TW202014490A - 黏接片以及加工物之製造方法 - Google Patents

黏接片以及加工物之製造方法 Download PDF

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Publication number
TW202014490A
TW202014490A TW108148058A TW108148058A TW202014490A TW 202014490 A TW202014490 A TW 202014490A TW 108148058 A TW108148058 A TW 108148058A TW 108148058 A TW108148058 A TW 108148058A TW 202014490 A TW202014490 A TW 202014490A
Authority
TW
Taiwan
Prior art keywords
adhesive sheet
adhesive
plate
layer
base material
Prior art date
Application number
TW108148058A
Other languages
English (en)
Chinese (zh)
Inventor
山下茂之
中村優智
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202014490A publication Critical patent/TW202014490A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
TW108148058A 2014-12-02 2015-12-01 黏接片以及加工物之製造方法 TW202014490A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-244009 2014-12-02
JP2014244009 2014-12-02

Publications (1)

Publication Number Publication Date
TW202014490A true TW202014490A (zh) 2020-04-16

Family

ID=56091621

Family Applications (3)

Application Number Title Priority Date Filing Date
TW104140062A TWI738633B (zh) 2014-12-02 2015-12-01 加工物之製造方法
TW110129890A TWI811763B (zh) 2014-12-02 2015-12-01 黏接片以及加工物之製造方法
TW108148058A TW202014490A (zh) 2014-12-02 2015-12-01 黏接片以及加工物之製造方法

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW104140062A TWI738633B (zh) 2014-12-02 2015-12-01 加工物之製造方法
TW110129890A TWI811763B (zh) 2014-12-02 2015-12-01 黏接片以及加工物之製造方法

Country Status (6)

Country Link
JP (1) JP6731852B2 (fr)
KR (1) KR102447759B1 (fr)
CN (1) CN106795396B (fr)
SG (1) SG11201704347YA (fr)
TW (3) TWI738633B (fr)
WO (1) WO2016088677A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102430472B1 (ko) * 2014-12-25 2022-08-05 덴카 주식회사 레이저 다이싱용 점착 시트 및 반도체 장치의 제조 방법
JP6980684B2 (ja) * 2016-11-02 2021-12-15 リンテック株式会社 ダイシングシート
CN110753993B (zh) * 2017-07-03 2023-12-01 琳得科株式会社 隐形切割用粘着片及半导体装置的制造方法
JP7109918B2 (ja) * 2017-12-28 2022-08-01 日東電工株式会社 ダイシングテープ一体型半導体背面密着フィルム
JP7296944B2 (ja) * 2018-03-29 2023-06-23 リンテック株式会社 ワーク加工用シート
CN111989764A (zh) * 2018-04-18 2020-11-24 琳得科株式会社 工件加工用片
JPWO2020195744A1 (fr) * 2019-03-27 2020-10-01
KR102426261B1 (ko) * 2019-09-26 2022-07-29 주식회사 엘지화학 다이싱 테이프용 점착조성물 및 이를 포함하는 다이싱 테이프
CN111693368A (zh) * 2020-06-15 2020-09-22 苏州高泰电子技术股份有限公司 用于晶圆切割胶带微观表征性能的测试方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5124778B2 (fr) 1971-12-22 1976-07-27
JP2005229040A (ja) 2004-02-16 2005-08-25 Denki Kagaku Kogyo Kk 半導体基盤固定用粘着シート
JP4712468B2 (ja) * 2004-11-30 2011-06-29 古河電気工業株式会社 ダイシングダイボンドテープ
JP4762671B2 (ja) * 2005-10-26 2011-08-31 古河電気工業株式会社 ダイシングテープ、および半導体ウェハダイシング方法
JP5019619B2 (ja) * 2008-03-27 2012-09-05 古河電気工業株式会社 ウェハ表面保護テープ
JP5124778B2 (ja) * 2008-09-18 2013-01-23 リンテック株式会社 レーザーダイシングシートおよび半導体チップの製造方法
JP2011040449A (ja) * 2009-08-07 2011-02-24 Du Pont Mitsui Polychem Co Ltd ダイシングテープ用基材、ダイシングテープ、半導体装置の製造方法
JP5603757B2 (ja) * 2009-12-04 2014-10-08 リンテック株式会社 レーザーダイシング用粘着シート及び半導体装置の製造方法
JP2012079936A (ja) * 2010-10-01 2012-04-19 Nitto Denko Corp ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
CN103238205B (zh) * 2010-12-06 2016-05-18 木本股份有限公司 激光切割用辅助片
JP6071712B2 (ja) * 2013-04-05 2017-02-01 日東電工株式会社 粘着テープ

Also Published As

Publication number Publication date
JP6731852B2 (ja) 2020-07-29
KR102447759B1 (ko) 2022-09-27
KR20170091578A (ko) 2017-08-09
WO2016088677A1 (fr) 2016-06-09
TWI811763B (zh) 2023-08-11
TWI738633B (zh) 2021-09-11
CN106795396A (zh) 2017-05-31
CN106795396B (zh) 2020-12-18
JPWO2016088677A1 (ja) 2017-09-07
TW202144516A (zh) 2021-12-01
SG11201704347YA (en) 2017-06-29
TW201629171A (zh) 2016-08-16

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