MY172228A - Dicing sheet and method for manufacturing device chips - Google Patents

Dicing sheet and method for manufacturing device chips

Info

Publication number
MY172228A
MY172228A MYPI2015700132A MYPI2015700132A MY172228A MY 172228 A MY172228 A MY 172228A MY PI2015700132 A MYPI2015700132 A MY PI2015700132A MY PI2015700132 A MYPI2015700132 A MY PI2015700132A MY 172228 A MY172228 A MY 172228A
Authority
MY
Malaysia
Prior art keywords
pressure sensitive
sensitive adhesive
adhesive layer
dicing sheet
energy ray
Prior art date
Application number
MYPI2015700132A
Other languages
English (en)
Inventor
Nakanishi Hayato
Nishida Takuo
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of MY172228A publication Critical patent/MY172228A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
MYPI2015700132A 2012-08-03 2013-05-02 Dicing sheet and method for manufacturing device chips MY172228A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012172653 2012-08-03

Publications (1)

Publication Number Publication Date
MY172228A true MY172228A (en) 2019-11-18

Family

ID=50027656

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015700132A MY172228A (en) 2012-08-03 2013-05-02 Dicing sheet and method for manufacturing device chips

Country Status (6)

Country Link
JP (1) JP5414953B1 (fr)
CN (1) CN104508801B (fr)
MY (1) MY172228A (fr)
PH (1) PH12015500230A1 (fr)
TW (1) TWI564363B (fr)
WO (1) WO2014020962A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102349547B1 (ko) * 2014-03-17 2022-01-10 린텍 가부시키가이샤 다이싱 시트 및 당해 다이싱 시트를 사용하는 칩의 제조 방법
WO2016017265A1 (fr) * 2014-07-31 2016-02-04 リンテック株式会社 Feuille de découpage en dés, procédé de fabrication de feuille de découpage en dés, et procédé de fabrication de puce moulée
EP3433876B1 (fr) * 2016-03-24 2023-09-13 Siltectra GmbH Un procédé de division
JP2018019022A (ja) * 2016-07-29 2018-02-01 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム、及び、半導体装置の製造方法
KR20210148068A (ko) * 2019-03-27 2021-12-07 린텍 가부시키가이샤 워크 가공용 시트
JP2020164786A (ja) * 2019-03-29 2020-10-08 住友ベークライト株式会社 粘着テープ
CN110465888B (zh) * 2019-09-17 2021-01-15 泉州运城制版有限公司 一种版辊研磨机砂轮的安装方法
JP7276555B1 (ja) 2021-11-08 2023-05-18 大日本印刷株式会社 半導体加工用粘着テープ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4369584B2 (ja) * 2000-01-21 2009-11-25 日東電工株式会社 半導体ウエハ保持保護用粘着シート
JP4781633B2 (ja) * 2004-03-29 2011-09-28 リンテック株式会社 粘着シート
US7875501B2 (en) * 2006-03-15 2011-01-25 Shin-Etsu Polymer Co., Ltd. Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure
JP4991350B2 (ja) * 2007-02-28 2012-08-01 リンテック株式会社 粘着シート
JP4991348B2 (ja) * 2006-04-06 2012-08-01 リンテック株式会社 粘着シート
JP2012069586A (ja) * 2010-09-21 2012-04-05 Nitto Denko Corp ダイシング・ダイボンドフィルム、ダイシング・ダイボンドフィルムの製造方法、及び、半導体装置の製造方法

Also Published As

Publication number Publication date
CN104508801B (zh) 2017-11-10
TW201408750A (zh) 2014-03-01
WO2014020962A1 (fr) 2014-02-06
JPWO2014020962A1 (ja) 2016-07-21
CN104508801A (zh) 2015-04-08
PH12015500230B1 (en) 2015-04-06
TWI564363B (zh) 2017-01-01
PH12015500230A1 (en) 2015-04-06
JP5414953B1 (ja) 2014-02-12

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