WO2016088677A1 - Adhesive sheet, and method for manufacturing processed article - Google Patents
Adhesive sheet, and method for manufacturing processed article Download PDFInfo
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- WO2016088677A1 WO2016088677A1 PCT/JP2015/083414 JP2015083414W WO2016088677A1 WO 2016088677 A1 WO2016088677 A1 WO 2016088677A1 JP 2015083414 W JP2015083414 W JP 2015083414W WO 2016088677 A1 WO2016088677 A1 WO 2016088677A1
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- Prior art keywords
- pressure
- sensitive adhesive
- adhesive sheet
- plate
- base material
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Definitions
- the present invention relates to a pressure-sensitive adhesive sheet that irradiates a plate-like member with laser light to form a modified portion, and divides the plate-like member into pieces to obtain a chip-like workpiece. Moreover, this invention relates to the method of manufacturing workpieces, such as a chip
- ⁇ As wafers that are brittle members become thinner, there is a higher risk of breakage during processing and transportation.
- chipping or the like occurs particularly on the back side of the semiconductor wafer, and the die strength of the chip is significantly reduced.
- a so-called stealth dicing method in which a dicing line is formed while a modified portion is selectively formed by irradiating the inside of a semiconductor wafer with a laser beam, and the semiconductor wafer is cut starting from the modified portion.
- Patent Document 1 a so-called stealth dicing method is proposed in which a dicing line is formed while a modified portion is selectively formed by irradiating the inside of a semiconductor wafer with a laser beam, and the semiconductor wafer is cut starting from the modified portion.
- the stealth dicing method after forming the modified portion by irradiating the inside of the semiconductor wafer with a laser beam, the ultrathin semiconductor wafer is attached to an adhesive sheet (dicing sheet) composed of a base material and an adhesive layer, By expanding the dicing sheet, the semiconductor wafer can be divided (diced) along the dicing line, and semiconductor chips can be produced with high yield.
- a laser is used as a processing means in the dicing process as described above, and a laser is also used as a tool for accurately aligning a plate-like member such as a semiconductor wafer in the dicing process.
- the pressure-sensitive adhesive sheet used when laser light is used in the dicing process (in this specification, this pressure-sensitive adhesive sheet is also referred to as “laser dicing sheet”) is used when the laser dicing sheet is used. If the laser is transmitted, it must have excellent transparency to the laser light.
- Patent Document 2 discloses a laser dicing sheet comprising a base material and an adhesive layer formed on one side thereof, and has a total light transmittance in a wavelength region of 300 to 400 nm. There is disclosed a laser dicing sheet that is 60% or more, has a haze of 20% or less, and has a transmission definition of 30 or more when the width of the optical comb is 0.25 mm.
- JP 2005-229040 A Japanese Patent No. 5124778
- Patent Document 2 discloses the above-described laser dicing sheet, in which the center line average roughness Ra on one side of the substrate is larger than the center line average roughness Ra on the other side, and the center line average roughness Ra is large.
- a surface having a center line average roughness Ra of 0.3 to 0.7 ⁇ m is defined as a pressure-sensitive adhesive layer forming surface, and the center line of the surface on the opposite side of the surface of the substrate.
- a laser dicing sheet having an average roughness Ra of 0.14 ⁇ m is disclosed (Example of Patent Document 2).
- Such a laser dicing sheet has a smooth surface on the side opposite to the pressure-sensitive adhesive layer forming surface of the substrate, which is the surface on which the laser is incident. This prevents the laser light from being used effectively.
- a workpiece such as a semiconductor chip manufactured from a plate-like member such as a semiconductor wafer using a laser dicing sheet tends to be thinner.
- a silicon wafer may be used instead of a substrate, and a chip may be stacked thereon using a Si through electrode (TSV, Through-Silicon Via).
- TSV Through-Silicon Via
- the pressure-sensitive adhesive layer of the laser dicing sheet is easily peeled off from the workpiece attached to the pressure-sensitive adhesive layer. It is preferable that it can be (excellent pickup property).
- the laser dicing sheet described in Patent Document 2 there may be a portion where the pressure-sensitive adhesive layer is not properly formed on the substrate. Such a portion is observed as a defect in a plan view of the laser dicing sheet, and may cause nonuniformity in the arrival light of the laser plate member incident to process the plate member.
- the present invention provides a pressure-sensitive adhesive sheet that is used when laser light is used in a dicing process, and that provides a pressure-sensitive adhesive sheet that is less prone to defects and has excellent pick-up properties. It is an object to provide a method for producing a workpiece from a member.
- the thickness of an adhesive layer shall be 2 micrometers or more and 12 micrometers or less, and arithmetic mean roughness Ra of both surfaces of a base material shall be 0.2 micrometers or less.
- the present inventors have obtained new knowledge that a pressure-sensitive adhesive sheet having excellent pickup properties can be obtained while stably reducing the possibility of occurrence of defects.
- the present invention completed based on the above findings is as follows.
- An adhesive layer provided on the surface, and the base material is arithmetically defined in JIS B0601: 2013 (ISO 4287: 1997) for both the one surface and the surface opposite to the one surface.
- the pressure-sensitive adhesive sheet is characterized in that an average roughness Ra is 0.01 ⁇ m or more and 0.2 ⁇ m or less, and a thickness of the pressure-sensitive adhesive layer is 2 ⁇ m or more and 12 ⁇ m or less.
- the pressure-sensitive adhesive sheet has a haze specified in JIS K7136: 2000 (ISO 14782: 1999) of 0.01% or more and 10% or less when the base material side is the incident side (1) ) Adhesive sheet.
- the acrylic polymer includes a structural unit derived from methyl methacrylate, and the mass ratio of methyl methacrylate to the whole monomer giving the acrylic polymer is 5% by mass or more and 20% by mass or less.
- the pressure-sensitive adhesive sheet according to (3) is a structural unit derived from methyl methacrylate, and the mass ratio of methyl methacrylate to the whole monomer giving the acrylic polymer is 5% by mass or more and 20% by mass or less.
- a surface closer to the pressure-sensitive adhesive layer than the base material of the pressure-sensitive adhesive sheet described in any one of (1) to (8) is set to one surface of an adherend including a plate-like member.
- the first laminate provided for the dividing step includes an additional layer between the pressure-sensitive adhesive layer and the plate-like member, and the additional layer is also divided by the dividing step, and the pickup step
- the chip separated from the pressure-sensitive adhesive sheet comprises a divided body of the plate-like member and a divided body of the additional layer formed on a surface proximal to the pressure-sensitive adhesive sheet of the divided body of the plate-like member.
- an adhesive sheet that is less prone to defects and has excellent pick-up properties. Moreover, it becomes possible to manufacture a processed material stably from a plate-shaped member by using this adhesive sheet.
- Adhesive sheet The adhesive sheet which concerns on one Embodiment of this invention is equipped with a base material and an adhesive layer.
- the base material of the pressure-sensitive adhesive sheet according to this embodiment is a surface opposite to the pressure-sensitive adhesive layer (also referred to as “pressure-sensitive adhesive processing surface” in this specification) and the pressure-sensitive adhesive processing surface.
- arithmetic average roughness Ra (hereinafter referred to as “arithmetic average roughness Ra”) defined in JIS B0601: 2013 (ISO 4287: 1997). “Is used in this sense.)” Is 0.2 ⁇ m or less.
- the laser light incident from the base material side of the pressure-sensitive adhesive sheet easily reaches the plate-like member to which the pressure-sensitive adhesive sheet is stuck uniformly.
- the plate-like member non-uniformly, for example, there is a portion where the modified portion is not properly formed in the plate-like member, and the plate-like member is appropriately separated at this portion.
- the arithmetic average roughness Ra is preferably 0.18 ⁇ m or less, and preferably 0.16 ⁇ m or less for both the pressure-sensitive adhesive processed surface and the laser incident surface.
- the lower limit of the arithmetic average roughness Ra is not limited for the pressure-sensitive adhesive processed surface.
- the arithmetic average roughness Ra is preferably 0.01 ⁇ m or more for both the pressure-sensitive adhesive processed surface and the laser incident surface.
- the constituent material of the base material according to an embodiment of the present invention can satisfy the condition regarding the arithmetic average roughness Ra, and can be used as a base material of a laser dicing sheet, that is, a laser beam having a desired wavelength.
- a base material of a laser dicing sheet that is, a laser beam having a desired wavelength.
- the base material according to an embodiment of the present invention is usually composed of a film mainly composed of a resin-based material. This film may be a single layer or a laminate.
- resin materials contained in such films include polypropylene such as random copolymer polypropylene and block copolymer polypropylene, polyethylene such as low density polyethylene (LDPE), linear low density polyethylene (LLDPE), and high density polyethylene (HDPE).
- polypropylene such as random copolymer polypropylene and block copolymer polypropylene
- polyethylene such as low density polyethylene (LDPE), linear low density polyethylene (LLDPE), and high density polyethylene (HDPE).
- LDPE low density polyethylene
- LLDPE linear low density polyethylene
- HDPE high density polyethylene
- Ethylene-vinyl acetate copolymer ethylene- (meth) acrylic acid copolymer
- ethylene- (meth) acrylic acid ester copolymer ethylene-based copolymer such as ethylene-norbornene copolymer, norbornene resin, etc.
- Polyolefin materials such as cycloolefin polymer (COP) polybutene, polybutadiene, and polymethylpentene; polyvinyl chloride materials such as polyvinyl chloride and vinyl chloride copolymers; polyethylene terephthalate, polybutylene terephthalate Polyester materials such as: Polyurethane materials; Polyimide materials; Ionomer resin materials; Polyacrylic materials such as alkyl (meth) acrylate homopolymers and alkyl (meth) acrylate copolymers; Polystyrene materials; Polycarbonate materials Examples thereof include resin materials, fluororesin materials, and resin materials mainly composed of water additives and modified products of these resin materials.
- COP cycloolefin polymer
- the resin material may be a cross-linked product of the above material and a cross-linking agent.
- (meth) acrylic acid in the present specification means both acrylic acid and methacrylic acid. The same applies to other similar terms.
- the resin-based material that provides the base material may be a single type or a mixture of two or more types. From the viewpoint of high laser transmittance, ease of local deformation in the in-plane direction and thickness direction, and low environmental load, the substrate according to an embodiment of the present invention contains a polyolefin-based material. Among the polyolefin-based materials, it is more preferable to contain a polypropylene such as a random copolymer polypropylene.
- the control of the arithmetic surface roughness Ra of both surfaces of the base material is a roll that sandwiches the base material using two rolls. Performed by pressurization. By adjusting the material constituting the surfaces of these rolls and the surface roughness, the arithmetic surface roughness Ra of both surfaces of the substrate is set.
- the surfaces of these rolls are generally made of one material made of metal and the other made of an elastic material such as rubber.
- the arithmetic surface roughness Ra of the surface of the base material in contact with the roll made of a metal surface could be made relatively low, but the base material in contact with the roll made of an elastic material It was difficult to make the arithmetic surface roughness Ra of the surface low.
- both the rolls required for roll pressurization are made of metal. It is preferable. However, in this case, it is necessary to more strictly control the relative arrangement of both the rolls and the substrate as compared with the case where the surface of one roll is made of an elastic material.
- the base material When the resin-based material contained in the base material is a polyvinyl chloride-based material, the base material can be manufactured by inflation molding, so the arithmetic surface roughness Ra on both sides of the base material is low. Setting to a value is easy. However, since the polyvinyl chloride-based material contains a halogen element, it is preferable not to use it as a base material when it is required to reduce the environmental load.
- the base material may contain various additives such as a colorant, a flame retardant, a plasticizer, an antistatic agent, a lubricant, and a filler in a film mainly composed of the resin-based material.
- the colorant include pigments such as titanium dioxide and carbon black, and various dyes.
- the filler include organic materials such as melamine resin, inorganic materials such as fumed silica, and metal materials such as nickel particles.
- the content of such additives is not particularly limited, but should be within a range in which the substrate exhibits a desired function, particularly a function of transmitting laser, and does not lose desired smoothness and flexibility.
- the substrate has transparency to the ultraviolet rays.
- a base material has the transparency of an electron beam.
- the thickness of the substrate is not limited as long as the pressure-sensitive adhesive sheet can function properly in each of the aforementioned steps.
- the thickness is preferably 20 to 450 ⁇ m, more preferably 25 to 200 ⁇ m, and particularly preferably 50 to 150 ⁇ m.
- the base material preferably has a Young's modulus of 50 to 500 MPa.
- the Young's modulus is more preferably 60 to 450 MPa, and further preferably 100 to 420 MPa, from the viewpoint of making blocking difficult to occur and improving the expandability while improving the mechanical strength. More preferably, the pressure is 150 to 300 MPa.
- the pressure-sensitive adhesive layer provided in the pressure-sensitive adhesive sheet according to this embodiment has a thickness of 2 ⁇ m or more and 12 ⁇ m or less. Since the thickness of the pressure-sensitive adhesive layer is within the above range and the arithmetic average roughness Ra of both surfaces of the base material is within the above range, defects are unlikely to occur in a plan view and excellent pick-up properties are obtained. An adhesive sheet can be obtained. From the viewpoint of more stably reducing the possibility of occurrence of the above disadvantages, the thickness of the pressure-sensitive adhesive layer is preferably 3 ⁇ m or more, and more preferably 4 ⁇ m or more. From the viewpoint of more stably realizing an adhesive sheet having excellent pick-up properties, the thickness of the adhesive layer is preferably 10 ⁇ m or less, more preferably 8 ⁇ m or less, and 6 ⁇ m or less. It is particularly preferred.
- the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer included in the pressure-sensitive adhesive sheet according to this embodiment is not limited.
- Examples of the pressure-sensitive adhesive contained in the pressure-sensitive adhesive composition include rubber-based, acrylic-based, silicone-based, and polyvinyl ether-based pressure-sensitive adhesives.
- the case where the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer contains an acrylic pressure-sensitive adhesive will be described as an example.
- Acrylic pressure-sensitive adhesives are excellent in transparency, and are easy to transmit laser beams.
- the acrylic pressure-sensitive adhesive contains an acrylic polymer.
- An acrylic polymer is a polymer containing a structural unit based on an acrylic compound as a unit constituting its skeleton.
- the acrylic polymer may be a homopolymer obtained by polymerizing one kind of monomer, or may be a copolymer obtained by polymerizing plural kinds of monomers. From the viewpoint of easily controlling physical properties and chemical properties of the polymer, the acrylic polymer is preferably a copolymer.
- the acrylic polymer preferably has a glass transition temperature Tg of ⁇ 40 ° C. or higher and ⁇ 10 ° C. or lower.
- the pressure-sensitive adhesive composition contains an acrylic polymer having a glass transition temperature Tg of ⁇ 40 ° C. or higher, the pressure-sensitive adhesive layer is reduced in stickiness, and pickup properties can be further improved.
- the glass transition temperature Tg of the acrylic polymer is more preferably ⁇ 35 ° C. or higher.
- the glass transition temperature Tg of the acrylic polymer is preferably ⁇ 20 ° C. or lower from the viewpoint that it is easy to maintain the performance of holding the chip after dividing the wafer into chips.
- the weight average molecular weight (Mw) of the acrylic polymer is not limited. Usually, it is preferably 100,000 to 2,000,000, more preferably 300,000 to 1,500,000. Further, the molecular weight distribution (Mw / Mn, Mn is the number average molecular weight) is not limited. Usually, it is preferably 1.0 to 10, and more preferably 1.0 to 3.0.
- the specific type of monomer that gives the acrylic polymer is not limited.
- examples of such monomers include (meth) acrylic acid, (meth) acrylic acid ester, acrylonitrile and the like.
- Specific examples of (meth) acrylic acid esters include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, dodecyl (Meth) acrylate, pentadecyl (meth) acrylate, octadecyl (meth) acrylate, etc.
- alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms cycloalkyl (meth) acrylate, benzyl (meth) acrylate, iso (Meth) acrylates having a cyclic skeleton such as bornyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, imide acrylate; Le (meth) acrylate, 2-hydroxypropyl having (meth) hydroxyl group, such as acrylates (meth) acrylate; glycidyl methacrylate, (meth) acrylate having an epoxy group such as glycidyl acrylate.
- the acrylic polymer preferably contains methyl methacrylate from the viewpoint of increasing its glass transition temperature Tg. From the viewpoint of more stably enjoying the effect brought about by the acrylic polymer containing methyl methacrylate, the mass ratio of methyl methacrylate to the whole monomer giving the acrylic polymer is 5% by mass or more and 20% by mass. Or less, more preferably 7% by mass or more and 15% by mass or less.
- the acrylic polymer may be a copolymer containing vinyl acetate, styrene, vinyl acetate or the like as a monomer.
- the acrylic polymer may have at least one of an energy ray polymerizable group and a reactive functional group capable of reacting with the crosslinking agent (hereinafter abbreviated as “reactive functional group”).
- the pressure-sensitive adhesive sheet having excellent pick-up properties can be reduced by irradiating the pressure-sensitive adhesive layer with energy rays. Can be easily obtained.
- the energy beam polymerizable group include a group containing a polymerizable double bond. The preparation method of the acrylic polymer having an energy ray polymerizable group is not limited.
- an acrylic polymer having a functional group having an active hydrogen such as a hydroxyl group, a carboxylic acid group, or an amino group, and functional group capable of reacting with the above functional group such as an isocyanate group and energy beam polymerization Reacting a substance having a functional group specifically examples include (meth) acryloyloxyethyl isocyanate.
- the acrylic pressure-sensitive adhesive contains an acrylic polymer containing an energy beam polymerizable group by such an adjustment method
- the glass transition temperature Tg of the acrylic polymer described above is Tg before reacting a substance having a functional group capable of reacting with a group and an energy ray polymerizable group.
- the cohesiveness of the pressure-sensitive adhesive layer is adjusted by reacting this reactive functional group with a cross-linking agent. It becomes easy to suppress the generation of a residue or to further improve the pickup property by reducing the adhesiveness of the adhesive layer.
- the combination of the reactive functional group and the crosslinking agent is not limited. Examples of reactive functional groups include groups having active hydrogen such as hydroxyl groups, carboxylic acid groups, and amino groups.
- Examples of the crosslinking agent include an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, and a metal chelate crosslinking agent.
- the isocyanate-based crosslinking agent contains at least a polyisocyanate compound having a plurality of isocyanate groups.
- the polyisocyanate compound include aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate; dicyclohexylmethane-4,4′-diisocyanate, bicycloheptane triisocyanate, cyclopentylene diisocyanate, cyclohexylene diisocyanate, methyl Alicyclic isocyanate compounds such as cyclohexylene diisocyanate and hydrogenated xylylene diisocyanate; acyclic aliphatic isocyanates such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate and lysine diisocyanate, and their biuret and isocyanurate forms, compounds having an isocyanate group
- epoxy-based crosslinking agent examples include 1,3-bis (N, N′-diglycidylaminomethyl) cyclohexane, N, N, N ′, N′-tetraglycidyl-m-xylylenediamine, ethylene glycol diglycidyl.
- examples include ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane diglycidyl ether, diglycidyl aniline, diglycidyl amine and the like.
- aziridine-based crosslinking agent examples include diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane tri- ⁇ -aziridinyl propionate, tetramethylolmethane tri- ⁇ -aziridinyl.
- Metal chelate crosslinking agents include chelate compounds whose metal atoms are aluminum, zirconium, titanium, zinc, iron, tin and the like. Among these, an aluminum chelate compound is preferable because of its excellent performance.
- the aluminum chelate compound include diisopropoxy aluminum monooleyl acetoacetate, monoisopropoxy aluminum bis oleyl acetoacetate, monoisopropoxy aluminum monooleate monoethyl acetoacetate, diisopropoxy aluminum monolauryl acetoacetate, diisopropoxy Examples thereof include aluminum monostearyl acetoacetate and diisopropoxy aluminum monoisostearyl acetoacetate.
- the pressure-sensitive adhesive composition may contain components other than the acrylic polymer.
- An example of such a material is an energy beam polymerizable compound.
- the energy beam polymerizable compound is a compound that polymerizes when irradiated with energy rays such as ultraviolet rays and electron beams.
- Examples of the energy beam polymerizable compound include low molecular weight compounds (monofunctional and polyfunctional monomers and oligomers) having an energy beam polymerizable group, and specifically include trimethylolpropane triacrylate and tetramethylolmethane.
- Tetraacrylate pentaerythritol triacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, dicyclopentadiene dimethoxydiacrylate, isobornyl Cyclic aliphatic skeleton-containing acrylate such as acrylate, polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate oligomer, epoxy Modified acrylate, acrylate compounds, such as polyether acrylate is employed.
- Such a compound has at least one polymerizable double bond in the molecule, and usually has a molecular weight of about 100 to 30,000, preferably about 300 to 10,000.
- the pressure-sensitive adhesive composition is an acrylic pressure-sensitive adhesive and contains an acrylic polymer containing an energy ray polymerizable group
- the pressure sensitive adhesive composition contains a low molecular weight compound having an energy ray polymerizable group. Even if it does not contain or contains only a small amount, the adhesiveness with respect to a to-be-adhered body can be reduced by irradiating an energy ray to an adhesive layer.
- there is much content of the low molecular weight compound which has an energy-beam polymeric group in an adhesive composition there exists a tendency for pick-up property to fall.
- the pressure-sensitive adhesive composition is an acrylic pressure-sensitive adhesive, and by using an acrylic polymer containing an energy ray polymerizable group, the amount of low molecular weight compound having an energy ray polymerizable group is reduced, The pickup property can be further improved.
- the pressure-sensitive adhesive composition is an acrylic pressure-sensitive adhesive
- the pressure-sensitive adhesive composition preferably contains 0 to 30 parts by mass of the energy ray polymerizable compound with respect to 100 parts by mass of the acrylic polymer. The content is more preferably 0 to 15 parts by mass, and further preferably 0 to 10 parts by mass.
- the pressure-sensitive adhesive composition contains an acrylic polymer having an energy ray polymerizable group or contains an energy ray polymerizable compound, it preferably contains a photopolymerization initiator.
- photopolymerization initiators include photoinitiators such as benzoin compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, thioxanthone compounds, and peroxide compounds, and photosensitizers such as amines and quinones.
- 1-hydroxycyclohexyl phenyl ketone benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, ⁇ -chloranthraquinone 2,4,6-trimethylbenzoyldiphenylphosphine oxide and the like.
- a photopolymerization initiator when ultraviolet rays are used as energy rays, the irradiation time and irradiation amount can be reduced.
- Examples of the energy beam for reacting the energy beam polymerizable group and the energy beam polymerizable compound include ionizing radiation, that is, X-rays, ultraviolet rays, and electron beams. Among these, ultraviolet rays that are relatively easy to introduce irradiation equipment are preferable.
- near ultraviolet rays including ultraviolet rays having a wavelength of about 200 to 380 nm may be used for ease of handling.
- the amount of ultraviolet light may be appropriately selected according to the type of energy ray polymerizable group or energy ray polymerizable compound contained in the pressure sensitive adhesive layer and the thickness of the pressure sensitive adhesive layer, and is usually about 50 to 500 mJ / cm 2. 100 to 450 mJ / cm 2 is preferable, and 150 to 400 mJ / cm 2 is more preferable.
- the ultraviolet illumination is usually 50 ⁇ 500mW / cm 2 or so, preferably 100 ⁇ 450mW / cm 2, more preferably 150 ⁇ 400mW / cm 2.
- an ultraviolet-ray source For example, a high pressure mercury lamp, a metal halide lamp, etc. are used.
- the acceleration voltage is appropriately selected according to the type of energy beam polymerizable group and energy beam polymerizable compound contained in the pressure sensitive adhesive layer and the thickness of the pressure sensitive adhesive layer.
- the acceleration voltage is preferably about 10 to 1000 kV.
- the irradiation dose may be set in a range in which the reaction of the energy beam polymerizable group or energy beam polymerizable compound contained in the pressure-sensitive adhesive layer appropriately proceeds, and is usually selected in the range of 10 to 1000 krad.
- the electron beam source is not particularly limited, and for example, various electron beam accelerators such as a Cockloft Walton type, a bandegraft type, a resonant transformer type, an insulated core transformer type, a linear type, a dynamitron type, and a high frequency type are used. be able to.
- various electron beam accelerators such as a Cockloft Walton type, a bandegraft type, a resonant transformer type, an insulated core transformer type, a linear type, a dynamitron type, and a high frequency type are used. be able to.
- the pressure-sensitive adhesive sheet according to one embodiment of the present invention is such that the haze specified by JIS K7136: 2000 (ISO 14782: 1999) is a surface closer to the base material than the pressure-sensitive adhesive layer. Is preferably 0.01% or more and 10% or less. When the haze is 10% or less, the laser light incident on the pressure-sensitive adhesive sheet can be effectively used. From the viewpoint of enabling more stable and effective use of laser light incident on the pressure-sensitive adhesive sheet, the haze is preferably 5% or less, more preferably 2.5% or less. . From the viewpoint of effective utilization of the laser light incident on the adhesive sheet, the lower limit of the above haze is not set. From the viewpoint of improving production stability, the haze is preferably about 0.01% or more.
- the pressure-sensitive adhesive sheet according to one embodiment of the present invention has a total light transmittance of 85% or more when the surface closer to the substrate than the pressure-sensitive adhesive layer is the incident surface, as defined in JIS K7375: 2000. Preferably there is.
- the total light transmittance is 85% or more, the laser light incident on the adhesive sheet can be effectively used.
- the total light transmittance is preferably 90% or more.
- the upper limit of the total light transmittance is not set.
- the total light transmittance is preferably about 99.99% or less.
- the adhesive sheet which concerns on one Embodiment of this invention is provided with the additional layer in the surface at the side of an adhesive layer, and is an adherend of an adhesive sheet in the case of use of an adhesive sheet.
- the additional layer may be attached to the plate-like member.
- the configuration of the additional layer is not limited. Specific examples of the additional layer include a case where the additional layer includes a protective film-forming film and a case where the additional layer includes a die bonding layer.
- the protective film-forming film is made of a material that can be cured by external energy such as heat to form a protective film.
- the protective film-forming film or the protective film is separated from the pressure-sensitive adhesive layer in a state where the divided body is attached to a chip-shaped member obtained by separating the plate-shaped member. Therefore, when the additional layer is a protective film-forming film, it is possible to obtain a processed product in which the protective film-forming film or the protective film divided body is laminated on one surface of the chip-like member.
- the additional layer is a die bonding layer
- the die bonding layer is separated from the pressure-sensitive adhesive layer in a state where the divided body of the die bonding layer is attached to the chip-like member obtained by separating the plate-like member. Therefore, when the additional layer is a die bonding layer, it is possible to obtain a processed product in which the die bonding layer divided body is laminated on one surface of the chip-like member.
- the pressure-sensitive adhesive sheet according to an embodiment of the present invention is for the purpose of protecting the pressure-sensitive adhesive layer or the additional layer until the pressure-sensitive adhesive layer or the additional layer is applied to the plate-like member as the adherend.
- the release surface of the release sheet may be bonded to the surface closer to the adhesive layer than the base material of the adhesive sheet, specifically to the surface of the adhesive layer or the surface of the additional layer.
- the configuration of the release sheet is arbitrary, and examples include a plastic film coated with a release agent.
- Specific examples of the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, and polyolefin films such as polypropylene and polyethylene.
- silicone-based, fluorine-based, long-chain alkyl-based, and the like can be used, and among these, a silicone-based material that is inexpensive and provides stable performance is preferable.
- a paper base such as glassine paper, coated paper, and high-quality paper, or a laminated paper obtained by laminating a thermoplastic resin such as polyethylene on a paper base may be used.
- a thermoplastic resin such as polyethylene on a paper base
- the surface closer to the pressure-sensitive adhesive layer than the base material specifically, the surface of the pressure-sensitive adhesive layer or the surface of the additional layer, Affixed to one surface of the adherend including the plate-like member to obtain a first laminate including the adhesive sheet and the plate-like member.
- the plate member is not limited. Examples thereof include a semiconductor wafer such as a silicon wafer, a laminate having a structure based on TSV, and the like.
- the thickness of the plate member is not limited. A range of several tens of ⁇ m to several hundreds of ⁇ m is exemplified.
- the first laminate may be provided with an additional layer.
- the additional layer include a protective film forming film, a protective film formed from the protective film forming film, and a die bonding layer.
- the additional layer may be affixed to the plate-like member as a part of the pressure-sensitive adhesive sheet, or the additional layer may be previously laminated on one surface of the plate-like member. In the latter case, the surface of the additional layer opposite to the surface facing the plate member is the surface to which the adhesive sheet is attached as one surface of the adherend including the plate member.
- the laser beam is irradiated so as to be focused on the focal point set inside the plate-like member, and the inside of the plate-like member is reformed.
- the wavelength of the laser beam and the irradiation method are appropriately set according to the structure of the plate member, the structure such as the thickness, and the like.
- the plate member may be irradiated with laser light through an adhesive sheet. Even in such a case, the pressure-sensitive adhesive sheet according to an embodiment of the present invention is less likely to have a defect in a plan view. The problem that the generation of the modified portion in the shaped member becomes locally inappropriate is unlikely to occur.
- the plate-like member may not be properly divided in the above-described dividing step. If the plate-shaped member is improperly divided, the possibility that the quality of the workpiece is lowered increases.
- a chip can be obtained as a workpiece by separating each of the plurality of chips included in the second laminate from the adhesive sheet.
- the separation method is not limited.
- the adhesive sheet is deformed locally by pushing up pins and the like from the surface opposite to the chip facing side of the adhesive sheet, thereby reducing the adhesiveness of the adhesive layer to the chip to be separated.
- the chip is separated from the pressure-sensitive adhesive sheet by peeling off the chip to be separated from the pressure-sensitive adhesive sheet using a vacuum collet or the like. In this case, when the pin is pushed up or when the chip is pulled up with a vacuum collet, a force for peeling off the adhesive layer from the chip is applied.
- the chip When the chip is thin or has a structure based on TSV, there is a possibility that the chip may be cracked during the peeling.
- the pressure-sensitive adhesive sheet according to an embodiment of the present invention since the thickness of the pressure-sensitive adhesive layer is appropriately controlled, the possibility that the chip breaks during the peeling is appropriately reduced. That is, the pressure-sensitive adhesive sheet according to one embodiment of the present invention is excellent in pickup properties.
- the chip separated from the pressure-sensitive adhesive sheet by this pick-up step is on the surface of the plate-shaped member divided body and the pressure-sensitive adhesive sheet of the plate-shaped member divided body.
- the division body of the formed additional layer is provided. That is, in the pick-up process, peeling occurs between the pressure-sensitive adhesive layer and the divided body of the additional layer, and the workpiece is separated from the pressure-sensitive adhesive sheet.
- the additional layer which gives the divided body of an additional layer is a protective film
- the time when a protective film is formed from a protective film formation film is not limited.
- the additional layer provided in the first laminate is a protective film-forming film, and the work of forming the protective film from the protective film-forming film may be performed before the start of the separation step.
- the additional layer that gives the divided body of the additional layer is a protective film-forming film, and the protective film may be formed from the divided body of the protective film-forming film provided in the workpiece.
- Example 1 Production of base material Extrusion molding is performed using a resin composition made of a random copolymer polypropylene resin with a small T-die extruder (“Lab Plast Mill” manufactured by Toyo Seiki Seisakusho Co., Ltd.), and one surface (adhesive processing) A film having an arithmetic surface roughness Ra of 0.03 ⁇ m and an other surface (corresponding to a laser incident surface) of 0.03 ⁇ m. did. The surface roughness of the substrate was measured using a surface roughness measuring machine (“SV-3000” manufactured by Mitutoyo Corporation).
- SV-3000 surface roughness measuring machine
- Example 2 A pressure-sensitive adhesive sheet was obtained in a state where a release sheet was laminated on the surface on the pressure-sensitive adhesive layer side in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer was 5 ⁇ m.
- Example 3 Except for the following changes, the pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, with the release sheet laminated on the surface on the pressure-sensitive adhesive layer side. (Changes) The molding conditions of the base material were changed so that the arithmetic surface roughness Ra of the pressure-sensitive adhesive processed surface of the base material was 0.16 ⁇ m, and the arithmetic surface roughness Ra of the laser incident surface was 0.03 ⁇ m.
- Example 4 Except for the following changes, the pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, with the release sheet laminated on the surface on the pressure-sensitive adhesive layer side. (Changes) The molding conditions of the substrate were changed so that the arithmetic surface roughness Ra of the pressure-sensitive adhesive processed surface of the substrate was 0.04 ⁇ m, and the arithmetic surface roughness Ra of the laser incident surface was 1.3 ⁇ m.
- a laser irradiation device Using a laser irradiation device, a laser focused on the inside of the wafer through the adhesive sheet from the side facing the adhesive layer of the silicon wafer is cut so that an 8 mm ⁇ 8 mm chip is formed. Irradiation was performed while scanning along the planned line. After irradiating all the planned cutting lines with laser, using an expander, pull out the 10 mm adhesive sheet at a speed of 10 mm / second, and remove the area where the silicon wafer is attached on the adhesive layer side of the adhesive sheet inside and outside the main surface. Stretched in the direction.
- the adhesive sheet was irradiated with ultraviolet rays under the following irradiation conditions.
- Illuminance 220 mW / cm 2
- Light intensity 190 mJ / cm 2
- the pressure-sensitive adhesive sheet of the example satisfying the conditions of the present invention had a low haze, hardly suffered from defects, was excellent in pickup properties, and was suitable as a laser dicing sheet.
- the pressure-sensitive adhesive sheet according to the present invention is suitably used as a laser dicing sheet.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Laminated Bodies (AREA)
Abstract
Description
上記知見に基づき完成された本発明は次のとおりである。 When the present inventors examined in order to achieve the said objective, the thickness of an adhesive layer shall be 2 micrometers or more and 12 micrometers or less, and arithmetic mean roughness Ra of both surfaces of a base material shall be 0.2 micrometers or less. The present inventors have obtained new knowledge that a pressure-sensitive adhesive sheet having excellent pickup properties can be obtained while stably reducing the possibility of occurrence of defects.
The present invention completed based on the above findings is as follows.
本発明の一実施形態に係る粘着シートは、基材および粘着剤層を備える。 1. Adhesive sheet The adhesive sheet which concerns on one Embodiment of this invention is equipped with a base material and an adhesive layer.
本実施形態に係る粘着シートの基材は、粘着剤層に対向する側の面(本明細書において「粘着剤加工面」ともいう。)および粘着剤加工面と反対側の面(本明細書において「レーザー入射面」ともいう。)の双方について、JIS B0601:2013(ISO 4287:1997)に規定される算術平均粗さRa(以下、ことわりのない「算術平均粗さRa」はこの意味で用いる。)が0.2μm以下である。これらの面の算術平均粗さRaが0.2μm以下であることにより、粘着シートの平面視で欠点が観測されにくい。このため、粘着シートの基材側から入射されたレーザー光が、粘着シートが貼付された板状部材に均一に到達しやすい。かかるレーザー光が板状部材に不均一に到達する場合には、例えば、板状部材内に適切に改質部が形成されていない部分が生じ、この部分で板状部材の個片化が適切に行われないといった不具合が生じる可能性が高まる。上記の入射レーザー光の均一性を高める観点から、粘着剤加工面およびレーザー入射面の双方について、算術平均粗さRaは、0.18μm以下であることが好ましく、0.16μm以下であることがより好ましく、0.14μm以下であることがさらに好ましく、0.12μm以下であることが特に好ましい。平面視で欠点が生じにくい粘着シートを得る観点からは、粘着剤加工面について、算術平均粗さRaの下限は限定されない。製造安定性を維持する観点などから、粘着剤加工面およびレーザー入射面の双方について、算術平均粗さRaは0.01μm以上とすることが好ましい。 (1) Base Material The base material of the pressure-sensitive adhesive sheet according to this embodiment is a surface opposite to the pressure-sensitive adhesive layer (also referred to as “pressure-sensitive adhesive processing surface” in this specification) and the pressure-sensitive adhesive processing surface. For both surfaces (also referred to as “laser incident surface” in this specification), arithmetic average roughness Ra (hereinafter referred to as “arithmetic average roughness Ra”) defined in JIS B0601: 2013 (ISO 4287: 1997). “Is used in this sense.)” Is 0.2 μm or less. When the arithmetic average roughness Ra of these surfaces is 0.2 μm or less, defects are hardly observed in a plan view of the pressure-sensitive adhesive sheet. For this reason, the laser light incident from the base material side of the pressure-sensitive adhesive sheet easily reaches the plate-like member to which the pressure-sensitive adhesive sheet is stuck uniformly. When such laser light reaches the plate-like member non-uniformly, for example, there is a portion where the modified portion is not properly formed in the plate-like member, and the plate-like member is appropriately separated at this portion. There is a high possibility that problems such as failure to occur will occur. From the viewpoint of improving the uniformity of the incident laser light, the arithmetic average roughness Ra is preferably 0.18 μm or less, and preferably 0.16 μm or less for both the pressure-sensitive adhesive processed surface and the laser incident surface. More preferably, it is 0.14 μm or less, and particularly preferably 0.12 μm or less. From the viewpoint of obtaining a pressure-sensitive adhesive sheet that is less prone to defects in plan view, the lower limit of the arithmetic average roughness Ra is not limited for the pressure-sensitive adhesive processed surface. From the viewpoint of maintaining manufacturing stability, the arithmetic average roughness Ra is preferably 0.01 μm or more for both the pressure-sensitive adhesive processed surface and the laser incident surface.
上記ヤング率は、ブロッキング等を発生しにくくし、また、機械強度を向上させつつエキスパンド性をより良好にする観点から、60~450MPaであることがより好ましく、100~420MPaであることがさらに好ましく、150~300MPaであることがよりさらに好ましい。 The base material preferably has a Young's modulus of 50 to 500 MPa. By setting the Young's modulus within this range, the mechanical strength of the base material can be improved while maintaining good extensibility, and the process suitability when forming the pressure-sensitive adhesive layer can be improved. For example, when a film containing a polyolefin resin as a base material is set on a coater, unintended elongation of the base material when tension is applied can be prevented.
The Young's modulus is more preferably 60 to 450 MPa, and further preferably 100 to 420 MPa, from the viewpoint of making blocking difficult to occur and improving the expandability while improving the mechanical strength. More preferably, the pressure is 150 to 300 MPa.
本実施形態に係る粘着シートが備える粘着剤層は、その厚さが2μm以上12μm以下である。粘着剤層の厚さが上記の範囲内にあり、基材の双方の面の算術平均粗さRaが前述の範囲内にあることにより、平面視で欠点が生じにくく、優れたピックアップ性を有する粘着シートを得ることができる。上記の欠点が生じる可能性をより安定的に低減させる観点から、粘着剤層の厚さは3μm以上であることが好ましく、4μm以上であることがより好ましい。優れたピックアップ性を有する粘着シートを得ることをより安定的に実現する観点から、粘着剤層の厚さは、10μm以下であることが好ましく、8μm以下であることがより好ましく、6μm以下であることが特に好ましい。 (2) Pressure-sensitive adhesive layer The pressure-sensitive adhesive layer provided in the pressure-sensitive adhesive sheet according to this embodiment has a thickness of 2 μm or more and 12 μm or less. Since the thickness of the pressure-sensitive adhesive layer is within the above range and the arithmetic average roughness Ra of both surfaces of the base material is within the above range, defects are unlikely to occur in a plan view and excellent pick-up properties are obtained. An adhesive sheet can be obtained. From the viewpoint of more stably reducing the possibility of occurrence of the above disadvantages, the thickness of the pressure-sensitive adhesive layer is preferably 3 μm or more, and more preferably 4 μm or more. From the viewpoint of more stably realizing an adhesive sheet having excellent pick-up properties, the thickness of the adhesive layer is preferably 10 μm or less, more preferably 8 μm or less, and 6 μm or less. It is particularly preferred.
イソシアネート系架橋剤は、複数のイソシアネート基を有するポリイソシアネート化合物を少なくとも含有する。ポリイソシアネート化合物の具体例として、トリレンジイソシアネート、ジフェニルメタンジイソシアネート、キシリレンジイソシアネート等の芳香族ポリイソシアネート;ジシクロヘキシルメタン-4,4’-ジイソシアネート、ビシクロヘプタントリイソシアネート、シクロペンチレンジイソシアネート、シクロヘキシレンジイソシアネート、メチルシクロヘキシレンジイソシアネート、水添キシリレンジイソシアネート等の脂環式イソシアネート化合物;ヘキサメチレンジイソシアネート、トリメチルヘキサメチレンジイソシアネート、リジンジイソシアネート等の非環式脂肪族イソシアネートおよびそのビウレット体やイソシアヌレート体、イソシアネート基を有する化合物と、エチレングリコール、トリメチロールプロパン、ヒマシ油等の非芳香族性低分子活性水素含有化合物との反応物であるアダクト体などの変性体などが挙げられる。 When the acrylic polymer has a reactive functional group, the cohesiveness of the pressure-sensitive adhesive layer is adjusted by reacting this reactive functional group with a cross-linking agent. It becomes easy to suppress the generation of a residue or to further improve the pickup property by reducing the adhesiveness of the adhesive layer. The combination of the reactive functional group and the crosslinking agent is not limited. Examples of reactive functional groups include groups having active hydrogen such as hydroxyl groups, carboxylic acid groups, and amino groups. Examples of the crosslinking agent include an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, and a metal chelate crosslinking agent.
The isocyanate-based crosslinking agent contains at least a polyisocyanate compound having a plurality of isocyanate groups. Specific examples of the polyisocyanate compound include aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate; dicyclohexylmethane-4,4′-diisocyanate, bicycloheptane triisocyanate, cyclopentylene diisocyanate, cyclohexylene diisocyanate, methyl Alicyclic isocyanate compounds such as cyclohexylene diisocyanate and hydrogenated xylylene diisocyanate; acyclic aliphatic isocyanates such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate and lysine diisocyanate, and their biuret and isocyanurate forms, compounds having an isocyanate group And ethylene glycol, trimethylolpropane, castor Examples include modified products such as adducts which are reaction products with non-aromatic low-molecular active hydrogen-containing compounds such as oil.
本発明の一実施形態に係る粘着シートは、JIS K7136:2000(ISO 14782:1999)に規定されるヘイズが、粘着剤層よりも基材に近位な面を入射面としたときに、0.01%以上10%以下であることが好ましい。当該ヘイズが10%以下であることにより、粘着シートに入射されたレーザー光の有効活用が可能となる。粘着シートに入射されたレーザー光をより安定的に有効に活用することを可能とする観点から、上記のヘイズは、5%以下であることが好ましく、2.5%以下であることがより好ましい。粘着シートに入射されたレーザー光の有効活用の観点からは、上記のヘイズの下限は設定されない。製造安定性を高める観点などから、上記のヘイズは0.01%以上程度とすることが好ましい。 (3) Optical properties The pressure-sensitive adhesive sheet according to one embodiment of the present invention is such that the haze specified by JIS K7136: 2000 (ISO 14782: 1999) is a surface closer to the base material than the pressure-sensitive adhesive layer. Is preferably 0.01% or more and 10% or less. When the haze is 10% or less, the laser light incident on the pressure-sensitive adhesive sheet can be effectively used. From the viewpoint of enabling more stable and effective use of laser light incident on the pressure-sensitive adhesive sheet, the haze is preferably 5% or less, more preferably 2.5% or less. . From the viewpoint of effective utilization of the laser light incident on the adhesive sheet, the lower limit of the above haze is not set. From the viewpoint of improving production stability, the haze is preferably about 0.01% or more.
本発明の一実施形態に係る粘着シートは、粘着剤層側の面に、付加層が設けられていて、粘着シートの使用の際には、粘着シートの被着体である板状部材に上記の付加層が貼付されてもよい。付加層の構成は限定されない。付加層の具体例として、付加層が保護膜形成フィルムを備える場合や、付加層がダイボンディング層を備える場合が挙げられる。 (4) Additional layer The adhesive sheet which concerns on one Embodiment of this invention is provided with the additional layer in the surface at the side of an adhesive layer, and is an adherend of an adhesive sheet in the case of use of an adhesive sheet. The additional layer may be attached to the plate-like member. The configuration of the additional layer is not limited. Specific examples of the additional layer include a case where the additional layer includes a protective film-forming film and a case where the additional layer includes a die bonding layer.
本発明の一実施形態に係る粘着シートは、粘着剤層または付加層を被着体である板状部材に貼付するまでの間において粘着剤層または付加層を保護する目的で、粘着シートの基材よりも粘着剤層に近位な面、具体的には粘着剤層の面または付加層の面に、剥離シートの剥離面が貼合されていてもよい。剥離シートの構成は任意であり、プラスチックフィルムに剥離剤を塗布したものが例示される。プラスチックフィルムの具体例として、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレートなどのポリエステルフィルム、およびポリプロピレンやポリエチレンなどのポリオレフィンフィルムが挙げられる。剥離剤としては、シリコーン系、フッ素系、長鎖アルキル系などを用いることができるが、これらの中で、安価で安定した性能が得られるシリコーン系が好ましい。上記の剥離シートのプラスチックフィルムに代えて、グラシン紙、コート紙、上質紙などの紙基材または紙基材にポリエチレンなどの熱可塑性樹脂をラミネートしたラミネート紙を用いてもよい。該剥離シートの厚さについては特に制限はないが、通常20μm以上250μm以下程度である。 (5) Release sheet The pressure-sensitive adhesive sheet according to an embodiment of the present invention is for the purpose of protecting the pressure-sensitive adhesive layer or the additional layer until the pressure-sensitive adhesive layer or the additional layer is applied to the plate-like member as the adherend. The release surface of the release sheet may be bonded to the surface closer to the adhesive layer than the base material of the adhesive sheet, specifically to the surface of the adhesive layer or the surface of the additional layer. The configuration of the release sheet is arbitrary, and examples include a plastic film coated with a release agent. Specific examples of the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, and polyolefin films such as polypropylene and polyethylene. As the release agent, silicone-based, fluorine-based, long-chain alkyl-based, and the like can be used, and among these, a silicone-based material that is inexpensive and provides stable performance is preferable. Instead of the plastic film of the release sheet, a paper base such as glassine paper, coated paper, and high-quality paper, or a laminated paper obtained by laminating a thermoplastic resin such as polyethylene on a paper base may be used. Although there is no restriction | limiting in particular about the thickness of this peeling sheet, Usually, they are about 20 micrometers or more and 250 micrometers or less.
上記の本発明の一実施形態に係る粘着シートを用いることにより、次に説明するように、板状部材から加工物を製造することが可能である。 2. Manufacturing method of processed material By using the pressure-sensitive adhesive sheet according to one embodiment of the present invention, it is possible to manufacture a processed material from a plate-like member as described below.
まず、上記の本発明の一実施形態に係る粘着シートにおける、基材より粘着剤層に近位な面、具体的には、粘着剤層の面または付加層の面を、板状部材を含む被着体の一方の面に貼付して、粘着シートおよび板状部材を備える第1の積層体を得る。板状部材は限定されない。シリコンウエハなどの半導体ウエハ、TSVに基づく構造を有する積層体などが例示される。板状部材の厚さも限定されない。数十μm~数百μmの範囲が例示される。 (1) Sticking step First, in the pressure-sensitive adhesive sheet according to one embodiment of the present invention, the surface closer to the pressure-sensitive adhesive layer than the base material, specifically, the surface of the pressure-sensitive adhesive layer or the surface of the additional layer, Affixed to one surface of the adherend including the plate-like member to obtain a first laminate including the adhesive sheet and the plate-like member. The plate member is not limited. Examples thereof include a semiconductor wafer such as a silicon wafer, a laminate having a structure based on TSV, and the like. The thickness of the plate member is not limited. A range of several tens of μm to several hundreds of μm is exemplified.
第1の積層体が備える基材を伸長することにより、粘着シート上の板状部材を分割して、板状部材の分割体を備えるチップの複数が粘着シート上に配置されてなる第2の積層体を得る。第1の積層体が付加層を備える場合には、基材を伸長することによって付加層も分割される。分割工程が行われた後に、基材における伸長の程度が大きい部分について、加熱などの手段によって収縮させ、粘着シートに過度の弛みが生じることを解消してもよい。 (2) Dividing process By extending the base material provided in the first laminate, the plate-like member on the pressure-sensitive adhesive sheet is divided, and a plurality of chips including the plate-like member divided body are arranged on the pressure-sensitive adhesive sheet. A second laminated body is obtained. When the first laminate includes an additional layer, the additional layer is also divided by extending the base material. After the dividing step is performed, a portion with a large degree of elongation in the base material may be contracted by means such as heating to eliminate excessive slack in the pressure-sensitive adhesive sheet.
上記の分割工程が開始されるまでに、板状部材の内部に設定された焦点に集束されるようにレーザー光を照射して、板状部材の内部に改質部を形成する。このレーザー光の波長や照射方法は、板状部材の組成、厚さなどの構造などに応じて適宜設定される。上記の貼付工程が行われた後に改質部形成工程が行われる場合には、レーザー光の板状部材への照射が、粘着シートを介して行われる場合もある。そのような場合であっても、本発明の一実施形態に係る粘着シートは平面視で欠点が生じにくいため、欠点およびその近傍でレーザー光の照射の程度が変動して、結果的に、板状部材内における改質部の生成が局所的に不適切になってしまう不具合が生じにくい。このように、板状部材内に改質物が局所的に不適切に形成されると、上記の分割工程において、板状部材の分割が適切に行われなくなるおそれがある。板状部材の分割が不適切に行われると、加工物の品質が低下する可能性が高まる。 (3) Reformation part forming process Before the above dividing process is started, the laser beam is irradiated so as to be focused on the focal point set inside the plate-like member, and the inside of the plate-like member is reformed. Forming part. The wavelength of the laser beam and the irradiation method are appropriately set according to the structure of the plate member, the structure such as the thickness, and the like. When the modified part forming step is performed after the pasting step is performed, the plate member may be irradiated with laser light through an adhesive sheet. Even in such a case, the pressure-sensitive adhesive sheet according to an embodiment of the present invention is less likely to have a defect in a plan view. The problem that the generation of the modified portion in the shaped member becomes locally inappropriate is unlikely to occur. Thus, if the modified product is locally inappropriately formed in the plate-like member, the plate-like member may not be properly divided in the above-described dividing step. If the plate-shaped member is improperly divided, the possibility that the quality of the workpiece is lowered increases.
第2の積層体が備える複数のチップのそれぞれを粘着シートから分離することにより、チップを加工物として得ることができる。分離方法は限定されない。通常、粘着シートにおけるチップに対向する側と反対側の面から、ピンなどを突き上げて局所的に粘着シートを変形させることにより、分離予定のチップに対する粘着剤層の粘着性を低減させる。次いで、真空コレットなどを用いて、分離予定のチップを粘着シートから引き剥がすことにより、チップの粘着シートからの分離は行われる。この場合には、ピンを突き上げたときや、真空コレットでチップを引き上げたときに、チップから粘着剤層を引き剥がそうとする力が付与されることになる。チップが薄かったり、TSVに基づく構造を有していたりする場合には、この引き剥がしの際にチップに割れが生じるおそれがある。しかしながら、本発明の一実施形態に係る粘着シートは、粘着剤層の厚さが適切に制御されているため、この引き剥がしの際にチップが割れる可能性が適切に低減されている。すなわち、本発明の一実施形態に係る粘着シートはピックアップ性に優れる。 (4) Pickup process A chip can be obtained as a workpiece by separating each of the plurality of chips included in the second laminate from the adhesive sheet. The separation method is not limited. Usually, the adhesive sheet is deformed locally by pushing up pins and the like from the surface opposite to the chip facing side of the adhesive sheet, thereby reducing the adhesiveness of the adhesive layer to the chip to be separated. Next, the chip is separated from the pressure-sensitive adhesive sheet by peeling off the chip to be separated from the pressure-sensitive adhesive sheet using a vacuum collet or the like. In this case, when the pin is pushed up or when the chip is pulled up with a vacuum collet, a force for peeling off the adhesive layer from the chip is applied. When the chip is thin or has a structure based on TSV, there is a possibility that the chip may be cracked during the peeling. However, in the pressure-sensitive adhesive sheet according to an embodiment of the present invention, since the thickness of the pressure-sensitive adhesive layer is appropriately controlled, the possibility that the chip breaks during the peeling is appropriately reduced. That is, the pressure-sensitive adhesive sheet according to one embodiment of the present invention is excellent in pickup properties.
(1)基材の作製
小型Tダイ押出機(東洋精機製作所社製「ラボプラストミル」)によって、ランダムコポリマーポリプロピレン樹脂からなる樹脂組成物を用いて押し出し成形を行い、一方の面(粘着剤加工面に相当する。)の算術表面粗さRaが0.03μm、他方の面(レーザ入射面に相当する。)の算術表面粗さRaが0.03μmであるフィルムを作製して、基材とした。なお、基材の表面粗さは、表面粗さ測定機(ミツトヨ社製「SV-3000」)を用いて測定した。 [Example 1]
(1) Production of base material Extrusion molding is performed using a resin composition made of a random copolymer polypropylene resin with a small T-die extruder (“Lab Plast Mill” manufactured by Toyo Seiki Seisakusho Co., Ltd.), and one surface (adhesive processing) A film having an arithmetic surface roughness Ra of 0.03 μm and an other surface (corresponding to a laser incident surface) of 0.03 μm. did. The surface roughness of the substrate was measured using a surface roughness measuring machine (“SV-3000” manufactured by Mitutoyo Corporation).
62質量部のブチルアクリレートと10質量部のメチルメタクリレートと28質量部の2-ヒドロキシエチルアクリレート(HEA)とを共重合して得た共重合体(ガラス転移温度Tg-34℃)に、メタクリロイルオキシエチルイソシアネート(MOI)を、共重合体のHEAに対して80mol%反応させて、エネルギー線重合性基を有するアクリル系重合体(重量平均分子量50万)を得た。
上記のアクリル系重合体100質量部に対して、光重合開始剤(BASF社製「イルガキュア184」、濃度:100%)3.0質量部、イソシアネート化合物(東洋インキ社製「BHS‐8515」)1.0質量部を配合し、溶媒で希釈された粘着剤組成物を得た。 (2) Preparation of pressure-sensitive adhesive composition A copolymer (glass transition temperature) obtained by copolymerizing 62 parts by mass of butyl acrylate, 10 parts by mass of methyl methacrylate and 28 parts by mass of 2-hydroxyethyl acrylate (HEA) Tg-34 ° C) is reacted with methacryloyloxyethyl isocyanate (MOI) at 80 mol% with respect to the copolymer HEA to obtain an acrylic polymer having an energy ray polymerizable group (weight average molecular weight 500,000). It was.
With respect to 100 parts by mass of the above acrylic polymer, 3.0 parts by mass of a photopolymerization initiator (“Irgacure 184” manufactured by BASF, concentration: 100%), an isocyanate compound (“BHS-8515” manufactured by Toyo Ink) 1.0 mass parts was mix | blended and the adhesive composition diluted with the solvent was obtained.
剥離シートの剥離面上に、上記の粘着剤組成物を塗布した。得られた塗膜を剥離シートごと80℃の環境を1分間経過させることにより、剥離シートと粘着剤層(測定した厚さは10μmであった。)とからなる積層体を得た。
前述の基材の粘着剤加工面に、上記の積層体の粘着剤層側の面を貼付して、基材と粘着剤層とからなる粘着シートを、粘着剤層側の面に剥離シートがさらに積層された状態で得た。 (3) Preparation of pressure-sensitive adhesive sheet The pressure-sensitive adhesive composition was applied on the release surface of the release sheet. The obtained coating film and the release sheet were allowed to pass through an environment of 80 ° C. for 1 minute to obtain a laminate comprising the release sheet and an adhesive layer (the measured thickness was 10 μm).
The pressure-sensitive adhesive layer side of the above laminate is affixed to the pressure-sensitive adhesive processed surface of the base material, and the pressure-sensitive adhesive sheet composed of the base material and the pressure-sensitive adhesive layer is attached to the pressure-sensitive adhesive layer side surface. Further, it was obtained in a laminated state.
粘着剤層の厚さを5μmとしたこと以外は実施例1と同様にして、粘着シートを、粘着剤層側の面に剥離シートが積層された状態で得た。 [Example 2]
A pressure-sensitive adhesive sheet was obtained in a state where a release sheet was laminated on the surface on the pressure-sensitive adhesive layer side in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer was 5 μm.
次の変更点以外は実施例1と同様にして、粘着シートを、粘着剤層側の面に剥離シートが積層された状態で得た。
(変更点)基材の成形条件を変更して、基材の粘着剤加工面の算術表面粗さRaを0.16μm、レーザー入射面の算術表面粗さRaを0.03μmとした。 Example 3
Except for the following changes, the pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, with the release sheet laminated on the surface on the pressure-sensitive adhesive layer side.
(Changes) The molding conditions of the base material were changed so that the arithmetic surface roughness Ra of the pressure-sensitive adhesive processed surface of the base material was 0.16 μm, and the arithmetic surface roughness Ra of the laser incident surface was 0.03 μm.
粘着剤層の厚さを15μmとしたこと以外は実施例3と同様にして、粘着シートを、粘着剤層側の面に剥離シートが積層された状態で得た。 [Comparative Example 1]
Except that the thickness of the pressure-sensitive adhesive layer was 15 μm, the pressure-sensitive adhesive sheet was obtained in the same manner as in Example 3 with the release sheet laminated on the surface on the pressure-sensitive adhesive layer side.
次の変更点1および2以外は実施例1と同様にして、粘着シートを、粘着剤層側の面に剥離シートが積層された状態で得た。
(変更点1)基材の成形条件を変更して、基材の粘着剤加工面の算術表面粗さRaを1.3μm、レーザー入射面の算術表面粗さRaを0.04μmとした。
(変更点2)粘着剤層の厚さを15μmとした。 [Comparative Example 2]
Except for the following changes 1 and 2, a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, with the release sheet laminated on the surface on the pressure-sensitive adhesive layer side.
(Change 1) The molding conditions of the base material were changed so that the arithmetic surface roughness Ra of the adhesive processing surface of the base material was 1.3 μm, and the arithmetic surface roughness Ra of the laser incident surface was 0.04 μm.
(Change 2) The thickness of the pressure-sensitive adhesive layer was 15 μm.
粘着剤層の厚さを10μmとしたこと以外は、比較例2と同様にして、粘着シートを、粘着剤層側の面に剥離シートが積層された状態で得た。 [Comparative Example 3]
Except that the thickness of the pressure-sensitive adhesive layer was 10 μm, a pressure-sensitive adhesive sheet was obtained in a state where the release sheet was laminated on the surface on the pressure-sensitive adhesive layer side in the same manner as in Comparative Example 2.
次の変更点以外は実施例1と同様にして、粘着シートを、粘着剤層側の面に剥離シートが積層された状態で得た。
(変更点)基材の成形条件を変更して、基材の粘着剤加工面の算術表面粗さRaを0.04μm、レーザー入射面の算術表面粗さRaを1.3μmとした。 [Comparative Example 4]
Except for the following changes, the pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, with the release sheet laminated on the surface on the pressure-sensitive adhesive layer side.
(Changes) The molding conditions of the substrate were changed so that the arithmetic surface roughness Ra of the pressure-sensitive adhesive processed surface of the substrate was 0.04 μm, and the arithmetic surface roughness Ra of the laser incident surface was 1.3 μm.
実施例および比較例により製造された粘着シートから剥離シートを剥がし、適切な大きさに切断して得られた試験片のヘイズを、JIS K7136:2000に準拠し、HAZE METER(日本電色工業社製「NDH-5000」)を用いて測定した。測定光は粘着シートの基材側の面から入射した。結果を表1に示す。 [Test Example 1] <Measurement of haze>
In accordance with JIS K7136: 2000, the haze of the test piece obtained by peeling the release sheet from the pressure-sensitive adhesive sheet produced in Examples and Comparative Examples and cutting it to an appropriate size is used. “NDH-5000”) Measurement light was incident from the substrate side surface of the adhesive sheet. The results are shown in Table 1.
実施例および比較例により製造された粘着シートから剥離シートを剥がし、それぞれの粘着シートの粘着剤層側の面の任意の100mm×100mmの範囲を観察範囲とした。これらの観察範囲のそれぞれについて、光学顕微鏡を用いて観察し、欠点の存在の程度に基づいて、次の基準で評価した。結果を表1に示す。
A:観察範囲において欠点は認められなかった。
B:観察範囲内に5個以下の欠点が観察された。
C:観察範囲内に6個以下の欠点が観察された。 [Test Example 2] <Observation of defects>
The release sheet was peeled off from the pressure-sensitive adhesive sheets produced in Examples and Comparative Examples, and an arbitrary range of 100 mm × 100 mm on the pressure-sensitive adhesive layer side surface of each pressure-sensitive adhesive sheet was taken as the observation range. Each of these observation ranges was observed using an optical microscope and evaluated according to the following criteria based on the degree of existence of defects. The results are shown in Table 1.
A: No defects were observed in the observation range.
B: 5 or less defects were observed within the observation range.
C: Six or fewer defects were observed within the observation range.
実施例および比較例により製造された粘着シートを平面視で円形に切断し、剥離シートを剥がし、シリコンウエハ(厚さ:100μm)およびリングフレームに粘着シートの粘着剤層の面を貼付した。 [Test Example 3] <Pickup evaluation>
The pressure-sensitive adhesive sheets produced in Examples and Comparative Examples were cut into a circle in plan view, the release sheet was peeled off, and the pressure-sensitive adhesive layer surface of the pressure-sensitive adhesive sheet was attached to a silicon wafer (thickness: 100 μm) and a ring frame.
照度:220mW/cm2
光量:190mJ/cm2 In this state, the adhesive sheet was irradiated with ultraviolet rays under the following irradiation conditions.
Illuminance: 220 mW / cm 2
Light intensity: 190 mJ / cm 2
A:1.7N以下
B:1.7Nより大きい Subsequently, the load at the time of pickup was measured with a push-pull gauge (push-up jig: 1 pin) manufactured by Aiko Engineering. The load required for pushing up was measured, and the pickup property was evaluated according to the following criteria based on the measured value. The results are shown in Table 1.
A: 1.7N or less B: Greater than 1.7N
Claims (13)
- 板状部材にレーザー光を照射して改質部を形成し、前記板状部材を分割してチップ化することに用いる粘着シートであって、
基材と、前記基材の一方の面に設けられた粘着剤層とを備え、
前記基材は、前記一方の面および前記一方の面と反対側の面の双方について、JIS B0601:2013(ISO 4287:1997)に規定される算術平均粗さRaが0.01μm以上0.2μm以下であり、
前記粘着剤層の厚さが2μm以上12μm以下であること
を特徴とする粘着シート。 A pressure-sensitive adhesive sheet used for forming a modified portion by irradiating a plate-like member with laser light, and dividing the plate-like member into chips,
A substrate and a pressure-sensitive adhesive layer provided on one surface of the substrate;
As for the said base material, arithmetic mean roughness Ra prescribed | regulated to JIS B0601: 2013 (ISO 4287: 1997) is 0.01 micrometer or more and 0.2 micrometer about both said one surface and the surface on the opposite side to said one surface. And
The pressure-sensitive adhesive sheet is characterized in that the pressure-sensitive adhesive layer has a thickness of 2 μm or more and 12 μm or less. - 前記粘着シートは、JIS K7136:2000(ISO 14782:1999)に規定されるヘイズが、基材側を入射側としたときに、0.01%以上10%以下である、請求項1に記載の粘着シート。 The said adhesive sheet is 0.01% or more and 10% or less when the haze prescribed | regulated to JISK7136: 2000 (ISO 14782: 1999) makes the base material side the incident side. Adhesive sheet.
- 前記粘着剤層はアクリル系重合体を含有し、前記アクリル系重合体はガラス転移温度Tgが-40℃以上-10℃以下である、請求項1または2に記載の粘着シート。 The pressure-sensitive adhesive sheet according to claim 1 or 2, wherein the pressure-sensitive adhesive layer contains an acrylic polymer, and the acrylic polymer has a glass transition temperature Tg of -40 ° C or higher and -10 ° C or lower.
- 前記アクリル系重合体はメチルメタクリレートに由来する構成単位を含み、前記アクリル系重合体を与える単量体全体に対するメチルメタクリレートの質量比率は、5質量%以上20質量%以下である、請求項3に記載の粘着シート。 The said acrylic polymer contains the structural unit derived from methyl methacrylate, The mass ratio of the methyl methacrylate with respect to the whole monomer which gives the said acrylic polymer is 5 mass% or more and 20 mass% or less. The adhesive sheet as described.
- 前記アクリル系重合体は、エネルギー線重合性基を有する、請求項3または4に記載の粘着シート。 The pressure-sensitive adhesive sheet according to claim 3 or 4, wherein the acrylic polymer has an energy ray polymerizable group.
- 前記基材はポリオレフィン系材料を含有する、請求項1から5のいずれか一項に記載の粘着シート。 The pressure-sensitive adhesive sheet according to any one of claims 1 to 5, wherein the base material contains a polyolefin-based material.
- 前記基材の前記算術平均粗さRaは前記基材をロール加圧することを含んで設定されたものである、請求項1から6のいずれか一項に記載の粘着シート。 The pressure-sensitive adhesive sheet according to any one of claims 1 to 6, wherein the arithmetic average roughness Ra of the base material is set by roll-pressing the base material.
- 前記ロール加圧に用いられたロールは金属材料からなる表面を有するロールである、請求項7に記載の粘着シート。 The pressure-sensitive adhesive sheet according to claim 7, wherein the roll used for pressurizing the roll is a roll having a surface made of a metal material.
- 請求項1から8のいずれかに記載される粘着シートの前記基材よりも前記粘着剤層に近位な面を、板状部材を含む被着体の一方の面に貼付して、前記粘着シートおよび前記板状部材を備える第1の積層体を得る貼付工程;
前記第1の積層体が備える前記基材を伸長することにより、前記粘着シート上の前記板状部材を分割して、前記板状部材の分割体を備えるチップの複数が前記粘着シート上に配置されてなる第2の積層体を得る分割工程;および
前記第2の積層体が備える前記複数のチップのそれぞれを前記粘着シートから分離して、前記チップを加工物として得るピックアップ工程を備え、
前記分割工程が開始されるまでに、前記板状部材の内部に設定された焦点に集束されるようにレーザー光を照射して、前記板状部材の内部に改質部を形成する改質部形成工程が行われること
を特徴とする加工物の製造方法。 The pressure-sensitive adhesive sheet according to any one of claims 1 to 8, wherein a surface closer to the pressure-sensitive adhesive layer than the base material is attached to one surface of an adherend including a plate-shaped member, and the pressure-sensitive adhesive sheet A sticking step of obtaining a first laminate comprising a sheet and the plate-like member;
The plate-like member on the pressure-sensitive adhesive sheet is divided by extending the base material provided in the first laminate, and a plurality of chips including the plate-like member divided body are arranged on the pressure-sensitive adhesive sheet. A dividing step of obtaining a second laminated body; and a pickup step of separating each of the plurality of chips provided in the second laminated body from the pressure-sensitive adhesive sheet and obtaining the chips as a workpiece,
A reforming unit that irradiates a laser beam so as to be focused on a focal point set inside the plate-like member before the dividing step is started to form a reforming unit inside the plate-like member A method for producing a workpiece, wherein a forming step is performed. - 前記分割工程に供される前記第1の積層体は、前記粘着剤層と前記板状部材との間に付加層を備え、前記分割工程によって前記付加層も分割され、前記ピックアップ工程によって前記粘着シートから分離するチップは、前記板状部材の分割体および当該板状部材の分割体の前記粘着シートに近位な面上に形成された前記付加層の分割体を備える、請求項9に記載の加工物の製造方法。 The first laminate provided for the dividing step includes an additional layer between the pressure-sensitive adhesive layer and the plate-like member, the additional layer is also divided by the dividing step, and the adhesive layer is divided by the pickup step. The chip separated from the sheet is provided with a divided body of the plate-like member and a divided body of the additional layer formed on a surface proximal to the adhesive sheet of the divided body of the plate-like member. Method of manufacturing the workpiece.
- 前記付加層は保護層を備える、請求項10に記載の加工物の製造方法。 The method for manufacturing a workpiece according to claim 10, wherein the additional layer includes a protective layer.
- 前記分割工程が開始されるまでに、前記第1の積層体が備える前記保護層を保護膜形成フィルムから形成する保護膜形成工程を備える、請求項11に記載の加工物の製造方法。 The manufacturing method of the workpiece of Claim 11 provided with the protective film formation process which forms the said protective layer with which a said 1st laminated body is provided from a protective film formation film before the said division | segmentation process is started.
- 前記付加層はダイボンディング層を備える、請求項10に記載の加工物の製造方法。 The method of manufacturing a workpiece according to claim 10, wherein the additional layer includes a die bonding layer.
Priority Applications (4)
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SG11201704347YA SG11201704347YA (en) | 2014-12-02 | 2015-11-27 | Adhesive sheet, and method for manufacturing processed article |
JP2016562422A JP6731852B2 (en) | 2014-12-02 | 2015-11-27 | Adhesive sheet and method for manufacturing processed product |
KR1020177005685A KR102447759B1 (en) | 2014-12-02 | 2015-11-27 | Adhesive sheet, and method for manufacturing processed article |
CN201580047960.6A CN106795396B (en) | 2014-12-02 | 2015-11-27 | Adhesive sheet and method for producing processed product |
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JP (1) | JP6731852B2 (en) |
KR (1) | KR102447759B1 (en) |
CN (1) | CN106795396B (en) |
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TW (3) | TWI811763B (en) |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPWO2016103902A1 (en) * | 2014-12-25 | 2017-11-24 | デンカ株式会社 | Laser dicing adhesive sheet and method for manufacturing semiconductor device |
WO2018084021A1 (en) * | 2016-11-02 | 2018-05-11 | リンテック株式会社 | Dicing sheet |
JP2019121659A (en) * | 2017-12-28 | 2019-07-22 | 日東電工株式会社 | Dicing tape integration type semiconductor back contact film |
WO2019203021A1 (en) * | 2018-04-18 | 2019-10-24 | リンテック株式会社 | Workpiece processing sheet |
JPWO2019188817A1 (en) * | 2018-03-29 | 2021-04-01 | リンテック株式会社 | Work sheet |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7042271B2 (en) * | 2017-07-03 | 2022-03-25 | リンテック株式会社 | Manufacturing method of adhesive sheet for stealth dicing and semiconductor device |
JPWO2020195744A1 (en) * | 2019-03-27 | 2020-10-01 | ||
KR102426261B1 (en) * | 2019-09-26 | 2022-07-29 | 주식회사 엘지화학 | Adhesive composition for dicing tape and dicing tape comprising the same |
CN111693368A (en) * | 2020-06-15 | 2020-09-22 | 苏州高泰电子技术股份有限公司 | Test method for microscopic characterization performance of wafer cutting adhesive tape |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006186305A (en) * | 2004-11-30 | 2006-07-13 | Furukawa Electric Co Ltd:The | Dicing/die bonding tape |
JP2007123404A (en) * | 2005-10-26 | 2007-05-17 | Furukawa Electric Co Ltd:The | Dicing tape and semiconductor wafer dicing method |
JP2010073897A (en) * | 2008-09-18 | 2010-04-02 | Lintec Corp | Laser dicing sheet, and manufacturing method of semiconductor chip |
JP2011040449A (en) * | 2009-08-07 | 2011-02-24 | Du Pont Mitsui Polychem Co Ltd | Substrate for dicing tape, the dicing tape, and method for manufacturing semiconductor device |
JP2011139042A (en) * | 2009-12-04 | 2011-07-14 | Lintec Corp | Adhesive sheet for stealth dicing and method of manufacturing semiconductor device |
WO2012077471A1 (en) * | 2010-12-06 | 2012-06-14 | 株式会社きもと | Auxiliary sheet for laser dicing |
JP2014201672A (en) * | 2013-04-05 | 2014-10-27 | 日東電工株式会社 | Adhesive tape |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5124778B2 (en) | 1971-12-22 | 1976-07-27 | ||
JP2005229040A (en) | 2004-02-16 | 2005-08-25 | Denki Kagaku Kogyo Kk | Pressure-sensitive adhesive sheet for fixing semiconductor base |
JP5019619B2 (en) * | 2008-03-27 | 2012-09-05 | 古河電気工業株式会社 | Wafer surface protection tape |
JP2012079936A (en) * | 2010-10-01 | 2012-04-19 | Nitto Denko Corp | Dicing, die-bonding film and method for manufacturing semiconductor device |
-
2015
- 2015-11-27 JP JP2016562422A patent/JP6731852B2/en active Active
- 2015-11-27 CN CN201580047960.6A patent/CN106795396B/en active Active
- 2015-11-27 SG SG11201704347YA patent/SG11201704347YA/en unknown
- 2015-11-27 WO PCT/JP2015/083414 patent/WO2016088677A1/en active Application Filing
- 2015-11-27 KR KR1020177005685A patent/KR102447759B1/en active IP Right Grant
- 2015-12-01 TW TW110129890A patent/TWI811763B/en active
- 2015-12-01 TW TW108148058A patent/TW202014490A/en unknown
- 2015-12-01 TW TW104140062A patent/TWI738633B/en active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006186305A (en) * | 2004-11-30 | 2006-07-13 | Furukawa Electric Co Ltd:The | Dicing/die bonding tape |
JP2007123404A (en) * | 2005-10-26 | 2007-05-17 | Furukawa Electric Co Ltd:The | Dicing tape and semiconductor wafer dicing method |
JP2010073897A (en) * | 2008-09-18 | 2010-04-02 | Lintec Corp | Laser dicing sheet, and manufacturing method of semiconductor chip |
JP2011040449A (en) * | 2009-08-07 | 2011-02-24 | Du Pont Mitsui Polychem Co Ltd | Substrate for dicing tape, the dicing tape, and method for manufacturing semiconductor device |
JP2011139042A (en) * | 2009-12-04 | 2011-07-14 | Lintec Corp | Adhesive sheet for stealth dicing and method of manufacturing semiconductor device |
WO2012077471A1 (en) * | 2010-12-06 | 2012-06-14 | 株式会社きもと | Auxiliary sheet for laser dicing |
JP2014201672A (en) * | 2013-04-05 | 2014-10-27 | 日東電工株式会社 | Adhesive tape |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2016103902A1 (en) * | 2014-12-25 | 2017-11-24 | デンカ株式会社 | Laser dicing adhesive sheet and method for manufacturing semiconductor device |
WO2018084021A1 (en) * | 2016-11-02 | 2018-05-11 | リンテック株式会社 | Dicing sheet |
KR20190076957A (en) * | 2016-11-02 | 2019-07-02 | 린텍 가부시키가이샤 | Dicing sheet |
CN110073468B (en) * | 2016-11-02 | 2023-01-10 | 琳得科株式会社 | Cutting blade |
CN110073468A (en) * | 2016-11-02 | 2019-07-30 | 琳得科株式会社 | Cutting sheet |
JPWO2018084021A1 (en) * | 2016-11-02 | 2019-09-19 | リンテック株式会社 | Dicing sheet |
KR102447761B1 (en) * | 2016-11-02 | 2022-09-27 | 린텍 가부시키가이샤 | dicing sheet |
JP7109918B2 (en) | 2017-12-28 | 2022-08-01 | 日東電工株式会社 | Dicing tape integrated semiconductor back adhesion film |
JP2019121659A (en) * | 2017-12-28 | 2019-07-22 | 日東電工株式会社 | Dicing tape integration type semiconductor back contact film |
JPWO2019188817A1 (en) * | 2018-03-29 | 2021-04-01 | リンテック株式会社 | Work sheet |
JP7296944B2 (en) | 2018-03-29 | 2023-06-23 | リンテック株式会社 | Work processing sheet |
JPWO2019203021A1 (en) * | 2018-04-18 | 2021-06-10 | リンテック株式会社 | Work sheet |
WO2019203021A1 (en) * | 2018-04-18 | 2019-10-24 | リンテック株式会社 | Workpiece processing sheet |
JP7325403B2 (en) | 2018-04-18 | 2023-08-14 | リンテック株式会社 | Work processing sheet |
Also Published As
Publication number | Publication date |
---|---|
CN106795396B (en) | 2020-12-18 |
JPWO2016088677A1 (en) | 2017-09-07 |
TW201629171A (en) | 2016-08-16 |
KR102447759B1 (en) | 2022-09-27 |
TWI738633B (en) | 2021-09-11 |
JP6731852B2 (en) | 2020-07-29 |
CN106795396A (en) | 2017-05-31 |
TWI811763B (en) | 2023-08-11 |
KR20170091578A (en) | 2017-08-09 |
TW202014490A (en) | 2020-04-16 |
TW202144516A (en) | 2021-12-01 |
SG11201704347YA (en) | 2017-06-29 |
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