JP2019096913A - Sheet for resin film formation and composite sheet for resin film formation - Google Patents

Abstract

To provide: a sheet for resin film formation, which is superior in reworkability; and a composite sheet for resin film formation, which has the sheet for resin film formation and a support body.SOLUTION: A sheet for resin film formation is to be attached to a silicon wafer to form a resin film on the silicon wafer. The sheet for resin film formation comprises a filler (C) of 10-51.1 mass% to a total quantity of the sheet for resin film formation. The surface roughness (Ra) of a surface (α) of the sheet for resin film formation on a side where attachment to a silicon wafer is performed is 40 nm or more.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin film forming sheet and a resin film forming composite sheet.

  In recent years, semiconductor devices have been manufactured using a mounting method called a so-called face down method. In the face-down method, a semiconductor chip (hereinafter, also simply referred to as a "chip") having electrodes such as bumps on a circuit surface is used, and the electrodes are bonded to a substrate. For this reason, the surface opposite to the circuit surface of the chip (hereinafter also referred to as "the back surface of the chip") may be exposed.

A resin film made of an organic material may be formed on the back surface of the exposed chip, and may be taken into a semiconductor device as a chip with a resin film. The resin film is used as a protective film to prevent the occurrence of cracks after dicing or packaging, or an adhesive for bonding the obtained chip onto another member such as a die pad portion or another semiconductor chip. It is formed as a film.
Generally, in this chip with a resin film, a solution of a composition containing a resin is applied to the back surface of a wafer by spin coating or the like to form a coating, and then the coating is dried and cured to obtain a resin. It manufactures by forming a film | membrane and dicing the wafer with a resin film obtained.

Various sheets for forming a resin film have been proposed as materials for forming a protective film and an adhesive film provided on the back surface of such a chip and the back surface of a wafer.
For example, Patent Document 1 discloses two energy beam curable protective film-forming layers including a polymer component composed of an acrylic copolymer, an energy beam curable component, a dye or a pigment, an inorganic filler, and a photopolymerization initiator. A chip protection film having a configuration of being sandwiched between the release sheets of
According to the description of Patent Document 1, the film for chip protection can form a protective film having improved laser marking recognizability, hardness, and adhesion to a wafer by irradiation of energy rays. The process can be simplified as compared to the conventional film for chip protection.

Further, Patent Document 2 discloses a dicing tape having a dicing tape having a substrate and a pressure-sensitive adhesive layer, and a wafer back surface protective film which is colored and has a predetermined elastic modulus on the pressure-sensitive adhesive layer of the dicing tape. An integral wafer backside protective film is disclosed.
According to the description of Patent Document 2, the wafer back surface protective film can exhibit excellent holding power with the semiconductor wafer in the dicing step of the semiconductor wafer.

JP, 2009-138026, A Unexamined-Japanese-Patent No. 2010-199543

By the way, in the step of sticking the protective film disclosed in Patent Documents 1 and 2 on the wafer, the protective film is placed so that the sticking position of the protective film is deviated or the foreign matter is included without noticing the foreign matter on the wafer. If it is stuck, it is difficult to peel off the protective film and rework the wafer.
The protective films disclosed in Patent Documents 1 and 2 are intended to improve the adhesion with the wafer at the time of sticking and the holding power with the wafer after sticking, so once sticking on the wafer, There is a problem in reworkability due to high adhesion to the wafer. When it is attempted to forcefully peel off the protective film that has been applied once on the wafer, the peeling force may damage the wafer or leave part of the protective film on the wafer. Therefore, it is difficult to reuse the protective film and the wafer once attached.
That is, in Patent Documents 1 and 2, although the protective film described in the above is examined from the viewpoint of adhesion with the wafer at the time of sticking and holding power with the wafer after sticking, the reworkability of the protective film No consideration has been made about.

  This invention is made in view of the said problem, Comprising: The sheet | seat for resin film formation which is excellent in rework property, and the composite sheet for resin film formation which has the said sheet | seat for resin film formation, and a support body. With the goal.

  The present inventors have found that the resin film forming sheet in which the surface roughness of the surface to which the silicon wafer is attached is adjusted to a predetermined value or more can solve the above problems, and completed the present invention.

That is, the present invention provides the following [1] to [15].
[1] A sheet attached to a silicon wafer for forming a resin film on the silicon wafer,
The sheet for resin film formation whose surface roughness (Ra) of the surface ((alpha)) of the said sheet | seat of the side stuck to a silicon wafer is 40 nm or more.
[2] A sheet for forming a resin film according to the above [1], which contains the polymer component (A) and the curable component (B).
[3] A sheet for forming a resin film according to the above [2], wherein the polymer component (A) contains an acrylic polymer (A1).
[4] A sheet for forming a resin film according to any one of the above [1] to [3], which contains a thermosetting component (B1).
[5] The resin film-forming sheet according to any one of the above [1] to [4], which contains a filler (C).
[6] The sheet for resin film formation as described in the above [5], wherein the content of the filler (C) is 10 to 80% by mass with respect to the total amount of the sheet for resin film formation.
[7] The sheet for forming a resin film according to the above [5] or [6], wherein the average particle diameter of the filler (C) is 100 to 1000 nm.
[8] The resin film formation sheet according to any one of the above [1] to [7], which is a protection film formation sheet for forming a protection film on a silicon wafer.
[9] After sticking the surface (α) of the sheet for resin film formation to a silicon wafer, it was measured from the surface (β ′) of the resin film formed from the sheet for resin film formation opposite to the silicon wafer The resin film-forming sheet according to any one of the above [1] to [8], which has a gloss value of 25 or more.
[10] A composite sheet for forming a resin film, comprising the sheet for forming a resin film according to any one of the above [1] to [9] and a support.
[11] It has a resin film forming sheet attached to a silicon wafer and for forming a resin film on the silicon wafer, and a support (I),
Resin film formation having a structure in which the surface (α) of the resin film-forming sheet to be attached to a silicon wafer and the surface (i) of the support (I) having a surface roughness of 40 nm or more are directly laminated Composite sheet.
[12] The surface roughness (Ra) of the surface (α) of the sheet for resin film formation which is exposed when the support (I) of the composite sheet for resin film formation is removed is 40 nm or more The composite sheet for resin film formation as described in [11].
[13] The composite sheet for resin film formation according to the above [11] or [12], wherein the sheet for resin film formation contains a thermosetting component (B1).
[14] A second support (II) is directly laminated on the surface (β) opposite to the surface (α) of the resin film-forming sheet,
The composite sheet for resin film formation as described in said [11] or [12] in which the said sheet | seat for resin film formation contains a thermosetting component (B1).
[15] The support (II) is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer and the surface (β) of the sheet for forming a resin film are directly laminated The composite sheet for resin film formation of description.

  The sheet for resin film formation of the present invention is excellent in reworkability. Therefore, once the resin film-forming sheet of the present invention is attached to a silicon wafer, when it is determined that the sheet needs to be attached again, the resin is not damaged and the resin is suppressed while suppressing the generation of a residue. The film-forming sheet can be peeled off, and the silicon wafer after peeling off the resin film-forming sheet can be reused.

  In the present specification, “reworkability of the resin film-forming sheet” means that the resin film is formed on the silicon wafer without damaging the silicon wafer when it is peeled off again after being attached to the silicon wafer. It refers to the property of being able to peel off without leaving a part of the support sheet.

It is sectional drawing of the composite sheet for resin film formation of 1 aspect of this invention.

In the description of the present specification, the values of mass average molecular weight (Mw) and number average molecular weight (Mn) of each component are values in terms of standard polystyrene measured by gel permeation chromatography (GPC) method, and specific examples Is a value measured based on the method described in the examples.
Further, in the present specification, for example, “(meth) acrylate” is used as a term indicating both “acrylate” and “methacrylate”, and the same applies to other similar terms.
Furthermore, in the present specification, the term "energy beam" refers to, for example, ultraviolet light, electron beam and the like.

[Sheet for resin film formation]
The sheet for resin film formation of the present invention is a sheet attached to a silicon wafer to form a resin film on the silicon wafer, and the surface of the sheet (α) on the side to be attached to the silicon wafer Roughness (Ra) (hereinafter, also simply referred to as “surface roughness (Ra) of surface (α)”) is 40 nm or more.

The sheet for resin film formation of the present invention has a surface roughness (Ra) of 40 nm or more on the surface (α), and thus the silicon wafer is not damaged even after the sheet for resin film formation is once attached to the silicon wafer. And the said sheet | seat for resin film formation can be peeled, suppressing generation | occurrence | production of a residue, and it is excellent in rework property.
On the other hand, if it is attempted to peel off a sheet for forming a resin film having a surface roughness (Ra) of less than 40 nm on the surface (α) to a silicon wafer, residue of the sheet for forming a resin film will be generated on the silicon wafer. There is a case. Also, if it is attempted to peel off forcibly, the silicon wafer may be broken.

  From the above viewpoint, the surface roughness (Ra) of the surface (α) of the resin film-forming sheet of the present invention is preferably 45 nm or more, more preferably 50 nm or more, still more preferably 53 nm or more, still more preferably 55 nm or more is there.

The upper limit value of the surface roughness (Ra) of the surface (α) is not particularly limited from the viewpoint of improving the reworkability.
However, the surface roughness (Ra) of the surface (α) of the sheet for resin film formation of the present invention is preferably 150 nm or less, from the viewpoint of forming a sheet for resin film formation in which adhesion with a silicon wafer is good. Preferably it is 100 nm or less, More preferably, it is 80 nm or less.

In the present specification, the surface roughness (Ra) of the surface (α) means a value measured by the method described in the examples.
In addition, the surface roughness (Ra) of the surface (α) appropriately sets, for example, the type, average particle diameter, and content of fine particle components such as fillers and colorants that may be contained in the resin film-forming sheet. It is adjustable by doing. The adjustment can also be made by laminating a rough support on the surface.

In one aspect of the present invention, the surface roughness (Ra) of the surface (β) opposite to the surface (α) of the resin film-forming sheet is not particularly limited, but is preferably 5 to 80 nm, More preferably, it is 8 to 60 nm, further preferably 10 to 45 nm.
If it is in the said range, it will become easy to adjust high the gloss value of the surface ((beta) ') of the below-mentioned resin film formed from the sheet | seat for resin film formation. In addition, in the case where a silicon wafer having a resin film formed from a resin film-forming sheet, a chip obtained from a silicon wafer, or the like is inspected by electromagnetic waves such as infrared rays, the electromagnetic wave permeability can be increased. it can.

After affixing the surface (α) of the sheet for resin film formation of one aspect of the present invention to a silicon wafer, the surface (β ′) of the resin film formed from the sheet for resin film formation is opposite to the silicon wafer. The measured gloss value is preferably 25 or more, more preferably 30 or more, further preferably 35 or more, and still more preferably 40 or more.
If the gloss value of the surface (β ′) of the resin film is 25 or more, it is possible to obtain a resin film excellent in the visibility of laser printing.

In one aspect of the present invention, the light transmittance of the resin film-forming sheet and the resin film formed from the resin film-forming sheet at a wavelength of 1250 nm is preferably 25% or more, more preferably 30% or more, and further preferably Is 35% or more, more preferably 40% or more.
If the light transmittance is 25% or more, the infrared light transmission is good, and the infrared light is transmitted to the resin film-forming sheet or the silicon wafer or chip provided with the resin film formed from the resin film-forming sheet. It can do the inspection. That is, since the crack etc. which arose in the silicon wafer or the chip can be easily found via the resin film formation sheet or the resin film, the product yield can be improved.
In addition, the light transmittance of wavelength 1250 nm of the sheet | seat for resin film formation means the value measured by the method as described in an Example.

There is no restriction | limiting in particular in the form of the sheet | seat for resin film formation of this invention, For example, it may be forms, such as a long tape shape, the label of a single leaf, etc.
Further, the resin film-forming sheet of the present invention may be a single layer body formed of one composition, or may be a multilayer body formed of two or more compositions.
In addition, when the sheet | seat for resin film formation of 1 aspect of this invention is a multilayer body, the composition ((alpha) ') which is a formation material by the side of surface ((alpha)) is surface roughness (Ra) of surface ((alpha)). It is preferable to adjust the kind and compounding quantity of a component so that it may become the said range.

In one aspect of the present invention, the thickness of the resin film-forming sheet is appropriately set depending on the application, but is preferably 1 to 300 μm, more preferably 3 to 250 μm, still more preferably 5 to 200 μm, still more preferably Is 7 to 150 μm.
In particular, when the thickness of the silicon wafer to which the resin film forming sheet is attached is thin, the thickness of the resin film forming sheet is preferably 1 to 20 μm, more preferably 3 to 15 μm.
In addition, also when the sheet | seat for resin film formation is a multilayer body comprised from 2 or more layers, it is preferable that the total thickness of the said multilayer body is the said range.

<Components of sheet for resin film formation>
The constituent components of the resin film-forming sheet according to one aspect of the present invention are not particularly limited as long as the surface roughness (Ra) of the surface (α) falls within the above range.
However, the sheet for resin film formation of one aspect of the present invention contains the polymer component (A) and the curable component (B) from the viewpoint of making the sheet-like shape maintainability into a sheet for resin film formation that is good. It is preferable that the
Further, the present invention from the viewpoint of adjusting the surface roughness (Ra) of the surface (α) to the above range, and from the viewpoint of adjusting the thermal expansion coefficient of the resin film formed from the resin film forming sheet to an appropriate range. It is preferable that the sheet | seat for resin film formation of one aspect | mode contains a filler (C).
Furthermore, the resin film-forming sheet according to one aspect of the present invention is further selected from a coloring agent (D), a coupling agent (E), and a general-purpose additive (F), as long as the effects of the present invention are not impaired. It may contain more than species.
Hereinafter, the said components (A)-(F) which can become a structural component of the sheet | seat for resin film formation of 1 aspect of this invention are demonstrated.

[Polymer component (A)]
In the present specification, the "polymer component" is a high molecular weight product obtained by a polymerization reaction, and means a compound having at least one repeating unit.
By containing the polymer component (A), the resin film-forming sheet used in one embodiment of the present invention can be easily imparted with flexibility, and the sheet-like shape maintainability can be made favorable. As a result, the storage elastic modulus of the resin film forming sheet can be adjusted to the above-mentioned range.
The mass average molecular weight (Mw) of the polymer component (A) is preferably 20,000 or more, more preferably 20,000 to 300, from the viewpoint of adjusting the storage elastic modulus of the sheet for resin film formation to be obtained in the above range. Ten thousand, more preferably 100,000 to 2,000,000, and still more preferably 150,000 to 1.5 million.

  The glass transition temperature (Tg) of the acrylic polymer (A1) is preferably -40 ° C or higher, more preferably -30 to 50 ° C, still more preferably -20 to 20 ° C, and still more preferably -15 to 0 ° C.

In the present specification, the value of the glass transition temperature of the acrylic polymer (Tg) of absolute temperature calculated by the following formula (1) (unit: K) a glass transition temperature represented by (Tg _K) , In degrees Celsius (unit: ° C.).

[In the above formula _{(1), W 1, W} 2, W 3, W 4 ··· shows the mass fraction of the monomer components constituting the polymer component _{(mass%), Tg 1, Tg 2} , Tg ₃ , Tg ₄ ... Indicate the glass transition temperature (unit: K) of the homopolymer of each monomer component constituting the polymer component. ]

  In one aspect of the present invention, the content of the polymer component (A) in the sheet for resin film formation is preferably 5 to 60% by mass, more preferably the total amount (100% by mass) of the sheet for resin film formation. The amount is preferably 8 to 50% by mass, more preferably 10 to 45% by mass, and still more preferably 15 to 40% by mass.

In the present specification, “the content of the component (A) with respect to the total amount of the sheet for resin film formation” is “the amount of the component (A) with respect to the total amount of the active component of the composition which is a forming material of the sheet for resin film formation. It is the same as "content". The same applies to the contents of the other components described below.
Furthermore, the above-mentioned "active ingredient" means a component other than a substance which does not affect the physical properties of the sheet, such as a solvent, etc. directly or indirectly, such as a solvent in the composition, specifically Mean components other than solvents such as water and organic solvents.

The polymer component (A) preferably contains an acrylic polymer (A1).
Moreover, the polymer component (A) may contain a non-acrylic polymer (A2) together with the acrylic polymer (A1).
These polymer components may be used alone or in combination of two or more.

  In one aspect of the present invention, the content of the acrylic polymer (A1) relative to the total amount (100% by mass) of the polymer component (A) contained in the resin film-forming sheet is preferably 50 to 100 mass. %, More preferably 60 to 100% by mass, still more preferably 70 to 100% by mass, still more preferably 80 to 100% by mass.

(Acrylic polymer (A1))
The mass average molecular weight (Mw) of the acrylic polymer (A1) imparts flexibility and film-forming property to the resin film-forming sheet, and the storage elastic modulus of the resin film-forming sheet is adjusted to the above range Therefore, it is preferably 20,000 to 3,000,000, more preferably 100,000 to 1,500,000, further preferably 150,000 to 1,200,000, and still more preferably 250,000 to 1,000,000.

  Examples of the acrylic polymer (A1) include polymers having alkyl (meth) acrylate as the main component, and specifically, a structure derived from an alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms An acrylic polymer containing a unit (a1) is preferable, and an acrylic copolymer containing a structural unit (a2) other than the structural unit (a1) may be used.

In addition, you may use acrylic polymer (A1) individually or in combination of 2 or more types.
When the acrylic polymer (A1) is a copolymer, the form of the copolymer may be any of block copolymer, random copolymer, alternating copolymer, and graft copolymer. Good.

(Constituent unit (a1))
The carbon number of the alkyl group of the alkyl (meth) acrylate constituting the structural unit (a1) is preferably 1 to 18 from the viewpoint of imparting flexibility and film-forming property to the resin film-forming sheet Preferably it is 1-12, More preferably, it is 1-8.

Examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, 2-ethylhexyl (meth) acrylate and isooctyl ( Examples include meta) acrylate, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate and the like.
These alkyl (meth) acrylates may be used alone or in combination of two or more.

Among these, the alkyl (meth) acrylate which has a C1-C3 alkyl group is preferable, and methyl (meth) acrylate is more preferable.
The content of the structural unit (a11) derived from the alkyl (meth) acrylate having an alkyl group having 1 to 3 carbon atoms in the acrylic polymer (A1) is the total structural unit (100 of the acrylic polymer (A1) Preferably it is 5-80 mass% with respect to mass%, More preferably, it is 15-70 mass%, More preferably, it is 25-60 mass%.

Moreover, the alkyl (meth) acrylate which has a C4-C12 alkyl group is preferable, and butyl (meth) acrylate is more preferable.
The content of the structural unit (a12) derived from the alkyl (meth) acrylate having an alkyl group having 4 to 12 carbon atoms in the acrylic polymer (A1) is the total structural unit (100 of the acrylic polymer (A1) Preferably it is 5-80 mass% with respect to mass%, More preferably, it is 15-70 mass%, More preferably, it is 20-60 mass%.

In addition, as an acryl-type polymer (A1) used by 1 aspect of this invention, the acryl-type copolymer which includes both the said structural unit (a11) and a structural unit (a12) is preferable.
The content ratio [(a11) / (a12)] (mass ratio) of the structural unit (a11) to the structural unit (a12) of the acrylic copolymer is preferably 20/80 to 95/5, and more preferably Is 30/70 to 90/10, more preferably 40/60 to 85/15, still more preferably 52/48 to 75/25.

  The content of the structural unit (a1) in the acrylic polymer (A1) is preferably 50% by mass or more, more preferably 50% by mass, relative to the total structural units (100% by mass) of the acrylic polymer (A1). It is -99 mass%, more preferably 55-98 mass%, still more preferably 60-97 mass%.

(Constituent unit (a2))
The acrylic polymer (A1) used in one aspect of the present invention may have another structural unit (a2) other than the above structural unit (a1), as long as the effects of the present invention are not impaired.
Examples of the monomer constituting the structural unit (a2) include functional group-containing monomers such as hydroxy group-containing monomers, carboxy group-containing monomers and epoxy group-containing monomers; vinyl esters monomers such as vinyl acetate and vinyl propionate; ethylene, Examples thereof include olefin monomers such as propylene and isobutylene; aromatic vinyl monomers such as styrene, methyl styrene and vinyl toluene: diene monomers such as butadiene and isoprene; nitrile monomers such as (meth) acrylonitrile and the like.
Among these, functional group-containing monomers are preferable, and one or more selected from hydroxy group-containing monomers and epoxy group-containing monomers are preferable.

As a hydroxy containing monomer, for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) ) Hydroxyalkyl (meth) acrylates such as acrylate and 4-hydroxybutyl (meth) acrylate; and unsaturated alcohols such as vinyl alcohol and allyl alcohol.
Among these, 2-hydroxyethyl (meth) acrylate is preferable.

  Examples of carboxy group-containing monomers include (meth) acrylic acid, maleic acid, fumaric acid, itaconic acid and the like.

Examples of epoxy group-containing monomers include glycidyl (meth) acrylate, β-methyl glycidyl (meth) acrylate, (3,4-epoxycyclohexyl) methyl (meth) acrylate, 3-epoxycyclo-2-hydroxypropyl (meth) Examples thereof include epoxy group-containing (meth) acrylic acid esters such as acrylate; non-acrylic epoxy group-containing monomers such as glycidyl crotonate and allyl glycidyl ether;
An acrylic polymer having a Mw of at least 20,000 having a structural unit derived from an epoxy group-containing monomer has thermosetting properties, but it is not a curable component (B) but a polymer component (A). Shall be included in the concept of

The acrylic polymer (A1) used in one aspect of the present invention preferably contains a structural unit (a21) derived from a hydroxy group-containing monomer.
The content of the structural unit (a21) derived from the hydroxy group-containing monomer in the acrylic polymer (A1) is preferably 1 to 2 parts based on the total structural units (100% by mass) of the acrylic polymer (A1). It is 40% by mass, more preferably 5 to 30% by mass, still more preferably 8 to 25% by mass, still more preferably 10 to 20% by mass.

Moreover, it is preferable that the acrylic polymer (A1) used by 1 aspect of this invention contains the structural unit (a22) originating in an epoxy-group containing monomer.
The content of the structural unit (a22) derived from the epoxy group-containing monomer in the acrylic polymer (A1) is preferably 1 to 2 based on the total structural units (100% by mass) of the acrylic polymer (A1). It is 40% by mass, more preferably 5 to 30% by mass, still more preferably 8 to 25% by mass.

When an epoxy-based thermosetting component is used as the curable component (B) described later, the carboxyl group and the epoxy group in the epoxy-based thermosetting component react with each other, so an acrylic polymer (A1) is used. The content of the structural unit derived from the carboxyl group-containing monomer is preferably as small as possible.
When an epoxy-based thermosetting component is used as the curable component (B), the content of the structural unit derived from the carboxy group-containing monomer is relative to the total constituent units (100% by mass) of the acrylic polymer (A1) Preferably it is 0-10 mass%, More preferably, it is 0-5 mass%, More preferably, it is 0-2 mass%, More preferably, it is 0 mass%.

  The content of the structural unit (a2) in the acrylic polymer (A1) is preferably 1 to 50 mass%, more preferably 1 to 50 mass%, based on the total structural units (100 mass%) of the acrylic polymer (A1). The content is 2 to 45% by mass, more preferably 3 to 40% by mass.

(Non-acrylic resin (A2))
The sheet for resin film formation of one aspect of the present invention may contain a non-acrylic polymer (A2) as a polymer component other than the above-mentioned acrylic polymer (A1), if necessary.
Examples of the non-acrylic polymers (A2) include polyesters, phenoxy resins, polycarbonates, polyethers, polyurethanes, polysiloxanes, rubber polymers and the like.
These non-acrylic polymers (A2) may be used alone or in combination of two or more.

  The mass average molecular weight (Mw) of the non-acrylic polymer (A2) is preferably 20,000 or more, more preferably 20,000 to 100,000, and still more preferably 20,000 to 100,000.

[Curable component (B)]
The curable component (B) plays a role of curing a resin film-forming sheet to form a hard resin film, and is a compound having a mass average molecular weight (Mw) of less than 20,000.
The resin film-forming sheet used in the present invention preferably contains at least one of a thermosetting component (B1) and an energy ray curable component (B2) as a curable component (B), and the curing reaction proceeds sufficiently It is more preferable to include at least the thermosetting component (B1) from the viewpoint of reducing the temperature and the cost reduction.
As a thermosetting component (B1), it is preferable to contain the compound which has a functional group which reacts at least by heating.
In addition, the energy ray curable component (B2) contains a compound (B21) having a functional group that reacts by energy ray irradiation, and polymerizes and hardens when it is irradiated with energy ray.
The functional groups possessed by these curable components react with one another to form a three-dimensional network structure, whereby curing is realized.
The mass average molecular weight (Mw) of the curable component (B) is used in combination with the component (A), thereby suppressing the viscosity of the composition forming the resin film-forming sheet and improving the handleability, etc. Preferably it is less than 20,000, More preferably, it is 10,000 or less, More preferably, it is 100-10,000.

(Thermosetting component (B1))
As a thermosetting component (B1), an epoxy-type thermosetting component is preferable.
It is preferable to use what combined the thermosetting agent (B12) with the compound (B11) which has an epoxy group thermosetting component as an epoxy-type thermosetting component.

Examples of the compound (B11) having an epoxy group (hereinafter, also referred to as “epoxy compound (B11)”) include polyfunctional epoxy resins, bisphenol A diglycidyl ether and hydrogenated products thereof, and novolaks such as cresol novolac epoxy resins And epoxy compounds having two or more functional groups in the molecule, such as epoxy resin of dicyclopentadiene type, epoxy resin of dicyclopentadiene type, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenylene skeleton type epoxy resin and the like.
You may use these epoxy compounds (B11) individually or in combination of 2 or more types.
Among these, it is preferable to include one or more selected from novolak epoxy resins and biphenyl epoxy resins.

Further, in one aspect of the present invention, it is preferable that the epoxy compound (B11) contains an epoxy compound which is liquid at 25 ° C. (hereinafter, also referred to as “liquid epoxy compound”).
When the epoxy compound (B11) contains a liquid epoxy compound, the value of the breaking elongation of the resin film-forming sheet can be increased, and a resin film-forming sheet excellent in reworkability can be obtained.
In one aspect of the present invention, the content of the liquid epoxy compound is preferably 10% by mass or more based on the total amount (100% by mass) of the epoxy compound (B11) in the resin film-forming sheet from the above viewpoint Preferably it is 15 mass% or more, More preferably, it is 30 mass% or more, More preferably, it is 40 mass% or more.
On the other hand, the content of the liquid epoxy compound is the total amount (100% by mass) of the epoxy compound (B11) in the sheet for resin film formation from the viewpoint of improving the reliability of the chip with a resin film produced using the sheet for resin film formation. Is preferably 90% by mass or less, more preferably 80% by mass or less, still more preferably 75% by mass or less, and still more preferably 70% by mass or less.
In the present specification, the “liquid epoxy compound” means an epoxy compound having a viscosity of 40 Pa · s or less at 25 ° C. Further, in the present specification, the viscosity at 25 ° C. of the epoxy compound is a value measured at 25 ° C. using an E-type viscometer according to JIS Z 8803.

  The content of the epoxy compound (B11) is preferably 1 to 500 parts by mass, more preferably 3 to 300 parts by mass, still more preferably 5 to 150 parts by mass, still more preferably 100 parts by mass of component (A). Is 10 to 100 parts by mass.

(Thermosetting agent (B12))
The heat curing agent (B12) functions as a curing agent for the epoxy compound (B11).
As a thermosetting agent, the compound which has 2 or more of functional groups which can react with an epoxy group in 1 molecule is preferable.
Examples of the functional group include phenolic hydroxyl group, alcoholic hydroxyl group, amino group, carboxyl group, and acid anhydride. Among these, a phenolic hydroxyl group, an amino group, or an acid anhydride is preferable, a phenolic hydroxyl group or an amino group is more preferable, and an amino group is still more preferable.

Examples of the phenol-based thermosetting agent having a phenolic hydroxyl group include polyfunctional phenol resins, biphenols, novolak-type phenol resins, dicyclopentadiene-type phenol resins, zyloc-type phenol resins, and aralkyl-type phenol resins.
As an amine thermosetting agent which has an amino group, dicyandiamide (DICY) etc. are mentioned, for example.
You may use these thermosetting agents (B12) individually or in combination of 2 or more types.
Among these, it is preferable to contain an amine-based thermosetting agent.

  The content of the thermosetting agent (B12) is preferably 0.1 to 500 parts by mass, more preferably 0.5 to 300 parts by mass, still more preferably 1 to 200 parts by mass with respect to 100 parts by mass of the epoxy compound (B11). It is a mass part.

(Hardening accelerator (B13))
The sheet for resin film formation of one aspect of the present invention may contain a curing accelerator (B13) from the viewpoint of adjusting the curing speed of the sheet by heating.
The curing accelerator (B13) is preferably used in combination with the epoxy compound (B11) as the thermosetting component (B1).

As the curing accelerator (B13), for example, tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol and tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole, Imidazoles such as 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole; such as tributyl phosphine, diphenyl phosphine, triphenyl phosphine and the like Organic phosphines; and tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate.
You may use these hardening accelerators (B13) individually or in combination of 2 or more types.

  The content of the curing accelerator (B13) is 100 parts by mass of the total amount of the epoxy compound (B11) and the thermosetting agent (B12) from the viewpoint of improving the adhesion of the resin film formed from the resin film-forming sheet. The amount is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 6 parts by mass, and still more preferably 0.3 to 4 parts by mass.

(Energy ray curable component (B2))
As the energy ray-curable component (B2), a compound (B21) having a functional group that reacts by energy ray irradiation may be used alone, but in combination with the compound (B21), a photopolymerization initiator (B22) may be used. It is preferred to use. The energy ray curable component (B2) is preferably curable by ultraviolet light.

(Compound (B21) having a functional group capable of reacting by energy ray irradiation)
Examples of the compound (B21) (hereinafter also referred to as “energy ray reactive compound (B21)”) having a functional group capable of reacting by energy ray irradiation include trimethylolpropane tri (meth) acrylate and pentaerythritol tri (meth) Acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxy penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butylene glycol di (meth) acrylate, 1,6-hexanediol di ( Examples include meta) acrylates, oligoester (meth) acrylates, urethane (meth) acrylate oligomers, epoxy (meth) acrylates, polyether (meth) acrylates, itaconic acid oligomers and the like.
These energy ray reactive compounds (B21) may be used alone or in combination of two or more.
The mass average molecular weight (Mw) of the energy ray reactive compound (B21) is preferably 100 to 30,000, more preferably 200 to 20,000, and still more preferably 300 to 10,000.

  The content of the energy ray reactive compound (B21) is preferably 1 to 1500 parts by mass, more preferably 3 to 1200 parts by mass, still more preferably 5 to 1000 parts by mass with respect to 100 parts by mass of the component (A). is there.

(Photoinitiator (B22))
By using the photopolymerization initiator (B22) in combination with the above-mentioned energy ray reactive compound (B21), the polymerization curing time is shortened, and the curing of the resin film forming sheet is advanced even if the light irradiation amount is small. be able to.

Examples of the photopolymerization initiator (B22) include benzoin compounds, acetophenone compounds, acyl phosphine oxide compounds, titanocene compounds, thioxanthone compounds, peroxide compounds and the like.
More specific photopolymerization initiators include, for example, 1-hydroxycyclohexyl phenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile Dibenzyl, diacetyl, β-chloroanthraquinone, 2,4,6-trimethyl benzoyl diphenyl phosphine oxide and the like.
You may use these photoinitiators individually or in combination of 2 or more types.

  The content of the photopolymerization initiator (B22) is based on 100 parts by mass of the energy ray reactive compound (B21) from the viewpoint of sufficiently advancing the curing reaction of the resin film-forming sheet and suppressing the formation of the residue. Preferably it is 0.1-10 mass parts, More preferably, it is 0.5-8 mass parts, More preferably, it is 1-5 mass parts.

In one aspect of the present invention, the content of the curable component (B) in the sheet for resin film formation is preferably 5 to 50% by mass, more preferably the total amount (100% by mass) of the sheet for resin film formation. Preferably it is 8-40 mass%, More preferably, it is 10-30 mass%, More preferably, it is 12-25 mass%.
In addition, said "content of a curable component (B)" is a thermosetting component (B1) containing the above-mentioned epoxy compound (B11), a thermosetting agent (B12), and a hardening accelerator (B13), and And the total content of the energy ray-curable component (B2) containing the energy ray-reactive compound (B21) and the photopolymerization initiator (B22).

[Filler (C)]
It is preferable that the sheet | seat for resin film formation of 1 aspect of this invention contains a filler (C).
By including the filler (C), the surface roughness (Ra) of the surface (α) of the resin film forming sheet can be easily adjusted to the above-mentioned range.
Further, in the resin film-forming sheet containing the filler (C), it is possible to adjust the thermal expansion coefficient of the resin film to be formed within an appropriate range, and to optimize the thermal expansion coefficient of the resin film-coated chip Thus, the reliability of the semiconductor device in which the chip is incorporated can be improved. Moreover, it also becomes possible to reduce the moisture absorption rate of the resin film formed from the said sheet | seat for resin film formation.

As the filler (C), organic fillers such as polymethyl methacrylate filler and rubber particles, and powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride, etc. Inorganic fillers such as spherical beads, single crystal fibers and glass fibers may be mentioned.
You may use these fillers (C) individually or in combination of 2 or more types.
Among these, when the resin film-forming sheet is thermosetting, an inorganic filler is preferable, and silica or alumina is more preferable, from the viewpoint of being excellent in heat resistance.

In one aspect of the present invention, the average particle diameter of the filler (C) is preferably from the viewpoint of easily adjusting the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film to the above range. Is 3 to 20 μm, more preferably 5 to 15 μm.
If the filler has an average particle size in the above range, the surface roughness (Ra) of the surface (α) of the sheet for resin film formation to be formed is the above even if the content of the filler (C) is relatively small. It can be easily adjusted to the range.

However, the filler (C) having a relatively small average particle diameter is used by adding a relatively large content of the filler (C) or using the composition of the composite sheet for resin film formation described later. Even in the case, the surface roughness (Ra) of the surface (α) of the sheet for resin film formation to be formed can be adjusted within the above range.
The average particle diameter of the filler (C) in the above case is preferably 100 to 1000 nm, more preferably 200 to 900 nm, still more preferably 200 to 800 nm, still more preferably 300 to 750 nm, still more preferably 400 ~ 700 nm.
If the average particle diameter of the filler (C) is 100 nm or more, the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film is adjusted in the above range by adjusting the content of the filler (C) Easy to adjust to.

Moreover, if the average particle diameter of a filler (C) is 1000 nm or less, there exists an advantage of the following (1)-(4).
(1) Gloss measured from the surface (β ') of the resin film formed from the sheet for resin film formation after the surface (α) of the sheet for resin film formation is attached to the silicon wafer You can increase the value.
(2) It becomes easy to improve the permeability of electromagnetic waves, such as infrared rays, of the sheet for resin film formation and the above-mentioned resin layer. As a result, when the resin film-forming sheet and the silicon wafer having a resin layer, a chip, or the like are inspected by electromagnetic waves, the permeability of the electromagnetic waves is high, and the efficiency of the inspection operation is improved.
(3) In the process of irradiating the resin film-forming sheet and the silicon wafer having the resin film with a laser, it is possible to easily avoid the problem of the laser diffusion caused by the presence of the resin film-forming sheet and the resin film.
(4) For example, when producing a sheet for forming a resin film having a thickness of 20 μm or less, in the coating step of the composition which is a forming material of the sheet for forming a resin film, the coating caused by the filler having a large particle diameter It is easy to avoid negative effects such as film formation defects.

When the resin film-forming sheet of one embodiment of the present invention is a multilayer formed of two or more compositions, the composition which is the forming material on the surface (α) side of the resin film-forming sheet is It is preferable to mix | blend the filler (C) of the average particle diameter of the said range, and to adjust the surface roughness (Ra) of surface ((alpha)).
On the other hand, the composition that is the forming material on the surface (β) side improves the gloss value measured from the surface (β ′) on the side opposite to the silicon wafer of the resin film formed from the resin film forming sheet. From the viewpoint, it is preferable to blend a filler (C ′) having a small average particle size different from the above range.
The average particle diameter of the filler (C ′) is usually 1 to 400 nm, preferably 1 to 250 nm, more preferably 1 to 100 nm.

  In addition, in this specification, the average particle diameter of filler (C) and (C ') means the value measured using dynamic light scattering type particle size distribution analyzer (Nanotrack Wave-UT 151, Nikkiso Co., Ltd. make) Do.

  In one aspect of the present invention, the content of the filler (C) in the resin film forming sheet is adjusted to the above range for the surface roughness (Ra) of the surface (α) of the resin film forming sheet, and From the viewpoint of improving the reliability of the resin film-coated chip produced using the resin film-forming sheet, preferably 10 to 80 mass% with respect to the total amount (100 mass%) of the resin film-forming sheet More preferably, it is 20-70 mass%, More preferably, it is 30-65 mass%, More preferably, it is 40-60 mass%.

  In one embodiment of the present invention, the total content of the polymer component (A), the curable component (B) and the filler (C) in the resin film-forming sheet is the total amount of the resin film-forming sheet (100 The content is preferably 60% by mass or more, more preferably 70% by mass or more, still more preferably 80% by mass or more, and still more preferably 90% by mass or more.

[Colorant (D)]
The resin film-forming sheet of one embodiment of the present invention may further contain a colorant (D).
When the semiconductor chip having a resin film formed from the resin film forming sheet is incorporated in equipment by containing the colorant (D) in the resin film forming sheet, grinding marks generated during grinding of the semiconductor wafer However, the appearance of the semiconductor chip can be adjusted.

Organic or inorganic pigments and dyes can be used as the colorant (D).
As the dye, for example, any dye such as an acid dye, a reactive dye, a direct dye, a disperse dye, and a cationic dye can be used.
The pigment is not particularly limited and may be appropriately selected from known pigments and used, for example, phthalocyanine-based blue pigment, isoindolinone-based yellow pigment, and diketopyrrolopyrrole-based red pigment, carbon black And black pigments such as iron oxide, manganese dioxide, aniline black, activated carbon and the like.
You may use these coloring agents (D) individually or in combination of 2 or more types.
In addition, by using a phthalocyanine-based blue pigment, an isoindolinone-based yellow pigment, and a diketopyrrolopyrrole-based red pigment in combination, the transmittance of light in the infrared region is improved while the visible light transmittance is low. It is easy to obtain a resin film.

  The average particle diameter of the colorant (D) is preferably 400 nm or less, more preferably 300 nm or less, still more preferably 200 nm or less, still more preferably 100 nm or less, preferably 10 nm or more, more preferably 20 nm or more It is.

  In one aspect of the present invention, the content of the colorant (D) in the resin film-forming sheet is preferably 0.01 to 20 mass%, based on the total amount (100 mass%) of the resin film-forming sheet. More preferably, it is 0.05-15 mass%, More preferably, it is 0.1-10 mass%, More preferably, it is 0.15-5 mass%.

[Coupling agent (E)]
The resin film-forming sheet of one embodiment of the present invention may further contain a coupling agent (E).
By containing a coupling agent (E), water resistance can also be improved, without impairing the heat resistance of the resin film formed from the sheet | seat for resin film formation obtained. Moreover, it contributes also to the improvement of the end part adhesiveness after sticking with a silicon wafer.

As a coupling agent (E), the compound which reacts with the functional group which a component (A) and a component (B) has is preferable, and a silane coupling agent is more preferable.
As a silane coupling agent, for example, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ- (methacryloxy) Propyl) trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-6- (aminoethyl) -γ-aminopropylmethyldiethoxysilane, N -Phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis (3-triethoxysilylpropyl) tetrasulfane, methyltri Methoxysilane And methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazole silane and the like.
You may use these coupling agents (E) individually or in combination of 2 or more types.

As a coupling agent (E), an oligomer type coupling agent is preferable.
The molecular weight of the coupling agent (E) including an oligomer type coupling agent is preferably 100 to 15000, more preferably 150 to 10000, still more preferably 200 to 5000, still more preferably 250 to 3000, and further more Preferably it is 350-2000.

  In one aspect of the present invention, the content of the coupling agent (E) in the resin film-forming sheet is preferably 0.01 to 3.0, based on the total amount (100% by mass) of the resin film-forming sheet. It is mass%, more preferably 0.03 to 1.5 mass%, still more preferably 0.05 to 0.8 mass%, still more preferably 0.1 to 0.3 mass%.

[General purpose additive (F)]
The resin film-forming sheet used in one aspect of the present invention may contain a general-purpose additive (F) as needed in addition to the above components, as long as the effects of the present invention are not impaired.
As a general purpose additive (F), a crosslinking agent, a plasticizer, a leveling agent, an antistatic agent, an antioxidant, an ion scavenger, a gettering agent, a chain transfer agent etc. are mentioned, for example.

  The content of each of these general-purpose additives (F) in the resin film-forming sheet of one embodiment of the present invention is preferably 0 to 10 mass based on the total amount (100 mass%) of the resin film-forming sheet %, More preferably 0 to 5% by mass, further preferably 0 to 2% by mass.

<Method of manufacturing sheet for resin film formation>
There is no restriction | limiting in particular as a manufacturing method of the sheet | seat for resin film formation of this invention, It can manufacture by a well-known method.
For example, after preparing the composition for resin film formation containing the above-mentioned each component used as the formation material of the sheet | seat for resin film formation, an organic solvent is suitably added and diluted, and the solution of the composition for resin film formation is obtained. Then, a solution of the composition for forming a resin film is applied onto a support described later by a known application method to form a coated film, and the coated film is dried to manufacture a sheet for forming a resin film. be able to.

From the viewpoint of adjusting the surface roughness (Ra) of the surface (α) of the sheet for resin film formation to be obtained to the above range, as a method for producing the sheet for resin film formation, a material for forming the resin film formation sheet Applying a resin film-forming composition, which is a resin film-forming composition, onto the surface of a support having a surface having a surface roughness (Ra) of 40 nm or more to form a coating, and drying the coating preferable.
The above-mentioned composition for resin film formation may be suitably added with a solvent and diluted, and may be in the form of a solution of the composition for resin film formation.
The surface roughness (Ra) of the surface of the support is preferably 40 nm or more, more preferably 70 nm or more, still more preferably 100 nm or more, still more preferably 200 nm or more, still more preferably 300 nm or more And preferably 1000 nm or less, more preferably 800 nm or less, and still more preferably 500 nm or less.

  Moreover, when the resin film formation sheet of one aspect of the present invention is a multilayer body, as a method for producing the resin film formation sheet, for example, the composition for resin film formation is formed on two or more supports. It may be a manufacturing method having a step of applying a solution of an object to form a coating, laminating the coating, laminating the coating, and drying.

As an organic solvent used for preparation of the solution of the composition for resin film formation, toluene, ethyl acetate, methyl ethyl ketone etc. are mentioned, for example.
The solid content concentration of the solution of the composition for forming a resin film when an organic solvent is blended is preferably 10 to 80% by mass, more preferably 20 to 70% by mass, and still more preferably 30 to 65% by mass.
Examples of the coating method include spin coating method, spray coating method, bar coating method, knife coating method, roll coating method, roll knife coating method, blade coating method, die coating method, gravure coating method and the like.

<Use of sheet for resin film formation>
The resin film forming sheet of one embodiment of the present invention can be attached to the back surface of a workpiece such as a face-down chip semiconductor wafer or a silicon wafer such as a semiconductor chip, and a resin film can be formed on the workpiece. The resin film has a function as a protective film for protecting the back surface of a workpiece such as a semiconductor wafer or a semiconductor chip. For example, in the case of being attached to a semiconductor wafer, since the resin film has a function of reinforcing the wafer, breakage or the like of the wafer can be prevented.
That is, it is preferable that the sheet for resin film formation of 1 aspect of this invention is a sheet for protective film formation for forming a protective film on a silicon wafer.

Moreover, the resin film formed from the sheet | seat for resin film formation of 1 aspect of this invention can also provide the function as an adhesive sheet. That is, when the resin film formed using the resin film formation sheet of one embodiment of the present invention has a function as an adhesive film, the chip having the resin film is a die pad portion or another semiconductor chip or the like. It can be bonded on a member (on a chip mounting portion), which can contribute to improvement in productivity for manufacturing a semiconductor device.
That is, the sheet for resin film formation of one aspect of the present invention can also be used as a sheet for adhesive film formation for forming an adhesive film on a silicon wafer.

[Configuration of Composite Sheet for Forming Resin Film]
The composite sheet for resin film formation of the present invention (hereinafter, also simply referred to as "composite sheet") has the sheet for resin film formation of the present invention and a support.
In addition, there is no restriction | limiting in particular about the form of the composite sheet of 1 aspect of this invention, For example, you may be forms, such as a label of a elongate tape shape, a single leaf.
FIG. 1 is a cross-sectional view of a composite sheet for resin film formation of one embodiment of the present invention.
Examples of the composite sheet according to one embodiment of the present invention include a composite sheet 1a having a configuration in which a resin film forming sheet 10 is directly laminated on a support 11, as shown in FIG. 1 (a).
The shape of the resin film forming sheet 10 of the composite sheet according to one aspect of the present invention may be any shape that can have substantially the same shape as that of the silicon wafer as the adherend or the shape of the silicon wafer.

  In addition, although the composite sheet 1a of FIG. 1 (a) is the shape where the support body 11 and the sheet | seat 10 for resin film formation are substantially the same, as shown in FIG.1 (b), the sheet | seat 10 for resin film formation. The composite sheet 1 b may be smaller than the shape of the support 11.

Moreover, as a composite sheet of 1 aspect of this invention, as shown in FIG.1 (c), the composite sheet 1c which has the ring-shaped jig adhesive layer 12 is mentioned.
The ring-shaped jig adhesive layer 12 is provided for the purpose of improving the adhesion to a jig such as a ring frame, and is a double-sided pressure-sensitive adhesive sheet having a base material (core material). Or, it can be formed from an adhesive.
In addition, in the composite sheet 1c shown by FIG.1 (c), although the structure which provided the jig adhesive layer 12 further with respect to the composite sheet 1a of Fig.1 (a) is shown, it is an aspect of this invention. As the composite sheet of the present invention, a composite sheet in which a jig adhesive layer 12 is provided on the surface of the support 11 of the composite sheet 1 b of FIG.

As a composite sheet according to one aspect of the present invention, as shown in FIG. 1D, a composite sheet 1d having a configuration in which a resin film forming sheet 10 is sandwiched between two supports 11 and 11 ′ may be used.
In addition, you may provide the support body different from the support body 11 on the surface of the sheet | seat 10 for resin film formation which the composite sheet 1b of FIG.1 (b) exposes similarly to the structure of 1d of composite sheets. .
Similarly, a support different from the support 11 may be provided on the surface of the resin film forming sheet 10 of the composite sheet 1c shown in FIG. 1C and the surface of the jig adhesive layer 12 .

<Support>
The support of the composite sheet according to one aspect of the present invention is a release sheet for preventing adhesion of dust or the like on the surface of the resin film-forming sheet, or for protecting the surface of the resin film-forming sheet in a dicing step or the like. It plays a role as a dicing sheet.

The support used in the present invention preferably has a resin film.
Examples of the resin film include polyethylene films such as low density polyethylene (LDPE) films and linear low density polyethylene (LLDPE) films, ethylene / propylene copolymer films, polypropylene films, polybutene films, polybutadiene films, polymethylpentene Film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene / vinyl acetate copolymer film, ionomer resin film, ethylene (meth) acrylic Acid copolymer film, ethylene (meth) acrylic ester copolymer film, polystyrene film, polycarbonate film , Polyimide films, fluororesin films and the like.
The substrate used in one aspect of the present invention may be a single layer film composed of one type of resin film, or may be a laminated film in which two or more types of resin films are laminated.

Moreover, the above-mentioned resin film may be a crosslinked film.
Moreover, what colored these resin films, or what gave printing etc. can be used.
Furthermore, the resin film may be a sheet formed by extrusion forming a thermoplastic resin, or may be stretched, and a sheet obtained by thinning and curing a curable resin by a predetermined means. May be used.

Among these resin films, a base material including a polypropylene film is preferable from the viewpoint of having expandability because it is excellent in heat resistance and appropriate flexibility, and is easily maintained in pickup ability.
In addition, as a structure of the base material containing a polypropylene film, the single layer structure which consists only of a polypropylene film may be sufficient, and the multilayer structure which consists of a polypropylene film and other resin films may be sufficient.
When the resin film-forming sheet is thermosetting, the resin film constituting the substrate has heat resistance, whereby the damage due to the heat of the substrate can be suppressed, and the occurrence of defects in the manufacturing process of the semiconductor device can be suppressed. .

  When the support is used as a release sheet for preventing adhesion of dust and the like on the surface of a sheet for resin film formation, the support can be easily peeled off from the sheet for resin film formation at the time of sticking to a silicon wafer or at the dicing step. Resin films are preferred.

Moreover, as the said support body, you may use the resin film which performed the peeling process on the surface of the above-mentioned resin film.
As the method of the said peeling process, the method of providing the peeling film formed from the peeling agent on the surface of the above-mentioned resin film is preferable.
Examples of the release agent include release agents containing a resin selected from acrylic resins, alkyd resins, silicone resins, fluorine resins, unsaturated polyester resins, polyolefin resins, wax resins and the like. .

When the support is used as a dicing sheet for fixing a sheet for resin film formation in a dicing step or the like, as the support, a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive on the above-mentioned resin film is preferable. .
As the adhesive resin contained in the adhesive, when focusing on the structure of the adhesive resin, for example, acrylic resin, urethane resin, rubber resin, silicone resin, vinyl ether resin, etc. may be mentioned. When attention is paid, for example, an energy ray curable resin and the like can be mentioned.
In one aspect of the present invention, a pressure-sensitive adhesive containing an energy ray-curable resin is preferable from the viewpoint of improving the pickup property.

The thickness of the support is appropriately selected depending on the use, but is preferably 10 to 500 μm, more preferably 20 to 350 μm, and still more preferably 30 to 200 μm.
In addition, not only the thickness of the resin film which comprises a support body but when it has an adhesive layer or a peeling film, the thickness of said support body also includes the thickness of the said adhesive layer or a peeling film.

<Jig adhesive layer>
The jig adhesive layer can be formed from a double-sided pressure-sensitive adhesive sheet having a substrate (core material) or a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive.
As the said base material (core material), the resin film which can be used as the above-mentioned base material is mentioned, A polypropylene film is preferable.
Moreover, as said adhesive agent, acrylic resin, urethane type resin, rubber-type resin, silicone resin, vinyl ether type resin etc. are mentioned, for example.
The thickness of the jig adhesive layer is preferably 1 to 80 μm, more preferably 5 to 60 μm, and still more preferably 10 to 40 μm.

[Composite Sheet for Forming Resin Film of Another Embodiment of the Present Invention]
As another aspect of the present invention, the following composite sheet for resin film formation (hereinafter, also referred to as “composite sheet (1)”) can be mentioned.
The composite sheet (1) according to one aspect of the present invention is attached to a silicon wafer, and has a resin film forming sheet for forming a resin film on the silicon wafer and a support (I). It has the same configuration as the composite sheets 1a to 1d shown in FIG. 1 described above.
However, in the composite sheet (1), the surface (α) of the resin film-forming sheet on the side to be attached to the silicon wafer and the surface (i) of the support (I) having a surface roughness of 40 nm or more are directly It has a stacked structure.
On the surface (α) of the sheet for resin film formation that appears when the support (I) is removed from the composite sheet (1), the surface roughness formed on the surface (i) of the support (I) As the unevenness (Ra) of 40 nm or more is equivalent or shows a surface roughness (Ra) smaller than the surface roughness (Ra) formed on the surface (i) of the support (I) , Considered to be migrated.
Therefore, the surface roughness (Ra) of the surface (α) of the sheet for resin film formation after removing the support (I) from the composite sheet (1) is not less than a predetermined value at which the reworkability improvement effect is exhibited. It is considered to have an effect of improving reworkability as in the case of the resin film-forming sheet of the present invention described above.

It is preferable that the sheet for resin film formation which the composite sheet (1) which is 1 aspect of this invention has has thermosetting.
In the case of a thermosetting resin sheet, it is easy to deform the asperity shape of the surface (α) of the resin film forming sheet in the heating step after the resin film forming sheet is attached to the silicon wafer. At the interface with the silicon wafer, voids due to the uneven shape of the surface (α) of the sheet for resin film formation are unlikely to occur. As a result, in the resin film formed on the silicon wafer, it is possible to suppress the scattering of the light beam caused by the air gap, and visual observation or inspection of the silicon wafer or chip having the resin film by electromagnetic waves such as infrared rays. Becomes easy.
The resin film-forming sheet of the composite sheet (1) according to one aspect of the present invention preferably contains the above-mentioned thermosetting component (B1) from the viewpoint of imparting thermosetting properties.

  The surface roughness (Ra) of the resin film-forming sheet after removal of the support (I) of the composite sheet (1) is preferably 40 nm or more, more preferably 45 nm or more, still more preferably 50 nm or more, More preferably, it is 53 nm or more, more preferably 55 nm or more, and preferably 200 nm or less, more preferably 150 nm or less, still more preferably 100 nm or less.

  The surface roughness (Ra) of the surface (i) of the support (I) is preferably 40 nm or more, more preferably 70 nm or more, still more preferably 100 nm or more, still more preferably 200 nm or more, still more preferably It is 300 nm or more, preferably 1000 nm or less, more preferably 800 nm or less, and still more preferably 500 nm or less.

  The support (I) of the composite sheet (1) is not particularly limited as long as it is a support which is surface-treated so that the surface roughness (Ra) falls within the above-mentioned range and which can be peeled off. It is preferable that it is comprised from a resin film from a viewpoint of reducing the possibility of generation | occurrence | production of dust from being comprised.

As a method of adjusting the surface roughness (Ra) of the surface (i) of the support (I), for example, a method of containing a filler in a resin film constituting the support (I), and a method of including a filler The method etc. which provide the peeling film formed from the peeling agent are mentioned.
When the support (I) is composed of a resin film produced by melt extrusion, the molten resin is injected onto a roll having a rough surface shape, and the surface roughness (Ra) is in the above range. It is good also as the adjusted resin film.
Besides, as a forming material of the support (I), using a material such as paper or non-woven fabric which makes the surface rough due to its properties, the surface roughness (Ra) of the surface (i) of the support (I) is adjusted May be

In addition, the composite sheet (1) has a second support on the surface (β) opposite to the surface (α) of the sheet for resin film formation as the composite sheet 1d shown in FIG. 1 (d). It may be a composite sheet having a configuration in which the body (II) is directly laminated.
It is preferable that the resin film-forming sheet included in the composite sheet has thermosetting properties. Therefore, it is preferable that the said sheet | seat for resin film formation contains the above-mentioned thermosetting component (B1).

In addition, as shown to FIG. 1 (d), in the composite sheet (1) which has the structure which the sheet | seat for resin film formation was pinched | interposed by support body (I) and support body (II), the surface of the sheet for resin film formation. After sticking (α) to a silicon wafer, the support (II) is not peeled off, and the resin film-forming sheet is thermally cured in a state where the support (II) and the resin film-forming sheet are laminated. The gloss value measured from the surface (β ′) of the formed resin film on the side opposite to the silicon wafer tends to be high. The said gross value peels the gloss value of the surface ((beta) ') of the resin film formed using the composite sheet which does not have a support body (II), and a support body (II), The surface of the sheet for resin film formation It becomes higher than the gloss value of the surface ((beta) ') of the resin film formed by thermosetting in the state which ((beta)) was made to expose.
That is, for example, even when the gloss value of the surface (β ′) of the resin film is lowered due to the use of the filler having a large average particle diameter as the filler (C), the composite sheet ( After sticking 1) to a silicon wafer, the support (II) is not peeled off, and the resin film formation sheet is thermally cured in a state where the support (II) and the resin film formation sheet are laminated. And a resin film having high visibility of laser printing can be formed.
In order to make the sheet for resin film formation to have a thermosetting property, the sheet for resin film formation may contain the above-mentioned thermosetting component (B1).

Examples of the support (II) include the same as the support of the composite sheet of the present invention described above. Specifically, the above-mentioned resin film, resin film having a release film, and pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer Etc.
When the support (II) is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer, the composite sheet (1) has a structure in which the pressure-sensitive adhesive layer and the surface (β) of the sheet for resin film formation are directly laminated. It is preferable to have. In the configuration, the pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive containing an energy ray-curable resin, and energy beam irradiation is performed in advance to cure the pressure-sensitive adhesive layer, whereby the support (II) and the resin film-forming sheet By thermally curing the resin film-forming sheet in the laminated state, it is possible to improve the gloss value of the surface (β ′) of the resin film to be formed.

[Regeneration method of silicon wafer]
As a method of peeling the said resin film formation sheet from the laminated body in which the silicon wafer and the surface (alpha) of the resin film formation sheet of this invention were stuck, the following process (1) is mentioned, for example There may be mentioned a method of regenerating a silicon wafer having (2).
Step (1): The surface of the pressure-sensitive adhesive sheet having a substrate and a pressure-sensitive adhesive layer opposite to the surface (α) of the sheet for resin film formation of the laminate, which is attached to the silicon wafer Step (2) of sticking on the upper surface: step of peeling the sheet for resin film formation stuck to the silicon wafer by pulling the pressure-sensitive adhesive sheet stuck in step (1)

The above-described silicon wafer recycling method has excellent reworkability such that the silicon wafer can be peeled without being damaged and leaving a residue when it is to be peeled after being attached to the silicon wafer. The property of the sheet for resin film formation of the present invention is utilized.
In addition, the method of regenerating the silicon wafer is not only a laminated body immediately after the silicon wafer and the surface (α) of the resin film forming sheet of the present invention are attached, but also silicon for about 24 hours after attachment. The present invention can also be applied to a laminate in a state in which the adhesion between the wafer and the resin film forming sheet is improved.

<Step (1)>
In the step (1), the pressure-sensitive adhesive layer of a pressure-sensitive adhesive sheet having a substrate and a pressure-sensitive adhesive layer is the surface opposite to the surface (α) attached to the silicon wafer of the resin film-forming sheet of the laminate (beta) is a process to stick on.
The silicon wafer is not limited to the wafer before being singulated, but for example, a pre-dicing method, that is, a groove is provided from the surface opposite to the surface to be ground of the silicon wafer, and the silicon wafer is ground to reach the groove The chip may be singulated according to the method of singulating the chip into chips.

The pressure-sensitive adhesive sheet used in this step has a substrate and a pressure-sensitive adhesive layer. When the composite sheet (1) having a support (II) made of a pressure-sensitive adhesive sheet is attached to a silicon wafer, the support (II) may be used as the "pressure-sensitive adhesive sheet" in this step.
As the said base material, a resin film is preferable and the resin film illustrated by the item of the above-mentioned support body is mentioned.
The pressure-sensitive adhesive that forms the pressure-sensitive adhesive layer is not particularly limited as long as it has an adhesive strength that allows the resin film-forming sheet to be peeled off from the silicon wafer in step (2).
As a specific adhesive, an acrylic adhesive, a urethane adhesive, a silicone adhesive etc. are mentioned, for example.

  The shape of the pressure-sensitive adhesive sheet is not particularly limited, but from the viewpoint of operability in the next step (2), a pressure-sensitive adhesive sheet having the same shape as the resin film-forming sheet or a shape larger than the resin film-forming sheet Is preferred.

  As a method of affixing the surface ((beta)) and the adhesive layer of an adhesive sheet in this process, you may attach using a machine and you may carry out manually.

  The surface (α) of the resin film-forming sheet of the composite sheet of one embodiment of the present invention described above is attached to a silicon wafer, and an adhesive sheet such as a dicing sheet is already laminated as a support on the surface (β) side. If it is, the pressure-sensitive adhesive sheet can also be used as a pressure-sensitive adhesive sheet in this step.

<Step (2)>
The step (2) is a step of pulling the pressure-sensitive adhesive sheet attached in the step (1) to peel off the resin film-forming sheet attached to the silicon wafer.
In this step, the surface roughness (Ra) of the surface (α) attached to the silicon wafer of the resin film-forming sheet of the present invention is adjusted to the above range, so the surface (β) in step (1) By pulling the pressure-sensitive adhesive sheet attached to the sheet, the resin film forming sheet is also pulled together, and the resin film forming sheet can be peeled off from the silicon wafer.

There is no restriction | limiting in particular as a peeling speed and peeling angle of an adhesive sheet, It can set suitably.
In this step, the pressure-sensitive adhesive sheet may be pulled using a machine, but from the viewpoint of operability, it is preferable to manually pull the pressure-sensitive adhesive sheet to separate the resin film-forming sheet from the silicon wafer.

In this step, after peeling the resin film-forming sheet, the surface of the silicon wafer may be washed with an organic solvent such as ethanol, if necessary.
Through the above steps, the silicon wafer to which the resin film forming sheet has been attached can be regenerated.

<Measurement of mass average molecular weight (Mw), number average molecular weight (Mn)>
It measured on condition of the following using the gel permeation chromatograph apparatus (Tosoh Corp. make, brand name "HLC-8220GPC"), and the value measured by standard polystyrene conversion was used.
(Measurement condition)
・ Column: “TSK guard column HXL-L”, “TSK gel GMHXL (× 2)”, “TSK gel G2000 HXL” (all manufactured by Tosoh Corporation) • Column temperature: 40 ° C.
-Developing solvent: tetrahydrofuran-Flow rate: 1.0 mL / min

<Average Particle Size of Components in Composition for Forming Resin Film>
It measured using the dynamic light scattering type particle size distribution analyzer (The Nikkiso Co., Ltd. make, product name "Nanotrack Wave-UT151").

<Measurement of surface roughness (Ra)>
The surface roughness (Ra) of the surface to be measured was measured at a magnification of 10 times in PSI mode using an optical interference surface shape measurement apparatus (manufactured by Veeco Metrology Group, product name “WYKO WT1100”).

<Evaluation of reworkability of sheet for resin film formation>
A silicon wafer (diameter: 200 mm) obtained by removing the support (I) possessed by the composite sheet for resin film formation prepared in Examples and Comparative Examples and exposing the surface (α) of the sheet for resin film formation exposed On a polished surface having a thickness of 280 μm, it was laminated and attached while heating at 70 ° C. using a tape mounter (manufactured by Lintec Co., Ltd., product name “Adwill RAD-3600 F / 12”).
After pasting, the support (II) of the composite sheet for resin film formation is also removed at room temperature (25 ° C.), and a general-purpose dicing tape (commercially available from Lintec Co., Ltd.) on the surface of the sheet for resin film formation exposed. , The adhesive layer side of brand name "Adwill D-510T") was stuck.
Then, by pulling the general-purpose dicing tape by hand, it was observed whether or not the resin film forming sheet could be peeled off from the silicon wafer together, and the presence or absence of the residue on the surface of the silicon wafer after peeling was observed. The reworkability of the resin film-forming sheet was evaluated based on the following criteria.
A: The resin film forming sheet could be completely peeled off from the silicon wafer. In the silicon wafer after peeling, no residue of the resin film-forming sheet which can be visually confirmed was observed.
B: The resin film forming sheet could be peeled off from the silicon wafer. Although some residue of the resin film-forming sheet was observed on the silicon wafer after peeling, it was a level that could be completely removed by wiping with ethanol.
C: Even if the silicon wafer is broken during peeling or the silicon wafer is peeled without breakage, the resin film-forming sheet remains on the silicon wafer after peeling to such an extent that it is difficult to wipe with ethanol. The thing was confirmed.

<Measurement of gloss value of resin film>
A silicon wafer (diameter 200 mm, diameter # 200 mm) obtained by removing the support (I) possessed by the composite sheet for resin film formation prepared in Examples and Comparative Examples and exposing the surface (α) of the sheet for resin film formation exposed It laminated | stacked on the grinding | polishing surface of thickness 280 micrometers, and it affixed, heating at 70 degreeC, using the tape mounter (The Lintec Co., Ltd. make, product name "Adwill RAD-3600 F / 12").
After pasting, the support (II) of the composite sheet for resin film formation was also removed, and the sheet was placed in a heating oven at 130 ° C. for 2 hours to cure the sheet for resin film formation, and a resin film was formed on the silicon wafer.
Then, using a gloss meter (manufactured by Nippon Denshoku Kogyo Co., Ltd., product name “VG 2000”), according to JIS Z 8741, 60 degrees of the surface of the resin film formed from the side opposite to the silicon wafer side. The specular gloss was measured. The value of the specular gloss was taken as the gloss value of the resin film.

<Measurement of light transmittance of 1250 nm wavelength of resin film>
The support (I) of the composite sheet for resin film formation produced in the examples and comparative examples is removed, and the surface (α) of the sheet for resin film formation exposed is the flat surface of a glass plate having a thickness of 2 mm. And laminated while heating at 70.degree. C. using a laminator.
After pasting, the support (II) of the composite sheet for resin film formation was also removed, and was put into a heating oven at 130 ° C. for 2 hours to cure the sheet for resin film formation, and a resin film was formed on the glass plate.
Then, using a spectrophotometer (manufactured by Shimadzu Corporation, product name “UV-VIS-NIR SPECTROPHOTOMETER UV-3600”), the transmittance of the resin film on the glass plate is measured, and the light transmittance at a wavelength of 1250 nm (%) Was extracted.
For measurement, measurement was performed using a large sample chamber “MPC-3100” (product name) attached to the above-mentioned spectrophotometer, without using a built-in integrating sphere. The light transmittance of the resin film at a wavelength of 1250 nm was calculated by taking the difference from the light transmittance of the wavelength of 1250 nm of only the glass plate measured in advance.

Example 1
Each component of the type and blending amount shown in Table 1 was added and diluted with methyl ethyl ketone to prepare a solution of a composition for forming a resin film with an active ingredient concentration of 51% by mass.
Then, as the support (II), the above-mentioned resin is formed on the release-treated surface of a polyethylene terephthalate (PET) film (Lintec Co., Ltd., trade name “SP-PET 381031”, thickness: 38 μm) subjected to release treatment. A solution of the composition for film formation was applied and dried to form a sheet for resin film formation with a thickness of 25 μm.
Furthermore, on the exposed surface of the formed sheet for resin film formation, as a support (I), release paper (Lintech Co., Ltd., trade name “SP-8LK Ao”, thickness: 88 μm, glassine paper) A polyolefin-coated, silicone-peel treated, and a peel-treated surface of the peel-treated surface (Ra) = 370 nm are attached to each other to form a laminator (product name "VA-400" manufactured by Taisei Laminator Co., Ltd.) It laminated using room temperature (25 degreeC), and produced the composite sheet for resin film formation comprised from the support body (I) / sheet | seat for resin film formation / support body (II).

Comparative Example 1
A polyethylene terephthalate (PET) film (Lintech Co., Ltd., trade name) as a support (I) on the exposed surface of the resin film-forming sheet formed in the same manner as Example 1 In the same manner as in Example 1 except that a release-treated surface of “SP-PET 251130” and a thickness of 25 μm was laminated, it was constituted of a support (I) / a sheet for resin film formation / a support (II) The composite sheet for resin film formation was produced.

The detail of each component of Table 1 used for preparation of the composition for resin film formation is as follows.
<Polymer component (A)>
· (A-1): Acrylic copolymer (BA /) obtained by copolymerizing methyl acrylate (MA), n-butyl acrylate (BA), glycidyl methacrylate (GMA), and 2-hydroxyethyl acrylate (HEA) MA / GMA / HEA = 37/28/20/15 (% by mass), Mw = 800,000, Tg = -10.1 ° C.).
<Curable component (B)>
-(B-1): bisphenol A type epoxy resin (Mitsubishi Chemical Co., Ltd. make, brand name "jER 828", epoxy equivalent = 184 to 194 g / eq, Mn = 370, viscosity at 25 ° C = 120 to 150 P (12 to 15 Pa) S) Liquid epoxy resin, a compound corresponding to the component (B11)).
-(B-2): bisphenol A type epoxy resin (Mitsubishi Chemical Corporation make, brand name "jER1055", epoxy equivalent = 800-900 g / eq, Mn = 1600, a solid epoxy resin, it corresponds to the said component (B11) Compound).
-(B-3) Dicyclopentadiene type epoxy resin (made by DIC Corporation, trade name "Epiclon HP-7200HH", epoxy equivalent = 255 to 260 g / eq, compound having Mw less than 20,000, solid epoxy resin, said component Compounds corresponding to (B11)).
-(B-4): Dicyandiamide (made by ADEKA, trade name "ADECAHARDNER EH-3636AS", an amine curing agent, active hydrogen content = 21 g / eq, a compound corresponding to the component (B12)).
(B-5): 2-phenyl-4,5-dihydroxymethylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name "Cuazole 2PHZ", a curing accelerator, a compound corresponding to the component (B13)).
<Filler (C)>
-(C-1): Silica filler (made by Admatex Co., Ltd., trade name "SC2050MA", average particle diameter = 500 nm).
<Colorant (D)>
-(D-1): carbon black (The Mitsubishi Chemical Corporation make, brand name "# MA650", average particle diameter = 28 nm).
<Silane coupling agent (E)>
(E-1): Silane coupling agent (3-glycidoxypropylmethyldimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., trade name "KBM-402", Mn = 220.3).

  Table 1 shows the results of measurement and evaluation of the physical properties of the resin film-forming sheets produced in Examples and Comparative Examples based on the above-described method.

According to Table 1, the sheet for resin film formation which the composite sheet for resin film formation produced in Example 1 which is an aspect of the present invention has excellent reworkability. Moreover, the resin film formed from the said sheet | seat for resin film formation also became a high value of the light transmittance of wavelength 1250 nm, and a gloss value.
On the other hand, the resin film forming sheet possessed by the composite sheet for resin film formation prepared in Comparative Example 1 may be peeled off after being attached to a silicon wafer because the surface roughness (Ra) of the surface (α) is small. It was difficult and resulted in poor reworkability.

  The sheet for resin film formation according to one aspect of the present invention is suitable as a material for forming a protective film for protecting the back surface of a semiconductor chip, or as a material for forming an adhesive film capable of adhering onto a die pad portion or other part.

1a, 1b, 1c, 1d Composite sheet 10 for resin film formation Sheet 11 for resin film formation 11 'Support 12 jig adhesive layer

Claims (13)

A sheet for forming a resin film, which is attached to a silicon wafer and for forming a resin film on the silicon wafer,
10 to 51.1% by mass of filler (C) based on the total amount of the resin film-forming sheet,
The sheet for resin film formation whose surface roughness (Ra) of the surface ((alpha)) of the said sheet | seat for resin film formation of the side stuck to a silicon wafer is 40 nm or more.   The sheet for resin film formation of Claim 1 containing a polymer component (A) and a curable component (B).   The sheet for resin film formation according to claim 2, wherein the polymer component (A) contains an acrylic polymer (A1).   The sheet for resin film formation of any one of Claims 1-3 containing a thermosetting component (B1).   The sheet for resin film formation of any one of Claims 1-4 whose average particle diameter of a filler (C) is 100-1000 nm.   The resin film forming sheet according to any one of claims 1 to 5, which is a protective film forming sheet for forming a protective film on a silicon wafer.   After the surface (α) of the sheet for resin film formation is attached to a silicon wafer, the gloss value measured from the surface (β ′) of the resin film formed from the sheet for resin film formation is opposite to the silicon wafer The sheet for resin film formation of any one of Claims 1-6 used as 25 or more.   The composite sheet for resin film formation which has a sheet | seat for resin film formation of any one of Claims 1-7, and a support body. It has a resin film forming sheet attached to a silicon wafer for forming a resin film on the silicon wafer, and a support (I).
The resin film-forming sheet contains 10 to 51.1% by mass of a filler (C) with respect to the total amount of the resin film-forming sheet,
Resin film formation having a structure in which the surface (α) of the resin film-forming sheet to be attached to a silicon wafer and the surface (i) of the support (I) having a surface roughness of 40 nm or more are directly laminated Composite sheet.   The surface roughness (Ra) of the surface (α) of the sheet for resin film formation which is exposed when the support (I) of the composite sheet for resin film formation is removed is 40 nm or more. The composite sheet for resin film formation of description.   The composite sheet for resin film formation of Claim 9 or 10 in which the said sheet | seat for resin film formation contains a thermosetting component (B1). The second support (II) is directly laminated on the surface (β) opposite to the surface (α) of the resin film-forming sheet,
The composite sheet for resin film formation of Claim 9 or 10 in which the said sheet | seat for resin film formation contains a thermosetting component (B1).   The resin film according to claim 12, wherein the support (II) is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer and the surface (β) of the sheet for resin film formation are directly laminated. Composite sheet for formation.