TWI564363B - A method for manufacturing a wafer and a device wafer - Google Patents

A method for manufacturing a wafer and a device wafer Download PDF

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Publication number
TWI564363B
TWI564363B TW102116980A TW102116980A TWI564363B TW I564363 B TWI564363 B TW I564363B TW 102116980 A TW102116980 A TW 102116980A TW 102116980 A TW102116980 A TW 102116980A TW I564363 B TWI564363 B TW I564363B
Authority
TW
Taiwan
Prior art keywords
adhesive layer
dicing sheet
mass
parts
substrate
Prior art date
Application number
TW102116980A
Other languages
English (en)
Chinese (zh)
Other versions
TW201408750A (zh
Inventor
Hayato Nakanishi
Takuo Nishida
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW201408750A publication Critical patent/TW201408750A/zh
Application granted granted Critical
Publication of TWI564363B publication Critical patent/TWI564363B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW102116980A 2012-08-03 2013-05-14 A method for manufacturing a wafer and a device wafer TWI564363B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012172653 2012-08-03

Publications (2)

Publication Number Publication Date
TW201408750A TW201408750A (zh) 2014-03-01
TWI564363B true TWI564363B (zh) 2017-01-01

Family

ID=50027656

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102116980A TWI564363B (zh) 2012-08-03 2013-05-14 A method for manufacturing a wafer and a device wafer

Country Status (6)

Country Link
JP (1) JP5414953B1 (fr)
CN (1) CN104508801B (fr)
MY (1) MY172228A (fr)
PH (1) PH12015500230A1 (fr)
TW (1) TWI564363B (fr)
WO (1) WO2014020962A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015141555A1 (fr) * 2014-03-17 2015-09-24 リンテック株式会社 Feuille de découpage et procédé de production de puces utilisant ladite feuille de découpage
JP6522617B2 (ja) * 2014-07-31 2019-05-29 リンテック株式会社 ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法
EP3433876B1 (fr) * 2016-03-24 2023-09-13 Siltectra GmbH Un procédé de division
JP2018019022A (ja) * 2016-07-29 2018-02-01 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム、及び、半導体装置の製造方法
JPWO2020195744A1 (fr) * 2019-03-27 2020-10-01
CN110465888B (zh) * 2019-09-17 2021-01-15 泉州运城制版有限公司 一种版辊研磨机砂轮的安装方法
JP7276555B1 (ja) 2021-11-08 2023-05-18 大日本印刷株式会社 半導体加工用粘着テープ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008214384A (ja) * 2007-02-28 2008-09-18 Lintec Corp 粘着シート
TW201215655A (en) * 2010-09-21 2012-04-16 Nitto Denko Corp Dicing-diebonding film, method for producing dicing-diebonding film, and method for producing semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4369584B2 (ja) * 2000-01-21 2009-11-25 日東電工株式会社 半導体ウエハ保持保護用粘着シート
JP4781633B2 (ja) * 2004-03-29 2011-09-28 リンテック株式会社 粘着シート
WO2007105611A1 (fr) * 2006-03-15 2007-09-20 Shin-Etsu Polymer Co., Ltd. Gabarit de maintien, procede d'usinage de tranche de semi-conducteur, structure de protection de tranche de semi-conducteur, procede d'usinage de tranche de semi-conducteur utilisant une telle structure de protection de tranche de semi-conducteur, et procede de fabrication de puce semi-conductrice
JP4991348B2 (ja) * 2006-04-06 2012-08-01 リンテック株式会社 粘着シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008214384A (ja) * 2007-02-28 2008-09-18 Lintec Corp 粘着シート
TW201215655A (en) * 2010-09-21 2012-04-16 Nitto Denko Corp Dicing-diebonding film, method for producing dicing-diebonding film, and method for producing semiconductor device

Also Published As

Publication number Publication date
JPWO2014020962A1 (ja) 2016-07-21
WO2014020962A1 (fr) 2014-02-06
JP5414953B1 (ja) 2014-02-12
TW201408750A (zh) 2014-03-01
PH12015500230B1 (en) 2015-04-06
MY172228A (en) 2019-11-18
CN104508801B (zh) 2017-11-10
PH12015500230A1 (en) 2015-04-06
CN104508801A (zh) 2015-04-08

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