TWI799562B - 基板載置裝置及基板載置方法 - Google Patents

基板載置裝置及基板載置方法 Download PDF

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Publication number
TWI799562B
TWI799562B TW108112291A TW108112291A TWI799562B TW I799562 B TWI799562 B TW I799562B TW 108112291 A TW108112291 A TW 108112291A TW 108112291 A TW108112291 A TW 108112291A TW I799562 B TWI799562 B TW I799562B
Authority
TW
Taiwan
Prior art keywords
substrate mounting
mounting device
mounting method
substrate
mounting
Prior art date
Application number
TW108112291A
Other languages
English (en)
Other versions
TW201946205A (zh
Inventor
牛丸浩二
糸永将司
Original Assignee
日商東京威力科創股份有限公司
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Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW201946205A publication Critical patent/TW201946205A/zh
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Publication of TWI799562B publication Critical patent/TWI799562B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
TW108112291A 2018-04-23 2019-04-09 基板載置裝置及基板載置方法 TWI799562B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-082535 2018-04-23
JP2018082535A JP7210896B2 (ja) 2018-04-23 2018-04-23 基板載置装置及び基板載置方法

Publications (2)

Publication Number Publication Date
TW201946205A TW201946205A (zh) 2019-12-01
TWI799562B true TWI799562B (zh) 2023-04-21

Family

ID=68238264

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108112291A TWI799562B (zh) 2018-04-23 2019-04-09 基板載置裝置及基板載置方法

Country Status (5)

Country Link
US (1) US11049758B2 (zh)
JP (1) JP7210896B2 (zh)
KR (1) KR20190123213A (zh)
CN (1) CN110391168B (zh)
TW (1) TWI799562B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220296762A1 (en) 2019-10-23 2022-09-22 Amatera, Inc. Bactericide diffusion apparatus and bactericide diffusion method
CN112230454B (zh) * 2020-09-22 2022-08-09 福建华佳彩有限公司 一种避免基板刮伤的方法和装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004100254A1 (ja) * 2003-05-06 2004-11-18 Olympus Corporation 基板吸着装置
US20180082880A1 (en) * 2016-09-16 2018-03-22 Toshiba Memory Corporation Substrate holding apparatus

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EP0456426B1 (en) * 1990-05-07 2004-09-15 Canon Kabushiki Kaisha Vacuum type wafer holder
JPH0758191A (ja) * 1993-08-13 1995-03-03 Toshiba Corp ウェハステージ装置
JP4700819B2 (ja) * 2000-03-10 2011-06-15 キヤノン株式会社 基板保持装置、半導体製造装置および半導体デバイス製造方法
JP2006059857A (ja) * 2004-08-17 2006-03-02 Dainippon Screen Mfg Co Ltd 基板乾燥装置
JP4443353B2 (ja) * 2004-08-31 2010-03-31 東京応化工業株式会社 基板載置ステージ及び基板の吸着・剥離方法
JP4606348B2 (ja) * 2006-03-06 2011-01-05 東京エレクトロン株式会社 基板処理装置及び基板搬送方法並びに記憶媒体
JP4781901B2 (ja) * 2006-05-08 2011-09-28 東京エレクトロン株式会社 熱処理方法，プログラム及び熱処理装置
JP4899879B2 (ja) * 2007-01-17 2012-03-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5029257B2 (ja) * 2007-01-17 2012-09-19 東京エレクトロン株式会社 載置台構造及び処理装置
JP5109376B2 (ja) * 2007-01-22 2012-12-26 東京エレクトロン株式会社 加熱装置、加熱方法及び記憶媒体
JP5093652B2 (ja) * 2007-06-12 2012-12-12 株式会社ニコン 研磨装置
CN101764028A (zh) * 2008-12-04 2010-06-30 北京中科信电子装备有限公司 一种注入机用晶片注入过渡夹
JP2011071293A (ja) * 2009-09-25 2011-04-07 Tokyo Electron Ltd プロセスモジュール、基板処理装置、および基板搬送方法
JP5583503B2 (ja) * 2010-07-14 2014-09-03 東京エレクトロン株式会社 基板洗浄装置、およびこれを備える塗布現像装置
JP5993568B2 (ja) * 2011-11-09 2016-09-14 東京エレクトロン株式会社 基板載置システム、基板処理装置、静電チャック及び基板冷却方法
JP2014024152A (ja) * 2012-07-26 2014-02-06 Disco Abrasive Syst Ltd 加工装置
WO2014158370A2 (en) * 2013-03-14 2014-10-02 Applied Materials, Inc. Temperature measurement in multi-zone heater
JP6316181B2 (ja) * 2014-12-18 2018-04-25 東京エレクトロン株式会社 基板保持ステージ
SG10201600301SA (en) * 2016-01-14 2017-08-30 3M Innovative Properties Co CMP Pad Conditioner, Pad Conditioning System And Method
JP6637829B2 (ja) 2016-04-27 2020-01-29 日本特殊陶業株式会社 真空吸着部材
JP6711168B2 (ja) * 2016-06-23 2020-06-17 東京エレクトロン株式会社 基板載置装置及び基板載置方法
JP6914078B2 (ja) * 2017-03-31 2021-08-04 株式会社荏原製作所 真空吸着パッドおよび基板保持装置
US11081383B2 (en) * 2017-11-24 2021-08-03 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate table with vacuum channels grid

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004100254A1 (ja) * 2003-05-06 2004-11-18 Olympus Corporation 基板吸着装置
US20180082880A1 (en) * 2016-09-16 2018-03-22 Toshiba Memory Corporation Substrate holding apparatus

Also Published As

Publication number Publication date
JP7210896B2 (ja) 2023-01-24
CN110391168B (zh) 2024-03-22
JP2019192738A (ja) 2019-10-31
TW201946205A (zh) 2019-12-01
KR20190123213A (ko) 2019-10-31
CN110391168A (zh) 2019-10-29
US20190326150A1 (en) 2019-10-24
US11049758B2 (en) 2021-06-29

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