SG11202002552PA - Adhesive film for use in semiconductor device manufacture, manufacturing method of said adhesive film, semiconductor device, and manufacturing method of semiconductor device - Google Patents
Adhesive film for use in semiconductor device manufacture, manufacturing method of said adhesive film, semiconductor device, and manufacturing method of semiconductor deviceInfo
- Publication number
- SG11202002552PA SG11202002552PA SG11202002552PA SG11202002552PA SG11202002552PA SG 11202002552P A SG11202002552P A SG 11202002552PA SG 11202002552P A SG11202002552P A SG 11202002552PA SG 11202002552P A SG11202002552P A SG 11202002552PA SG 11202002552P A SG11202002552P A SG 11202002552PA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- manufacturing
- adhesive film
- manufacture
- device manufacture
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 3
- 239000004065 semiconductor Substances 0.000 title 3
- 239000002313 adhesive film Substances 0.000 title 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
- B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Die Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2017/033746 WO2019058429A1 (en) | 2017-09-19 | 2017-09-19 | Adhesive film for semiconductor device manufacture and manufacturing method thereof |
| PCT/JP2018/034513 WO2019059188A1 (en) | 2017-09-19 | 2018-09-18 | Adhesive film for use in semiconductor device manufacture, manufacturing method of said adhesive film, semiconductor device, and manufacturing method of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202002552PA true SG11202002552PA (en) | 2020-04-29 |
Family
ID=65810307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202002552PA SG11202002552PA (en) | 2017-09-19 | 2018-09-18 | Adhesive film for use in semiconductor device manufacture, manufacturing method of said adhesive film, semiconductor device, and manufacturing method of semiconductor device |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPWO2019059188A1 (en) |
| KR (1) | KR102578510B1 (en) |
| CN (1) | CN111095505B (en) |
| SG (1) | SG11202002552PA (en) |
| TW (1) | TWI753200B (en) |
| WO (2) | WO2019058429A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023160001A (en) * | 2022-04-21 | 2023-11-02 | 浜松ホトニクス株式会社 | Photodetector |
| WO2023248337A1 (en) * | 2022-06-21 | 2023-12-28 | 株式会社レゾナック | Film, wound body, connection structure, and method for manufacturing connection structure |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3402131B2 (en) * | 1997-07-11 | 2003-04-28 | 日立電線株式会社 | Method of attaching adhesive sheet to substrate for semiconductor package |
| JPH11106717A (en) * | 1997-10-01 | 1999-04-20 | Oji Paper Co Ltd | Pressure-sensitive adhesive label |
| JPH11274244A (en) * | 1998-03-20 | 1999-10-08 | Sumitomo Metal Mining Co Ltd | Metal reinforcing plate for semiconductor package support and producing method therefor |
| JP3542080B2 (en) * | 2001-03-30 | 2004-07-14 | リンテック株式会社 | Adhesive tape / sheet for supporting semiconductor chip, semiconductor chip carrier, semiconductor chip mounting method, and semiconductor chip package |
| CN1301046C (en) * | 2002-05-13 | 2007-02-14 | 三井金属鉱业株式会社 | Flexible printed wiring board for chip-on-film |
| JP4677758B2 (en) * | 2004-10-14 | 2011-04-27 | 日立化成工業株式会社 | Die-bonded dicing sheet, method for manufacturing the same, and method for manufacturing a semiconductor device |
| JP2006265411A (en) * | 2005-03-24 | 2006-10-05 | Sekisui Chem Co Ltd | Adhesive in sheet form or paste form, method for producing electronic component device and electronic component device |
| JP2007009022A (en) * | 2005-06-29 | 2007-01-18 | Sekisui Chem Co Ltd | Sheet-like adhesive, method for producing electronic part device and electronic part device |
| JP5157208B2 (en) | 2006-03-20 | 2013-03-06 | 日立化成株式会社 | Die bond dicing sheet |
| KR100870810B1 (en) * | 2007-03-05 | 2008-11-27 | 주식회사 네패스 | Semiconductor package for optical detection and fabrication method thereof |
| JP2010129632A (en) * | 2008-11-26 | 2010-06-10 | Toppan Printing Co Ltd | Adhesive sheet with peeling sheet, metal plate sticking device, and metal plate sticking method |
| JP5741811B2 (en) * | 2011-02-23 | 2015-07-01 | 三菱マテリアル株式会社 | Composition for enhanced reflective transparent film for light emitting device, light emitting device, and method for producing light emitting device |
| US20150107764A1 (en) * | 2012-07-03 | 2015-04-23 | Toray Industries, Inc. | Process for producing adhesive sheet having singulated adhesive layer, process for producing wiring substrate using the adhesive sheet, method of manufacturing semiconductor equipment, and equipment for producing adhesive sheet |
| JP2014033177A (en) * | 2012-07-12 | 2014-02-20 | Denso Corp | Manufacturing method of semiconductor device |
| CN106739369A (en) * | 2016-12-25 | 2017-05-31 | 登封市豫科玻璃技术有限公司 | A kind of clean screen protecting film of antifouling shield with nanometer absorbed layer |
-
2017
- 2017-09-19 WO PCT/JP2017/033746 patent/WO2019058429A1/en active Application Filing
-
2018
- 2018-09-18 JP JP2019543645A patent/JPWO2019059188A1/en active Pending
- 2018-09-18 KR KR1020207010060A patent/KR102578510B1/en active IP Right Grant
- 2018-09-18 WO PCT/JP2018/034513 patent/WO2019059188A1/en active Application Filing
- 2018-09-18 CN CN201880060518.0A patent/CN111095505B/en active Active
- 2018-09-18 SG SG11202002552PA patent/SG11202002552PA/en unknown
- 2018-09-19 TW TW107132897A patent/TWI753200B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| CN111095505A (en) | 2020-05-01 |
| WO2019058429A1 (en) | 2019-03-28 |
| CN111095505B (en) | 2023-12-15 |
| WO2019059188A1 (en) | 2019-03-28 |
| TWI753200B (en) | 2022-01-21 |
| JPWO2019059188A1 (en) | 2020-11-19 |
| TW201922513A (en) | 2019-06-16 |
| KR20200055011A (en) | 2020-05-20 |
| KR102578510B1 (en) | 2023-09-13 |
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