TW202014490A - 黏接片以及加工物之製造方法 - Google Patents
黏接片以及加工物之製造方法 Download PDFInfo
- Publication number
- TW202014490A TW202014490A TW108148058A TW108148058A TW202014490A TW 202014490 A TW202014490 A TW 202014490A TW 108148058 A TW108148058 A TW 108148058A TW 108148058 A TW108148058 A TW 108148058A TW 202014490 A TW202014490 A TW 202014490A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive sheet
- adhesive
- plate
- layer
- base material
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laser Beam Processing (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-244009 | 2014-12-02 | ||
JP2014244009 | 2014-12-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202014490A true TW202014490A (zh) | 2020-04-16 |
Family
ID=56091621
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104140062A TWI738633B (zh) | 2014-12-02 | 2015-12-01 | 加工物之製造方法 |
TW110129890A TWI811763B (zh) | 2014-12-02 | 2015-12-01 | 黏接片以及加工物之製造方法 |
TW108148058A TW202014490A (zh) | 2014-12-02 | 2015-12-01 | 黏接片以及加工物之製造方法 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104140062A TWI738633B (zh) | 2014-12-02 | 2015-12-01 | 加工物之製造方法 |
TW110129890A TWI811763B (zh) | 2014-12-02 | 2015-12-01 | 黏接片以及加工物之製造方法 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6731852B2 (fr) |
KR (1) | KR102447759B1 (fr) |
CN (1) | CN106795396B (fr) |
SG (1) | SG11201704347YA (fr) |
TW (3) | TWI738633B (fr) |
WO (1) | WO2016088677A1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102430472B1 (ko) * | 2014-12-25 | 2022-08-05 | 덴카 주식회사 | 레이저 다이싱용 점착 시트 및 반도체 장치의 제조 방법 |
JP6980684B2 (ja) * | 2016-11-02 | 2021-12-15 | リンテック株式会社 | ダイシングシート |
CN110753993B (zh) * | 2017-07-03 | 2023-12-01 | 琳得科株式会社 | 隐形切割用粘着片及半导体装置的制造方法 |
JP7109918B2 (ja) * | 2017-12-28 | 2022-08-01 | 日東電工株式会社 | ダイシングテープ一体型半導体背面密着フィルム |
JP7296944B2 (ja) * | 2018-03-29 | 2023-06-23 | リンテック株式会社 | ワーク加工用シート |
CN111989764A (zh) * | 2018-04-18 | 2020-11-24 | 琳得科株式会社 | 工件加工用片 |
JPWO2020195744A1 (fr) * | 2019-03-27 | 2020-10-01 | ||
KR102426261B1 (ko) * | 2019-09-26 | 2022-07-29 | 주식회사 엘지화학 | 다이싱 테이프용 점착조성물 및 이를 포함하는 다이싱 테이프 |
CN111693368A (zh) * | 2020-06-15 | 2020-09-22 | 苏州高泰电子技术股份有限公司 | 用于晶圆切割胶带微观表征性能的测试方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5124778B2 (fr) | 1971-12-22 | 1976-07-27 | ||
JP2005229040A (ja) | 2004-02-16 | 2005-08-25 | Denki Kagaku Kogyo Kk | 半導体基盤固定用粘着シート |
JP4712468B2 (ja) * | 2004-11-30 | 2011-06-29 | 古河電気工業株式会社 | ダイシングダイボンドテープ |
JP4762671B2 (ja) * | 2005-10-26 | 2011-08-31 | 古河電気工業株式会社 | ダイシングテープ、および半導体ウェハダイシング方法 |
JP5019619B2 (ja) * | 2008-03-27 | 2012-09-05 | 古河電気工業株式会社 | ウェハ表面保護テープ |
JP5124778B2 (ja) * | 2008-09-18 | 2013-01-23 | リンテック株式会社 | レーザーダイシングシートおよび半導体チップの製造方法 |
JP2011040449A (ja) * | 2009-08-07 | 2011-02-24 | Du Pont Mitsui Polychem Co Ltd | ダイシングテープ用基材、ダイシングテープ、半導体装置の製造方法 |
JP5603757B2 (ja) * | 2009-12-04 | 2014-10-08 | リンテック株式会社 | レーザーダイシング用粘着シート及び半導体装置の製造方法 |
JP2012079936A (ja) * | 2010-10-01 | 2012-04-19 | Nitto Denko Corp | ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法 |
CN103238205B (zh) * | 2010-12-06 | 2016-05-18 | 木本股份有限公司 | 激光切割用辅助片 |
JP6071712B2 (ja) * | 2013-04-05 | 2017-02-01 | 日東電工株式会社 | 粘着テープ |
-
2015
- 2015-11-27 JP JP2016562422A patent/JP6731852B2/ja active Active
- 2015-11-27 WO PCT/JP2015/083414 patent/WO2016088677A1/fr active Application Filing
- 2015-11-27 SG SG11201704347YA patent/SG11201704347YA/en unknown
- 2015-11-27 KR KR1020177005685A patent/KR102447759B1/ko active IP Right Grant
- 2015-11-27 CN CN201580047960.6A patent/CN106795396B/zh active Active
- 2015-12-01 TW TW104140062A patent/TWI738633B/zh active
- 2015-12-01 TW TW110129890A patent/TWI811763B/zh active
- 2015-12-01 TW TW108148058A patent/TW202014490A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP6731852B2 (ja) | 2020-07-29 |
KR102447759B1 (ko) | 2022-09-27 |
KR20170091578A (ko) | 2017-08-09 |
WO2016088677A1 (fr) | 2016-06-09 |
TWI811763B (zh) | 2023-08-11 |
TWI738633B (zh) | 2021-09-11 |
CN106795396A (zh) | 2017-05-31 |
CN106795396B (zh) | 2020-12-18 |
JPWO2016088677A1 (ja) | 2017-09-07 |
TW202144516A (zh) | 2021-12-01 |
SG11201704347YA (en) | 2017-06-29 |
TW201629171A (zh) | 2016-08-16 |
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