JP6882698B2 - Purge nozzle unit, load port - Google Patents

Description

The present invention relates to a purge nozzle unit that performs a purge process on a purge target container having a purge target space, and a load port provided with the purge nozzle unit.

In the semiconductor manufacturing process, wafers are processed in a clean room in order to improve yield and quality. In recent years, as an alternative method for improving the cleanliness of the entire clean room, a "mini-environment method" that further improves the cleanliness of only the local space around the wafer has been adopted, and a means for transporting the wafer and other processing has been adopted. It has been adopted. In the mini-environment method, a storage container called FOUP (Front-Opening Unified Pod) for transporting and storing wafers in a highly clean environment and wafers in the FOUP are taken in and out of the semiconductor manufacturing equipment and transported. A load port, which is a device of an interface unit that transfers a FOUP to and from a device, is used as an important device.

By the way, the inside of the semiconductor manufacturing apparatus is maintained in a predetermined gas atmosphere suitable for processing or processing the wafer, but when the wafer is sent from the inside of the FOUP into the semiconductor manufacturing apparatus, the internal space of the FOUP and the inside of the semiconductor manufacturing apparatus are maintained. The space and the space will communicate with each other. Therefore, if the environment in the FOUP is lower in cleanliness than in the semiconductor manufacturing apparatus, the gas in the FOUP may enter the semiconductor manufacturing apparatus and adversely affect the gas atmosphere in the semiconductor manufacturing apparatus. Further, when the wafer is housed in the FOUP from the semiconductor manufacturing apparatus, there is a problem that an oxide film may be formed on the surface of the wafer due to moisture, oxygen or other gas in the gas atmosphere in the FOUP.

As a technique for dealing with such a problem, Patent Document 1 states that the door of the FOUP is opened at the door portion of the load port so that the internal space of the FOUP and the internal space of the semiconductor manufacturing apparatus are communicated with each other. A load port including a purge device for blowing a predetermined gas (for example, nitrogen, an inert gas, etc.) into the FOUP by a purge unit (purge nozzle) provided on the semiconductor manufacturing apparatus side of the opening is disclosed.

However, a predetermined gas is injected into the FOUP from the front side (semiconductor manufacturing apparatus side) into the FOUP opened to the internal space of the semiconductor manufacturing apparatus through such a carry-in port to create a predetermined gas atmosphere in the FOUP. The so-called front purge type purging device that replaces with is high in the FOUP because the purging process is performed in a state where the opening of the FOUP is opened and the internal space of the FOUP is directly communicated with the entire internal space of the semiconductor manufacturing device. It is difficult to maintain the predetermined gas atmosphere concentration, and there is a demerit that the reached concentration of the predetermined gas atmosphere is low.

On the other hand, in Patent Document 2, a predetermined gas (for example, nitrogen, an inert gas, etc.) is injected into the inside from the bottom surface side of the FOUP in a state where the FOUP containing the wafer is placed on the mounting table of the load port. A load port with a purging device that fills and replaces the interior of the FOUP with a predetermined gaseous atmosphere is disclosed.

The so-called bottom purge method in which a gas such as nitrogen or dry air (hereinafter referred to as "purge gas") is injected into the FOUP from the bottom surface side of the FOUP to replace the inside of the FOUP with a predetermined gas atmosphere is a front purge. Compared with the type purging device, there is an advantage that the reached concentration of a predetermined gas atmosphere is high.

When the bottom purge method is adopted, the port provided on the bottom surface of the FOUP mounted on the mounting table comes into contact with the upper end portion of the purge nozzle.

Japanese Unexamined Patent Publication No. 2009-038074 Japanese Unexamined Patent Publication No. 2011-187539

By the way, the port that can come into contact with the upper end of the purge nozzle is, for example, a hollow tubular resin product (grommet seal), which is fitted into the opening formed on the bottom surface of the FOUP, but the fitting amount is insufficient. In some cases, the downward surface of the port may not be horizontal to the bottom surface of the FOUP due to individual differences in the port itself (for example, manufacturing accuracy of the grommet seal) or aging.

It is difficult to bring the upper end of the purge nozzle into close contact with such a port without a gap, and the purging gas supplied from the purge nozzle leaks out of the FOUP from the gap between the purge nozzle and the port, resulting in a decrease in purging processing efficiency. obtain.

It should be noted that such a problem may occur not only in the purge device of the load port but also in the purge device other than the load port, for example, the purge device of the stocker and the purge device of the purge station.

The present invention has been made by paying attention to such a problem, and a main object thereof is to adopt a bottom purge method capable of performing a purge process having a high concentration of a predetermined gas atmosphere, and at the upper end of the port. It is an object of the present invention to provide a purge nozzle unit capable of bringing the portions into close contact with each other, a purge device provided with such a purge nozzle unit, and a load port.

That is, the present invention relates to a purge nozzle unit capable of replacing the gas atmosphere in the purge target container with a purging gas composed of either nitrogen or dry air through a port provided on the bottom surface of the purge target container. Here, the "purge target container" in the present invention includes all containers having a purge target space inside such as FOUP.

Then, in the purging device according to the present invention, a nozzle having a purging gas flow path extending in the purging gas supply direction extending from the lower side to the upper side is provided so as to be able to move up and down. It has a port receiving part having a port contact part that contacts the port, and by following the inclination of the downward surface of the port, the port contact part is in close contact with the downward surface of the port, and the purging gas is purged through the port. It is characterized by being supplied to.

With such a purging device, at least the upper end of the nozzle , that is, the part in contact with the port can be tilted according to the pressure received from above, and the downward surface of the port is inclined at a predetermined angle with respect to the horizontal plane. Even in this case, the upper end portion that tilts according to the inclined surface can be brought into contact with the downward surface of the port without a gap. As a result, the purging process can be performed with the upper end portion (port contact portion) of the nozzle in close contact with the port having such an inclined surface, and the purging gas supplied from the purge nozzle is the purge nozzle and the port. It is possible to prevent a decrease in purging processing efficiency due to leakage from the gap to the outside of the container to be purged.

The tilting support portion described in the present specification includes a tilting support portion configured by using a spherical bearing portion that supports a spherical portion formed in a predetermined portion of the purging gas supply portion in a contact state, and an elastic purging gas supply portion. Examples thereof include those configured by using an elastic support member that supports. However, even if the spherical surface portion and the spherical bearing portion are not completely spherical surfaces, if the contact sliding region of both members also constitutes a part of the spherical surface, the spherical surface portion and the spherical bearing portion in the present invention are sufficient. .. That is, the spherical portion and the spherical bearing portion may have a completely spherical shape or a partially spherical shape.

Further, the purge device of the present invention is provided with a plurality of purge nozzle units, and the purging gas supply unit of the purge nozzle unit is communicated with each of the plurality of ports provided on the bottom surface of the purge target container in the purge target container. The gas atmosphere can be replaced with nitrogen or dry air.

Further, as a load port using the purge device of the present invention, a wafer provided adjacent to the semiconductor manufacturing device in a clean room and receiving a FOUP, which is a container to be purged, and stored in the FOUP is used as a semiconductor. It is taken in and out through the carry-in / out port formed on the front surface of the FOUP between the inside of the manufacturing apparatus and the inside of the FOUP, and it is preferable to provide a purge device having the above-described configuration.

Such a purging device and a load port will have the above-mentioned effects and effects, prevent a decrease in purging processing efficiency due to a gap between the upper end of the purging gas supply unit and the port, and provide a predetermined gas atmosphere. The purge process with a high reaching concentration can be performed efficiently and accurately.

According to the present invention, a purge nozzle unit capable of improving the purge processing efficiency and shortening the time (tact time) required for the purge processing, a purge device configured by using such a purge nozzle unit, and a purge thereof. A load port with a device can be provided.

The whole block diagram of the load port which concerns on one Embodiment of this invention. FIG. 6 is a schematic cross-sectional view of the purge nozzle unit according to the same embodiment (first embodiment). FIG. 2 is a diagram showing a state of close contact of the purge nozzle unit with respect to a port whose downward surface is not horizontal in the same embodiment, corresponding to FIG. FIG. 6 is a schematic cross-sectional view of the purge nozzle unit according to the second embodiment of the present invention. FIG. 4 is a diagram showing a state of close contact of the purge nozzle unit with respect to a port whose downward surface is not horizontal in the same embodiment, corresponding to FIG. FIG. 6 is a schematic cross-sectional view of the purge nozzle unit according to the third embodiment of the present invention. FIG. 6 is a schematic cross-sectional view of the purge nozzle unit according to the fourth embodiment of the present invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

The purge nozzle unit 1 according to the present embodiment can be attached to the purge device P applied to the load port X shown in FIG. 1, for example. The load port X is used in a semiconductor manufacturing process and is arranged adjacent to a semiconductor manufacturing apparatus (not shown) in a clean room, and has a door portion on the door of FOUP100, which is an example of a container to be purged of the present invention. The D is brought into close contact with the door to open and close, and a wafer (not shown), which is an in-contained body housed in the FOUP 100, is taken in and out of the semiconductor manufacturing apparatus.

The FOUP 100 applied in the present embodiment is a known one that accommodates a plurality of wafers inside, is configured so that these wafers can be taken in and out through a carry-in / out port formed on the front surface, and has a door that can open and close the carry-in / out port. Therefore, detailed description thereof will be omitted. In the present embodiment, the front surface of the FOUP 100 means the surface of the load port X facing the door portion D when mounted on the load port X. As shown in FIG. 2, a purging port 101 is provided at a predetermined position on the bottom surface of the FOUP 100. The port 101 is mainly composed of a hollow tubular glomet seal fitted in an opening 102 formed on the bottom surface of the FOUP 100, and a gas such as nitrogen, an inert gas, or dry air, which will be described later, is contained in the glomet seal. In the embodiment, nitrogen gas is used, and a valve (not shown) that switches from the closed state to the open state depending on the injection pressure or the discharge pressure of the “purge gas” in the following description is provided.

The semiconductor manufacturing apparatus includes, for example, a semiconductor manufacturing apparatus main body arranged at a position relatively far from the load port X, and a transfer chamber arranged between the semiconductor manufacturing apparatus main body and the load port X. A transfer machine is provided in the transfer chamber, for example, for transferring wafers in the FOUP 100 one by one between the FOUP 100 and the transfer chamber, and between the transfer chamber and the semiconductor manufacturing apparatus main body. It is also possible to transfer the entire cassette containing a plurality of wafers between the FOUP 100 and the semiconductor manufacturing apparatus (semiconductor manufacturing apparatus main body and transfer chamber). With such a configuration, in the clean room, the inside of the semiconductor manufacturing apparatus main body, the transfer room, and the inside of the FOUP100 are maintained with high cleanliness, while the space where the load port X is arranged, in other words, the outside of the semiconductor manufacturing apparatus main body and the outside of the transfer room. , And the outside of FOUP100 has a relatively low cleanliness.

As shown in FIG. 1, the load port X is arranged in an upright position and has a frame F having a door portion D capable of opening and closing an opening that can communicate with the carry-in / out port of the FOUP 100, and the frame F is moved away from the semiconductor manufacturing apparatus. It is provided with a mounting table B extending in a substantially horizontal posture in a direction, and a purging device P capable of injecting a purging gas into the FOUP 100 and replacing the gas atmosphere in the FOUP 100 with a purging gas such as nitrogen gas. ..

The door portion D provided on the frame F is an open position in which the FOUP 100 is placed on the mounting table B and the door is opened in close contact with the door (not shown) provided on the front surface of the FOUP 100 to open the carry-out entrance. , It can be operated between the closing position and the closing position that closes the carry-in / out port. As a door elevating mechanism (not shown) for moving the door portion D up and down at least between the open position and the closed position, a known one can be applied.

The mounting table B is arranged in a substantially horizontal posture at a position slightly upward from the central portion in the height direction of the frame F, and has a plurality of positioning protrusions B1 (kinematic pins) protruding upward. .. Then, by engaging these positioning protrusions B1 with the positioning recesses (not shown) formed on the bottom surface of the FOUP 100, the FOUP 100 is positioned on the mounting table B. As an example of the positioning protrusion B1, the upper part of the positioning protrusion B1 that comes into contact with the downward V-shaped positioning recess having a cross-sectional view is curved, and this upper curved surface can be in contact with each inclined wall surface of the positioning recess in a well-balanced manner. Examples can be mentioned. Further, the mounting table B is provided with a seating sensor B2 for detecting whether or not the FOUP 100 is mounted on the mounting table B at a predetermined position. The structure and arrangement location of the positioning protrusion B1 and the seating sensor B2 can be appropriately set and changed according to the standard and the like. As the mounting table B, the FOUP 100 in the mounted state is placed at a position where the carry-out entrance (door) is closest to the opening (door portion D) of the frame F and a position separated from the opening (door portion D) by a predetermined distance. It is also possible to apply a moving mechanism for moving between and.

The purge device P includes a plurality of purge nozzle units 1 arranged at predetermined locations with the upper end exposed on the mounting table B, and these plurality of purge nozzle units 1 are used for injection to inject a purge gas. It functions as a purge nozzle unit and a discharge purge nozzle unit that discharges the gas atmosphere in the FOUP 100. The ratio of the injection purge nozzle unit and the discharge purge nozzle unit to the total number of the purge nozzle units 1 may be the same, or one of them may be larger than the other.

These plurality of purge nozzle units 1 can be mounted at appropriate positions on the mounting table B according to the positions of the ports 101 provided on the bottom surface of the FOUP 100. Each purge nozzle unit 1 (injection purge nozzle unit, discharge purge nozzle unit) has a valve function for regulating the backflow of gas, and can contact the port 101 provided at the bottom of the FOUP 100. Of the plurality of ports 101 provided at the bottom of the FOUP 100, the port 101 that contacts the injection purge nozzle unit functions as an injection port, and the port 101 that contacts the discharge purge nozzle unit functions as an discharge port. ..

As shown in FIG. 2 (the figure is a schematic cross-sectional view of the purge nozzle unit 1), each purge nozzle unit 1 tilts to support the purge gas supply unit 2 and the purge gas supply unit 2 in a tiltable manner. It is provided with a support portion 3.

The purging gas supply unit 2 includes a cylindrical body portion 21 and a spherical portion 22 projecting laterally from the body portion 21. In the present embodiment, a purging gas flow path 23 extending along the purging gas supply direction A from the lower side to the upper side is formed at the axial center portion of the body portion 21. In the following description, the upper end portion of the purging gas flow path 23 that is open upward may be referred to as an upper opening 24. A port contact portion 25 capable of contacting the port 101 (injection port, discharge port) is provided on the upward surface of the body portion 21. In the present embodiment, the port contact portion 25 is composed of a ring-shaped upward protruding portion that protrudes upward from the horizontal upward surface of the body portion 21. The tip of the ring-shaped port contact portion 25 is also horizontal.

Further, the lower end portion of the purging gas flow path 23 that opens downward functions as a ventilation hole 26 that is connected to the purging gas supply source V1 via the pipe H. When the purging gas flow path 23 has a bottomed tubular shape that does not open downward, the body portion 21 penetrates the side surface of the purging gas flow path 23 on the lower end region side in the thickness direction. A hole to be formed may be formed, and the hole may function as a ventilation hole. In the present embodiment, the pipe H is connected to the ventilation hole 26, and the purging gas can be injected into the purging gas flow path 23 through the pipe H and the ventilation hole 26.

The tilting support portion 3 has a cylindrical shape, and a concave spherical bearing portion 31 that supports the spherical portion 22 of the purging gas supply portion 2 in contact state is formed on the side wall 32. The spherical bearing portion 31 is continuous in the circumferential direction. The inner diameter of the side wall 32 is set to be larger than the outer diameter of the body 21 of the purging gas supply unit 2 by a predetermined dimension.

The purge nozzle unit 1 of the present embodiment in which the purging gas supply portion 2 and the tilting support portion 3 are unitized with the spherical portion 22 supported by the spherical bearing portion 31 is an extension of the purging gas flow path 23. The purging gas supply section 2 in the reference posture (see FIG. 2) whose direction (purge gas supply direction A) coincides with the vertical direction is fulcrum (tilted) around the centers of the spherical portions 22 and the spherical bearing portions 31 that coincide with each other. It is configured to be able to tilt (swing) as the center (center, swing center). In the purge nozzle unit 1 of the present embodiment, the upper end side region of the body 21 of the purging gas supply unit 2 projects upward from the upward surface of the tilt support portion 3 and faces the tilt support portion 3 in the radial direction C. A space S1 that allows tilting of the purging gas supply unit 2 is formed between the side wall 32 and the body portion 21 of the purging gas supply unit 2.

The purge nozzle unit 1 according to the present embodiment is mounted on the mounting table B at a plurality of predetermined locations (near the four corners of the mounting table B in the present embodiment) on the mounting table B of the load port X in a unitized state. It functions as a purging device P capable of replacing the gas atmosphere in the mounted FOUP 100 with a purging gas. The process of attaching each purge nozzle unit 1 to the mounting table B can be realized by fixing the purge nozzle unit 1 to a predetermined position on the mounting table B using an appropriate fixing tool such as a screw. In this fixed state, the upward surface of the tilting support portion 3 is set to be substantially the same level as the upward surface of the mounting table B.

Next, a method and operation of the load port X in which the purge nozzle unit 1 having such a configuration is mounted on the mounting table B will be described.

First, the FOUP 100 is transported to the load port X by a transport device such as OHT (not shown), and is mounted on the mounting table B. At this time, the FOUP 100 can be placed in a predetermined regular position on the mounting table B by the positioning protrusion B1 fitting into the positioning recess of the FOUP 100 and coming into contact with the positioning protrusion B1. Detects that it has been placed in the normal position of. Then, by mounting the FOUP 100 at a regular position on the mounting table B, the port contact portion 25 of the purge nozzle unit 1 comes into contact with each port 101 provided on the bottom surface of the FOUP 100. In this contact state, as shown in FIG. 2, the internal space 103 of the port 101 and the purging gas flow path 23 of the purging gas supply unit 2 communicate with each other.

Then, the purging gas is supplied from the purging gas supply source V1 to the purging gas flow path 23 through the vent hole 26 formed inside the purging gas supply unit 2 and the pipe H connected to the vent hole 26. And purge. The purging gas supplied from the ventilation hole 26 to the purging gas flow path 23 flows toward the upper opening 24 of the purging gas flow path 23.

As a result, the purge nozzle unit 1 according to the present embodiment can inject the purge gas into the FOUP 100 through the purge gas flow path 23 and the internal space 103 of the port 101 (perform the purge process). As a result, the gas filled in the FOUP 100 is discharged to the outside of the FOUP 100 through the discharge port 101 and the discharge purge nozzle unit 1. The discharge process may be started before the injection process, and the air in the FOUP 100 may be discharged to the outside of the FOUP 100 to some extent to perform the injection process in a state where the inside of the FOUP 100 is depressurized.

After performing the purging process as described above, or during the purging process, the load port X of the present embodiment allows the wafer in the FOUP 100 to enter the semiconductor manufacturing apparatus through the carry-in / out port of the FOUP 100 communicating with the opening of the frame F. Pay out sequentially. The wafer transferred into the semiconductor manufacturing apparatus is subsequently subjected to a semiconductor manufacturing processing process by the semiconductor manufacturing apparatus main body. Wafers that have completed the semiconductor manufacturing process by the semiconductor manufacturing apparatus main body are sequentially stored in the FOUP 100.

In the load port X of the present embodiment, the bottom purge process by the purging device P can be continuously performed even when the wafer is taken in and out, and the gas atmosphere in the FOUP 100 is used for purging nitrogen gas or the like while the wafer is taken in and out. It can be kept at a high concentration by continuing to replace it with a gas.

When all the wafers have completed the semiconductor manufacturing process and are housed in the FOUP100, the door portion D is moved from the open position to the closed position in a state of being in close contact with the door of the FOUP100. As a result, the opening of the load port X and the carry-in / out port of the FOUP 100 are closed. Subsequently, the FOUP 100 mounted on the mounting table B is carried out to the next process by a transport mechanism (not shown). If necessary, the bottom purge process may be performed again on the FOUP 100 containing the wafer that has completed the semiconductor manufacturing process. In this way, the purge process can be immediately started for the FOUP 100 containing the wafer that has completed the semiconductor manufacturing process, and the processed wafer can be prevented from being oxidized.

As described in detail above, the load port X according to the present embodiment can maintain a high filling degree (replacement degree) of the purging gas in the FOUP 100 by the bottom purging process by the purging device P.

Further, among a plurality of wafers housed in the common FOUP100, the wafer that first finishes the semiconductor manufacturing process and is housed in the FOUP100 is the wafer that finally goes through the semiconductor manufacturing process and is housed in the FOUP100. Until, normally, exposure to a gas atmosphere in which the filling degree (replacement degree) of the purging gas decreases with the lapse of wafer loading / unloading work time in the FOUP100 may have a slight adverse effect. By injecting the purging gas into the FOUP 100, it is possible to effectively suppress a decrease in the purging gas filling degree (replacement degree) in the FOUP 100, and the wafer should be stored in the FOUP 100 in a good condition. Can be done.

Further, when the FOUP 100 containing the wafer that has completed the semiconductor manufacturing processing process is delivered to the transfer mechanism, or at a predetermined timing after the delivery, the purging gas is sent from the purging gas supply source V1 to the purging gas flow path. When the process of supplying the 23 is stopped, the purging gas existing in the purging gas flow path 23 at that time is released to the atmosphere.

By the way, the port 101 that can come into contact with the upper end portion (port contact portion 25) of the purge nozzle unit 1 is fitted into the opening 102 formed on the bottom surface of the FOUP 100, but the fitting amount is insufficient or the fitting amount is insufficient. Due to individual differences in the port 101 itself (for example, manufacturing error of the grommet seal) and aging, the downward surface 104 of the port 101 may not be horizontal and may be tilted with respect to the bottom surface of the FOUP 100.

With a conventional purge nozzle, it is difficult to bring the upper end portion (port contact portion) of the purge gas supply unit into close contact with such a port 101 without a gap, and the purge gas supplied from the purge nozzle unit is the purge nozzle. Leakage from the gap between the unit and the port 101 to the outside of the FOUP 100 may lead to a decrease in purging processing efficiency.

On the other hand, in the purge nozzle unit 1 of the present embodiment, as described above, the entire purging gas supply unit 2 is set to swing freely, and the inclination support unit 3 follows the inclination angle of the downward surface 104 of the port 101. It is configured so that the relative angular posture of the purging gas supply unit 2 can be changed.

Therefore, for example, as shown in FIG. 3, the downward surface 104 of the port 101 is inclined with respect to the bottom surface of the FOUP 100 (FIG. 3 shows the case where the downward surface 104 is inclined due to individual differences of the port 101 itself. The inclination of the downward surface 104 of the port 101 with respect to the bottom surface of the FOUP 100 is exaggerated so that the behavior of the purge nozzle unit 1 according to the present embodiment can be easily grasped). The purging gas supply unit 2 tilts with respect to the tilt support unit 3 according to the inclination angle, and the entire port contact portion 25 constituting the upper end portion of the purging gas supply unit 2 is formed on the downward surface 104 of the port 101. In close contact. In the present embodiment, the shape of an object in which the entire purging gas supply portion 2 receives pressure from above with the center of the spherical bearing portion 31 supporting the spherical portion 22 of the purging gas supply portion 2 as a fulcrum among the tilt support portions 3 That is, it tilts according to the tilt angle of the downward surface 104 of the port 101. Further, in the purge nozzle unit 1 of the present embodiment, the space S1 between the body 21 of the purge gas supply unit 2 formed with the purge gas supply unit 2 in the reference posture and the side wall 32 of the tilt support unit 3 is formed. As a result, the purging gas supply unit 2 can be swung smoothly.

As described above, the purge nozzle unit 1 according to the present embodiment supports the spherical portion 22 of the purging gas supply portion 2 by the spherical bearing portion 31 of the tilt support portion 3, and corresponds to the inclination angle of the downward surface 104 of the port 101. By configuring the purging gas supply unit 2 so as to be tiltable, the upper end portion (port contact portion 25) of the purging gas supply unit 2 is provided with respect to the downward surface 104 of the port 101 where accurate horizontality is ensured. Not only can they be brought into close contact with each other, but also the upper end portion (port contacting portion 25) of the purging gas supply unit 2 is automatically brought into close contact with the downward surface 104 of the port 101 where accurate levelness is not ensured. be able to. As a result, it is possible to prevent the purge gas supplied from the purge gas flow path 23 of the purge nozzle unit 1 from leaking to the outside of the FOUP 100 through the gap between the purge nozzle unit 1 and the port 101, and the purge gas supply unit 2 Compared with the configuration in which the upper end portion (port contact portion 25) of the port 101 cannot be brought into close contact with the inclined downward surface 104 of the port 101, the purging process efficiency is improved and the time (tact time) required for the purging process is shortened. be able to.

Next, the purge nozzle unit 1 according to an embodiment different from the above-described embodiment (hereinafter, referred to as a second embodiment, and the above-described embodiment is referred to as a first embodiment) will be described with reference to FIG. .. The description of the members and parts adopting the same configuration as or the same configuration as that of the first embodiment will be omitted. Further, in FIG. 4, the same reference numerals are given to the members and parts that adopt the same configuration as or the same configuration as that of the first embodiment.

The purge nozzle unit 1 according to the second embodiment includes a purge gas supply unit 2 and a tilt support unit 3 that tiltably supports the purge gas supply unit 2, and the purge gas supply unit 2 It is different from the purge nozzle unit 1 of the first embodiment in that the tilting support portion 3 is formed by using the elastic support member 33 that elastically supports the gas.

The purging gas supply unit 2 includes a cylindrical body portion 21 and a flange portion 27 projecting laterally from the body portion 21. In the present embodiment, the collar portion 27 is provided at a position above the lower end of the body portion 21 by a predetermined dimension.

The tilting support portion 3 has a side wall 32 having an inner diameter set to be larger than the outer diameter of the flange portion 27 of the purging gas supply portion 2 by a predetermined dimension, and the flange portion 27 and the height of the tilt support portion 3 protruding inward from the lower end portion of the side wall 32. It is provided with an inwardly projecting portion 34 facing in the direction and an elastic support member 33 arranged between the flange portion 27 and the inwardly projecting portion 34. In the present embodiment, as the elastic support member 33, a coil spring that orbits the body 21 of the purging gas supply unit 2 is applied.

In the purge nozzle unit 1 of the present embodiment, the purging gas supply unit 2 and the tilting support unit 3 are unitized while the flange portion 27, and thus the purging gas supply unit 2 is elastically supported by such an elastic support member 33. The elastic support member 33 elastically deforms the purging gas supply unit 2 in the reference posture (see FIG. 4) in which the stretching direction of the purging gas flow path 23 coincides with the vertical direction, and thus tilts. (Swing movement) It is configured to be possible. The purge nozzle unit 1 has a space S2 that allows the purging gas supply unit 2 to tilt between the flange portion 27 and the side wall 32 facing the radial direction C and between the body portion 21 and the inwardly projecting portion 34, respectively. It forms S3.

The purge nozzle unit 1 according to the present embodiment is mounted on the mounting table B at a plurality of predetermined locations (near the four corners of the mounting table B in the present embodiment) on the mounting table B of the load port X in a unitized state. It functions as a purging device P capable of replacing the gas atmosphere in the mounted FOUP 100 with a purging gas. The process of attaching each purge nozzle unit 1 to the mounting table B can be realized by fixing the purge nozzle unit 1 to a predetermined position on the mounting table B using an appropriate fixing tool such as a screw. In this fixed state, the upward surface of the tilting support portion 3 is set to be substantially the same level as the upward surface of the mounting table B.

Then, as shown in FIG. 5, in the purge nozzle unit 1 according to the present embodiment, when the downward surface 104 of the port 101 is tilted with respect to the bottom surface of the FOUP 100, the purge gas supply unit 2 is tilted according to the tilt angle. However, the entire port contact portion 25 constituting the upper end portion tilts with respect to the tilt support portion 3 and comes into close contact with the downward surface 104 of the port 101. In the present embodiment, the elastic support member 33 of the tilt support portion 3 is elastically deformed according to the shape of the object to which the purging gas supply portion 2 receives pressure from above, that is, the inclination angle of the downward surface 104 of the port 101 for purging. The entire gas supply unit 2 tilts. Further, in the purge nozzle unit 1 of the present embodiment, the space S2 between the flange portion 27 of the purge gas supply portion 2 and the side wall 32 of the tilt support portion 3 formed in a state where the purge gas supply portion 2 is in the reference posture. The space S3 between the body 21 of the purging gas supply unit 2 and the inwardly projecting portion 34 of the tilting support unit 3 allows the purging gas supply unit 2 to swing smoothly.

As described above, in the purge nozzle unit 1 according to the present embodiment, the purging gas supply unit 2 is elastically supported by the elastic support member 33 of the tilt support unit 3, and is used for purging according to the inclination angle of the downward surface 104 of the port 101. By configuring the gas supply unit 2 so as to be tiltable, the upper end portion (port contact portion 25) of the gas supply unit 2 for purging is brought into close contact with the downward surface 104 of the port 101 where accurate horizontality is ensured. As shown in FIG. 5, the upper end portion (port contact portion 25) of the gas supply unit 2 for purging is surely secured even for the downward surface 104 of the port 101 where the accurate levelness is not ensured. Can be brought into close contact with. As a result, it is possible to prevent the purge gas supplied from the purge gas flow path 23 of the purge nozzle unit 1 from leaking to the outside of the FOUP 100 through the gap between the purge nozzle unit 1 and the port 101, and the purge gas supply unit 2 Compared with the configuration in which the upper end portion (port contact portion 25) of the port 101 cannot be brought into close contact with the inclined downward surface 104 of the port 101, the purging process efficiency can be improved and the time required for the purging process can be shortened.

Next, the purge nozzle unit 1 according to an embodiment different from each of the above-described embodiments (hereinafter, referred to as a third embodiment) will be described with reference to FIG. The description of the members and parts adopting the same configuration as or the same configuration as that of the first embodiment will be omitted. Further, in FIG. 6, members and parts adopting the same configuration as or a configuration similar to that of the first embodiment are designated by the same reference numerals.

As shown in FIG. 6, each purge nozzle unit 1 according to the third embodiment includes a purge gas supply unit 2, a tilt support unit 3 that tiltably supports the purge gas supply unit 2, and a purge gas supply unit 3. It is provided with a holder 6 (cylinder outer cylinder) that supports the piston unit 5 in which the portion 2 and the tilting support portion 3 are assembled to each other so as to be movable up and down. The purge nozzle unit 1 is the same as the purge nozzle unit according to each of the above-described embodiments in that it constitutes the purge device P and that it can be applied to the load port X.

The purging gas supply unit 2 is provided with a port receiving portion 28 (head 28) having a port contact portion 25 at the upper end portion, a spherical portion 22 at the lower end portion, and a body between the port receiving portion 28 and the spherical portion 22. The part 21 is provided. A purging gas flow path 23 extending along the purging gas supply direction A from the lower side to the upper side is formed in the axial portion of the purging gas supply unit 2.

The tilting support portion 3 includes a side wall 32 provided with a spherical bearing portion 31 that supports the spherical portion 22 of the purging gas supply portion 2 orbiting an inward surface, and further, a region on the lower end side of the spherical bearing portion 31. In addition, a small-diameter tubular portion 35 having an outer diameter smaller than the outer diameter of the side wall 32, and a lateral protruding portion protruding laterally from a part of the small-diameter tubular portion 35 and having the same outer diameter as the outer diameter of the side wall 32. 36 is provided. A seal member 7 that contacts the side wall 61 of the holder 6, which will be described later, is attached to the outer peripheral surface of the lateral protrusion 36. A purging gas flow path 37 penetrating in the height direction is formed in the axial center portion of the tilting support portion 3, and the lower end portion of the purging gas flow path 37 that opens downward is piped to the purging gas supply source V1. It functions as a vent 38 connected via H. When the purging gas flow path 37 has a bottomed tubular shape that does not open downward, a small-diameter tubular portion 35 is provided on the side surface of the purging gas flow path 37 on the lower end region side in the thickness direction. A hole may be formed through the hole, and the hole may function as a ventilation hole. In the present embodiment, the pipe H is connected to the ventilation hole 38, and the purging gas can be injected into the purging gas flow path 37 through the pipe H and the ventilation hole 38.

In the piston unit 5 in which the purging gas supply portion 2 and the tilting support portion 3 are assembled to each other in a state where the spherical portion 22 of the purging gas supply portion 2 is supported by the spherical bearing portion 31 of the tilting support portion 3, the purging gas is used. The purging gas flow path 23 formed inside the supply unit 2 and the purging gas flow path 37 formed inside the tilting support unit 3 communicate with each other, and the purging gas flow path 23 and the purging gas flow path 37 The purging gas supply unit 2 in the reference posture (see FIG. 6) whose stretching direction coincides with the vertical direction is tilted (swinging operation) with the center of the spherical portion 22 and the spherical bearing portion 31 which coincide with each other as the swing center. It is configured to be possible.

In the purge nozzle unit 1 of the present embodiment, the upper end side region and the port receiving portion 28 of the body portion 21 of the purging gas supply portion 2 project upward from the upward surface of the tilting support portion 3 and face the radial direction C. A space S4 that allows tilting of the purging gas supply unit 2 is formed between the body 21 of the purging gas supply unit 2 and a part of the tilt support unit 3. Further, in the present embodiment, the opening diameter of the purging gas flow path 37 of the tilting support portion 3 is set to be larger than the opening diameter of the purging gas flow path 23 of the purging gas supply unit 2, and the purging gas supply unit is set. Even when 2 is tilted with respect to the tilting support portion 3, the purging gas flow path 37 of the tilting support portion 3 and the purging gas flow path 23 of the purging gas supply unit 2 can be ensured to communicate with each other. doing.

The holder 6 is formed from the side wall 61 to which the outward surface (outer peripheral surface) of the spherical bearing portion 31 of the purging gas supply unit 2 and the outward surface (outer peripheral surface) of the lateral protrusion 36 are in contact with each other, and the lower end of the side wall 61. It has a bottom wall 63 having a through hole 62 formed in the central portion, which protrudes inward (center side) and allows only the small-diameter tubular portion 35 of the tilting support portion 3 to be inserted. A ventilation path (lower ventilation path 64, upper ventilation path 65) communicating with the outside is formed on the side wall 61 of such a holder 6. In the present embodiment, two ventilation holes 64 and 65 are formed at different positions in the height direction. Further, a seal member 7 that comes into contact with the small-diameter tubular portion 35 of the tilting support portion 3 is attached to the inward facing surface of the through hole 62 formed in the bottom wall 63.

The purge nozzle unit 1 of the present embodiment in which the piston unit 5 is assembled to such a holder 6 has an outward surface of a lateral protrusion 36 of the tilting support portion 3 in a state where the piston unit 5 is held by the holder 6. (Outer peripheral surface) is configured to be in contact with the side wall 61 of the holder 6 in the same manner as the side wall 32 of the tilting support portion 3.

Further, the purge nozzle unit 1 according to the present embodiment applies gas (pressurized air) as a drive source for moving the purge gas supply unit 2 up and down with respect to the holder 6. Then, gas flows through two air passages (upper air passage 65 and lower air passage 64) formed in the side wall 61 of the holder 6 in a space formed between the piston unit 5 and the holder 6. The piston unit 5 is configured to move up and down with respect to the holder 6 by relatively changing the pressures of the two possible pressure adjustment spaces (lower pressure adjustment space S5 and upper pressure adjustment space S6). ing.

Specifically, the lower pressure adjusting space S5 is a space partitioned by the small-diameter tubular portion 35 and the lateral protrusion 36 of the tilting support portion 3, the side wall 61 of the holder 6, and the bottom wall 63, and is the upper side. The pressure adjusting space S6 is a space partitioned by a lateral protrusion 36 of the tilting support portion 3, a small-diameter tubular portion 35, a side wall 32, and a side wall 61 of the holder 6. In the present embodiment, between the side wall 32 of the tilt support portion 3 and the side wall 61 of the holder 6, between the lateral protrusion 36 of the tilt support portion 3 and the side wall 61 of the holder 6, and the small diameter cylinder of the tilt support portion 3. By interposing the seal member 7 between the shape portion 35 and the bottom wall 63 of the holder 6, high airtightness of each pressure adjustment space (lower pressure adjustment space S5, upper pressure adjustment space S6) is ensured. doing.

Then, in the purge nozzle unit 1 according to the present embodiment, individual pipes (lower pipe Ha, upper pipe Hb) are connected to each of the ventilation passages (lower ventilation passage 64, upper ventilation passage 65), and the lower one is connected. At the same time as injecting gas into the lower pressure adjustment space S5 through the side pipe Ha and the lower ventilation passage 64, the gas in the upper pressure adjustment space S6 is released to the outside through the upper pipe Hb and the upper ventilation passage 65. By doing so, the pressure in the lower pressure adjustment space S5 is higher than the pressure in the upper pressure adjustment space S6 (first pressure adjustment state), and the upper pressure adjustment space is passed through the upper pipe Hb and the upper ventilation passage 65. At the same time as injecting gas into S6, the pressure in the upper pressure adjustment space S6 is released to the outside through the lower pipe Ha and the lower ventilation passage 64 to release the gas in the lower pressure adjustment space S5 to the lower side. By controlling the operation of the switching unit 8 (for example, the electromagnetic valve (solute valve)) that can be switched to the state where the pressure is higher than the pressure of the pressure adjustment space S5 (second pressure adjustment state), the piston unit 5 is held by the holder 6. It is configured to move up and down with respect to. A gas supply source V2 is connected to the switching unit 8.

In the present embodiment, by setting the first pressure adjustment state, the piston unit 5 is placed at the position shown in FIG. 6, that is, at the purge position where the port contact portion 25 of the purging gas supply unit 2 can contact the port 101 of the FOUP 100. By setting the second pressure adjustment state, the purging gas supply unit 2 can be positioned at a standby position (not shown) in which the port contact unit 25 does not contact the port 101 of the FOUP 100.

Further, when the piston unit 5 is moved up and down, the outward surface of the side wall 32 and the outward surface of the lateral protrusion 36 of the tilt support portion 3 are in sliding contact with the inward surface of the side wall 61 of the holder 6 and are tilted and supported. The outward surface of the small-diameter tubular portion 35 of the portion 3 is configured to be in sliding contact with the inward surface of the through hole 62 formed in the bottom wall 63 of the holder 6, so that the piston unit 5 can be moved up and down smoothly and appropriately. I am trying to do it.

The purge nozzle unit 1 according to the present embodiment described in detail above is attached to a plurality of predetermined locations (near the four corners of the mounting table B in the present embodiment) on the mounting table B of the load port X in a unitized state. It functions as a purging device P capable of replacing the gas atmosphere in the FOUP 100 mounted on the mounting table B with a purging gas. The process of attaching the purge nozzle unit 1 to the mounting table B can be realized by fixing the purge nozzle unit 1 to a predetermined position on the mounting table B using an appropriate fixing tool such as a screw. In this fixed state, the upward surface of the holder 6 is set to be substantially the same level as the upward surface of the mounting table B.

These plurality of purge nozzle units 1 can be mounted at appropriate positions on the mounting table B according to the positions of the ports 101 provided on the bottom surface of the FOUP 100.

Next, a method and operation of the load port X in which the purge nozzle unit 1 having such a configuration is mounted on the mounting table B will be described.

First, the FOUP 100 is transported to the load port X by a transport device such as OHT (not shown), and is mounted on the mounting table B. At this time, by setting the switching portion 8 to the second pressure adjusting state, the piston unit 5 can be positioned at the standby position, and the positioning protrusion B1 fits into the positioning recess of the FOUP 100 and comes into contact with the piston unit 5. The FOUP 100 can be placed in a predetermined regular position on the mounting table B. Further, the seating sensor B2 detects that the FOUP 100 is placed at a normal position on the mounting table B. At this point, since the piston unit 5 is in the standby position, it does not come into contact with the port 101. That is, in the standby position of the piston unit 5, the upper end (port contact portion 25) of the piston unit 5 is the FOUP 100 in a state where the positioning protrusion B1 is engaged with the positioning recess and the FOUP 100 is mounted on the mounting table B. It is a position lower than the lower end of the port 101 provided in.

Then, the load port X of the present embodiment detects the normal seating state of the FOUP 100 by the seating sensor B2, then switches the switching unit 8 from the second pressure adjusting state to the first pressure adjusting state, and waits for the piston unit 5. Move up from the position to the purge position. That is, gas is injected into the lower pressure adjusting space S5 through the lower ventilation path 64 formed on the side wall 61 of the holder 6 and the lower piping Ha connected to the lower ventilation path 64, and the lower side. The pressure in the pressure adjustment space S5 is increased, and the gas in the upper pressure adjustment space S6 is discharged to the outside through the upper ventilation passage 65 and the upper pipe Hb connected to the upper ventilation passage 65 to the lower side. By making the pressure in the pressure adjusting space S5 higher than the pressure in the pressure adjusting space S6 on the upper side, the piston unit 5 is moved upward with respect to the holder 6.

As a result, the port contact portion 25 of the purging gas supply unit 2 of the piston unit 5 comes into contact with the downward surface 104 of the port 101, and the internal space 103 of the port 101 and the purging gas flow path 23 of the purging gas supply unit 2 And the purging gas flow path 37 of the tilting support portion 3 communicates with each other. In this state, the load port X of the present embodiment supplies the purging gas supplied from the purging gas supply source V1 to the pipe H, the purging gas flow path 37 of the tilting support portion 3, and the purging gas supply unit 2. The gas is injected into the FOUP 100 through the internal space 103 of the purge gas flow path 23 and the port 101, and the gas filled in the FOUP 100 is discharged to the outside of the FOUP 100 through the discharge port and the discharge purge nozzle unit. The discharge process may be started before the injection process, and the air in the FOUP 100 may be discharged to the outside of the FOUP 100 to some extent to perform the injection process in a state where the inside of the FOUP 100 is depressurized.

The operation of the load port X after the purging process as described above or during the purging process is based on the above-described first embodiment, and detailed description thereof will be omitted.

When the FOUP 100 containing the wafer that has completed the semiconductor manufacturing process is delivered to the transfer mechanism, or at a predetermined timing after the delivery, the switching unit 8 is switched from the second pressure adjustment state to the first pressure adjustment state. , The piston unit 5 is moved downward from the purge position to the standby position. That is, gas is injected into the upper pressure adjusting space S6 through the upper air passage 65 formed on the side wall 61 of the holder 6 and the upper pipe Hb connected to the upper air passage 65, and the upper pressure adjusting space S6 The gas in the lower pressure adjustment space S5 is discharged to the outside through the lower ventilation passage 64 and the lower pipe Ha connected to the lower ventilation passage 64, and the upper pressure is increased. By making the pressure in the adjustment space S6 higher than the pressure in the lower pressure adjustment space S5, the piston unit 5 is moved downward with respect to the holder 6. As a result, it is possible to prevent the piston unit 5 from interfering with the downward surface of the FOUP 100 when the FOUP 100 containing the unprocessed wafer is received from the transfer mechanism on the mounting table B.

In this way, the purge nozzle unit 1 of the present embodiment, which is formed by unitizing the piston unit 5 and the holder 6, has a pressure difference between the two pressure adjusting spaces S5 and S6 formed between the piston unit 5 and the holder 6. The piston unit 5 is configured to move up and down with respect to the holder 6 by adjusting through the ventilation passages 64 and 65 formed in the side wall 61 of the holder 6. Therefore, as compared with the mode in which the piston unit 5 is moved up and down by simultaneously expanding and contracting a plurality of cylinders, for example, control for simultaneously expanding and contracting the cylinders is unnecessary, and the relative pressure adjustment spaces S5 and S6 are relative to each other. The piston unit 5 can be moved up and down with high accuracy by simple control for adjusting the pressure difference, and the reliability is improved. In particular, the purge nozzle unit 1 according to the present embodiment does not need to be evacuated in each pressure adjustment space (lower pressure adjustment space S5, upper pressure adjustment space S6), and therefore is a negative pressure source (vacuum). It is advantageous in that the source) is not required.

Then, in the purge nozzle unit 1 of the present embodiment, the entire purge gas supply unit 2 is set to be able to swing, and the purge gas supply unit for the tilt support unit 3 follows the angle of the downward surface 104 of the port 101. It is configured so that the relative assembly angle of 2 can be changed.

Therefore, even when the downward surface 104 of the port 101 is tilted with respect to the bottom surface of the FOUP 100, the purging gas supply portion 2 is tilted with respect to the tilt support portion 3 according to the tilt angle, and the upper end portion thereof. The entire port contact portion 25 constituting the port 101 is in close contact with the downward surface 104 of the port 101. In the present embodiment, the shape of an object in which the entire purging gas supply unit 2 receives pressure from above with the center of the spherical bearing portion 31 supporting the spherical surface portion 22 of the purging gas supply unit 2 as a fulcrum (swing center). That is, it tilts according to the tilt angle of the downward surface 104 of the port 101. Further, in the purge nozzle unit 1 of the present embodiment, the purge nozzle unit 1 is purged by the space S4 between the body portion 21 of the purge gas supply portion 2 and the tilt support portion 3 formed in a state where the purge gas supply unit 2 is in the reference posture. The swinging operation of the gas supply unit 2 can be smoothly performed.

As described above, the purge nozzle unit 1 according to the present embodiment supports the spherical portion 22 of the purging gas supply portion 2 by the spherical bearing portion 31 of the tilt support portion 3, and corresponds to the inclination angle of the downward surface 104 of the port 101. By configuring the purging gas supply unit 2 so as to be tiltable, the upper end portion (port contact portion 25) of the purging gas supply unit 2 is provided with respect to the downward surface 104 of the port 101 where accurate horizontality is ensured. Not only can they be brought into close contact with each other, but also the upper end portion (port contacting portion 25) of the purging gas supply unit 2 is automatically brought into close contact with the downward surface 104 of the port 101 where accurate levelness is not ensured. be able to. As a result, it is possible to prevent the purge gas supplied from the purge gas flow path 37 and the purge gas flow path 23 of the purge nozzle unit 1 from leaking to the outside of the FOUP 100 through the gap between the purge nozzle unit 1 and the port 101. Compared with the configuration in which the upper end portion (port contact portion 25) of the purging gas supply unit 2 cannot be brought into close contact with the inclined downward surface 104 of the port 101, the purging process efficiency is improved and the time required for the purging process is shortened. Can be achieved.

Next, another embodiment of the purge nozzle unit in which the piston unit 5 in which the purging gas supply unit 2 and the tilting support unit 3 are assembled to each other can be moved up and down with respect to the holder 6 (hereinafter referred to as the fourth embodiment). (Referred to as) will be described with reference to FIG. 7. The description of the members and parts adopting the same configuration as or the same configuration as each of the above embodiments will be omitted. Further, in FIG. 7, the same reference numerals are given to the members and parts that adopt the same configuration or the same configuration as that of the second embodiment.

As shown in FIG. 7, the purge nozzle unit 1 according to the fourth embodiment includes a purge gas supply unit 2 and a tilt support unit 3 that tiltably supports the purge gas supply unit 2. The purge nozzle unit of the third embodiment is different from the purge nozzle unit of the third embodiment in that the tilt support portion 3 is formed by using the elastic support member 33 that elastically supports the purge gas supply portion 2.

The purging gas supply unit 2 is provided with a port receiving portion 28 (head 28) having a port contact portion 25 at the upper end portion of the cylindrical body portion 21, and is sided to the lower end portion of the cylindrical body portion 21. A retaining portion 29 is provided so as to project toward the side. A purging gas flow path 23 extending along the purging gas supply direction A is formed at the axial center portion of the purging gas supply unit 2.

The tilting support portion 3 has a side wall 32 having an inner diameter set to be larger than the outer diameter of the body portion 21 of the purging gas supply portion 2 by a predetermined dimension, and the side wall 32 protruding inward from a predetermined height position to receive a port. It is provided with an inwardly projecting portion 34 facing the portion 28 in the height direction, and an elastic support member 33 arranged between the port receiving portion 28 and the inwardly projecting portion 34, and further, the lower end of the side wall 32. A small-diameter tubular portion 35 having an outer diameter smaller than the outer diameter of the side wall 32 and a part of the small-diameter tubular portion 35 to the side in the region on the lower end side of the second inwardly projecting portion 39 protruding inward from the side. A lateral projecting portion 36 that projects toward the side and has the same outer diameter as the outer diameter of the side wall 32 is provided.

In the present embodiment, as the elastic support member 33, a coil spring that orbits the body 21 of the purging gas supply unit 2 is applied.

The piston unit 5 in which the purging gas supply portion 2 and the tilting support portion 3 are unitized while the port receiving portion 28 and the purging gas supply portion 2 are elastically supported by such an elastic support member 33 is supplied with the purging gas. The purging gas flow path 23 formed inside the portion 2 and the purging gas flow path 37 formed inside the tilting support portion 3 are the second retaining portion 29 of the purging gas supply portion 2 and the second tilting support portion 3. For purging, the gas flow path 23 for purging and the gas flow path 37 for purging communicate with each other through a relay space S7 that can be partitioned by the inward projecting portion 39 and the side wall 32, and the extending directions of the gas flow path 23 for purging and the gas flow path 37 for purging are in a reference posture that coincides with the vertical direction. The gas supply unit 2 is configured to be tilted (swinging operation) by elastic deformation of the elastic support member 33. In the purge nozzle unit 1 of the present embodiment, the upper end side region and the port receiving portion 28 of the body portion 21 of the purging gas supply portion 2 project upward from the upward surface of the tilting support portion 3 and face the radial direction C. Between the body 21 of the purging gas supply part 2 and the side wall 32 of the tilting support part 3 and the inward surface of the inwardly protruding part 34, and between the retaining part 29 of the purging gas supply part 2 and the side wall of the tilting support part 3. A space is formed between the gas supply unit 2 and the purging gas supply unit 2 to allow tilting. Further, in the present embodiment, the opening diameter of the purging gas flow path 37 of the tilting support portion 3 is set to be larger than the opening diameter of the purging gas flow path 23 of the purging gas supply unit 2, and the purging gas supply unit is set. Even when 2 is tilted with respect to the tilting support portion 3, the purging gas flow path 37 of the tilting support portion 3 and the purging gas flow path 23 of the purging gas supply unit 2 communicate with each other via the relay space S7. It is configured to ensure the state of gas.

Since the structure of the holder 6 that supports the piston unit 5 so that it can be moved up and down, the structure that moves the piston unit 5 up and down, and the action and effect obtained by them are the same as the structure and the action and effect in the third embodiment. , Detailed description will be omitted.

The purge nozzle unit 1 according to the present embodiment is mounted on the mounting table B at a plurality of predetermined locations (near the four corners of the mounting table B in the present embodiment) on the mounting table B of the load port X in a unitized state. It functions as a purging device P capable of replacing the gas atmosphere in the mounted FOUP 100 with a purging gas. The process of attaching each purge nozzle unit 1 to the mounting table B can be realized by fixing the purge nozzle unit 1 to a predetermined position on the mounting table B using an appropriate fixing tool such as a screw. In this fixed state, the upward surface of the tilting support portion 3 is set to be substantially the same level as the upward surface of the mounting table B.

When the downward surface 104 of the port 101 is tilted with respect to the bottom surface of the FOUP 100, the purge nozzle unit 1 according to the present embodiment in which the purge gas supply unit 2 is configured to be tiltable with respect to the tilt support unit 3 The purging gas supply unit 2 tilts with respect to the tilt support unit 3 according to the inclination angle, and the entire port contact portion 25 constituting the upper end portion comes into close contact with the downward surface 104 of the port 101. In the present embodiment, the elastic support member 33 of the tilt support portion 3 is elastically deformed according to the shape of the object to which the purging gas supply portion 2 receives pressure from above, that is, the inclination angle of the downward surface 104 of the port 101 for purging. The entire gas supply unit 2 tilts. Further, in the purge nozzle unit 1 of the present embodiment, the body portion 21 of the purge gas supply unit 2 formed with the purge gas supply unit 2 in the reference posture, the side wall 32 of the tilt support portion 3, and the inward protrusion. The swinging operation of the purging gas supply unit 2 can be smoothly performed by the space between the inward facing surface of the unit 34 and the space between the retaining portion 29 of the purging gas supply unit 2 and the side wall 32 of the tilting support unit 3. it can.

As described above, in the purge nozzle unit 1 according to the present embodiment, the purging gas supply unit 2 is elastically supported by the elastic support member 33 of the tilt support unit 3, and is used for purging according to the inclination angle of the downward surface 104 of the port 101. By configuring the gas supply unit 2 so as to be tiltable, the upper end portion (port contact portion 25) of the gas supply unit 2 for purging is brought into close contact with the downward surface 104 of the port 101 where accurate horizontality is ensured. Of course, the upper end portion (port contact portion 25) of the purging gas supply unit 2 can be automatically brought into close contact with the downward surface 104 of the port 101 where accurate levelness is not ensured. .. As a result, it is possible to prevent the purge gas supplied from the purge gas flow path 23 of the purge nozzle unit 1 from leaking to the outside of the FOUP 100 through the gap between the purge nozzle unit 1 and the port 101, and the purge gas supply unit 2 Compared with the configuration in which the upper end portion (port contact portion 25) of the port 101 cannot be brought into close contact with the inclined downward surface 104 of the port 101, the purging process efficiency can be improved and the time required for the purging process can be shortened.

The present invention is not limited to the above-described embodiment. For example, when the tilting support portion is formed by using the elastic support member, a plurality of elastic support members may be arranged between the purging gas supply portion and the tilting support portion. Specifically, an embodiment in which a plurality of elastic support members are arranged at a predetermined pitch around the body of the purging gas supply unit can be mentioned. When the tilting support portion is configured by using a plurality of elastic support members in this way, the amount of elastic deformation of each elastic support member is equal or substantially equal when the upper end portion of the purging gas supply portion receives pressure from above. In some cases, the amount of elastic deformation may differ for each elastic support member, and in the latter case, at least the upper end portion of the purging gas supply portion is tilted.

Further, the purging gas supply unit is composed of a port receiving portion having a port contacting portion capable of contacting the port and a main body portion which is another part, and the port receiving portion is provided by an appropriate means with respect to the main body portion. It can also be configured so that it can be assembled. In this case, since the main body of the purging gas supply section and the port receiving section are composed of separate parts, the port contacting section of the purging gas supply section that can come into contact with the port deteriorates over time and is used frequently. Even if the port is damaged or deformed according to the situation, the port can be replaced with a new port receiving part or another port receiving part that is not worn or deformed. It is possible to secure a good contact state that ensures high airtightness with.

Further, when the purging gas supply portion includes a port receiving portion having an upper end portion that can come into contact with the port and a main body portion that is another part, the port receiving portion and the main body portion are folded, for example. It may be connected via a joint such as a telescopic member (bellows-shaped joint) or a flexible joint of the type, and the tilting support portion may be configured to tiltably support only the port receiving portion.

Further, in the third and fourth embodiments described above, a gas different from the purging gas is exemplified as the gas used for adjusting the pressure in the pressure adjusting space, but the purging gas may be used together (diverted). it can.

Further, in the third and fourth embodiments described above, an embodiment in which the pressure adjustment space and the ventilation passage are formed in a one-to-one relationship is illustrated, but a configuration in which a plurality of ventilation passages communicating with one pressure adjustment space are formed is formed. It may be adopted. The location where the air passage is formed in the holder is not particularly limited as long as it communicates with the pressure adjusting space, and may be formed on the bottom wall of the holder, for example.

Furthermore, by forming only one pressure adjustment space between the piston unit and the holder and putting the pressure adjustment space in a pressurized state or a depressurized state (negative pressure), the piston unit can be moved up and down. It may be configured.

Furthermore, as long as the airtightness of the pressure adjusting space can be ensured, it is not necessary to interpose the sealing member between the piston unit and the holder.

Further, in the above-described embodiment, the purge nozzle can be changed between the desired standby position and the purge position by moving the entire piston unit up and down with respect to the holder, but the purge nozzle is moved up and down to stand by. It can also be configured to be mutable between the position and the purge position.

Further, in either the mode in which the purging gas supply unit is moved up and down with respect to the holder, or the mode in which the entire purge nozzle is moved up and down, a gas or fluid other than the purging gas is applied as a driving source for moving up and down. Alternatively, a mechanical drive mechanism may be applied.

Further, a configuration may be adopted in which the purge nozzle unit is moved between the standby position and the purge position by a mechanical drive mechanism such as an air cylinder.

Further, in the above-described embodiment, FOUP is exemplified as the container to be purged, but another container (carrier) may be used, and the container to be accommodated in the container to be purged is not limited to the wafer and is a display device. It may be a glass substrate used for a photoelectric conversion device or the like.

Further, the purging device can be applied to something other than the load port, for example, a stocker for storing a container to be purged or a dedicated purging station.

In addition, the specific configuration of each part is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

1 ... Purge nozzle unit 2 ... Purge gas supply part 22 ... Spherical part 23 ... Purge gas flow path 3 ... Tilt support part 31 ... Spherical bearing part 100 ... Purge target container (FOUP)
101 ... Port P ... Purge device X ... Load port

Claims (4)

A mounting table on which a purging target container capable of replacing the internal gas atmosphere with a purging gas through a port provided on the bottom surface is placed, and injections provided at a plurality of locations on the above-mentioned stand according to the port position on the bottom surface. A purging device used in a semiconductor manufacturing process equipped with an elevating nozzle unit for
The elevating nozzle unit has a nozzle having a purging gas flow path extending along a purging gas supply direction extending from the lower side to the upper side, and a holder for holding the nozzle so as to be able to move up and down.
The nozzle provided so as to be able to move up and down with respect to the port has a purging gas supply portion and a tilting support portion.
One of the purging gas supply portions has a port receiving portion that contacts the port, and the other has a supported portion that is tiltably supported by the tilting support portion.
The port receiving portion comes into close contact with the port according to the inclination of the port, and the purging gas is supplied to the purging target container through the port.
A purging device characterized by that. The purging device according to claim 1, wherein the opening diameter of the purging gas flow path of the tilting support portion is larger than the opening diameter of the purging gas flow path of the supported portion. The purging device according to claim 1 or 2, wherein a space is provided between the purging gas supply unit and the tilting support unit to allow tilting of the purging gas supply unit. Any of claims 1 to 3, wherein the elastic member of the tilting support portion is elastically deformed according to the inclination of the downward surface of the port, and the purging gas supply portion having the port receiving portion is tilted. Purge device described in.

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