JP7446887B2 - film adhesive - Google Patents

Description

The present invention relates to a film adhesive.

The semiconductor chip is usually die-bonded to the circuit-forming surface of the substrate using a film adhesive attached to the back surface of the semiconductor chip. Then, a semiconductor package is manufactured using the obtained product, and a target semiconductor device is finally manufactured using this semiconductor package.

A semiconductor chip having a film adhesive on its back surface is produced by, for example, dividing (cutting) a semiconductor wafer having a film adhesive on its back surface together with the film adhesive.

Various thermosetting die-bonding films have been disclosed as film adhesives depending on the purpose. For example, Patent Document 1 describes a thermosetting die bond film having a tensile elongation at break of less than 5%.

Patent No. 5353703

However, when dividing a semiconductor wafer using a thermosetting die-bonding film, poor cutting and die cracks may occur. Furthermore, when a semiconductor wafer is divided using the thermosetting die-bonding film described in Patent Document 1, burrs may occur.
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a film adhesive that can sufficiently suppress the occurrence of cutting defects, die cracks, and burrs when used as a thermosetting die-bonding film to divide semiconductor wafers.

The present invention includes the following aspects.
[1] A film adhesive, in which the film adhesive, double-sided tape, and hard support are laminated in this order on a test substrate made of polyolefin; The 180° peeling force between the test base material measured at a peeling speed of 300 mm/min and a temperature of 23° C. is 0.01 to 0.2 N/25 mm, and a plurality of sheets of the film adhesive The stress and strain curves of a laminate sample with a width of 15 mm, a length of 70 mm, and a thickness of 200 μm were measured at 25°C using a tensile tester under the conditions of a chuck distance of 30 mm and a pulling speed of 200 mm/min. The film adhesive has a breaking strength of 30 MPa or less and a breaking elongation of the film adhesive of 11% or more, calculated by the following formula using these measurement results. .
Breaking strength (Pa) = maximum strength (N) / cross-sectional area of sample (m ² )
Elongation at break (%) = (Length between chucks of sample at break (mm) - 30)/30/100
[2] The film adhesive according to [1], wherein the film adhesive does not substantially contain a polymer component having a weight average molecular weight of 100,000 or more.
[3] The film-like adhesive according to [1] or [2], wherein the film-like adhesive has a ring structure in its main chain and contains a thermoplastic resin having a glass transition temperature (Tg) of 140° C. or higher. agent.
[4] The film-like adhesive is attached to the back surfaces of a plurality of semiconductor chips, and the film-like adhesive is pushed up in a direction from the film-like adhesive toward the semiconductor chips. A semiconductor chip with a film-like adhesive, which is configured by cutting along the outer periphery of the semiconductor chip, and comprising the semiconductor chip and the film-like adhesive after cutting, which is provided on the back surface of the semiconductor chip. The film adhesive according to any one of [1] to [3], which is for producing.
[5] A support sheet, and a film adhesive provided on one surface of the support sheet, wherein the film adhesive is the film adhesive according to any one of [1] to [4]. A film-like adhesive composite sheet that is an adhesive.
[6] The film-like adhesive composite sheet according to [5], wherein the support sheet consists of only a base material.

According to the present invention, it is possible to provide a film adhesive that can sufficiently suppress the occurrence of cutting defects, die cracks, and burrs when used as a thermosetting die bonding film to divide semiconductor wafers.

FIG. 1 is a cross-sectional view schematically showing a film adhesive according to an embodiment of the present invention. 1 is a cross-sectional view schematically showing a film-like adhesive composite sheet according to an embodiment of the present invention. FIG. 3 is a cross-sectional view schematically showing a film-like adhesive composite sheet according to another embodiment of the present invention. FIG. 7 is a cross-sectional view schematically showing a film-like adhesive composite sheet according to still another embodiment of the present invention. FIG. 7 is a cross-sectional view schematically showing a film-like adhesive composite sheet according to still another embodiment of the present invention. Schematically shows an embodiment from cutting a film adhesive to separating a semiconductor chip from a support sheet in a method for manufacturing a semiconductor device using a film adhesive according to an embodiment of the present invention. FIG.

<<Film adhesive>>
The film adhesive according to the present invention is obtained by laminating the film adhesive, double-sided tape, and hard support in this order on a test substrate made of polyolefin, and the film adhesive and the test base material made of polyolefin. The 180° peeling force measured at a peeling speed of 300 mm/min and a temperature of 23° C. between the plurality of sheets of the film adhesive is 0.01 to 0.2 N/25 mm. The stress and strain curves of a laminate sample with a width of 15 mm, a length of 70 mm, and a thickness of 200 μm were measured at 25°C using a tensile tester under the conditions of a chuck distance of 30 mm and a tensile speed of 200 mm/min. The breaking strength of the film adhesive calculated by the following formula using these measurement results is 30 MPa or less, and the breaking elongation of the film adhesive is 11% or more.

The film adhesive preferably has curability, thermosetting properties, and pressure-sensitive adhesive properties. A film adhesive having both thermosetting and pressure-sensitive adhesive properties can be attached to various adherends by lightly pressing it in an uncured state. Further, the film adhesive may be one that can be applied to various adherends by being heated and softened. When the film adhesive is cured, it ultimately becomes a cured product with high impact resistance, and this cured product can maintain sufficient adhesive properties even under severe high temperature and high humidity conditions.

In this specification, when the film adhesive has curability, "film adhesive" means "film adhesive before curing", and "film adhesive after curing" means "film adhesive after curing". It is called "cured product of film adhesive" to distinguish whether it is cured or not.

(Peeling force)
The 180° peeling force between the film adhesive and the base material made of polyolefin is measured as follows.
First, an adhesive composition is applied onto a release film, dried, and a test base made of polyolefin is laminated to the exposed surface of the adhesive. A film laminate is obtained.
Next, the release film is peeled off from the laminate, and the laminate is bonded so that the surface of the film adhesive and the surface of the double-sided tape attached to the surface of the hard support are in contact with each other.
Next, the test base material is peeled from the hard support/double-sided tape/film adhesive/test base material at a peel rate of 300 mm/min in an environment of 23°C. Peeling at this time involves peeling the film adhesive in the length direction so that the surfaces of the test base material and the film adhesive that were in contact with each other form an angle of 180°. ° Peel off. Then, the load (peel force) during this 180° peeling is measured, and the measured value is defined as the peel force (N/25 mm).

The 180° peeling force between the film adhesive and the base material made of polyolefin is preferably 0.01 to 0.2 N/25 mm, and preferably 0.01 to 0.15 N/25 mm. is more preferable, and particularly preferably 0.02 to 0.1 N/25 mm. When this peeling force is equal to or higher than the lower limit value, it is possible to avoid the problem that the film adhesive peels off from the base material during actual use. Moreover, by being below the upper limit value, as will be described in detail later, the base material can be peeled off from the silicon chip to which the film-like adhesive composite sheet is attached, and the silicon chip with the film-like adhesive can be easily divided. It is possible to prevent die cracks.

(breaking strength, breaking elongation)
The elongation at break of a film adhesive can be measured by the method shown below.
First, a plurality of film-like adhesives are laminated to obtain a sample with a thickness of 200 μm. The thickness of one film-like adhesive is not particularly limited, and may be 5 to 50 μm. The number of film-like adhesive sheets to be laminated is not particularly limited, and may be 4 to 40 sheets.
Next, the laminated film adhesive is cut to obtain a sample having a width of 15 mm, a length of 70 mm, and a thickness of 200 μm.
Next, stress and strain curves are measured using a tensile tester in an environment of 25° C. under conditions of a distance between chucks of 30 mm and a tensile speed of 200 mm/min.
Next, using the measurement results, the breaking strength and breaking elongation are calculated by the following formula.
Breaking strength (Pa) = maximum strength (N) / cross-sectional area of sample (m ² )
Elongation at break (%) = (Length between chucks of sample at break (mm) - 30)/30/100

The breaking strength is preferably 30 MPa or less, more preferably 10 MPa or less, particularly preferably 3 MPa or less. When the breaking strength is below the upper limit value, as will be described in detail later, it is possible to easily obtain a silicon chip with a film adhesive by cutting the film adhesive, and die cracks can be prevented. .

The elongation at break is preferably 11% or more, preferably 20% or more, and preferably 30% or more. When the elongation at break is equal to or greater than the lower limit, as will be described in detail later, it is possible to prevent burrs from forming on the film adhesive when cutting the film adhesive.

In this specification, the surface of a semiconductor chip and a semiconductor wafer on which a circuit is formed is referred to as a "circuit formation surface," and the surface opposite to this circuit formation surface is referred to as a "back surface." A structure including a semiconductor chip and a film adhesive provided on the back surface of the semiconductor chip is referred to as a "semiconductor chip with film adhesive."
The film-like adhesive-attached semiconductor chip provided with the film-like adhesive of this embodiment can be die-bonded to a substrate in good condition by the film-like adhesive.

The film-like adhesive-attached semiconductor chip produced using the film-like adhesive of this embodiment is bonded (die-bonded) to the circuit-forming surface of the substrate using the film-like adhesive therein. Furthermore, the film adhesive is finally cured.
Therefore, the cured film adhesive is required to have sufficient adhesive strength to the object to be bonded.

The film-like adhesive may be composed of one layer (single layer) or may be composed of two or more layers, and when it is composed of multiple layers, these multiple layers may be the same as each other. However, they may be different, and the combination of these multiple layers is not particularly limited.

Note that in this specification, "the multiple layers may be the same or different from each other" refers to "all the layers may be the same or all the layers may be the same or different", not only in the case of film adhesives. "The layers may be different, or only some of the layers may be the same." Furthermore, "the layers are different from each other" means "at least one of the constituent materials and thicknesses of each layer may be different from each other." It means "different".

The thickness of the film adhesive is not particularly limited, but is preferably 1 to 50 μm, more preferably 3 to 40 μm, and particularly preferably 5 to 30 μm. When the thickness of the film adhesive is equal to or greater than the lower limit, the adhesive force of the film adhesive to the adherend (semiconductor wafer, semiconductor chip) becomes higher. By setting the thickness of the film adhesive to be less than or equal to the above upper limit, the film adhesive can be cut more easily in the semiconductor chip manufacturing process described later, and cut pieces originating from the film adhesive can be cut. The amount can be further reduced.
Here, the "thickness of a film adhesive" means the thickness of the entire film adhesive. For example, the thickness of a film adhesive consisting of multiple layers refers to the total thickness of the film adhesive. means the total thickness of the layers.

The film adhesive is made using an adhesive composition containing constituent materials of the film adhesive, such as a polymer component (a), an epoxy resin (b1), and a thermosetting agent (b2), which will be described later. Can be formed. For example, by applying an adhesive composition to the surface on which the film adhesive is to be formed and drying it as necessary, the film adhesive can be formed at the target site.
The content ratio of components that do not vaporize at room temperature in the adhesive composition is usually the same as the content ratio of the components in the film adhesive. In this specification, "normal temperature" means a temperature that is not particularly cooled or heated, that is, a normal temperature, and includes, for example, a temperature of 15 to 25°C.

The adhesive composition may be applied by a known method, such as an air knife coater, blade coater, bar coater, gravure coater, roll coater, roll knife coater, curtain coater, die coater, knife coater, or screen coater. , a method using various coaters such as a Meyer bar coater and a kiss coater.

The drying conditions for the adhesive composition are not particularly limited, but when the adhesive composition contains a solvent described below, it is preferable to dry the adhesive composition by heating. The adhesive composition containing a solvent is preferably dried at, for example, 70 to 130° C. for 10 seconds to 5 minutes.
Hereinafter, the components contained in the film adhesive and the adhesive composition will be explained in detail.

It is preferable that the film adhesive of this embodiment does not substantially contain a polymer component having a weight average molecular weight of 100,000 or more. In other words, in the film adhesive of the present embodiment, the content of the polymer component having a weight average molecular weight of 100,000 or more is preferably 1% by mass or less based on 100% by mass of the film adhesive.

The film adhesive of this embodiment preferably includes a resin having a ring structure in the main chain and having a glass transition temperature (Tg) of 140°C or higher, and the glass transition temperature is 150°C or higher. is more preferable, and even more preferably 160°C or higher. When the film adhesive contains such a resin, it can have good pick-up suitability.
It is preferable that the film adhesive contains such a resin as a polymer component (a) described below.

<Polymer component (a)>
The polymer component (a) is preferably a resin having a ring structure in its main chain and having a glass transition temperature (Tg) of 140° C. or higher.

The polymer component (a) may be a polymer component or an oligomer component that can be considered to be formed by a polymerization reaction of a polymerizable compound. The polymer component (a) imparts film-forming properties, flexibility, etc. to the film adhesive, and also improves adhesion (applicability) to objects to be bonded such as semiconductor chips. The polymer component (a) has thermoplasticity and does not have thermosetting property. Moreover, the polymer component (a) is also a component that does not correspond to the epoxy resin (b1) and thermosetting agent (b2) described below.

The polymer component (a) may also correspond to the thermosetting component (b). In the present invention, when the adhesive composition contains components corresponding to both the polymer component (a) and the thermosetting component (b), the adhesive composition contains the polymer component (a). ) and thermosetting component (b).

The glass transition temperature (Tg) of the polymer component (a) is preferably 140°C or higher, more preferably 150°C or higher, and even more preferably 160°C or higher.
When the glass transition temperature (Tg) of the polymer component (a) is equal to or higher than the lower limit, it is possible to reduce the 180° peeling force between the film adhesive and the base material, improving pickup suitability. can be made good.

When the polymer component (a) has two or more types of structural units, the glass transition temperature (Tg) of the polymer component (a) can be calculated using the Fox formula. As the Tg of the monomer used at this time to induce the structural unit, the value described in the Polymer Data Handbook or the Adhesive Handbook can be used.

When the polymer component (a) has a ring structure in the main chain, the glass transition temperature (Tg) can be easily adjusted to 140° C. or higher. The ring structure of the main chain may be an aromatic ring, an aliphatic ring, a hydrocarbon ring, or a heterocycle.

By using a thermoplastic resin as the polymer component (a), it becomes easier to separate a semiconductor chip with a film adhesive from a support sheet (described later) during pick-up, and the film can be easily removed from the uneven surface of an adherend. The shaped adhesive becomes easier to follow, and the occurrence of voids etc. between the adherend and the film adhesive may be further suppressed.

The weight average molecular weight of the polymer component (a) is preferably 1,000 or more and less than 100,000, more preferably 2,000 to 80,000. The number average molecular weight of the polymer component (a) is preferably from 500 to 50,000, more preferably from 1,000 to 40,000.
When the weight average molecular weight of the polymer component (a) is at least the above-mentioned lower limit, the elongation at break and the break strength of the film adhesive can be increased, and when it is at most the above-mentioned upper limit, the elongation at break can be increased. and the breaking strength can be reduced.

The adhesive composition and the film adhesive may contain only one type of polymer component (a), or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. .

In the film adhesive of the present embodiment, the content of the polymer component (a) is preferably 5 to 20% by mass, and preferably 6 to 18% by mass, based on 100% by mass of the film adhesive. It is more preferable that the amount is 7 to 15% by mass. When the content of the polymer component (a) is equal to or higher than the lower limit value, the structure of the film adhesive becomes more stable, and the above effect becomes easier to achieve. By being below the upper limit, the adhesiveness as a film adhesive becomes good.

As the polymer component (a), for example, known engineering plastics such as polyarylate, polycarbonate, polyphenylene ether, polyphenylene sulfide, thermoplastic polyimide, and polyether ether ketone can be used. Among these, polyarylate and polycarbonate are preferred.

- Polyarylate Polyarylate is an aromatic polyester polymer consisting of an aromatic dicarboxylic acid and/or its derivative, and a dihydric phenol and/or its derivative. There are no particular restrictions on the polyarylate raw material for introducing aromatic dicarboxylic acid residues, but examples include terephthalic acid, isophthalic acid, phthalic acid, chlorophthalic acid, nitrophthalic acid, 2,5-naphthalenedicarboxylic acid, 2, 6-naphthalene dicarboxylic acid, 2,7-naphthalene dicarboxylic acid, 1,5-naphthalene dicarboxylic acid, methyl terephthalic acid, 4,4'-biphenyl dicarboxylic acid, 2,2'-biphenyl dicarboxylic acid, 4,4'-diphenyl ether Dicarboxylic acid, 4,4'-diphenylmethanedicarboxylic acid, 4,4'-diphenylsulfonedicarboxylic acid, 4,4'-diphenylisopropylidenedicarboxylic acid, 1,2-bis(4-carboxyphenoxy)ethane, 5-sodium sulfonate Examples include isophthalic acid. Among them, terephthalic acid and isophthalic acid are preferred. These aromatic dicarboxylic acids can be used alone or in combination of two or more types.

The polyarylate raw material for introducing dihydric phenol residues is not particularly limited, but examples include 1,1-bis(4-hydroxyphenyl)methane, 1,1-bis(4-hydroxyphenyl)ethane, 1,1-bis(4-methyl-2-hydroxyphenyl)methane, 1,1-bis(3,5-dimethyl-4-hydroxyphenyl)methane, 1,1-bis(4-hydroxyphenyl)cyclohexane, 2 , 2-bis(4-hydroxyphenyl)-4-methylpentane, 2,2-bis(4-hydroxyphenyl)propane (=BisA), 2,2-bis(3-methyl-4-hydroxyphenyl)propane, 2,2-bis(3,5-dimethyl-4-hydroxyphenyl)propane, 1,1-bis(4-hydroxyphenyl)-1-phenylethane, 1,1-bis(4-hydroxyphenyl)-2- Examples include ethylhexane, 2,2-bis(3-phenyl-4-hydroxyphenyl)propane, 1,1-bis(3-methyl-4-hydroxyphenyl)methane, 4,4'-biphenol, and hydroquinone. These dihydric phenols can be used alone or in combination of two or more types.

- Polycarbonate Polycarbonate is synthesized by a method in which a dihydric phenol component is reacted with a carbonate precursor such as phosgene or diester carbonate. The dihydric phenol component is the same as that listed as the polyarylate raw material.

[Thermosetting component (b)]
The thermosetting component (b) has thermosetting properties and is a component for thermosetting the film adhesive.
The thermosetting component (b) consists of an epoxy resin (b1) and a thermosetting agent (b2).
The thermosetting component (b) contained in the adhesive composition and the film adhesive may be one type or two or more types, and when there are two or more types, the combination and ratio thereof can be selected arbitrarily. can.

<Epoxy resin (b1)>
Examples of the epoxy resin (b1) include known ones, such as polyfunctional epoxy resins, biphenyl compounds, bisphenol A diglycidyl ether and hydrogenated products thereof, o-cresol novolac type epoxy resins, dicyclopentadiene type epoxy resins, etc. Difunctional or higher functional epoxy compounds such as resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, and phenylene skeleton type epoxy resin can be mentioned. In this specification, the epoxy resin (b1) refers to a curable, that is, uncured, epoxy resin.

The number average molecular weight of the epoxy resin (b1) is not particularly limited, but is preferably from 300 to 30,000 in terms of the curability of the film adhesive and the strength and heat resistance of the cured product of the film adhesive, It is more preferably 400 to 10,000, particularly preferably 500 to 3,000.
The epoxy equivalent of the epoxy resin (b1) is preferably 100 to 1000 g/eq, more preferably 150 to 800 g/eq.

The adhesive composition and the film adhesive may contain only one kind of epoxy resin (b1), or two or more kinds, and when they are two or more kinds, the combination and ratio thereof can be arbitrarily selected.

The content of the epoxy resin (b1) is preferably 20 to 70% by mass, more preferably 25 to 60% by mass, and 30 to 50% by mass with respect to 100% by mass of the film adhesive. It is particularly preferable that When the content of the epoxy resin (b1) is at least the lower limit, it is possible to increase the strength of the cured product, and when it is at most the upper limit, it is possible to increase the strength of the cured product. Stability can be increased.

<Thermosetting agent (b2)>
The thermosetting agent (b2) is a curing agent for the epoxy resin (b1). The combination of the epoxy resin (b1) and the thermosetting agent (b2) functions as an epoxy thermosetting resin (herein sometimes referred to as "epoxy thermosetting resin (b)").
The adhesive composition and the film adhesive may contain only one type of epoxy thermosetting resin (b), or two or more types, and in the case of two or more types, the combination and ratio thereof are arbitrary. can be selected.

Examples of the thermosetting agent (b2) include compounds having two or more functional groups capable of reacting with epoxy groups in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxy group, a group in which an acid group is anhydrified, and the like. It is preferably a group, and more preferably a phenolic hydroxyl group or an amino group.

Among the thermosetting agents (b2), examples of the phenolic curing agent having a phenolic hydroxyl group include polyfunctional phenol resins, biphenols, novolac type phenolic resins, dicyclopentadiene type phenolic resins, aralkyl type phenolic resins, etc. .
Among the thermosetting agents (b2), examples of amine-based curing agents having an amino group include dicyandiamide (DICY).

The thermosetting agent (b2) may have an unsaturated hydrocarbon group.
Examples of the thermosetting agent (b2) having an unsaturated hydrocarbon group include a compound in which a part of the hydroxyl group of a phenol resin is substituted with a group having an unsaturated hydrocarbon group; Examples include compounds formed by directly bonding groups having saturated hydrocarbon groups.
The unsaturated hydrocarbon group in the thermosetting agent (b2) is the same as the unsaturated hydrocarbon group in the above-mentioned epoxy resin having an unsaturated hydrocarbon group.

When using a phenolic curing agent as the thermosetting agent (b2), it is preferable to appropriately select the softening point and glass transition temperature in consideration of the bonding temperature when using the film adhesive.

Among the thermosetting agents (b2), the number average molecular weight of resin components such as polyfunctional phenolic resins, novolak phenolic resins, dicyclopentadiene phenolic resins, and aralkyl phenolic resins is preferably 300 to 30,000. , more preferably from 400 to 10,000, particularly preferably from 500 to 3,000.
Among the thermosetting agents (b2), the molecular weight of non-resin components such as biphenol and dicyandiamide is not particularly limited, but is preferably 60 to 500, for example.

The thermosetting agent (b2) is preferably an o-cresol type novolak resin represented by the following general formula (1).

In general formula (1), n is an integer of 1 or more.
In the general formula (1), n is an integer of 1 or more, and may be, for example, 2 or more, 4 or more, or 6 or more.
The upper limit of n is not particularly limited as long as it does not impair the effects of the present invention. For example, an o-cresol type novolac resin in which n is 10 or less is easier to manufacture or obtain.

In general formula (1), these o-cresol groups of methylene groups (-CH ₂ -) connecting o-cresol-diyl groups (-C ₆ H ₄ (-OH) (-CH ₃ )-) The bonding position to the -diyl group is not particularly limited.

As is clear from the general formula (1), the thermosetting agent (b2) is a carbon atom adjacent to the carbon atom to which the phenolic hydroxyl group is bonded in the phenol resin (the carbon forming the benzene ring skeleton). The phenolic hydroxyl group preferably has a structure in which a methyl group is bonded to the phenolic hydroxyl group, and has steric hindrance in the vicinity of the phenolic hydroxyl group. It is presumed that the thermosetting agent (b2) has such steric hindrance, thereby suppressing its reactivity during storage. By using such a thermosetting agent (b2), the components contained in the film adhesive, such as curable components, are inhibited from reacting during storage, thereby preventing changes in properties. is assumed to be suppressed. It is presumed that by using such a film adhesive and a semiconductor chip, a highly reliable semiconductor package can be obtained.
The film adhesive using the thermosetting agent (b2) represented by the general formula (1) has high storage stability and can be stored at room temperature. The composition also has high storage stability and can be stored at room temperature.

The adhesive composition and the film adhesive may contain only one type of thermosetting agent (b2), or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. .

The content of the thermosetting agent (b2) is preferably 15 to 50% by mass, more preferably 20 to 45% by mass, and 30 to 40% by mass based on 100% by mass of the film adhesive. % is particularly preferred. When the content of the thermosetting agent (b2) is equal to or higher than the lower limit value, the curing reaction of the film adhesive can be reliably progressed, the above effects can be easily achieved, and the content of the thermosetting agent (b2) When the content is below the upper limit, it can be stored more stably.

The content of the epoxy thermosetting resin (b) consisting of the epoxy resin (b1) and the thermosetting agent (b2) is 60 to 95% by mass with respect to 100% by mass of the film adhesive. The amount is preferably from 70 to 90% by weight, more preferably from 77 to 88% by weight. When the content of the epoxy thermosetting resin (b) is equal to or higher than the lower limit, it becomes easier to suppress poor cutting of the film adhesive, and the above effect is more likely to be achieved, and the thermosetting agent (b2) When the content is below the upper limit, stability during storage can be improved.

At the point where the above-mentioned effect becomes higher, the softening point of the thermosetting agent (b2) is, for example, 64°C or more and 130°C or less, 68°C or more and 130°C or less, 72°C or more and 130°C or less, and 76°C or more and 130°C. It may be any of the following: 60°C or more and 120°C or less, 60°C or more and 110°C or less, 60°C or more and 100°C or less, and 64°C or more and 90°C or less. The temperature may be any of 120°C or lower, 68°C or higher and 110°C or lower, 72°C or higher and 100°C or lower, and 76°C or higher and 90°C or lower.

In order to improve its various physical properties, the film adhesive may contain, in addition to the polymer component (a) and the epoxy thermosetting resin (b), other components that do not fall under these, if necessary. You may do so.
Other components contained in the film adhesive include, for example, a curing accelerator (c), a filler (d), a coupling agent (e), an energy ray curable resin (g), and a photopolymerization initiator ( h), general-purpose additives (i), and the like. Among these, preferable other components include a curing accelerator (c), a filler (d), and a coupling agent (e).

As used herein, the term "energy ray" refers to electromagnetic waves or charged particle beams that have energy quanta, examples of which include ultraviolet rays, radiation, electron beams, and the like.
The ultraviolet rays can be irradiated using, for example, a high-pressure mercury lamp, fusion lamp, xenon lamp, black light, or LED lamp as an ultraviolet source. The electron beam can be generated by an electron beam accelerator or the like.
In this specification, "energy ray curable" means a property that hardens when irradiated with energy rays, and "non-energy ray curable" means a property that does not harden even when irradiated with energy rays. do.

<Curing accelerator (c)>
The curing accelerator (c) is a component for adjusting the curing speed of the adhesive composition and film adhesive.
Preferred curing accelerators (c) include, for example, tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; 2-methylimidazole, 2-phenylimidazole; , 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and other imidazoles (where one or more hydrogen atoms are other than hydrogen atoms) (imidazole substituted with a group of Examples include tetraphenylboron salts such as tetraphenylborate; and clathrate compounds containing the above-mentioned imidazoles as a guest compound.

The curing accelerator (c) contained in the adhesive composition and the film adhesive may be one type or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. .

When using a curing accelerator (c), the content of the curing accelerator (c) in the adhesive composition and film adhesive is the content of the epoxy thermosetting resin (b) (i.e., the epoxy resin ( The total content of b1) and thermosetting agent (b2) is preferably 0.01 to 5 parts by mass, more preferably 0.1 to 2 parts by mass, based on 100 parts by mass. When the content of the curing accelerator (c) is at least the lower limit, the effect of using the curing accelerator (c) can be more significantly obtained. By setting the content of the curing accelerator (c) below the above-mentioned upper limit, for example, the highly polar curing accelerator (c) will not interact with the adherend in the film adhesive under high temperature and high humidity conditions. The effect of suppressing migration to the adhesive interface side and segregation is enhanced, and the reliability of the semiconductor package obtained using the film adhesive is further improved.

<Filler (d)>
By containing the filler (d), the film adhesive can easily adjust its thermal expansion coefficient, and by optimizing this thermal expansion coefficient for the object to which the film adhesive is attached, the film adhesive can be easily adjusted. The reliability of the semiconductor package obtained using the adhesive is further improved. Moreover, when the film adhesive contains the filler (d), the moisture absorption rate of the cured product of the film adhesive can be reduced and the heat dissipation property can be improved.

The filler (d) may be either an organic filler or an inorganic filler, but is preferably an inorganic filler.
Preferred inorganic fillers include, for example, powders of silica, alumina, talc, calcium carbonate, titanium white, red iron, silicon carbide, boron nitride, etc.; beads formed by spheroidizing these inorganic fillers; surface modification of these inorganic fillers. products; single crystal fibers of these inorganic fillers; glass fibers and the like.
Among these, the inorganic filler is preferably silica, alumina, or a surface-modified product thereof.

The average particle diameter of the filler (d) is not particularly limited, but is preferably 10 to 300 nm, more preferably 20 to 150 nm, and even more preferably 30 to 100 nm. When the average particle diameter of the filler (d) is within such a range, the effects of using the filler (d) can be sufficiently obtained, and the storage stability of the film adhesive is further improved.
In this specification, the "average particle diameter" means the value of the particle diameter (D ₅₀ ) at an integrated value of 50% in a particle size distribution curve determined by a laser diffraction scattering method, unless otherwise specified. .

The adhesive composition and the film adhesive may contain only one type of filler (d), or two or more types, and when they are two or more types, the combination and ratio thereof can be arbitrarily selected.

When using the filler (d), in the adhesive composition, the ratio of the content of the filler (d) to the total content of all components other than the solvent (i.e., the ratio of the content of the filler (d) to the total content of all components other than the solvent) The content ratio of the filler (d) to the total mass is preferably 1 to 25% by mass, more preferably 3 to 20% by mass, particularly 5 to 15% by mass. preferable. When the content of the filler (d) is at least the lower limit, the elongation at break can be reduced. Moreover, since the content of the filler (d) is within such a range, the above-mentioned coefficient of thermal expansion can be more easily adjusted.

<Coupling agent (e)>
By containing the coupling agent (e), the film adhesive improves adhesiveness and adhesion to the adherend. Further, since the film adhesive contains the coupling agent (e), the cured product thereof has improved water resistance without impairing heat resistance. The coupling agent (e) has a functional group capable of reacting with an inorganic compound or an organic compound.

The coupling agent (e) is preferably a compound having a functional group capable of reacting with a functional group possessed by the polymer component (a), the epoxy thermosetting resin (b), etc., and is a silane coupling agent. It is more preferable.
Preferred examples of the silane coupling agent include 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxymethyldiethoxysilane, 2- (3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-(2-aminoethylamino)propyltrimethoxysilane, 3-(2-amino ethylamino)propylmethyldiethoxysilane, 3-(phenylamino)propyltrimethoxysilane, 3-anilinopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyl Examples include dimethoxysilane, bis(3-triethoxysilylpropyl)tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazolesilane, oligomer type or polymer type organosiloxane, etc. .

The adhesive composition and the film adhesive may contain only one type of coupling agent (e), or two or more types, and in the case of two or more types, the combination and ratio thereof can be arbitrarily selected. .

When using a coupling agent (e), the content of the coupling agent (e) in the adhesive composition and film adhesive is the total amount of the polymer component (a) and the epoxy thermosetting resin (b). The content is preferably 0.03 to 20 parts by weight, more preferably 0.05 to 10 parts by weight, and particularly preferably 0.1 to 5 parts by weight. When the content of the coupling agent (e) is at least the lower limit, the dispersibility of the filler (d) in the resin is improved, the adhesiveness of the film adhesive to the adherend is improved, etc. , the effect of using the coupling agent (e) is more noticeable. When the content of the coupling agent (e) is less than or equal to the upper limit, the generation of outgas is further suppressed.

<Energy ray curable resin (g)>
The adhesive composition and the film adhesive may contain an energy ray curable resin (g). Since the film adhesive contains the energy ray curable resin (g), its properties can be changed by irradiation with energy rays.

<General purpose additive (i)>
The general-purpose additive (i) may be a known one, can be arbitrarily selected depending on the purpose, and is not particularly limited. Preferred general-purpose additives (i) include, for example, plasticizers, antistatic agents, antioxidants, colorants (dyes, pigments), gettering agents, and the like.

The adhesive composition and the film adhesive may contain only one type of general-purpose additive (i), or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. .
The content of the general-purpose additive (i) in the adhesive composition and film adhesive is not particularly limited, and may be appropriately selected depending on the purpose.

<Solvent>
It is preferable that the adhesive composition further contains a solvent. An adhesive composition containing a solvent has good handling properties.
The solvent is not particularly limited, but preferable examples include hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutyl alcohol (2-methylpropan-1-ol), and 1-butanol. ; esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; and amides (compounds having an amide bond) such as dimethylformamide and N-methylpyrrolidone.
The number of solvents contained in the adhesive composition may be one, or two or more, and when there are two or more, the combination and ratio thereof can be arbitrarily selected.

The solvent contained in the adhesive composition is preferably toluene, methyl ethyl ketone, etc., since the components contained in the adhesive composition can be mixed more uniformly.

<Method for manufacturing adhesive composition>
The adhesive composition is obtained by blending the constituent components.
The order in which each component is added when blending is not particularly limited, and two or more components may be added at the same time.
When using a solvent, it may be used by mixing the solvent with any component other than the solvent and diluting this component in advance, or by diluting any component other than the solvent in advance. The solvent may be used by mixing it with these ingredients without keeping it in place.

The method of mixing each component at the time of compounding is not particularly limited, and may be any known method such as mixing by rotating a stirrer or stirring blade; mixing by using a mixer; or mixing by applying ultrasonic waves. You can select it as appropriate.
The temperature and time during addition and mixing of each component are not particularly limited as long as each component does not deteriorate, and may be adjusted as appropriate, but the temperature is preferably 15 to 30°C.

FIG. 1 is a cross-sectional view schematically showing a film adhesive according to an embodiment of the present invention. Note that the figures used in the following explanation may show important parts enlarged for convenience in order to make it easier to understand the features of the present invention, and the dimensional ratio of each component may be the same as the actual one. Not necessarily.

The film adhesive 13 shown here includes a first release film 151 on one surface (sometimes referred to as "first surface" in this specification) 13a, and the first surface 13a is different from the first surface 13a. A second release film 152 is provided on the other surface (sometimes referred to as "second surface" in this specification) 13b on the opposite side.
Such a film adhesive 13 is suitable for storage as a roll, for example.

The film adhesive 13 has the above-mentioned characteristics.
The film adhesive 13 can be formed using the above adhesive composition.

Both the first release film 151 and the second release film 152 may be known ones.
The first release film 151 and the second release film 152 may be the same or different from each other, such as having different peeling forces when peeled from the film adhesive 13. Good too.

In the film adhesive 13 shown in FIG. 1, either the first release film 151 or the second release film 152 is removed, and the resulting exposed surface becomes the attachment surface of the back surface of a semiconductor wafer (not shown). Then, the other of the first release film 151 and the second release film 152 is removed, and the resulting exposed surface becomes a surface to which a support sheet or dicing sheet, which will be described later, is attached.

◇Film-like adhesive composite sheet A film-like adhesive composite sheet according to one embodiment of the present invention includes a support sheet, and the film-like adhesive is provided on one surface of the support sheet.

<<Support sheet>>
The support sheet may be composed of one layer (single layer) or may be composed of two or more layers. When the support sheet consists of multiple layers, the constituent materials and thicknesses of these multiple layers may be the same or different from each other, and the combination of these multiple layers is not particularly limited as long as the effects of the present invention are not impaired.

Preferred support sheets include, for example, those consisting only of a base material; those comprising a base material and an adhesive layer provided on one surface of the base material; and the like.
When the support sheet includes the base material and the adhesive layer, in the film adhesive composite sheet, the adhesive layer is disposed between the base material and the film adhesive. .

The support sheet made of only the base material is suitable as a carrier sheet or a dicing sheet. A film-like adhesive composite sheet equipped with a support sheet consisting only of such a base material is produced by using a film-like adhesive on the side of the film-like adhesive opposite to the side provided with the support sheet (i.e., the base material) (in this specification). (sometimes referred to as the "first surface") is used by being attached to the back surface of a semiconductor wafer.

On the other hand, the support sheet provided with a base material and an adhesive layer is suitable as a dicing sheet. In a film-like adhesive composite sheet equipped with such a support sheet, the surface (first surface) of the film-form adhesive opposite to the side provided with the support sheet is attached to the back surface of the semiconductor wafer. ,used.

The method of using the film-like adhesive composite sheet will be explained in detail later.
Each layer constituting the support sheet will be explained below.

<Base material>
The base material is in the form of a sheet or a film, and its constituent materials include, for example, various resins.
Examples of the resin include polyethylene such as low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), and high-density polyethylene (HDPE); polyethylene other than polyethylene such as polypropylene, polybutene, polybutadiene, polymethylpentene, and norbornene resin. Polyolefin: Ethylene copolymers such as ethylene-vinyl acetate copolymer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester copolymer, and ethylene-norbornene copolymer (ethylene as a monomer) polyvinyl chloride, vinyl chloride resins such as vinyl chloride copolymers (resins obtained using vinyl chloride as a monomer); polystyrene; polycycloolefin; polyethylene terephthalate, polyethylene Polyesters such as naphthalate, polybutylene terephthalate, polyethylene isophthalate, polyethylene-2,6-naphthalene dicarboxylate, and fully aromatic polyesters in which all constituent units have aromatic cyclic groups; combinations of two or more of the above polyesters. Polymer; poly(meth)acrylic ester; polyurethane; polyurethane acrylate; polyimide; polyamide; polycarbonate; fluororesin; polyacetal; modified polyphenylene oxide; polyphenylene sulfide; polysulfone; polyether ketone.
Examples of the resin include polymer alloys such as mixtures of the polyester and other resins. The polymer alloy of the polyester and other resin preferably has a relatively small amount of resin other than the polyester.
In addition, examples of the resin include, for example, a crosslinked resin obtained by crosslinking one or more of the resins exemplified above; modified ionomers using one or more of the resins exemplified above; Also mentioned are resins.

The number of resins constituting the base material may be one type, or two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

The base material may be composed of one layer (single layer) or may be composed of two or more layers, and when composed of multiple layers, these multiple layers may be the same or different from each other. The combination of these multiple layers is not particularly limited.

The thickness of the base material is preferably 50 to 300 μm, more preferably 60 to 150 μm. When the thickness of the base material is within this range, the flexibility of the film-like adhesive composite sheet and the adhesion to a semiconductor wafer or semiconductor chip are further improved.
Here, the "thickness of the base material" means the thickness of the entire base material. For example, the thickness of a base material consisting of multiple layers refers to the total thickness of all the layers that make up the base material. means.

The base material is preferably one with high accuracy in thickness, that is, one in which variation in thickness is suppressed regardless of the location. Among the above-mentioned constituent materials, materials that can be used to construct the base material with such high precision in thickness include, for example, polyethylene, polyolefins other than polyethylene, polyethylene terephthalate, ethylene-vinyl acetate copolymer, etc. can be mentioned.

In addition to the main constituent materials such as the resin, the base material contains various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, and softeners (plasticizers). It's okay.

The base material may be transparent or opaque, may be colored depending on the purpose, or may have other layers deposited on it.

In order to improve the adhesion with other layers such as the adhesive layer provided on the base material, the base material is subjected to roughening treatment such as sandblasting treatment, solvent treatment, corona discharge treatment, electron beam irradiation treatment, and plasma treatment. The surface may be subjected to oxidation treatment such as ozone/ultraviolet irradiation treatment, flame treatment, chromic acid treatment, hot air treatment, etc.
Further, the surface of the base material may be subjected to primer treatment.
The base material also has an antistatic coating layer; this prevents the base material from adhering to other sheets or from adhering to the suction table when the film-like adhesive composite sheets are stacked and stored. It may have layers or the like.

The base material can be manufactured by a known method. For example, a base material containing a resin can be manufactured by molding a resin composition containing the resin.

<Adhesive layer>
The adhesive layer is in the form of a sheet or film and contains an adhesive.
Examples of the adhesive include adhesive resins such as acrylic resin, urethane resin, rubber resin, silicone resin, epoxy resin, polyvinyl ether, polycarbonate, and ester resin.

In this specification, the term "adhesive resin" includes both resins that have adhesive properties and resins that have adhesive properties. For example, the above-mentioned adhesive resins include not only resins that are adhesive themselves, but also resins that exhibit adhesiveness when used in combination with other components such as additives, and resins that exhibit adhesiveness due to the presence of triggers such as heat or water. It also includes resins that show.

The adhesive layer may be composed of one layer (single layer) or may be composed of two or more layers, and when composed of multiple layers, these multiple layers may be the same or different from each other. The combination of these multiple layers is not particularly limited.

The thickness of the adhesive layer is not particularly limited, but is preferably 1 to 100 μm, more preferably 1 to 60 μm, and particularly preferably 1 to 30 μm.
Here, the "thickness of the adhesive layer" means the thickness of the entire adhesive layer. For example, the thickness of an adhesive layer consisting of multiple layers is the total thickness of all the layers that make up the adhesive layer. means the thickness of

The adhesive layer may be formed using an energy ray curable adhesive or may be formed using a non-energy ray curable adhesive. That is, the adhesive layer may be either energy ray curable or non-energy ray curable. The physical properties of the energy ray-curable adhesive layer can be easily adjusted before and after curing.

The adhesive layer can be formed using an adhesive composition containing an adhesive. For example, a pressure-sensitive adhesive layer can be formed on a target site by applying a pressure-sensitive adhesive composition to a surface on which a pressure-sensitive adhesive layer is to be formed, and drying the composition as necessary. The content ratio of components that do not vaporize at room temperature in the adhesive composition is usually the same as the content ratio of the components in the adhesive layer.

The adhesive composition can be applied in the same manner as the adhesive composition described above.

When the adhesive layer is energy ray curable, the energy ray curable adhesive composition may be, for example, non-energy ray curable adhesive resin (I-1a) (hereinafter referred to as "adhesive resin (I-1a)"). 1a)") and an energy ray-curable compound; an unsaturated group is introduced into the side chain of the adhesive resin (I-1a). An adhesive composition (I-2) containing an energy ray-curable adhesive resin (I-2a) (hereinafter sometimes abbreviated as "adhesive resin (I-2a)"); Examples include a pressure-sensitive adhesive composition (I-3) containing a curable resin (I-2a) and an energy ray-curable compound.

When the adhesive layer is non-energy ray-curable, examples of the non-energy ray-curable adhesive composition include the adhesive composition (I-4) containing the adhesive resin (I-1a), etc. can be mentioned.

Adhesive compositions such as Adhesive Compositions (I-1) to (I-4) can be produced in the same manner as the above-mentioned adhesive compositions, except that the ingredients are different.

Next, examples of the film-like adhesive composite sheet of the present embodiment will be described for each type of support sheet with reference to the drawings.

FIG. 2 is a cross-sectional view schematically showing a film-like adhesive composite sheet according to an embodiment of the present invention.
In the figures after FIG. 2, the same components as those shown in the already explained figures are given the same reference numerals as in the already explained figures, and detailed explanation thereof will be omitted.

A film-like adhesive composite sheet 101 shown here includes a support sheet 10, and a film-like adhesive is disposed on one surface (herein sometimes referred to as "first surface") 10a of the support sheet 10. It is equipped with 13. The support sheet 10 consists only of the base material 11, and the film-like adhesive composite sheet 101 is composed of one surface (herein sometimes referred to as "first surface") 11a of the base material 11. It has a structure in which a film adhesive 13 is laminated thereon. Further, the film-like adhesive composite sheet 101 further includes a release film 15 on the film-like adhesive 13.

In the film-like adhesive composite sheet 101, the film-like adhesive 13 is laminated on the first surface 11a of the base material 11, and the surface of the film-like adhesive 13 opposite to the side on which the base material 11 is provided ( In this specification, the jig adhesive layer 16 is laminated on a part of the 13a (sometimes referred to as the "first surface"), that is, a region near the peripheral edge, and the first surface of the film adhesive 13 A release film is provided on the surface of the jig adhesive layer 16 on which the jig adhesive layer 16 is not laminated, and on the surface 16a (top surface and side surfaces) of the jig adhesive layer 16 that is not in contact with the film adhesive 13. 15 are stacked.
Here, the first surface 11a of the base material 11 is also referred to as the first surface 10a of the support sheet 10.

The release film 15 is similar to the first release film 151 or the second release film 152 shown in FIG.

The jig adhesive layer 16 may have, for example, a single layer structure containing an adhesive component, or a multilayer structure in which layers containing an adhesive component are laminated on both sides of a sheet serving as a core material. There may be.

The film-like adhesive composite sheet 101 has the back side of a semiconductor wafer (not shown) attached to the first surface 13a of the film-like adhesive 13 with the release film 15 removed, and a jig adhesive The upper surface of the surface 16a of the layer 16 is used by being attached to a jig such as a ring frame.

FIG. 3 is a cross-sectional view schematically showing a film-like adhesive composite sheet according to another embodiment of the present invention.
The film-like adhesive composite sheet 102 shown here is the same as the film-like adhesive composite sheet 101 shown in FIG. 2, except that it does not include the jig adhesive layer 16. That is, in the film adhesive composite sheet 102, the film adhesive 13 is laminated on the first surface 11a of the base material 11 (the first surface 10a of the support sheet 10), and the first surface 13a of the film adhesive 13 A release film 15 is laminated on the entire surface.
In other words, the film-like adhesive composite sheet 102 is constructed by laminating the base material 11, the film-like adhesive 13, and the release film 15 in this order in their thickness direction.

The film adhesive composite sheet 102 shown in FIG. The back side of a semiconductor wafer (not shown) is attached to a part of the center area, and further, the area near the peripheral edge of the film adhesive 13 is attached to a jig such as a ring frame. used.

FIG. 4 is a cross-sectional view schematically showing a film-like adhesive composite sheet according to still another embodiment of the present invention.
The film-like adhesive composite sheet 103 shown here is the same as the film-like adhesive shown in FIG. 2 except that it further includes an adhesive layer 12 between the base material 11 and the film-like adhesive 13. This is the same as the composite sheet 101. The support sheet 10 is a laminate of a base material 11 and an adhesive layer 12, and the film adhesive composite sheet 103 also has a structure in which a film adhesive 13 is laminated on the first surface 10a of the support sheet 10. .

In the film-like adhesive composite sheet 103, the adhesive layer 12 is laminated on the first surface 11a of the base material 11, and the surface of the adhesive layer 12 on the opposite side to the base material 11 side (in this specification, A film adhesive 13 is laminated on the entire surface of the film adhesive 13 (sometimes referred to as the "first surface") 12a, and a part of the first surface 13a of the film adhesive 13, that is, a region near the peripheral edge, is Of the first surface 13a of the film adhesive 13, the surface on which the jig adhesive layer 16 is not laminated, and of the jig adhesive layer 16, the film adhesive layer 16 is laminated. A release film 15 is laminated on the surface 16a (top surface and side surface) that is not in contact with the agent 13.

In the film-like adhesive composite sheet 103 shown in FIG. 4, the back surface of a semiconductor wafer (not shown) is attached to the first surface 13a of the film-like adhesive 13 with the release film 15 removed. The upper surface of the surface 16a of the tool adhesive layer 16 is used by being attached to a jig such as a ring frame.

FIG. 5 is a cross-sectional view schematically showing a film-like adhesive composite sheet according to still another embodiment of the present invention.
The film-like adhesive composite sheet 104 shown here is different from the film-like adhesive composite sheet 103 shown in FIG. 4 except that it does not include the jig adhesive layer 16 and the shape of the film-like adhesive is different. It's the same. That is, the film-like adhesive composite sheet 104 includes a base material 11 , a pressure-sensitive adhesive layer 12 on the base material 11 , and a film-like adhesive 23 on the pressure-sensitive adhesive layer 12 . The support sheet 10 is a laminate of a base material 11 and an adhesive layer 12, and the film adhesive composite sheet 104 also has a structure in which a film adhesive 23 is laminated on the first surface 10a of the support sheet 10. .

In the film-like adhesive composite sheet 104, the adhesive layer 12 is laminated on the first surface 11a of the base material 11, and the film-like adhesive layer 12 is laminated on a part of the first surface 12a of the adhesive layer 12, that is, in the central region. Adhesive 23 is laminated. Then, of the first surface 12a of the adhesive layer 12, a region on which the film adhesive 23 is not laminated, and a surface 23a (top surface and side surface) of the film adhesive 23 that is not in contact with the adhesive layer 12. ), a release film 15 is laminated thereon.

When the film-like adhesive composite sheet 104 is viewed from above on the release film 15 side in plan view, the film-like adhesive 23 has a smaller surface area than the adhesive layer 12, and has a shape such as a circular shape, for example. .

In the film-like adhesive composite sheet 104 shown in FIG. 5, with the release film 15 removed, the back surface of a semiconductor wafer (not shown) is attached to the upper surface 23a of the film-like adhesive 23, and further, The region of the first surface 12a of the adhesive layer 12 on which the film adhesive 23 is not laminated is used by being attached to a jig such as a ring frame.

In addition, in the film-like adhesive composite sheet 104 shown in FIG. 5, the film-like adhesive composite sheet 104 shown in FIGS. Similarly, a jig adhesive layer may be laminated (not shown). The film-like adhesive composite sheet 104 having such a jig adhesive layer is similar to the case of the film-like adhesive composite sheet shown in FIGS. 2 and 4, in which the surface of the jig adhesive layer is The upper surface is attached to a jig such as a ring frame and used.

In this way, the film-like adhesive composite sheet may be provided with a jig adhesive layer, regardless of the form of the support sheet and the film-like adhesive. However, as shown in FIGS. 2 and 4, the film-like adhesive composite sheet with a jig adhesive layer is usually one that has a jig adhesive layer on a film-like adhesive. preferable.

The film-like adhesive composite sheet of this embodiment is not limited to that shown in FIGS. 2 to 5, and some of the configurations of those shown in FIGS. 2 to 5 may be changed within a range that does not impair the effects of the present invention. Alternatively, it may be deleted, or other configurations may be added to those described above.

For example, in the film-like adhesive composite sheets shown in FIGS. 2 to 5, layers other than the base material, the adhesive layer, the film-like adhesive, and the release film may be provided at arbitrary locations.
Further, in the film-like adhesive composite sheet, a gap may be partially formed between the release film and the layer that is in direct contact with the release film.
Further, in the film-like adhesive composite sheet, the size and shape of each layer can be arbitrarily adjusted depending on the purpose.

◇How to use film adhesive and film adhesive composite sheet (method for manufacturing semiconductor devices)
The film adhesive and the film adhesive composite sheet of this embodiment can be used to manufacture a semiconductor package and a semiconductor device after manufacturing a semiconductor chip with a film adhesive.

After the film adhesive without a support sheet is applied to the back side of the semiconductor wafer, for example, the release film is removed if necessary, and the exposed side (in other words, the side that is applied to the semiconductor wafer) is removed. A dicing sheet is attached to the opposite surface (herein sometimes referred to as "second surface"). The thus obtained laminated structure in which the dicing sheet, the film adhesive, and the semiconductor wafer are laminated in this order in the thickness direction is then subjected to a known dicing process. . Note that the laminated structure of the dicing sheet and the film adhesive is a dicing die bonding sheet, and can be regarded as a film adhesive composite sheet.

In this specification, a laminate structure in which the film-like adhesive composite sheet or the dicing die bonding sheet and the semiconductor wafer are laminated will be referred to as a "first laminate structure". There is.

By performing the dicing process, the semiconductor wafer is divided into a plurality of semiconductor chips, and the film adhesive is also cut along the outer periphery of the semiconductor chip. A plurality of semiconductor chips (ie, semiconductor chips with film-like adhesive) are obtained. These plurality of film-like adhesive-attached semiconductor chips are fixed in an aligned state on a dicing sheet.

In this specification, a laminate structure in which a plurality of film-like adhesive-attached semiconductor chips are fixed in an aligned state on a dicing sheet or the support sheet is referred to as a "second laminate structure". ” is sometimes called.

On the other hand, the film-like adhesive composite sheet already has a structure similar to that of a dicing die bonding sheet. Therefore, the first laminated structure is obtained at the stage where the film-like adhesive composite sheet is attached to the back surface of the semiconductor wafer. Thereafter, as described above, a dicing process is performed in the same manner as when using a film adhesive without a support sheet, thereby forming a second laminate including a plurality of semiconductor chips with a film adhesive. A structure is obtained.

The method for dicing the semiconductor wafer is not particularly limited, and may be any known method, such as blade dicing, laser dicing, water dicing, and the like. In addition to these, stealth dicing (registered trademark), in which a modified layer is formed by focusing a laser on the inside of a semiconductor wafer where it is to be divided, and division is performed using the modified layer as a starting point, and the finished thickness of a semiconductor wafer. A known method is to make a deeper incision and cut into pieces by grinding to reduce the thickness.

Regarding the second laminated structure obtained by stealth dicing or half-cutting, the semiconductor chip and the laminated film adhesive are not cut.
It is desirable that the film adhesive can be cut at the same time as the expanding and picking up processes, but with conventional film adhesives, cutting and picking up may not be performed properly.
The film-like adhesive of this embodiment and the film-like adhesive composite sheet including the same can be suitably used in such a process.

However, when trying to divide a semiconductor wafer with a modified layer along the modified layer using a conventional film adhesive and cutting the film adhesive, the film adhesive could not be cut. , there were times when I couldn't pick it up.
The film-like adhesive of the present embodiment and the film-like adhesive composite sheet including the same can be suitably used, particularly when performing dicing of a semiconductor wafer that involves the formation of such a modified layer.

When the film adhesive or the film adhesive composite sheet of this embodiment is used to separate the semiconductor wafer and the film adhesive into individual pieces at different timings as described above, when dividing the semiconductor wafer at To do this, first, a surface protection tape is applied to the circuit-forming surface of the semiconductor wafer, and then the semiconductor wafer is divided using this method. Then, a film adhesive and a dicing sheet are attached in this order to the back surface of the obtained plurality of semiconductor chip assemblies, or a film adhesive composite sheet is attached therein by the method described above. It is attached using a film adhesive. A laminated structure formed by laminating such a film-like adhesive composite sheet or a dicing die bonding sheet and a semiconductor chip may be referred to as a "third laminated structure."

Next, after removing the protective tape, the third laminated structure is pushed up from the support sheet or dicing sheet side thereof to cut the film adhesive along the outer periphery of the semiconductor chip, thereby forming a film adhesive. An adhesive-attached semiconductor chip is produced, and the obtained film-like adhesive-attached semiconductor chip is separated from a dicing sheet or a support sheet and picked up. The method of cutting the film adhesive in this way includes, for example, a process of cutting the film adhesive by irradiating the film adhesive with a laser, a process of cutting the film adhesive by expanding the film adhesive, etc. This is advantageous in that the film-like adhesive can be cut without the need for a separate process whose main purpose is to. The film-like adhesive or film-like adhesive composite sheet of this embodiment is particularly suitable for applying such a method.

That is, the film-like adhesive or film-like adhesive composite sheet is attached to the back surfaces of a plurality of semiconductor chips, and the film-like adhesive or film-like adhesive composite sheet is attached to the back surface of a plurality of semiconductor chips, and the film By pushing up the adhesive or film-like adhesive composite sheet, the film-like adhesive (if a film-like adhesive composite sheet is used, the film-like adhesive therein) is pushed up along the outer periphery of the semiconductor chip. It is particularly suitable for cutting into film-like adhesive-attached semiconductor chips.
After dividing a semiconductor wafer by a method that involves half-cutting or forming a modified layer, by using the film-like adhesive or film-like adhesive composite sheet of this embodiment, the film-like adhesive can be cut well by pushing up. After that, the semiconductor chip with the film-like adhesive can be picked up well.
The steps of cutting the film adhesive and picking up the semiconductor chip with the film adhesive when using the film adhesive composite sheet 1 described above will be described below with reference to the drawings. Among these, examples of the process of cutting the film adhesive include the following process. This step will be described in detail below with reference to FIGS. 6(a) to 6(c).

In the third laminated structure shown in FIG. 6A, the film adhesive 13 in the film adhesive composite sheet 1 is attached to the back surface 9b of a plurality of semiconductor chips 9. Then, on the surface (back surface) 11b of the support sheet 11 of the film-like adhesive composite sheet 1 opposite to the surface 11a on which the film-like adhesive 13 is provided, a semiconductor device manufacturing apparatus (not shown in the overall diagram) is attached. (omitted), a push-up portion 81 that pushes up the semiconductor chip is in contact with the push-up portion 81 .

When the support sheet 11 is made of only a base material, the film-like adhesive composite sheet 1 is formed by laminating the base material and the film-like adhesive 13, and is in contact with the base material of the film-like adhesive 13. The surface opposite to the side that is attached is attached to the back surface 9b of the semiconductor chip 9.
When the support sheet 11 is formed by laminating a base material and an adhesive layer, the film-like adhesive composite sheet 1 is formed by laminating a base material, an adhesive layer, and a film-like adhesive 13 in this order. The surface of the film adhesive 13 opposite to the side in contact with the adhesive layer is attached to the back surface 9b of the semiconductor chip 9.

In this step A, as shown in FIG. 6(b), a force is applied to the support sheet 11 in the film-like adhesive composite sheet 1 from the back surface 11b, so that the force is applied through the support sheet 11. A force is applied to the film adhesive 13 in the direction from the film adhesive composite sheet 1 (film adhesive 13) toward the semiconductor chip 9. Here, a protrusion (pin) 811 protrudes from the push-up part 81, and the tip of the protrusion 811 pushes up the support sheet 11 from the back surface 11b, so that the protrusion 811 An example of applying force in the direction of protrusion is shown. At this time, push-up conditions such as the amount of protrusion (push-up amount) of the protrusion 811, the protrusion speed (push-up speed), and the holding time of the protrusion state (lifting waiting time) can be adjusted as appropriate. Here, a case is shown in which the number of protrusions 811 that push up the support sheet 11 is one, but it may be two or more, and the number of protrusions 811 may be selected as appropriate.

The amount of protrusion of the protrusion 811 can be, for example, 0 to 1000 μm.
The protrusion speed of the protrusion 811 can be, for example, 0.1 to 50 mm/sec.
The time period for which the protrusion 811 remains in the protruding state can be, for example, 1 to 1000 msec.

In this way, when force is applied to the film adhesive 13, by using the film adhesive composite sheet 1, the shear force generated as the protrusions 811 push up will cause the film to break down while suppressing process abnormalities. The shaped adhesive 13 can be cut. More specifically, the film adhesive 13 is cut at room temperature at a target location, that is, at a location that surrounds only the semiconductor chip 9 to be separated from the support sheet 11 .

Subsequently, as shown in FIG. 6(c), a semiconductor chip 2 with a film adhesive, which includes a semiconductor chip 9 and a film adhesive 13 provided on the back surface of the semiconductor chip 9 after cutting, is prepared. , pull it away from the support sheet 11 (pick it up). Normally, the operation of applying a shearing force to the film adhesive 13 and the picking up of the semiconductor chip 2 with the film adhesive are performed immediately in succession. Here, an example is shown in which pickup is performed by pulling up the semiconductor chip 2 coated with film adhesive by the lifting unit 82 of the semiconductor device manufacturing apparatus. The method of pulling up the semiconductor chip 2 with film-like adhesive may be any known method. For example, the surface of the semiconductor chip 9 in the semiconductor chip 2 with film-like adhesive is adsorbed using a vacuum collet to pull up the semiconductor chip 2 with film-like adhesive. Examples include a method of pulling up the semiconductor chip 2 with adhesive.

Although the cutting process of the film adhesive has been described as illustrated in FIGS. 6(b) and (c), as mentioned above, the operations in FIGS. 6(b) and 6(c) are performed immediately and immediately. Cutting of the film adhesive may occur in stages from FIG. 6(b) to FIG. 6(c).
By using the film adhesive according to the present invention, a semiconductor chip with a film adhesive can be obtained while suppressing poor cutting of the film adhesive and occurrence of burrs.

In the manufacturing method of the present invention, a semiconductor device is manufactured using the separated film-like adhesive-attached semiconductor chip 2 in the same manner as the conventional method. For example, the semiconductor chip is die-bonded to the circuit surface of the substrate using a film-like adhesive provided on the back surface of the semiconductor chip, and if necessary, one or more semiconductor chips are further stacked on this semiconductor chip, and wires are bonded. After bonding, the entire structure is sealed with resin to form a semiconductor package. Then, a desired semiconductor device may be manufactured using this semiconductor package.

Up to this point, the cutting of the film adhesive and the pickup of the semiconductor chip 2 with the film adhesive have been explained using a film adhesive composite sheet as an example. When a dicing sheet is attached to this and used, the same method as described above can be used except for this point, and the same effect can be obtained.

The method for manufacturing a semiconductor device according to the present embodiment is not limited to the above-described method described with reference to FIG. Or it may be added.
For example, as a method of applying force to the film adhesive 13 through the support sheet 11, so far, a method of applying force to the film adhesive 13 by pushing up the support sheet 11 with the protrusion 811 has been described. Other methods include applying force from the support sheet 11 to the film adhesive 13 using a slider method, a disk method, a block method, or the like instead of using the projections 811, for example.

As described above, since the film adhesive of this embodiment can be cut at the desired location, pick-up defects are suppressed, and in the cut film adhesive 12 attached to the picked-up semiconductor chip 9, The occurrence of burrs is suppressed.
Further, according to the method for manufacturing a semiconductor device of the present embodiment, the intended portion of the film adhesive peels off from the support sheet during pickup, so that the occurrence of pickup failure of the semiconductor chip is suppressed.

The picked up semiconductor chip 2 with film adhesive is die-bonded to the circuit forming surface of the substrate using the film adhesive. After die-bonding the film adhesive-attached semiconductor chip 2 to the circuit forming surface of the substrate, a semiconductor package and a semiconductor device are manufactured in the same manner as the conventional method. For example, if necessary, one or more semiconductor chips are further stacked on this die-bonded semiconductor chip, and wire bonding is performed. Next, the film adhesive is thermally cured, and the entire obtained product is further sealed with a resin. A semiconductor package is manufactured through these steps. Then, a target semiconductor device is manufactured using this semiconductor package.

Hereinafter, the present invention will be explained in more detail with reference to specific examples. However, the present invention is not limited to the examples shown below.

The following components were mixed at the compounding ratio (in terms of solid content) shown in Table 1, diluted with methyl ethyl ketone so that the solid content concentration was 50% by mass based on the total mass of the adhesive composition, and a film was formed. An adhesive composition for forming a shaped adhesive composite sheet was prepared.

The raw materials used for manufacturing the adhesive composition are shown below.
<Raw materials for manufacturing adhesive composition>
[Polymer component (a)]
(a)-1: Copolymerization of n-butyl acrylate (55 parts by mass), methyl acrylate (10 parts by mass), glycidyl methacrylate (20 parts by mass), and 2-hydroxyethyl acrylate (15 parts by mass). (meth)acrylic acid ester copolymer (weight average molecular weight: 800,000, glass transition temperature: -28°C)
(a)-2: Polyarylate (Unifiner (registered trademark) M-2040 manufactured by Unitika, weight average molecular weight 50,000, glass transition temperature 220°C)
(a)-3: Polycarbonate (Teijin "TS-2020", weight average molecular weight 20,000, glass transition temperature 160°C)
[Epoxy resin (b1)]
(b1)-1: Bisphenol A type epoxy resin (“jER828” manufactured by Mitsubishi Chemical Corporation, epoxy equivalent 184 to 194 g/eq)
(b1)-2: Cresol novolac type epoxy resin (“EOCN-102S” manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 205 to 217 g/eq)
(b1)-3: Triphenylene type epoxy resin (“EPPN-502H” manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 158 to 178 g/eq)
(b1)-4: Dicyclopentadiene type epoxy resin (“ADEKA Resin EP-4088L” manufactured by ADEKA, epoxy equivalent 165 g/eq)
[Thermosetting agent (b2)]
(b2)-1: o-cresol type novolac resin (“Phenolite (registered trademark) KA-1160” manufactured by DIC Corporation, hydroxyl equivalent: 117 g/eq, softening point: 80°C, n in general formula (1): 6 to 7)
[Curing accelerator (c)]
(c) -1:2-phenyl-4,5-dihydroxymethylimidazole (“Curezol (registered trademark) 2PHZ-PW” manufactured by Shikoku Kasei Kogyo Co., Ltd., fine powder, average particle size 5 μm, maximum 20 μm, melting point 137-147°C )
[Filler (d)]
(d)-1: Spherical silica modified with epoxy group (Admanano (registered trademark) YA050C-MKK manufactured by Admatex, average particle size 50 nm)
[Coupling agent (E)]
(e)-1: Oligomeric silane coupling agent having an epoxy group, a methyl group, and a methoxy group ("X-41-1056" manufactured by Shin-Etsu Silicone Co., Ltd., epoxy equivalent: 280 g/eq)

[Example 1]
<<Manufacture of film-like adhesive composite sheet>>
Polymer component (a)-2 (11 parts by mass), epoxy resin (b1)-2 (7 parts by mass), epoxy resin (b1)-3 (20 parts by mass), epoxy resin (b1)-4 (21 parts by mass) part), thermosetting agent (b2)-1 (32.5 parts by mass), curing accelerator (c)-1 (0.5 parts by mass), filler (d)-1 (7 parts by mass), and cup By dissolving or dispersing ring agent (e)-1 (1 part by mass) in a mixed solvent of 1/2 (mass ratio) of methyl ethyl ketone/toluene and stirring at 23°C, the total concentration of all the above components was determined. An adhesive composition was obtained in which the amount was 50% by mass. Note that all the blending amounts of components other than methyl ethyl ketone and toluene shown here are the amounts of the target products excluding solvent components.

<Manufacture of film adhesive>
Using a release film ("SP-PET381031" manufactured by Lintec Corporation, thickness 38 μm) in which one side of a polyethylene terephthalate (PET) film has been subjected to release treatment by silicone treatment, the obtained adhesive is applied to the release treatment surface. The composition was applied and dried by heating at 100° C. for 1 minute to form a film adhesive with a thickness of 10 μm.

<Manufacture of film-like adhesive composite sheet>
A polypropylene film (manufactured by Gunze Co., Ltd., Fanclair (registered trademark) LPD#, which is a base material) is applied to the surface of the obtained film-like adhesive opposite to the side provided with the release film (in other words, the exposed surface). 80, thickness 80 μm, surface roughness of the glossy surface 0.1 μm, surface roughness of the matte surface 0.3 μm), and the base material, film adhesive, and release film were bonded together in this order. A film-like adhesive composite sheet was obtained, which was constructed by laminating layers in the thickness direction.

<Evaluation of film adhesive and film adhesive composite sheet>
(Elongation at break, strength at break)
The elongation at break of the film adhesive at 23° C. was measured by the method shown below.
Using a laminator, two sheets of film-like adhesive are pasted together, and then the same film-like adhesive is pasted on top of this, and the film-like adhesive is laminated so that the total thickness is 200 μm. was created. Next, the obtained laminate was heated for 30 seconds using a hot plate heated to 60°C.
Next, using a super cutter ("PH1-600" manufactured by Ogino Seiki Seisakusho), this heated laminate was cut within 30 seconds to produce a test piece with a width of 15 mm, a length of 70 mm, and a thickness of 200 μm. The reason why the laminate is cut after heating in this way is to prevent defects from occurring at the ends of the test piece that may cause breakage.
Next, a universal tensile tester AG-IS manufactured by Shimadzu Corporation was used as a measuring device, and the test piece was fixed at two locations using its fixing grips. At this time, the distance between the tips of the fixed gripping instruments (the length of the exposed part of the test piece, the distance between the fixed parts) was set to 30 mm. Then, the test piece was pulled between the fixed points at a tensile speed of 200 mm/min, and the breaking strength (MPa) and breaking elongation (%) of the test piece were measured.
Here, the breaking strength refers to the maximum value of the tensile force applied until the test piece is broken.
Moreover, the elongation at break is the ratio of the amount of increase in the length of the test piece (ΔL) when the test piece breaks to the original length (L).

(Measurement of peeling force)
The obtained film-like adhesive composite sheet was cut into a rectangular shape of 25 mm x 250 mm, and the release film was removed. A hard support made of a polystyrene plate with double-sided tape attached to the surface was used, and a film-like adhesive of a 25 mm x 250 mm film-like adhesive composite sheet was superimposed on the double-sided tape, and the temperature was 23°C and the relative humidity was 50°C. The film-like adhesive composite sheet was attached to the hard support via double-sided tape by moving a 2 kg rubber roller back and forth once over the stacked material under an environment of 100%.
Next, after leaving the pasted material in the same environment at 23°C and 50% relative humidity for 30 minutes, the film-like adhesive composite sheet was tested using a universal tensile tester AG-IS manufactured by Shimadzu Corporation as a measuring device. The peel force (N/25 mm) was measured when the base material was peeled off from the film adhesive at an angle of 180° at a speed of 300 mm/min. The results are shown in Table 1.

Using the obtained film-like adhesive composite sheet, silicon wafer, etc., the cutting suitability, die crack suppression ability, and burr generation suppression ability were evaluated by the following evaluation methods.

(Cutability)
A backgrind tape (“Adwill E-3125KL” manufactured by Lintec Corporation) was attached to an 8-inch silicon wafer having a thickness of 750 μm using a tape laminator (“RAD3510” manufactured by Lintec Corporation). Using a stealth laser dicer (“DFL7361” manufactured by DISCO), a modified layer was formed on a silicon wafer to which a backgrind tape was attached. Next, using a grinder (“DFG8760” manufactured by DISCO), the surface of the silicon wafer opposite to the side to which the back-grind tape is attached is ground, thereby reducing the thickness of the silicon wafer and removing the silicon wafer. It was divided to obtain a silicon chip aggregate having a size of 2.5 mm x 2.5 mm and a thickness of 30 μm (grinding/singulation process).
Using a tape mounter (Adwill RAD2500 manufactured by Lintec), the obtained film-like adhesive composite sheet was attached to the ground surface of these silicon chips, and the obtained laminate (the third laminate structure) was attached to a wafer. While fixing it to a ring frame for dicing, the backgrind tape was irradiated with energy rays to reduce its adhesive strength and then peeled off.
Next, using a pick-up device ("BESTEM-D02" manufactured by Canon Machinery Co., Ltd.), the obtained third laminated structure was subjected to a 1-pin push-up method at a push-up amount of 300 μm and a push-up speed of 20 mm/sec. The film-like adhesive was cut (cutting process), and 48 silicon chips with film-like adhesive were separated from the support sheet (separation process) and picked up.
The case where 1 to 47 silicon chips with film adhesive were picked up was evaluated as B, and the case where all 48 silicon chips with film adhesive were picked up was evaluated as A. A rating of C was given when no single silicon chip could be picked up. The results are shown in Table 1. In Table 1, the number in parentheses indicates the number of silicon chips with film adhesive that could not be picked up in the evaluation of cutting suitability.

(Die crack suppression ability)
After attempting to pick up using the above procedure, count the number of cracks that have occurred on the silicon chip, regardless of whether or not it can be picked up, and if no cracks have occurred in all 48 silicon chips, it will be evaluated as A. However, the case where cracks were generated in one or more silicon chips was evaluated as B. The results are shown in Table 1.

(Ability to suppress burr generation)
If after trying to pick up the silicon chip with a film-like adhesive after trying to pick it up using the above-mentioned procedure, no burrs were generated on the silicon chips with a film-like adhesive that could be picked up, the evaluation is A. The case where this occurred was evaluated as B. The results are shown in Table 1.

<Manufacture and evaluation of film adhesive and film adhesive composite sheet>
[Examples 2 to 4, Comparative Examples 1 to 3]
Either one or both of the types and amounts of the ingredients to be mixed at the time of manufacturing the adhesive composition are changed so that the types and amounts of the ingredients in the adhesive composition are as shown in Table 1. Alternatively, a film adhesive and a film adhesive composite sheet were produced in the same manner as in Example 1, except that the thickness of the film adhesive was changed as shown in Table 1. and evaluated. The results are shown in Tables 1 and 2.

The evaluation results are shown in Tables 1 and 2.
The film adhesives of Examples 1 to 4 had peeling force, breaking strength, and breaking elongation within the range specified by the present invention, and had sufficient cutting suitability, die crack suppression ability, and burr generation suppression ability.
The peeling force of the film adhesive of Comparative Example 1 was outside the range defined by the present invention, and the cutting suitability and die crack suppressing ability were insufficient. Further, the film adhesive of Comparative Example 2 had a breaking strength outside the range defined by the present invention, and its cutting suitability and die crack suppressing ability were insufficient. Further, the film adhesive of Comparative Example 3 had sufficient die crack suppression ability, but the elongation at break was outside the range defined by the present invention, and the burr generation suppression ability was not sufficient.

It is possible to provide a film adhesive that can sufficiently suppress the occurrence of cutting defects, die cracks, and burrs when used as a thermosetting die-bonding film to divide semiconductor wafers.

DESCRIPTION OF SYMBOLS 1... Film adhesive composite sheet, 2... Semiconductor chip with film adhesive, 9... Semiconductor chip, 10... Support sheet, 10a... First surface of support sheet, 11. ... Base material, 11a... First surface of base material, 12... Adhesive layer, 13, 23... Film adhesive, 81... Push-up portion, 101, 102, 103, 104. ...Film-like adhesive composite sheet, 811...Protrusion

Claims (5)

A film adhesive,
The film adhesive contains a resin having a ring structure in the main chain and a glass transition temperature (Tg) of 140° C. or higher, and an o-cresol novolac type epoxy resin,
Between the film adhesive and the test base material when the film adhesive, double-sided tape, and hard support are laminated in this order on one side of the test base material made of polypropylene film. The 180° peeling force measured at a peeling speed of 300 mm/min and a temperature of 23° C. is 0.01 to 0.2 N/25 mm,
The surface roughness of the one side of the test base material is 0.1 μm,
A sample having a width of 15 mm, a length of 70 mm, and a thickness of 200 μm, which is a laminate of multiple sheets of the film adhesive, was tested at 25° C. using a tensile tester at a distance between chucks of 30 mm and a tensile speed of 200 mm/min. Stress and strain curves were measured under the following conditions, and using these measurement results, the breaking strength of the film adhesive calculated by the following formula was 30 MPa or less, and the breaking elongation of the film adhesive was 11%. The above is the film adhesive.
Breaking strength (Pa) = maximum strength (N) / cross-sectional area of sample (m ² )
Elongation at break (%) = (Length between chucks of sample at break (mm) - 30)/30/100 The film adhesive according to claim 1, wherein the film adhesive does not substantially contain a polymer component having a weight average molecular weight of 100,000 or more. The film adhesive is attached to the back surface of a plurality of semiconductor chips, and by pushing up the film adhesive in a direction from the film adhesive toward the semiconductor chips, the film adhesive is attached to the semiconductor chips. A semiconductor chip with a film-like adhesive is manufactured by cutting the chip along the outer periphery, and comprising the semiconductor chip and the film-like adhesive after cutting, which is provided on the back surface of the semiconductor chip. The film adhesive according to claim 1 or 2 , which is used for. comprising a support sheet and a film adhesive provided on one surface of the support sheet,
A film-like adhesive composite sheet, wherein the film-like adhesive is the film-like adhesive according to any one of claims 1 to 3 . The film-like adhesive composite sheet according to claim 4 , wherein the support sheet consists of only a base material.

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