TW201708477A - Sheet for forming resin film and composite sheet for forming resin film - Google Patents

Abstract

The present invention provides: a sheet for forming a resin film, which has excellent reworkability and is bonded to a silicon wafer to form a resin film on the silicon wafer, and wherein a surface ([alpha]) of the sheet, said surface being bonded to the silicon wafer, has a surface roughness (Ra) of 40 nm or more; and a composite sheet for forming a resin film, which has a configuration wherein the sheet for forming a resin film and a supporting body are directly laminated.

Description

Resin film forming sheet and resin film forming composite sheet

The present invention relates to a sheet for forming a resin film and a composite sheet for forming a resin film.

In recent years, the manufacture of a semiconductor device using a so-called face down mounting method has been carried out. In the face-down method, a semiconductor wafer (hereinafter also simply referred to as a "wafer") having electrodes such as bumps on a circuit surface is used to bond the electrodes to the substrate. Therefore, the surface of the wafer opposite to the circuit surface (hereinafter also referred to as "the back surface of the wafer") may be exposed.

A wafer formed of an organic material on the back surface of the exposed wafer is formed, and a wafer as a resin film is incorporated in the semiconductor device. The resin film is used as a protective film for preventing cracking after the slicing step or the encapsulating step, or is formed as an adhesive film for adhering the obtained wafer to other members such as a die pad portion or other semiconductor wafer. .

Generally, the film with the resin film is formed by applying a resin-containing composition solution onto the back surface of the wafer by a spin coating method, and then drying and hardening the coating film to form a resin film, and attaching the obtained film. Resin film wafer dicing Manufacturing.

Various sheets for forming a resin film have been proposed as a material for forming a protective film or a bonding film provided on the back surface of the wafer or the back surface of the wafer.

For example, Patent Document 1 discloses a film for protecting a wafer comprising a polymer component made of an acrylic copolymer, an energy ray-curable component, a dye or a pigment, an inorganic filler, and a photopolymerization initiator. The energy ray-curable protective film forming layer is formed by sandwiching two peeling sheets.

According to the description of Patent Document 1, the wafer protective film can form a protective film having laser mark identification property, hardness, and adhesion to a wafer by irradiating an energy ray, and is superior to the conventional wafer protective film. The steps can be simplified.

Further, Patent Document 2 discloses a dicing tape-integrated wafer back surface protective film comprising: a dicing tape having a substrate and an adhesive layer; and a wafer back surface protective film adhered to the dicing tape The layer is colored, and has a specific modulus of elasticity.

According to Patent Document 2, the wafer back surface protective film exhibits excellent holding power with the semiconductor wafer in the dicing step of the semiconductor wafer.

[Previous Technical Literature]

[Patent Literature]

Patent Document 1: Japanese Laid-Open Patent Publication No. 2009-138026

Patent Document 2: Japanese Patent Laid-Open Publication No. 2010-199543

However, in the step of attaching the protective film disclosed in Patent Documents 1 and 2 to the wafer, the attachment position of the protective film is shifted, the foreign matter on the wafer is not noticed, and the foreign matter is attached. In the case of a protective film, it is difficult to peel off the protective film secondary processing wafer.

The protective films disclosed in Patent Documents 1 and 2 are intended to improve the adhesion to the wafer at the time of attachment or to improve the adhesion between the wafer and the wafer, and therefore, when attached to the wafer, The adhesion of the wafer is high, so there is a problem in secondary workability. When the protective film temporarily attached to the wafer is strongly peeled off, the wafer may be damaged by the force of peeling, and one part of the protective film may remain on the wafer. Therefore, once the wafer attached to the protective film is difficult to reuse.

In other words, the protective films described in Patent Documents 1 and 2 are discussed based on the adhesion to the wafer at the time of attachment or the adhesion to the wafer after attachment, but the secondary processing of the protective film. There is absolutely no review of sex.

The present invention has been made in view of the above problems, and an object of the invention is to provide a sheet for forming a resin film having excellent secondary workability and a composite sheet for forming a resin film having the sheet for forming a resin film and a support.

The inventors of the present invention have found that a sheet for forming a resin film having a surface roughness of a surface on the side to which the wafer is attached is adjusted to a specific value or more can be solved. The problem is described and thus the present invention has been completed.

That is, the present invention provides the following [1] to [15].

[1] A sheet for forming a resin film for attaching to a tantalum wafer, and forming a sheet of a resin film on the tantalum wafer, and a surface of the sheet attached to the side of the tantalum wafer (α) The surface roughness (Ra) is 40 nm or more.

[2] The sheet for forming a resin film according to the above [1], which comprises a polymer component (A) and a curable component (B).

[3] The sheet for forming a resin film according to [2] above, wherein the polymer component (A) contains an acrylic polymer (A1).

[4] The sheet for forming a resin film according to any one of the above [1] to [3], which comprises a thermosetting component (B1).

[5] The sheet for forming a resin film according to any one of the above [1] to [4], which comprises a filler (C).

[6] The sheet for forming a resin film according to the above [5], wherein the content of the filler (C) is from 10 to 80% by mass based on the total amount of the sheet for forming a resin film.

[7] The sheet for forming a resin film according to the above [5] or [6] wherein the filler (C) has an average particle diameter of 100 to 1000 nm.

[8] The sheet for forming a resin film according to any one of the above [1] to [7], which is used for forming a protective film for forming a protective film on a tantalum wafer.

[9] The sheet for forming a resin film according to any one of the above [1], wherein the surface of the resin film-forming sheet is attached to the surface of the resin film, and the resin film is formed. The resin film formed by the sheet is in phase with the tantalum wafer The gloss value measured on the surface (β') on the reverse side was 25 or more.

[10] A composite sheet for forming a resin film, which comprises the sheet for forming a resin film and the support according to any one of the above [1] to [9].

[11] A composite sheet for forming a resin film, comprising a sheet for forming a resin film and a support (I) for forming a resin film on the tantalum wafer, and having a crucible The surface (α) of the resin film-forming sheet on the wafer attaching side and the surface (i) of the support (I) having a surface roughness of 40 nm or more are directly laminated.

[12] The composite sheet for forming a resin film according to the above [11], wherein the surface (α) of the exposed resin film-forming sheet is removed when the support (I) of the composite film for forming a resin film is removed The surface roughness (Ra) is 40 nm or more.

[13] The composite sheet for forming a resin film according to the above [11], wherein the sheet for forming a resin film contains a thermosetting component (B1).

[14] The composite sheet for forming a resin film according to the above [11] or [12], which is provided on the surface (β) opposite to the surface (α) of the sheet for forming a resin film, and then directly laminated The second support (II) is configured to contain a thermosetting component (B1).

[15] The composite sheet for forming a resin film according to the above [14], wherein the support (II) has an adhesive sheet of an adhesive layer and has a surface (β) of the adhesive layer and the sheet for forming a resin film. The composition of direct accumulation.

The sheet for forming a resin film of the present invention is excellent in secondary workability. Therefore, when it is determined that it is necessary to reattach the sheet for forming a resin film of the present invention, the sheet for forming a resin film can be peeled off without causing the occurrence of the residue. The wafer after stripping with the sheet can be reused.

In the present specification, the "secondary workability of the sheet for forming a resin film" means that the resin film is not peeled off and the resin film is not formed on the silicon wafer when it is peeled off after being attached to the silicon wafer. One of the properties of the sheet which is peelable.

1a, 1b, 1c, 1d‧‧‧ composite film for resin film formation

10‧‧‧Sheet film for resin film formation

11, 11'‧‧‧ Support

12‧‧ ‧ fixtures

Fig. 1 is a cross-sectional view showing a composite sheet for forming a resin film in the same state of the present invention.

In the description of the present specification, the values of the mass average molecular weight (Mw) and the number average molecular weight (Mn) of each component are values in terms of standard polystyrene measured by a gel permeation chromatography (GPC) method, specifically based on The values measured by the methods described in the examples.

In the present specification, for example, "(meth)acrylate" is used as a term indicating both "acrylate" and "methacrylate", and the same applies to other similar terms.

In the present specification, the term "energy line" means, for example, an ultraviolet ray or an electron beam.

[Resin film forming sheet]

The sheet for forming a resin film of the present invention is used for attaching to a tantalum wafer, and forming a sheet of a resin film on the tantalum wafer, and the surface of the sheet is rough with the surface (α) of the side to which the tantalum wafer is attached. The degree (Ra) (hereinafter also referred to as "surface roughness (Ra) of the surface (α)") is 40 nm or more.

In the sheet for forming a resin film of the present invention, since the surface roughness (Ra) of the surface (α) is 40 nm or more, the sheet for forming a resin film can be prevented from being damaged by the wafer after being attached to the wafer. The sheet for forming a resin film can be peeled off while suppressing the occurrence of residue, and the secondary workability is excellent.

On the other hand, the sheet for forming a resin film having a surface roughness (Ra) of the surface (α) of less than 40 nm is peeled off after being attached to the tantalum wafer, and the sheet for forming a resin film is formed on the tantalum wafer. The situation of the residue. Moreover, if it is strongly peeled off, there is also a case where the wafer is damaged.

From the above viewpoint, the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film of the present invention is preferably 45 nm or more, more preferably 50 nm or more, still more preferably 53 nm or more, still more preferably 55 nm or more.

In addition, the upper limit of the surface roughness (Ra) of the surface (α) is not particularly limited as long as the secondary workability is good.

The surface roughness (Ra) of the surface (α) of the sheet for forming a resin film of the present invention is preferably 150 nm or less, more preferably from the viewpoint of the sheet for forming a resin film which is excellent in adhesion to the ruthenium wafer. It is 100 nm or less, and more preferably 80 nm or less.

In the present specification, the surface roughness (Ra) of the surface (α) means a value measured by the method described in the examples.

In addition, the surface roughness (Ra) of the surface (α) can be adjusted, for example, by appropriately setting the type, average particle diameter, and content of the fine particle component such as a filler or a colorant which can be contained in the sheet for forming a resin film. It can also be adjusted by attaching a support having a relatively thick surface.

Further, in the same aspect of the invention, the surface roughness (Ra) of the surface (α) of the resin film-forming sheet and the surface (β) of the opposite side is not particularly limited, but is preferably 5 to 80 nm, more preferably 8 ~60nm, and more preferably 10~45nm.

When it is in this range, it is easy to adjust the gloss value of the surface (β') of the resin film described later from the sheet for forming a resin film to be high. In addition, when the silicon wafer having the resin film formed from the resin film forming sheet or the wafer obtained from the germanium wafer is inspected by electromagnetic waves such as infrared rays, the electromagnetic wave permeability can be improved.

The surface (α) of the resin film-forming sheet of the same state of the present invention is attached to the tantalum wafer, and the surface of the resin film formed of the resin film-forming sheet opposite to the tantalum wafer (β') The gloss value measured is preferably 25 or more, more preferably 30 or more, still more preferably 35 or more, and still more preferably 40 or more.

When the gloss value of the surface (β') of the resin film is 25 or more, the resin film excellent in visibility of laser printing can be obtained.

In the same manner as in the present invention, the resin film-forming sheet and the resin film formed of the resin film-forming sheet have a wavelength of 1250 nm. The transmittance is preferably 25% or more, more preferably 30% or more, more preferably 35% or more, and even more preferably 40% or more.

When the light transmittance is 25% or more, the infrared ray transmittance is good, and infrared ray inspection can be performed on a ruthenium wafer or wafer including a resin film formation sheet or a resin film formed from the resin film formation sheet. In other words, the resin film forming sheet or the resin film can easily detect cracks or the like generated in the wafer or the wafer, so that the product yield can be improved.

Further, the light transmittance at a wavelength of 1250 nm of the sheet for forming a resin film means a value measured by the method described in the examples.

The form of the sheet for forming a resin film of the present invention is not particularly limited, and may be, for example, a long tape shape or a single-piece label.

Moreover, the sheet for forming a resin film of the present invention may be a single layer formed of one type of composition, or a multilayer body formed of two or more types of compositions.

Further, when the sheet for forming a resin film in the same state of the present invention is a multilayer body, the composition (α') of the material forming on the surface (α) side is preferably such that the surface roughness (Ra) of the surface (α) becomes the above. The range of ingredients or the amount of blending is adjusted in the range.

In the same manner as in the present invention, the thickness of the sheet for forming a resin film is appropriately set depending on the use, but is preferably from 1 to 300 μm, more preferably from 3 to 250 μm, still more preferably from 5 to 200 μm, and even more preferably from 7 to 7. 150 μm.

In particular, when the thickness of the ruthenium wafer to which the resin film-forming sheet is attached is thin, the thickness of the sheet for forming a resin film is preferably from 1 to 20 μm, more preferably from 3 to 15 μm.

When the sheet for forming a resin film is a multilayer body composed of two or more layers, The total thickness of the multilayer body is also preferably in the above range.

<Composition component of sheet for forming a resin film>

In the sheet for forming a resin film of the same state of the present invention, if the surface roughness (Ra) of the surface (α) is in the above range, the constituent component is not particularly limited.

The resin film-forming sheet of the present invention preferably contains the polymer component (A) and the curable component (B) from the viewpoint of the sheet for forming a resin film which is excellent in the shape of the sheet.

In addition, from the viewpoint of adjusting the surface roughness (Ra) of the surface (α) to the above range and the thermal expansion coefficient of the resin film formed of the sheet for forming a resin film to an appropriate range, the resin of the present invention is the same. The film forming sheet preferably contains a filler (C).

Further, the sheet for forming a resin film in the same state of the present invention may further contain a coloring agent (D), a coupling agent (E), and a widely used additive (F) insofar as the effects of the present invention are not impaired. One or more of the choices.

Hereinafter, the above components (A) to (F) which are constituent components of the sheet for forming a resin film which can be in the same state of the present invention will be described.

[Polymer component (A)]

In the present specification, the term "polymer component" means a polymer obtained by a polymerization reaction, and a compound having at least one repeating unit.

The sheet for forming a resin film used in the same manner of the present invention can easily impart flexibility by containing the polymer component (A), and can maintain the shape of the sheet-like shape. As a result, the storage elasticity of the sheet for forming a resin film can be obtained. The rate is adjusted to the above range.

The mass average molecular weight (Mw) of the polymer component (A) is preferably 20,000 or more, more preferably 20,000 to 3,000,000, from the viewpoint of adjusting the storage elastic modulus of the obtained sheet for forming a resin film to the above range. It is better for 100,000 to 2 million, and better for 150,000 to 1.5 million.

The glass transition temperature (Tg) of the acrylic polymer (A1) is preferably -40 ° C or higher, more preferably -30 to 50 ° C, still more preferably -20 to 20 ° C, and even more preferably -15 to 0. °C.

Absolute temperature (1) Calculation of glass transition temperature (Tg) of the addition, the present specification, the value of the acrylic-based polymers of the following formula will be: glass transition temperature (a Tg of _K) (unit K) expressed in terms of Celsius (Unit: °C) The value.

[In the above formula (1), W ₁ , W ₂ , W ₃ , W ₄ ... represent the mass fraction (% by mass) of the monomer component constituting the polymer component, Tg ₁ , Tg ₂ , Tg ₃ , Tg ₄ ... The glass transition temperature (unit: K) of the homopolymer of each monomer component constituting the polymer component is shown.

In the same manner as in the present invention, the content of the polymer component (A) in the sheet for forming a resin film is preferably from 5 to 60% by mass, more preferably from 5 to 60% by mass based on the total amount of the sheet for forming a resin film (100% by mass). 8 to 50% by mass, more preferably 10 to 45% by mass, and even more preferably 15 to 40% by mass.

In addition, in this specification, "component (A) is relative to the resin film shape The content of the total amount of the sheet to be formed is the same as the content of the total amount of the active ingredient of the component (A) with respect to the composition of the material for forming the sheet for forming a resin film. The contents of the other components described below are also the same.

In addition, the term "active ingredient" as used herein means a component other than a substance such as a solvent in the composition which does not directly or indirectly affect the physical properties of the reaction or the formed sheet, and specifically means water and an organic solvent. Other than the solvent.

The polymer component (A) preferably contains an acrylic polymer (A1).

Further, the polymer component (A) may contain a non-acrylic polymer (A2) together with the acrylic polymer (A1).

These polymer components can be used individually or in combination of 2 or more types.

In the same manner as in the present invention, the content of the acrylic polymer (A1) is preferably from 50 to 100% by mass, more preferably 60%, based on the total amount of the polymer component (A) contained in the sheet for forming a resin film. ~100% by mass, more preferably 70 to 100% by mass, and even more preferably 80 to 100% by mass.

(acrylic polymer (A1))

The mass average molecular weight (Mw) of the acrylic polymer (A1) is preferably adjusted to the above range by setting the storage elastic modulus of the sheet for forming a resin film to the above range. 20,000 to 3 million, more preferably 100,000 to 1.5 million, and even better, 150,000 to 1.2 million, and even better, 250,000 to 1 million.

As the acrylic polymer (A1), for example, (meth) propyl The polymer containing alkenoic acid ester as a main component, specifically, preferably contains an acrylic polymer derived from a constituent unit (a1) of an alkyl (meth)acrylate having an alkyl group having 1 to 18 carbon atoms, and further It may be an acrylic copolymer containing a constituent unit other than the constituent unit (a1).

Further, the acrylic polymer (A1) may be used singly or in combination of two or more.

Further, when the acrylic polymer (A1) is a copolymer, the form of the copolymer may be any of a block copolymer, a random copolymer, an alternating copolymer, and a graft copolymer.

(constituting unit (a1))

The alkyl carbon number of the (meth)acrylic acid alkyl ester constituting the structural unit (a1) is preferably from 1 to 18, more preferably 1 from the viewpoint of imparting flexibility and film-forming property to the sheet for forming a resin film. ~12, and better is 1~8.

The alkyl (meth)acrylate is exemplified by, for example, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, or amyl (meth)acrylate. , 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, n-octyl (meth)acrylate, n-decyl (meth)acrylate, isodecyl (meth)acrylate, ( Ethyl methacrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, and the like.

Further, these alkyl (meth)acrylates may be used singly or in combination of two or more.

Among these, an alkyl (meth)acrylate having a carbon number of 1 to 3 is preferable, and methyl (meth)acrylate is more preferable.

The content of the constituent unit (a11) derived from the alkyl (meth)acrylate having an alkyl group having 1 to 3 carbon atoms in the acrylic polymer (A1), relative to the total structural unit of the acrylic polymer (A1) 100% by mass), preferably 5 to 80% by mass, more preferably 15 to 70% by mass, still more preferably 25 to 60% by mass.

Further, it is preferably an alkyl (meth)acrylate having an alkyl group having 4 to 12 carbon atoms, more preferably butyl (meth)acrylate.

The content of the constituent unit (a12) derived from the alkyl (meth)acrylate having an alkyl group having 4 to 12 carbon atoms in the acrylic polymer (A1), relative to the total structural unit of the acrylic polymer (A1) ( 100% by mass), preferably 5 to 80% by mass, more preferably 15 to 70% by mass, still more preferably 20 to 60% by mass.

Further, the acrylic polymer (A1) used in the same manner as in the present invention preferably contains an acrylic copolymer having both a constituent unit (a11) and a constituent unit (a12).

The content ratio [(a11)/(a12)] (mass ratio) of the constituent unit (a11) and the constituent unit (a12) of the acrylic copolymer is preferably 20/80 to 95/5, more preferably 30. /70~90/10, it is better for 40/60~85/15, and even better for 52/48~75/25.

The content of the constituent unit (a1) in the acrylic polymer (A1) is preferably 50% by mass or more, more preferably 50 to 99% by mass based on the total structural unit (100% by mass) of the acrylic polymer (A1). %, more preferably 55 to 98% by mass, and even more preferably 60 to 97% by mass.

(constituting unit (a2))

The acrylic polymer (A1) used in the same state of the present invention is not damaged. Further, in the range of the effects of the present invention, other constituent units (a2) other than the above-described constituent unit (a1) may be provided.

The monomer as the constituent unit (a2) is exemplified by a functional group-containing monomer such as a hydroxyl group-containing monomer, a carboxyl group-containing monomer, or an epoxy group-containing monomer; and vinyl acetate, vinyl propionate or the like. Ester monomer; olefin monomer such as ethylene, propylene or isobutylene; aromatic vinyl monomer such as styrene, methyl styrene or vinyl toluene; diene such as butadiene or isoprene Monomer; nitrile monomer such as (meth)acrylonitrile.

In the above, the functional group-containing monomer is preferably one or more selected from the group consisting of a hydroxyl group-containing monomer and an epoxy group-containing monomer.

Examples of the hydroxyl group-containing monomer are, for example, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, and 2-hydroxy(meth)acrylate. a hydroxyalkyl (meth)acrylate such as butyl ester, 3-hydroxybutyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate; an unsaturated alcohol such as vinyl alcohol or allyl alcohol.

Among these, 2-hydroxyethyl (meth)acrylate is preferred.

Examples of the carboxyl group-containing monomer are (meth)acrylic acid, maleic acid, fumaric acid, and itaconic acid.

Examples of the epoxy group-containing monomer include glycidyl (meth)acrylate, β-methylglycidyl (meth)acrylate, and (3,4-epoxycyclohexyl)methyl (meth)acrylate. An epoxy group-containing (meth) acrylate such as 3-epoxycyclo-2-hydroxypropyl (meth)acrylate; a non-acrylic epoxy group such as glycidyl crotonate or glycidyl ether; Monomer;

Further, the Mw derived from the constituent unit of the epoxy group-containing monomer is 20,000 The acrylic polymer described above has thermosetting properties, but is not a curable component (B) but is included in the concept of the polymer component (A).

The acrylic polymer (A1) used in the same manner as in the present invention preferably contains a constituent unit (a21) derived from a hydroxyl group-containing monomer.

The content of the constituent unit (a21) derived from the hydroxyl group-containing monomer in the acrylic polymer (A1) is preferably from 1 to 40 by mass based on the total structural unit (100% by mass) of the acrylic polymer (A1). More than %, more preferably 5 to 30% by mass, still more preferably 8 to 25% by mass, and even more preferably 10 to 20% by mass.

Further, the acrylic polymer (A1) used in the same manner as in the present invention preferably contains a constituent unit (a22) derived from an epoxy group-containing monomer.

The content of the constituent unit (a22) derived from the epoxy group-containing monomer in the acrylic polymer (A1) is preferably 1 to the total structural unit (100% by mass) of the acrylic polymer (A1). 40% by mass or more, more preferably 5 to 30% by mass, still more preferably 8 to 25% by mass.

When an epoxy-based thermosetting component is used as the curable component (B) to be described later, since the carboxyl group reacts with the epoxy group in the epoxy-based curable component, the source of the acrylic polymer (A1) The content of the structural unit derived from the carboxyl group-containing monomer is preferably small.

When the epoxy-based thermosetting component is used as the curable component (B), the content of the structural unit derived from the carboxyl group-containing monomer is preferably based on the total structural unit (100% by mass) of the acrylic polymer (A1). It is 0 to 10% by mass or more, more preferably 0 to 5% by mass, still more preferably 0 to 2% by mass, and even more preferably 0% by mass.

The constituent unit (a2) in the acrylic polymer (A1) The amount is preferably from 1 to 50% by mass, more preferably from 2 to 45% by mass, even more preferably from 3 to 40% by mass, based on the total structural unit (100% by mass) of the acrylic polymer (A1).

(non-acrylic resin (A2))

The sheet for forming a resin film in the same manner as in the present invention may contain a non-acrylic polymer (A2) as a polymer component other than the acrylic polymer (A1) as necessary.

The non-acrylic polymer (A2) is exemplified by, for example, a polyester, a phenoxy resin, a polycarbonate, a polyether, a polyurethane, a polyoxyalkylene, a rubber-based polymer, or the like.

These non-acrylic polymers (A2) may be used singly or in combination of two or more.

The mass average molecular weight (Mw) of the non-acrylic polymer (A2) is preferably 20,000 or more, more preferably 20,000 to 100,000, and still more preferably 20,000 to 80,000.

[Sclerosing ingredient (B)]

The curable component (B) is a compound which forms a hard resin film by curing a sheet for forming a resin film, and has a mass average molecular weight (Mw) of less than 20,000.

The sheet for forming a resin film used in the present invention preferably contains at least one of the thermosetting component (B1) and the energy ray-curable component (B2) as the curable component (B), and the viewpoint of the curing reaction is sufficiently performed and the cost is reduced. View Preferably, it contains at least a hardening component (B1).

The thermosetting component (B1) is preferably a compound containing at least a functional group which is reacted by heating.

Further, the energy ray-curable component (B2) contains a compound (B21) having a functional group which is reacted by irradiation with an energy ray, and is polymerized and cured by irradiation with an energy ray.

The three-dimensional network structure is formed by reacting functional groups of the curable components to form a three-dimensional network structure.

The mass average molecular weight (Mw) of the curable component (B) is preferably used in combination with the component (A), and the viscosity of the composition for forming the sheet for forming a resin film is suppressed, and the handleability is improved. It is better to be 10,000 or less, and more preferably 100 to 10,000.

(thermosetting component (B1))

The thermosetting component (B1) is preferably an epoxy thermosetting component.

The epoxy-based thermosetting component is preferably one in which a thermosetting agent (B12) is combined with a compound (B11) having an epoxy group.

The epoxy group-containing compound (B11) (hereinafter also referred to as "epoxy compound (B11)") is exemplified by, for example, a polyfunctional epoxy resin, bisphenol A glycidyl ether and a hydride thereof, and a cresol novolac ring. A novolak type epoxy resin such as an oxygen resin, a dicyclopentadiene type epoxy resin, a biphenyl type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenyl group skeleton ring An epoxy compound or the like having two or more functional groups in the molecule such as an oxygen resin.

These epoxy compounds (B11) may be used singly or in combination of two or more.

In the above, one or more selected from the group consisting of a novolac type epoxy resin and a biphenyl type epoxy resin are preferably contained.

Further, in the same manner as in the present invention, the epoxy compound (B11) preferably contains an epoxy compound (hereinafter also referred to as "liquid epoxy compound") which is liquid at 25 °C.

When the epoxy compound (B11) is contained in the liquid epoxy compound, the value of the elongation at break of the sheet for forming a resin film can be increased, and the sheet for forming a resin film having excellent secondary workability can be obtained.

In the same manner as the above, the content of the liquid epoxy compound is preferably 10% by mass or more based on the total amount (100% by mass) of the epoxy compound (B11) in the sheet for forming a resin film. It is preferably 15% by mass or more, more preferably 30% by mass or more, and even more preferably 40% by mass or more.

On the other hand, the content of the liquid epoxy compound is based on the total amount of the epoxy compound (B11) in the sheet for forming a resin film, from the viewpoint of improving the reliability of the wafer with the resin film produced using the sheet for forming a resin film. (100% by mass) is preferably 90% by mass or less, more preferably 80% by mass or less, still more preferably 75% by mass or less, and still more preferably 70% by mass or less.

In the present specification, the term "liquid epoxy compound" means a viscosity of 40 Pa at 25 ° C. The epoxy compound below s. Further, in the present specification, the viscosity of the epoxy compound at 25 ° C is a value measured at 25 ° C using an E-type viscometer in accordance with JIS Z 8803.

The content of the epoxy compound (B11) is preferably from 1 to 500 parts by mass, more preferably from 3 to 300 parts by mass, still more preferably from 5 to 150 parts by mass, even more preferably 10 parts by mass based on 100 parts by mass of the component (A). ~100 parts by mass.

(thermal hardener (B12))

The thermosetting agent (B12) functions as a curing agent for the epoxy compound (B11).

The thermosetting agent is preferably a compound having two or more functional groups reactive with an epoxy group in one molecule.

Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amine group, a carboxyl group, and an acid anhydride. Among these, a phenolic hydroxyl group, an amine group or an acid anhydride is preferred, and a phenolic hydroxyl group or an amine group is more preferred, and an amine group is more preferred.

Examples of the phenolic thermosetting agent having a phenolic hydroxyl group are, for example, a polyfunctional phenol resin, a biphenol, a novolac type phenol resin, a dicyclopentadiene type phenol resin, a polyphenol ether (xyloc) type phenol resin, and an aralkyl group. Basic phenol resin and the like.

The amine-based thermosetting agent having an amine group is exemplified by, for example, dicyandiamide (DICY).

These thermosetting agents (B12) may be used alone or in combination of two or more.

Among these, an amine-based thermosetting agent is preferably contained.

The content of the thermal curing agent (B12) is preferably from 0.1 to 500 parts by mass, more preferably from 0.5 to 300 parts by mass, even more preferably from 1 to 200 parts by mass, per 100 parts by mass of the epoxy compound (B11).

(hardening accelerator (B13))

The sheet for forming a resin film in the same state of the present invention may contain a curing accelerator (B13) from the viewpoint of adjusting the curing rate by heating of the sheet.

The hardening accelerator (B13) is preferably used together with the epoxy compound (B11) as the thermosetting component (B1).

As the hardening accelerator (B13), for example, a tertiary amine such as tri-ethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, or tris(dimethylaminomethyl)phenol is exemplified. 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5 An imidazole such as hydroxymethylimidazole; an organic phosphine such as tributylphosphine, diphenylphosphine or triphenylphosphine; tetraphenylphosphonium tetraphenylborate; triphenylphosphine tetraphenylborate; Tetraphenylborate or the like.

These hardening accelerators (B13) can be used individually or in combination of 2 or more types.

The content of the curing accelerator (B13) is 100 parts by mass based on the total amount of the epoxy compound (B11) and the thermosetting agent (B12), from the viewpoint of improving the adhesion of the resin film formed from the sheet for forming a resin film. It is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 6 parts by mass, and more preferably 0.3 to 4 parts by mass.

(energy line hardening component (B2))

As the energy ray hardening component (B2), it can be used alone and has energy The compound (B21) which is a functional group which is reacted by the amount of light is irradiated, but it is preferably used in combination with the compound (B21) in combination with a photopolymerization initiator (B22). Further, the energy ray-curable component (B2) is preferably one which is cured by ultraviolet rays.

(Compound (B21) having a functional group reactive by irradiation with an energy ray)

The compound (B21) having a functional group reactive by irradiation with an energy ray (hereinafter also referred to as "energy ray-reactive compound (B21)") is exemplified by, for example, trimethylolpropane tri(meth)acrylate. Pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypentane (meth) acrylate, dipentaerythritol hexa(meth) acrylate, 1,4-butanediol bis ( Methyl) acrylate, 1,6-hexanediol di(meth) acrylate, oligoester (meth) acrylate, urethane (meth) acrylate oligomer, epoxy ( Methyl) acrylate, polyether (meth) acrylate, isoconic acid oligomer, and the like.

These energy ray-reactive compounds (B21) may be used alone or in combination of two or more.

Further, the mass average molecular weight (Mw) of the energy ray-reactive compound (B21) is preferably from 100 to 30,000, more preferably from 200 to 20,000, still more preferably from 300 to 10,000.

The content of the energy ray-reactive compound (B21) is preferably from 1 to 1,500 parts by mass, more preferably from 3 to 1200 parts by mass, even more preferably from 5 to 1,000 parts by mass, per 100 parts by mass of the component (A).

(Photopolymerization initiator (B22))

When the photopolymerization initiator (B22) is used in combination with the above-mentioned energy-ray-reactive compound (B22), the amount of light irradiation is small, and the sheet for forming a resin film can be hardened.

The photopolymerization initiator (B22) is exemplified by, for example, a benzoin compound, an acetophenone compound, a mercaptophosphine oxide compound, a titanocene compound, a thioxanthone compound, a peroxide compound, and the like.

As a more specific photopolymerization initiator, for example, 1-hydroxycyclohexyl phenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl diphenyl sulfide, Tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl ketone, diacetyl, β-chloropurine, 2,4,6-trimethylbenzhydrylbiphenyl Phosphine oxide and the like.

These photopolymerization initiators may be used singly or in combination of two or more.

The content of the photopolymerization initiator (B22) is preferably 0.1 to 100 parts by mass based on 100 parts by mass of the energy ray-reactive compound (B21), from the viewpoint that the curing reaction of the sheet for forming a resin film is sufficiently performed and the generation of the residue is suppressed. 10 parts by mass, more preferably 0.5 to 8 parts by mass, still more preferably 1 to 5 parts by mass.

In the same manner as in the present invention, the content of the curable component (B) in the sheet for forming a resin film is preferably from 5 to 50% by mass, more preferably from 5 to 50% by mass, based on the total amount of the sheet for forming a resin film (100% by mass). 8 to 40% by mass, more preferably 10 to 30% by mass, and even more preferably 12 to 25% by mass.

In addition, the "content of the curable component (B)" means the thermosetting component (B1) containing the epoxy compound (B11), the thermosetting agent (B12), and the curing accelerator (B13), and the energy contained therein. Linear reactive compound (B21) and The total content of the energy ray hardening component (B2) of the photopolymerization initiator (B22).

[Filling material (C)]

The sheet for forming a resin film in the same state of the present invention preferably contains a filler (C).

By including the filler (C), the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film is easily adjusted to the above range.

Further, the resin film forming sheet containing the filler (C) can adjust the thermal expansion coefficient of the formed resin film to an appropriate range, optimize the thermal expansion coefficient of the wafer with the resin film, and improve the reliability of the semiconductor device in which the wafer is assembled. Sex. Moreover, the moisture absorption rate of the resin film formed from the sheet for forming a resin film can also be reduced.

Examples of the filler (C) include polymethyl methacrylate fillers, organic fillers such as rubber-based particles, and cerium oxide, aluminum oxide, talc, calcium carbonate, titanium oxide, iron oxide, cerium carbide, and boron nitride. A powder such as a powder, an inorganic filler such as the spheroidized beads, a single crystal fiber, or a glass fiber.

These fillers (C) may be used alone or in combination of two or more.

In the case where the sheet for forming a resin film is thermosetting, it is preferably an inorganic filler, more preferably cerium oxide or aluminum oxide, from the viewpoint of excellent heat resistance and the like.

In the same state of the present invention, the surface roughness (Ra) of the surface (α) of the formed sheet for forming a resin film is easily adjusted to the above-mentioned range. From the viewpoint of the circumference, the average particle diameter of the filler (C) is preferably from 3 to 20 μm, more preferably from 5 to 15 μm.

When the content of the filler (C) is small, the surface roughness (Ra) of the surface (α) of the formed resin film-forming sheet is easily adjusted to the above. range.

However, by adding a large amount of filler (C) content or a composition of a composite film for forming a resin film to be described later, even when a filler (C) having a relatively small average particle diameter is used, it can be easily formed. The surface roughness (Ra) of the surface (α) of the sheet for forming a resin film is adjusted to the above range.

The average particle diameter of the filler (C) in the above case is preferably from 100 to 1000 nm, more preferably from 200 to 900 nm, still more preferably from 200 to 800 nm, even more preferably from 300 to 750 nm, and even more preferably from 400 to 400. 700nm.

When the average particle diameter of the filler (C) is 100 nm or more, the surface roughness (Ra) of the surface (α) of the formed sheet for forming a resin film can be easily adjusted by adjusting the content of the filler (C). In the above range.

Further, when the average particle diameter of the filler (C) is 1000 nm or less, the following advantages (1) to (4) are obtained.

(1) After the surface (α) of the sheet for forming a resin film is attached to the tantalum wafer, the surface (β') of the resin film formed of the resin film forming sheet on the opposite side to the tantalum wafer can be increased. Gloss value.

(2) It is easy to improve the permeability of electromagnetic waves such as the sheet for forming a resin film and the infrared rays of the resin layer. As a result, when the electromagnetic wave is inspected for a silicon wafer or a wafer having a resin film-forming sheet and a resin layer, the electromagnetic wave permeability is high, and the inspection work efficiency is good.

(3) In the process of irradiating the laser beam with the resin film forming sheet and the resin layer, it is easy to avoid the problem of laser diffusion due to the presence of the resin film forming sheet and the resin film.

(4) When a thin resin film-forming sheet having a thickness of 20 μm or less is produced, for example, in the composition coating step of forming a material for forming a resin film, it is easy to avoid coating film caused by a filler having a large particle diameter. Defects such as poor formation.

When the sheet for forming a resin film in the same state of the present invention is a multilayered body formed of two or more kinds of compositions, the composition of the material for forming the surface (α) side of the sheet for forming a resin film is preferably blended in the above range. The filler (C) having an average particle diameter adjusts the surface roughness (Ra) of the surface (α).

On the other hand, the composition of the material for forming the surface (β) side is based on the viewpoint of improving the gloss value measured on the surface (β') of the resin film formed of the sheet for forming a free resin film on the opposite side to the tantalum wafer. It is preferred to formulate a filler (C') having a smaller average particle diameter than the above range.

The average particle diameter of the filler (C') is usually from 1 to 400 nm, preferably from 1 to 250 nm, more preferably from 1 to 100 nm.

In the present specification, the average particle diameter of the fillers (C) and (C') means a value measured by a dynamic light scattering type particle size distribution meter (Nanotrack Wave-UT 151, manufactured by Nikkiso Co., Ltd.).

In the same manner as in the present invention, the content of the filler (C) in the sheet for forming a resin film is adjusted based on the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film, and the use thereof The reliability of the wafer with the resin film produced by the sheet for forming a resin film is good, The total amount (100% by mass) of the sheet for forming a resin film is preferably from 10 to 80% by mass, more preferably from 20 to 70% by mass, still more preferably from 30 to 65% by mass, even more preferably from 40 to 60%. quality%.

In the same manner as in the present invention, the total content of the polymer component (A), the curable component (B), and the filler (C) in the sheet for forming a resin film is 100% by mass based on the total amount of the sheet for forming a resin film. The amount is preferably 60% by mass or more, more preferably 70% by mass or more, still more preferably 80% by mass or more, and still more preferably 90% by mass or more.

[Colorant (D)]

The sheet for forming a resin film in the same state of the present invention may further contain a coloring agent (D).

When a semiconductor wafer having a resin film formed of a sheet for forming a resin film is assembled in a device by including a coloring agent (D) in the sheet for forming a resin film, it is difficult to recognize the grinding marks generated during the grinding of the semiconductor wafer. Finishing the appearance of the semiconductor wafer.

As the colorant (D), organic or inorganic pigments and dyes can be used.

As the dye, for example, any of an acid dye, a reactive dye, a direct dye, a disperse dye, a cationic dye, or the like can be used.

Further, the pigment is not particularly limited, and may be appropriately selected from conventional pigments, and examples thereof include, for example, a phthalocyanine dye, an isoindolinone yellow pigment, a diketopyrrolopyrrole red pigment, carbon black, iron oxide, and the like. Black pigments such as manganese oxide, aniline black, and activated carbon.

These coloring agents (D) may be used alone or in combination of two or more.

In addition, by using a phthalocyanine dye, an isoindolinone yellow pigment, and a diketopyrrolopyrrole red pigment, it is easy to obtain a resin film having improved light transmittance in the infrared region and low visible light transmittance.

The average particle diameter of the colorant (D) is preferably 400 nm or less, more preferably 300 nm or less, still more preferably 200 nm or less, still more preferably 100 nm or less, and still more preferably 10 nm or more, more preferably 20 nm or more.

In the same manner of the present invention, the content of the coloring agent (D) in the sheet for forming a resin film is preferably 0.01 to 20% by mass, more preferably 0.05, based on the total amount of the sheet for forming a resin film (100% by mass). ~15% by mass, more preferably 0.1 to 10% by mass, and even more preferably 0.15 to 5% by mass.

[coupler (E)]

The sheet for forming a resin film in the same state of the present invention may further contain a coupling agent (E).

By containing the coupling agent (E), the heat resistance of the resin film formed from the obtained sheet for forming a resin film can be prevented, and the water resistance can be improved. It also helps to improve the adhesion of the end after attaching to the wafer.

The crosslinking agent (E) is preferably a compound which reacts with a functional group of the component (A) or the component (B), and more preferably a decane coupling agent.

Examples of the decane coupling agent are, for example, γ-glycidoxypropyltrimethoxydecane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)B. Trimethoxy decane, γ-(methacrylofluorene Propyl)trimethoxydecane, γ-aminopropyltrimethoxydecane, N-6-(aminoethyl)-γ-aminopropyltrimethoxydecane, N-6-(amino B -γ-aminopropylmethyldiethoxydecane, N-phenyl-γ-aminopropyltrimethoxydecane, γ-ureidopropyltriethoxydecane, γ-mercaptopropyl Trimethoxydecane, γ-mercaptopropylmethyldiethoxydecane, bis(3-triethoxydecylpropyl)tetrasulfide, methyltrimethoxydecane, methyltriethoxydecane, Vinyl trimethoxy decane, vinyl triethoxy decane, imidazolyl decane, and the like.

These coupling agents (E) may be used singly or in combination of two or more.

As the coupling agent (E), an oligomer type coupling agent is preferred.

The molecular weight of the coupling agent (E), which also includes the oligomer-type coupling agent, is preferably from 100 to 15,000, more preferably from 150 to 10,000, still more preferably from 200 to 5,000, and even more preferably from 250 to 3,000. It is even better for 350~2000.

In the same manner as in the present invention, the content of the coupling agent (E) in the sheet for forming a resin film is preferably 0.01 to 3.0% by mass, more preferably 0.03, based on the total amount of the sheet for forming a resin film (100% by mass). ~1.5% by mass, more preferably 0.05 to 0.8% by mass, still more preferably 0.1 to 0.3% by mass.

[A widely used additive (F)]

The sheet for forming a resin film used in the same manner as in the present invention may contain a widely used additive (F) as needed in addition to the above components, insofar as the effects of the present invention are not impaired.

As a widely used additive (F), for example, a crosslinking agent, a plasticizer, a leveling agent, an antistatic agent, an antioxidant, an ion trapping agent, and aggregation are exemplified. Agent, chain transfer agent, etc.

The content of the additive (F) which is widely used in the sheet for forming a resin film used in the same state of the present invention is preferably from 0 to 10% by mass based on the total amount of the sheet for forming a resin film (100% by mass). It is preferably 0 to 5 mass%, and more preferably 0 to 2 mass%.

<Method for Producing Sheet for Forming Resin Film>

The method for producing the sheet for forming a resin film of the present invention is not particularly limited, and it can be produced by a conventional method.

For example, a resin film-forming composition containing the above-described respective components, which is a material for forming a sheet for forming a resin film, is prepared, and then diluted with an appropriate organic solvent to obtain a solution for forming a resin film. Then, the solution for forming a resin film is applied onto a support to be described later by a conventional coating method to form a coating film, and the coating film is dried to produce a sheet for forming a resin film.

In addition, from the viewpoint of adjusting the surface roughness (Ra) of the surface (α) of the obtained sheet for forming a resin film to the above range, it is preferred to form the sheet for forming a resin film as a method for producing a sheet for forming a resin film. The resin film-forming composition of the material is coated on the surface of the support having a surface having a surface roughness (Ra) of 40 nm or more to form a coating film, and has a step of drying the coating film.

The resin film-forming composition may be diluted with a suitable solvent to form a solution of a resin film-forming composition.

Further, the surface roughness (Ra) of the surface of the support body is preferably 40 nm, more preferably 70 nm or more, and still more preferably 100 nm. Above, it is better to be 200 nm or more, and more preferably 300 nm or more. It is preferably 1000 nm or less, more preferably 800 nm or less, and still more preferably 500 nm or less.

In the case where the sheet for forming a resin film of the present invention is a multilayer film, the method for producing the sheet for forming a resin film may be applied to a resin film, for example, on two or more supports. A method of producing a coating film, laminating the coating film, and laminating the coating film, followed by drying.

The organic solvent used for the solution preparation of the resin film-forming composition is exemplified by, for example, toluene, ethyl acetate, methyl ethyl ketone or the like.

The solid content concentration of the solution of the resin film-forming composition in the preparation of the organic solvent is preferably from 10 to 80% by mass, more preferably from 20 to 70% by mass, even more preferably from 30 to 65% by mass.

Examples of the coating method include a spin coating method, a spray coating method, a bar coating method, a knife coating method, a roll coating method, a roll coating method, a blade coating method, and a die coating method. , gravure coating method, and the like.

<Use of Sheet for Forming Resin Film>

The sheet for forming a resin film in the same state of the present invention can be attached to the back surface of a workpiece such as a semiconductor wafer for wafer facing down, a wafer such as a semiconductor wafer, or the like, and a resin film is formed on the workpiece. This resin film functions as a protective film for protecting the back surface of a workpiece such as a semiconductor wafer or a semiconductor wafer. For example, when attached to a semiconductor wafer, since the resin film has a function of reinforcing the wafer, it is possible to prevent wafer damage or the like.

In other words, the sheet for forming a resin film in the same state of the present invention is preferably a sheet for forming a protective film for forming a protective film on a tantalum wafer.

Further, the resin film formed of the sheet for forming a resin film in the same manner of the present invention can also be provided as a function of the succeeding sheet. In other words, when the resin film formed by using the sheet for forming a resin film of the present invention has a function as a bonding film, the wafer having the resin film can be attached to other members such as a die bonding portion or another semiconductor wafer. (on the wafer mounting portion), it is possible to improve the productivity of manufacturing a semiconductor device.

In other words, the sheet for forming a resin film in the same state of the present invention can also be used as a sheet for forming an adhesive film for forming an adhesive film on a tantalum wafer.

[Composition of composite sheet for resin film formation]

The composite sheet for forming a resin film of the present invention (hereinafter also simply referred to as "composite sheet") has the sheet for forming a resin film of the present invention and a support.

Further, the form of the composite sheet in the same state of the present invention is not particularly limited, and may be in the form of, for example, a long tape shape or a single-piece label.

Fig. 1 is a cross-sectional view showing a composite sheet for forming a resin film in the same state of the invention.

As a composite sheet of the present invention, as shown in Fig. 1 (a), a composite sheet 1a having a structure in which a resin film forming sheet 10 is directly laminated on a support 11 is provided.

The shape of the sheet 10 for forming a resin film as a composite sheet in the same state of the present invention may be any shape that is substantially the same as the shape of the tantalum wafer to be adhered or includes a shape of a tantalum wafer.

Further, the composite sheet 1a in Fig. 1(a) has substantially the same shape as the support 11 and the resin film-forming sheet 10, but may have a shape ratio of the resin film-forming sheet 10 as shown in Fig. 1(b). The composite sheet 1b having a small shape of the support body 11.

Further, as a composite sheet of the same state of the present invention, as shown in Fig. 1 (c), a composite sheet 1c having a ring-shaped jig and a layer 12 is provided.

The annular jig adjoining layer 12 is provided to be attached to a jig of a ring frame or the like, and is provided for adhesion to the jig, and may be formed by adhering a sheet or an adhesive on both sides of the substrate (core material). .

Further, the composite sheet 1c shown in Fig. 1(c) shows a configuration in which the composite sheet 1a of Fig. 1(a) is further provided with the jig-attach layer 12, but the composite sheet which is the same as the present invention is also exemplified as A composite sheet having a structure of a jig subsequent layer 12 is provided on the surface of the support 11 of the composite sheet 1b of Fig. 1(b).

The composite sheet of the same state as the present invention may have a composite sheet 1d having a resin film forming sheet 10 sandwiched between two supports 11 and 11' as shown in Fig. 1(d).

Further, similarly to the configuration of the composite sheet 1d, a support different from the support 11 may be provided on the surface of the exposed resin film forming sheet 10 of the composite sheet 1b of Fig. 1(b).

In the same manner, a support different from the support 11 may be provided on the surface of the resin film-forming sheet 10 of the composite sheet 1c shown in Fig. 1(c) and the surface of the jig-attach layer 12.

<support>

The support system of the composite sheet of the same state of the present invention exhibits a release sheet which prevents dust or the like from adhering to the surface of the sheet for forming a resin film, or a crystallized sheet for protecting the surface of the sheet for forming a resin film, such as a dicing step. The role of the person.

The support used in the present invention preferably has a constitution of a resin film.

The resin film is exemplified by a polyethylene film such as a low density polyethylene (LDPE) film or a linear low density polyethylene (LLDPE) film, an ethylene/propylene copolymer film, a polypropylene film, a polybutene film, and a polybutylene. Diene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film , polyurethane film, ethylene/vinyl acetate copolymer film, polyurethane film, ethylene/vinyl acetate film, ionomer resin film, ethylene/(meth)acrylic acid copolymer Film, ethylene/(meth)acrylate copolymer film, polystyrene film, polycarbonate film, polyimide film, fluororesin film, and the like.

The substrate used in the same manner as in the present invention may be a single layer of one type of resin film, or a laminated film of two or more types of resin films.

Further, the resin film may be a crosslinked film.

Further, the resin film may be a colorant or a printer.

Further, the resin film can be thinned by extrusion molding of the thermoplastic resin, or can be extended or used to make the curable resin thin by a specific means. Membrane and hardened and thinned.

Among these resin films, a base material containing a polypropylene film is preferred because it is excellent in heat resistance, has ductility in order to have moderate flexibility, and is easy to maintain pick-up property.

Further, the structure of the substrate including the polypropylene film may be a single layer structure formed only of a polypropylene film, or may have a multilayer structure composed of a polypropylene film and another resin film.

When the resin film-forming sheet is thermosetting, the resin film constituting the substrate has heat resistance, thereby suppressing damage of the substrate due to heat and suppressing occurrence of defects in the semiconductor device manufacturing process.

When the support is used as a release sheet that prevents dust or the like from adhering to the surface of the sheet for forming a resin film, the support is preferably a resin film which is easily peeled off from the resin film formation sheet when attached to the ruthenium wafer or during the dicing step. .

Further, as the support, a resin film which is subjected to a release treatment on the surface of the resin film may be used.

As the peeling treatment method, a method of providing a release film formed of a release agent on the surface of the resin film is preferred.

The release agent is, for example, a release agent containing a resin selected from the group consisting of an acrylic resin, an alkyd resin, a polyoxymethylene resin, a fluorine resin, an unsaturated polyester resin, a polyolefin resin, and a wax resin. Wait.

When the support is used as a dicing sheet for fixing a sheet for forming a resin film in a dicing step or the like, it is preferable that the support has an adhesive layer formed of an adhesive layer formed of an adhesive on the resin film. sheet.

When the adhesive resin contained in the adhesive is focused on the structure of the adhesive resin, for example, an acrylic resin, a urethane resin, a rubber resin, a polyoxyn resin, or a vinyl ether resin is exemplified. When focusing on the function, for example, an energy ray-curable resin or the like is exemplified.

In the same manner as in the present invention, an adhesive of an energy ray-curable resin is preferably contained from the viewpoint of good pickup property.

The thickness of the support is appropriately selected depending on the use, but is preferably from 10 to 500 μm, more preferably from 20 to 350 μm, still more preferably from 30 to 200 μm.

Further, the thickness of the support is not only the thickness of the resin film constituting the support, but also the thickness of the adhesive layer or the release film when the adhesive layer or the release film is provided.

<Jigs and layers>

The jig adhesive layer may be a double-sided adhesive sheet having a substrate (core material) or may be formed of an adhesive composition containing an adhesive.

As the base material (core material), a resin film which can be used as the above-mentioned base material is preferable, and a polypropylene film is preferable.

Further, examples of the pressure-sensitive adhesive include an acrylic resin, a urethane resin, a rubber resin, a polyoxyn resin, and a vinyl ether resin.

The thickness of the adhesive layer is preferably from 1 to 80 μm, more preferably from 5 to 60 μm, even more preferably from 10 to 40 μm.

[Composite sheet for forming a resin film according to another aspect of the present invention]

The other aspect of the present invention is exemplified by the following composite sheet for resin film formation (hereinafter also referred to as "composite sheet (1)").

The composite sheet (1) of the present invention has a sheet for forming a resin film and a support (I) for forming a resin film on the tantalum wafer, which is attached to the above-mentioned FIG. The composite sheets 1a to 1d shown have the same structure.

The composite sheet (1) has a structure in which the surface (α) of the resin film-forming sheet on the side of the enamel wafer is directly laminated with the surface (i) of the support (I) having a surface roughness of 40 nm or more.

The surface (α) of the above-mentioned resin film-forming sheet which is exposed when the support (I) is removed from the composite sheet (1) is considered to have a surface roughness (Ra) of 40 nm formed on the surface (i) of the display support (I). The above concavities and convexities are the same as or less than the surface roughness (Ra) which is smaller than the surface roughness (Ra) formed on the surface (i) of the support (I).

Therefore, the surface roughness (Ra) of the surface (α) of the sheet for forming a resin film after removing the support (1) from the composite sheet (1) can be considered to be a specific value or more to the extent that the secondary workability is improved. In the same manner as the sheet for forming a resin film of the present invention described above, the secondary workability improving effect is obtained.

The sheet for forming a resin film which the composite sheet (1) of the same state of the present invention has is preferably thermosetting.

In the heating step after the resin film forming sheet is attached to the tantalum wafer, the resin film is formed as a sheet for forming a resin film having thermosetting properties. The uneven shape of the surface (α) of the sheet is easily deformed, and the void due to the uneven shape of the surface (α) of the sheet for forming a resin film is less likely to occur at the interface with the tantalum wafer. As a result, the resin film formed on the wafer can suppress light scattering due to the void, and it is easy to observe the wafer or wafer inspection with the resin film by electromagnetic waves such as visual observation or infrared rays.

The sheet for forming a resin film of the composite sheet (1) of the present invention preferably contains the thermosetting component (B1) from the viewpoint of imparting thermosetting properties.

The surface roughness (Ra) of the sheet for forming a resin film after the support (I) having the composite sheet (1) is preferably 40 nm or more, more preferably 45 nm or more, and even more preferably 50 nm or more. It is 53 nm or more, and more preferably 55 nm or more, and more preferably 200 nm or less, more preferably 150 nm or less, still more preferably 100 nm or less.

Further, the surface roughness (Ra) of the surface (i) as the support (I) is preferably 40 nm or more, more preferably 70 nm or more, still more preferably 100 nm or more, and even more preferably 200 nm or more. It is 300 nm or more, and preferably 1000 nm or less, more preferably 800 nm or less, and still more preferably 500 nm or less.

The support (I) of the composite sheet (1) is not particularly limited as long as the surface roughness (Ra) is in the above range and is a peelable support, but it is preferably paper or The resin film is preferably composed of a resin film from the viewpoint of reducing the possibility of occurrence of dust.

As the surface roughness of the surface (i) of the adjustment support (I) The method of (Ra) is, for example, a method of containing a filler in a resin film constituting the support (I), or a method of providing a release film formed from a release agent containing a filler.

Further, when the support (I) is composed of a resin film produced by melt extrusion, the molten resin may be sprayed onto a roll having a rough surface shape to adjust the surface roughness (Ra) to the above range. Resin film.

Further, as the material for forming the support (I), a material having a relatively thick surface such as paper or non-woven fabric is used, and the surface roughness (Ra) of the surface (i) of the support (I) can be adjusted.

Further, the composite sheet (1) may be a composite sheet 1d as shown in Fig. 1(d), and has a second support directly laminated on the surface (β) on the side opposite to the surface (α) of the sheet for forming a resin film. A composite sheet composed of the body (II).

The sheet for forming a resin film which the composite sheet has is preferably thermosetting. Therefore, the sheet for forming a resin film preferably contains the above-mentioned thermosetting component (B1).

Further, as shown in Fig. 1 (d), in the composite sheet (1) having the resin film-forming sheet sandwiched between the support (I) and the support (II), the surface of the resin film-forming sheet is used. (α) is attached to the enamel wafer, and the support film (II) and the resin film-forming sheet are laminated without being peeled off from the support (II), and the resin film-forming sheet is thermally cured. The gloss value measured on the surface (β') of the resin film on the opposite side to the tantalum wafer tends to be high. The gloss value is higher than the gloss value of the surface of the resin film (β') formed using the composite sheet having no support (II), or higher than the surface of the sheet for forming a resin film by peeling off the support (II) (β) ) exposed to form a state of thermal hardening The gloss value of the surface (β') of the resin film.

In other words, for example, when the gloss value of the surface (β') of the resin film is lowered by using a filler having a large average particle diameter as the filler (C) or the like, the composite sheet (1) is attached to the crucible. After the wafer is not peeled off from the support (II), the support film (II) and the resin film-forming sheet are laminated, and the resin film-forming sheet is thermally cured, and the visibility of the laser print can be high. Resin film.

When the sheet for forming a resin film is made to have thermosetting properties, the thermosetting component (B1) may be contained in the sheet for forming a resin film.

The support (II) is exemplified by the above-mentioned resin film, a resin film having a release film, an adhesive sheet having an adhesive layer, and the like, as the support of the composite sheet of the present invention.

Further, when the support (II) is an adhesive sheet having an adhesive layer, the composite sheet (1) preferably has a structure in which the adhesive layer and the surface (β) of the resin film-forming sheet are directly laminated. In this configuration, the adhesive layer is formed of an adhesive containing an energy ray-curable resin, and is cured by energy ray irradiation to form an adhesive layer, and the support (II) and the resin film-forming sheet are laminated. This sheet for forming a resin film is thermally cured, and the gloss value of the surface (β') of the formed resin film can be improved.

[矽 wafer regeneration method]

The method of regenerating the tantalum wafer by peeling the laminate of the resin film forming sheet from the laminate of the resin film forming sheet surface (α) of the present invention, for example, has the following steps (1) to (1) 2) After the wafer is regenerated law.

Step (1): attaching the adhesive layer having the adhesive sheet of the substrate and the adhesive layer to the surface of the surface of the resin film forming sheet of the laminate (opposite to the surface (α) to which the tantalum wafer is attached ( Step on β)

Step (2): a step of stretching the above-mentioned adhesive sheet attached to the step (1) and peeling off the resin film forming sheet attached to the tantalum wafer.

The method for regenerating the ruthenium wafer can be used for the resin film-forming sheet of the present invention which has excellent secondary workability in which the ruthenium wafer is not damaged and is detached without causing residue and can be peeled off. The nature of the person.

In addition, the method for regenerating the tantalum wafer can be applied not only to the laminate in which the tantalum wafer and the surface of the resin film forming sheet (α) of the present invention are attached, but also to the application of the laminate for about 24 hours. A laminate in a state in which the adhesion between the wafer and the resin film forming sheet is improved.

<Step (1)>

In the step (1), the adhesive layer having the adhesive sheet of the substrate and the adhesive layer is attached to the surface of the resin film-forming sheet of the laminate which is opposite to the surface (α) to which the tantalum wafer is attached ( Step on β).

The germanium wafer is not limited to the wafer before the singulation, and may be, for example, first diced, that is, by providing a groove from the surface of the wafer opposite to the grinding surface, and then grinding until reaching the trench The method of singulating a wafer into a wafer has been singulated.

The adhesive sheet used in this step has a substrate and a paste The layer of the agent. Further, when the composite sheet (1) having the support (II) made of the adhesive sheet is attached to the tantalum wafer, the support (II) can also be used as an "adhesive sheet" in this step.

The substrate is preferably a resin film, and is exemplified by the resin film exemplified in the above-mentioned support item.

The adhesive for forming the pressure-sensitive adhesive layer is not particularly limited as long as it has the adhesion to the extent that the resin film-forming sheet is peeled off from the wafer by the step (2).

Specific examples of the adhesive include, for example, an acrylic adhesive, a urethane adhesive, a polyoxygen adhesive, and the like.

The shape of the adhesive sheet is not particularly limited, and is preferably an adhesive sheet having the same shape as the resin film-forming sheet or a shape larger than the resin film-forming sheet, from the viewpoint of the operability of the next step (2).

In this step, the attachment method of the surface (β) and the adhesive layer of the adhesive sheet can be carried out by using a machine attached or manually.

In addition, the surface (α) of the sheet for forming a resin film having the composite sheet of the same aspect of the present invention is attached to a tantalum wafer, and an adhesive sheet such as a diced sheet which is a support on the surface (β) side is laminated. The adhesive sheet can also be utilized as an adhesive sheet of this step.

<Step (2)>

The step (2) is a step of stretching the adhesive sheet attached to the step (1) and peeling off the resin film forming sheet attached to the tantalum wafer.

In this step, since the surface roughness (Ra) of the surface (α) attached to the ruthenium wafer of the sheet for forming a resin film of the present invention is adjusted within the above range, the step (1) is attached thereto. The adhesive sheet of the surface (β) is stretched, and can be pulled together with the sheet for forming a resin film, and the sheet for forming a resin film can be peeled off from the wafer.

The peeling speed and the peeling angle of the adhesive sheet are not particularly limited and can be appropriately set.

In this step, the adhesive sheet can be stretched by a machine. However, from the viewpoint of workability, it is preferred to stretch the adhesive sheet by hand and peel the sheet for forming a resin film from the wafer.

Further, in this step, after the sheet for forming a resin film is peeled off, the surface of the wafer may be washed with an organic solvent such as ethanol, if necessary.

Through the above steps, the wafer in which the sheet for forming a resin film is temporarily attached can be regenerated.

[Examples]

<Measurement of mass average molecular weight (Mw) and number average molecular weight (Mn)>

Using a gel permeation chromatography apparatus (product name "HLC-8220GPC", manufactured by TOSOH Co., Ltd.), the measurement was carried out under the following conditions, and the measured values converted to standard polystyrene were used.

(measurement conditions)

. Column: Make "TSK guard column HXL-L", "TSK" Gel GMHXL (×2)” and “TSK gel G2000HXL” (both manufactured by TOSOH Co., Ltd.) were sequentially connected.

. Column temperature: 40 ° C

. Developing solvent: tetrahydrofuran

. Flow rate: 1.0mL/min

<Average particle diameter of components in the composition for forming a resin film>

The measurement was carried out using a dynamic light scattering type particle size distribution meter (manufactured by Nikkiso Co., Ltd., product name "Nanotrack Wave-UT151").

<Measurement of Surface Roughness (Ra)>

The surface roughness (Ra) of the surface to be measured was measured at a magnification of 10 times in a PSI mode using an optical interference type surface shape measuring device (product name "WYKO WT1100", manufactured by Veeco Metrology Group Co., Ltd.).

<Evaluation of secondary workability of sheet for forming a resin film>

The support (I) of the composite film for forming a resin film produced in the examples and the comparative examples was removed, and the surface (α) of the exposed resin film-forming sheet was laminated on a wafer polished by #2000 (diameter: 200 mm). On the polished surface of 280 μm thick, it was attached by heating to 70 ° C using a tape holder (manufactured by LINTEC Co., Ltd., product name "Adwill RAD-3600 F/12").

After attaching, at room temperature (25 ° C), the composite film for resin film formation is also removed. The support layer (II) of the sheet is attached to the surface of the exposed resin film-forming sheet by an adhesive layer of a commercially available widely used dicing tape (manufactured by LINTEC Co., Ltd., product name "Adwill D-510T"). .

Then, the widely used dicing tape was stretched by hand, and it was observed whether or not the sheet for forming a resin film was peeled off from the wafer, and whether or not the surface of the wafer was peeled off after peeling, and the sheet for forming a resin film was evaluated by the following criteria. Secondary processing.

A: The sheet for forming a resin film can be peeled off from the wafer. After the peeling, the residue of the resin film-forming sheet which was visually confirmed was not observed on the wafer.

B: The sheet for forming a resin film can be peeled off from the wafer. After the peeling, a residue of the sheet for forming a resin film was observed on the wafer, but it was completely removed by wiping with ethanol.

C: The wafer was peeled off during the peeling, or the wafer was peeled off without being damaged. However, on the wafer after the peeling, the residue of the sheet for forming a resin film which was difficult to wipe by ethanol was confirmed.

<Measurement of gloss value of resin film>

The support (I) of the composite film for forming a resin film produced in the examples and the comparative examples was removed, and the surface (α) of the exposed resin film-forming sheet was laminated on a wafer polished by #2000 (diameter: 200 mm). On the polished surface of 280 μm thick, it was attached by heating to 70 ° C using a tape holder (manufactured by LINTEC Co., Ltd., product name "Adwill RAD-3600 F/12").

After the attachment, the support of the composite sheet for resin film formation is also removed (II) The film was placed in a heating oven at 130 ° C for 2 hours to cure the resin film forming sheet, and a resin film was formed on the silicon wafer.

Next, a 60-degree specular gloss from the surface of the resin film formed on the side opposite to the side of the crucible wafer was measured in accordance with JIS Z 8741 using a gloss meter (product name "VG2000" manufactured by Nippon Denshoku Industries Co., Ltd.). The value of the specular gloss is taken as the gloss value of the resin film.

<Measurement of Light Transmittance of Resin Film at a Wavelength of 1250 nm>

The support (I) of the composite film for forming a resin film produced in the examples and the comparative examples was removed, and the surface (α) of the exposed resin film-forming sheet was laminated on a flat surface of a glass plate having a thickness of 2 mm, and a laminate was used. The machine is attached while heating to 70 °C.

After the attachment, the support (II) of the composite sheet for forming a resin film was removed, and the mixture was placed in a heating oven at 130 ° C for 2 hours to cure the resin film-forming sheet, and a resin film was formed on the glass plate.

Then, using a spectrophotometer (product name "VV-VIS-NIR spectrophotometer UV-3600" manufactured by Shimadzu Corporation), the transmittance of the resin film on the glass plate was measured, and the light transmittance at a wavelength of 1250 nm was measured ( %).

In the measurement, the large sample chamber "MPC-3100" (product name) attached to the spectrophotometer was used, and the measurement was performed without using the built-in integrating sphere. The difference in light transmittance between the wavelength of 1250 nm of the glass plate measured in advance was obtained, and the light transmittance of the resin film at a wavelength of 1250 nm was calculated.

Example 1

Each component of the type and the amount of the formulation shown in Table 1 was added and diluted with methyl ethyl ketone to prepare a solution of a resin film-forming composition having an active ingredient concentration of 51% by mass.

Next, a release treatment surface of a polyethylene terephthalate (PET) film (manufactured by LINTEC Co., Ltd., trade name "SP-PET381031", thickness: 38 μm) which was subjected to a release treatment as a support (II) The solution of the above-described resin film-forming composition was applied and dried to form a sheet for forming a resin film having a thickness of 25 μm.

Further, on the exposed surface of the formed resin film-forming sheet, a release paper (LINTEC Co., Ltd., trade name "SP-8LK AO", thickness: 88 μm, and cellophane coated with polyolefin) was bonded to the support (I). The peeling-treated surface of the surface roughness (Ra) of the peeling-treated surface was applied to the surface of the surface of the treated surface (Ra) = 370 nm), and a laminator (product name "VA-400" manufactured by Daisei LAMINATOR Co., Ltd.) was used at room temperature. (25 ° C) The composite sheet for resin film formation comprising the support (I) / resin film-forming sheet / support (II) was produced.

Comparative example 1

On the exposed surface of the sheet for forming a resin film formed in the same manner as in Example 1, it was bonded to a polyethylene terephthalate (PET) film which was subjected to a release treatment as a support (I) (LINTEC Corporation) In the same manner as in Example 1, a support (I) / resin film-forming sheet/support was produced in the same manner as in Example 1 except that the product was "SP-PET251130" (thickness: 25 μm). (II) A composite sheet for forming a resin film.

The details of the respective components described in Table 1 used for preparation of the resin film-forming composition are as follows.

<Polymer component (A)>

. (A-1): Acrylic copolymer obtained by copolymerizing methyl acrylate (MA), n-butyl acrylate (BA), glycidyl methacrylate (GMA) and 2-hydroxyethyl acrylate (HEA) (BA/MA/GMA/HEA=37/28/20/15 (% by mass), Mw=800,000, Tg=-10.1 °C)

<hardenable component (B)>

. (B-1): bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name "jER828", epoxy equivalent = 184 to 194 g/eq, Mn = 370, viscosity at 25 ° C = 120 to 150 P (12-15 Pa.s), a liquid epoxy resin equivalent to the compound of the above component (B11).

. (B-2): bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name "jER1055", epoxy equivalent = 800 to 900 g/eq, Mn = 1,600, solid epoxy resin, equivalent to the above components (B11) compound).

. (B-3): Dicyclopentadiene type epoxy resin (manufactured by DIC Corporation, trade name "EPICLON HP-7200HH", epoxy equivalent = 255 to 260 g/eq, Mn not up to 20,000 compounds, solid The epoxy resin corresponds to the compound of the above component (B11).

. (B-4): dicyanamide (trade name "ADEKA HARDNER EH-3636AS", manufactured by ADEKA CORPORATION, amine-based curing agent, active hydrogen equivalent = 21 g/eq, equivalent to the compound of the above component (B12) ).

. (B-5): 2-phenyl-4,5-dihydroxymethylimidazole (manufactured by Shikoku Chemicals Co., Ltd., trade name "CUREZOL 2PHZ", hardening accelerator, equivalent to the compound of the above component (B13) ).

<Filling material (C)>

. (C-1): cerium oxide filler (manufactured by ADMTECHS Co., Ltd., trade name "SC2050MA", average particle diameter = 500 nm)

<Colorant (D)>

. (D-1): Carbon black (manufactured by Mitsubishi Chemical Corporation, trade name "#MA650", average particle diameter = 28 nm).

<decane coupling agent (E)>

. (E-1): a decane coupling agent (3-glycidoxypropylmethyldimethoxydecane, manufactured by Shin-Etsu Chemical Co., Ltd., trade name "KBM-402", Mn = 220.3).

The physical properties of the sheets for forming a resin film produced in the examples and the comparative examples and the evaluation results are shown in Table 1 based on the above methods.

As is apparent from Table 1, the sheet for forming a resin film which the composite sheet for resin film formation produced in Example 1 of the present invention is excellent in secondary workability. Further, the gloss value of the resin film formed from the sheet for forming a resin film and the light transmittance at a wavelength of 1250 nm were also high.

On the other hand, the surface (α) of the resin film-forming sheet of the composite sheet for forming a resin film produced in Comparative Example 1 has a small surface roughness (Ra), so that it is difficult to peel off after being attached to the tantalum wafer. It becomes the result of poor secondary processing.

[Industrial availability]

The sheet for forming a resin film in the same state of the present invention can be preferably used as a material for forming a protective film for protecting the back surface of a semiconductor wafer or as a material for forming an adhesive film which can be attached to a die pad or other portion.

Claims (15)

A sheet for forming a resin film for attaching to a tantalum wafer, and forming a sheet of a resin film on the tantalum wafer, and having a surface roughened with a surface ( α ) attached to the side of the tantalum wafer The degree (Ra) is 40 nm or more. The sheet for forming a resin film according to the first aspect of the invention includes the polymer component (A) and the curable component (B). The sheet for forming a resin film according to the second aspect of the invention, wherein the polymer component (A) comprises an acrylic polymer (A1). The sheet for forming a resin film according to any one of claims 1 to 3, which comprises a thermosetting component (B1). The sheet for forming a resin film according to any one of claims 1 to 4, which further comprises a filler (C). The sheet for forming a resin film according to the fifth aspect of the invention, wherein the content of the filler (C) is from 10 to 80% by mass based on the total amount of the sheet for forming a resin film. The sheet for forming a resin film according to the fifth or sixth aspect of the invention, wherein the filler (C) has an average particle diameter of 100 to 1000 nm. The sheet for forming a resin film according to any one of claims 1 to 7, which is a sheet for forming a protective film for forming a protective film on a tantalum wafer. The sheet for forming a resin film according to any one of the first to eighth aspects of the present invention, wherein the surface ( α ) of the resin film-forming sheet is attached to the ruthenium wafer, and the sheet for forming a resin film is formed. The gloss value of the surface of the tantalum wafer of the resin film measured on the opposite side (β') was 25 or more. A composite sheet for forming a resin film, which comprises the sheet for forming a resin film and the support according to any one of the first to ninth aspects of the invention. A composite sheet for forming a resin film, which has a resin film forming sheet and a support (I) for forming a resin film on the tantalum wafer, and has a ruthenium wafer attached thereto The surface ( α ) of the resin film-forming sheet on the side of the side and the surface (i) of the support (I) having a surface roughness of 40 nm or more are directly laminated. The composite sheet for forming a resin film according to the eleventh aspect of the invention, wherein the surface ( α ) of the exposed resin film-forming sheet is removed when the support (I) of the resin film-forming composite sheet is removed The surface roughness (Ra) is 40 nm or more. The composite sheet for forming a resin film according to the invention of claim 11 or 12, wherein the sheet for forming a resin film contains a thermosetting component (B1). The composite sheet for forming a resin film according to claim 11 or 12, which has a surface ( β ) opposite to the surface ( α ) of the sheet for forming a resin film, and directly laminates the second support ( In the configuration of the second embodiment, the sheet for forming a resin film contains the thermosetting component (B1). The composite sheet for forming a resin film according to claim 14, wherein the support (II) has an adhesive sheet of an adhesive layer, and the adhesive layer and the surface ( β ) of the resin film-forming sheet are directly laminated. The composition.