TWI799544B - 黏著膠帶及半導體裝置的製造方法 - Google Patents

黏著膠帶及半導體裝置的製造方法 Download PDF

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Publication number
TWI799544B
TWI799544B TW108109276A TW108109276A TWI799544B TW I799544 B TWI799544 B TW I799544B TW 108109276 A TW108109276 A TW 108109276A TW 108109276 A TW108109276 A TW 108109276A TW I799544 B TWI799544 B TW I799544B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
adhesive tape
manufacturing semiconductor
manufacturing
tape
Prior art date
Application number
TW108109276A
Other languages
English (en)
Other versions
TW201945487A (zh
Inventor
長谷川裕也
前田淳
西田卓生
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201945487A publication Critical patent/TW201945487A/zh
Application granted granted Critical
Publication of TWI799544B publication Critical patent/TWI799544B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW108109276A 2018-03-20 2019-03-19 黏著膠帶及半導體裝置的製造方法 TWI799544B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018053335A JP2018119156A (ja) 2018-03-20 2018-03-20 粘着テープおよび半導体装置の製造方法
JP2018-053335 2018-03-20

Publications (2)

Publication Number Publication Date
TW201945487A TW201945487A (zh) 2019-12-01
TWI799544B true TWI799544B (zh) 2023-04-21

Family

ID=63044885

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108109276A TWI799544B (zh) 2018-03-20 2019-03-19 黏著膠帶及半導體裝置的製造方法

Country Status (3)

Country Link
JP (2) JP2018119156A (zh)
TW (1) TWI799544B (zh)
WO (1) WO2019181733A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018119156A (ja) * 2018-03-20 2018-08-02 リンテック株式会社 粘着テープおよび半導体装置の製造方法
CN112967928B (zh) * 2020-12-16 2022-07-29 重庆康佳光电技术研究院有限公司 芯片的切割方法及芯片的转移方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201422758A (zh) * 2012-10-05 2014-06-16 Lintec Corp 表面保護片
JP2015185691A (ja) * 2014-03-24 2015-10-22 古河電気工業株式会社 半導体ウェハ加工用粘着テープ、該粘着テープの製造方法および半導体ウェハの加工方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6169067B2 (ja) 2014-12-24 2017-07-26 古河電気工業株式会社 電子部品加工用粘着テープ
WO2017046855A1 (ja) * 2015-09-14 2017-03-23 古河電気工業株式会社 半導体ウェハ加工用粘着テープ、該粘着テープの製造方法および半導体ウェハの加工方法
JP2018119156A (ja) * 2018-03-20 2018-08-02 リンテック株式会社 粘着テープおよび半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201422758A (zh) * 2012-10-05 2014-06-16 Lintec Corp 表面保護片
JP2015185691A (ja) * 2014-03-24 2015-10-22 古河電気工業株式会社 半導体ウェハ加工用粘着テープ、該粘着テープの製造方法および半導体ウェハの加工方法

Also Published As

Publication number Publication date
TW201945487A (zh) 2019-12-01
JP7326249B2 (ja) 2023-08-15
JPWO2019181733A1 (ja) 2021-04-01
WO2019181733A1 (ja) 2019-09-26
JP2018119156A (ja) 2018-08-02

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