WO2014020962A1 - Feuille de découpage en dés et procédé de fabrication de puce de dispositif - Google Patents

Feuille de découpage en dés et procédé de fabrication de puce de dispositif Download PDF

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Publication number
WO2014020962A1
WO2014020962A1 PCT/JP2013/062772 JP2013062772W WO2014020962A1 WO 2014020962 A1 WO2014020962 A1 WO 2014020962A1 JP 2013062772 W JP2013062772 W JP 2013062772W WO 2014020962 A1 WO2014020962 A1 WO 2014020962A1
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WIPO (PCT)
Prior art keywords
adhesive layer
sensitive adhesive
pressure
dicing sheet
mass
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PCT/JP2013/062772
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English (en)
Japanese (ja)
Inventor
勇人 中西
卓生 西田
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リンテック株式会社
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Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to JP2013541139A priority Critical patent/JP5414953B1/ja
Priority to CN201380040183.3A priority patent/CN104508801B/zh
Publication of WO2014020962A1 publication Critical patent/WO2014020962A1/fr
Priority to PH12015500230A priority patent/PH12015500230A1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

Definitions

  • the present invention relates to a dicing sheet used when dicing a device related member such as a semiconductor package in which a plurality of semiconductor chips are resin-sealed, and a method of manufacturing a device chip using the dicing sheet.
  • a semiconductor component (referred to as a "mold chip” in this specification) in which a semiconductor chip is resin-sealed is usually produced as follows. First, a semiconductor chip is mounted on each base of an assembly formed by connecting a plurality of bases such as TAB tape, and these semiconductor chips are collectively resin-sealed to form an electronic component assembly (this specification). In the book, we call “semiconductor package”. Next, the semiconductor package is attached to the dicing sheet by attaching a pressure-sensitive adhesive sheet (referred to as a "dicing sheet” in the present specification) including a base and an adhesive layer on the surface on the sealing resin side of the semiconductor package. Fix it. The semiconductor package fixed to the dicing sheet is cut and separated (dicing) to be separated into pieces, and a member in which a plurality of mold chips are arranged in proximity to each other on the dicing sheet is manufactured (dicing step).
  • a pressure-sensitive adhesive sheet referred to as a "dicing sheet” in the present specification
  • the dicing sheet in this member is expanded (stretched in the main surface inward direction) to widen the space between the mold chips disposed on the dicing sheet (expanding step).
  • the mold chips thus separated from each other on the dicing sheet are individually picked up and separated from the dicing sheet (pickup process) and transferred to the next process.
  • the pressure-sensitive adhesive layer of the dicing sheet is usually designed such that the tackiness thereof is reduced by a particular stimulus, and as a particular stimulus, energy rays such as ultraviolet rays and electron beams are used. Irradiation is employed.
  • the semiconductor package and the mold chip obtained by dicing the semiconductor package are required to be kept attached to the dicing sheet.
  • the pressure-sensitive adhesive layer of the dicing sheet has a tackiness before energy beam irradiation to the semiconductor package and the mold chip (herein, the “tackiness” is the tackiness of the dicing sheet
  • the viscosity of the agent layer is high before the irradiation with energy rays.
  • the adherend of the dicing sheet is a semiconductor package
  • the surface roughness of the adherend surface is larger than in the case where a semiconductor substrate such as a semiconductor wafer is used as the adherend. Therefore, when a dicing sheet for forming a semiconductor substrate or the like as an adherend is diverted to a dicing sheet using a semiconductor package as an adherend, the adhesion to the adherend becomes insufficient, and the individual pieces of the semiconductor package are cut. There may be a problem (chip scattering) in which a fragmented mold chip peels off from the dicing sheet and scatters.
  • device-related member means an intermediate product manufactured in the process of manufacturing a device, which is to be subjected to a dicing process.
  • a device related member in which chip scattering easily occurs such as a member having a substrate made of a porous ceramic based material, a member having a large surface roughness of a deposition surface, or a semiconductor substrate having a thickness like a spacer The member etc. by which unevenness
  • a tackifying resin is contained in the adhesive layer of the adhesive sheet for fixing a semiconductor substrate.
  • non-flat surface a device related member having the rough surface and the uneven surface as described above (generally referred to as “non-flat surface” in the present specification).
  • adhesion is generally It is necessary to set the thickness of the pressure-sensitive adhesive layer of the sheet to about 25 ⁇ m or more to facilitate the wetting and spreading of the pressure-sensitive adhesive layer on the adherend surface and to improve the adhesion to the adherend surface of the device-related non-flat surface member.
  • the blade An aggregate formed from components such as a pressure-sensitive adhesive which made up the excluded pressure-sensitive adhesive layer by increasing the amount of the pressure-sensitive adhesive layer to be excluded (herein referred to as “pressure-sensitive adhesive aggregate").
  • pressure-sensitive adhesive aggregate An aggregate formed from components such as a pressure-sensitive adhesive which made up the excluded pressure-sensitive adhesive layer by increasing the amount of the pressure-sensitive adhesive layer to be excluded.
  • the device-related members there is a tendency for the device-related members to be easily attached to the end portions of the members (also referred to as “device chips” in this specification) in which the device-related members are separated by the dicing step.
  • a defect such as adhesion of the device chip to another member via the adhesive aggregate tends to occur.
  • the present invention is provided with a pressure-sensitive adhesive layer having excellent adhesiveness, even when the surface of the device-related member, in particular, the non-flat surface of the device-related non-flat surface member, is a defect based on pressure-sensitive adhesive aggregates. It is an object of the present invention to provide a dicing sheet which is less likely to cause and a method of manufacturing a device chip using the dicing sheet.
  • the present inventors examined the thickness of the pressure-sensitive adhesive layer of the dicing sheet to 25 ⁇ m or less, and the storage elastic modulus at 23 ° C. was 0. 0 before the energy beam irradiation.
  • the pressure-sensitive adhesive layer has excellent tackiness and cohesion by setting the pressure to 12 MPa or less and the holding time measured according to JIS Z 0237: 2000 to have a holding time of 15000 seconds or more. It has been found that it is hard to break and that the amount of adhesive aggregate formed can be reduced in the dicing step.
  • a dicing sheet comprising a substrate and a pressure-sensitive adhesive layer laminated on at least one surface of the substrate, wherein the pressure-sensitive adhesive layer is The pressure-sensitive adhesive composition comprising an acrylic polymer (A) and an energy ray-polymerizable compound (B), wherein the pressure-sensitive adhesive layer has a thickness of 25 ⁇ m or less, and the pressure-sensitive adhesive layer comprises energy ray The storage elastic modulus at 23 ° C.
  • the thickness of the pressure-sensitive adhesive layer is 25 ⁇ m or less, pressure-sensitive adhesive aggregates are not easily formed in the dicing step.
  • the adhesive layer has a storage elastic modulus at 23 ° C. before energy beam irradiation of 0.12 MPa or less. It has excellent adhesion to the surface. And since said holding time is 15000 second or more, an adhesive layer does not carry out cohesive failure easily. Since the pressure-sensitive adhesive layer having such excellent properties is provided, the dicing sheet according to the above invention is less likely to have a defect in the dicing step and the expanding step.
  • the pressure-sensitive adhesive composition comprises 50 parts by mass of a storage elastic modulus modifier (C) having a weight average molecular weight of 4,000 or less, relative to 100 parts by mass of the acrylic polymer (A). It is preferable to contain above (invention 2).
  • a pressure-sensitive adhesive composition can more stably reduce the storage modulus at 23 ° C. before the energy ray irradiation of the pressure-sensitive adhesive layer.
  • At least one part of the said energy beam polymeric compound (B) has the property as said storage elastic modulus modifier (C) (invention 3).
  • the number of components of the pressure-sensitive adhesive composition can be reduced, which is preferable in terms of production control.
  • the pressure-sensitive adhesive composition comprises a crosslinking agent (D) capable of undergoing a crosslinking reaction with the acrylic polymer (A) relative to 100 parts by mass of the acrylic polymer (A). It is preferable to contain 0.02 mass part or more (invention 4). In this case, it is easy to set the holding time to 15000 seconds or more.
  • the substrate comprises at least one of an ethylene copolymer film and a polyolefin film (Invention 5).
  • the base material provided with the ethylene-based copolymer film is likely to satisfy the mechanical properties required as the base material of the dicing sheet according to the present invention.
  • ethylene copolymer films and polyolefin films are materials that are relatively difficult to relieve stress, the combination with the pressure-sensitive adhesive layer according to the present invention results in dicing sheets that are less likely to cause problems in the expanding process. It is possible to enjoy the properties of the film, such as excellent availability stability and excellent chemical stability.
  • the surface on the opposite side to the said base material of the said adhesive layer is what is stuck on the surface of a device related member (invention 6). Even if the adhesion surface of the pressure-sensitive adhesive layer according to the above-mentioned invention is the surface of the device related member, it has excellent adhesiveness.
  • the pressure-sensitive adhesive layer side surface of the dicing sheet according to any of the above inventions is attached to a surface of a device related member, and the device on the dicing sheet Provided is a method of manufacturing a device chip, wherein related members are cut and separated to obtain a plurality of device chips (Invention 7).
  • the above-mentioned dicing sheet has excellent adhesiveness even if the surface of the device related member is the adhesion surface, the use of this dicing sheet causes problems during the manufacturing process of the device chip, particularly during the dicing process and the expanding process. Is less likely to occur.
  • the thickness of the pressure-sensitive adhesive layer is 25 ⁇ m or less, the pressure-sensitive adhesive aggregate is not easily formed in the dicing step, and a failure due to the pressure-sensitive adhesive aggregate hardly occurs.
  • the pressure-sensitive adhesive layer has excellent adhesiveness to the adhesion surface, so the thickness of the pressure-sensitive adhesive layer Although it is 25 micrometers or less as it is, it is hard to produce chip
  • the adhesive layer is unlikely to be cohesively broken, the desired tension is not applied to the dicing sheet in the expanding step, and the problem that the device chips attached to the sheet are not properly separated does not easily occur. Therefore, by using the dicing sheet according to the present invention, it is possible to manufacture with high productivity a device chip which is less likely to cause a defect based on the adhesion of the adhesive aggregate.
  • a dicing sheet 1 includes a substrate 2 and an adhesive layer 3 laminated on at least one surface of the substrate 2.
  • Base Material 2 of the dicing sheet 1 according to the present embodiment is not particularly limited as long as the base material 2 is not broken in the expanding step or the like performed after the dicing step, and usually a resin material is mainly used. Composed of film.
  • the film include ethylene copolymer films such as ethylene-vinyl acetate copolymer film, ethylene- (meth) acrylic acid copolymer film, ethylene- (meth) acrylic acid ester copolymer film; low density Polyethylene (LDPE) film, linear low density polyethylene (LLDPE) film, polyethylene film such as high density polyethylene (HDPE) film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, ethylene-norbornene copolymer film, Polyolefin-based films such as norbornene resin film; Polyvinyl chloride-based films such as polyvinyl chloride film, vinyl chloride copolymer film, etc .; Polyester film of tallate films; polyurethane film; polyimide film; polystyrene films; polycarbonate films; and fluorine resin film.
  • ethylene copolymer films such as ethylene-vinyl acetate copolymer film, ethylene- (me
  • modified films such as these crosslinked films and ionomer films are also used.
  • the above-mentioned substrate 2 may be a film made of one of these, or may be a laminated film in which two or more of these are combined.
  • (meth) acrylic acid in this specification means both acrylic acid and methacrylic acid. The same applies to other similar terms.
  • the film constituting the substrate 2 preferably comprises at least one of an ethylene copolymer film and a polyolefin film. It is easy to control the mechanical properties of the ethylene copolymer film in a wide range by changing the copolymerization ratio. For this reason, the base material 2 provided with an ethylene-type copolymer film tends to satisfy
  • Ethylene-based copolymer films and polyolefin-based films are components that adversely affect the properties as a dicing sheet (for example, in polyvinyl chloride-based films, the plasticizer contained in the film is transferred from the substrate 2 to the pressure-sensitive adhesive layer 3 And may be distributed on the side opposite to the side facing the substrate 2 of the pressure-sensitive adhesive layer 3 to reduce the adhesion of the pressure-sensitive adhesive layer 3 to the adherend. Since the amount is small, problems such as the decrease in the adhesiveness of the pressure-sensitive adhesive layer 3 to the adherend are unlikely to occur. That is, the ethylene-based copolymer film and the polyolefin-based film are excellent in chemical stability.
  • the base material 2 may contain various additives such as a pigment, a flame retardant, a plasticizer, an antistatic agent, a lubricant, and a filler in a film mainly composed of the above-described resin-based material.
  • the pigment include titanium dioxide, carbon black and the like.
  • the filler include organic materials such as melamine resin, inorganic materials such as fumed silica, and metal materials such as nickel particles.
  • the substrate 2 be permeable to ultraviolet light.
  • the base material 2 has the permeability of an electron beam.
  • the surface on the pressure-sensitive adhesive layer 3 side of the substrate 2 is one or more selected from the group consisting of a carboxyl group and its ions and salts. It is preferred that a component having is present.
  • the components described above in the substrate 2 and the components related to the pressure-sensitive adhesive layer 3 are exemplified) The chemical interaction between and can reduce the possibility of exfoliation between them. There are no particular limitations on the specific method for causing such a component to be present on the substrate adhesion surface.
  • the substrate 2 itself is, for example, an ethylene- (meth) acrylic acid copolymer film, an ionomer resin film, etc.
  • the resin to be the material constituting the substrate 2 is selected from the group consisting of carboxyl groups and their ions and salts. It may be one or two or more.
  • the substrate 2 is, for example, a polyolefin film, and the substrate adhesion surface side is subjected to corona treatment or provided with a primer layer. You may In addition, various coated films may be provided on the surface of the substrate 2 opposite to the substrate-adhered surface.
  • the thickness of the substrate 2 is not limited as long as the dicing sheet 1 can function properly in each of the aforementioned steps.
  • the thickness is preferably in the range of 20 ⁇ m to 450 ⁇ m, more preferably 25 ⁇ m to 400 ⁇ m, and particularly preferably 50 ⁇ m to 350 ⁇ m.
  • the breaking elongation of the base material 2 in the present embodiment is preferably 100% or more as a value measured at 23 ° C. and 50% relative humidity, and particularly preferably 200% or more and 1000% or less.
  • the breaking elongation is an elongation percentage of the length of the test piece at the time of breaking the test piece relative to the original length in a tensile test based on JIS K7161: 1994 (ISO 527-1 1993).
  • the base material 2 having the above-mentioned breaking elongation of 100% or more is not easily broken in the expanding step, and the device chip formed by cutting the device related member is easily separated.
  • the tensile stress at 25% strain of the base material 2 in the present embodiment is preferably 5 N / 10 mm or more and 15 N / 10 mm or less, and the maximum tensile stress is preferably 15 MPa or more and 50 MPa or less.
  • the tensile stress at 25% strain and the maximum tensile stress are measured by a test according to JIS K7161: 1994. If the tensile stress at 25% strain is less than 5N / 10 mm or the maximum tensile stress is less than 15MPa, then the device related components are attached to the dicing sheet 1 and then fixed to a frame such as a ring frame Due to the softness of the substrate 2, there is concern that slack will occur, which may cause a transport error.
  • the pressure-sensitive adhesive layer 3 included in the dicing sheet 1 according to the present embodiment is an acrylic polymer (A) and an energy ray polymerizable compound (B) described below, and, if necessary, a storage elastic modulus modifier ( It is formed from the adhesive composition containing C), a crosslinking agent (D), etc.
  • Acrylic polymer (A) The pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer 3 according to the present embodiment contains an acrylic polymer (A).
  • the acrylic polymer (A) may be contained as a crosslinked product by performing a crosslinking reaction with a crosslinking agent (D) at least a part of which is described later. .
  • the acrylic polymer (A) conventionally known acrylic polymers can be used.
  • the weight average molecular weight (Mw) of the acrylic polymer (A) is preferably 10,000 or more and 2,000,000 or less, and more preferably 100,000 or more and 1,500,000 or less from the viewpoint of film forming property at the time of coating .
  • the glass transition temperature Tg of the acrylic polymer (A) is preferably in the range of -70 ° C to 30 ° C, and more preferably in the range of -60 ° C to 20 ° C.
  • the glass transition temperature can be calculated from the Fox equation.
  • the acrylic polymer (A) may be a homopolymer formed of one type of acrylic monomer, or a copolymer formed of a plurality of types of acrylic monomers, It may be a copolymer formed of one or more types of acrylic monomers and monomers other than acrylic monomers.
  • the specific type of the compound to be the acrylic monomer is not particularly limited, and (meth) acrylic acid, itaconic acid, (meth) acrylic acid esters and derivatives thereof (such as acrylonitrile) may be mentioned as specific examples.
  • (meth) acrylic acid esters include linear skeletons of methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, etc.
  • Cyclic structures such as cyclohexyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, imidoacrylate, etc.
  • (Meth) acrylates having a hydroxyl group (meth) acrylates having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate; glycidyl (meth) acrylate, N-methylamino Having a reactive functional group other than hydroxyl group, such as chill (meth) acrylate (meth) acrylate.
  • monomers other than acrylic monomers olefins such as ethylene and norbornene, vinyl acetate, styrene and the like are exemplified.
  • the acrylic monomer is an alkyl (meth) acrylate
  • the carbon number of the alkyl group is preferably in the range of 1 to 18.
  • the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer 3 contains a crosslinking agent (D) capable of crosslinking the acrylic polymer (A) as described later, an acrylic
  • the type of reactive functional group possessed by the base polymer (A) is not particularly limited, and may be appropriately determined based on the type of the crosslinking agent (D) and the like.
  • the crosslinking agent (D) is a polyisocyanate compound
  • examples of the reactive functional group possessed by the acrylic polymer (A) include a hydroxyl group, a carboxyl group, an amino group and the like.
  • polar functional groups have the effect of improving the compatibility between the acrylic polymer (A) and the storage elastic modulus modifier (C) described later, in addition to the function of reacting with the crosslinking agent (D).
  • the crosslinking agent (D) is a polyisocyanate compound
  • the method for introducing a hydroxyl group as a reactive functional group to the acrylic polymer (A) is not particularly limited.
  • the case where the acrylic polymer (A) contains a structural unit based on an acrylate having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate or the like in the skeleton can be mentioned.
  • the acrylic polymer (A) has a reactive functional group
  • the retention before the energy ray irradiation of the pressure-sensitive adhesive layer 3 also referred to as "pre-irradiation retention in the present specification”
  • Mass ratio of the reactive functional group with respect to all monomers is 1% by mass or more and 20% by mass or less in terms of monomers for forming the acrylic polymer (A) from the viewpoint of making It is preferable to set it as a grade, and it is more preferable to set it as 2 to 10 mass%.
  • the energy ray polymerizable compound (B) contained in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment has an energy ray polymerizable group and is irradiated with energy rays such as ultraviolet rays and electron rays.
  • the specific constitution is not particularly limited as long as it can be received and polymerized.
  • the type of energy beam polymerizable group is not particularly limited. Specific examples thereof include functional groups having an ethylenically unsaturated bond such as a vinyl group and a (meth) acryloyl group.
  • the energy ray-polymerizable group has an ethylenic property from the viewpoint of reducing the possibility of functionally overlapping with the site where the crosslinking reaction of the crosslinking agent (D) is performed. It is preferable that it is a functional group which has a unsaturated bond, and the (meth) acryloyl group is more preferable from the viewpoint of the height of the reactivity when an energy ray is irradiated among them.
  • the molecular weight of the energy ray polymerizable compound (B) is not particularly limited. If the molecular weight is too small, there is a concern that the compound will volatilize during the manufacturing process, and at this time the stability of the composition of the pressure-sensitive adhesive layer 3 is reduced. Therefore, the molecular weight of the energy beam polymerizable compound (B) is preferably 100 or more, more preferably 200 or more, and particularly preferably 300 or more as a weight average molecular weight (Mw).
  • the molecular weight of at least a part of the energy ray polymerizable compound (B) is preferably 4,000 or less as a weight average molecular weight (Mw), and preferably has a property as a storage elastic modulus modifier (C) described later .
  • Mw weight average molecular weight
  • C storage elastic modulus modifier
  • the compound which consists of 1 type (s) or 2 or more types selected from is illustrated.
  • the specific composition of the above-mentioned compound is not particularly limited.
  • Specific examples of the above compounds include trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol monohydroxy penta (meth) acrylate and dipentaerythritol hexa (meth) )
  • An alkyl (meth) acrylate having a linear skeleton such as acrylate, 1,4-butylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate; dicyclopentadiene dimethoxydi (meth) acrylate, isobornyl Alkyl (meth) acrylates having a cyclic skeleton such as (meth) acrylates; polyethylene glycol di (meth) acrylates,
  • the number of energy ray polymerizable groups that the energy ray polymerizable compound (B) has in one molecule is not limited, but is preferably plural, more preferably 3 or more, and particularly preferably 5 or more. .
  • the energy ray polymerizable compound (B) contained in the pressure sensitive adhesive composition for forming the pressure sensitive adhesive layer 3 according to the present embodiment has a property as a storage elastic modulus modifier (C)
  • the energy ray The content of the polymerizable compound (B) is preferably 50 parts by mass to 300 parts by mass with respect to 100 parts by mass of the acrylic polymer (A), and may be 75 parts by mass to 150 parts by mass More preferable.
  • “parts by mass” indicating the content of each component means an amount as a solid content.
  • the energy beam polymerizable compound (B) is not a material having a property as a storage elastic modulus modifier (C)
  • the energy beam polymerizable compound (B) is an acrylic polymer and the energy beam polymerization line is The case where it has what has a structural unit which has group in a principal chain or a side chain is mentioned.
  • the composition of the composition for forming the adhesive layer 3 is simplified, the pressure-sensitive adhesive layer It has the advantage of being easy to control the existing density of the energy ray polymerizable group in 3.
  • the energy ray polymerizable compound (B) having the properties of the acrylic polymer (A) as described above can be prepared, for example, by the following method.
  • Acrylic based on a copolymer comprising a constituent unit based on (meth) acrylate containing a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group and an epoxy group and a constituent unit based on alkyl (meth) acrylate
  • the above acrylic heavy chain is produced by reacting a polymer with a compound having a functional group capable of reacting with the above functional group and an energy ray polymerizable group (for example, a group having an ethylenic double bond) in one molecule.
  • An energy ray polymerizable group can be added to the united body.
  • Examples of the energy ray for curing the energy ray polymerizable compound (B) include ionizing radiation, that is, X-ray, ultraviolet ray, electron beam and the like. Among these, ultraviolet light which is relatively easy to introduce irradiation equipment is preferable.
  • near ultraviolet light including ultraviolet light having a wavelength of about 200 to 380 nm may be used because of easy handling.
  • the amount of ultraviolet light may be appropriately selected according to the type of energy beam polymerizable compound (B) and the thickness of the adhesive layer 3 and is usually about 50 to 500 mJ / cm 2 and 100 to 450 mJ / cm 2. Preferably, 200 to 400 mJ / cm 2 is more preferable.
  • the ultraviolet illumination is usually 50 ⁇ 500mW / cm 2 or so, preferably 100 ⁇ 450mW / cm 2, more preferably 200 ⁇ 400mW / cm 2.
  • the ultraviolet light source is not particularly limited, and for example, a high pressure mercury lamp, a metal halide lamp, a UV-LED and the like are used.
  • the accelerating voltage may be appropriately selected according to the type of the energy beam polymerizable compound (B) and the thickness of the pressure-sensitive adhesive layer 3 and is generally 10 to 1000 kV. It is preferable that the degree is.
  • the irradiation dose may be set in a range where the energy ray polymerizable compound (B) cures appropriately, and is usually selected in the range of 10 to 1000 krad.
  • an electron beam source there is no restriction
  • various electron beam accelerators such as a Cockloft Wharton type, a bande graft type, a resonant transformer type, an insulation core transformer type, or a linear type, a dynamitron type, a high frequency type, are used. be able to.
  • the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer 3 according to the present embodiment may contain a storage elastic modulus modifier (C).
  • the storage elastic modulus modifier (C) has a weight average molecular weight of 4,000 or less, and the storage elastic modulus at 23 ° C. of the adhesive layer 3 before the energy ray irradiation (herein, “pre-irradiation storage elastic modulus”
  • the composition is not particularly limited as long as it can reduce the It may be composed of one kind of compound or may be composed of plural kinds of compounds.
  • the weight average molecular weight of the storage elastic modulus modifier (C) is preferably 2,500 or less, and particularly preferably 2,000 or less.
  • the lower limit of the weight average molecular weight of the storage elastic modulus modifier (C) is not particularly limited, but if it is excessively low, it tends to volatilize, and there is a concern that the composition stability of the above adhesive composition may be reduced. Therefore, the weight average molecular weight of the storage elastic modulus modifier (C) is preferably 300 or more, more preferably 500 or more, and particularly preferably 700 or more.
  • the weight average molecular weight can be measured using a GPC apparatus (HLC-8220, manufactured by Tosoh Corporation) and a column (TSK-GEL GMHXL, manufactured by Tosoh Corporation).
  • the energy beam polymerizable compound (B) contained in the composition for forming the pressure-sensitive adhesive layer 3 may have a property as a storage elastic modulus modifier (C), or adhesion
  • the composition for forming the agent layer 3 may separately contain a storage elastic modulus modifier (C).
  • a tackifying resin, a long chain alkyl acrylic oligomer, etc. are illustrated as such separately stored storage elastic modulus modifier (C).
  • the content of the storage elastic modulus modifier (C) is preferably 50 parts by mass or more, and 75 parts by mass with respect to 100 parts by mass of the acrylic polymer (A), from the viewpoint of exhibiting the function stably. It is more preferable to set it as the above and it is especially preferable to set it as 100 mass parts or more. Moreover, in order to maintain the cohesiveness of the adhesive contained in the adhesive layer 3 to an appropriate degree, the content of the storage elastic modulus modifier (C) is 500 parts by mass with respect to 100 parts by mass of the acrylic polymer (A). It is preferable to set it as mass part or less, It is more preferable to set it as 400 mass part or less, It is especially preferable to set it as 350 mass part or less.
  • the type of the tackifying resin is not particularly limited. It may be a rosin-based tackifying resin such as polymerized rosin, esterified rosin and disproportionated rosin, and hydrogenated resins thereof, or a terpene-based tackifying resin such as ⁇ -pinene resin And petroleum resins such as hydrocarbon resins. Alternatively, it may be an aromatic tackifier resin such as coumarone resin, alkyl / phenol resin, or xylene resin.
  • a composition for forming the pressure-sensitive adhesive layer 3 contains a polymerized rosin ester (C1) as a storage modulus modifier (C), and also a hydrogenated rosin ester (C2) and a hydrocarbon resin (C3) The case where it contains at least one of is mentioned.
  • the content of the polymerized rosin ester (C1) in the composition for forming the pressure-sensitive adhesive layer 3 is 20 parts by mass with respect to 100 parts by mass of the acrylic polymer (A)
  • the amount is preferably not more than 5 parts by mass, more preferably 5 parts by mass to 18 parts by mass, and particularly preferably 7 parts by mass to 15 parts by mass.
  • the sum of the content of the hydrogenated rosin ester (C2) and the content of the hydrocarbon resin (C3) in the composition for forming the pressure-sensitive adhesive layer 3 determines the cohesion of the pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer 3 From the viewpoint of enhancing the content, it is preferably 50 parts by mass or more, more preferably 70 parts by mass or more and 200 parts by mass or less, and 90 parts by mass or more and 170 parts by mass or less with respect to 100 parts by mass of the acrylic polymer (A). Is particularly preferred.
  • the long chain alkyl acrylic oligomer is an oligomer formed by polymerizing an alkyl (meth) acrylate having about 4 to 18 carbon atoms, and the specific configuration of the alkyl group portion is not particularly limited. Specific examples of monomers for forming such oligomers include butyl acrylate.
  • the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer 3 according to the present embodiment may contain, as described above, a crosslinking agent (D) capable of reacting with the acrylic polymer (A).
  • the pressure-sensitive adhesive layer 3 according to the present embodiment contains the crosslinked product obtained by the crosslinking reaction of the acrylic polymer (A) and the crosslinking agent (D).
  • the content of the crosslinking agent (D) is not particularly limited. From the viewpoint of the easiness of formation of the above-mentioned crosslinked product, the content of the crosslinking agent (D) is preferably 0.02 parts by mass or more with respect to 100 parts by mass of the acrylic polymer (A).
  • a kind of crosslinking agent (D) polyimine compounds, such as an epoxy type compound, an isocyanate type compound, a metal chelate type compound, an aziridine type compound, a melamine resin, a urea resin, dialdehydes, methylol polymer, a metal alkoxide, a metal Salt etc. are mentioned.
  • the crosslinking agent (D) is preferably a polyisocyanate compound and / or a polyepoxy compound, for the reason that the crosslinking reaction can be easily controlled.
  • the polyisocyanate compound is a compound having two or more isocyanate groups per molecule, for example, aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, xylylene diisocyanate, etc .; dicyclohexylmethane-4,4'-diisocyanate, bicycloheptane Alicyclic isocyanate compounds such as triisocyanate, cyclopentylene diisocyanate, cyclohexylene diisocyanate, methylcyclohexylene diisocyanate, hydrogenated xylylene diisocyanate; and isocyanates having a linear skeleton such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, etc. It can be mentioned.
  • biuret body isocyanurate body, adduct of these compounds and non-aromatic low molecular weight active hydrogen-containing compounds such as ethylene glycol, trimethylolpropane, castor oil, etc.
  • non-aromatic low molecular weight active hydrogen-containing compounds such as ethylene glycol, trimethylolpropane, castor oil, etc.
  • the modified form of can also be used.
  • the above-mentioned polyisocyanate compound may be one kind or plural kinds.
  • the polyepoxy compound is a compound having two or more epoxy groups per molecule, and, for example, 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane, 1,3-bis (N, N-diglycidyl) Aminomethyl) toluene, N, N, N ', N'-tetraglycidyl-4,4-diaminodiphenylmethane, N, N, N', N'-tetraglycidyl-m-xylenediamine, 1,6-diglycidyl n- Hexane, bisphenol A epoxy compounds, bisphenol F epoxy compounds, etc. may be mentioned.
  • the crosslink density of the crosslinked product contained in the adhesive layer 3 is adjusted. By doing this, it is possible to control the characteristics of the pressure-sensitive adhesive layer 3 such as holding power before irradiation.
  • the crosslink density can be adjusted by changing the content of the crosslinking agent (D) contained in the composition for forming the pressure-sensitive adhesive layer 3 or the like. Specifically, in the case where the crosslinking agent (D) contained in the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer 3 is an isocyanate compound, the content thereof may be the acrylic polymer (A) 100.
  • the content of the crosslinking agent (D) comprising an isocyanate-based compound is more preferably 10 parts by mass or more with respect to 100 parts by mass of the acrylic polymer (A), and 20 parts by mass It is particularly preferable to use the above.
  • the upper limit of the content of the crosslinking agent (D) composed of an isocyanate compound is not particularly limited, but when the content is excessively high, the storage elastic modulus before irradiation depending on the content of the storage elastic modulus modifier (C) Since it may be difficult to control in the range described later, it is preferably 50 parts by mass or less, more preferably 40 parts by mass or less, per 100 parts by mass of the acrylic polymer (A). .
  • the content of the crosslinking agent (D) contained in the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer 3 is an epoxy compound
  • the content thereof is 100 parts by mass of the acrylic polymer (A).
  • the content of the crosslinking agent (D) comprising an epoxy compound is more preferably 0.05 parts by mass or more with respect to 100 parts by mass of the acrylic polymer (A), 0 .1 part by mass or more is particularly preferable.
  • the upper limit of the content of the crosslinking agent (D) comprising an epoxy compound is not particularly limited, but when the content is excessively high, the storage elastic modulus before irradiation depending on the content of the storage elastic modulus modifier (C) Since it may be difficult to control in the range described later, it is preferably 0.4 parts by mass or less, preferably 0.3 parts by mass or less, per 100 parts by mass of the acrylic polymer (A). Is more preferred.
  • the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer 3 contains a crosslinking agent (D)
  • an appropriate crosslinking accelerator is selected depending on the type of the crosslinking agent (D) and the like. It is preferable to contain.
  • the crosslinking agent (D) is a polyisocyanate compound
  • the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer 3 preferably contains an organic metal compound-based crosslinking accelerator such as an organic tin compound. .
  • the photopolymerization initiator will be described in some detail.
  • the photopolymerization initiator include benzoin compounds, acetophenone compounds, acyl phosphine oxide compounds, titanocene compounds, thioxanthone compounds, photoinitiators such as peroxide compounds, and photosensitizers such as amines and quinones, and the like.
  • the pressure-sensitive adhesive layer 3 provided in the dicing sheet 1 according to this embodiment has a storage elastic modulus at 23 ° C. before irradiation with energy rays (storage elastic modulus before irradiation) Is 0.12 MPa or less.
  • the storage elastic modulus before irradiation is preferably 0.09 MPa or less, more preferably 0.06 MPa or less, from the viewpoint of more stably increasing the adhesiveness of the pressure-sensitive adhesive layer 3.
  • the storage elastic modulus before irradiation can be controlled by changing the molecular weight and content of the acrylic polymer (A), the degree of crosslinking thereof, the type and content of the storage elastic modulus modifier, and the like.
  • the pre-irradiation storage elastic modulus can be measured using a known viscoelasticity measuring apparatus (for example, ARES manufactured by TA Instruments). Further, in the measurement, as will be described later in the examples, using a layered body of about 1 mm in thickness made of the material constituting the pressure-sensitive adhesive layer 3 as an object to be measured is from the viewpoint of reducing variation in measurement results. preferable.
  • ARES viscoelasticity measuring apparatus
  • pre-irradiation retention force refers to the retention force of the pressure-sensitive adhesive layer 3 before energy ray irradiation, which is measured in accordance with JIS Z 0237: 2009 (ISO 29862-29864 2007). means.
  • the degree of holding power is evaluated by the time until the test piece falls off from the test plate, that is, the holding time, and the measurement method and calculation method are as defined in the above-mentioned standard.
  • the holding time measured when the measurement test of the holding force before irradiation is performed is 15000 seconds or more.
  • the adhesive layer 3 of the dicing sheet 1 does not easily cause cohesive failure or the like. Therefore, a desired tension is not applied to the dicing sheet 1 in the expanding step, and the problem that the plural mold chips arranged in proximity are not properly separated hardly occurs.
  • the holding time is 20000 seconds or more, because the longer the holding time, the less the possibility of the above-mentioned problems.
  • the upper limit of the holding time is 70000 seconds in the above standard, and the holding time of the pressure-sensitive adhesive layer 3 provided in the dicing sheet 1 according to the present embodiment is also preferably 70000 seconds.
  • the thickness of the pressure-sensitive adhesive layer 3 provided in the dicing sheet 1 according to the present embodiment is 25 ⁇ m or less. As the pressure-sensitive adhesive layer 3 becomes thinner, the amount of the pressure-sensitive adhesive deposit formed when dicing the device-related member tends to decrease. Therefore, problems caused by adhesion of adhesive deposits on device chips and the like are less likely to occur.
  • the lower limit of the thickness of the dicing sheet is not particularly limited, but if it is excessively thin, there may be a problem that the variation in the tackiness of the pressure-sensitive adhesive layer 3 may increase, so the thickness of the pressure-sensitive adhesive layer 3 is The thickness is preferably 2 ⁇ m or more, and more preferably 5 ⁇ m or more.
  • the dicing sheet 1 is a base material of the pressure-sensitive adhesive layer 3 for the purpose of protecting the pressure-sensitive adhesive layer 3 until the pressure-sensitive adhesive layer 3 is attached to the device related member which is an adherend.
  • the peeling surface of a peeling sheet may be bonded by the surface on the opposite side to the side which opposes a to-be-adhered surface.
  • the configuration of the release sheet is optional, and examples thereof include those obtained by release treatment of a plastic film with a release agent or the like.
  • Specific examples of the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate, and polyolefin films such as polypropylene and polyethylene.
  • silicone type fluorine type, long chain alkyl type and the like can be used, but among these, silicone type is preferable because inexpensive and stable performance can be obtained.
  • the thickness of the release sheet is not particularly limited, but is usually about 20 ⁇ m to 250 ⁇ m.
  • the method for producing the dicing sheet 1 is not particularly limited as long as the pressure-sensitive adhesive layer 3 formed from the above-mentioned pressure-sensitive adhesive composition can be laminated on one surface of the substrate 2.
  • a coating composition containing the above-mentioned pressure-sensitive adhesive composition and optionally further solvent is prepared, and on one surface of the substrate 2, a die coater, a curtain coater, a spray coater, a slit coater
  • the pressure-sensitive adhesive layer 3 can be formed by applying the coating composition with a knife coater or the like to form a coating, and drying the coating on the one surface.
  • the property of the coating composition is not particularly limited as long as the composition can be applied, and the composition for forming the pressure-sensitive adhesive layer 3 may be contained as a solute, or may be contained as a dispersoid There is also.
  • the acrylic weight in the coating film may be changed by changing the above-mentioned drying conditions (temperature, time, etc.) or by separately providing a heat treatment.
  • the crosslinking reaction between the combined (A) and the crosslinking agent (D) may be advanced to form a crosslinked structure in the pressure-sensitive adhesive layer 3 at a desired density of presence.
  • the obtained dicing sheet 1 is placed in an environment of, for example, 23 ° C. and 50% relative humidity. You may go to rest for a day.
  • the composition for coating is apply
  • the pressure-sensitive adhesive layer 3 of the laminate and the surface opposite to the side facing the release sheet are attached to the base material-adhered surface of the base 2 to form the dicing sheet 1 and the release sheet.
  • a laminate may be obtained.
  • the release sheet in this laminate may be released as a process material, or the pressure-sensitive adhesive layer 3 may be protected until it is attached to the semiconductor package.
  • Method of Manufacturing Device Chip A method of manufacturing a device chip from a device related member will be described below by taking a case where a molded chip is manufactured from a semiconductor package using the dicing sheet 1 according to the present embodiment as a specific example.
  • the semiconductor package is an electronic component assembly in which a semiconductor chip is mounted on each base of the base assembly as described above, and these semiconductor chips are collectively sealed with resin, but usually the substrate surface and the resin sealing It has a surface, and its thickness is about 200 to 2000 ⁇ m.
  • the resin sealing surface is rougher than the silicon mirror wafer (Ra: 0.005 ⁇ m), with an arithmetic average roughness Ra of about 0.5 to 10 ⁇ m on the surface, and facilitates removal from the mold of the sealing device. Therefore, the sealing material may contain a mold release component. Therefore, when the dicing sheet is attached to the resin sealing surface of the semiconductor package, sufficient fixing performance tends not to be exhibited.
  • the dicing sheet 1 adheres the surface on the pressure-sensitive adhesive layer 3 side (that is, the surface on the opposite side of the pressure-sensitive adhesive layer 3 to the base 2) to the resin sealing surface of the semiconductor package.
  • a release sheet is attached to the surface of the dicing sheet 1 on the pressure-sensitive adhesive layer 3 side, the release sheet is peeled off to expose the surface on the pressure-sensitive adhesive layer 3 side, and resin sealing of the semiconductor package is performed.
  • the surface may be attached to the end surface.
  • the peripheral edge portion of the Dysig sheet 1 is attached to an annular jig called a ring frame for transportation or fixing to an apparatus by an adhesive layer 3 generally provided at that portion.
  • the pressure-sensitive adhesive layer 3 is controlled to have a storage elastic modulus before irradiation within a suitable range, and thus easily spreads wet on the adherend surface formed of the resin sealing surface of the semiconductor package, and has excellent adhesion. Therefore, when the dicing sheet 1 according to the present embodiment is used, chip scattering is less likely to occur during the dicing process. Although the size of the mold chip formed by the dicing step is usually 5 mm ⁇ 5 mm or less, and may be about 1 mm ⁇ 1 mm in recent years, the pressure-sensitive adhesive layer 3 of the dicing sheet 1 according to the present embodiment is excellent. Because of its tackiness, such fine pitch dicing can be sufficiently coped with.
  • a plurality of mold chips can be obtained from the semiconductor package by performing the above-described dicing process. After completion of the dicing process, an expanding process of expanding the dicing sheet 1 in the main surface inward direction is performed so that a plurality of mold chips closely arranged on the dicing sheet 1 can be easily picked up.
  • the degree of the extension may be appropriately set in consideration of the interval which the mold chip closely arranged should have, the tensile strength of the base material 2 and the like.
  • the pressure-sensitive adhesive layer 3 according to the present embodiment has a high holding power before irradiation. Therefore, cohesive failure of the pressure-sensitive adhesive layer 3 or the like occurs during extension in the expanding step, desired tension is not applied to the dicing sheet 1, and the problem that the plural mold chips closely arranged do not separate properly does not easily occur.
  • energy beam irradiation is performed from the base material 2 side of the dicing sheet 1 which concerns on this embodiment by the start of a pick-up process, inside the adhesive layer 3 with which the dicing sheet 1 is equipped,
  • the polymerization reaction of the energy beam polymerizable compound (B) contained in this advances, and the workability of the pickup step can be enhanced.
  • the implementation time of the energy ray irradiation is not particularly limited as long as it is before the start of the pickup process after the completion of the dicing process.
  • the device chip manufacturing method according to the present embodiment is less likely to cause chip scattering. For this reason, the yield is unlikely to be reduced in the dicing step of dividing the device related member into a plurality of device chips. Therefore, the device chip obtained by the manufacturing method according to the present embodiment using the dicing sheet 1 according to the present embodiment tends to be advantageous in cost.
  • chip scattering causes problems such as chipping in other device chips manufactured in the same lot by collision not only with scattered device chips but also with scattered device chips that are not scattered. There is a case. Therefore, the possibility of having such a problem is reduced and the device chip manufactured by the method for manufacturing a device chip according to the present embodiment is excellent in quality.
  • Example 1 Preparation of Coating Composition
  • a coating composition (solvent: toluene) in a solution state having the following composition was prepared.
  • a UV-curable component manufactured by Nippon Gohsei Chemical Co., Ltd .: UV-5806, including a photopolymerization initiator) containing a 10-functional urethane acrylate (weight average molecular weight 1740) as the energy beam polymerizable compound (B) is used as a solid content 100 parts by weight, and iii) 5 parts by weight as a solid component of a crosslinking agent component (manufactured by Nippon Polyurethane Industry Co., Ltd .: Coronate L)
  • the thickness of the pressure-sensitive adhesive layer was measured using a constant-pressure thickness measuring instrument (manufactured by Techlock: PG-02).
  • One of the substrates consisting of a 140 ⁇ m thick ethylene-methacrylic acid copolymer (EMAA) film (tensile stress at 25% strain: 10.8 N / 10 mm, maximum tensile stress: 25.5 MPa, elongation at break: 525%)
  • EVA ethylene-methacrylic acid copolymer
  • the pressure-sensitive adhesive layer side of the above laminate is attached to the surface with the surface of the substrate as the substrate adhesion surface, and a dicing sheet comprising the substrate and the pressure-sensitive adhesive layer as shown in FIG. It obtained in the state by which the peeling sheet was further laminated
  • Example 2 A coating composition (solvent: toluene) in the form of a solution having the following composition was prepared.
  • i) A copolymer obtained by copolymerizing 97.5 parts by mass of butyl acrylate, 2 parts by mass of acrylic acid, and 0.5 parts by mass of 2-hydroxyethyl acrylate as an acrylic polymer
  • a UV curable component (Dainippon Seika Kogyo Co., Ltd .: EXL 810TL, containing a photopolymerization initiator) containing a trifunctional to tetrafunctional urethane acrylate (weight average molecular weight: 5000) as the energy beam polymerizable compound
  • B) 200 parts as solid
  • iii) As tackifying resin, 4 parts by mass of polymerized rosin ester (C1) (weight average molecular weight:
  • the component which has a property as a storage elastic modulus modifier (C) among the components which the composition for coating obtained contains is a tackifying resin component, and the content is 100 mass of acrylic polymers (A). It was 100 parts by mass with respect to parts. Thereafter, the same operation as in Example 1 was performed to obtain a dicing sheet.
  • Example 2 is the same as Example 2 except that the content of the UV curable component contained in the coating composition is 300 parts by mass, and the content of the crosslinking agent component is 7.5 parts by mass. The operation was performed to obtain a dicing sheet.
  • content of the component which has a property as a storage elastic modulus modifier (C) among the components which the composition for coating which concerns on Example 3 contains is 100 with respect to 100 mass parts of acrylic polymers (A). It was a mass part.
  • Example 4 In Example 1, by changing the content of the UV curable component contained in the coating composition to 120 parts by mass, the storage elastic modulus modifier (C) among the components contained in the coating composition The same operation as in Example 1 was carried out except that the content of the component having the properties as B was 120 parts by mass with respect to 100 parts by mass of the acrylic polymer (A), to obtain a dicing sheet.
  • Example 5 In Example 1, by changing the content of the UV curable component contained in the coating composition to 75 parts by mass, the storage elastic modulus modifier (C) among the components contained in the coating composition The same operation as in Example 1 was carried out except that the content of the component having the properties as in Table 1 was 75 parts by mass with respect to 100 parts by mass of the acrylic polymer (A), to obtain a dicing sheet.
  • Example 6 A dicing sheet was obtained in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer was changed from 10 ⁇ m to 20 ⁇ m in Example 1.
  • Example 7 A dicing sheet was obtained in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer was changed from 10 ⁇ m to 25 ⁇ m in Example 1.
  • Example 8 In Example 1, by changing the content of the UV curable component contained in the coating composition to 110 parts by mass, the storage elastic modulus modifier (C) among the components contained in the coating composition The same operation as in Example 1 was carried out except that the content of the component having the property of 110 parts by mass with respect to 100 parts by mass of the acrylic polymer (A) was obtained, to obtain a dicing sheet.
  • Example 9 In Example 1, from the EMAA film which is a kind of ethylene copolymer film, the polypropylene film which is a kind of polyolefin film (thickness: 140 ⁇ m, tensile stress at 25% strain) is used. A dicing sheet was obtained in the same manner as in Example 1 except that 17N / 10 mm, maximum tensile stress: 30 MPa, breaking elongation: 600% were changed.
  • the crosslinking agent component contained in the coating composition is a crosslinking agent component (Mitsubishi Gas Co., Ltd.) containing 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane as the crosslinking agent (D) Chemical made: TETRAD-C, solid content concentration: 100 mass%), and changing the content as solid content to 0.07 mass parts with respect to 100 mass parts of acrylic polymer (A) The same operation as in 1 was performed to obtain a dicing sheet.
  • a crosslinking agent component Mitsubishi Gas Co., Ltd.
  • TETRAD-C 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane
  • solid content concentration 100 mass%
  • Example 1 the type of UV curable component contained in the composition for coating is contained in the composition for coating according to Example 2 (content: acrylic polymer (A) While changing to 100 parts by mass with respect to 100 parts by mass, the coating composition does not contain a component having a property as a storage elastic modulus modifier (C), and the thickness of the pressure-sensitive adhesive layer An operation was performed in the same manner as in Example 1 except that the thickness was changed from 10 ⁇ m to 30 ⁇ m, to obtain a dicing sheet.
  • content acrylic polymer
  • C storage elastic modulus modifier
  • Comparative Example 2 In Comparative Example 1, a dicing sheet was obtained by performing the same operation as in Comparative Example 1 except that the thickness of the pressure-sensitive adhesive layer was changed from 30 ⁇ m to 10 ⁇ m.
  • Example 3 by changing the content of the UV curable component contained in the coating composition to 150 parts by mass, the storage elastic modulus modifier (C) among the components contained in the coating composition The same operation as in Example 1 was carried out except that the content of the component having the property of 150 parts by mass with respect to 100 parts by mass of the acrylic polymer (A) was obtained, to obtain a dicing sheet.
  • Comparative Example 4 Example 1 except that the UV curable component contained in the coating composition is changed to a component containing pentaerythritol tetraacrylate (weight average molecular weight: 704) (manufactured by Daicel-Cytec Co., Ltd .: EBECRYL 40) The same operation as in Example 1 was performed to obtain a dicing sheet.
  • a component containing pentaerythritol tetraacrylate weight average molecular weight: 704
  • EBECRYL 40 weight average molecular weight
  • Comparative Example 5 A dicing sheet was obtained in the same manner as in Example 1 except that the content of the crosslinking agent component was changed to 2.5 parts by mass in Example 2.
  • Comparative Example 6 A dicing sheet was obtained in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer was changed from 10 ⁇ m to 30 ⁇ m in Example 1.
  • Comparative Example 7 The same operation as in Comparative Example 2 except that the content of the UV curable component contained in the composition for coating in Comparative Example 2 is 200 parts by mass with respect to 100 parts by mass of the acrylic polymer (A). To obtain a dicing sheet.
  • Comparative Example 8 In Example 1, changing the content of the UV curable component contained in the coating composition to 140 parts by mass allows the storage elastic modulus modifier (C) to be contained among the components contained in the coating composition
  • the same operation as in Example 1 was carried out except that the content of the component having the properties as in Table 1 was 140 parts by mass with respect to 100 parts by mass of the acrylic polymer (A), to obtain a dicing sheet.
  • Example 10 component used in Example 10
  • the numerical value in the column of the content of each component means the number of parts by mass per 100 parts by mass of the acrylic polymer (A).
  • the thickness of the adhesive layer of the dicing sheet which concerns on an Example and a comparative example is shown in Table 2.
  • a release sheet (SP-PET 382 120, manufactured by Lintec Corporation) was prepared by forming a 0.1 ⁇ m-thick silicone-based release agent layer on one main surface of a 38 ⁇ m-thick polyethylene terephthalate base film.
  • Each of the coating compositions prepared in Examples and Comparative Examples is coated on the release surface of the above release sheet by a knife coater so that the thickness of the finally obtained pressure-sensitive adhesive layer is 40 ⁇ m. did.
  • the resulting coated film is dried for 1 minute in an environment of 100 ° C.
  • Test member a member simulating a semiconductor package as a device related member
  • Each of the dicing sheets prepared in Examples and Comparative Examples is attached to the surface on the sealing resin side of the test member using a tape mounter (manufactured by Lintec Corporation: Adwill RAD-2500m / 12), and the obtained test member Ring frame for dicing (Disco, Inc .: 2-6-1) on the peripheral edge of the surface on the test member side of the laminate of glass and dicing sheet (the part where the surface on the adhesive layer side of the dicing sheet is exposed) Attached. Subsequently, the test member was diced under the following conditions to obtain a chip-like member (number: 100) imitating a 5 mm square device chip.
  • the side surfaces of four members arbitrarily selected from the obtained tip-like members were observed with an optical microscope, and the number of adhesive aggregates having a size of 30 ⁇ m or more attached to the side surfaces was counted. Based on the obtained number, the generation situation of the adhesive aggregate was evaluated in the following five steps. 5: 20 or less 4: 21-40 pieces 3: 41-60 pieces 2: 61-80 pieces 1: 81 or more The evaluation results are shown in Table 2.
  • Test Example 4 ⁇ Measurement of the number of scattered chips in the dicing step> The same operation as in Test Example 3 was performed to prepare a test member provided with a sealing resin having a size of 50 mm ⁇ 50 mm and a thickness of 600 ⁇ m. The arithmetic average roughness of the surface on the sealing resin side of the obtained test member was Ra: 2 ⁇ m.
  • Each of the dicing sheets prepared in Examples and Comparative Examples is attached to the surface on the sealing resin side of the test member using a tape mounter (manufactured by Lintec Corporation: Adwill RAD-2500m / 12), and the obtained test member Ring frame for dicing (Disco, Inc .: 2-6-1) on the peripheral edge of the surface on the test member side of the laminate of glass and dicing sheet (the part where the surface on the adhesive layer side of the dicing sheet is exposed) Attached.
  • a tape mounter manufactured by Lintec Corporation: Adwill RAD-2500m / 12
  • test member Ring frame for dicing Disco, Inc .: 2-6-1
  • test member is diced under the same conditions as in Test Example 3 except that the dicing pitch is changed from 5 mm to 1 mm, the cutting speed is 100 mm / min, and the blade rotational speed is changed to 50000 rpm, and 1 mm square device chips are obtained.
  • the simulated tip-like member (number: 2500) was obtained. After dicing, the number of semiconductor components scattered from the dicing sheet was visually counted. The measurement results are shown in Table 2.
  • Test Example 5 Expanding Aptitude Test UV irradiation (illuminance: 230 mW / cm 2 , light quantity: 190 mJ / cm 2 ) from the substrate side to a dicing sheet to which a plurality of device chips are attached obtained by dicing under the conditions of Test Example 4 After this, using the expand device (manufactured by JCM: SE-100), the peripheral edge portion of the dicing sheet was dropped by 10 mm at a speed of 5 mm / s together with the ring frame to expand the dicing sheet. After leaving in the expanded state for 1 hour, it was visually confirmed whether or not deviation occurred in the part (peripheral part) stuck to the ring frame in the dicing sheet, and was evaluated according to the following criteria. Good: No deviation was confirmed. No: Deviation was observed. The evaluation results are shown in Table 2.
  • the dicing sheet according to the present invention is suitably used as a device-related member, in particular, as a dicing sheet for a device-related non-flat surface member whose deposition surface is a non-flat surface.

Abstract

La présente invention concerne une feuille de découpage en dés qui est pourvue d'une couche adhésive, ladite couche adhésive pouvant présenter un excellent pouvoir adhésif par rapport à la surface d'une partie associée à un dispositif, en particulier, même par rapport à une surface adhérente qui est une surface irrégulière d'une partie associée au dispositif possédant une surface irrégulière, et qui pose un petit problème lié à des produits d'agrégation d'adhésif. Selon l'invention, la feuille de découpage en dés (1) est dotée d'un substrat (2) et d'une couche adhésive (3) qui est stratifiée sur au moins une surface du substrat (2), la couche adhésive (3) étant formée d'une composition adhésive contenant un polymère acrylique (A) et un composé polymérisable par rayonnement énergétique (B) ; l'épaisseur de la couche adhésive (3) étant de 25 µm au maximum ; avant l'irradiation par rayonnement énergétique, le module d'élasticité de conservation de la couche adhésive (3) à 23 °C est de 0,12 MPa au maximum et, lors d'un essai de mesure de résistance à l'arrachement de la couche adhésive (3) avant l'irradiation par rayonnement énergétique, ledit essai étant mené conformément à la norme JIS Z0237:2009, le temps d'arrachement est de 15 000 s au minimum. La présente invention concerne également un procédé de fabrication d'une puce de dispositif au moyen de la feuille de découpage en dés (1).
PCT/JP2013/062772 2012-08-03 2013-05-02 Feuille de découpage en dés et procédé de fabrication de puce de dispositif WO2014020962A1 (fr)

Priority Applications (3)

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KR102349547B1 (ko) 2014-03-17 2022-01-10 린텍 가부시키가이샤 다이싱 시트 및 당해 다이싱 시트를 사용하는 칩의 제조 방법
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JP2019091903A (ja) * 2014-03-17 2019-06-13 リンテック株式会社 ダイシングシートおよび当該ダイシングシートを用いるチップの製造方法
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CN109155248A (zh) * 2016-03-24 2019-01-04 西尔特克特拉有限责任公司 用于在分裂方法中使用的聚合物杂化材料
CN109155248B (zh) * 2016-03-24 2023-09-15 西尔特克特拉有限责任公司 用于在分裂方法中使用的聚合物杂化材料
JP2018019022A (ja) * 2016-07-29 2018-02-01 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム、及び、半導体装置の製造方法
CN113226754A (zh) * 2019-03-27 2021-08-06 琳得科株式会社 工件加工用片
CN110465888A (zh) * 2019-09-17 2019-11-19 泉州运城制版有限公司 一种版辊研磨机砂轮的安装方法
JP7276555B1 (ja) 2021-11-08 2023-05-18 大日本印刷株式会社 半導体加工用粘着テープ
JP2023073945A (ja) * 2021-11-08 2023-05-26 大日本印刷株式会社 半導体加工用粘着テープ

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JP5414953B1 (ja) 2014-02-12
TW201408750A (zh) 2014-03-01
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PH12015500230A1 (en) 2015-04-06
TWI564363B (zh) 2017-01-01

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