WO2016088677A1 - Feuille adhésive et procédé de fabrication d'un article transformé - Google Patents

Feuille adhésive et procédé de fabrication d'un article transformé Download PDF

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Publication number
WO2016088677A1
WO2016088677A1 PCT/JP2015/083414 JP2015083414W WO2016088677A1 WO 2016088677 A1 WO2016088677 A1 WO 2016088677A1 JP 2015083414 W JP2015083414 W JP 2015083414W WO 2016088677 A1 WO2016088677 A1 WO 2016088677A1
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WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
adhesive sheet
plate
base material
Prior art date
Application number
PCT/JP2015/083414
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English (en)
Japanese (ja)
Inventor
茂之 山下
優智 中村
Original Assignee
リンテック株式会社
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Publication date
Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to KR1020177005685A priority Critical patent/KR102447759B1/ko
Priority to SG11201704347YA priority patent/SG11201704347YA/en
Priority to CN201580047960.6A priority patent/CN106795396B/zh
Priority to JP2016562422A priority patent/JP6731852B2/ja
Publication of WO2016088677A1 publication Critical patent/WO2016088677A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to a pressure-sensitive adhesive sheet that irradiates a plate-like member with laser light to form a modified portion, and divides the plate-like member into pieces to obtain a chip-like workpiece. Moreover, this invention relates to the method of manufacturing workpieces, such as a chip
  • ⁇ As wafers that are brittle members become thinner, there is a higher risk of breakage during processing and transportation.
  • chipping or the like occurs particularly on the back side of the semiconductor wafer, and the die strength of the chip is significantly reduced.
  • a so-called stealth dicing method in which a dicing line is formed while a modified portion is selectively formed by irradiating the inside of a semiconductor wafer with a laser beam, and the semiconductor wafer is cut starting from the modified portion.
  • Patent Document 1 a so-called stealth dicing method is proposed in which a dicing line is formed while a modified portion is selectively formed by irradiating the inside of a semiconductor wafer with a laser beam, and the semiconductor wafer is cut starting from the modified portion.
  • the stealth dicing method after forming the modified portion by irradiating the inside of the semiconductor wafer with a laser beam, the ultrathin semiconductor wafer is attached to an adhesive sheet (dicing sheet) composed of a base material and an adhesive layer, By expanding the dicing sheet, the semiconductor wafer can be divided (diced) along the dicing line, and semiconductor chips can be produced with high yield.
  • a laser is used as a processing means in the dicing process as described above, and a laser is also used as a tool for accurately aligning a plate-like member such as a semiconductor wafer in the dicing process.
  • the pressure-sensitive adhesive sheet used when laser light is used in the dicing process (in this specification, this pressure-sensitive adhesive sheet is also referred to as “laser dicing sheet”) is used when the laser dicing sheet is used. If the laser is transmitted, it must have excellent transparency to the laser light.
  • Patent Document 2 discloses a laser dicing sheet comprising a base material and an adhesive layer formed on one side thereof, and has a total light transmittance in a wavelength region of 300 to 400 nm. There is disclosed a laser dicing sheet that is 60% or more, has a haze of 20% or less, and has a transmission definition of 30 or more when the width of the optical comb is 0.25 mm.
  • JP 2005-229040 A Japanese Patent No. 5124778
  • Patent Document 2 discloses the above-described laser dicing sheet, in which the center line average roughness Ra on one side of the substrate is larger than the center line average roughness Ra on the other side, and the center line average roughness Ra is large.
  • a surface having a center line average roughness Ra of 0.3 to 0.7 ⁇ m is defined as a pressure-sensitive adhesive layer forming surface, and the center line of the surface on the opposite side of the surface of the substrate.
  • a laser dicing sheet having an average roughness Ra of 0.14 ⁇ m is disclosed (Example of Patent Document 2).
  • Such a laser dicing sheet has a smooth surface on the side opposite to the pressure-sensitive adhesive layer forming surface of the substrate, which is the surface on which the laser is incident. This prevents the laser light from being used effectively.
  • a workpiece such as a semiconductor chip manufactured from a plate-like member such as a semiconductor wafer using a laser dicing sheet tends to be thinner.
  • a silicon wafer may be used instead of a substrate, and a chip may be stacked thereon using a Si through electrode (TSV, Through-Silicon Via).
  • TSV Through-Silicon Via
  • the pressure-sensitive adhesive layer of the laser dicing sheet is easily peeled off from the workpiece attached to the pressure-sensitive adhesive layer. It is preferable that it can be (excellent pickup property).
  • the laser dicing sheet described in Patent Document 2 there may be a portion where the pressure-sensitive adhesive layer is not properly formed on the substrate. Such a portion is observed as a defect in a plan view of the laser dicing sheet, and may cause nonuniformity in the arrival light of the laser plate member incident to process the plate member.
  • the present invention provides a pressure-sensitive adhesive sheet that is used when laser light is used in a dicing process, and that provides a pressure-sensitive adhesive sheet that is less prone to defects and has excellent pick-up properties. It is an object to provide a method for producing a workpiece from a member.
  • the thickness of an adhesive layer shall be 2 micrometers or more and 12 micrometers or less, and arithmetic mean roughness Ra of both surfaces of a base material shall be 0.2 micrometers or less.
  • the present inventors have obtained new knowledge that a pressure-sensitive adhesive sheet having excellent pickup properties can be obtained while stably reducing the possibility of occurrence of defects.
  • the present invention completed based on the above findings is as follows.
  • An adhesive layer provided on the surface, and the base material is arithmetically defined in JIS B0601: 2013 (ISO 4287: 1997) for both the one surface and the surface opposite to the one surface.
  • the pressure-sensitive adhesive sheet is characterized in that an average roughness Ra is 0.01 ⁇ m or more and 0.2 ⁇ m or less, and a thickness of the pressure-sensitive adhesive layer is 2 ⁇ m or more and 12 ⁇ m or less.
  • the pressure-sensitive adhesive sheet has a haze specified in JIS K7136: 2000 (ISO 14782: 1999) of 0.01% or more and 10% or less when the base material side is the incident side (1) ) Adhesive sheet.
  • the acrylic polymer includes a structural unit derived from methyl methacrylate, and the mass ratio of methyl methacrylate to the whole monomer giving the acrylic polymer is 5% by mass or more and 20% by mass or less.
  • the pressure-sensitive adhesive sheet according to (3) is a structural unit derived from methyl methacrylate, and the mass ratio of methyl methacrylate to the whole monomer giving the acrylic polymer is 5% by mass or more and 20% by mass or less.
  • a surface closer to the pressure-sensitive adhesive layer than the base material of the pressure-sensitive adhesive sheet described in any one of (1) to (8) is set to one surface of an adherend including a plate-like member.
  • the first laminate provided for the dividing step includes an additional layer between the pressure-sensitive adhesive layer and the plate-like member, and the additional layer is also divided by the dividing step, and the pickup step
  • the chip separated from the pressure-sensitive adhesive sheet comprises a divided body of the plate-like member and a divided body of the additional layer formed on a surface proximal to the pressure-sensitive adhesive sheet of the divided body of the plate-like member.
  • an adhesive sheet that is less prone to defects and has excellent pick-up properties. Moreover, it becomes possible to manufacture a processed material stably from a plate-shaped member by using this adhesive sheet.
  • Adhesive sheet The adhesive sheet which concerns on one Embodiment of this invention is equipped with a base material and an adhesive layer.
  • the base material of the pressure-sensitive adhesive sheet according to this embodiment is a surface opposite to the pressure-sensitive adhesive layer (also referred to as “pressure-sensitive adhesive processing surface” in this specification) and the pressure-sensitive adhesive processing surface.
  • arithmetic average roughness Ra (hereinafter referred to as “arithmetic average roughness Ra”) defined in JIS B0601: 2013 (ISO 4287: 1997). “Is used in this sense.)” Is 0.2 ⁇ m or less.
  • the laser light incident from the base material side of the pressure-sensitive adhesive sheet easily reaches the plate-like member to which the pressure-sensitive adhesive sheet is stuck uniformly.
  • the plate-like member non-uniformly, for example, there is a portion where the modified portion is not properly formed in the plate-like member, and the plate-like member is appropriately separated at this portion.
  • the arithmetic average roughness Ra is preferably 0.18 ⁇ m or less, and preferably 0.16 ⁇ m or less for both the pressure-sensitive adhesive processed surface and the laser incident surface.
  • the lower limit of the arithmetic average roughness Ra is not limited for the pressure-sensitive adhesive processed surface.
  • the arithmetic average roughness Ra is preferably 0.01 ⁇ m or more for both the pressure-sensitive adhesive processed surface and the laser incident surface.
  • the constituent material of the base material according to an embodiment of the present invention can satisfy the condition regarding the arithmetic average roughness Ra, and can be used as a base material of a laser dicing sheet, that is, a laser beam having a desired wavelength.
  • a base material of a laser dicing sheet that is, a laser beam having a desired wavelength.
  • the base material according to an embodiment of the present invention is usually composed of a film mainly composed of a resin-based material. This film may be a single layer or a laminate.
  • resin materials contained in such films include polypropylene such as random copolymer polypropylene and block copolymer polypropylene, polyethylene such as low density polyethylene (LDPE), linear low density polyethylene (LLDPE), and high density polyethylene (HDPE).
  • polypropylene such as random copolymer polypropylene and block copolymer polypropylene
  • polyethylene such as low density polyethylene (LDPE), linear low density polyethylene (LLDPE), and high density polyethylene (HDPE).
  • LDPE low density polyethylene
  • LLDPE linear low density polyethylene
  • HDPE high density polyethylene
  • Ethylene-vinyl acetate copolymer ethylene- (meth) acrylic acid copolymer
  • ethylene- (meth) acrylic acid ester copolymer ethylene-based copolymer such as ethylene-norbornene copolymer, norbornene resin, etc.
  • Polyolefin materials such as cycloolefin polymer (COP) polybutene, polybutadiene, and polymethylpentene; polyvinyl chloride materials such as polyvinyl chloride and vinyl chloride copolymers; polyethylene terephthalate, polybutylene terephthalate Polyester materials such as: Polyurethane materials; Polyimide materials; Ionomer resin materials; Polyacrylic materials such as alkyl (meth) acrylate homopolymers and alkyl (meth) acrylate copolymers; Polystyrene materials; Polycarbonate materials Examples thereof include resin materials, fluororesin materials, and resin materials mainly composed of water additives and modified products of these resin materials.
  • COP cycloolefin polymer
  • the resin material may be a cross-linked product of the above material and a cross-linking agent.
  • (meth) acrylic acid in the present specification means both acrylic acid and methacrylic acid. The same applies to other similar terms.
  • the resin-based material that provides the base material may be a single type or a mixture of two or more types. From the viewpoint of high laser transmittance, ease of local deformation in the in-plane direction and thickness direction, and low environmental load, the substrate according to an embodiment of the present invention contains a polyolefin-based material. Among the polyolefin-based materials, it is more preferable to contain a polypropylene such as a random copolymer polypropylene.
  • the control of the arithmetic surface roughness Ra of both surfaces of the base material is a roll that sandwiches the base material using two rolls. Performed by pressurization. By adjusting the material constituting the surfaces of these rolls and the surface roughness, the arithmetic surface roughness Ra of both surfaces of the substrate is set.
  • the surfaces of these rolls are generally made of one material made of metal and the other made of an elastic material such as rubber.
  • the arithmetic surface roughness Ra of the surface of the base material in contact with the roll made of a metal surface could be made relatively low, but the base material in contact with the roll made of an elastic material It was difficult to make the arithmetic surface roughness Ra of the surface low.
  • both the rolls required for roll pressurization are made of metal. It is preferable. However, in this case, it is necessary to more strictly control the relative arrangement of both the rolls and the substrate as compared with the case where the surface of one roll is made of an elastic material.
  • the base material When the resin-based material contained in the base material is a polyvinyl chloride-based material, the base material can be manufactured by inflation molding, so the arithmetic surface roughness Ra on both sides of the base material is low. Setting to a value is easy. However, since the polyvinyl chloride-based material contains a halogen element, it is preferable not to use it as a base material when it is required to reduce the environmental load.
  • the base material may contain various additives such as a colorant, a flame retardant, a plasticizer, an antistatic agent, a lubricant, and a filler in a film mainly composed of the resin-based material.
  • the colorant include pigments such as titanium dioxide and carbon black, and various dyes.
  • the filler include organic materials such as melamine resin, inorganic materials such as fumed silica, and metal materials such as nickel particles.
  • the content of such additives is not particularly limited, but should be within a range in which the substrate exhibits a desired function, particularly a function of transmitting laser, and does not lose desired smoothness and flexibility.
  • the substrate has transparency to the ultraviolet rays.
  • a base material has the transparency of an electron beam.
  • the thickness of the substrate is not limited as long as the pressure-sensitive adhesive sheet can function properly in each of the aforementioned steps.
  • the thickness is preferably 20 to 450 ⁇ m, more preferably 25 to 200 ⁇ m, and particularly preferably 50 to 150 ⁇ m.
  • the base material preferably has a Young's modulus of 50 to 500 MPa.
  • the Young's modulus is more preferably 60 to 450 MPa, and further preferably 100 to 420 MPa, from the viewpoint of making blocking difficult to occur and improving the expandability while improving the mechanical strength. More preferably, the pressure is 150 to 300 MPa.
  • the pressure-sensitive adhesive layer provided in the pressure-sensitive adhesive sheet according to this embodiment has a thickness of 2 ⁇ m or more and 12 ⁇ m or less. Since the thickness of the pressure-sensitive adhesive layer is within the above range and the arithmetic average roughness Ra of both surfaces of the base material is within the above range, defects are unlikely to occur in a plan view and excellent pick-up properties are obtained. An adhesive sheet can be obtained. From the viewpoint of more stably reducing the possibility of occurrence of the above disadvantages, the thickness of the pressure-sensitive adhesive layer is preferably 3 ⁇ m or more, and more preferably 4 ⁇ m or more. From the viewpoint of more stably realizing an adhesive sheet having excellent pick-up properties, the thickness of the adhesive layer is preferably 10 ⁇ m or less, more preferably 8 ⁇ m or less, and 6 ⁇ m or less. It is particularly preferred.
  • the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer included in the pressure-sensitive adhesive sheet according to this embodiment is not limited.
  • Examples of the pressure-sensitive adhesive contained in the pressure-sensitive adhesive composition include rubber-based, acrylic-based, silicone-based, and polyvinyl ether-based pressure-sensitive adhesives.
  • the case where the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer contains an acrylic pressure-sensitive adhesive will be described as an example.
  • Acrylic pressure-sensitive adhesives are excellent in transparency, and are easy to transmit laser beams.
  • the acrylic pressure-sensitive adhesive contains an acrylic polymer.
  • An acrylic polymer is a polymer containing a structural unit based on an acrylic compound as a unit constituting its skeleton.
  • the acrylic polymer may be a homopolymer obtained by polymerizing one kind of monomer, or may be a copolymer obtained by polymerizing plural kinds of monomers. From the viewpoint of easily controlling physical properties and chemical properties of the polymer, the acrylic polymer is preferably a copolymer.
  • the acrylic polymer preferably has a glass transition temperature Tg of ⁇ 40 ° C. or higher and ⁇ 10 ° C. or lower.
  • the pressure-sensitive adhesive composition contains an acrylic polymer having a glass transition temperature Tg of ⁇ 40 ° C. or higher, the pressure-sensitive adhesive layer is reduced in stickiness, and pickup properties can be further improved.
  • the glass transition temperature Tg of the acrylic polymer is more preferably ⁇ 35 ° C. or higher.
  • the glass transition temperature Tg of the acrylic polymer is preferably ⁇ 20 ° C. or lower from the viewpoint that it is easy to maintain the performance of holding the chip after dividing the wafer into chips.
  • the weight average molecular weight (Mw) of the acrylic polymer is not limited. Usually, it is preferably 100,000 to 2,000,000, more preferably 300,000 to 1,500,000. Further, the molecular weight distribution (Mw / Mn, Mn is the number average molecular weight) is not limited. Usually, it is preferably 1.0 to 10, and more preferably 1.0 to 3.0.
  • the specific type of monomer that gives the acrylic polymer is not limited.
  • examples of such monomers include (meth) acrylic acid, (meth) acrylic acid ester, acrylonitrile and the like.
  • Specific examples of (meth) acrylic acid esters include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, dodecyl (Meth) acrylate, pentadecyl (meth) acrylate, octadecyl (meth) acrylate, etc.
  • alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms cycloalkyl (meth) acrylate, benzyl (meth) acrylate, iso (Meth) acrylates having a cyclic skeleton such as bornyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, imide acrylate; Le (meth) acrylate, 2-hydroxypropyl having (meth) hydroxyl group, such as acrylates (meth) acrylate; glycidyl methacrylate, (meth) acrylate having an epoxy group such as glycidyl acrylate.
  • the acrylic polymer preferably contains methyl methacrylate from the viewpoint of increasing its glass transition temperature Tg. From the viewpoint of more stably enjoying the effect brought about by the acrylic polymer containing methyl methacrylate, the mass ratio of methyl methacrylate to the whole monomer giving the acrylic polymer is 5% by mass or more and 20% by mass. Or less, more preferably 7% by mass or more and 15% by mass or less.
  • the acrylic polymer may be a copolymer containing vinyl acetate, styrene, vinyl acetate or the like as a monomer.
  • the acrylic polymer may have at least one of an energy ray polymerizable group and a reactive functional group capable of reacting with the crosslinking agent (hereinafter abbreviated as “reactive functional group”).
  • the pressure-sensitive adhesive sheet having excellent pick-up properties can be reduced by irradiating the pressure-sensitive adhesive layer with energy rays. Can be easily obtained.
  • the energy beam polymerizable group include a group containing a polymerizable double bond. The preparation method of the acrylic polymer having an energy ray polymerizable group is not limited.
  • an acrylic polymer having a functional group having an active hydrogen such as a hydroxyl group, a carboxylic acid group, or an amino group, and functional group capable of reacting with the above functional group such as an isocyanate group and energy beam polymerization Reacting a substance having a functional group specifically examples include (meth) acryloyloxyethyl isocyanate.
  • the acrylic pressure-sensitive adhesive contains an acrylic polymer containing an energy beam polymerizable group by such an adjustment method
  • the glass transition temperature Tg of the acrylic polymer described above is Tg before reacting a substance having a functional group capable of reacting with a group and an energy ray polymerizable group.
  • the cohesiveness of the pressure-sensitive adhesive layer is adjusted by reacting this reactive functional group with a cross-linking agent. It becomes easy to suppress the generation of a residue or to further improve the pickup property by reducing the adhesiveness of the adhesive layer.
  • the combination of the reactive functional group and the crosslinking agent is not limited. Examples of reactive functional groups include groups having active hydrogen such as hydroxyl groups, carboxylic acid groups, and amino groups.
  • Examples of the crosslinking agent include an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, and a metal chelate crosslinking agent.
  • the isocyanate-based crosslinking agent contains at least a polyisocyanate compound having a plurality of isocyanate groups.
  • the polyisocyanate compound include aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate; dicyclohexylmethane-4,4′-diisocyanate, bicycloheptane triisocyanate, cyclopentylene diisocyanate, cyclohexylene diisocyanate, methyl Alicyclic isocyanate compounds such as cyclohexylene diisocyanate and hydrogenated xylylene diisocyanate; acyclic aliphatic isocyanates such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate and lysine diisocyanate, and their biuret and isocyanurate forms, compounds having an isocyanate group
  • epoxy-based crosslinking agent examples include 1,3-bis (N, N′-diglycidylaminomethyl) cyclohexane, N, N, N ′, N′-tetraglycidyl-m-xylylenediamine, ethylene glycol diglycidyl.
  • examples include ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane diglycidyl ether, diglycidyl aniline, diglycidyl amine and the like.
  • aziridine-based crosslinking agent examples include diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane tri- ⁇ -aziridinyl propionate, tetramethylolmethane tri- ⁇ -aziridinyl.
  • Metal chelate crosslinking agents include chelate compounds whose metal atoms are aluminum, zirconium, titanium, zinc, iron, tin and the like. Among these, an aluminum chelate compound is preferable because of its excellent performance.
  • the aluminum chelate compound include diisopropoxy aluminum monooleyl acetoacetate, monoisopropoxy aluminum bis oleyl acetoacetate, monoisopropoxy aluminum monooleate monoethyl acetoacetate, diisopropoxy aluminum monolauryl acetoacetate, diisopropoxy Examples thereof include aluminum monostearyl acetoacetate and diisopropoxy aluminum monoisostearyl acetoacetate.
  • the pressure-sensitive adhesive composition may contain components other than the acrylic polymer.
  • An example of such a material is an energy beam polymerizable compound.
  • the energy beam polymerizable compound is a compound that polymerizes when irradiated with energy rays such as ultraviolet rays and electron beams.
  • Examples of the energy beam polymerizable compound include low molecular weight compounds (monofunctional and polyfunctional monomers and oligomers) having an energy beam polymerizable group, and specifically include trimethylolpropane triacrylate and tetramethylolmethane.
  • Tetraacrylate pentaerythritol triacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, dicyclopentadiene dimethoxydiacrylate, isobornyl Cyclic aliphatic skeleton-containing acrylate such as acrylate, polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate oligomer, epoxy Modified acrylate, acrylate compounds, such as polyether acrylate is employed.
  • Such a compound has at least one polymerizable double bond in the molecule, and usually has a molecular weight of about 100 to 30,000, preferably about 300 to 10,000.
  • the pressure-sensitive adhesive composition is an acrylic pressure-sensitive adhesive and contains an acrylic polymer containing an energy ray polymerizable group
  • the pressure sensitive adhesive composition contains a low molecular weight compound having an energy ray polymerizable group. Even if it does not contain or contains only a small amount, the adhesiveness with respect to a to-be-adhered body can be reduced by irradiating an energy ray to an adhesive layer.
  • there is much content of the low molecular weight compound which has an energy-beam polymeric group in an adhesive composition there exists a tendency for pick-up property to fall.
  • the pressure-sensitive adhesive composition is an acrylic pressure-sensitive adhesive, and by using an acrylic polymer containing an energy ray polymerizable group, the amount of low molecular weight compound having an energy ray polymerizable group is reduced, The pickup property can be further improved.
  • the pressure-sensitive adhesive composition is an acrylic pressure-sensitive adhesive
  • the pressure-sensitive adhesive composition preferably contains 0 to 30 parts by mass of the energy ray polymerizable compound with respect to 100 parts by mass of the acrylic polymer. The content is more preferably 0 to 15 parts by mass, and further preferably 0 to 10 parts by mass.
  • the pressure-sensitive adhesive composition contains an acrylic polymer having an energy ray polymerizable group or contains an energy ray polymerizable compound, it preferably contains a photopolymerization initiator.
  • photopolymerization initiators include photoinitiators such as benzoin compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, thioxanthone compounds, and peroxide compounds, and photosensitizers such as amines and quinones.
  • 1-hydroxycyclohexyl phenyl ketone benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, ⁇ -chloranthraquinone 2,4,6-trimethylbenzoyldiphenylphosphine oxide and the like.
  • a photopolymerization initiator when ultraviolet rays are used as energy rays, the irradiation time and irradiation amount can be reduced.
  • Examples of the energy beam for reacting the energy beam polymerizable group and the energy beam polymerizable compound include ionizing radiation, that is, X-rays, ultraviolet rays, and electron beams. Among these, ultraviolet rays that are relatively easy to introduce irradiation equipment are preferable.
  • near ultraviolet rays including ultraviolet rays having a wavelength of about 200 to 380 nm may be used for ease of handling.
  • the amount of ultraviolet light may be appropriately selected according to the type of energy ray polymerizable group or energy ray polymerizable compound contained in the pressure sensitive adhesive layer and the thickness of the pressure sensitive adhesive layer, and is usually about 50 to 500 mJ / cm 2. 100 to 450 mJ / cm 2 is preferable, and 150 to 400 mJ / cm 2 is more preferable.
  • the ultraviolet illumination is usually 50 ⁇ 500mW / cm 2 or so, preferably 100 ⁇ 450mW / cm 2, more preferably 150 ⁇ 400mW / cm 2.
  • an ultraviolet-ray source For example, a high pressure mercury lamp, a metal halide lamp, etc. are used.
  • the acceleration voltage is appropriately selected according to the type of energy beam polymerizable group and energy beam polymerizable compound contained in the pressure sensitive adhesive layer and the thickness of the pressure sensitive adhesive layer.
  • the acceleration voltage is preferably about 10 to 1000 kV.
  • the irradiation dose may be set in a range in which the reaction of the energy beam polymerizable group or energy beam polymerizable compound contained in the pressure-sensitive adhesive layer appropriately proceeds, and is usually selected in the range of 10 to 1000 krad.
  • the electron beam source is not particularly limited, and for example, various electron beam accelerators such as a Cockloft Walton type, a bandegraft type, a resonant transformer type, an insulated core transformer type, a linear type, a dynamitron type, and a high frequency type are used. be able to.
  • various electron beam accelerators such as a Cockloft Walton type, a bandegraft type, a resonant transformer type, an insulated core transformer type, a linear type, a dynamitron type, and a high frequency type are used. be able to.
  • the pressure-sensitive adhesive sheet according to one embodiment of the present invention is such that the haze specified by JIS K7136: 2000 (ISO 14782: 1999) is a surface closer to the base material than the pressure-sensitive adhesive layer. Is preferably 0.01% or more and 10% or less. When the haze is 10% or less, the laser light incident on the pressure-sensitive adhesive sheet can be effectively used. From the viewpoint of enabling more stable and effective use of laser light incident on the pressure-sensitive adhesive sheet, the haze is preferably 5% or less, more preferably 2.5% or less. . From the viewpoint of effective utilization of the laser light incident on the adhesive sheet, the lower limit of the above haze is not set. From the viewpoint of improving production stability, the haze is preferably about 0.01% or more.
  • the pressure-sensitive adhesive sheet according to one embodiment of the present invention has a total light transmittance of 85% or more when the surface closer to the substrate than the pressure-sensitive adhesive layer is the incident surface, as defined in JIS K7375: 2000. Preferably there is.
  • the total light transmittance is 85% or more, the laser light incident on the adhesive sheet can be effectively used.
  • the total light transmittance is preferably 90% or more.
  • the upper limit of the total light transmittance is not set.
  • the total light transmittance is preferably about 99.99% or less.
  • the adhesive sheet which concerns on one Embodiment of this invention is provided with the additional layer in the surface at the side of an adhesive layer, and is an adherend of an adhesive sheet in the case of use of an adhesive sheet.
  • the additional layer may be attached to the plate-like member.
  • the configuration of the additional layer is not limited. Specific examples of the additional layer include a case where the additional layer includes a protective film-forming film and a case where the additional layer includes a die bonding layer.
  • the protective film-forming film is made of a material that can be cured by external energy such as heat to form a protective film.
  • the protective film-forming film or the protective film is separated from the pressure-sensitive adhesive layer in a state where the divided body is attached to a chip-shaped member obtained by separating the plate-shaped member. Therefore, when the additional layer is a protective film-forming film, it is possible to obtain a processed product in which the protective film-forming film or the protective film divided body is laminated on one surface of the chip-like member.
  • the additional layer is a die bonding layer
  • the die bonding layer is separated from the pressure-sensitive adhesive layer in a state where the divided body of the die bonding layer is attached to the chip-like member obtained by separating the plate-like member. Therefore, when the additional layer is a die bonding layer, it is possible to obtain a processed product in which the die bonding layer divided body is laminated on one surface of the chip-like member.
  • the pressure-sensitive adhesive sheet according to an embodiment of the present invention is for the purpose of protecting the pressure-sensitive adhesive layer or the additional layer until the pressure-sensitive adhesive layer or the additional layer is applied to the plate-like member as the adherend.
  • the release surface of the release sheet may be bonded to the surface closer to the adhesive layer than the base material of the adhesive sheet, specifically to the surface of the adhesive layer or the surface of the additional layer.
  • the configuration of the release sheet is arbitrary, and examples include a plastic film coated with a release agent.
  • Specific examples of the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, and polyolefin films such as polypropylene and polyethylene.
  • silicone-based, fluorine-based, long-chain alkyl-based, and the like can be used, and among these, a silicone-based material that is inexpensive and provides stable performance is preferable.
  • a paper base such as glassine paper, coated paper, and high-quality paper, or a laminated paper obtained by laminating a thermoplastic resin such as polyethylene on a paper base may be used.
  • a thermoplastic resin such as polyethylene on a paper base
  • the surface closer to the pressure-sensitive adhesive layer than the base material specifically, the surface of the pressure-sensitive adhesive layer or the surface of the additional layer, Affixed to one surface of the adherend including the plate-like member to obtain a first laminate including the adhesive sheet and the plate-like member.
  • the plate member is not limited. Examples thereof include a semiconductor wafer such as a silicon wafer, a laminate having a structure based on TSV, and the like.
  • the thickness of the plate member is not limited. A range of several tens of ⁇ m to several hundreds of ⁇ m is exemplified.
  • the first laminate may be provided with an additional layer.
  • the additional layer include a protective film forming film, a protective film formed from the protective film forming film, and a die bonding layer.
  • the additional layer may be affixed to the plate-like member as a part of the pressure-sensitive adhesive sheet, or the additional layer may be previously laminated on one surface of the plate-like member. In the latter case, the surface of the additional layer opposite to the surface facing the plate member is the surface to which the adhesive sheet is attached as one surface of the adherend including the plate member.
  • the laser beam is irradiated so as to be focused on the focal point set inside the plate-like member, and the inside of the plate-like member is reformed.
  • the wavelength of the laser beam and the irradiation method are appropriately set according to the structure of the plate member, the structure such as the thickness, and the like.
  • the plate member may be irradiated with laser light through an adhesive sheet. Even in such a case, the pressure-sensitive adhesive sheet according to an embodiment of the present invention is less likely to have a defect in a plan view. The problem that the generation of the modified portion in the shaped member becomes locally inappropriate is unlikely to occur.
  • the plate-like member may not be properly divided in the above-described dividing step. If the plate-shaped member is improperly divided, the possibility that the quality of the workpiece is lowered increases.
  • a chip can be obtained as a workpiece by separating each of the plurality of chips included in the second laminate from the adhesive sheet.
  • the separation method is not limited.
  • the adhesive sheet is deformed locally by pushing up pins and the like from the surface opposite to the chip facing side of the adhesive sheet, thereby reducing the adhesiveness of the adhesive layer to the chip to be separated.
  • the chip is separated from the pressure-sensitive adhesive sheet by peeling off the chip to be separated from the pressure-sensitive adhesive sheet using a vacuum collet or the like. In this case, when the pin is pushed up or when the chip is pulled up with a vacuum collet, a force for peeling off the adhesive layer from the chip is applied.
  • the chip When the chip is thin or has a structure based on TSV, there is a possibility that the chip may be cracked during the peeling.
  • the pressure-sensitive adhesive sheet according to an embodiment of the present invention since the thickness of the pressure-sensitive adhesive layer is appropriately controlled, the possibility that the chip breaks during the peeling is appropriately reduced. That is, the pressure-sensitive adhesive sheet according to one embodiment of the present invention is excellent in pickup properties.
  • the chip separated from the pressure-sensitive adhesive sheet by this pick-up step is on the surface of the plate-shaped member divided body and the pressure-sensitive adhesive sheet of the plate-shaped member divided body.
  • the division body of the formed additional layer is provided. That is, in the pick-up process, peeling occurs between the pressure-sensitive adhesive layer and the divided body of the additional layer, and the workpiece is separated from the pressure-sensitive adhesive sheet.
  • the additional layer which gives the divided body of an additional layer is a protective film
  • the time when a protective film is formed from a protective film formation film is not limited.
  • the additional layer provided in the first laminate is a protective film-forming film, and the work of forming the protective film from the protective film-forming film may be performed before the start of the separation step.
  • the additional layer that gives the divided body of the additional layer is a protective film-forming film, and the protective film may be formed from the divided body of the protective film-forming film provided in the workpiece.
  • Example 1 Production of base material Extrusion molding is performed using a resin composition made of a random copolymer polypropylene resin with a small T-die extruder (“Lab Plast Mill” manufactured by Toyo Seiki Seisakusho Co., Ltd.), and one surface (adhesive processing) A film having an arithmetic surface roughness Ra of 0.03 ⁇ m and an other surface (corresponding to a laser incident surface) of 0.03 ⁇ m. did. The surface roughness of the substrate was measured using a surface roughness measuring machine (“SV-3000” manufactured by Mitutoyo Corporation).
  • SV-3000 surface roughness measuring machine
  • Example 2 A pressure-sensitive adhesive sheet was obtained in a state where a release sheet was laminated on the surface on the pressure-sensitive adhesive layer side in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer was 5 ⁇ m.
  • Example 3 Except for the following changes, the pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, with the release sheet laminated on the surface on the pressure-sensitive adhesive layer side. (Changes) The molding conditions of the base material were changed so that the arithmetic surface roughness Ra of the pressure-sensitive adhesive processed surface of the base material was 0.16 ⁇ m, and the arithmetic surface roughness Ra of the laser incident surface was 0.03 ⁇ m.
  • Example 4 Except for the following changes, the pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, with the release sheet laminated on the surface on the pressure-sensitive adhesive layer side. (Changes) The molding conditions of the substrate were changed so that the arithmetic surface roughness Ra of the pressure-sensitive adhesive processed surface of the substrate was 0.04 ⁇ m, and the arithmetic surface roughness Ra of the laser incident surface was 1.3 ⁇ m.
  • a laser irradiation device Using a laser irradiation device, a laser focused on the inside of the wafer through the adhesive sheet from the side facing the adhesive layer of the silicon wafer is cut so that an 8 mm ⁇ 8 mm chip is formed. Irradiation was performed while scanning along the planned line. After irradiating all the planned cutting lines with laser, using an expander, pull out the 10 mm adhesive sheet at a speed of 10 mm / second, and remove the area where the silicon wafer is attached on the adhesive layer side of the adhesive sheet inside and outside the main surface. Stretched in the direction.
  • the adhesive sheet was irradiated with ultraviolet rays under the following irradiation conditions.
  • Illuminance 220 mW / cm 2
  • Light intensity 190 mJ / cm 2
  • the pressure-sensitive adhesive sheet of the example satisfying the conditions of the present invention had a low haze, hardly suffered from defects, was excellent in pickup properties, and was suitable as a laser dicing sheet.
  • the pressure-sensitive adhesive sheet according to the present invention is suitably used as a laser dicing sheet.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)

Abstract

Cette invention concerne une feuille adhésive destinée à être utilisée dans la fabrication de puces par exposition d'un élément en forme de plaque à une lumière laser pour former des parties modifiées dans l'élément en forme de plaque et division ultérieure dudit élément en forme de plaque, ladite feuille adhésive comprenant un élément de base et une couche d'agent adhésif agencée sur une surface de l'élément de base, ladite surface de l'élément de base et une surface opposée à ladite surface de l'élément de base ayant une rugosité Ra en moyenne arithmétique telle que définie dans la norme JIS B0601:2013 (ISO 4287:1997) de 0,01 à 0,2 μm, bornes incluses, et la couche d'agent adhésif ayant une épaisseur de 2 à 12 μm, bornes incluses. La feuille adhésive présente rarement des défauts et peut fait preuve d'une excellente performance de prise quand elle est utilisée dans un procédé de découpage de puces par lumière laser.
PCT/JP2015/083414 2014-12-02 2015-11-27 Feuille adhésive et procédé de fabrication d'un article transformé WO2016088677A1 (fr)

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KR1020177005685A KR102447759B1 (ko) 2014-12-02 2015-11-27 점착 시트, 및 가공물의 제조 방법
SG11201704347YA SG11201704347YA (en) 2014-12-02 2015-11-27 Adhesive sheet, and method for manufacturing processed article
CN201580047960.6A CN106795396B (zh) 2014-12-02 2015-11-27 粘着片以及加工物的制造方法
JP2016562422A JP6731852B2 (ja) 2014-12-02 2015-11-27 粘着シート、および加工物の製造方法

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WO2018084021A1 (fr) * 2016-11-02 2018-05-11 リンテック株式会社 Feuille de découpage en dés
JP2019121659A (ja) * 2017-12-28 2019-07-22 日東電工株式会社 ダイシングテープ一体型半導体背面密着フィルム
WO2019203021A1 (fr) * 2018-04-18 2019-10-24 リンテック株式会社 Feuille de traitement de pièce à usiner
JPWO2019188817A1 (ja) * 2018-03-29 2021-04-01 リンテック株式会社 ワーク加工用シート

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KR20210148068A (ko) * 2019-03-27 2021-12-07 린텍 가부시키가이샤 워크 가공용 시트
KR102426261B1 (ko) * 2019-09-26 2022-07-29 주식회사 엘지화학 다이싱 테이프용 점착조성물 및 이를 포함하는 다이싱 테이프
CN111693368A (zh) * 2020-06-15 2020-09-22 苏州高泰电子技术股份有限公司 用于晶圆切割胶带微观表征性能的测试方法

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JPWO2019203021A1 (ja) * 2018-04-18 2021-06-10 リンテック株式会社 ワーク加工用シート
WO2019203021A1 (fr) * 2018-04-18 2019-10-24 リンテック株式会社 Feuille de traitement de pièce à usiner
JP7325403B2 (ja) 2018-04-18 2023-08-14 リンテック株式会社 ワーク加工用シート

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JP6731852B2 (ja) 2020-07-29
TW202014490A (zh) 2020-04-16
TW202144516A (zh) 2021-12-01
TW201629171A (zh) 2016-08-16
KR102447759B1 (ko) 2022-09-27
CN106795396B (zh) 2020-12-18
CN106795396A (zh) 2017-05-31
SG11201704347YA (en) 2017-06-29
TWI811763B (zh) 2023-08-11
TWI738633B (zh) 2021-09-11
JPWO2016088677A1 (ja) 2017-09-07
KR20170091578A (ko) 2017-08-09

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