WO2016017265A1 - Feuille de découpage en dés, procédé de fabrication de feuille de découpage en dés, et procédé de fabrication de puce moulée - Google Patents

Feuille de découpage en dés, procédé de fabrication de feuille de découpage en dés, et procédé de fabrication de puce moulée Download PDF

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Publication number
WO2016017265A1
WO2016017265A1 PCT/JP2015/065855 JP2015065855W WO2016017265A1 WO 2016017265 A1 WO2016017265 A1 WO 2016017265A1 JP 2015065855 W JP2015065855 W JP 2015065855W WO 2016017265 A1 WO2016017265 A1 WO 2016017265A1
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Prior art keywords
adhesive layer
acrylic polymer
sensitive adhesive
dicing sheet
pressure
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PCT/JP2015/065855
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English (en)
Japanese (ja)
Inventor
卓生 西田
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リンテック株式会社
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Priority to JP2016538191A priority Critical patent/JP6522617B2/ja
Publication of WO2016017265A1 publication Critical patent/WO2016017265A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Definitions

  • the present invention relates to a dicing sheet used when dicing a semiconductor package in which a plurality of semiconductor chips are sealed with resin. Moreover, this invention relates to the manufacturing method of said dicing sheet, and the manufacturing method of a mold chip using said dicing sheet.
  • a semiconductor component in which a semiconductor chip is resin-sealed (referred to as “mold chip” in this specification) is usually manufactured as follows.
  • a semiconductor chip is mounted on each base of an assembly formed by connecting a plurality of bases such as a TAB tape, and these semiconductor chips are collectively sealed with an electronic component assembly (this specification) (Referred to as “semiconductor package”).
  • the semiconductor package is fixed to the dicing sheet by attaching an adhesive sheet (referred to as a “dicing sheet” in this specification) including a base material and an adhesive layer on one surface of the semiconductor package. .
  • the semiconductor package fixed to the dicing sheet is cut and separated (diced) into individual pieces, and a member in which a plurality of mold chips are arranged close to each other on the dicing sheet is manufactured (dicing step).
  • the pressure-sensitive adhesive layer of the dicing sheet is designed so that the adhesiveness of the pressure-sensitive adhesive layer is lowered by a specific stimulus, and for example, energy beam irradiation is adopted as the specific stimulus. And the process of irradiating an energy beam to a dicing sheet before the following processes are performed and reducing the adhesiveness of an adhesive layer is included.
  • the dicing sheet in this member is expanded (extends in the main surface direction) to widen the interval between the mold chips arranged on the dicing sheet (expanding process).
  • the mold chips thus separated from each other on the dicing sheet are individually picked up and separated from the dicing sheet (pickup process), and transferred to the next process. Under the present circumstances, it becomes easy to pick up by including the process of reducing the adhesiveness of said adhesive layer.
  • the pressure-sensitive adhesive layer of the dicing sheet has adhesiveness to the semiconductor package and the mold chip before irradiation with energy rays (in this specification, “adhesiveness” is not changed before irradiation with energy rays). It means that the adhesiveness is high).
  • the adherend of the dicing sheet is a semiconductor package
  • the adherend surface is usually a sealing resin surface
  • the unevenness of the adherend surface is larger than when the semiconductor wafer is the adherend. Tend to be.
  • a dicing sheet having a semiconductor wafer as an adherend is diverted as a dicing sheet used in the above process for a semiconductor package, the adhesiveness to the adherend becomes insufficient, and the individual semiconductor package is cut during the dicing process.
  • the separated mold chip is separated from the dicing sheet and scattered.
  • this defect that occurs in the dicing process is collectively referred to as “chip scattering”.
  • a resin material for imparting adhesiveness to the adhesive layer of the dicing sheet (in this specification, “Tackifying resin”) is included.
  • a general rosin-based material as a tackifying resin is a preferable material from the viewpoint of improving the tackiness of the pressure-sensitive adhesive layer.
  • the rosin-based tackifier resin may vary in adhesiveness in the adhesive layer or the adhesive layer unless the type and content thereof are appropriately controlled. It was revealed that the pick-up process could not be properly performed although the adhesive property of the film could be secured. Specifically, in the pickup process, there may be a problem that the mold chip cannot be picked up. Hereinafter, these defects are collectively referred to as “pickup defects”.
  • the present invention provides a dicing sheet and a method for manufacturing the dicing sheet in which the possibility of occurrence of problems in both the dicing step and the pickup step is reduced, and a method for manufacturing a mold chip using the dicing sheet. With the goal.
  • the surface to be attached to the dicing sheet in the semiconductor package is a resin sealing surface, as described above, the degree of unevenness is large compared to a semiconductor wafer or the like. Therefore, when the storage elastic modulus of the pressure-sensitive adhesive layer is low, the material constituting the pressure-sensitive adhesive layer is likely to enter the recess of the resin sealing surface of the semiconductor package. As a result, even if the storage modulus of the pressure-sensitive adhesive layer is increased by irradiating energy rays, the force required for the material constituting the pressure-sensitive adhesive layer that has entered this recess to escape from the recess or to be destroyed. Affects the pick-up failure.
  • the pressure-sensitive adhesive layer before being irradiated with energy rays was examined for a material having a high storage elastic modulus at 23 ° C. and having an appropriate tack value.
  • the main polymer in the material constituting the pressure-sensitive adhesive layer has an energy ray-polymerizable group and a reactive functional group, and this polymer and the cross-linking agent are reacted to cross-link the pressure-sensitive adhesive layer. It was found that the storage elastic modulus can be increased by having the structure.
  • the pressure-sensitive adhesive layer obtained by using an organometallic catalyst containing at least one of titanium and zirconium when obtaining a polymer having the energy beam polymerizable group and the reactive functional group described above The new knowledge that it is possible to raise the tack of.
  • a dicing sheet comprising a base material and an adhesive layer laminated on at least one surface of the base material, wherein the adhesive layer has an energy ray polymerizable group and a reactive functional group.
  • the acrylic polymer (A) is formed from a pressure-sensitive adhesive composition containing an acrylic polymer (A) and an isocyanate crosslinking agent (B) capable of crosslinking reaction with the reactive functional group.
  • an organometallic catalyst (C) in which the acrylic polymer (A1) having the reactive functional group and the isocyanate compound (A2) having the energy ray polymerizable group contain at least one of titanium and zirconium.
  • the mass ratio with respect to the total amount of the monomer giving the polymer (A1) is 5% by mass or more and 30% by mass or less, and the compound (A2)
  • the amount used is 0.4 equivalents or more and 0.8 equivalents or less with respect to the monomer (m1), and the surface of the pressure-sensitive adhesive layer of the dicing sheet is a method described in JIS Z0237: 1991).
  • the dicing sheet is characterized in that the amount of energy measured by using a probe tack while changing the peeling speed to 1 mm / min is 0.4 mJ / 5 mm ⁇ to 0.8 mJ / 5 mm ⁇ .
  • organometallic catalyst (C) includes a zirconium-containing chelate compound.
  • a resin sealing surface of a semiconductor package in which a semiconductor chip is resin-sealed is attached to a surface of the pressure-sensitive adhesive layer opposite to the base material.
  • the dicing sheet according to any one of the above.
  • a method for producing a dicing sheet comprising a substrate and an adhesive layer laminated on at least one surface of the substrate, wherein the acrylic heavy having an energy ray polymerizable group and a reactive functional group From the coating film obtained by applying a pressure-sensitive adhesive composition containing the union (A) and an isocyanate-based crosslinking agent (B) capable of crosslinking reaction with the reactive functional group to one surface of the substrate.
  • the acrylic polymer (A) is composed of an acrylic polymer (A1) having the reactive functional group and an isocyanate compound (A2) having the energy ray polymerizable group made of titanium and zirconium.
  • Monomer (m1) obtained by reacting in the presence of an organometallic catalyst (C) containing at least one and providing a structural unit having the reactive functional group in the acrylic polymer (A1) )
  • the reaction for forming the acrylic polymer (A) is 5% by mass to 30% by mass with respect to the whole monomer giving the acrylic polymer (A1).
  • the method for producing a dicing sheet, wherein the amount of the compound (A2) used is 0.4 equivalents or more and 0.8 equivalents or less with respect to the monomer (m1).
  • a dicing sheet and a method for manufacturing the dicing sheet in which the possibility of occurrence of problems in any of the dicing process, the expanding process, and the pick-up process is reduced. Further, by using such a dicing sheet, it is possible to manufacture a mold chip that is excellent in quality and advantageous in terms of cost.
  • the dicing sheet which concerns on one Embodiment of this invention is equipped with a base material and an adhesive layer.
  • the base material of the dicing sheet according to the present embodiment is not particularly limited as long as it is not broken in the pick-up process or the like, and is usually composed of a film mainly composed of a resin-based material. Is done.
  • Specific examples of the film include polyethylene films such as low density polyethylene (LDPE) film, linear low density polyethylene (LLDPE) film, and high density polyethylene (HDPE) film, polypropylene film, polybutene film, polybutadiene film, and polymethylpentene film.
  • Polyolefin films such as ethylene-norbornene copolymer film and norbornene resin film; polyvinyl chloride films such as polyvinyl chloride film and vinyl chloride copolymer film; polyester films such as polyethylene terephthalate film and polybutylene terephthalate film Polyurethane film; polyimide film; ionomer resin film; ethylene-vinyl acetate copolymer film; ) Ethylene copolymer films such as acrylic acid copolymer films and ethylene- (meth) acrylic acid ester copolymer films; polystyrene films, polycarbonate films; fluororesin films; and water additives and modified products of these resins Examples include films as main materials.
  • the above substrate may be a single type, or may be a laminated film in which two or more types are combined.
  • (meth) acrylic acid in the present specification means both acrylic acid and methacrylic acid. The same applies to other similar terms.
  • the base material may contain various additives such as a colorant, a flame retardant, a plasticizer, an antistatic agent, a lubricant, and a filler in a film mainly composed of the resin-based material.
  • the colorant include pigments such as titanium dioxide and carbon black, and various dyes.
  • the filler include organic materials such as melamine resin, inorganic materials such as fumed silica, and metal materials such as nickel particles.
  • the content of such an additive is not particularly limited, but should be within a range where the substrate exhibits a desired function and does not lose desired smoothness and flexibility.
  • the substrate has transparency to the ultraviolet rays.
  • a base material has the transparency of an electron beam.
  • the thickness of the base material is not limited as long as the dicing sheet can function properly in each of the aforementioned steps.
  • the thickness is preferably 20 to 450 ⁇ m, more preferably 25 to 200 ⁇ m, and particularly preferably 50 to 150 ⁇ m.
  • the breaking elongation of the base material in this embodiment is preferably 100% or more as a value measured at 23 ° C. and a relative humidity of 50%, particularly preferably 200% or more and 1000% or less.
  • the base material having a breaking elongation of 100% or more is not easily broken even when the expanding process is performed, and the mold chip formed by cutting the semiconductor package is easily separated.
  • the elongation at break is the rate of elongation relative to the original length of the test piece when the test piece is broken in a tensile test based on JIS K7161: 1994.
  • the tensile stress at 25% strain measured by a test based on JIS K7161: 1994 of the base material in the present embodiment is preferably 5 N / 10 mm or more and 15 N / 10 mm or less, and the maximum tensile stress is 15 MPa or more and 50 MPa or less. It is preferable that If the tensile stress at 25% strain is less than 5N / 10mm or the maximum tensile stress is less than 15MPa, the base material is soft when the semiconductor package is attached to the dicing sheet and then fixed to the ring frame. Looseness may occur and cause a conveyance error.
  • the load applied to the dicing sheet increases when the expanding process is performed. May cause problems such as peeling off.
  • the elongation at break, tensile stress at 25% strain, and maximum tensile stress in the present invention refer to values measured in the longitudinal direction of the substrate.
  • the pressure-sensitive adhesive layer included in the dicing sheet according to the present embodiment includes an acrylic polymer (A) having an energy ray polymerizable group and a reactive functional group, which will be described below, and a reactive functional group. It is formed from the adhesive composition containing the isocyanate type crosslinking agent (B) in which a crosslinking reaction is possible.
  • the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer included in the dicing sheet according to this embodiment contains an acrylic polymer (A) having an energy ray polymerizable group and a reactive functional group.
  • the acrylic polymer (A) is an acrylic polymer containing a structural unit based on an acrylic compound having an energy ray polymerizable group and a reactive functional group as a unit constituting its skeleton.
  • the acrylic polymer (A) may be a homopolymer obtained by polymerizing one kind of monomer, or may be a copolymer obtained by polymerizing plural kinds of monomers. From the viewpoint of easily controlling the physical characteristics and chemical characteristics of the polymer, the acrylic polymer (A) is preferably a copolymer.
  • the weight average molecular weight (Mw) of the acrylic polymer (A) is preferably 10,000 to 2,000,000.
  • Such an acrylic polymer (A) causes an effect of maintaining the cohesiveness of the pressure-sensitive adhesive layer, which is a general function of the pressure-sensitive adhesive main agent. Such an effect is more exhibited as the molecular weight is higher.
  • the weight average molecular weight (Mw) of the acrylic polymer (A) is more preferably 100,000 to 1,500,000.
  • the glass transition temperature Tg of the acrylic polymer (A) is preferably in the range of ⁇ 70 to 30 ° C., more preferably in the range of ⁇ 60 to 20 ° C.
  • the weight average molecular weight in this specification is the value of polystyrene conversion measured by the gel permeation chromatography (GPC) method.
  • the reactive functional group possessed by the acrylic polymer (A) is a functional group capable of undergoing a crosslinking reaction with the isocyanate crosslinking agent (B) described later, and examples thereof include a hydroxyl group, a carboxyl group, and an amino group. Among these, a hydroxyl group having high reactivity with the isocyanate group related to the isocyanate-based crosslinking agent (B) is preferable as the reactive functional group of the acrylic polymer (A).
  • the kind of energy ray polymerizable group which the acrylic polymer (A) has is not particularly limited. Specific examples thereof include a functional group having an ethylenically unsaturated bond such as a vinyl group or a (meth) acryloyl group. From the viewpoint of excellent polymerization reactivity, the energy ray polymerizable group is preferably a functional group having an ethylenically unsaturated bond, and among them, from the viewpoint of high reactivity when irradiated with energy rays (meta) An acryloyl group is more preferred.
  • Examples of the energy beam for reacting the energy beam polymerizable group include ionizing radiation, that is, X-rays, ultraviolet rays, and electron beams. Among these, ultraviolet rays that are relatively easy to introduce irradiation equipment are preferable.
  • near ultraviolet rays including ultraviolet rays having a wavelength of about 200 to 380 nm may be used for ease of handling.
  • the amount of ultraviolet rays may be appropriately selected according to the type of energy beam polymerizable group of the acrylic polymer (A) and the thickness of the pressure-sensitive adhesive layer, and is usually about 50 to 500 mJ / cm 2 , 450 mJ / cm 2 is preferable, and 150 to 400 mJ / cm 2 is more preferable.
  • the ultraviolet illumination is usually 50 ⁇ 500mW / cm 2 or so, preferably 100 ⁇ 450mW / cm 2, more preferably 150 ⁇ 400mW / cm 2.
  • an ultraviolet-ray source For example, a high pressure mercury lamp, a metal halide lamp, etc. are used.
  • the accelerating voltage may be appropriately selected according to the type of energy beam polymerizable group of the acrylic polymer (A) and the thickness of the pressure-sensitive adhesive layer.
  • the acceleration voltage is preferably about 10 to 1000 kV.
  • the irradiation dose may be set in a range in which the reaction of the energy beam polymerizable group of the acrylic polymer (A) proceeds appropriately, and is usually selected in the range of 10 to 1000 krad.
  • the electron beam source is not particularly limited, and for example, various electron beam accelerators such as a Cockloft Walton type, a bandegraft type, a resonant transformer type, an insulated core transformer type, a linear type, a dynamitron type, and a high frequency type are used. be able to.
  • various electron beam accelerators such as a Cockloft Walton type, a bandegraft type, a resonant transformer type, an insulated core transformer type, a linear type, a dynamitron type, and a high frequency type are used. be able to.
  • the acrylic polymer (A) is an organic polymer in which the acrylic polymer (A1) having a reactive functional group and the isocyanate compound (A2) having an energy ray polymerizable group contain at least one of titanium and zirconium. It was obtained by reacting in the presence of the metal catalyst (C). By reacting in the presence of such an organometallic catalyst (C), the resulting pressure-sensitive adhesive composition containing the acrylic polymer (A) has a high storage elastic modulus at 23 ° C. and an appropriate tack value. (The definition of “tack value” will be described later).
  • the acrylic polymer (A1) is an acrylic polymer having the aforementioned reactive functional group.
  • the mass ratio of the monomer (m1) that provides the structural unit having a reactive functional group in the acrylic polymer (A1) to the whole monomer that provides the acrylic polymer (A1) is 5% by mass or more and 30% by mass. % Or less.
  • regulation regarding said mass ratio the adhesive composition containing the acrylic polymer (A) obtained from the acrylic polymer (A1) has the high storage elastic modulus in 23 degreeC, and an appropriate tack. It becomes possible to form an adhesive layer having a value.
  • the mass ratio is preferably 7% by mass or more and 25% by mass or less, more preferably 10% by mass or more and 20% by mass or less, and particularly preferably 12% by mass or more and 17% by mass or less.
  • the monomer for forming the acrylic polymer (A1) will be described by taking as an example the case where the acrylic polymer (A1) has a hydroxyl group as a reactive functional group.
  • An acrylic monomer having a hydroxyl group as a monomer (also referred to as “raw material monomer” in the present specification) that can be a raw material for forming the acrylic polymer (A1) having a hydroxyl group as described above. (Referred to herein as “hydroxyacrylic monomer”), non-acrylic monomers having a hydroxyl group, acrylic monomers having no hydroxyl group, and non-acrylic monomers having no hydroxyl group. .
  • the acrylic polymer (A1) having a hydroxyl group is a hydroxy acrylic monomer and an acrylic monomer having no hydroxyl group so that the polymer becomes an acrylic polymer among the above raw material monomers.
  • hydroxyacrylic monomers include (meth) acrylates having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate.
  • specific examples of the non-acrylic monomer having a hydroxyl group include N-methylolacrylamide.
  • the acrylic polymer having a hydroxyl group preferably includes a structural unit derived from a hydroxyacrylic monomer.
  • the monomer having a hydroxyl group is preferably a monomer having only one hydroxyl group from the viewpoint that it is easy to control the amount of the energy ray polymerizable group in the acrylic polymer (A).
  • acrylic monomers having no hydroxyl group include (meth) acrylic acid, (meth) acrylic acid esters, and derivatives thereof (acrylonitrile, etc.).
  • Specific examples of (meth) acrylic acid esters include chain skeletons such as methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate.
  • (Meth) acrylates having the following: cycloalkyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) ) (Meth) acrylates having a cyclic skeleton such as acrylate, tetrahydrofurfuryl (meth) acrylate, imide acrylate, etc .; water such as glycidyl (meth) acrylate, N-methylaminoethyl (meth) acrylate And (meth) acrylates having a reactive functional group other than groups.
  • the acrylic monomer having no hydroxyl group is alkyl (meth) acrylate
  • the alkyl group preferably has 1 to 18 carbon atoms.
  • the non-acrylic monomer having no hydroxyl group include olefins such as ethylene and norbornene, vinyl acetate, and styrene.
  • the isocyanate compound (A2) is a compound that has an energy ray polymerizable group and can have an isocyanate group upon reaction with the reactive functional group of the acrylic polymer (A1).
  • isocyanate compounds include compounds having an isocyanate group, compounds having a blocked isocyanate group, biurets and isocyanurates of compounds having an isocyanate group, compounds having an isocyanate group, ethylene glycol, trimethylolpropane, castor oil, and the like.
  • Examples include modified products such as adducts that are reaction products with non-aromatic low-molecular active hydrogen-containing compounds.
  • the isocyanate compound (A2) include (meth) acryloyloxyethyl isocyanate.
  • a reaction product of (meth) acrylate in which at least one hydroxyl group remains and a polyisocyanate compound is also given as a specific example of the isocyanate compound (A2).
  • an isocyanate compound having only one energy beam polymerizable group is preferable in that it is easy to control the amount of the energy beam polymerizable group in the acrylic polymer (A), and (meth) More preferred is acryloyloxyethyl isocyanate.
  • the amount of the compound (A2) used is 0.4 equivalents or more and 0.8 or more with respect to the monomer (m1) related to the acrylic polymer (A). It is below the equivalent.
  • regulation regarding the usage-amount of said compound (A2) the adhesive composition containing the acrylic polymer (A1) obtained from the acrylic polymer (A1) and the compound (A2) is thereby It can avoid that the obtained adhesive layer hardens
  • the amount of the compound (A2) used relative to the monomer (m1) is preferably 0.45 equivalents or more and 0.75 equivalents or less, and more preferably 0.5 equivalents or more and 0.7 equivalents or less. .
  • isocyanate-based crosslinking agent means, as specific examples of polyisocyanate compounds, aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate; dicyclohexylmethane-4,4′-diisocyanate, bicycloheptane Alicyclic isocyanate compounds such as triisocyanate, cyclopentylene diisocyanate, cyclohexylene diisocyanate, methylcyclohexylene diisocyanate, hydrogenated xylylene diisocyanate; acyclic aliphatic isocyanates such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate;
  • aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate
  • the content of the isocyanate-based crosslinking agent (B) in the pressure-sensitive adhesive composition is not limited. It sets suitably according to the kind of isocyanate type crosslinking agent (B). As an illustration which is not limited, 0.01 mass% or more and 10 mass% or less are preferred, 0.05 mass% or more and 7 mass% or less are more preferred, and 0.1 mass% or more and 3 mass% to the whole adhesive composition. The following are particularly preferred:
  • the organometallic catalyst (C) contains at least one of titanium and zirconium. Specifically, it consists of an organometallic compound containing at least one of titanium and zirconium. Examples of such organometallic compounds include alkoxides, chelates, and acylates of these metal elements, and specific examples include titanium alkoxides, titanium chelates, zirconium alkoxides, and zirconium chelates. Among these, the metal element contained in the organometallic compound preferably contains zirconium, and the metal element is preferably zirconium. The organometallic compound is preferably a chelate compound. Therefore, the organometallic catalyst (C) preferably contains a zirconium-containing chelate compound, and more preferably consists of a zirconium-containing chelate compound.
  • the organometallic catalyst (C) does not contain a tin-containing organometallic compound.
  • the pressure-sensitive adhesive composition does not contain the organometallic catalyst (C) containing a tin-containing organometallic compound, a pressure-sensitive adhesive layer having a high storage elastic modulus at 23 ° C. and an appropriate tack value is prepared. Easy to form.
  • the amount of the organometallic catalyst (C) used in the reaction for obtaining the acrylic polymer (A) is not limited.
  • the amount used is preferably 0.001 parts by mass or more and 5 parts by mass or less, and 0.01 parts by mass or more and 2 parts by mass or less in terms of metal amount with respect to 100 parts by mass of the solid content of the acrylic polymer (A1). More preferred is 0.05 part by weight or more and 1 part by weight or less.
  • the metal amount conversion means a compounding amount or a compounding ratio calculated by the mass of the metal only, excluding the mass corresponding to the molecular weight of the structure composed of the organic substance in the organometallic catalyst (C).
  • the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer included in the dicing sheet according to the present embodiment includes a photopolymerization initiator (D), a tackifier resin, You may contain various additives, such as coloring materials, such as dye and a pigment, a flame retardant, and a filler.
  • the photopolymerization initiator (D) will be described in some detail.
  • the photopolymerization initiator (D) include photoinitiators such as benzoin compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, thioxanthone compounds and peroxide compounds, and photosensitizers such as amines and quinones.
  • the irradiation time and irradiation amount can be reduced by blending the photopolymerization initiator (D).
  • an acrylic polymer (A1) and an isocyanate compound (A2) are reacted in the presence of an organometallic catalyst (C) to produce an acrylic polymer (A) and an organometallic catalyst (C
  • an organometallic catalyst (C) to produce an acrylic polymer (A) and an organometallic catalyst (C
  • a product comprising components based on A suitable solvent may be used in the above reaction.
  • the reaction conditions for the reaction in the first step are appropriately set according to the types and contents of the acrylic polymer (A1), the isocyanate compound (A2) and the organometallic catalyst (C) which are reaction raw materials.
  • the component based on the organometallic catalyst (C) preferably maintains catalytic activity.
  • an organometallic catalyst (A) is used as a catalyst for the reaction between the acrylic polymer (A) and the isocyanate-based crosslinking agent (B) that is generated when the pressure-sensitive adhesive layer is formed from the pressure-sensitive adhesive composition.
  • Components based on C) can function.
  • a mixture containing the product of the first step, the isocyanate-based crosslinking agent (B), and the photopolymerization initiator (D) as necessary is used as an adhesive composition.
  • the product of the first step includes the acrylic polymer (A)
  • the product may have undergone a process such as solvent removal.
  • the mixing method is not limited, and may be set as appropriate so that the uniformity of the mixture is increased.
  • Tack Value The surface of the pressure-sensitive adhesive layer of the dicing sheet according to this embodiment was measured using a probe tack with the peeling rate changed to 1 mm / min by the method described in JIS Z0237: 1991.
  • the amount of energy also referred to as “tack value” in this specification
  • tack value is 0.4 mJ / 5 mm ⁇ or more and 0.8 mJ / 5 mm ⁇ or less. This tack value is obtained as an integrated value of peaks measured from the start of measurement until the probe peels. When the tack value is in the above range, occurrence of chip scattering can be suppressed.
  • the tack value is preferably 0.43 mJ / 5 mm ⁇ or more and 0.75 mJ / 5 mm ⁇ or less, and 0.46 mJ / 5 mm ⁇ or more and 0.7 mJ / 5 mm ⁇ or less. More preferably, it is 0.5 mJ / 5 mm ⁇ or more and 0.65 mJ / 5 mm ⁇ or less.
  • the thickness of the pressure-sensitive adhesive layer provided in the dicing sheet according to this embodiment is not particularly limited.
  • the thickness of the pressure-sensitive adhesive layer is 20 ⁇ m or more from the viewpoint of easily controlling the tack value of the pressure-sensitive adhesive layer within the above range and reducing the possibility of cohesive failure occurring inside the pressure-sensitive adhesive layer during pickup.
  • the thickness is preferably 60 ⁇ m or less, more preferably 25 ⁇ m or more and 60 ⁇ m or less, and particularly preferably 30 ⁇ m or more and 50 ⁇ m or less.
  • the storage elastic modulus at 23 ° C. (referred to as “pre-irradiation elastic modulus” in this specification) of the pressure-sensitive adhesive layer before energy ray irradiation with respect to the pressure-sensitive adhesive layer is 10 kPa or more and 80 kPa or less. Preferably there is.
  • the material constituting the pressure-sensitive adhesive layer is less likely to enter the concave portion of the surface of the sealing resin of the semiconductor package, which is the surface to which the pressure-sensitive adhesive layer is attached, and pickup failure is caused. It becomes difficult to occur.
  • the elasticity modulus before irradiation exists in said range, the adhesiveness with respect to the to-be-adhered surface of an adhesive layer becomes suitable, and it becomes difficult to produce chip
  • the pre-irradiation elastic modulus is preferably 20 kPa or more and 75 kPa or less, and more preferably 30 kPa or more and 70 kPa or less.
  • the dicing sheet according to this embodiment is opposed to the base material of the pressure-sensitive adhesive layer for the purpose of protecting the pressure-sensitive adhesive layer until the pressure-sensitive adhesive layer is attached to a semiconductor package as an adherend.
  • the release surface of the release sheet may be bonded to the surface opposite to the surface.
  • the configuration of the release sheet is arbitrary, and examples include a plastic film coated with a release agent.
  • Specific examples of the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, and polyolefin films such as polypropylene and polyethylene.
  • silicone-based, fluorine-based, long-chain alkyl-based, and the like can be used, and among these, a silicone-based material that is inexpensive and provides stable performance is preferable.
  • a paper base such as glassine paper, coated paper, and high-quality paper, or a laminated paper obtained by laminating a thermoplastic resin such as polyethylene on a paper base may be used.
  • a thermoplastic resin such as polyethylene on a paper base
  • the manufacturing method of a dicing sheet will not be specifically limited if the adhesive layer formed from the above-mentioned adhesive composition can be laminated
  • a coating liquid containing the above-mentioned pressure-sensitive adhesive composition and optionally further containing a solvent is prepared, and a die coater, curtain coater, spray coater, slit coater, knife coater is formed on one surface of the substrate.
  • the pressure-sensitive adhesive layer can be formed by applying the coating solution, etc., and drying the coating film on the one surface.
  • the properties of the coating liquid are not particularly limited as long as it can be applied, and may contain a component for forming the pressure-sensitive adhesive layer as a solute or a dispersoid.
  • the acrylic polymer (A) and the isocyanate crosslinking agent (B) in the coating film may be advanced to form a cross-linked structure at a desired density in the pressure-sensitive adhesive layer.
  • the obtained dicing sheet is allowed to stand in an environment of, for example, 23 ° C. and 50% relative humidity for several days. Curing is usually performed.
  • the coating liquid is applied onto the release surface of the release sheet to form a coating film, which is dried to form a laminate composed of the adhesive layer and the release sheet.
  • a layered body of a dicing sheet and a release sheet may be obtained by sticking a surface of the layer opposite to the side facing the release sheet to one surface of the substrate.
  • the release sheet in this laminate may be peeled off as a process material, or may protect the pressure-sensitive adhesive layer without being peeled off until it is attached to the semiconductor package.
  • the manufacturing method includes any of the following steps:
  • the pressure-sensitive adhesive composition containing the acrylic polymer (A) and the isocyanate-based crosslinking agent (B) is applied to one surface of the base material, and a pressure-sensitive adhesive layer is formed from the obtained coating film.
  • the acrylic polymer (A) is obtained by reacting the acrylic polymer (A1) and the isocyanate compound (A2) in the presence of the organometallic catalyst (C).
  • the mass ratio of the monomer (m1) in the acrylic polymer (A1) to the whole monomer giving the acrylic polymer (A1) is 5% by mass or more and 30% by mass or more, and the acrylic polymer ( In the reaction for forming A), the amount of the compound (A2) used is 0.4 equivalents or more and 0.8 equivalents or less based on the monomer (m1).
  • Mold Chip Manufacturing Method A method of manufacturing a mold chip from a semiconductor package using the dicing sheet according to the present embodiment will be described below.
  • a semiconductor package is an electronic component assembly in which a semiconductor chip is mounted on each base of a base assembly as described above, and these semiconductor chips are collectively resin-sealed. And has a thickness of about 200 to 2000 ⁇ m.
  • the resin sealing surface has a rough arithmetic average roughness Ra of about 0.5 to 10 ⁇ m, and the sealing material contains a mold release component to facilitate removal from the mold of the sealing device. Sometimes. For this reason, when an adhesive sheet is affixed on the resin sealing surface, there is a tendency that sufficient fixing performance is not exhibited.
  • the dicing sheet according to the present embodiment affixes the surface on the pressure-sensitive adhesive layer side (that is, the surface opposite to the base material of the pressure-sensitive adhesive layer) to the resin sealing surface of the semiconductor package. If a release sheet is attached to the surface of the dicing sheet on the pressure-sensitive adhesive layer side, the release sheet is peeled off to expose the surface of the pressure-sensitive adhesive layer side to the resin sealing surface of the semiconductor package. What is necessary is just to stick the surface.
  • the outer peripheral portion of the dicing sheet is usually attached to an annular jig called a ring frame for conveyance and fixing to the apparatus by an adhesive layer provided in the portion.
  • the pressure-sensitive adhesive layer is formed from a suitable pressure-sensitive adhesive composition, the tack value is appropriate. Therefore, even if the semiconductor package affixed to the dicing sheet is subjected to a dicing process, the possibility that mold chips formed by dividing the semiconductor package into pieces will be reduced during processing.
  • the size of the mold chip formed by the dicing process is usually 5 mm ⁇ 5 mm or less, and in recent years it may be about 1 mm ⁇ 1 mm, but the pressure-sensitive adhesive layer of the dicing sheet according to this embodiment has a tack value. Since it is appropriate, it can sufficiently cope with such fine pitch dicing.
  • a plurality of mold chips can be obtained from the semiconductor package.
  • an expanding process for extending the dicing sheet in the main surface direction is usually performed so that a plurality of mold chips arranged close to each other on the dicing sheet can be easily picked up.
  • the extent of this extension may be set as appropriate in consideration of the interval between adjacent mold chips and the tensile strength of the substrate.
  • the mold chip on the adhesive layer is picked up by general means such as a suction collet.
  • the picked-up mold chip is used for the next process such as a transport process.
  • the energy beam irradiation is performed from the base material side of the dicing sheet according to the present embodiment after the dicing process is finished and before the pickup process is started, the energy beam polymerization contained in the adhesive layer included in the dicing sheet is included.
  • the reaction of the functional group proceeds, and the adhesiveness of the adhesive layer to the mold chip can be reduced.
  • an adhesive layer is formed in the recessed part of the resin sealing surface of the semiconductor package which is a to-be-adhered body. Difficult to get into the constituent materials.
  • the dicing sheet according to the present embodiment is particularly difficult to cause a pickup failure.
  • the mold chip manufacturing method according to the present embodiment chip scattering is unlikely to occur, and pick-up failure is unlikely to occur in subsequent processes. For this reason, the yield is unlikely to decrease in a series of steps from a dicing step and a pickup step for dividing the semiconductor package into a plurality of mold chips to the next step. Therefore, the mold chip obtained by the manufacturing method according to the present embodiment using the dicing sheet according to the present embodiment is likely to be cost-effective. In addition to chip molds that are directly related to these problems, chip scattering and pickup defects may cause problems such as chipping of mold chips manufactured in the same lot due to chip collisions. Therefore, the mold chip manufactured by the method for manufacturing a mold chip according to the present embodiment is less likely to have such a problem and is excellent in quality.
  • Example 1 Preparation of coating solution A coating solution having the following composition was prepared.
  • the acrylic polymer (A1) 75 parts by mass of 2-ethylhexyl acrylate, 10 parts by mass of methyl methacrylate and 15 parts by mass of 2-hydroxyethyl acrylate (HEA) were copolymerized to give a copolymer (weight average molecular weight). 700,000).
  • the amount of the compound (A2) used was 0.6 equivalent with respect to HEA positioned as a monomer (m1) that gives a structural unit having a hydroxyl group that is a reactive functional group in the acrylic polymer (A1). .
  • This amount used corresponded to 9 parts by mass with respect to 100 parts by mass of the solid content of the acrylic polymer (A1).
  • the amount of the organometallic catalyst (C) added was 3.7 ⁇ 10 ⁇ 3 parts by mass in terms of the amount of metal with respect to 100 parts by mass of the solid content of the acrylic polymer (A1).
  • a product containing components based on the acrylic polymer (A) and the organometallic catalyst (C) was obtained.
  • the adhesive layer side surface of the above laminate is affixed to one surface (corona-treated, surface tension: 54 mN / m) of a substrate made of an ethylene-methacrylic acid copolymer (EMAA) film having a thickness of 140 ⁇ m.
  • EMAC ethylene-methacrylic acid copolymer
  • Example 2 The organometallic catalyst (C) used to obtain the acrylic polymer (A) was replaced with a zirconium chelate catalyst, and a titanium chelate catalyst (“TC-750” manufactured by Matsumoto Fine Chemical Co., Ltd.) was used.
  • the dicing sheet was bonded to the pressure-sensitive adhesive layer side in the same manner as in Example 1 except that the solid content of the polymer (A1) was 100 parts by mass and the metal amount was 3.4 ⁇ 10 ⁇ 3 parts by mass. It was obtained in a state where a release sheet was laminated on the surface.
  • Example 3 A dicing sheet was prepared in the same manner as in Example 1 except that the amount of MOI used as the compound (A2) used for obtaining the acrylic polymer (A) was 0.7 equivalent to HEA. It was obtained in a state where a release sheet was laminated on the surface on the pressure-sensitive adhesive layer side.
  • Example 2 A dicing sheet was prepared in the same manner as in Example 1 except that the amount of MOI used as the compound (A2) used for obtaining the acrylic polymer (A) was 0.9 equivalent to HEA. It was obtained in a state where a release sheet was laminated on the surface on the pressure-sensitive adhesive layer side.
  • Example 3 A dicing sheet was prepared in the same manner as in Example 1 except that the amount of MOI used as the compound (A2) used for obtaining the acrylic polymer (A) was 0.3 equivalent to HEA. It was obtained in a state where a release sheet was laminated on the surface on the pressure-sensitive adhesive layer side.
  • Example 5 Except that the pressure-sensitive adhesive composition was prepared by the method described below, a dicing sheet was obtained in the state where the release sheet was laminated on the surface on the pressure-sensitive adhesive layer side in the same manner as in Example 1.
  • a composition for pressure-sensitive adhesive coating as a solution of an organic solvent by adding 10 parts by weight of a cross-linking agent and 75 parts by weight of an energy ray-curable compound (all blending amounts are solid contents) to 100 parts by weight of an acrylic polymer.
  • the details of the acrylic polymer, the crosslinking agent and the energy ray curable compound were as follows.
  • Crosslinking agent trimethylolpropane tolylene diisocyanate (TDI-TMP), “BHS 8515” manufactured by Toyochem Energy ray curable compound: 3-4 functional urethane acrylate, weight average molecular weight: 5000, “EXL810TL” manufactured by Dainichi Seika Co., Ltd.
  • the laminate of the dicing sheet and the simulated semiconductor package thus obtained is mounted on a dicing ring frame (“2-6-1” manufactured by Disco) and used with a dicing apparatus (“DFD-651” manufactured by Disco). Then, a dicing process of cutting from the simulated semiconductor package side was performed, and divided into 1 mm ⁇ 1 mm mold chips.
  • the dicing conditions were as follows.
  • Dicing blade “ZBT-5074 (Z1110LS3)” manufactured by DISCO Corporation Blade thickness: 0.17 mm Blade length: 3.3 mm Blade rotation speed: 30000 rpm Cutting speed: 100 mm / min Depth of cut into substrate: 50 ⁇ m Cutting water amount: 1.0 L / min Cutting water temperature: 20 ° C
  • the member obtained by the dicing process, where the mold chip is attached to the surface of the dicing sheet on the pressure-sensitive adhesive layer side, is visually observed, and the number of mold chips that have dropped from the dicing sheet during the dicing process is counted. The number was divided by the number of divisions (2500) in the dicing step to obtain the chip scattering rate (unit:%).
  • a laminate consisting of the dicing sheet thus obtained and four simulated semiconductor packages is mounted on a dicing ring frame (“2-6-1” manufactured by Disco), and a dicing apparatus (“DFD651” manufactured by Disco) is used. Then, a dicing process of cutting from the simulated semiconductor package side was performed, and the chip was divided into 10 mm ⁇ 10 mm mold chips.
  • the dicing conditions were the same as the dicing conditions in Test Example 3.
  • the above-mentioned member after the dicing process is irradiated with ultraviolet rays (illuminance 230 mW / cm 2 , amount of ultraviolet rays 190 mJ) from the dicing sheet side in a nitrogen atmosphere using an ultraviolet irradiation device (“RAD-2000m / 12” manufactured by Lintec Corporation). / Cm 2 ), and the reaction of the energy ray polymerizable group contained in the pressure-sensitive adhesive layer provided in the dicing sheet was allowed to proceed.
  • ultraviolet rays ultraviolet 230 mW / cm 2 , amount of ultraviolet rays 190 mJ
  • a dicing sheet in a member formed by adhering a mold chip to the surface of the dicing sheet on the pressure-sensitive adhesive layer side is expanded at a speed of 1 mm / second using an expanding device (“ME-300B type” manufactured by JCM Co., Ltd.). An expanding step of extending 20 mm in the main surface direction of the sheet was performed.
  • the dicing sheet of the example satisfying the conditions of the present invention is less likely to cause defects in both the dicing process and the pickup process.
  • the dicing sheet according to the present invention is suitably used as a dicing sheet for a semiconductor package having a large uneven surface.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)

Abstract

L'invention concerne une feuille de découpage en dés comportant un substrat et une couche d'adhésif sensible à la pression stratifiée sur une surface du substrat. La couche d'adhésive sensible à la pression est faite d'une composition d'adhésif sensible à la pression contenant un polymère acrylique (A) contenant un groupe polymérisable par rayons d'énergie et un groupe fonctionnel réactif, et un agent de réticulation isocyanate (B) susceptible de provoquer une réaction de réticulation avec le groupe fonctionnel réactif. Le polymère acrylique (A) est obtenu en résultat de la réaction, en présence d'un catalyseur organométallique (C) contenant du titane et/ou du zirconium, d'un polymère acrylique (A1) contenant un groupe fonctionnel réactif et d'un composé isocyanate (A2) contenant un groupe polymérisable par rayons d'énergie. Dans le polymère acrylique (A1), le rapport en masse d'un monomère (m1) conférant le motif structural qui contient le groupe fonctionnel réactif par rapport à tous les monomères formant le polymère acrylique (A1) est de 5 à 30 % en poids. Dans la réaction de formation du polymère acrylique (A), la quantité du composé (A2) qui est utilisée est de 0,4 à 0,8 quantités équivalentes au monomère (m1). La quantité d'énergie de la surface de la couche d'adhésif sensible à la pression sur la feuille de découpage en dés est de 0,4 à 0,8 mJ/5 mmφ.
PCT/JP2015/065855 2014-07-31 2015-06-02 Feuille de découpage en dés, procédé de fabrication de feuille de découpage en dés, et procédé de fabrication de puce moulée WO2016017265A1 (fr)

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JP2017179029A (ja) * 2016-03-29 2017-10-05 リンテック株式会社 ガラスダイシング用粘着シートおよびその製造方法
JP2017179027A (ja) * 2016-03-29 2017-10-05 リンテック株式会社 ガラスダイシング用粘着シートおよびその製造方法
JP2017179028A (ja) * 2016-03-29 2017-10-05 リンテック株式会社 ガラスダイシング用粘着シートおよびその製造方法
JPWO2017170021A1 (ja) * 2016-03-30 2019-02-14 リンテック株式会社 半導体加工用シート
TWI811187B (zh) * 2016-03-29 2023-08-11 日商琳得科股份有限公司 玻璃切割用黏著板片及其製造方法

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WO2013042698A1 (fr) * 2011-09-20 2013-03-28 日東電工株式会社 Feuille adhésive pouvant être retirée par la chaleur pour couper un composant électrique et procédé de coupe d'un composant électrique
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JP2012180494A (ja) * 2011-02-10 2012-09-20 Nitto Denko Corp 自発巻回性粘着シート及び切断体の製造方法
WO2013042698A1 (fr) * 2011-09-20 2013-03-28 日東電工株式会社 Feuille adhésive pouvant être retirée par la chaleur pour couper un composant électrique et procédé de coupe d'un composant électrique
WO2014020962A1 (fr) * 2012-08-03 2014-02-06 リンテック株式会社 Feuille de découpage en dés et procédé de fabrication de puce de dispositif

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JP2017179029A (ja) * 2016-03-29 2017-10-05 リンテック株式会社 ガラスダイシング用粘着シートおよびその製造方法
JP2017179027A (ja) * 2016-03-29 2017-10-05 リンテック株式会社 ガラスダイシング用粘着シートおよびその製造方法
JP2017179028A (ja) * 2016-03-29 2017-10-05 リンテック株式会社 ガラスダイシング用粘着シートおよびその製造方法
KR20170113062A (ko) * 2016-03-29 2017-10-12 린텍 가부시키가이샤 유리 다이싱용 점착 시트 및 그 제조 방법
KR20170113060A (ko) * 2016-03-29 2017-10-12 린텍 가부시키가이샤 유리 다이싱용 점착 시트 및 그 제조 방법
TWI811187B (zh) * 2016-03-29 2023-08-11 日商琳得科股份有限公司 玻璃切割用黏著板片及其製造方法
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KR102638358B1 (ko) * 2016-03-29 2024-02-19 린텍 가부시키가이샤 유리 다이싱용 점착 시트 및 그 제조 방법
JPWO2017170021A1 (ja) * 2016-03-30 2019-02-14 リンテック株式会社 半導体加工用シート

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