HK1252139A1 - 電子裝置 - Google Patents

電子裝置

Info

Publication number
HK1252139A1
HK1252139A1 HK18111530.4A HK18111530A HK1252139A1 HK 1252139 A1 HK1252139 A1 HK 1252139A1 HK 18111530 A HK18111530 A HK 18111530A HK 1252139 A1 HK1252139 A1 HK 1252139A1
Authority
HK
Hong Kong
Prior art keywords
electronic device
electronic
Prior art date
Application number
HK18111530.4A
Other languages
English (en)
Inventor
板東晃司
Original Assignee
瑞薩電子株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞薩電子株式會社 filed Critical 瑞薩電子株式會社
Publication of HK1252139A1 publication Critical patent/HK1252139A1/zh

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Classifications

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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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HK18111530.4A 2016-10-31 2018-09-07 電子裝置 HK1252139A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016213676A JP6673803B2 (ja) 2016-10-31 2016-10-31 電子装置

Publications (1)

Publication Number Publication Date
HK1252139A1 true HK1252139A1 (zh) 2019-05-17

Family

ID=60201334

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18111530.4A HK1252139A1 (zh) 2016-10-31 2018-09-07 電子裝置

Country Status (6)

Country Link
US (2) US10050007B2 (zh)
EP (1) EP3316291A1 (zh)
JP (1) JP6673803B2 (zh)
CN (2) CN207503955U (zh)
HK (1) HK1252139A1 (zh)
TW (1) TW201834192A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6673803B2 (ja) * 2016-10-31 2020-03-25 ルネサスエレクトロニクス株式会社 電子装置
US11107962B2 (en) * 2018-12-18 2021-08-31 Soulnano Limited UV LED array with power interconnect and heat sink
JP2022044549A (ja) * 2020-09-07 2022-03-17 ロバート ボッシュ （オーストラリア） ピーティーワイ リミテッド 整流素子のパッケージング方法および整流素子
US11678468B2 (en) * 2020-09-24 2023-06-13 Dana Tm4 Inc. High density power module
CN115101512B (zh) * 2022-06-16 2023-06-27 宁波芯健半导体有限公司 一种晶圆级mpw芯片封装结构及封装方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3225457B2 (ja) * 1995-02-28 2001-11-05 株式会社日立製作所 半導体装置
JP5362624B2 (ja) * 2010-03-09 2013-12-11 株式会社三社電機製作所 パワー半導体モジュール
CN103975430B (zh) * 2011-11-30 2016-12-07 三菱电机株式会社 半导体装置及车载用功率转换装置
JP2015122453A (ja) * 2013-12-25 2015-07-02 ダイキン工業株式会社 パワーモジュール
CN104810328B (zh) * 2014-01-28 2018-07-06 台达电子企业管理（上海）有限公司 封装外壳及具有该封装外壳的功率模块
JP6673803B2 (ja) * 2016-10-31 2020-03-25 ルネサスエレクトロニクス株式会社 電子装置

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