KR102499451B1 - Sheet for forming resin film and composite sheet for forming resin film - Google Patents

Abstract

The present invention is a sheet applied to a silicon wafer to form a resin film on the silicon wafer, wherein the surface roughness (Ra) of the surface (α) of the sheet on the side to be adhered to the silicon wafer is 40 nm or more. A sheet for forming a resin film that is a sheet for forming a resin film having excellent reworkability, and a composite sheet for forming a resin film having a structure in which the sheet for forming a resin film and a support are directly laminated are provided.

Description

Sheet for forming resin film and composite sheet for forming resin film {SHEET FOR FORMING RESIN FILM AND COMPOSITE SHEET FOR FORMING RESIN FILM}

The present invention relates to a sheet for forming a resin film and a composite sheet for forming a resin film.

In recent years, manufacturing of semiconductor devices using a mounting method called a so-called face down method has been performed. In the face-down method, a semiconductor chip having electrodes such as bumps on a circuit surface (hereinafter, simply referred to as "chip") is used, and the electrode is bonded to the substrate. For this reason, the surface on the opposite side to the circuit surface of the chip (hereinafter also referred to as "rear surface of the chip") may be exposed.

A resin film containing an organic material is formed on the exposed rear surface of the chip, and it may be incorporated into a semiconductor device as a chip having the resin film. The resin film is formed as a protective film for preventing cracks after a dicing process or packaging, or as an adhesive film for bonding the obtained chip onto another member such as a die pad portion or another semiconductor chip.

In general, a chip having a resin film is obtained by coating a solution of a composition containing a resin on the back surface of a wafer by a spin coating method or the like to form a coating film, and then drying and curing the coating film to form a resin film. It is manufactured by dicing a wafer.

Various resin film formation sheets have been proposed as materials for forming a protective film or an adhesive film formed on the back surface of a chip or wafer.

For example, in Patent Document 1, an energy ray curable protective film forming layer containing a polymer component containing an acrylic copolymer, an energy ray curable component, a dye or pigment, an inorganic filler, and a photopolymerization initiator is sandwiched between two release sheets. A chip protection film having a is disclosed.

According to the description of Patent Document 1, the chip protection film can form a protective film with improved laser marking recognition, hardness, and adhesion to a wafer by irradiation with energy rays, and compared to conventional chip protection films, the process is Simplification is possible.

Further, in Patent Literature 2, a dicing tape-integrated wafer back surface protective film having a dicing tape having a base material and an adhesive layer, and a wafer back surface protective film that is colored and has a predetermined elastic modulus on the pressure-sensitive adhesive layer of the dicing tape. This is disclosed.

According to the description of Patent Literature 2, it is said that the wafer back surface protective film can exert excellent holding power with a semiconductor wafer in the dicing process of a semiconductor wafer.

Japanese Unexamined Patent Publication No. 2009-138026 Japanese Unexamined Patent Publication No. 2010-199543

However, in the process of attaching the protective film disclosed in Patent Literatures 1 and 2 on the wafer, when the protective film is adhered to, the position of the protective film is shifted, or the protective film is attached so that the foreign matter is included without noticing the foreign matter on the wafer. , It is difficult to rework the wafer by peeling off the protective film.

Since the protective films disclosed in Patent Literatures 1 and 2 are aimed at improving adhesion to the wafer at the time of attachment and holding power with the wafer after attachment, once attached on the wafer, adhesion to the wafer is high, so rework There is a problem with sex. When trying to forcibly peel off the protective film once attached on a wafer, the peeling force may damage the wafer or leave a part of the protective film on the wafer. Therefore, it is difficult to reuse the protective film and the attached wafer once.

That is, in Patent Literatures 1 and 2, the described protective films are examined from the viewpoint of adhesion to the wafer at the time of attachment and holding power with the wafer after attachment, but no examination regarding the reworkability of the protective film has been made. not.

The present invention has been made in view of the above problems, and an object thereof is to provide a sheet for forming a resin film having excellent reworkability, and a composite sheet for forming a resin film having the sheet for forming a resin film and a support.

The inventors of the present invention have found that a sheet for forming a resin film in which the surface roughness of the surface to which a silicon wafer is attached is adjusted to a predetermined value or more can solve the above problems, and completed the present invention.

That is, the present invention provides the following [1] to [15].

[1] A sheet attached to a silicon wafer to form a resin film on the silicon wafer,

A sheet for forming a resin film, wherein a surface roughness (Ra) of the surface (α) of the sheet on the side to be adhered to the silicon wafer is 40 nm or more.

[2] The sheet for forming a resin film according to [1], comprising a polymer component (A) and a curable component (B).

[3] The sheet for forming a resin film according to [2], wherein the polymer component (A) contains an acrylic polymer (A1).

[4] The sheet for forming a resin film according to any one of [1] to [3], containing a thermosetting component (B1).

[5] The sheet for forming a resin film according to any one of [1] to [4], including a filler (C).

[6] The sheet for forming a resin film according to [5], wherein the content of the filler (C) is 10 to 80% by mass with respect to the total amount of the sheet for forming a resin film.

[7] The sheet for forming a resin film according to [5] or [6], wherein the filler (C) has an average particle diameter of 100 to 1000 nm.

[8] The sheet for forming a resin film according to any one of [1] to [7], which is a sheet for forming a protective film for forming a protective film on a silicon wafer.

[9] After attaching the surface (α) of the sheet for forming a resin film to a silicon wafer, the gloss value of the resin film formed from the sheet for forming a resin film measured from the surface (β') on the opposite side to the silicon wafer is 25 The sheet for forming a resin film according to any one of the above [1] to [8].

[10] A composite sheet for forming a resin film, comprising the sheet for forming a resin film according to any one of [1] to [9] above, and a support.

[11] A sheet for forming a resin film attached to a silicon wafer to form a resin film on the silicon wafer, and a support (I),

A composite sheet for forming a resin film having a configuration in which a surface (α) of the sheet for forming a resin film on a side to be attached to a silicon wafer and a surface (i) of a support (I) having a surface roughness of 40 nm or more are directly laminated.

[12] The surface roughness (Ra) of the surface (α) of the sheet for forming a resin film exposed when the support (I) of the composite sheet for forming a resin film is removed is 40 nm or more, according to [11] above. Composite sheet for forming resin film.

[13] The composite sheet for forming a resin film according to [11] or [12], wherein the sheet for forming a resin film contains a thermosetting component (B1).

[14] has a configuration in which a second support (II) is further directly laminated on the surface (β) on the opposite side to the surface (α) of the sheet for forming a resin film,

The composite sheet for forming a resin film according to [11] or [12], wherein the sheet for forming a resin film contains a thermosetting component (B1).

[15] The resin film formation according to [14] above, wherein the support (II) is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer and the surface (β) of the sheet for forming a resin film are directly laminated. composite sheet.

The sheet for forming a resin film of the present invention has excellent reworkability. Therefore, when it is determined that re-attachment is necessary after the sheet for forming a resin film of the present invention has been once attached to a silicon wafer, the sheet for forming a resin film is peeled off while suppressing generation of residues without damaging the silicon wafer. Therefore, the sheet for forming a resin film can be reused for the silicon wafer after separation.

In the present specification, "reworkability of the sheet for forming a resin film" means that the sheet for forming a resin film remains on the silicon wafer without damaging the silicon wafer when peeling again after attaching to the silicon wafer. It refers to the property that can be peeled off without causing it.

1 is a cross-sectional view of a composite sheet for forming a resin film of one embodiment of the present invention.

In the description of this specification, the values of the mass average molecular weight (Mw) and number average molecular weight (Mn) of each component are values in terms of standard polystyrene measured by gel permeation chromatography (GPC). It is a value measured based on the described method.

In this specification, for example, "(meth)acrylate" is used as a term representing both "acrylate" and "methacrylate", and the same applies to other similar terms.

In addition, in this specification, an "energy ray" refers to an ultraviolet ray, an electron beam, etc., for example.

[Sheet for Forming Resin Film]

The sheet for forming a resin film of the present invention is a sheet for forming a resin film on a silicon wafer by being adhered to a silicon wafer, and the surface roughness (Ra) of the surface (α) of the sheet on the side to be adhered to the silicon wafer is Hereinafter, simply referred to as “surface roughness (Ra) of the surface (α)”) is 40 nm or more.

Since the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film of the present invention is 40 nm or more, even after the sheet for forming a resin film is once attached to a silicon wafer, the silicon wafer is not damaged, and the residue is not damaged. The sheet for resin film formation can be peeled off while suppressing generation, and the reworkability is excellent.

On the other hand, if the sheet for forming a resin film having a surface roughness (Ra) of the surface α of less than 40 nm is attached to a silicon wafer and then peeled off, residues of the sheet for forming a resin film may be generated on the silicon wafer. . In addition, there are cases in which the silicon wafer is damaged when it is forcibly peeled off.

From the above viewpoint, the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film of the present invention is preferably 45 nm or more, more preferably 50 nm or more, even more preferably 53 nm or more, still more preferably It is preferably 55 nm or more.

In addition, the upper limit of the surface roughness (Ra) of the surface (α) is not particularly limited from the viewpoint of improving the reworkability.

However, from the viewpoint of obtaining a sheet for forming a resin film having good adhesion to a silicon wafer, the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film of the present invention is preferably 150 nm or less, more preferably is 100 nm or less, more preferably 80 nm or less.

In this specification, the surface roughness (Ra) of the surface (α) means a value measured by the method described in Examples.

The surface roughness (Ra) of the surface (α) can be adjusted, for example, by appropriately setting the type, average particle diameter, and content of particulate components such as fillers and colorants that can be contained in the sheet for forming a resin film. Moreover, it can be adjusted also by bonding a support body with a rough surface.

In one embodiment of the present invention, the surface roughness (Ra) of the surface (β) on the opposite side to the surface (α) of the sheet for forming a resin film is not particularly limited, but is preferably 5 to 80 nm, more preferably is 8 to 60 nm, more preferably 10 to 45 nm).

If it is within the said range, it becomes easy to adjust the gloss value of the surface ((beta)') of the later-mentioned resin film formed from the sheet|seat for resin film formation high. Further, when inspecting a silicon wafer having a resin film formed from a sheet for forming a resin film or a chip obtained from the silicon wafer by electromagnetic waves such as infrared rays, the electromagnetic wave permeability can be increased.

After attaching the surface (α) of the sheet for forming a resin film of one embodiment of the present invention to a silicon wafer, the gloss value measured from the surface (β') of the resin film formed from the sheet for forming a resin film on the opposite side to the silicon wafer is preferably 25 or more, more preferably 30 or more, still more preferably 35 or more, still more preferably 40 or more.

If the gloss value of the surface (β') of the resin film is 25 or more, it can be set as a resin film excellent in the visibility of laser printing.

In one embodiment of the present invention, the light transmittance of the sheet for forming a resin film and the resin film formed from the sheet for forming a resin film at a wavelength of 1250 nm is preferably 25% or more, more preferably 30% or more, still more preferably is 35% or more, and even more preferably 40% or more.

When the light transmittance is 25% or more, infrared transmittance becomes good, and infrared inspection can be performed on the sheet for forming a resin film or a silicon wafer or chip provided with a resin film formed from the sheet for forming a resin film. That is, since cracks and the like generated in silicon wafers or chips can be easily found through the sheet for forming a resin film or the resin film, the product yield can be improved.

In addition, the light transmittance of the sheet for forming a resin film at a wavelength of 1250 nm means a value measured by the method described in Examples.

The shape of the sheet for forming a resin film of the present invention is not particularly limited, and may be, for example, in the form of a long tape or a single leaf label.

Moreover, the sheet|seat for resin film formation of this invention may be a single layer body formed from 1 type of composition, or the multilayer body formed from 2 or more types of compositions may be sufficient as it.

In addition, when the sheet for forming a resin film of one embodiment of the present invention is a multilayer body, the composition (α'), which is a forming material on the surface (α) side, contains components so that the surface roughness (Ra) of the surface (α) falls within the above range. It is preferable to adjust the type or compounding amount.

In one embodiment of the present invention, the thickness of the sheet for forming a resin film is appropriately set depending on the application, preferably 1 to 300 μm, more preferably 3 to 250 μm, still more preferably 5 to 200 μm, More preferably, it is 7-150 micrometers.

In addition, especially when the thickness of the silicon wafer to which the sheet for forming a resin film is attached is thin, the thickness of the sheet for forming a resin film is preferably 1 to 20 µm, more preferably 3 to 15 µm.

Further, even when the sheet for forming a resin film is a multilayer body composed of two or more layers, it is preferable that the total thickness of the multilayer body is within the above range.

<Components of Sheet for Forming Resin Film>

The constituent components of the sheet for forming a resin film of one embodiment of the present invention are not particularly limited as long as the surface roughness (Ra) of the surface (α) falls within the above range.

However, from the viewpoint of providing a sheet for forming a resin film having good sheet-like shape retention, the sheet for forming a resin film of one embodiment of the present invention preferably contains a polymer component (A) and a curable component (B).

Furthermore, from the viewpoint of adjusting the surface roughness (Ra) of the surface (α) to the above range and the viewpoint of adjusting the thermal expansion coefficient of the resin film formed from the sheet for forming a resin film to an appropriate range, the resin film formation of one embodiment of the present invention It is preferable that the dragon sheet contains the filler (C).

In addition, the sheet for forming a resin film of one embodiment of the present invention further contains at least one selected from a colorant (D), a coupling agent (E), and a general-purpose additive (F) within a range that does not impair the effects of the present invention. There may be.

Hereinafter, the components (A) to (F) which may be constituent components of the sheet for forming a resin film of one embodiment of the present invention will be described.

[Polymer component (A)]

In this specification, a "polymer component" is a high molecular weight body obtained by a polymerization reaction and means a compound having at least one type of repeating unit.

By containing the polymer component (A), the sheet for forming a resin film used in one embodiment of the present invention is easily imparted with flexibility, and the sheet-like shape retention can be improved. As a result, the storage elastic modulus of the sheet for forming a resin film can be adjusted within the above range.

The mass average molecular weight (Mw) of the polymer component (A) is preferably 20,000 or more, more preferably 20,000 to 3,000,000 from the viewpoint of adjusting the storage modulus of the obtained sheet for forming a resin film to the range described above. Preferably it is 100,000 to 2 million, and still more preferably 150,000 to 1.5 million.

The glass transition temperature (Tg) of the acrylic polymer (A1) is preferably -40°C or higher, more preferably -30 to 50°C, still more preferably -20 to 20°C, even more preferably -15 to 0. is °C.

In the present specification, the value of the glass transition temperature (Tg) of an acrylic polymer or the like is the glass transition temperature (TgK) represented by the absolute temperature (unit: K) calculated by the following formula (1) in degrees Celsius (unit: It is a value converted to °C).

[In Formula (1), W ₁ , W ₂ , W ₃ , W ₄ . . . Represents the mass fraction (mass %) of the monomer component constituting the polymer component, Tg ₁ , Tg ₂ , Tg ₃ , Tg ₄ . . . Represents the glass transition temperature (unit: K) of a homopolymer of each monomer component constituting the polymer component]

In one embodiment of the present invention, the content of the polymer component (A) in the sheet for forming a resin film is preferably 5 to 60% by mass, more preferably 5 to 60% by mass, based on the total amount (100% by mass) of the sheet for forming a resin film. 8 to 50% by mass, more preferably 10 to 45% by mass, still more preferably 15 to 40% by mass.

In the present specification, "the content of component (A) relative to the total amount of the sheet for forming a resin film" means "the content of the component (A) relative to the total amount of active ingredients of the composition as a forming material for the sheet for forming a resin film" is the same as The same applies to the content of other components described below.

In addition, the above-mentioned "active ingredient" refers to components other than substances that do not directly or indirectly react with the solvent in the composition or affect the physical properties of the formed sheet, specifically, components other than solvents such as water and organic solvents. means

The polymer component (A) preferably contains an acrylic polymer (A1).

In addition, the polymer component (A) may contain a non-acrylic polymer (A2) together with the acrylic polymer (A1).

You may use these polymer components individually or in combination of 2 or more types.

In one embodiment of the present invention, the content of the acrylic polymer (A1) relative to the total amount (100% by mass) of the polymer component (A) contained in the sheet for forming a resin film is preferably 50 to 100% by mass, more preferably is 60 to 100% by mass, more preferably 70 to 100% by mass, still more preferably 80 to 100% by mass.

(Acrylic Polymer (A1))

The mass average molecular weight (Mw) of the acrylic polymer (A1) is preferably 20,000 from the viewpoint of imparting flexibility and film-forming properties to the sheet for forming a resin film and adjusting the storage modulus of the sheet for forming a resin film to the range described above. to 3 million, more preferably 100,000 to 1.5 million, even more preferably 150,000 to 1.2 million, still more preferably 250,000 to 1 million.

Examples of the acrylic polymer (A1) include polymers containing alkyl (meth)acrylate as a main component, and specifically include a structural unit (a1) derived from an alkyl (meth)acrylate having an alkyl group of 1 to 18 carbon atoms. An acrylic polymer to do is preferable, and it is good also as an acrylic copolymer containing other structural units (a2) other than a structural unit (a1).

In addition, you may use an acrylic polymer (A1) individually or in combination of 2 or more types.

In addition, when the acrylic polymer (A1) is a copolymer, any of a block copolymer, a random copolymer, an alternating copolymer, and a graft copolymer may be used as the form of the copolymer.

(Constructive unit (a1))

The number of carbon atoms in the alkyl group of the alkyl (meth)acrylate constituting the structural unit (a1) is preferably 1 to 18, more preferably 1 to 18, from the viewpoint of imparting flexibility and film-forming properties to the sheet for forming a resin film. 12, more preferably 1 to 8.

Examples of the alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, n-octyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, lauryl ( Meth) acrylate, stearyl (meth) acrylate, etc. are mentioned.

Moreover, you may use these alkyl (meth)acrylates individually or in combination of 2 or more types.

Among these, alkyl (meth)acrylates having an alkyl group of 1 to 3 carbon atoms are preferred, and methyl (meth)acrylates are more preferred.

The content of the structural unit (a11) derived from an alkyl (meth)acrylate having an alkyl group of 1 to 3 carbon atoms in the acrylic polymer (A1) is preferably based on all structural units (100% by mass) of the acrylic polymer (A1). is 5 to 80% by mass, more preferably 15 to 70% by mass, still more preferably 25 to 60% by mass.

Moreover, alkyl (meth)acrylates having an alkyl group of 4 to 12 carbon atoms are preferred, and butyl (meth)acrylates are more preferred.

The content of the structural unit (a12) derived from an alkyl (meth)acrylate having an alkyl group of 4 to 12 carbon atoms in the acrylic polymer (A1) is preferably based on all structural units (100% by mass) of the acrylic polymer (A1). is 5 to 80% by mass, more preferably 15 to 70% by mass, still more preferably 20 to 60% by mass.

As the acrylic polymer (A1) used in one embodiment of the present invention, an acrylic copolymer containing both the structural unit (a11) and the structural unit (a12) is preferable.

The content ratio [(a11)/(a12)] (mass ratio) of the structural units (a11) and (a12) of the acrylic copolymer is preferably 20/80 to 95/5, more preferably 30/70. to 90/10, more preferably from 40/60 to 85/15, even more preferably from 52/48 to 75/25.

The content of the structural unit (a1) in the acrylic polymer (A1) is preferably 50% by mass or more, more preferably 50 to 99% by mass, and more preferably 50 to 99% by mass relative to the total structural units (100% by mass) of the acrylic polymer (A1). It is preferably 55 to 98% by mass, and even more preferably 60 to 97% by mass.

(Constructive unit (a2))

The acrylic polymer (A1) used in one embodiment of the present invention may have structural units (a2) other than the aforementioned structural units (a1) within a range not impairing the effects of the present invention.

As a monomer which comprises structural unit (a2), For example, functional group containing monomers, such as a hydroxyl group containing monomer, a carboxy group containing monomer, an epoxy group containing monomer; vinyl ester monomers such as vinyl acetate and vinyl propionate; olefin monomers such as ethylene, propylene, and isobutylene; aromatic vinyl monomers such as styrene, methylstyrene, and vinyltoluene; diene monomers such as butadiene and isoprene; Nitrile type monomers, such as (meth)acrylonitrile, etc. are mentioned.

Among these, functional group-containing monomers are preferable, and at least one selected from hydroxyl group-containing monomers and epoxy group-containing monomers is preferable.

Examples of the hydroxy-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl (meth)acrylate. Hydroxyalkyl (meth)acrylates, such as an acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate; Unsaturated alcohols, such as vinyl alcohol and allyl alcohol, etc. are mentioned.

Among these, 2-hydroxyethyl (meth)acrylate is preferable.

Examples of the carboxy group-containing monomer include (meth)acrylic acid, maleic acid, fumaric acid, and itaconic acid.

Examples of the epoxy group-containing monomer include glycidyl (meth)acrylate, β-methylglycidyl (meth)acrylate, (3,4-epoxycyclohexyl)methyl (meth)acrylate, and 3-epoxycyclo- epoxy group-containing (meth)acrylic acid esters such as 2-hydroxypropyl (meth)acrylate; non-acrylic epoxy group-containing monomers such as glycidyl crotonate and allyl glycidyl ether; etc. can be mentioned.

In addition, an acrylic polymer having a Mw of 20,000 or more having structural units derived from an epoxy group-containing monomer has thermosetting properties, but is included in the concept of the polymer component (A) rather than the curable component (B).

The acrylic polymer (A1) used in one embodiment of the present invention preferably contains a structural unit (a21) derived from a hydroxy group-containing monomer.

The content of the structural unit (a21) derived from the hydroxy group-containing monomer in the acrylic polymer (A1) is preferably 1 to 40% by mass, more preferably 1 to 40% by mass, based on the total structural units (100% by mass) of the acrylic polymer (A1). 5 to 30% by mass, more preferably 8 to 25% by mass, still more preferably 10 to 20% by mass.

In addition, it is preferable that the acrylic polymer (A1) used in one embodiment of the present invention contains a structural unit (a22) derived from an epoxy group-containing monomer.

The content of the structural unit (a22) derived from the epoxy group-containing monomer in the acrylic polymer (A1) is preferably 1 to 40% by mass, more preferably 1 to 40% by mass, based on the total structural units (100% by mass) of the acrylic polymer (A1). 5 to 30% by mass, more preferably 8 to 25% by mass.

In the case of using an epoxy-based thermosetting component as the curable component (B) described later, since a carboxyl group reacts with an epoxy group in the epoxy-based thermosetting component, in the acrylic polymer (A1), a structural unit derived from a carboxyl group-containing monomer The one where content is small is preferable.

When using an epoxy-based thermosetting component as the curable component (B), the content of the structural unit derived from the carboxyl group-containing monomer is preferably 0 to 10 mass% with respect to all structural units (100% by mass) of the acrylic polymer (A1). %, more preferably 0 to 5% by mass, even more preferably 0 to 2% by mass, still more preferably 0% by mass.

The content of the structural unit (a2) in the acrylic polymer (A1) is preferably 1 to 50% by mass, more preferably 2 to 45% by mass, based on the total structural units (100% by mass) of the acrylic polymer (A1). More preferably, it is 3-40 mass %.

(Non-acrylic resin (A2))

The sheet for forming a resin film of one embodiment of the present invention may contain a non-acrylic polymer (A2) as a polymer component other than the above-mentioned acrylic polymer (A1), if necessary.

Examples of the non-acrylic polymer (A2) include polyester, phenoxy resin, polycarbonate, polyether, polyurethane, polysiloxane, and rubber polymer.

These non-acrylic polymers (A2) may be used alone or in combination of two or more.

The mass average molecular weight (Mw) of the non-acrylic polymer (A2) is preferably 20,000 or more, more preferably 20,000 to 100,000, still more preferably 20,000 to 80,000.

[curable component (B)]

The curable component (B) plays a role of curing the sheet for forming a resin film to form a hard resin film, and is a compound having a mass average molecular weight (Mw) of less than 20,000.

The sheet for forming a resin film used in the present invention preferably contains at least one of a thermosetting component (B1) and an energy ray curable component (B2) as the curable component (B), and from the viewpoint of sufficiently advancing the curing reaction; and It is more preferable to contain at least a thermosetting component (B1) from a viewpoint of cost reduction.

As the thermosetting component (B1), it is preferable to contain at least a compound having a functional group that reacts by heating.

The energy ray-curable component (B2) contains a compound (B21) having a functional group that reacts with energy ray irradiation, and is polymerized and cured when energy ray irradiation is applied.

Curing is realized when the functional groups of these curable components react with each other to form a three-dimensional network structure.

The mass average molecular weight (Mw) of the curable component (B) is preferably 20,000 from the viewpoint of suppressing the viscosity of the composition for forming the sheet for forming a resin film by using it in combination with the component (A) to improve handleability. less than, more preferably 10,000 or less, still more preferably 100 to 10,000.

(thermosetting component (B1))

As the thermosetting component (B1), an epoxy-based thermosetting component is preferable.

It is preferable to use what combined the thermosetting agent (B12) with the compound (B11) which has an epoxy group as an epoxy-type thermosetting component.

Examples of the compound (B11) having an epoxy group (hereinafter also referred to as "epoxy compound (B11)") include polyfunctional epoxy resins, bisphenol A diglycidyl ether and hydrogenated products thereof, cresol novolak epoxy resins, and the like. Epoxy compounds having at least two functionalities in molecules such as novolak-type epoxy resins, dicyclopentadiene-type epoxy resins, biphenyl-type epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, phenylene skeleton type epoxy resins, etc. can be heard

You may use these epoxy compounds (B11) individually or in combination of 2 or more types.

Among these, it is preferable to include at least one type selected from novolak-type epoxy resins and biphenyl-type epoxy resins.

In one embodiment of the present invention, the epoxy compound (B11) preferably contains an epoxy compound that is liquid at 25°C (hereinafter, also referred to as "liquid epoxy compound").

When the epoxy compound (B11) contains a liquid epoxy compound, the elongation at break of the sheet for forming a resin film can be increased, and a sheet for forming a resin film with excellent reworkability can be obtained.

In one aspect of the present invention, from the above viewpoint, the content of the liquid epoxy compound is preferably 10% by mass or more, more preferably 10% by mass or more, based on the total amount (100% by mass) of the epoxy compound (B11) in the sheet for forming a resin film. is 15% by mass or more, more preferably 30% by mass or more, and still more preferably 40% by mass or more.

On the other hand, from the viewpoint of improving the reliability of a chip having a resin film manufactured using the sheet for forming a resin film, the content of the liquid epoxy compound is based on the total amount (100% by mass) of the epoxy compound (B11) in the sheet for forming a resin film. It is preferably 90% by mass or less, more preferably 80% by mass or less, still more preferably 75% by mass or less, and still more preferably 70% by mass or less.

In addition, in this specification, a "liquid epoxy compound" means an epoxy compound whose viscosity in 25 degreeC is 40 Pa.s or less. In addition, in this specification, the viscosity at 25 degreeC of an epoxy compound is the value measured at 25 degreeC using the E-type viscometer according to JISZ8803.

The content of the epoxy compound (B11) is preferably 1 to 500 parts by mass, more preferably 3 to 300 parts by mass, still more preferably 5 to 150 parts by mass, and even more preferably, based on 100 parts by mass of the component (A). Preferably it is 10 to 100 parts by mass.

(Heat Curing Agent (B12))

The heat curing agent (B12) functions as a curing agent for the epoxy compound (B11).

As the thermosetting agent, a compound having two or more functional groups capable of reacting with an epoxy group in one molecule is preferable.

As the said functional group, a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, an acid anhydride, etc. are mentioned. Among these, a phenolic hydroxyl group, an amino group, or an acid anhydride is preferable, a phenolic hydroxyl group or an amino group is more preferable, and an amino group is still more preferable.

Examples of the phenolic thermosetting agent having a phenolic hydroxyl group include polyfunctional phenolic resins, biphenols, novolak-type phenolic resins, dicyclopentadiene-type phenolic resins, xylock-type phenolic resins, and aralkyl-type phenolic resins. can

As an amine-type thermosetting agent which has an amino group, dicyandiamide (DICY) etc. are mentioned, for example.

These thermosetting agents (B12) may be used alone or in combination of two or more.

Among these, it is preferable to include an amine-based heat curing agent.

The content of the thermal curing agent (B12) is preferably 0.1 to 500 parts by mass, more preferably 0.5 to 300 parts by mass, still more preferably 1 to 200 parts by mass, based on 100 parts by mass of the epoxy compound (B11).

(curing accelerator (B13))

The sheet for forming a resin film of one embodiment of the present invention may contain a curing accelerator (B13) from the viewpoint of adjusting the curing speed of the sheet by heating.

The curing accelerator (B13) is preferably used in combination with the epoxy compound (B11) as the thermosetting component (B1).

Examples of the curing accelerator (B13) include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5 -Imidazoles such as hydroxymethylimidazole; organic phosphines such as tributylphosphine, diphenylphosphine, and triphenylphosphine; tetraphenyl boron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate; and the like.

These curing accelerators (B13) may be used alone or in combination of two or more.

The content of the curing accelerator (B13) is preferably from 0.01 to 10 with respect to 100 parts by mass of the total amount of the epoxy compound (B11) and the thermosetting agent (B12) from the viewpoint of improving the adhesion of the resin film formed from the sheet for forming a resin film. Part by mass, more preferably 0.1 to 6 parts by mass, still more preferably 0.3 to 4 parts by mass.

(Energy ray curable component (B2))

As the energy ray-curable component (B2), a compound (B21) having a functional group that reacts with energy ray irradiation may be used alone, but it is preferable to use a photopolymerization initiator (B22) in combination with the compound (B21). . In addition, it is preferable to cure the energy ray-curable component (B2) with ultraviolet rays.

(Compound (B21) having a functional group that reacts with energy ray irradiation)

Examples of the compound (B21) having a functional group that reacts with energy ray irradiation (hereinafter also referred to as “energy ray reactive compound (B21)”) include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth) )Acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butylene glycoldi(meth) Acrylate, 1,6-hexanedioldi(meth)acrylate, oligoester(meth)acrylate, urethane(meth)acrylate oligomer, epoxy(meth)acrylate, polyether(meth)acrylate, itaconic acid Oligomer etc. are mentioned.

You may use these energy ray reactive compounds (B21) individually or in combination of 2 or more types.

The mass average molecular weight (Mw) of the energy ray-reactive compound (B21) is preferably 100 to 30,000, more preferably 200 to 20,000, still more preferably 300 to 10,000.

The content of the energy ray-reactive compound (B21) is preferably 1 to 1500 parts by mass, more preferably 3 to 1200 parts by mass, still more preferably 5 to 1000 parts by mass, based on 100 parts by mass of the component (A).

(Photoinitiator (B22))

By using the photopolymerization initiator (B22) together with the energy ray-reactive compound (B21) described above, the polymerization and curing time can be shortened and the resin film forming sheet can be cured even if the light irradiation amount is small.

As a photoinitiator (B22), a benzoin compound, an acetophenone compound, an acylphosphine oxide compound, a titanocene compound, a thioxanthone compound, a peroxide compound etc. are mentioned, for example.

As a more specific photopolymerization initiator, for example, 1-hydroxycyclohexylphenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzylphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, β-chloroanthraquinone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, and the like.

You may use these photoinitiators individually or in combination of 2 or more types.

The content of the photopolymerization initiator (B22) is preferably 0.1 to 100 parts by mass of the energy ray-reactive compound (B21) from the viewpoint of sufficiently advancing the curing reaction of the sheet for forming a resin film and suppressing the formation of residues. 10 parts by mass, more preferably 0.5 to 8 parts by mass, still more preferably 1 to 5 parts by mass.

In one embodiment of the present invention, the content of the curable component (B) in the sheet for forming a resin film is preferably 5 to 50% by mass, more preferably 5 to 50% by mass, based on the total amount (100% by mass) of the sheet for forming a resin film. 8 to 40% by mass, more preferably 10 to 30% by mass, still more preferably 12 to 25% by mass.

In addition, the "content of the curable component (B)" refers to the above-described epoxy compound (B11), the thermosetting component (B1) containing the thermosetting agent (B12) and the curing accelerator (B13), and the energy ray reactive compound (B21) and It refers to the total content of the energy ray-curable component (B2) containing the photopolymerization initiator (B22).

[Filling material (C)]

The sheet for forming a resin film of one embodiment of the present invention preferably contains a filler (C).

By including the filler (C), it becomes easy to adjust the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film within the above-mentioned range.

Further, in the sheet for forming a resin film containing the filler (C), the thermal expansion coefficient of the resin film to be formed can be adjusted within an appropriate range, and by optimizing the thermal expansion coefficient of a chip having the resin film, the semiconductor device in which the chip is assembled can be formed. Reliability can be improved. Furthermore, it becomes possible to reduce the moisture absorptivity of the resin film formed from the sheet for forming a resin film.

As the filler (C), organic fillers such as polymethyl methacrylate fillers and rubber particles, and powders such as silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride, and spherical beads, and inorganic fillers such as single crystal fibers and glass fibers.

You may use these fillers (C) individually or in combination of 2 or more types.

Among these, when the sheet for forming a resin film is thermosetting, inorganic fillers are preferred, and silica or alumina is more preferred, from the viewpoint of excellent heat resistance and the like.

In one aspect of the present invention, from the viewpoint of easily adjusting the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film to be formed within the above range, the average particle diameter of the filler (C) is preferably 3 to 3. 20 μm, more preferably 5 to 15 μm.

If the filler has an average particle diameter within the above range, the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film formed can be easily adjusted within the above range even when the content of the filler (C) is relatively small.

However, even in the case of using a filler (C) having a relatively small average particle diameter, by adding a relatively large amount of the filler (C) or by configuring a composite sheet for forming a resin film described later, for forming a resin film formed The surface roughness (Ra) of the surface (α) of the sheet can be adjusted within the above range.

The average particle diameter of the filler (C) in the above case is preferably 100 to 1000 nm, more preferably 200 to 900 nm, even more preferably 200 to 800 nm, still more preferably 300 to 750 nm, more preferably 400 to 700 nm).

When the average particle diameter of the filler (C) is 100 nm or more, the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film can be easily adjusted within the above range by adjusting the content of the filler (C).

Moreover, if the average particle diameter of a filler (C) is 1000 nm or less, there exist the following advantages (1)-(4).

(1) After attaching the surface α of the sheet for forming a resin film to a silicon wafer, the gloss value measured from the surface β′ on the opposite side to the silicon wafer of the resin film formed from the sheet for forming a resin film is to be increased. can

(2) It becomes easy to improve the permeability of the sheet for forming a resin film and the resin layer to electromagnetic waves such as infrared rays. As a result, in the case of performing an inspection by electromagnetic waves on a silicon wafer or chip having a sheet for forming a resin film and a resin layer, the efficiency of the inspection work is improved because of the high electromagnetic wave permeability.

(3) In the process of irradiating the silicon wafer having the sheet for forming a resin film and the resin film with a laser, it is easy to avoid the problem that the laser diffuses due to the existence of the sheet for forming a resin film and the resin film.

(4) When manufacturing a sheet for forming a resin film having a thin thickness of, for example, 20 μm or less, in the step of applying a composition that is a forming material for the sheet for forming a resin film, poor coating film formation due to a filler having a large particle size It is easy to avoid such harmful effects.

When the sheet for forming a resin film of one embodiment of the present invention is a multilayer body formed from two or more types of compositions, the composition as a forming material on the surface (α) side of the sheet for forming a resin film is a filler having an average particle diameter within the above range ( C) is preferably blended to adjust the surface roughness (Ra) of the surface (α).

On the other hand, the composition as a forming material on the surface (β) side is within the above range from the viewpoint of improving the gloss value measured from the surface (β′) on the opposite side to the silicon wafer of the resin film formed from the sheet for forming a resin film. It is preferable to blend a filler (C') having a different small average particle diameter.

The average particle diameter of the filler (C') is usually 1 to 400 nm, preferably 1 to 250 nm, and more preferably 1 to 100 nm.

In addition, in this specification, the average particle diameter of filler (C) and (C') means the value measured using the dynamic light scattering type particle size distribution analyzer (Nanotrack Wave-UT151, manufactured by Nikkiso Co., Ltd.).

In one embodiment of the present invention, the content of the filler (C) in the sheet for forming a resin film is adjusted from the viewpoint of adjusting the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film to the above range, and the resin film It is preferably 10 to 80% by mass, more preferably 20 to 80% by mass, relative to the total amount (100% by mass) of the sheet for forming a resin film, from the viewpoint of improving the reliability of chips having a resin film produced using the forming sheet. 70% by mass, more preferably 30 to 65% by mass, still more preferably 40 to 60% by mass.

In one embodiment of the present invention, the total content of the polymer component (A), the curable component (B), and the filler (C) in the sheet for forming a resin film is preferable relative to the total amount (100% by mass) of the sheet for forming a resin film. It is preferably 60% by mass or more, more preferably 70% by mass or more, even more preferably 80% by mass or more, and still more preferably 90% by mass or more.

[Colorant (D)]

The sheet for forming a resin film of one embodiment of the present invention may further contain a colorant (D).

By including the coloring agent (D) in the sheet for forming a resin film, when a semiconductor chip having a resin film formed from the sheet for forming a resin film is assembled in a device, grinding marks generated during grinding of a semiconductor wafer are difficult to be visually recognized, and semiconductor chips The appearance of the chip can be tidied up.

As the coloring agent (D), organic or inorganic pigments and dyes can be used.

As a dye, it is possible to use any dye, such as an acid dye, a reactive dye, a direct dye, a disperse dye, and a cationic dye, for example.

In addition, the pigment is not particularly limited, and may be appropriately selected and used from known pigments. For example, phthalocyanine-based blue pigments, isoindolinone-based yellow pigments, and diketopyrrolopyrrole-based red pigments, carbon black, iron oxide, manganese dioxide, Black pigments, such as aniline black and activated carbon, etc. are mentioned.

You may use these coloring agents (D) individually or in combination of 2 or more types.

In addition, by mixing and using a phthalocyanine-based blue pigment, an isoindolinone-based yellow pigment, and a diketopyrrolopyrrole-based red pigment, it is easy to obtain a resin film having low visible light transmittance while improving light transmittance in the infrared region.

The average particle size of the colorant (D) is preferably 400 nm or less, more preferably 300 nm or less, even more preferably 200 nm or less, still more preferably 100 nm or less, and more preferably 10 nm or more, more preferably It is at least 20 nm.

In one embodiment of the present invention, the content of the colorant (D) in the sheet for forming a resin film is preferably 0.01 to 20% by mass, more preferably 0.05% by mass, based on the total amount (100% by mass) of the sheet for forming a resin film. to 15% by mass, more preferably 0.1 to 10% by mass, still more preferably 0.15 to 5% by mass.

[Coupling agent (E)]

The sheet for forming a resin film of one embodiment of the present invention may further contain a coupling agent (E).

Water resistance can also be improved by including a coupling agent (E), without impairing the heat resistance of the resin film formed from the obtained sheet|seat for resin film formation. It also contributes to the improvement of edge adhesion after attachment to a silicon wafer.

As a coupling agent (E), the compound which reacts with the functional group which component (A) or component (B) has is preferable, and a silane coupling agent is more preferable.

Examples of the silane coupling agent include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and γ-( Methacryloxypropyl)trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)-γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)-γ-aminopropyl Methyldiethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis( 3-triethoxysilylpropyl) tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazolesilane and the like.

You may use these coupling agents (E) individually or in combination of 2 or more types.

As the coupling agent (E), an oligomer type coupling agent is preferable.

The molecular weight of the coupling agent (E) including the oligomer type coupling agent is preferably 100 to 15000, more preferably 150 to 10000, still more preferably 200 to 5000, still more preferably 250 to 3000, still more preferably Preferably it is 350 to 2000.

In one embodiment of the present invention, the content of the coupling agent (E) in the sheet for forming a resin film is preferably 0.01 to 3.0% by mass, more preferably 0.01 to 3.0% by mass relative to the total amount (100% by mass) of the sheet for forming a resin film. 0.03 to 1.5% by mass, more preferably 0.05 to 0.8% by mass, still more preferably 0.1 to 0.3% by mass.

[Universal additive (F)]

The sheet for forming a resin film used in one embodiment of the present invention may contain a general-purpose additive (F) as needed in addition to the above components within a range not impairing the effects of the present invention.

As a general purpose additive (F), a crosslinking agent, a plasticizer, a leveling agent, an antistatic agent, antioxidant, an ion trapping agent, a gettering agent, a chain transfer agent etc. are mentioned, for example.

The content of each of these general-purpose additives (F) in the sheet for forming a resin film of one embodiment of the present invention is preferably 0 to 10% by mass, more preferably 0 to 10% by mass, based on the total amount (100% by mass) of the sheet for forming a resin film. is 0 to 5% by mass, more preferably 0 to 2% by mass.

<Method for producing sheet for forming resin film>

There is no particular restriction on the manufacturing method of the sheet for forming a resin film of the present invention, and it can be manufactured by a known method.

For example, after preparing a composition for forming a resin film containing each of the components described above, which is a material for forming a sheet for forming a resin film, it is appropriately added and diluted with an organic solvent to obtain a solution of the composition for forming a resin film. Then, a sheet for forming a resin film can be manufactured by applying a solution of the composition for forming a resin film to a support described later by a known coating method to form a coating film, and drying the coating film.

Further, from the viewpoint of adjusting the surface roughness (Ra) of the surface (α) of the obtained sheet for forming a resin film to the range described above, as a method for producing a sheet for forming a resin film, a resin film forming material for forming a sheet for forming a resin film is formed. It is preferable to include a step of applying the composition for use on the surface of a support having a surface having a surface roughness (Ra) of 40 nm or more to form a coating film, and drying the coating film.

The composition for forming a resin film may be appropriately diluted by adding a solvent to form a solution form of the composition for forming a resin film.

The surface roughness (Ra) of the surface of the support is preferably 40 nm or more, more preferably 70 nm or more, even more preferably 100 nm or more, even more preferably 200 nm or more, still more preferably is 300 nm or more, and is preferably 1000 nm or less, more preferably 800 nm or less, still more preferably 500 nm or less.

In the case where the sheet for forming a resin film of one embodiment of the present invention is a multilayer body, as a method for manufacturing the sheet for forming a resin film, for example, a solution of a composition for forming a resin film is applied onto two or more supports, respectively, to form a coating film. It may be a manufacturing method including a step of forming, laminating the coating films by bonding the coating films, and then drying them.

As an organic solvent used for solution preparation of the composition for resin film formation, toluene, ethyl acetate, methyl ethyl ketone etc. are mentioned, for example.

The solid content concentration of the solution of the composition for forming a resin film when an organic solvent is blended is preferably 10 to 80% by mass, more preferably 20 to 70% by mass, still more preferably 30 to 65% by mass.

Examples of the coating method include spin coating, spray coating, bar coating, knife coating, roll coating, roll knife coating, blade coating, die coating, and gravure coating.

<Use of Sheet for Forming Resin Film>

The sheet for forming a resin film of one embodiment of the present invention can be applied to the back surface of a work such as a face-down type semiconductor wafer for chips or a silicon wafer such as a semiconductor chip to form a resin film on the work. This resin film has a function as a protective film that protects the back surface of a work such as a semiconductor wafer or semiconductor chip. For example, when attached to a semiconductor wafer, since the resin film has a function of reinforcing the wafer, damage or the like of the wafer can be prevented.

That is, it is preferable that the sheet for forming a resin film of one embodiment of the present invention is a sheet for forming a protective film for forming a protective film on a silicon wafer.

In addition, the resin film formed from the sheet for forming a resin film of one embodiment of the present invention can also function as an adhesive sheet. That is, when the resin film formed using the sheet for forming a resin film of one embodiment of the present invention has a function as an adhesive film, the chip having the resin film is placed on another member such as a die pad portion or another semiconductor chip (on a chip mounting portion). ), and can contribute to improving productivity for manufacturing semiconductor devices.

That is, the sheet for forming a resin film of one embodiment of the present invention can also be used as a sheet for forming an adhesive film for forming an adhesive film on a silicon wafer.

[Configuration of Composite Sheet for Forming Resin Film]

The composite sheet for forming a resin film of the present invention (hereinafter, simply referred to as "composite sheet") includes the sheet for forming a resin film of the present invention and a support.

The shape of the composite sheet of one embodiment of the present invention is not particularly limited, and may be, for example, a long tape shape or a single sheet label.

1 is a cross-sectional view of a composite sheet for forming a resin film of one embodiment of the present invention.

As a composite sheet of one embodiment of the present invention, as shown in Fig. 1 (a), a composite sheet 1a having a configuration in which the sheet 10 for forming a resin film is directly laminated on a support 11 is mentioned. can

The shape of the sheet 10 for forming a resin film of the composite sheet of one embodiment of the present invention may be substantially the same as that of a silicon wafer as an adherend or a shape that may include a shape of a silicon wafer.

In the composite sheet 1a of Fig. 1 (a), the support 11 and the sheet 10 for forming a resin film have substantially the same shape, but as shown in Fig. 1 (b), the sheet for forming a resin film The shape of (10) may be a composite sheet 1b smaller than the shape of the support body 11.

As a composite sheet of one embodiment of the present invention, as shown in Fig. 1(c), a composite sheet 1c having a ring-shaped jig adhesive layer 12 is exemplified.

The ring-shaped jig adhesive layer 12 is provided for the purpose of improving the adhesive strength to the jig when adhering to a jig such as a ring frame, and can be formed from a double-sided adhesive sheet having a substrate (core material) or an adhesive. there is.

Further, in the composite sheet 1c shown in Fig. 1 (c), a configuration in which a jig adhesive layer 12 is further provided with respect to the composite sheet 1a in Fig. 1 (a) is shown, but one embodiment of the present invention As the composite sheet, a composite sheet having a configuration in which a jig adhesive layer 12 is provided on the surface of the support 11 of the composite sheet 1b in Fig. 1(b) is also exemplified.

As a composite sheet of one embodiment of the present invention, as shown in FIG. ) can be done.

Similarly to the configuration of the composite sheet 1d, even if a support body different from the support body 11 is provided on the exposed surface of the sheet 10 for forming a resin film of the composite sheet 1b in FIG. do.

Similarly, even if a support body different from the support body 11 is provided on the surface of the sheet 10 for forming a resin film and on the surface of the jig adhesive layer 12 of the composite sheet 1c shown in FIG. do.

<support>

The support of the composite sheet of one embodiment of the present invention is a release sheet for preventing adhesion of dust or the like to the surface of the sheet for forming a resin film, or a dicing sheet for protecting the surface of the sheet for forming a resin film in a dicing step or the like. etc. will play a role.

It is preferable that the support body used by this invention has a structure which has a resin film.

Examples of the resin film include polyethylene films such as low-density polyethylene (LDPE) films and linear low-density polyethylene (LLDPE) films, ethylene-propylene copolymer films, polypropylene films, polybutene films, polybutadiene films, and polymethylpentene films. , polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene/vinyl acetate copolymer film, ionomer resin film, ethylene/(meth) ) An acrylic acid copolymer film, an ethylene/(meth)acrylic acid ester copolymer film, a polystyrene film, a polycarbonate film, a polyimide film, a fluororesin film, and the like.

The substrate used in one embodiment of the present invention may be a single-layer film made of one type of resin film or a laminated film obtained by laminating two or more types of resin films.

Moreover, the said resin film may be a crosslinked film.

Moreover, those to which these resin films were colored or printed can also be used.

In addition, the resin film may be a sheet formed by extrusion molding of a thermoplastic resin, or may be stretched, or a sheet formed by thinning and curing a curable resin by a predetermined means may be used.

Among these resin films, a base material made of a polypropylene film is preferable from the viewpoint of being excellent in heat resistance, having appropriate flexibility, having expandability, and being easy to maintain pick-up properties.

Moreover, as a structure of the base material containing a polypropylene film, a single-layer structure containing only a polypropylene film may be sufficient, and a multi-layer structure containing a polypropylene film and another resin film may be sufficient.

When the sheet for forming a resin film is thermosetting, the resin film constituting the base material has heat resistance, so that the base material is prevented from being damaged by heat, and problems in the manufacturing process of the semiconductor device can be suppressed.

When the support is used as a release sheet for preventing adhesion of dust or the like to the surface of the sheet for forming a resin film, the support can be easily peeled off from the sheet for forming a resin film when attached to a silicon wafer or during a dicing step. A resin film that can be used is preferred.

Moreover, as the said support body, you may use the resin film which performed the peeling process on the surface of the above-mentioned resin film.

As a method of the said peeling treatment, the method of providing the peeling film formed from the peeling agent on the surface of the above-mentioned resin film is preferable.

Examples of the release agent include release agents containing resins selected from acrylic resins, alkyd resins, silicone resins, fluorine resins, unsaturated polyester resins, polyolefin resins, and wax resins.

When the support is used as a dicing sheet for fixing the sheet for forming a resin film in a dicing step or the like, the support is preferably an adhesive sheet having an adhesive layer formed of an adhesive on the resin film described above.

Examples of the adhesive resin included in the adhesive include acrylic resins, urethane resins, rubber resins, silicone resins, and vinyl ether resins when focusing on the structure of the adhesive resin, and when focusing on the function, examples For example, an energy ray curing type resin etc. are mentioned.

In one aspect of the present invention, a pressure-sensitive adhesive containing an energy ray curable resin is preferable from the viewpoint of improving pickup properties.

The thickness of the support is appropriately selected depending on the intended use, but is preferably 10 to 500 μm, more preferably 20 to 350 μm, still more preferably 30 to 200 μm.

In addition, the thickness of the said support body includes not only the thickness of the resin film which comprises a support body, but also the thickness of the said adhesive layer or release film, when it has an adhesive layer or a release film.

<Jig adhesive layer>

The jig adhesive layer can be formed from a double-sided pressure-sensitive adhesive sheet having a substrate (core material) or an adhesive composition containing an adhesive.

Examples of the base material (core material) include resin films that can be used as the base material described above, and a polypropylene film is preferable.

Moreover, as said adhesive, acrylic resin, urethane type resin, rubber type resin, silicone type resin, vinyl ether type resin etc. are mentioned, for example.

The thickness of the jig adhesive layer is preferably 1 to 80 μm, more preferably 5 to 60 μm, still more preferably 10 to 40 μm.

[Composite sheet for forming a resin film of another embodiment of the present invention]

As another embodiment of the present invention, the following composite sheet for forming a resin film (hereinafter also referred to as "composite sheet 1") is exemplified.

A composite sheet 1, which is one embodiment of the present invention, has a sheet for forming a resin film for forming a resin film on a silicon wafer by being attached to a silicon wafer, and a support body (I), as shown in FIG. 1 described above. It is the same structure as the composite sheets 1a to 1d.

However, the composite sheet 1 has a configuration in which the surface (α) of the sheet for forming a resin film on the side to be adhered to the silicon wafer and the surface (i) of the support body (I) having a surface roughness of 40 nm or more are directly laminated. have

On the surface (α) of the sheet for forming a resin film exposed when the support (I) is removed from the composite sheet (1), the surface roughness (Ra) formed on the surface (i) of the support (I) is 40 nm or more. It is considered that the unevenness is transferred to the same degree or to show a surface roughness (Ra) smaller than the surface roughness (Ra) formed on the surface (i) of the support (I).

Therefore, it is considered that the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film after removing the support (I) from the composite sheet (1) is a predetermined value or more to the extent that the effect of improving the reworkability is exhibited, It has the effect of improving reworkability similarly to the sheet for forming a resin film of the present invention described above.

It is preferable that the sheet for forming a resin film included in the composite sheet 1 of one embodiment of the present invention has thermosetting properties.

In the case of a sheet for forming a resin film having thermosetting properties, in the heating step after attaching the sheet for forming a resin film to a silicon wafer, the concavo-convex shape of the surface α of the sheet for forming a resin film is easily deformed, and At the interface, voids due to the uneven shape of the surface α of the sheet for forming a resin film are less likely to occur. As a result, in the resin film formed on the silicon wafer, scattering of light due to the void can be suppressed, and observation, such as inspection, of the silicon wafer or chip having the resin film can be easily performed with the naked eye or electromagnetic waves such as infrared rays. It happens.

The sheet for forming a resin film included in the composite sheet 1 of one embodiment of the present invention preferably contains the thermosetting component (B1) described above from the viewpoint of imparting thermosetting properties.

The surface roughness (Ra) of the sheet for forming a resin film after removing the support (I) of the composite sheet (1) is preferably 40 nm or more, more preferably 45 nm or more, still more preferably 50 nm or more It is more preferably 53 nm or more, still more preferably 55 nm or more, and is also preferably 200 nm or less, more preferably 150 nm or less, still more preferably 100 nm or less.

The surface roughness (Ra) of the surface (i) of the support (I) is preferably 40 nm or more, more preferably 70 nm or more, even more preferably 100 nm or more, still more preferably 200 nm or more More preferably, it is 300 nm or more, and is also preferably 1000 nm or less, more preferably 800 nm or less, and still more preferably 500 nm or less.

The support (I) of the composite sheet 1 is not particularly limited as long as it has been surface-treated so that the surface roughness (Ra) falls within the above range and can be peeled off. It is more preferable to be comprised of a resin film from a viewpoint of reducing the possibility of occurrence.

As a method of adjusting the surface roughness (Ra) of the surface (i) of the support (I), for example, a method of containing a filler in the resin film constituting the support (I), or a release film formed from a release agent containing a filler The method of formation etc. are mentioned.

In addition, when the support body (I) is composed of a resin film produced by melt extrusion, it is also possible to obtain a resin film having a surface roughness (Ra) adjusted to the above range by injecting molten resin onto a roll having a rough surface shape. do.

Alternatively, the surface roughness (Ra) of the surface (i) of the support (I) may be adjusted by using a material having a rough surface due to its nature, such as paper or nonwoven fabric, as a material for forming the support (I).

In the composite sheet 1, like the composite sheet 1d shown in FIG. 1(d), a second support ( II) may be a composite sheet having a configuration in which it is directly laminated.

The sheet for forming a resin film of this composite sheet preferably has thermosetting properties. Therefore, it is preferable that the sheet for forming a resin film contains the thermosetting component (B1) described above.

Further, as shown in FIG. 1(d), in the composite sheet 1 having a structure in which the sheet for forming a resin film is sandwiched by a support body (I) and a support body (II), the surface of the sheet for forming a resin film ( After attaching α) to a silicon wafer, the resin film forming sheet is thermally cured in a state in which the support body (II) and the sheet for forming a resin film are laminated without peeling the support body (II), and the formed resin film The gloss value measured from the surface (β') on the opposite side to the silicon wafer tends to be high. The gloss value is the gloss value of the surface (β') of the resin film formed using the composite sheet having no support (II), and the surface (β) of the sheet for forming a resin film by peeling the support (II). It is higher than the gloss value of the surface (β') of the resin film formed by thermosetting in the exposed state.

That is, even when the gloss value of the surface (β') of the resin film is low due to, for example, the use of a filler having a large average particle diameter as the filler (C), after the composite sheet 1 is attached to the silicon wafer, the support A resin film with high visibility of laser printing can be formed by thermally curing the sheet for forming a resin film in a state in which the support (II) and the sheet for forming a resin film are laminated without peeling off (II).

In order to make the sheet for forming a resin film thermosetting, the sheet for forming a resin film may contain the thermosetting component (B1) described above.

Examples of the support (II) include the same support as the support of the above-described composite sheet of the present invention, and specifically include the above-described resin film, resin film with a release film, and pressure-sensitive adhesive sheet with a pressure-sensitive adhesive layer.

In the case where the support (II) is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer, the composite sheet 1 preferably has a configuration in which the pressure-sensitive adhesive layer and the surface (β) of the sheet for forming a resin film are directly laminated. In this configuration, the pressure-sensitive adhesive layer is formed from a pressure-sensitive adhesive containing an energy ray-curable resin, cured by irradiation with energy rays in advance to form a pressure-sensitive adhesive layer, and the support body (II) and the sheet for forming a resin film are laminated. , By thermally curing the sheet for forming a resin film, the gloss value of the surface (β') of the formed resin film can be improved.

[Method of Recycling Silicon Wafer]

As a method of regenerating a silicon wafer by peeling the sheet for forming a resin film from a laminate in which a silicon wafer and the surface (α) of the sheet for forming a resin film of the present invention are adhered, for example, the following steps (1) to (2) ).

Step (1): A step of attaching the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet having the base material and the pressure-sensitive adhesive layer on the surface (β) opposite to the surface (α) attached to the silicon wafer of the sheet for forming a resin film of the laminate.

Step (2): Step of peeling off the sheet for forming a resin film attached to the silicon wafer by pulling the adhesive sheet attached in step (1)

The silicon wafer regeneration method is a sheet for forming a resin film of the present invention having excellent reworkability in that the silicon wafer can be peeled off without damaging the silicon wafer and without generating residue when trying to peel it off after being attached to the silicon wafer. It uses the properties of

In addition, this method of regenerating a silicon wafer is not only a laminate immediately after attaching the silicon wafer and the surface (α) of the sheet for forming a resin film of the present invention, but also a silicon wafer and a resin film formed after about 24 hours have elapsed since the attachment. It is applicable also to the laminated body of the state which the adhesiveness of the sheet|seat improved.

<Process (1)>

In step (1), the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet having the base material and the pressure-sensitive adhesive layer is applied on the surface (β) opposite to the surface (α) attached to the silicon wafer of the sheet for forming a resin film of the laminate. It is fair.

A silicon wafer is not limited to a wafer before being diced into pieces. For example, a pre-dicing method is used, that is, a groove is formed from the surface opposite to the surface on which the silicon wafer is ground, and the groove is formed. It may have already been singulated by a method of singling a silicon wafer into chips by performing grinding until reaching the wafer.

As the adhesive sheet used in this process, it has a base material and an adhesive layer. In addition, when the composite sheet 1 having the support body (II) containing the adhesive sheet is affixed to the silicon wafer, the support body (II) may be used as the "adhesive sheet" referred to in this step.

As the base material, a resin film is preferable, and the resin film exemplified in the above-mentioned item of the support body is exemplified.

The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is not particularly limited as long as it has an adhesive force capable of peeling the sheet for forming a resin film from the silicon wafer in step (2).

As a specific adhesive, an acrylic adhesive, a urethane type adhesive, a silicone type adhesive etc. are mentioned, for example.

The shape of the PSA sheet is not particularly limited, but from the viewpoint of operability in the next step (2), a PSA sheet having the same shape as the sheet for forming a resin film or a larger shape than the sheet for forming a resin film is preferable.

As a method of attaching the surface β to the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet in this step, a machine may be used for adhesion, or it may be carried out manually.

In addition, the surface (α) of the sheet for forming a resin film of the composite sheet of one embodiment of the present invention described above is adhered to a silicon wafer, and an adhesive sheet such as a dicing sheet is already laminated on the surface (β) side as a support. If there is, the said adhesive sheet can also be used as an adhesive sheet in this process.

<Process (2)>

Step (2) is a step of peeling off the sheet for forming a resin film attached to the silicon wafer by pulling the adhesive sheet attached in step (1).

In this step, since the surface roughness (Ra) of the surface (α) adhered to the silicon wafer of the sheet for forming a resin film of the present invention is adjusted within the above range, the By pulling the adhesive sheet, the sheet for forming a resin film is also pulled together, and the sheet for forming a resin film can be separated from the silicon wafer.

The peeling speed and peeling angle of the pressure-sensitive adhesive sheet are not particularly limited and can be set appropriately.

In this step, although the adhesive sheet may be pulled using a machine, it is preferable to peel the sheet for forming a resin film from the silicon wafer by manually pulling the adhesive sheet from the viewpoint of operability.

In this step, the surface of the silicon wafer may be washed with an organic solvent such as ethanol, if necessary, after peeling the sheet for forming a resin film.

By passing through the above steps, it is possible to regenerate the silicon wafer to which the sheet for forming a resin film has been adhered once.

Example

<Measurement of mass average molecular weight (Mw) and number average molecular weight (Mn)>

Using a gel permeation chromatograph (manufactured by Tosoh Corporation, product name "HLC-8220GPC"), it was measured under the following conditions, and the value measured in terms of standard polystyrene was used.

(Measuring conditions)

・Column: "TSK guard column HXL-L", "TSK gel GMHXL (x 2)", "TSK gel G2000HXL" (all manufactured by Tosoh Corporation) are sequentially connected

Column temperature: 40℃

Developing solvent: tetrahydrofuran

・Flow rate: 1.0mL/min

<Average Particle Diameter of Components in Composition for Forming Resin Film>

It was measured using a dynamic light scattering type particle size distribution analyzer (manufactured by Nikkiso Co., Ltd., product name "Nanotrack Wave-UT151").

<Measurement of surface roughness (Ra)>

The surface roughness (Ra) of the surface of the measurement target was measured at a magnification of 10 times in the PSI mode using an optical interference type surface shape measuring device (manufactured by Veeco Metrology Group, product name "WYKOWT1100").

<Evaluation of reworkability of sheet for forming resin film>

A silicon wafer (diameter: 200 mm, diameter: 200 mm, Thickness: 280 μm) was laminated on the polished surface, and it was attached while heating at 70° C. using a tape mounter (manufactured by Lintec Co., Ltd., product name “Adwill RAD-3600 F/12”).

After attaching, at room temperature (25°C), the support (II) of the composite sheet for forming a resin film is also removed, and a commercially available general-purpose dicing tape (manufactured by Lintec Co., Ltd.) is placed on the surface of the exposed sheet for forming a resin film. A pressure-sensitive adhesive layer surface (trade name "Adwill D-510T") was attached.

Then, by manually pulling the general-purpose dicing tape, whether or not the sheet for forming a resin film could be peeled from the silicon wafer together and whether or not the surface of the silicon wafer after peeling was observed was observed, and the resin film was filmed according to the following criteria. The reworkability of the forming sheet was evaluated.

A: The sheet for forming a resin film could be completely separated from the silicon wafer. In the silicon wafer after peeling, no visible remnant of the sheet for forming a resin film was found.

B: The sheet for forming a resin film could be peeled from the silicon wafer. A slight residue of the sheet for forming a resin film was observed on the silicon wafer after separation, but it was to the extent that it could be completely removed by wiping with ethanol.

C: The silicon wafer was damaged during peeling, or even if peeled off without damaging the silicon wafer, residues of the sheet for forming a resin film that were difficult to wipe off with ethanol were confirmed on the peeled silicon wafer.

<Measurement of gloss value of resin film>

A silicon wafer (diameter: 200 mm, thickness: 200 mm, thickness 280 μm) on the polished surface, and using a tape mounter (manufactured by Lintec Co., Ltd., product name “Adwill RAD-3600 F/12”), it was attached while heating at 70°C.

After attachment, the support (II) of the composite sheet for forming a resin film was also removed, and the sheet for forming a resin film was cured by putting it in a heating oven at 130° C. for 2 hours to form a resin film on the silicon wafer.

Then, using a gloss meter (manufactured by Nippon Denshoku Kogyo Co., Ltd., product name "VG2000"), in accordance with JIS Z 8741, the surface of the resin film formed from the side opposite to the silicon wafer was measured for 60 degrees of specular gloss. . The value of the specular gloss was made into the gloss value of the resin film.

<Measurement of light transmittance of the resin film at a wavelength of 1250 nm>

The support (I) of the composite sheet for forming a resin film prepared in Examples and Comparative Examples was removed, and the exposed surface (α) of the sheet for forming a resin film was laminated on a flat surface of a glass plate having a thickness of 2 mm, Using a laminator, it was attached while heating at 70°C.

After the attachment, the support (II) of the composite sheet for forming a resin film was also removed, and the sheet for forming a resin film was cured by putting it in a heating oven at 130° C. for 2 hours to form a resin film on the glass plate.

Then, the transmittance of the resin film on the glass plate was measured using a spectrophotometer (manufactured by Shimadzu Corporation, product name "UV-VIS-NIR SPECTROPHOTOMETER UV-3600"), and the light transmittance (%) at a wavelength of 1250 nm was determined. extracted.

For the measurement, a large sample chamber "MPC-3100" (product name) attached to the spectrophotometer was used, but the measurement was performed without using a built-in integrating sphere. The light transmittance of the resin film at a wavelength of 1250 nm was calculated by taking the difference from the light transmittance at a wavelength of 1250 nm only for the glass plate measured beforehand.

Example 1

Each component of the type and compounding quantity shown in Table 1 was added and diluted with methyl ethyl ketone to prepare a solution of a composition for forming a resin film having an active ingredient concentration of 51% by mass.

And, as the support (II), the composition for forming a resin film on the peeling treated surface of a polyethylene terephthalate (PET) film (manufactured by Lintec Co., Ltd., trade name "SP-PET381031", thickness: 38 μm) subjected to peeling treatment The solution was applied and dried to form a sheet for forming a resin film having a thickness of 25 μm.

Further, on the exposed surface of the formed sheet for forming a resin film, as a support (I), release paper (manufactured by Lintec Co., Ltd., trade name "SP-8LK Ao", thickness: 88 μm, glassine paper coated with polyolefin and subjected to silicone peeling treatment, bonding the peeling treated surface of the surface roughness (Ra) = 370 nm) of the peeling treated surface, using a laminator (manufactured by Daisei Laminator Co., Ltd., product name "VA-400"), By laminating at room temperature (25°C), a composite sheet for forming a resin film composed of support (I)/sheet for resin film formation/support (II) was produced.

Comparative Example 1

A polyethylene terephthalate (PET) film (manufactured by Lintec Co., Ltd., trade name "SP- PET251130”, thickness: 25 μm), in the same manner as in Example 1 except that the peeling treated surface was bonded, a composite sheet for forming a resin film composed of support (I) / sheet for forming a resin film / support (II) was produced. .

The detail of each component of Table 1 used for preparation of the composition for resin film formation is as follows.

<Polymer component (A)>

(A-1): Acrylic copolymer obtained by copolymerizing methyl acrylate (MA), n-butyl acrylate (BA), glycidyl methacrylate (GMA) and 2-hydroxyethyl acrylate (HEA) (BA/MA/GMA/HEA=37/28/20/15 (% by mass), Mw=800,000, Tg=-10.1° C.).

<Curable component (B)>

- (B-1): Bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name "jER828", epoxy equivalent = 184 to 194 g / eq, Mn = 370, viscosity at 25 ° C = 120 to 150 P (12 to 15 Pa·s), liquid epoxy resin, compound corresponding to the above component (B11)).

- (B-2): bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name "jER1055", epoxy equivalent = 800 to 900 g / eq, Mn = 1600, solid epoxy resin, corresponding to the above component (B11) compound that does).

- (B-3) dicyclopentadiene type epoxy resin (manufactured by DIC Co., Ltd., trade name "Epiclon HP-7200HH", epoxy equivalent = 255 to 260 g / eq, Mw is less than 20,000 compounds, solid epoxy resin, above Compounds corresponding to component (B11)).

- (B-4): Dicyandiamide (manufactured by Adeka Co., Ltd., trade name "Adeka Hardener EH-3636AS", amine-based curing agent, amount of active hydrogen = 21 g / eq, corresponding to the above component (B12) compound that does).

(B-5): 2-phenyl-4,5-dihydroxymethylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., trade name "Curesol 2PHZ", curing accelerator, compound corresponding to the above component (B13) ).

<Filling material (C)>

(C-1): Silica filler (manufactured by Admatex Co., Ltd., trade name "SC2050MA", average particle diameter = 500 nm).

<Colorant (D)>

(D-1): Carbon black (manufactured by Mitsubishi Chemical Corporation, trade name "#MA650", average particle diameter = 28 nm).

<Silane coupling agent (E)>

(E-1): A silane coupling agent (3-glycidoxypropylmethyldimethoxysilane, manufactured by Shin-Etsu Chemical Industry Co., Ltd., trade name "KBM-402", Mn = 220.3).

Table 1 shows the results of measuring and evaluating the physical properties of the sheets for forming a resin film produced in Examples and Comparative Examples based on the above-described method.

According to Table 1, the sheet for forming a resin film of the composite sheet for forming a resin film produced in Example 1, which is one embodiment of the present invention, has excellent reworkability. In addition, the resin film formed from the sheet for forming a resin film had a high gloss value and high light transmittance at a wavelength of 1250 nm.

On the other hand, since the sheet for forming a resin film possessed by the composite sheet for forming a resin film produced in Comparative Example 1 has a small surface roughness (Ra) value of the surface (α), it is difficult to peel off after being attached to a silicon wafer. This resulted in poor workability.

The sheet for forming a resin film of one embodiment of the present invention is suitable as a material for forming a protective film that protects the back surface of a semiconductor chip or as a material for forming an adhesive film that can be adhered onto a die pad portion or other site.

1a, 1b, 1c, 1d: composite sheet for forming resin film
10: sheet for forming resin film
11, 11': support
12: jig adhesive layer

Claims (18)

A sheet for forming a resin film attached to a silicon wafer to form a resin film on the silicon wafer,
A polymer component (A) comprising an acrylic polymer (A1) having a glass transition temperature (Tg) of -40 to 0 ° C,
A sheet for forming a resin film, wherein a surface roughness (Ra) of the surface (α) of the sheet on the side to be adhered to the silicon wafer is 40 nm or more. A sheet for forming a resin film attached to a silicon wafer to form a resin film on the silicon wafer,
10 to 51.1% by mass of a filler (C) with respect to the total amount of the sheet,
A sheet for forming a resin film, wherein a surface roughness (Ra) of the surface (α) of the sheet on the side to be adhered to the silicon wafer is 40 nm or more. The sheet for forming a resin film according to claim 1, further comprising a curable component (B). The sheet for forming a resin film according to claim 2, further comprising a polymer component (A) and a curable component (B). The sheet for forming a resin film according to claim 4, wherein the polymer component (A) contains an acrylic polymer (A1). The sheet for forming a resin film according to claim 1 or 2, comprising a thermosetting component (B1). The sheet for forming a resin film according to claim 1, comprising a filler (C). The sheet for forming a resin film according to claim 7, wherein the content of the filler (C) is 10 to 80% by mass with respect to the total amount of the sheet for forming a resin film. The sheet for forming a resin film according to claim 2 or 7, wherein the filler (C) has an average particle diameter of 100 to 1000 nm. The sheet for forming a resin film according to claim 1 or 2, which is a sheet for forming a protective film for forming a protective film on a silicon wafer. The surface of the resin film formed from the sheet for forming a resin film according to claim 1 or 2, after attaching the surface (α) of the sheet for forming a resin film to the silicon wafer (β') on the opposite side to the silicon wafer. A sheet for forming a resin film having a gloss value of 25 or more measured from A composite sheet for forming a resin film comprising the sheet for forming a resin film according to claim 1 or 2 and a support. A sheet for forming a resin film attached to a silicon wafer to form a resin film on the silicon wafer, and a support (I),
A composite sheet for forming a resin film having a structure in which a surface (α) of the sheet for forming a resin film on a side to be attached to a silicon wafer and a surface (i) of a support (I) having a surface roughness of 40 nm or more are directly laminated. ,
The composite sheet for forming a resin film, wherein the sheet for forming a resin film contains a polymer component (A) containing an acrylic polymer (A1) having a glass transition temperature (Tg) of -40 to 0°C. A sheet for forming a resin film attached to a silicon wafer to form a resin film on the silicon wafer, and a support (I),
A composite sheet for forming a resin film having a structure in which a surface (α) of the sheet for forming a resin film on a side to be attached to a silicon wafer and a surface (i) of a support (I) having a surface roughness of 40 nm or more are directly laminated. ,
The composite sheet for forming a resin film, wherein the sheet for forming a resin film contains 10 to 51.1% by mass of the filler (C) with respect to the total amount of the sheet. The surface roughness (Ra) of the surface (α) of the composite sheet for forming a resin film, which is exposed when the support (I) of the composite sheet for forming a resin film is removed, is 40 nm or more according to claim 13 or 14. , Composite sheet for forming a resin film. The composite sheet for forming a resin film according to claim 13 or 14, wherein the sheet for forming a resin film contains a thermosetting component (B1). The method according to claim 13 or 14, wherein a second support (II) is further directly laminated on the surface (β) of the sheet for forming a resin film opposite to the surface (α),
The composite sheet for forming a resin film, wherein the sheet for forming a resin film contains a thermosetting component (B1). The composite sheet for forming a resin film according to claim 17, wherein the support (II) is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer and the surface (β) of the sheet for forming a resin film are directly laminated.

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