WO2004100254A1 - 基板吸着装置 - Google Patents
基板吸着装置 Download PDFInfo
- Publication number
- WO2004100254A1 WO2004100254A1 PCT/JP2004/006002 JP2004006002W WO2004100254A1 WO 2004100254 A1 WO2004100254 A1 WO 2004100254A1 JP 2004006002 W JP2004006002 W JP 2004006002W WO 2004100254 A1 WO2004100254 A1 WO 2004100254A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- suction
- substrate
- housing
- suction pad
- pad
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
Definitions
- the present invention relates to a substrate suction device for holding a thin substrate such as a glass substrate or a semiconductor wafer used for, for example, flat panel display (hereinafter abbreviated as F PD).
- a substrate suction device for holding a thin substrate such as a glass substrate or a semiconductor wafer used for, for example, flat panel display (hereinafter abbreviated as F PD).
- the gap between the suction tool and the storage hole is made small in order to position the glass substrate with high precision or prevent the glass substrate from oscillating during transportation, the movement of the suction tool in the tilting direction is restricted. Be done. As a result, it becomes difficult for the suction pad to tilt following the warping of the glass substrate.
- a housing which is hollow and has an opening at its tip
- a suction package which is provided in the hollow shape of the housing and provided with an air drawing passage for drawing air. It is placed on the suction pad support member in a state of protruding from the opening of the housing and the opening of the housing, and it can be oscillated by point contact with the opening of the housing at at least three points.
- a suction pad holding means for holding the suction pad in the opening of the housing.
- FIG. 1 is a block diagram showing a first embodiment of a substrate suction apparatus according to the present invention.
- Fig. 2 is a configuration diagram showing another example of the adsorption section of the adsorption package in the same device.
- FIG. 3 is a block diagram of the first and second support plates in the same device.
- Fig. 4A shows the start of copying of the suction pad onto the bent glass substrate in the same device.
- Fig. 4B shows the adsorption state of the adsorption pad on the stagnant glass substrate in the same device.
- Fig. 4C is a diagram showing the correction operation of the glass substrate by the suction pad in the same device.
- Fig. 5 is a top view of the air levitation transfer device to which the same device is applied.
- Figure 6 is a side view of the same device.
- FIG. 8 is a block diagram showing the characterizing portion of the second embodiment of the substrate suction apparatus according to the present invention.
- Fig. 9A is a configuration diagram showing a modified array using wires in the same device.
- Figure 9B is a block diagram showing a modified array using wires in the same device.
- Fig. 10 is a configuration diagram showing a modification of the suction pad in the same device.
- FIG. 11 is a block diagram showing a third embodiment of the substrate suction device according to the present invention.
- Fig. 12 A shows the start of the suction operation of the suction pad to the glass substrate in the same device.
- Fig. 12 B is a diagram showing how the suction pad contacts the glass substrate in the same device.
- Fig. 12 C is a diagram showing how the adsorption pad is attached to the glass substrate in the same device.
- FIG. 13 is a block diagram showing a fourth embodiment of the substrate suction device according to the present invention.
- Figure 14 is a block diagram of the part of a large substrate transfer robot to which the same system is applied.
- FIG. 15 is a block diagram showing a fifth embodiment in which the first and second substrate suction devices according to the present invention are applied to an alpha floating transfer device.
- Figure 16 shows the air vacuum system used for the same substrate suction device.
- FIG. 17 is a configuration diagram showing a sixth embodiment in which the substrate suction device according to the present invention is applied to an air floating conveyance device.
- FIG. 18 is a block diagram showing a sixth embodiment in which the substrate suction device according to the present invention is applied to an air floating conveyance device.
- FIG. 19 is a view showing a modified example of the air evacuation system in the substrate suction apparatus according to the present invention.
- Fig. 20 A is a view showing a modified example of the shape of the contact surface portion of the suction pad.
- Fig. 20 B is a view showing a modified example of the shape of the contact surface of the suction pad.
- Fig. 20C is a view showing a modified example of the shape of the contact surface portion of the suction pad.
- Fig. 20 D is a view showing a modified example of the shape of the contact surface portion of the suction pad.
- Fig. 20 E is a view showing a modified example of the shape of the contact surface portion of the suction pad.
- FIG. 1 is a block diagram of the substrate suction device E.
- the housing 1 is formed in a cylindrical shape that is hollow by metal, and a hollow portion 2 is formed inside thereof.
- An opening 1 b having a circular end 1 a is formed on the tip end side which is one end of the housing 1.
- a threaded portion 1 c is provided on the inner wall of the opening at the other end of the housing 1.
- the base of the housing 1 is attached to the main body 4 mounted on the mount 3 for the substrate suction device E.
- the unit body 4 has an outer diameter substantially matching the diameter of the nose 1 and the hollow 1, and is formed in the shape of a hollow weir in which an air drawing passage 5 is provided.
- a screw portion 4 a is provided on the outer peripheral surface of the unit main body 4.
- the housing 1 can be attached to and removed from the body 4 by screwing the screw portion 1 c and the screw portion 4 a.
- the mounting chuck for the substrate suction unit E is attached in the lower part of the main body 4 of the mounting tool.
- the flange 4 b is provided projecting.
- the body 4 can be attached to and removed from the mount 3 by screwing the threaded portion 4 b with the screw of the mount 3 for the substrate suction device Ei.
- a threaded portion 4 c is provided inside the hollow shape of the fitting body 4. Also, a screw 4 d is provided on the outer peripheral surface of the unit body 4. A nut 6 is screwed into this screw 4 d. This nut 6 fixes the mounting position of the switch body 4 with respect to the housing 1 by tightening the screw 4 d.
- a groove 7 is provided in the circumferential direction of the lower inner wall surface of the housing 1. The position of this groove 7 corresponds to the end of the body 3 of the unit.
- An O-ring 8 for preventing air leakage is held between the inside of the groove 7 and the end of the unit main body 3.
- a sliding member 9 is provided in the hollow portion 2 of the housing 1 and on the tip end side of the unit body 3.
- the sliding member 9 is slidable in the hollow portion 2 of the housing 1 along the direction of the hollow portion 2.
- the sliding member 9 integrally forms a thick cylindrical portion 10 and a thin cylindrical portion 1 1.
- the thick cylindrical portion 10 is formed to have a diameter substantially matching the inner diameter of the hollow portion 2 of the housing 1, and the outer peripheral surface thereof is in close contact with the inner surface of the hollow portion 2 of the housing 1.
- a groove 12 is provided on the outer peripheral surface of the thick cylindrical portion 10, and a V-shaped packing 13 is provided in the groove 12.
- the V-shaped packing 1 3 opens in a V-shape when vacuuming is performed from the air drawing passage 5 of the unit main body 4. Keep air tight by preventing air leakage between hollow 2 of housing 1 and sliding member 9.
- the thin-walled cylindrical portion 11 is formed to have a diameter substantially equal to the inner diameter of the air drawing passage 5 of the unit body 4, and the outer peripheral surface thereof is in close contact with the air drawing passage 5 of the unit body 4.
- the thin cylindrical portion 1 1 is provided so as to be insertable into and removable from the air drawing passage 5.
- an air drawing passage 14 is provided inside the thick-walled cylindrical portion 10 and the thin-walled cylindrical portion 1 1, an air drawing passage 14 is provided.
- the air drawing passage 14 communicates with the air drawing passage 5 of the unit main body 4.
- a tube member 15 which is a suction pad supporting member is provided on the top of the sliding member 9.
- the tube member 15 is formed of a resilient member in a cylindrical shape, and has a bellows-like bent portion 17 in close contact with the suction pad 16 at the top.
- the tube member 15 is attached by screwing to the inside of the air drawing passage 1 4 in the sliding member 9 by means of the screw portion 1 8.
- An air drawing passage 1 9 is formed inside the tube member 1 5.
- the air drawing passage 1 9 is in airtight communication with the air drawing passage 1 4 of the sliding member 9.
- Suction pad 1 6 is placed on top of tube member 1 5.
- the suction node 16 protrudes from the open end 1 a of the housing 1.
- the suction pad 16 is made of, for example, a resin such as engineering plastic.
- the suction source 16 can be oscillated on the tube member 1 5 by being placed on the tube member 1 5.
- This suction pad 1 6 is a suction portion 16 b having a flat suction surface 16 a on the surface, and a contact surface portion 16 c having a curved surface that is integrally formed by hanging down on the back surface of the suction portion 16 b It will be An air suction hole 16 d is provided at the center of the suction portion 16 b.
- the suction portion 16 b has an outer diameter equal to the outer diameter of the housing 1.
- the suction portion 16 b comes into surface contact with the open end 1 a of the housing 1 to stop the lowering. Therefore, the open end 1a of the housing 1 serves as a stop for the lowering of the suction pad 16 and also maintains the inclination of the suction surface 16a of the suction pad 16 with the reference plane. Become.
- the suction portion 16 b is formed longer by a length D on the outer peripheral surface of the housing 1 It is also good. With such a suction portion 16 b, the area of the suction surface 16 a becomes large, and even if the glass substrate comes in contact with any portion of this suction surface 16 a, this contact occurs. When the distance between the point of action of the force applied and the center position P of the suction part 16 b is increased, the suction pad 16 swings on the tube member 1 5 by a slight force. Operate.
- the contact surface portion 16 c has a cylindrical shape, and its outer peripheral surface is formed in a hemispherical shape having a maximum diameter at the middle in the vertical direction.
- the contact surface portion 16 c is formed so that the maximum outer diameter dimension is slightly smaller than the inner diameter dimension of the hollow portion 2 (opening end la) of the housing 1, and is vertically inserted in the opening portion 1 b of the housing 1 It has been purchased for mobility.
- This contact surface portion 16 c is located in the hollow portion 2 of the housing 1. It is supported in point contact with at least 3 points on the wall 2 a.
- the contact between the contact surface portion 16 c and the inner wall 2 a of the hollow portion 2 of the housing 1 is not necessarily in point contact with at least only three points, and contact by the swing of the suction pad 16 It contacts at a plurality of points on the same circumferential line on the surface portion 16 c, or makes line contact on the same circumferential line. Due to the contact between the contact surface 16c and the inner wall 2a of the hollow portion 2 of the housing 1, the frictional resistance between the contact surface 16c and the inner wall 2a of the housing 1 is small. Suction pad 1 6 enables smooth swinging movement.
- An annular step 20 is provided in the air suction hole 16 d of the suction pad 16.
- the first support plate 21 shown in FIG. 3 is provided in the step 20.
- the first support plate 2 1 is formed in a disk shape, and is provided with two holes 21 a and 21 b for circulating air.
- An annular step 2 2 is provided in the air drawing passage 1 4 of the sliding member 9.
- a second support plate 2 3 having the same shape as the first support plate 2 1 is provided in the step 2 2.
- the first support plate 2 1 and the second support plate 2 3 are connected by, for example, a thin thread 2 4 as a wire member which is a connecting member.
- the thin yarn 2 4 is formed of, for example, nylon resin as a soft wire which does not stretch against tension and has high strength against breakage.
- This thin thread 2 4 has a constant distance between the first and second support plates 2 1 and 2 3 through the tube member 1 5 and the swing state of the suction pad 1 6
- the tube member 1 5 is tensioned to apply a biasing force that enables it to return to a horizontal position. It is done.
- the tension of this thin thread 24 can be adjusted when it is stretched between the first and second support plates 21 and 23.
- the thin thread 24 can be used as the first or second support plate 21. Adjustments can be made according to the binding conditions when binding to 2 3.
- the first support plate 2 1, the second support plate 2 3 and the thin thread 2 4 constitute suction pad holding means.
- a spring 2 5 is provided inside the air drawing passage 5 of the air drawing passage 1 4 in the thin-walled cylindrical portion 1 1 of the sliding member 9 and the air drawing passage 5 of the doublet body 4.
- the spring 25 is formed by integrating the suction pad 16, the tube member 15 and the sliding member 9 into the hollow portion 2 of the housing 1 from the sliding member 9 to the open end 1 a side of the housing 1. Give an urging force toward the The lower side of this spring 2 5 is locked to the spring adjustment member 2 6.
- Screws 2 6 a are provided on the outer peripheral surface of the spring adjustment member 2 6.
- the spring adjusting member 2 6 is internally mounted in the air pulling passage 5 by screwing the screw portion 2 6 a with the screw portion 4 c of the air pulling passage 5 of the union body 4.
- the spring adjusting member 2 6 is formed in a ring shape, and an air drawing passage 26 b is provided in the hollow portion thereof.
- the spring adjustment member 2 6 is rotated by screwing the screw portion 26 a with the screw portion 4 c to move up and down in the air drawing passage 5 to bias the spring 2 5.
- a suction pad height adjustment mechanism 2 7 is provided in the hollow portion 2 of the housing 1.
- the suction pad height adjusting mechanism 2 7 has an adjusting annular member 2 9 which is screwed to a screw portion 2 8 formed in the hollow portion 2 of the housing 1.
- the adjusting annular member 2 9 moves up and down in the hollow portion 2 of the housing 1 by rotating with respect to the screw portion 2 8.
- the suction pad 16, the tube member 15 and the sliding member 9 move up and down into the hollow portion 2 of the housing 1 as a body.
- the height position A of the suction pad 16 with respect to the open end 1 a of the housing 1 is adjusted.
- the substrate suction device ascends due to the lift mechanism.
- the glass substrate S is inclined, for example, due to warpage or stagnation.
- a part of the suction surface 16a of the suction pad 16 comes in contact with the back surface of the glass substrate 40, which is warped as shown in Fig. 4A, due to the rise of the substrate suction device.
- the suction pad 16 is placed on the tube member 15 and pulled to the lower side of the housing 1 by a thin thread 2 4. As a result, the suction pad 16 can swing on the tube member 15 and in its original posture, that is, the suction surface 16a does not swing unless the external force is applied. A biasing force is added to return to the horizontal position.
- the suction pads 16 are slightly below the glass substrate S. Since it contacts the back surface of the glass substrate S with an applied pressure, as shown in Fig. 4B, the glass substrate S will be in an oscillating state so as to follow the inclination of the glass substrate S due to warpage or stagnation. That is, since the suction pad 16 swings while inserting the contact surface portion 16 c into the opening portion 1 b of the housing 1, the outer peripheral edge of the rear surface of the suction portion 16 b at the maximum 16 e It is possible to tilt to a swing angle in which the end 1 a of the housing 1 abuts.
- the suction node 16 oscillates while the contact surface 16 c is in point contact with the inner wall of the opening 1 b of the housing 1 at least at three points, so that the contact surface 16 c and the housing 1
- the frictional resistance between the opening 1 b and the inner wall is small.
- the suction surface 16 a of the suction pad 16 adheres to the back surface of the glass substrate S following the inclination of the glass substrate S due to the warpage or stagnation. Do.
- the outer diameter of the suction portion 16 a is formed to be the same as the outer diameter of the housing 1, so the point of action of the force applied when the glass substrate S contacts the outer peripheral edge of the suction portion 16 a and the suction The distance to the center position of part 1 6 a becomes longer.
- the force of the contact causes the neck of the suction pad 1 6 by the action of the forceps. It will be a big turning force to shake.
- the insides of the air drawing passages 5, 14, 19 and the air suction holes 16 become negative pressure by vacuuming, so that the suction pads 16, the tube members 15, and the negative pressure by this negative pressure.
- the sliding member 9 is piled by the spring force of the spring 25 and descends in the hollow portion 2 of the housing 1 by itself.
- the entire outer peripheral edge 16 e of the back surface of the suction pad 16 comes in surface contact with the open end 1 a of the housing 1. Since the open end 1 a of the housing 1 is a reference plane, the suction surface 16 a of the suction pad 2 2 is disposed in the horizontal direction. As a result, the glass substrate S is held in the horizontal direction.
- the contact surface portion 16 c is in contact with the opening wall of the housing 1, the lateral movement of the suction pad 16 is restricted. Due to this restriction, even in the state where the suction pad 16 is adsorbed on the back surface of the glass substrate S, the glass substrate S can be positioned with high accuracy without being displaced.
- the suction pad 1 6 can be inclined at a large inclination angle, since the contact surface 16 c is in contact with the opening wall of the housing 1 even when it is inclined, the suction pad 16 can not be displaced in the lateral direction.
- the suction pad 16 has a large swing angle and a slight external force, so that the swing motion can be performed smoothly and smoothly with small frictional resistance, and the large warpage of the glass substrate S or the large swing of the glass substrate S It adheres to the back surface of the glass substrate S following the inclination due to stagnation, and the glass substrate S can be reliably adsorbed without air leakage.
- the suction pad 1 6 Since the distance between the point of contact force on the suction part 1 6 b and the center position of the suction part 1 6 b when the glass substrate S comes in contact is increased, the suction pad 1 6 is necked with a slight contact force. It can be oscillated and can immediately follow the large warping or bending of the glass substrate S.
- the suction nodes 1 6 are connected by thin threads 2 4 so that they can not come off the open end 1 a of the housing 1.
- the suction pad height adjustment mechanism 2 7 Since the suction pad height adjustment mechanism 2 7 is provided, the height position A of the suction pad 16 from the end 1 a of the housing 1 is It can be adjusted according to the height position of the substrate S held.
- Figure 5 is a top view
- Figure 6 is a side view.
- a plurality of air blow-out holes 3 1 are provided on the upper surface of the floating transfer stage 3 0 and leveled. These air blowing holes 31 1 blow air at uniform air pressure.
- An air layer is formed between the floating transfer stage 30 and the glass substrate S by the blowout of the air, and the glass substrate S floats on the floating transfer stage 30.
- Guide rails 3 2 and 3 3 in a linear shape are provided on both side surfaces of the floating transport stage 30 respectively. On these guide rails 32 and 33, the transport units 34 and 35 are provided so as to be movable in synchronization with one another.
- a suction mounting table 3 7 is provided in each of the transfer units 34 and 35 via the raising and lowering support members 3 6. Each raising and lowering support member 3 6 raises and lowers the suction mounting table 3 7 in the upward and downward directions (Z direction).
- the substrate suction devices E are arranged in the same direction as the transport direction T of the glass substrate S, for example.
- the number of substrate suction devices E is not limited to five, and any number may be provided. These substrate suction devices are adjusted to the same height position by adjusting the height position of each suction pad 16.
- the glass substrate S is floated or placed on the floating transfer stage 30. This state 06002
- each suction pad 16 of each substrate suction device E comes in contact with the back surface of the glass substrate S.
- the suction pads 16 are swung by the force applied to the glass substrate S as in the first embodiment.
- the suction surface 16 a comes in close contact with the back surface of the glass substrate S by means of vacuum suction of air and holds it by suction.
- the glass substrate S floating on the air is transferred to the transport units 34 and 35. It is pulled by movement and air is conveyed at high speed in the conveyance direction T on the floating conveyance stage 30.
- the substrate suction device E is applied to the air floating transfer device, even when the glass substrate S which has warped or stagnated is transferred by air floating, each of the glass substrates S follows the warping or bending of the glass substrate S
- the suction pad 1 6 of the substrate suction device Ei can be reliably suctioned to the back surface of the glass substrate S. Since the suction pads 16 do not shift in position, they do not shift the position of the glass substrate S when the back surface of the glass substrate S is sucked and held.
- the alignment section and the inspection section in the manufacturing line are It is possible to suction and hold the aligned glass substrate S with high accuracy without shifting the position. Even if the height positions of multiple suction pads 16 are uneven, the height positions of the suction pads 1 6 can be adjusted to the same height position by the suction pad height adjustment mechanisms 2 7.
- the inspection stage 40 is provided in parallel with each other at a predetermined interval in the hollow main body 4 1 of the frame main body 4 1 formed in a rectangular shape with a hollow frame structure and the stage main body 4 1. It consists of several stagnant anti-collision bars 4 3.
- a plurality of substrate suction devices E are embedded at predetermined intervals in the inner peripheral edge portion of the hollow portion 4 2 in the stage main body 4 1.
- a plurality of support pins 44 are erected on each anti-collision bar 4 3.
- each suction pad 16 of each substrate suction device comes in contact with the back surface of the glass substrate S.
- these suction pads 16 move in an oscillating manner so that the suction surface 16 a follows the back surface of the glass substrate S, and the vacuum suction of air is performed on the glass substrate S Adheres to the back side and securely holds the glass substrate S by suction. Therefore, even if the warped glass substrate S is placed on the inspection stage 40, the glass substrate S can be securely held by suction.
- the height position of each suction surface 16 a can be adjusted by each suction pad height adjustment mechanism 2 7, and the glass substrate can be obtained by raising the height position A of the suction pad 16. Large warping and bending in S Even if there is, the glass substrate S can be held by suction with a high degree of flatness on the inspection stage 40 by correcting these warpage and deflection.
- FIG. 8 is a block diagram showing the characteristic part of the substrate suction device Ei.
- a wire 45 is locked between the first support plate 21 and the second support plate 23.
- the wire 4 5 has torsional rigidity and is formed of, for example, a metal material or the like.
- the wire 4 5 includes a rod-shaped wire body 4 6, a hook-shaped first locking portion 4 7 provided at one end of the wire body 4 6, and the other end of the wire body 4 7 And a second J-shaped locking portion 4 8 provided.
- the first locking portion 47 is connected to the first support plate 21 through the holes 21a and 21b of the first support plate 21 by a wire 4 9 such as a thread.
- the second locking portions 4 8 are locked in the respective holes 21 a and 21 b of the second support plate 2 3.
- the substrate adsorption device E adsorbs the glass substrate S in which a warp occurs
- the substrate adsorption device adsorbs so as to receive the glass substrate S.
- the suction pad 16 of the substrate suction device E may rotate slightly.
- the mechanism for holding the suction pad 16 is the thin thread 24 of the thin thread stretched between the first support plate 21 and the second support plate 23. The amount of twist gradually increases. Then, the tension of thin thread 2 4 becomes large, suction pad 16 gradually descends, and the end of housing 1 The protrusion amount of the adsorption node 16 from the 1 a force decreases.
- the rotation of the suction pad 16 can be regulated by the wire 45. Therefore, the suction pads 16 are maintained at the height position A from the end 1 a of the housing 1 without rotation being accumulated over time.
- the first and second embodiments may be formed as follows.
- FIG. 9A is a block diagram showing a modified row of wires 45.
- the wire 4 5 is provided with a small diameter portion 4 9 a on the side of, for example, the first locking portion 4 7 of the wire body 4 6.
- the small diameter portion 4 9 a is formed to be thinner than the diameter of the tire main body 4 6, and the upper portion from the small diameter portion 4 9 a is inclined freely with a small external force, but the suction pad 1 6 Suppress the rotational force.
- FIG. 9B is also a block diagram showing a modified row of the wire 45.
- This wire 45 separates the first locking portion 4 7 from the wire main body 4 6, and the first locking portion 4 is separated.
- the wire main body 4 6 is provided with a receptacle 4 9 c of the pole 4 9 b at the end separated from the first locking portion 4 7.
- the receiving portion 4 9 c rotatably holds the pole 4 9 b. Therefore, even if a twisting force is applied to the wire 45, the ball 4 9 b rotates in the receiving portion 4 9 c. As a result, even if suction pad 1 6 rotates, Yer 4 5 can not twist.
- a tube member 15 a formed in a nozzle may be used.
- Figure 1 1 is a block diagram of a substrate attracting device E 2.
- the housing 50 is formed in a cylindrical shape, for example, of a rigid material such as aluminum.
- a cylindrical holding hole 51 for a pad is provided at the front end of the housing 50.
- the suction pad 52 is rotatably held so as to protrude slightly from the open end 51a of the holding hole 51.
- the suction pad 5 2 is formed in a cylindrical shape using a resin, and the contact surface portion 5 2 a which is the side surface of the pad is formed in a spherical shape. Inside the suction pad 5 2, a cylindrical hollow portion 5 3 opened downward is provided. A flat suction surface 5 4 is provided on the top of the suction pad 5 2.
- the suction surface 54 is provided with a pad recess 54a having a small depth and an air suction hole 54b for vacuum suction communicating with the hollow portion 53 at the central portion. .
- the holding hole 5 1 of the housing 50 is formed to have an inner diameter slightly smaller than the dimension of the contact surface portion 5 2 a of the suction pad 5 2.
- an iris shape portion 5 5 which is squeezed in accordance with the curvature of the spherical shape of the contact surface portion 5 2 a of the suction pad 5 2.
- the throttle shape portion 5 5 constitutes suction pad holding means for holding the suction pad 5 2 in the holding hole 5 1.
- the contact surface of holding hole 5 1 and suction pad 5 2 of No. 5 0 5 2 a has a precision close-fit structure in which the suction pad 5 2 can be rotated within the holding hole 5 1 of the housing 5 0. Therefore, when the suction pad 52 is converged in the holding hole 51, at least three points make point contact with the contact surface 52a of the suction pad 52 and the inner wall surface of the holding hole 51.
- the contact between the contact surface portion 5 2 a of the suction pad 5 2 and the inner wall surface of the holding hole 5 1 is not necessarily in point contact with at least only three points, and the vibration of the suction pad 5 2 Depending on the contact surface, contact is made at a plurality of points on the same circumferential line on the contact surface 52a, or in line contact on the same circumferential line. Due to the contact between the contact surface 52a and the inner wall surface of the holding hole 51, the frictional resistance between the contact surface 52a and the inner wall surface of the holding hole 51 is extremely small.
- the suction pad 52 is rotatably held, for example, in the direction of arrow F in the holding hole 51 in the entire circumferential direction with a slight external force, and a smooth swinging movement becomes possible.
- a receiving surface 5 6 for receiving the suction pad 5 2 is provided.
- the receiving surface 5 6 is formed of a flat portion 5 7 and a tapered portion 5 8 provided on the outer peripheral edge of the flat portion 5 7.
- the flat portion 5 7 regulates the inclination angle of the suction pad 5 2 with respect to the arrow F direction by the contact of the bottom of the suction pad 5 2.
- the inclination angle of the suction pad 52 is such that the suction surface 54 is not hidden in the holding hole 51 when the suction pad 52 is inclined.
- the tapered portion 5 8 is formed at an angle following the curvature of the spherical shape of the contact surface portion 5 2 a of the suction pad 5 2.
- the tapered portion 5 8 abuts against the suction pad 5 2 which descends in the holding hole 5 1 to restrict the downward movement of the suction pad 5 2.
- the housing 50 is provided with a hollow hole 5 9.
- the hollow hole 5 9 is formed to have an inner diameter smaller than the inner diameter of the holding hole 5 1.
- a suction pad supporting member 60 is provided in the hollow portion 5 3 of the hollow hole 5 9 and the suction pad 5 2.
- the suction pad support member 60 is formed in a hollow shape by a flexible member such as rubber, and an air drawing passage 6 1 is provided therein.
- the tip of this suction pad support member 60 is formed with a bellows 60 a for obtaining a small elastic force.
- the tip of this bellows 60 a is formed thinner than the base and can be expanded and contracted by forming it in a bellows shape.
- the bellows 60 is in close contact with the air suction holes 54 b of the suction pad 52.
- the base of the suction pad support member 60 is airtightly connected to the end face of the unit body 6 2.
- the housing 5 0 is screwed to the unit body 6 2 through the screw portion 6 3.
- the housing 50 is rotated relative to the unit body 62 to change the amount of expansion and contraction of the bellows 60 a and adjust the rotational force of the suction pad 52.
- This adjustment is a fine adjustment within the range in which the suction pad 52 can be rotated by receiving an external force that acts when the suction pad 52 abuts on the glass substrate S.
- the housing 50 can adjust the height position of the suction pad 52 by rotating relative to the unit body 62.
- the housing 50 when adjusting the expansion amount (elastic force) of Bellows 60 a or the height position of suction pad 52 is a screw nut 6 4 It is fixed to the unit body 6 2 by tightening the
- An air drawing passage 65 is provided in the unit body 6 2.
- the air drawing passage 65 is in communication with the air drawing passage 6 1 of the suction pad support member 60.
- the air suction holes 54 b and the air drawing passages 61 and 65 form a vacuum suction passage.
- Figure 1 2 A shows a state in which the glass substrate S is conveyed above the substrate adsorption device E 2.
- the suction pad 52 is inclined, for example, in the holding hole 51 of the housing 50, and the suction surface 54 is out of parallel with the back surface of the glass substrate S.
- a part of the suction surface 5 4 of the suction pad 5 2 that is inclined abuts on the back surface of the glass substrate S.
- the suction pad 52 Since the suction pad 52 is held by point contact in the holding hole 51 of the housing 50, the friction resistance between the suction pad 52 and the inner wall surface of the holding hole 51 is extremely small. It rotates in the direction of arrow F in holding hole 51 with a slight contact force against the back side.
- the suction pad 5 2 rotates, and the suction surface 5 as shown in FIG. 2B. Copy so that 4 is the same as the direction of the back of glass substrate S. At this time, even if the suction pad 52 is inclined or the glass substrate S is warped or wrinkled, it is not absorbed. The rod 5 2 rotates and the suction surface 5 4 adheres to the back surface of the glass substrate S.
- the suction pad support member 60 formed of an elastic member Belose 6 0 a shrinks.
- the suction pad 5 2 descends in the holding hole 5 1 due to the contraction of the bellows 60 a, and the bottom of the suction pad 5 2 abuts on the tapered portion 5 8 as shown in FIG. 12 C and stops.
- the suction pad 5 2 is fixed in the holding hole 5 1.
- the suction pad 5 2 having the contact surface portion 5 2 a formed into a spherical shape is formed into the precision clearance fitting structure in the holding hole 5 1 of the housing 50. Since the suction pad 5 2 can be rotated all around in the holding hole 5 1 by the point contact, the frictional resistance of the suction pad 5 2 in the holding hole 5 1 is extremely high. It is small and can rotate in the circumferential direction with a slight external force. Therefore, by contacting the back surface of the glass substrate S with a slight contact force from the lower side of the glass substrate S, the adsorption pad 5 2 follows the inclination direction of the back surface of the glass substrate S. The vacuum suction can be done without leakage and the back side of the glass substrate S can be reliably adsorbed. By this, even if the glass substrate S is warped or bent, the suction pad 5 2 can be inclined and reliably attracted according to these.
- the suction pad 52 is held in the holding hole 51 of the housing 50 by means of a precision close-fitting structure, the positional deviation of the suction pad 52 in the holding hole 51 is extremely small. This enables highly accurate positioning when the glass substrate S is held by suction.
- the negative pressure in the adsorption pad support member 60 causes the bellows 60a to be shrunk, and the adsorption pad 52 has a tapered portion 5 8 Since it regulates the downward movement by contacting with the glass substrate S, it can be fixed at the correct height while the glass substrate S is adsorbed.
- the amount of expansion and contraction of Bellows 60 a is adjusted by rotating the No. 5 50 relative to the main body 6 2 so that the suction pad 5 2 is optimally applied to the glass substrate S.
- the height position of suction pad 52 can be adjusted.
- the substrate suction device 2 can be replaced with the substrate suction device 1 of the air floating transfer device shown in FIGS. 5 and 6 above. If the substrate suction device 2 is applied to the air floating conveyance device, the suction pattern 52 of each substrate suction device 2 is taken in accordance with the warping and bending of the glass substrate S as in the first embodiment. Glass substrate S The back side can be securely adsorbed, and the position of the glass substrate S is not shifted.
- Figure 1 3 shows a block diagram of a substrate attracting device E 3.
- the substrate suction device E 3 can be provided in place of the substrate suction device E on the inspection stage of the large substrate inspection device shown in FIG.
- the housing 50 is screwed to the screw portion 7 1 formed at the bottom of each recess 70 and is fixed by tightening the screw portion 7 1 of the lock nut 7 2.
- the amount of expansion and contraction of the bellows 60 can be adjusted by rotating the housing 50 relative to the screw section 71. This adjusted condition is fixed by tightening the lock nut 72.
- An air suction passage 74 communicating with the air drawing passage 6 1 in the suction pad support member 60 is provided on each stage 7 3 of the stage main body 4 1 and each anti-scratch bar 4 3.
- the glass substrate S having a warp can be securely held by suction, and the height position of the suction pad 52 is adjusted.
- the glass substrate S having a warp can be securely held by suction, and the height position of the suction pad 52 is adjusted.
- the substrate suction device E 3 can also be applied to the arm portion R of the large substrate transfer robot shown in FIG.
- the arm R is connected to the arm support 8 0 while a plurality of, for example, four arms 8 1 are in a predetermined period. They are spaced apart and parallel to one another. A plurality of substrate suction devices E 3 are provided on the arms 8 1.
- This large substrate transfer robot inserts the arm support 80 into the storage unit, takes out the large glass substrate S, and transfers it on the transfer line of the inspection station.
- the glass substrate S becomes stagnant.
- the suction pad 52 the suction surface 54 follows the inclination of the back surface of the glass substrate S, and adheres to the back surface of the glass substrate S by vacuum suction of air, so that the glass substrate S is securely adsorbed. Hold.
- the height of the housing 50 can be reduced to miniaturize, and the inspection stage of the large substrate inspection apparatus and the arm of the large substrate transfer robot can be obtained.
- the glass substrate S can be reliably held by suction following the warp that occurs on the glass substrate S without shifting the position.
- FIG. 1, FIG. 11, FIG. 5 and FIG. 6 will be assigned the same reference numerals and detailed explanations thereof will be omitted.
- the air levitation transfer apparatus shown in FIGS. 5 and 6 includes the substrate suction apparatus (hereinafter referred to as the first substrate suction apparatus) of the first embodiment and the third A substrate suction device (hereinafter referred to as a second substrate suction device) E 2 according to the embodiment was applied.
- the substrate suction apparatus hereinafter referred to as the first substrate suction apparatus
- the third A substrate suction device hereinafter referred to as a second substrate suction device
- FIG. 15 shows the first substrate suction device and the second substrate suction device E 2 provided on each suction mounting table 57. Note that in the figure, only the reference numerals of the necessary parts are attached because they become complicated if the reference numerals are attached.
- a plurality of first and second substrate suction devices E 2 are arranged in parallel in the same direction as the transport direction T of the glass substrate S.
- a plurality of, for example, two first substrate suction devices E are provided on the tip end side of the glass substrate S along the transport direction T of the glass substrate S, for example.
- a plurality of, for example, six second substrate suction devices E 2 are provided on the rear end side of the first substrate suction device.
- first and second substrate suction devices E i and E 2 have the heights of the suction surfaces 16 a and 54 of the suction pads 16 and 52 when the glass substrate S is adsorbed. The height is adjusted so that the position matches the reference plane H. In each first substrate suction device E, the height position of the suction surface 16 a coincides with the reference plane H when the suction pad 16 descends into the housing 1 and makes surface contact with the end 1 a The height is adjusted to be correct.
- the first and second substrate adsorption device E 1 lambda E 2 since each different heights, the adsorption table 5 7, in step G is provided Rereru.
- Figure 16 shows the air evacuation system.
- the regulators 90 and 91 are connected to the first substrate suction devices E on the left side in the transport direction T of the glass substrate S through the air suction paths of different systems, and the right side
- Each of the registrators 92 and 93 is connected to each of the first substrate suction devices.
- These regula- tors 90, 91, ' ⁇ ', 93 individually control the suction force of each air preset for each first substrate suction device.
- each regulator 9 4-1, 9 4 – 2, –, 9 4 1 n are connected, and the second substrate attachment device E 2 on the right side is also connected to the respective regulators 9 5 ⁇ 1, 9 5 ⁇ 2, ⁇ , 9
- 9 4 1 n, 9 5-1, 9 5-2,..., 9 5-n are preset for the respective second substrate suction devices E 2 . Control each air suction separately.
- a vacuum valve 96 is commonly connected to each of the regulators 90, 91 on the left side with respect to the transport direction T of the glass substrate S.
- each regulator 9 on the left side 9 4 1 1 9 4 2 ' ⁇ , 9 4 — n is connected in common to the vacuum valve 9 7.
- air pressure gauges 9 8 and 9 9 are provided on the vacuum valves 9 6 and 9 7, respectively, on the registrator 90, 9 1, 9 4-1, ... ⁇ 9 4-n side. .
- the air pressure gauge 98 measures the air suction force drawn from each regulator 90, 9 1 force, and when this air suction force does not become lower than the set suction force, an error signal is sent to the vacuum valve 9 6 And shut off this vacuum valve 9 6.
- the air pressure gauge 9 9 measures the pressure of the air drawn from the pressure of each regulator 9 4 1 1 9 4 n, and this air suction force does not become lower than the set suction force. Send an error signal to the vacuum valve 9 7 and shut off the vacuum valve 9 7.
- the vacuum valves 100 are commonly connected to the regulators 9 2 and 9 3 on the right side in the transport direction T of the glass substrate S, and the regulators 9 5 1 1 on the right side are also the same. ..., 9 5 — n is commonly connected to the vacuum valve 101.
- Each vacuum valve 96, 100 on the side of each first substrate suction device is commonly connected to the main regulator 104a, and furthermore, an air suction source 1 0 4 to the main regulator 104. 5 is connected.
- the vacuum valves 9 7 and 10 1 on the second substrate suction unit E 2 side are commonly connected to the main regulator 104 b, and further to the air on the main regulator 104 b.
- Suction source 1 0 5 is connected.
- air pressure gauges 106 a and 106 b are provided on the side of the main vacuum valves 96, 97, 100 and 101 of the main regulators 104 a and 104 b, respectively. It is connected.
- the first and second substrate suction devices E and E 2 are The suction pads 16 and 52 rise to the back of the glass substrate S as shown in Fig. 15.
- the tip of the glass substrate S is warped in the transport direction T, first, one end of the suction pad 16 in the first substrate suction device comes in contact with the back surface of the glass substrate S.
- the glass substrate S is warped to the tip side in the transport direction T.
- the first substrate suction device E capable of adjusting the height of each suction pad 16 on the tip end side with respect to the transport direction T causes warping or bending.
- Each suction pad 16 can be brought into contact with the back surface of the glass substrate S.
- suction pads 16 come in contact with the back surface of the glass substrate S with a slight contact force from below the glass substrate S, and swing according to the inclination of the glass substrate S due to warpage or stagnation,
- the suction surface 36 is in close contact with the back surface of the glass substrate S.
- each of the first and second substrate suction devices £ and E 2 is subjected to the respective regulator 90, 91,. 9 3 and Regilators 9 4-1, 9 4-2, " ⁇ 9 4-n, 9 5-1, 9 5-2, ⁇ ⁇ ', 9 5-n force from each vacuum valve 9 6,
- the air suction is performed through 9 7, 100 0 1, 1 0 1, and the main regulator 1 0 4, whereby the first substrate suction device is the same as the first embodiment described above.
- the suction surface 16 a of the suction pad 16 adheres closely to the back surface of the glass substrate S in which warping occurs, and vacuum suctions the glass substrate S reliably without air leakage.
- the outer peripheral edge 16 e of the back surface of the pad 16 comes into surface contact with the end 1 a of the housing 1 and stops, and the warpage and stagnation of the glass substrate S are corrected in a plane.
- This and come back surface of the glass substrate S is closer to the respective suction pad 5 second plurality of second substrate adsorption device E 2.
- These second substrate suction devices E 2 contact the respective suction pads by contacting the back surface of the glass substrate S with a slight contact force from below the glass substrate S. 5 2 rotates so that the surface direction of suction surface 5 4 is the same as the direction of the back surface of glass substrate S. '
- the back surface of the glass substrate S is exposed by the suction pad 16. It can be held securely by adsorption. Since the tip side of the glass substrate S having a large amount of deflection is adsorbed and held by the first substrate suction device E and lowered toward the reference plane H, the back surface of the glass substrate S is the second substrate. The suction device E 2 can be gradually approached, and the second substrate suction device E 2 can reliably hold the back surface of the glass substrate S by suction.
- the first and second substrate adsorption devices E i and E 2 are air passing through the respective registrators 90, 91,... Since air suction is performed, even if one adsorption pad 16 or 52 at one place does not adsorb to the back surface of the glass substrate S, the air leaks to the adsorption pad 16 or 52 which has leaked the air.
- the second substrate suction device E 2 can maintain the suction operation of each suction pad 1 6 or 5 2.
- the safety can be improved without stopping the adsorption and holding of the glass substrate S in the middle, and the air-leaking suction pad 16 or 52 first or second substrate suction device ⁇ 1 Repairing only the system of ⁇ 2 is advantageous in terms of maintenance.
- Ri by the and this for the air supply to each of the first substrate adsorption equipment E 1 and the second substrate adsorption device E 2 into two lines, one main Regiyu rater 1 0 4 a or 1 0 Even if 4 b fails, the other main regulator 104 b or 104 a is activated, so all the first substrate adsorption devices A and the second substrate adsorption devices B can be used. It solves the problem that air suction can not be performed.
- the first and second substrate suction devices E 1 E 2 are used, but all of them may be used as the first substrate suction device E 1.
- Figure 17 is a block diagram of the air levitation conveyor that can be used as an inspection stage.
- a plurality of, for example, three suction mounting tables 3 7 a, 3 7 b, 3 7 c are provided. These suction mounting tables 3 7 a, 3 7 b, 3 7 c are provided on the front end side, the rear end side, and the middle portion in the transport direction T of the glass substrate S.
- a plurality of first or second substrate suction devices E, E 2 are respectively arranged in parallel on the suction mounting tables 3 7 a, 3 7 b, 3 7 c.
- the first and second substrate adsorption devices E i and E 2 have the heights of the adsorption surfaces 16 a and 5 4 of the adsorption pads 16 and 5 2 in the state where the glass substrate S is adsorbed. The height is adjusted so that the position matches the reference plane H.
- the first and second substrate suction devices E 1 E 2 are connected to the registrators through the air suction paths of different systems, for example, one first or even air leakage occurs in the second substrate adsorption device E 1 E 2, in the first or second substrate adsorption device E 1 lambda E 2 of the other can be maintained adsorption Chakudosa, suction holding of the glass substrate S It is possible to improve the safety without stopping in the middle.
- the adsorption control method for the first or second substrate adsorption device E 1 E 2 is as follows. First, each first or second substrate adsorption device E or E on the adsorption table 3 7 c provided at the center portion Start the suction operation for 2 . Next, the suction operation for each of the first and second substrate suction devices E i or E 2 on the suction table 3 7 a or 3 7 b provided at the front end or the rear end is started. According to this suction control method, when the glass substrate S floating on the air is sucked and held on the floating conveyance stage 30, the suction mounting table 3 7 c is provided on the small middle portion of the curvature.
- the central portion of the glass substrate S is obtained by starting the suction operation from each of the first or second substrate suction devices E or E 2 of each of the first or second substrate suction devices E i or E The suction and retention is ensured by 2 . At this time, since the glass substrate S is held by suction by the first or second substrate suction device or E 2 in the middle portion, the warping of the glass substrate S is reduced.
- each first or second substrate suction device E or E 2 on the suction mounting table 3 7 a or 3 7 b provided at the front end portion or the rear end portion starts the suction operation.
- each first or second substrate suction device E i or E 2 at the tip portion sequentially contacts the back surface of the glass substrate S from the center portion toward the tip portion and holds it by suction.
- the suction table can be increased according to the size of the glass substrate S, not only at the central part, the front end part, and the rear end part, but it can be warped from the small part other than the central part. It may be arranged in a large area.
- Figure 18 is a block diagram of the air levitation conveyance system.
- Levitation carrier One suction table 3 7 is installed on each side of the stage 1.
- a plurality of first or second substrate suction devices or E 2 are arranged in parallel in the same direction as the transport direction T of the glass substrate S.
- these first and second substrate suction devices or E 2 are connected to each other through the respective air suction paths of different systems, and are drawn.
- the adsorption control method for the first or second substrate adsorption device or E 2 is such that the first or second substrate adsorption device E or E 2 is warped from the smaller central portion side of the glass substrate S.
- the suction operation starts in order toward the large end of the.
- each first or second substrate adsorption device or E 2 is a glass.
- the substrate S contacts the back surface of the glass substrate S sequentially from the middle portion side to the tip portion side, and is held by suction.
- the warping of the glass substrate S is sequentially corrected from the middle portion side to the end portion side, and each first or second substrate suction device E i or E 2 is an end portion from the middle portion side. Hold the glass substrate S firmly to the part side.
- the first or second substrate adsorption device E or E 2 simultaneously performs adsorption operation, adsorption is sequentially started from the small warpage portion of the glass substrate S toward the large warpage portion. As a result, the warping and bending of the glass substrate S are corrected horizontally on the reference plane H.
- the second substrate suction device E 2 having a small protrusion height of the suction pad 52 and the well-known substrate suction device are provided. It becomes possible to securely hold the glass substrate S which is warped even if it is placed.
- the present invention is not limited to the above embodiments, but may be modified as follows.
- the present invention can also be applied to the case where the glass substrate S is adsorbed and held on the inspection stage in the inspection section of the glass substrate S.
- each of the first substrate adsorption device groups H i to H 4 a plurality of substrate adsorption device groups E are arranged along the transport direction T of the glass substrate S.
- the first substrate suction device groups H i and H 2 are provided adjacent to each other, and the first substrate suction device groups H 3 and H 4 are provided adjacent to each other.
- the first substrate suction device group HHA may use a second substrate suction device E2.
- Each of the first substrate adsorption devices in these first substrate adsorption devices H i to H 4 is connected to each of the regulators 1 1 0, and further common to each first substrate adsorption device group to H 4 It is connected and connected to each vacuum pulp i ⁇ ⁇ 1 1 4.
- the vacuum pulps 1 1 1 and 1 1 3 corresponding to the first substrate suction device group H i and H 3 are connected in common and connected to the main regulator 1 15 a.
- the vacuum valves 1 12 and 1 1 4 corresponding to the first substrate suction device group H 2 and H 4 are commonly connected to the main regulators 1 1 5 b.
- the adsorbing device groups H 2 and H 4 as separate air evacuation systems, adjacent ones of the first substrate adsorbing device group H 3 will be adjacent even if H 3 becomes non-suctionable.
- the other substrate suction device H 2 can reliably hold the glass substrate S by suction. For example, even if the whole of the first substrate suction device group H i leaks, the suction operation to the glass substrate S can be maintained by the adjacent first substrate suction device group H 2 .
- the shape of the contact surface portion 16 c of the suction pad 16 according to the first embodiment is shown in the partial sectional view shown in FIG. 2 OA to FIG. 2 OD and the top view shown in FIG. It may be modified as well.
- the contact surface portion 16 c shown in FIG. 2A intersects each of the inclined surfaces 120 and 1 2 1 to form an apex 12 2 having an obtuse angle, for example.
- the apex 1 22 is formed in the entire circumferential direction of the contact surface 16 c. In the case of such a contact surface 16 c of the suction pad 16, the vertex 12 22 of the contact surface 16 c is in line contact with the inner wall 2 a of the housing 1 in the entire circumferential direction.
- the contact surface portion 16 c shown in FIG. 20 B forms, for example, a convex body 1 2 4 having an obtuse angle 1 2 3.
- This contact surface portion 16 c also has the top 1 2 3 of the convex body 1 2 4 on the inner wall 2 a of the housing 1 Line contact in all circumferential directions.
- the contact surface portion 16 c shown in FIG. 20 C forms a hemispherical convex body 1 2 6 on the cylindrical curved main body 1 2 5.
- the convex body 1 26 makes line contact with the inner wall 2 a of the housing 1 in the entire circumferential direction.
- the contact surface portion 16 c shown in FIG. 2D forms a protrusion 1 2 7 on the cylindrical curved main body 1 2 5.
- the protruding band 1 2 7 makes line contact with the inner wall 2 a of the housing 1 in the entire circumferential direction.
- the contact surface portion 16c shown in FIG. 2E forms at least three, for example, four protrusions 1 2 8 on the outer peripheral surface of the cylindrical curved body 1 2 5. In the case of this contact surface portion 16 c, each protrusion 1 2 8 makes point contact with the inner wall 2 a of the housing 1.
- the suction pads 16 do not shift in the lateral direction, and have a smooth and smooth swinging motion with small frictional resistance. it can.
- the invention is not limited to air levitation, but may be applied to transport of the glass substrate S levitated by electrostatic levitation or ultrasonic levitation. Ru.
- the substrate adsorption device among the substrate adsorption devices The first substrate suction device with a large height protruding from the tip side sucks and holds the substrate Holding and correcting the substrate horizontally, and holding the glass substrate by suction using a second substrate suction device with a small protruding height in a state where the glass substrate is horizontally corrected by the first substrate suction device
- a substrate suction method characterized by:
- a second aspect of the present invention is the substrate according to the first aspect of the present invention, characterized in that the adsorption operation of the first substrate adsorption device is started, and then the adsorption operation of the second substrate adsorption device is started. It is an adsorption method.
- a third aspect of the present invention is the substrate adsorption method according to the first aspect of the present invention, wherein the first substrate adsorption device and the second substrate adsorption device simultaneously start the adsorption operation.
- a substrate suction method for holding the substrate by a plurality of substrate suction devices arranged along the side edge of the substrate, the method corresponding to a small portion of the warp of the substrate.
- the substrate adsorption method is characterized in that an adsorption operation is started from the substrate adsorption device toward the substrate adsorption device corresponding to a large portion of the warp of the substrate.
- a substrate adsorption method in which the substrate is adsorbed and held by a plurality of substrate adsorption devices arranged along the side edge of the substrate, wherein one or more of the substrate adsorption devices are Each air evacuation system is provided for each substrate, and the air evacuation systems are operated at the same time, and the substrate adsorption devices are sequentially attracted to the substrate from the small part to the large part of the warp of the substrate.
- the substrate suction method is characterized in that the warp of the substrate is corrected.
- the present invention can also be applied to the fields of, for example, transfer of a glass substrate of a liquid crystal display in an LCD manufacturing line, and transfer of a semiconductor wafer and various members in a semiconductor manufacturing line.
Abstract
Description
Claims
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KR1020057018997A KR101055911B1 (ko) | 2003-05-06 | 2004-04-26 | 기판 흡착 장치 |
JP2005505982A JP4553841B2 (ja) | 2003-05-06 | 2004-04-26 | 基板吸着装置 |
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JP (1) | JP4553841B2 (ja) |
KR (1) | KR101055911B1 (ja) |
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JP6218395B2 (ja) * | 2013-03-05 | 2017-10-25 | 日置電機株式会社 | 吸着機構および吸着装置 |
JP6655514B2 (ja) * | 2016-09-21 | 2020-02-26 | 東京エレクトロン株式会社 | 基板検査方法及び基板検査装置 |
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JP2006269498A (ja) * | 2005-03-22 | 2006-10-05 | Olympus Corp | 基板保持装置及び基板の保持方法 |
JP2007008698A (ja) * | 2005-07-01 | 2007-01-18 | Ishikawajima Harima Heavy Ind Co Ltd | 基板吸着方法、基板ホルダ及び基板吸着装置 |
JP2007022758A (ja) * | 2005-07-15 | 2007-02-01 | Ckd Corp | 板状ワークの移載装置 |
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JP2007157867A (ja) * | 2005-12-02 | 2007-06-21 | Olympus Corp | 基板吸着機構及び基板検査装置 |
JP2008302487A (ja) * | 2007-06-11 | 2008-12-18 | Olympus Corp | 基板吸着装置及び基板搬送装置並びに外観検査装置 |
JP2010098126A (ja) * | 2008-10-16 | 2010-04-30 | Tokyo Electron Ltd | 基板搬送処理装置 |
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JP2012164948A (ja) * | 2011-02-08 | 2012-08-30 | Kondo Kogyo Kk | N2ガスパージ装置におけるノズルユニット |
WO2013161376A1 (ja) * | 2012-04-26 | 2013-10-31 | 株式会社Ihi | 搬送装置 |
CN103646905A (zh) * | 2013-12-11 | 2014-03-19 | 中国电子科技集团公司第二研究所 | 晶圆片识别旋转定位吸附台 |
JP2015153970A (ja) * | 2014-02-18 | 2015-08-24 | キヤノン株式会社 | 基板保持機構、基板搬送装置および基板搬送方法 |
JP2016119337A (ja) * | 2014-12-18 | 2016-06-30 | 東京エレクトロン株式会社 | 基板保持ステージ |
CN104708461A (zh) * | 2015-03-03 | 2015-06-17 | 西北工业大学 | 一种大型壁板的简易固持装置 |
CN108431944A (zh) * | 2015-12-25 | 2018-08-21 | 三星钻石工业股份有限公司 | 基板吸附装置 |
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CN108431944B (zh) * | 2015-12-25 | 2022-08-26 | 三星钻石工业股份有限公司 | 基板吸附装置和工作台 |
JP2017112394A (ja) * | 2017-02-21 | 2017-06-22 | シンフォニアテクノロジー株式会社 | パージノズルユニット、ロードポート |
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Also Published As
Publication number | Publication date |
---|---|
KR20060008319A (ko) | 2006-01-26 |
JPWO2004100254A1 (ja) | 2006-07-13 |
TW200508125A (en) | 2005-03-01 |
JP4553841B2 (ja) | 2010-09-29 |
KR101055911B1 (ko) | 2011-08-10 |
TWI327986B (en) | 2010-08-01 |
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