SG11201704347YA - Adhesive sheet, and method for manufacturing processed article - Google Patents
Adhesive sheet, and method for manufacturing processed articleInfo
- Publication number
- SG11201704347YA SG11201704347YA SG11201704347YA SG11201704347YA SG11201704347YA SG 11201704347Y A SG11201704347Y A SG 11201704347YA SG 11201704347Y A SG11201704347Y A SG 11201704347YA SG 11201704347Y A SG11201704347Y A SG 11201704347YA SG 11201704347Y A SG11201704347Y A SG 11201704347YA
- Authority
- SG
- Singapore
- Prior art keywords
- adhesive sheet
- manufacturing processed
- processed article
- article
- manufacturing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laser Beam Processing (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014244009 | 2014-12-02 | ||
| PCT/JP2015/083414 WO2016088677A1 (en) | 2014-12-02 | 2015-11-27 | Adhesive sheet, and method for manufacturing processed article |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201704347YA true SG11201704347YA (en) | 2017-06-29 |
Family
ID=56091621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201704347YA SG11201704347YA (en) | 2014-12-02 | 2015-11-27 | Adhesive sheet, and method for manufacturing processed article |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6731852B2 (en) |
| KR (1) | KR102447759B1 (en) |
| CN (1) | CN106795396B (en) |
| SG (1) | SG11201704347YA (en) |
| TW (3) | TWI811763B (en) |
| WO (1) | WO2016088677A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107148663B (en) * | 2014-12-25 | 2020-11-06 | 电化株式会社 | Adhesive sheet for laser dicing and method for manufacturing semiconductor device |
| CN110073468B (en) * | 2016-11-02 | 2023-01-10 | 琳得科株式会社 | Cutting blade |
| JP7042271B2 (en) * | 2017-07-03 | 2022-03-25 | リンテック株式会社 | Manufacturing method of adhesive sheet for stealth dicing and semiconductor device |
| JP7109918B2 (en) * | 2017-12-28 | 2022-08-01 | 日東電工株式会社 | Dicing tape integrated semiconductor back adhesion film |
| JP7296944B2 (en) * | 2018-03-29 | 2023-06-23 | リンテック株式会社 | Work processing sheet |
| KR20200144090A (en) * | 2018-04-18 | 2020-12-28 | 린텍 가부시키가이샤 | Work sheet |
| JPWO2020195744A1 (en) * | 2019-03-27 | 2020-10-01 | ||
| KR102426261B1 (en) * | 2019-09-26 | 2022-07-29 | 주식회사 엘지화학 | Adhesive composition for dicing tape and dicing tape comprising the same |
| CN111693368A (en) * | 2020-06-15 | 2020-09-22 | 苏州高泰电子技术股份有限公司 | Test method for microscopic characterization performance of wafer cutting adhesive tape |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5124778B2 (en) | 1971-12-22 | 1976-07-27 | ||
| JP2005229040A (en) | 2004-02-16 | 2005-08-25 | Denki Kagaku Kogyo Kk | Pressure-sensitive adhesive sheet for fixing semiconductor base |
| JP4712468B2 (en) * | 2004-11-30 | 2011-06-29 | 古河電気工業株式会社 | Dicing die bond tape |
| JP4762671B2 (en) * | 2005-10-26 | 2011-08-31 | 古河電気工業株式会社 | Dicing tape and semiconductor wafer dicing method |
| JP5019619B2 (en) * | 2008-03-27 | 2012-09-05 | 古河電気工業株式会社 | Wafer surface protection tape |
| JP5124778B2 (en) * | 2008-09-18 | 2013-01-23 | リンテック株式会社 | Laser dicing sheet and semiconductor chip manufacturing method |
| JP2011040449A (en) * | 2009-08-07 | 2011-02-24 | Du Pont Mitsui Polychem Co Ltd | Substrate for dicing tape, the dicing tape, and method for manufacturing semiconductor device |
| JP5603757B2 (en) * | 2009-12-04 | 2014-10-08 | リンテック株式会社 | Laser dicing adhesive sheet and method for manufacturing semiconductor device |
| JP2012079936A (en) * | 2010-10-01 | 2012-04-19 | Nitto Denko Corp | Dicing, die-bonding film and method for manufacturing semiconductor device |
| US20130260140A1 (en) * | 2010-12-06 | 2013-10-03 | Kimoto Co., Ltd. | Auxiliary sheet for laser dicing |
| JP6071712B2 (en) * | 2013-04-05 | 2017-02-01 | 日東電工株式会社 | Adhesive tape |
-
2015
- 2015-11-27 JP JP2016562422A patent/JP6731852B2/en active Active
- 2015-11-27 CN CN201580047960.6A patent/CN106795396B/en active Active
- 2015-11-27 SG SG11201704347YA patent/SG11201704347YA/en unknown
- 2015-11-27 WO PCT/JP2015/083414 patent/WO2016088677A1/en active Application Filing
- 2015-11-27 KR KR1020177005685A patent/KR102447759B1/en active IP Right Grant
- 2015-12-01 TW TW110129890A patent/TWI811763B/en active
- 2015-12-01 TW TW108148058A patent/TW202014490A/en unknown
- 2015-12-01 TW TW104140062A patent/TWI738633B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106795396B (en) | 2020-12-18 |
| JPWO2016088677A1 (en) | 2017-09-07 |
| TW201629171A (en) | 2016-08-16 |
| KR102447759B1 (en) | 2022-09-27 |
| TWI738633B (en) | 2021-09-11 |
| JP6731852B2 (en) | 2020-07-29 |
| CN106795396A (en) | 2017-05-31 |
| TWI811763B (en) | 2023-08-11 |
| KR20170091578A (en) | 2017-08-09 |
| TW202014490A (en) | 2020-04-16 |
| TW202144516A (en) | 2021-12-01 |
| WO2016088677A1 (en) | 2016-06-09 |
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