SG11201703337RA - Film-like adhesive composite sheet and method for manufacturing semiconductor device - Google Patents
Film-like adhesive composite sheet and method for manufacturing semiconductor deviceInfo
- Publication number
- SG11201703337RA SG11201703337RA SG11201703337RA SG11201703337RA SG11201703337RA SG 11201703337R A SG11201703337R A SG 11201703337RA SG 11201703337R A SG11201703337R A SG 11201703337RA SG 11201703337R A SG11201703337R A SG 11201703337RA SG 11201703337R A SG11201703337R A SG 11201703337RA
- Authority
- SG
- Singapore
- Prior art keywords
- film
- semiconductor device
- composite sheet
- manufacturing semiconductor
- adhesive composite
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Die Bonding (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015042647 | 2015-03-04 | ||
| PCT/JP2016/056379 WO2016140248A1 (en) | 2015-03-04 | 2016-03-02 | Film-like adhesive composite sheet and method for manufacturing semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201703337RA true SG11201703337RA (en) | 2017-09-28 |
Family
ID=56849386
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201907601S SG10201907601SA (en) | 2015-03-04 | 2016-03-02 | Film-like adhesive composite sheet and method for manufacturing semiconductor device |
| SG11201703337RA SG11201703337RA (en) | 2015-03-04 | 2016-03-02 | Film-like adhesive composite sheet and method for manufacturing semiconductor device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201907601S SG10201907601SA (en) | 2015-03-04 | 2016-03-02 | Film-like adhesive composite sheet and method for manufacturing semiconductor device |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP3196265A4 (en) |
| JP (1) | JP6678641B2 (en) |
| CN (1) | CN107001875B (en) |
| SG (2) | SG10201907601SA (en) |
| TW (2) | TWI740500B (en) |
| WO (1) | WO2016140248A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6967506B2 (en) * | 2016-02-23 | 2021-11-17 | リンテック株式会社 | Method for manufacturing film-like adhesive composite sheet and semiconductor device |
| JP6926070B2 (en) * | 2016-05-02 | 2021-08-25 | 昭和電工マテリアルズ株式会社 | Resin film for temporary fixing |
| WO2018180594A1 (en) * | 2017-03-28 | 2018-10-04 | リンテック株式会社 | Film-like adhesive composite sheet and semiconductor device manufacturing method |
| WO2019130539A1 (en) * | 2017-12-28 | 2019-07-04 | リンテック株式会社 | Adhesive sheet and method for producing semiconductor device |
| JP7446887B2 (en) * | 2020-03-30 | 2024-03-11 | リンテック株式会社 | film adhesive |
| WO2024128199A1 (en) * | 2022-12-14 | 2024-06-20 | 日産化学株式会社 | Releaser composition for photoirradiation release, and adhesive composition for photoirradiation release |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5275553B2 (en) * | 2006-06-27 | 2013-08-28 | スリーエム イノベイティブ プロパティズ カンパニー | Method for manufacturing divided chips |
| MY151700A (en) * | 2007-10-09 | 2014-06-30 | Hitachi Chemical Co Ltd | Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device |
| JP2011023692A (en) * | 2009-06-15 | 2011-02-03 | Sekisui Chem Co Ltd | Dicing-die bonding tape and method of manufacturing the same, and method of manufacturing semiconductor chip |
| JP2011060848A (en) * | 2009-09-07 | 2011-03-24 | Nitto Denko Corp | Thermosetting type die bond film, dicing-die bond film and semiconductor device |
| JP5505421B2 (en) * | 2009-11-13 | 2014-05-28 | 日立化成株式会社 | Method for manufacturing film adhesive, adhesive sheet, semiconductor device, and method for manufacturing the same |
| JP2012033637A (en) * | 2010-07-29 | 2012-02-16 | Nitto Denko Corp | Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device |
| JP2012079936A (en) * | 2010-10-01 | 2012-04-19 | Nitto Denko Corp | Dicing, die-bonding film and method for manufacturing semiconductor device |
| JP5294358B2 (en) * | 2012-01-06 | 2013-09-18 | 古河電気工業株式会社 | Wafer processing tape and semiconductor device manufacturing method using the same |
| JP5908543B2 (en) * | 2014-08-07 | 2016-04-26 | 日東電工株式会社 | Manufacturing method of semiconductor device |
-
2016
- 2016-03-02 CN CN201680003728.7A patent/CN107001875B/en active Active
- 2016-03-02 SG SG10201907601S patent/SG10201907601SA/en unknown
- 2016-03-02 JP JP2017503676A patent/JP6678641B2/en active Active
- 2016-03-02 WO PCT/JP2016/056379 patent/WO2016140248A1/en active Application Filing
- 2016-03-02 SG SG11201703337RA patent/SG11201703337RA/en unknown
- 2016-03-02 EP EP16758941.5A patent/EP3196265A4/en not_active Withdrawn
- 2016-03-03 TW TW109116118A patent/TWI740500B/en active
- 2016-03-03 TW TW105106441A patent/TWI740819B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI740500B (en) | 2021-09-21 |
| TW201704402A (en) | 2017-02-01 |
| EP3196265A4 (en) | 2018-04-11 |
| CN107001875A (en) | 2017-08-01 |
| CN107001875B (en) | 2020-05-19 |
| SG10201907601SA (en) | 2019-10-30 |
| JPWO2016140248A1 (en) | 2017-12-14 |
| EP3196265A1 (en) | 2017-07-26 |
| JP6678641B2 (en) | 2020-04-08 |
| TW202033701A (en) | 2020-09-16 |
| WO2016140248A1 (en) | 2016-09-09 |
| TWI740819B (en) | 2021-10-01 |
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