 가지는 전자 기기 - Google Patents

반도체 장치, 상기 반도체 장치를 가지는 표시 장치, 및 상기 반도체 장치를 가지는 전자 기기 Download PDF

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KR20180084819A
KR20180084819A KR1020187014740A KR20187014740A KR20180084819A KR 20180084819 A KR20180084819 A KR 20180084819A KR 1020187014740 A KR1020187014740 A KR 1020187014740A KR 20187014740 A KR20187014740 A KR 20187014740A KR 20180084819 A KR20180084819 A KR 20180084819A
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semiconductor device
semiconductor
electronic
display
display device
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KR1020187014740A
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야스하루 호사카
유키노리 시마
마사타카 나카다
마사미 진쵸우
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가부시키가이샤 한도오따이 에네루기 켄큐쇼
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Publication of KR20180084819A publication Critical patent/KR20180084819A/ko

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
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    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
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    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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    • H01L29/42312—Gate electrodes for field effect devices
    • H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
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    • H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
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    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
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    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
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    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78633—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78645—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
    • H01L29/78648—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate arranged on opposing sides of the channel
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    • H01—ELECTRIC ELEMENTS
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    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/42—Bombardment with radiation
    • H01L21/423—Bombardment with radiation with high-energy radiation
    • H01L21/425—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/426—Bombardment with radiation with high-energy radiation producing ion implantation using masks
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    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
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    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
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    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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    • H10K59/40—OLEDs integrated with touch screens
KR1020187014740A 2015-11-20 2016-11-09 반도체 장치, 상기 반도체 장치를 가지는 표시 장치, 및 상기 반도체 장치를 가지는 전자 기기 KR20180084819A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015227617 2015-11-20
JPJP-P-2015-227617 2015-11-20
JPJP-P-2015-237207 2015-12-04
JP2015237207 2015-12-04
PCT/IB2016/056731 WO2017085591A1 (ja) 2015-11-20 2016-11-09 半導体装置、該半導体装置を有する表示装置、及び該半導体装置を有する電子機器

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KR20180084819A true KR20180084819A (ko) 2018-07-25

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KR1020187014740A KR20180084819A (ko) 2015-11-20 2016-11-09 반도체 장치, 상기 반도체 장치를 가지는 표시 장치, 및 상기 반도체 장치를 가지는 전자 기기

Country Status (5)

Country Link
US (3) US11329166B2 (ko)
JP (3) JPWO2017085591A1 (ko)
KR (1) KR20180084819A (ko)
CN (2) CN116154003A (ko)
WO (1) WO2017085591A1 (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200079900A (ko) * 2018-12-26 2020-07-06 엘지디스플레이 주식회사 이종의 절연막을 포함하는 게이트 절연막을 갖는 박막 트랜지스터, 그 제조방법 및 이를 포함하는 표시장치
US11482626B2 (en) 2018-03-29 2022-10-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of semiconductor device
US11552111B2 (en) 2018-04-20 2023-01-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107068903A (zh) * 2017-04-07 2017-08-18 惠科股份有限公司 一种显示面板和显示装置
CN107204375B (zh) * 2017-05-19 2019-11-26 深圳市华星光电技术有限公司 薄膜晶体管及其制作方法
US10355021B2 (en) * 2017-09-21 2019-07-16 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Thin film transistor structure and method for manufacturing same
KR20200101964A (ko) 2018-01-05 2020-08-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
CN111656430B (zh) * 2018-02-01 2022-07-26 株式会社半导体能源研究所 显示装置及电子设备
CN110085678A (zh) * 2019-04-18 2019-08-02 深圳市华星光电半导体显示技术有限公司 显示面板和薄膜晶体管的制作方法
US11532687B2 (en) 2019-07-30 2022-12-20 Samsung Display Co., Ltd. Thin film transistor, display panel having the same, and method of manufacturing the display panel
CN110880518B (zh) 2019-11-28 2021-07-13 云谷（固安）科技有限公司 一种阵列基板及其制备方法和显示面板
KR20210083638A (ko) * 2019-12-27 2021-07-07 엘지디스플레이 주식회사 박막 트랜지스터, 그 제조방법 및 이를 포함하는 표시장치
US11631704B2 (en) 2020-04-21 2023-04-18 Sharp Kabushiki Kaisha Active matrix substrate and display device
US11450686B2 (en) * 2020-06-29 2022-09-20 Taiwan Semiconductor Manufacturing Co., Ltd. High density 3D FERAM
KR20220077305A (ko) 2020-12-01 2022-06-09 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
US11581340B2 (en) 2020-12-15 2023-02-14 Sharp Kabushiki Kaisha Active matrix substrate
JP2022178523A (ja) 2021-05-20 2022-12-02 シャープディスプレイテクノロジー株式会社 アクティブマトリクス基板および液晶表示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007096055A (ja) 2005-09-29 2007-04-12 Semiconductor Energy Lab Co Ltd 半導体装置、及び半導体装置の作製方法
JP2009278115A (ja) 2008-05-15 2009-11-26 Samsung Electronics Co Ltd トランジスタとこれを含む半導体素子及びそれらの製造方法
JP2012009836A (ja) 2010-05-21 2012-01-12 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4209477B2 (ja) 1995-11-27 2009-01-14 株式会社半導体エネルギー研究所 半導体装置の作製方法
JPH09146118A (ja) 1995-11-27 1997-06-06 Sanyo Electric Co Ltd 半導体装置及び液晶表示装置
US6294799B1 (en) 1995-11-27 2001-09-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating same
US6310363B1 (en) 1998-05-15 2001-10-30 Semiconductor Energy Laboratory Co., Ltd. Thin-film transistor and semiconductor device using thin-film transistors with N and P impurities in the source and drain regions
JP3376247B2 (ja) 1997-05-30 2003-02-10 株式会社半導体エネルギー研究所 薄膜トランジスタ及び薄膜トランジスタを用いた半導体装置
US6541793B2 (en) 1997-05-30 2003-04-01 Semiconductor Energy Laboratory Co., Ltd. Thin-film transistor and semiconductor device using thin-film transistors
JPH1197660A (ja) 1997-09-19 1999-04-09 Semiconductor Energy Lab Co Ltd イメージセンサおよびそれを用いた装置
JP5046445B2 (ja) 2001-07-31 2012-10-10 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP3989761B2 (ja) 2002-04-09 2007-10-10 株式会社半導体エネルギー研究所 半導体表示装置
US7038239B2 (en) 2002-04-09 2006-05-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
JP4409196B2 (ja) 2002-04-09 2010-02-03 株式会社半導体エネルギー研究所 半導体装置及びそれを用いた表示装置、並びに半導体装置の作製方法
TWI272556B (en) 2002-05-13 2007-02-01 Semiconductor Energy Lab Display device
JP4493931B2 (ja) 2002-05-13 2010-06-30 株式会社半導体エネルギー研究所 表示装置
JP5138163B2 (ja) 2004-11-10 2013-02-06 キヤノン株式会社 電界効果型トランジスタ
EP1812969B1 (en) 2004-11-10 2015-05-06 Canon Kabushiki Kaisha Field effect transistor comprising an amorphous oxide
JP2007293155A (ja) 2006-04-27 2007-11-08 Epson Imaging Devices Corp 液晶表示装置
US8164933B2 (en) 2007-04-04 2012-04-24 Semiconductor Energy Laboratory Co., Ltd. Power source circuit
JP2009036947A (ja) 2007-08-01 2009-02-19 Seiko Epson Corp 液晶装置の製造方法、および液晶装置
EP2146379B1 (en) 2008-07-14 2015-01-28 Samsung Electronics Co., Ltd. Transistor comprising ZnO based channel layer
KR101845480B1 (ko) 2010-06-25 2018-04-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
US8772130B2 (en) 2011-08-23 2014-07-08 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of SOI substrate
US20130221345A1 (en) 2012-02-28 2013-08-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8941113B2 (en) 2012-03-30 2015-01-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element, semiconductor device, and manufacturing method of semiconductor element
US8981372B2 (en) 2012-09-13 2015-03-17 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic appliance
JP6433757B2 (ja) 2013-10-31 2018-12-05 株式会社半導体エネルギー研究所 半導体装置、表示装置、電子機器
TWI721409B (zh) 2013-12-19 2021-03-11 日商半導體能源研究所股份有限公司 半導體裝置
US9577110B2 (en) 2013-12-27 2017-02-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including an oxide semiconductor and the display device including the semiconductor device
US9472678B2 (en) 2013-12-27 2016-10-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9443876B2 (en) 2014-02-05 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device including the semiconductor device, display module including the display device, and electronic device including the semiconductor device, the display device, and the display module
US9929279B2 (en) 2014-02-05 2018-03-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US9640669B2 (en) * 2014-03-13 2017-05-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device including the semiconductor device, display module including the display device, and electronic appliance including the semiconductor device, the display device, and the display module
JP6559444B2 (ja) * 2014-03-14 2019-08-14 株式会社半導体エネルギー研究所 半導体装置の作製方法
US10002971B2 (en) 2014-07-03 2018-06-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the semiconductor device
US9837547B2 (en) 2015-05-22 2017-12-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising oxide conductor and display device including the semiconductor device
KR20240014632A (ko) 2015-05-22 2024-02-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 및 상기 반도체 장치를 포함하는 표시 장치
US11024725B2 (en) 2015-07-24 2021-06-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including metal oxide film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007096055A (ja) 2005-09-29 2007-04-12 Semiconductor Energy Lab Co Ltd 半導体装置、及び半導体装置の作製方法
JP2009278115A (ja) 2008-05-15 2009-11-26 Samsung Electronics Co Ltd トランジスタとこれを含む半導体素子及びそれらの製造方法
JP2012009836A (ja) 2010-05-21 2012-01-12 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11482626B2 (en) 2018-03-29 2022-10-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of semiconductor device
US11552111B2 (en) 2018-04-20 2023-01-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR20200079900A (ko) * 2018-12-26 2020-07-06 엘지디스플레이 주식회사 이종의 절연막을 포함하는 게이트 절연막을 갖는 박막 트랜지스터, 그 제조방법 및 이를 포함하는 표시장치

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