TW200508125A - Substrate suction device - Google Patents

Substrate suction device

Info

Publication number
TW200508125A
TW200508125A TW093111648A TW93111648A TW200508125A TW 200508125 A TW200508125 A TW 200508125A TW 093111648 A TW093111648 A TW 093111648A TW 93111648 A TW93111648 A TW 93111648A TW 200508125 A TW200508125 A TW 200508125A
Authority
TW
Taiwan
Prior art keywords
suction device
substrate suction
suction pad
housing
suction
Prior art date
Application number
TW093111648A
Other languages
Chinese (zh)
Other versions
TWI327986B (en
Inventor
Takato Hayashi
Koji Hirado
Hitoshi Kinoshita
Shuya Jogasaki
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW200508125A publication Critical patent/TW200508125A/en
Application granted granted Critical
Publication of TWI327986B publication Critical patent/TWI327986B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)

Abstract

A suction pad (16) is placed on a tube member (15) in an opening portion (1b) of a housing (1). The suction pad (16) has a suction portion (16a) and a hemispherically curved contact surface portion (16c) being in point-contact through at least three points with the inner wall of the opening portion of the housing (1). A fine thread (24) is stretched between the suction pad (16) and a sliding member (9).
TW093111648A 2003-05-06 2004-04-26 Substrate absorption device TWI327986B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003128054 2003-05-06
JP2003192188 2003-07-04
JP2003192141 2003-07-04

Publications (2)

Publication Number Publication Date
TW200508125A true TW200508125A (en) 2005-03-01
TWI327986B TWI327986B (en) 2010-08-01

Family

ID=33436989

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111648A TWI327986B (en) 2003-05-06 2004-04-26 Substrate absorption device

Country Status (4)

Country Link
JP (1) JP4553841B2 (en)
KR (1) KR101055911B1 (en)
TW (1) TWI327986B (en)
WO (1) WO2004100254A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI380944B (en) * 2004-11-24 2013-01-01 Ckd Corp A floating unit having a tilting function, and a floating device
JP4895518B2 (en) * 2005-03-22 2012-03-14 オリンパス株式会社 Substrate holding device and substrate holding method
JP4899357B2 (en) * 2005-07-01 2012-03-21 株式会社Ｉｈｉ Substrate adsorption device
JP4920209B2 (en) * 2005-07-15 2012-04-18 シーケーディ株式会社 Plate workpiece transfer equipment
JP2007048828A (en) * 2005-08-08 2007-02-22 Murata Mfg Co Ltd Deformation processing apparatus and deformation processing method of plate-shaped structure
JP4655272B2 (en) * 2005-08-19 2011-03-23 株式会社安川電機 Substrate adsorption device and substrate transfer device using the same
JP4790395B2 (en) * 2005-12-02 2011-10-12 オリンパス株式会社 Substrate adsorption mechanism and substrate inspection device
JP2008302487A (en) * 2007-06-11 2008-12-18 Olympus Corp Substrate sucking device, substrate transporting device, and outside appearance inspecting device
JP4787872B2 (en) * 2008-10-16 2011-10-05 東京エレクトロン株式会社 Substrate transfer processing equipment
JP5815959B2 (en) * 2011-02-08 2015-11-17 近藤工業株式会社 Nozzle unit in N2 gas purge device
KR101841534B1 (en) 2011-11-21 2018-03-23 한화테크윈 주식회사 Panel Stransfer Apparatus
KR101610215B1 (en) * 2012-04-26 2016-04-07 가부시키가이샤 아이에이치아이 Conveyance device
JP6135066B2 (en) * 2012-08-10 2017-05-31 シンフォニアテクノロジー株式会社 Purge nozzle unit, purge device, load port
JP6218395B2 (en) * 2013-03-05 2017-10-25 日置電機株式会社 Adsorption mechanism and adsorption device
CN103646905A (en) * 2013-12-11 2014-03-19 中国电子科技集团公司第二研究所 Wafer identification, rotation and positioning adsorption table
JP2015153970A (en) * 2014-02-18 2015-08-24 キヤノン株式会社 Substrate holding mechanism, substrate transport apparatus and substrate transport method
JP6316181B2 (en) * 2014-12-18 2018-04-25 東京エレクトロン株式会社 Substrate holding stage
CN104708461B (en) * 2015-03-03 2017-07-07 西北工业大学 A kind of simple holding unit of large-scale wallboard
TWI630059B (en) * 2015-12-25 2018-07-21 日商三星鑽石工業股份有限公司 Substrate adsorption device and workbench
JP6655514B2 (en) 2016-09-21 2020-02-26 東京エレクトロン株式会社 Substrate inspection method and substrate inspection device
JP6327374B2 (en) * 2017-02-21 2018-05-23 シンフォニアテクノロジー株式会社 Purge nozzle unit, load port
JP6804155B2 (en) * 2017-03-13 2020-12-23 東レエンジニアリング株式会社 Board floating transfer device
JP6519897B2 (en) * 2018-04-10 2019-05-29 シンフォニアテクノロジー株式会社 Purge nozzle unit, load port
JP7210896B2 (en) * 2018-04-23 2023-01-24 東京エレクトロン株式会社 SUBSTRATE PLACEMENT DEVICE AND SUBSTRATE PLACEMENT METHOD
JP6882698B2 (en) * 2019-04-24 2021-06-02 シンフォニアテクノロジー株式会社 Purge nozzle unit, load port
KR102416681B1 (en) * 2021-04-20 2022-07-05 주식회사 윈텍오토메이션 Vacuum Griper Device for Separating Ultra-Wide Insert Products from CVD Coating Tray

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6094487U (en) * 1983-11-30 1985-06-27 東芝機械株式会社 Wafer adsorption device
JPS63136636U (en) * 1987-02-27 1988-09-08
JPH05318368A (en) * 1992-05-18 1993-12-03 Tokyo Electron Yamanashi Kk Suction conveying device
JP3122590B2 (en) * 1994-12-28 2001-01-09 株式会社三協精機製作所 Suction pad
JPH08236597A (en) * 1995-02-27 1996-09-13 Hitachi Ltd Transfer device
JP4106450B2 (en) * 2001-02-07 2008-06-25 日産自動車株式会社 Adsorption holding device

Also Published As

Publication number Publication date
KR20060008319A (en) 2006-01-26
KR101055911B1 (en) 2011-08-10
TWI327986B (en) 2010-08-01
WO2004100254A1 (en) 2004-11-18
JPWO2004100254A1 (en) 2006-07-13
JP4553841B2 (en) 2010-09-29

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees