JP5414953B1 - ダイシングシートおよびデバイスチップの製造方法 - Google Patents

ダイシングシートおよびデバイスチップの製造方法 Download PDF

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Publication number
JP5414953B1
JP5414953B1 JP2013541139A JP2013541139A JP5414953B1 JP 5414953 B1 JP5414953 B1 JP 5414953B1 JP 2013541139 A JP2013541139 A JP 2013541139A JP 2013541139 A JP2013541139 A JP 2013541139A JP 5414953 B1 JP5414953 B1 JP 5414953B1
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Japan
Prior art keywords
sensitive adhesive
pressure
adhesive layer
dicing sheet
mass
Prior art date
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JP2013541139A
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English (en)
Japanese (ja)
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JPWO2014020962A1 (ja
Inventor
勇人 中西
卓生 西田
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Lintec Corp
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Lintec Corp
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Priority to JP2013541139A priority Critical patent/JP5414953B1/ja
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Publication of JP5414953B1 publication Critical patent/JP5414953B1/ja
Publication of JPWO2014020962A1 publication Critical patent/JPWO2014020962A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2013541139A 2012-08-03 2013-05-02 ダイシングシートおよびデバイスチップの製造方法 Active JP5414953B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013541139A JP5414953B1 (ja) 2012-08-03 2013-05-02 ダイシングシートおよびデバイスチップの製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012172653 2012-08-03
JP2012172653 2012-08-03
PCT/JP2013/062772 WO2014020962A1 (fr) 2012-08-03 2013-05-02 Feuille de découpage en dés et procédé de fabrication de puce de dispositif
JP2013541139A JP5414953B1 (ja) 2012-08-03 2013-05-02 ダイシングシートおよびデバイスチップの製造方法

Publications (2)

Publication Number Publication Date
JP5414953B1 true JP5414953B1 (ja) 2014-02-12
JPWO2014020962A1 JPWO2014020962A1 (ja) 2016-07-21

Family

ID=50027656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013541139A Active JP5414953B1 (ja) 2012-08-03 2013-05-02 ダイシングシートおよびデバイスチップの製造方法

Country Status (6)

Country Link
JP (1) JP5414953B1 (fr)
CN (1) CN104508801B (fr)
MY (1) MY172228A (fr)
PH (1) PH12015500230A1 (fr)
TW (1) TWI564363B (fr)
WO (1) WO2014020962A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015141555A1 (fr) * 2014-03-17 2015-09-24 リンテック株式会社 Feuille de découpage et procédé de production de puces utilisant ladite feuille de découpage
JP6522617B2 (ja) * 2014-07-31 2019-05-29 リンテック株式会社 ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法
EP3433876B1 (fr) * 2016-03-24 2023-09-13 Siltectra GmbH Un procédé de division
JP2018019022A (ja) * 2016-07-29 2018-02-01 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム、及び、半導体装置の製造方法
JPWO2020195744A1 (fr) * 2019-03-27 2020-10-01
JP2020164786A (ja) * 2019-03-29 2020-10-08 住友ベークライト株式会社 粘着テープ
CN110465888B (zh) * 2019-09-17 2021-01-15 泉州运城制版有限公司 一种版辊研磨机砂轮的安装方法
JP7276555B1 (ja) 2021-11-08 2023-05-18 大日本印刷株式会社 半導体加工用粘着テープ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203255A (ja) * 2000-01-21 2001-07-27 Nitto Denko Corp 半導体ウエハ保持保護用粘着シート
JP2005281419A (ja) * 2004-03-29 2005-10-13 Lintec Corp 粘着シート
JP2007297591A (ja) * 2006-04-06 2007-11-15 Lintec Corp 粘着シート
JP2008214384A (ja) * 2007-02-28 2008-09-18 Lintec Corp 粘着シート

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007105611A1 (fr) * 2006-03-15 2007-09-20 Shin-Etsu Polymer Co., Ltd. Gabarit de maintien, procede d'usinage de tranche de semi-conducteur, structure de protection de tranche de semi-conducteur, procede d'usinage de tranche de semi-conducteur utilisant une telle structure de protection de tranche de semi-conducteur, et procede de fabrication de puce semi-conductrice
JP2012069586A (ja) * 2010-09-21 2012-04-05 Nitto Denko Corp ダイシング・ダイボンドフィルム、ダイシング・ダイボンドフィルムの製造方法、及び、半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203255A (ja) * 2000-01-21 2001-07-27 Nitto Denko Corp 半導体ウエハ保持保護用粘着シート
JP2005281419A (ja) * 2004-03-29 2005-10-13 Lintec Corp 粘着シート
JP2007297591A (ja) * 2006-04-06 2007-11-15 Lintec Corp 粘着シート
JP2008214384A (ja) * 2007-02-28 2008-09-18 Lintec Corp 粘着シート

Also Published As

Publication number Publication date
PH12015500230B1 (en) 2015-04-06
MY172228A (en) 2019-11-18
JPWO2014020962A1 (ja) 2016-07-21
CN104508801B (zh) 2017-11-10
TW201408750A (zh) 2014-03-01
PH12015500230A1 (en) 2015-04-06
CN104508801A (zh) 2015-04-08
WO2014020962A1 (fr) 2014-02-06
TWI564363B (zh) 2017-01-01

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