JP7132488B2 - Gas supply device, gas supply device control method, load port, and semiconductor manufacturing equipment - Google Patents

Description

The present invention relates to a gas supply device for supplying a predetermined gas to a target container having a target space, a control method for the gas supply device, a load port, and a semiconductor manufacturing apparatus.

Conventionally, in a semiconductor manufacturing process, wafers are processed in a clean room in order to improve yield and quality. In recent years, a storage container called FOUP (Front-Opening Unified Pod), which is a target container for transporting and storing wafers in a highly clean environment, and a storage container for transferring wafers in the FOUP to and from semiconductor manufacturing equipment. The load port, which is an interface device that transfers FOUPs to and from the device, is used as an important device for improving the cleanliness of only the local space around the wafer. .

By the way, the inside of the semiconductor manufacturing apparatus is maintained in a predetermined gas atmosphere suitable for wafer processing or processing. space will communicate with each other. Therefore, if the environment in the FOUP is less clean than in the semiconductor manufacturing equipment, the gas in the FOUP may enter the semiconductor manufacturing equipment and adversely affect the gas atmosphere in the semiconductor manufacturing equipment.

As a technique for coping with such a problem, conventionally, a predetermined gas (for example, nitrogen, dry air, inert gas, etc.) is supplied to the FOUP containing the wafers while the FOUP is mounted on the mounting table of the load port. A load port is disclosed which is equipped with a purge device for filling the inside of the FOUP by injecting it from the bottom side to replace the inside of the FOUP with a predetermined gas atmosphere. A so-called bottom purge system in which a predetermined gas such as nitrogen, dry air, or inert gas is injected into the FOUP from the bottom side of the FOUP to replace the inside of the FOUP with a predetermined gas atmosphere is a front purge system purge device. has the advantage of reaching a higher concentration in a given gaseous atmosphere.

In addition, in Patent Document 1, in order to blow a predetermined gas (for example, nitrogen, inert gas, etc.) into the FOUP, a valve provided in the FOUP, which is the target container, is operated with a gas other than the predetermined gas (compressed air, etc.) A load port is disclosed with a purge device configured as follows.

Japanese Unexamined Patent Application Publication No. 2015-88500

However, the conventional purging apparatus has a structure in which a predetermined gas pressure is used to operate a valve provided in the FOUP, which is the object container, in order to open the opening of the FOUP. Therefore, the amount of gas supplied per unit time varies depending on the pressure of the predetermined gas. However, there is a demerit that the attained concentration of the gas atmosphere is low.

The present invention has been made with attention to such points, and the main object thereof is to provide a gas supply device capable of replacing the inside of a target container with a predetermined gas with high efficiency, a control method thereof, and a method for controlling the same. , and to provide a load port and a semiconductor manufacturing apparatus equipped with the gas supply device.

In view of the problems described above, the present invention has taken the following means.

That is, the gas supply device of the present invention contacts a housing structure part through which the gas can pass in order to supply a predetermined gas to the inside of the object container, and a port part provided on one surface of the object container and having an opening/closing mechanism inside. and a nozzle structure having a pressing portion for opening the opening and closing mechanism, a use posture and the port that allow the nozzle structure to supply the predetermined gas into the target container through the port. and an operation adjustment space that expands and contracts to operate between a standby posture in which the predetermined gas cannot be supplied into the target container via the nozzle structure, and the nozzle structure is brought into close contact with the outer edge of the port. and a spaced posture separated from the port portion .

With such a configuration, the nozzle structure can be operated regardless of the pressure of the predetermined gas supplied into the target container, so that the predetermined gas can be preferably introduced into the target container. can. In addition, since the nozzle structure not only opens the port but also adheres closely to the vicinity of the port, it effectively prevents the specified gas from leaking to the outside. can be introduced into the interior of As a result, according to the present invention, the inside of the target container can be replaced with a predetermined gas with higher efficiency.

As a specific configuration capable of replacing the inside of a target container with a predetermined gas with high efficiency , a housing structure part capable of passing the predetermined gas so as to supply the predetermined gas to the inside of the target container, and one surface of the target container a nozzle structure portion having a nozzle portion contacting a port portion provided in the interior thereof and having an opening/closing mechanism and a pressing portion for opening the opening/closing mechanism; an operation adjustment space that expands and contracts to operate between a use posture in which the gas can be supplied into the target container and a standby posture in which the predetermined gas cannot be supplied into the target container via the port, The nozzle portion prevents the gas in the target container from flowing out to the outside by being in close contact with the outer edge of the port portion provided on one surface of the target container, and the pressing portion includes a pressing surface that presses the opening and closing mechanism, A configuration having an injection part for injecting a predetermined gas toward the inside of the target container can be mentioned.

In addition, as a configuration of the operation adjustment space for more efficiently replacing the gas in the target container with a predetermined gas, the operation adjustment space is provided between the housing structure portion and the nozzle portion, and the nozzle portion is located at the port portion. a first operation adjustment space that expands and contracts to operate the nozzle portion between a close contact posture in which the nozzle portion is in close contact with the outer edge and a separation posture in which the nozzle portion and the port portion are separated from the close contact posture; and a nozzle portion and a pressing portion. It is provided between and expands and contracts to operate between a closed posture in which the port is closed by separating the pressing portion from the port and an open posture in which the port is opened by pressing the port. and a second motion adjustment space.

As a specific control method of the gas supply device for more efficiently replacing the gas in the target container with a predetermined gas, the gas can be passed through the target container so as to replace the target container with the predetermined gas. a housing structure portion, a nozzle portion for preventing the gas in the target container from flowing out to the outside by being in close contact with the outer edge of the port portion provided on one surface of the target container, and a pressing surface for pressing the port portion. and a pressing portion having an injection portion for injecting a predetermined gas into the target container, and a close contact posture provided between the housing structure portion and the nozzle portion, in which the nozzle portion is brought into close contact with the outer edge of the port portion, and the close contact. A first operation adjustment space that expands and contracts so as to operate the nozzle portion between a separated posture in which the nozzle portion and the port portion are separated from the posture, and a first operation adjustment space provided between the nozzle portion and the pressing portion, and the pressing portion. A second operation adjustment space that expands and contracts to operate between a closed posture in which the port is closed by moving away from the port and an open posture in which the port is opened by pressing the port. A control method for a gas supply device comprising: controlling operations of a nozzle section and a pressing section by introducing and removing the control gas into and out of the first operation adjustment space and the second operation adjustment space and

Furthermore, in order to control the operations of the nozzle section and the pressing section with a simpler configuration, the control gas is directly introduced into and taken out of the first operation adjustment space, and the first operation adjustment space and the first operation adjustment space are controlled. It is desirable to be able to expand and contract the second motion adjustment space by further providing a communication passage that communicates the two motion adjustment spaces.

In order to control the operations of the nozzle portion and the pressing portion more effectively, the communicating path moves the pressing portion to the open posture after the nozzle portion is brought into close contact with the outer edge of the port portion. Desirably, it is configured to operate.

Further, as an example in which the above-described gas supply device can be effectively used, a plurality of the above-described gas supply devices are provided, and the pressing portion of the gas supply device is communicated with each of a plurality of port portions provided on the bottom surface of the target container. A load port is characterized in that it is configured to be able to replace the gas atmosphere in the target container with nitrogen or dry air in a state.

Furthermore, a semiconductor device comprising the above-described load port, receiving a transported target container, and loading and unloading wafers stored in the target container through a loading/unloading port formed on the front surface of the target container. The above effects can also be obtained in the manufacturing apparatus.

As described above, according to the present invention, a gas supply device capable of replacing the inside of a target container with a predetermined gas with high efficiency, a control method thereof, a load port equipped with the gas supply device, and a semiconductor manufacturing method It becomes possible to provide the device.

1 is an external view according to one embodiment of the present invention; FIG. The typical sectional side view which concerns on the same embodiment. The external view of the principal part which concerns on the same embodiment. FIG. 4 is a schematic cross-sectional view according to FIG. 3; FIG. 4 is a central side cross-sectional view according to FIG. 3; FIG. 4 is an explanatory view of operation according to FIG. 3; FIG. 6 is an explanatory diagram of operation according to FIG. 5; FIG. 4 is an explanatory view of operation according to FIG. 3; FIG. 6 is an explanatory diagram of operation according to FIG. 5; The external view corresponding to FIG. 8 which concerns on the modification of the same embodiment. 1 is a schematic plan view of a semiconductor manufacturing apparatus according to an embodiment; FIG.

An embodiment of the present invention will be described below with reference to the drawings.

A purge nozzle unit 1, which is a gas supply device according to this embodiment, can be attached to a purge device P applied to a load port X shown in FIGS. 1 and 2, for example. The load port X is mounted on a semiconductor manufacturing apparatus used in a semiconductor manufacturing process. FIG. 11 schematically illustrates the configuration of a semiconductor manufacturing apparatus M. As shown in FIG. The semiconductor manufacturing apparatus M is arranged and used in a clean room, and includes a semiconductor manufacturing apparatus main body 71, a transfer chamber 72 arranged adjacent to the semiconductor manufacturing apparatus main body 71, and a transfer chamber 72 arranged adjacent to the transfer chamber 72. and one or more (three in the example of the figure) load ports X to be connected. In the semiconductor manufacturing apparatus M, the FOUP 100 shown in FIG. Then, the door portion D of the load port X is brought into close contact with the door 112 of the FOUP 100, and the door 112 and the door portion D are integrally moved to open and close them. A wafer W, which is schematically illustrated, is taken in and out of the semiconductor manufacturing apparatus M. As shown in FIG.

As shown in FIG. 2, the FOUP 100 applied in the present embodiment accommodates a plurality of wafers W inside and is configured such that these wafers W can be taken in and out through a loading/unloading port 111 formed on the front surface. Since it is a known one provided with a door 112 capable of opening and closing the door, detailed description thereof will be omitted. In this embodiment, the front surface of the FOUP 100 means the surface facing the door portion D of the load port X when the FOUP 100 is placed on the load port X. As shown in FIG. A purge port 101 is provided at a predetermined location on the bottom surface of the FOUP 100, as indicated by imaginary lines in FIGS. The port 101 is mainly composed of, for example, a hollow cylindrical grommet seal fitted into an opening formed in the bottom surface of the FOUP 100 .

For example, as shown in FIG. 11, the semiconductor manufacturing apparatus M includes a load port X, a semiconductor manufacturing apparatus main body 71 arranged at a position relatively far from the load port X, and a semiconductor manufacturing apparatus main body 71 and the load port X. In the transfer chamber 72, for example, the wafers W in the FOUP 100 placed on each load port X are transferred one by one between the FOUP 100 and the transfer chamber 72. A transfer device 721 is provided for transferring between the inside of the chamber 72 and between the inside of the transfer chamber 72 and the inside of the semiconductor manufacturing apparatus main body 71 . It is also possible to transfer a cassette storing a plurality of wafers W between the FOUP 100 and the transfer chamber 72 and between the transfer chamber 72 and the conductor manufacturing apparatus main body 71 . With such a configuration, in the clean room, the interior of the semiconductor manufacturing apparatus main body 71, the interior of the transfer chamber 72, and the interior of the FOUP 100 are maintained at a high degree of cleanliness.

The load port X, as shown in FIG. 71, and a purge device P capable of injecting a purge gas into the FOUP 100 and replacing the gas atmosphere in the FOUP 100 with a purge gas such as nitrogen gas. It is.

The door portion D provided on the frame F has an open position in which the door 112 provided on the front surface of the FOUP 100 is opened while the FOUP 100 is placed on the mounting table B, and the door 112 is opened to open the loading/unloading port 111. It is operable between a closed position for closing the loading/unloading port 111 . A known mechanism (not shown) can be applied as a door lifting mechanism (not shown) that moves the door portion D up and down at least between the open position and the closed position.

The mounting table B is arranged in a substantially horizontal posture at a position slightly above the center in the height direction of the frame F, and has a plurality of positioning projections (kinematic pins) 81 protruding upward. . The FOUP 100 is positioned on the mounting table B by engaging these positioning protrusions 81 with positioning recesses (not shown) formed in the bottom surface of the FOUP 100 . Further, the mounting table B is provided with a seating sensor 82 (not shown) for detecting whether or not the FOUP 100 is mounted on the mounting table B at a predetermined position. The structure and location of the positioning projection 81 and the seating sensor 82 can be appropriately set and changed in accordance with standards and the like.

The purge device P includes a plurality of purge nozzle units 1 arranged at predetermined positions on a mounting table B with their upper ends exposed.

The plurality of purge nozzle units 1 are attached at appropriate positions on the mounting table B according to the positions of the ports 101 provided on the bottom surface of the FOUP 100 and can contact the ports 101 provided on the bottom of the FOUP 100 . In this embodiment, in addition to each purge nozzle unit 1, an exhaust valve configured to discharge the gas in the FOUP 100 when the pressure in the FOUP 100 becomes high is appropriately arranged at any location corresponding to the port 101. ing. Since the configuration of the exhaust valve is based on existing configurations, a detailed description thereof will be omitted.

Also, here, the configuration of the port 101 provided in the FOUP 100 will be specifically described. The port 101 is arranged corresponding to the purge nozzle unit 1 as described above. a gas inlet 104 into which the gas flows, a check valve 105, a valve chamber 106 that movably houses the check valve 105, a compression spring 107 that biases the check valve 105 toward the gas inlet 104, It has a communication port 108, a support plate 109 that supports the compression spring 107, a filter 110, and the like. Since the port 101 having such a configuration is an existing one, further detailed description is omitted. A conventional general manner of introducing the purge gas into the FOUP 100 through the existing port 101 is as follows. That is, a purge gas, which is a predetermined gas, is caused to flow into the gas inlet 104 , and the compression spring 107 is compressed by the pressure associated with the flow rate of the purge gas to form a gap between the check valve 105 and the base 103 . As a result, the purge gas is introduced into the FOUP 100 from this gap, through the valve chamber 106 and the communication port 108 , and through the filter 110 .

The gas inlet 104, the check valve 105 and the compression spring 107 constituting the port 101 constitute an opening/closing mechanism according to the present invention.

Each purge nozzle unit 1, as shown in FIGS. and a gas introducing portion 4 for taking in and out compressed air to operate the . In addition, in this specification, illustration of the said gas introduction part 4 is made into a schematic thing.

Here, the purge nozzle unit 1, which is a gas supply device according to the present embodiment, includes a housing 3 through which a predetermined gas can pass in order to supply a predetermined gas inside the FOUP 100, and an opening/closing mechanism provided on one side of the FOUP 100 and inside. A nozzle 2 having a first nozzle 21 which is a nozzle portion which contacts the vicinity of a port 101 which is a port portion and a second nozzle 22 which is a pressing portion which opens and closes an opening/closing mechanism, and a nozzle provided over the housing 3 and the nozzle 2. 2 between a use posture in which a predetermined gas can be supplied into the target container through the port 101 and a standby posture in which the predetermined gas cannot be supplied into the target container through the port 101. It is characterized by comprising an adjustment space 5 . Further, the purge nozzle unit 1 according to the present embodiment further includes a gas introduction section 4 that controls the operation of the nozzle 2 by introducing and removing compressed air, which is a control gas, into and from the operation adjustment space 5 .

Each component of the purge nozzle unit 1, which is a gas supply device, will be described below.

The housing 3 is capable of passing a predetermined gas to replace the inside of the FOUP 100, which is the object container, with the gas. The housing 3 includes a housing body 31 having a substantially rectangular parallelepiped shape, a pair of outer rings 32 provided on an inner wall 35 of the housing body 31 and in contact with the outer peripheral surface of the nozzle 2 , and an outer wall 34 of the housing body 31 extending from the nozzle 2 . and an inlet port 33 for introducing compressed air toward the nozzle 2 side. Specifically, the introduction port 33 penetrates from the outer wall 34 to the inner wall 35 of the housing body 31 and communicates with the operation adjustment space 5 formed between the housing 3 and the nozzle 2 . is doing.

The nozzle 2 has a first nozzle 21 for preventing the gas in the FOUP 100 from flowing out to the outside by coming into close contact with the outer edge 102 of the port 101 provided on one surface of the target container, and a pressing surface for pressing the port 101. and a second nozzle 22 having an injection part for injecting a predetermined gas into the target container. The first nozzle 21 has a contact surface 23 that can come into close contact with the outer edge 102 of the port 101 and an inner ring 24 that is a packing for supporting the second nozzle 22 without gaps. The second nozzle 22 has a gas introduction port 25 for introducing a predetermined gas, and a height direction nozzle for guiding upward the predetermined gas introduced from the gas introduction port 25, i.e., nitrogen gas. a gas guide path 26 penetrating through a gas guide path 26, a pressing surface 27 which can abut and press against a port 101 of a target container at its distal end to open a check valve 105 (FIG. 2) inside the port 101, and the pressing surface 27 to the proximal end. It has a gas injection port 28 formed in a slit shape on the side for introducing nitrogen gas into the FOUP 100 . In this embodiment, a second channel 25a for guiding the purge gas, which is a predetermined gas, from the gas inlet 25 in the horizontal direction, and a second channel 25a continuous with the second channel 25a for guiding the purge gas in the vertical direction. The first flow path 26a is integrally formed with the relative position fixed. However, the present invention does not preclude a configuration in which the relative positions of the first and second flow paths 26a and 25a are changeable.

The operation adjustment space 5 is provided between the housing 3 and the first nozzle 21, and the first nozzle 21 is in a close contact posture (P1) in which the first nozzle 21 is brought into close contact with the outer edge 102 of the port 101, and from the close contact posture (P1) to the first nozzle. A first operation adjustment space 51 that expands and contracts to operate the first nozzle 21 between the separation posture (P2) in which the one nozzle 21 and the port 101 are separated, and the first nozzle 21 and the second The port 101 is closed by separating the second nozzle 22 from the port 101 (specifically, the check valve 105) and the port 101 (specifically, the , the check valve 105) is pressed to open the port 101 to open the second operation adjustment space 52 that expands and contracts to operate between the open posture (Q1), and these first operation adjustment spaces 51 and a communication passage 53 that communicates with the second motion adjustment space 52 .

The first operation adjustment space 51 assumes a separation posture (P2 ) to a close contact position (P1) in close contact with the outer edge 102 of the port 101. FIG.

After gas is introduced into the first operation adjustment space 51 and the first nozzle 21 assumes the close contact posture (P1), the second operation adjustment space 52 is configured by introducing compressed air through the communication passage 53. The second nozzle 22 is separated from the port 101 (specifically, the check valve 105) to close the port 101 (Q2), and the port 101 (specifically, the check valve 105) is closed. This is for changing the posture to the open posture (Q1) in which the port 101 is opened by pressing.

The communication passage 53 supplies control gas to the first motion adjustment space 51 and introduces gas, ie, compressed air, into the first and second motion adjustment spaces 51 and 52 to bring the first nozzle 21 into the close contact posture. (P1), the second nozzle 22 is moved to the open posture (Q1), and the compressed air, which is the control gas in the first and second operation adjustment spaces 51 and 52, is sucked into the second nozzle 22. It is constructed such that the nozzle 22 is in the closing posture (Q2) and the first nozzle 21 is in the separating posture (P2). 4, 5, 7 and 9, one or more communication passages 53 are provided in the circumferential direction of the first and second nozzles 22. As shown in FIG. By adjusting the diameter, position, and number of the communicating passages 53, the first operation adjusting space 51 changes the posture of the first nozzle 21 to the contact posture (P1) when compressed air is introduced. After that, compressed air is introduced into the second operation adjustment space 52 to change the posture of the second nozzle 22 to the open posture (Q1).

The gas introduction unit 4 introduces and extracts compressed air, which is an example of a gas different from nitrogen gas, into and out of the first operation adjustment space 51 and the second operation adjustment space 52 . to control the operation of This gas introduction part 4 introduces and extracts the control gas into and out of the first motion adjustment space 51, and through a communication passage 53 that communicates the first motion adjustment space 51 and the second motion adjustment space 52, , the second motion adjustment space 52 can also be scaled.

In this embodiment, by introducing compressed air into the operation adjustment space 5, the standby position shown in FIGS. From the state in the closed posture (Q2), the first nozzle 21 changes to the close posture (P1) as shown in FIGS. ) in which the port 101 is not opened while being in close contact with the outer edge 102 of the port 101, and furthermore, as in the use position shown in FIGS. 27 pushes up the port 101 (specifically, the check valve 105), so that the port 101 can be controlled step by step to the open posture (Q1) in which the port 101 is opened.

Of course, if compressed air is sucked by controlling the gas introduction section 4 from the state (P1, Q1) shown in FIGS. 8 and 9, the state (P1, Q2) shown in FIGS. Needless to say, the state returns to the state (P2, Q2) shown in FIGS. That is, according to the present embodiment, the first nozzle 21 and the second nozzle 22 constituting the nozzle 2 are raised and lowered by introducing and removing compressed air different from nitrogen gas, which is a predetermined gas, from the gas introduction part 4. It allows for smooth and efficient movement.

The purge nozzle unit 1 according to the present embodiment described in detail above is attached to a plurality of predetermined positions (near the four corners of the mounting table B in this embodiment) on the mounting table B of the load port X in a unitized state. It is realized to function as a purge device P capable of replacing the gas atmosphere in the FOUP 100 mounted on the mounting table B with a purge gas.

Further, as a modified example of this embodiment, a purge nozzle unit 1 as a gas supply device shown in FIG. 10 can be cited. The same reference numerals are given to the components of the modified example that correspond to the components of the above-described embodiment, and detailed description thereof will be omitted.

Specifically, in the purge nozzle unit 1 according to this modified example, the shape of the second nozzle 22 is different. The second nozzle 22 is provided with an opening 29 at a position separated from the pressing surface 27 , and the opening 29 corresponds to the gas injection port 28 . Even with such a configuration, the same effects as those of the above-described embodiment can be obtained.

As described above, the gas supply apparatus according to the present embodiment is in close contact with the housing 3 through which the gas can pass in order to replace the inside of the target container with a predetermined gas, and the vicinity of the port 101 provided on one surface of the target container. Then, the nozzle 2 is pressed to open the port 101, and the nozzle 2 is provided over the housing 3 and the nozzle 2, and the nozzle 2 is in a use position and through the port 101 to supply a predetermined gas into the target container through the port 101. A gas introduction that controls the operation of the nozzle 2 by moving gas into and out of the operation adjustment space 5 and the operation adjustment space 5 that expands and contracts so that the nozzle 2 can operate between a standby posture in which the specified gas cannot be supplied into the target container. A part 4 is provided.

By doing so, the nozzle 2 is operated regardless of the pressure of the predetermined gas supplied into the object container, so that the predetermined gas can be preferably introduced into the FOUP 100 as the object container. can. In addition, the nozzle 2 not only opens the port 101 but also adheres closely to the vicinity of the port 101 to effectively prevent the predetermined gas from leaking to the outside. It can be introduced inside. As a result, according to the present embodiment, the purge nozzle unit 1 capable of supplying a predetermined gas to the inside of the target container with higher efficiency, the purge device P and the load port X equipped with the purge nozzle unit 1 are provided. , and a semiconductor manufacturing apparatus M having the load port X can be provided.

As a specific configuration that can replace the inside of the target container with a predetermined gas with high efficiency, in this embodiment, the nozzle 2 is in close contact with the outer edge 102 of the port 101 provided on one surface of the target container, so that the inside of the target container A first nozzle 21 that is a nozzle portion for preventing the gas from flowing out to the outside, a pressing surface 27 that presses the port 101, and a second pressing portion that has an injection portion that injects the gas toward the inside of the target container. It is configured to have two nozzles 22 .

Further, as an example of the configuration of the operation adjustment space 5 for more efficiently replacing the gas in the target container with a predetermined gas, in the present embodiment, the operation adjustment space 5 is located between the housing 3 and the first nozzle 21. and a close contact posture (P1) in which the first nozzle 21 is brought into close contact with the outer edge 102 of the port 101, and a separated posture (P2) in which the first nozzle 21 and the port 101 are separated from the close contact posture (P1). A first operation adjustment space 51 that expands and contracts to operate the first nozzle 21 between, and is provided between the first nozzle 21 and the second nozzle 22 to move the second nozzle 22 from the port 101 A second operation adjustment space that expands and contracts to operate between a closed posture (Q2) in which the port 101 is closed by separating the port 101 and an open posture (Q1) in which the port 101 is opened by pressing the port 101. 52 is applied.

The control method of the purge nozzle unit 1 according to the present embodiment is a specific configuration for more efficiently replacing the gas in the FOUP 100 with a predetermined gas. 21, the first nozzle 21 is brought into close contact with the outer edge 102 of the port 101 (P1), and the separated posture (P1) is separated from the first nozzle 21 and the port 101 from the close contact posture (P1). P2) and a first operation adjustment space 51 that expands and contracts to operate the first nozzle 21 between the first nozzle 21 and the second nozzle 22, and the second nozzle 22 The second expansion/contraction mechanism is operated between a closed posture (Q2) in which the port 101 is closed by separating from the port 101 and an open posture (Q1) in which the port 101 is opened by pressing the port 101. This is a control method applied to the purge nozzle unit 1 having the operation adjustment space 52 , and the gas introduction section 4 allows compressed air to flow into and out of the first operation adjustment space 51 and the second operation adjustment space 52 . Characterized by

Furthermore, in order to control the operations of the first nozzle 21 and the second nozzle 22 with a simpler configuration, in the present embodiment, the control gas introduction device is used to introduce the control gas into the first operation adjustment space 51. By further providing a communication path 53 that communicates the first motion adjustment space 51 and the second motion adjustment space 52, the second motion adjustment space 52 can also be expanded and contracted.

In order to more effectively control the operations of the first nozzle 21 and the second nozzle 22, in the present embodiment, the communication path 53 is arranged in a close contact posture in which the first nozzle 21 is in close contact with the outer edge 102 of the port 101 ( P1), and then the second nozzle 22 is moved to the open posture (Q1).

In addition, the semiconductor manufacturing apparatus M according to the present embodiment is provided with a load port X, receives the FOUP 100 which is a container to be purged, which has been transported, and carries out the wafer W stored in the FOUP 100 formed on the front surface of the FOUP 100. It is characterized by taking in and out through an entrance 111 .

Although the embodiments of the present invention have been described above, the present invention is not limited to the configurations of the above embodiments. In the above-described embodiment, the gas introduction section 4 has disclosed a mode in which compressed air is taken in and out of the first operation adjustment space 51 and the second operation adjustment space 52 as an example of a gas different from nitrogen gas. The gas is not limited to compressed air, and nitrogen gas, other inert gas, or dried air may be used.

In the above-described embodiment, the ascending motion adjusting space in which the nozzle mechanism ascends is formed by introducing compressed air into the first motion adjusting space. Additional space may be provided. Similarly, as for the second motion adjustment space, not only the motion adjustment space for ascent but also the motion adjustment space for descent may be provided. Alternatively, by combining with an elastic bias such as a spring, it is also possible to form only an operation adjusting space for either ascending or descending.

In the above-described embodiment, the port 101, which is a valve, is opened by the second nozzle 22, which is the pressing portion forming the first flow path 26a. You may provide the press part which carries out. Further, in the above-described embodiment, a configuration in which the member forming the second flow path 25a moves relative to the housing 3 is applied. It is good also as a structure which can operate|move relatively.

Further, for example, in the above-described embodiment, the operation adjustment spaces 51 and 52 and the ventilation holes are formed in a one-to-one relationship. good. Further, in the above-described embodiment, a mode of controlling the nozzle 2 only by controlling the compressed air by the gas introduction part 4 is disclosed, but this does not deny a mode of making the nozzle operable by elastically biasing it.

Other configurations can also be modified in various ways without departing from the gist of the present invention.

1... Gas supply device (purge nozzle unit)
2 Nozzle structure (nozzle)
21 Nozzle part (first nozzle)
22... Pressing portion (second nozzle)
3... housing structure (housing)
4 Gas introduction part 5 Operation adjustment space 51 First operation adjustment space 52 Second operation adjustment space 53 Communication path X Load port P Purge device 100 ... Object container (FOUP)

Claims (8)

a housing structure through which a predetermined gas can pass in order to supply the gas to the inside of the target container;
a nozzle structure portion having a nozzle portion provided on one surface of the target container and in contact with a port portion provided with an opening/closing mechanism therein, and a pressing portion for opening the opening/closing mechanism;
The nozzle structure has a use posture in which the predetermined gas can be supplied into the target container through the port portion, and a standby posture in which the predetermined gas cannot be supplied into the target container through the port portion. and an operation adjustment space that expands and contracts to operate between
A gas supply device , wherein the nozzle structure part is moved up and down between a contact position in which the nozzle structure part is brought into close contact with the outer edge of the port part and a separated position in which the nozzle structure part is separated from the port part . a housing structure through which a predetermined gas can pass in order to supply the gas to the inside of the target container;
a nozzle structure portion having a nozzle portion provided on one surface of the target container and in contact with a port portion provided with an opening/closing mechanism therein, and a pressing portion for opening the opening/closing mechanism;
The nozzle structure has a use posture in which the predetermined gas can be supplied into the target container through the port portion, and a standby posture in which the predetermined gas cannot be supplied into the target container through the port portion. and an operation adjustment space that expands and contracts to operate between
The nozzle portion is in close contact with the outer edge of the port portion provided on one surface of the target container to prevent the gas in the target container from flowing out to the outside,
The gas supply device, wherein the pressing portion has a pressing surface for pressing the opening/closing mechanism and an injection portion for injecting the predetermined gas into the target container. The motion adjustment space is
A close contact posture provided between the housing structure portion and the nozzle portion, in which the nozzle portion is in close contact with the outer edge of the port portion, and a separation posture in which the nozzle portion and the port portion are separated from the close contact posture. a first motion adjustment space that expands and contracts to move the nozzle portion therebetween;
A closed posture provided between the nozzle portion and the pressing portion, in which the port portion is closed by separating the pressing portion from the port portion, and the port portion is opened by pressing the port portion. 3. The gas supply device according to claim 2, further comprising a second operation adjustment space that expands and contracts to operate between the open position and the open position. a housing structure capable of passing a predetermined gas to replace the inside of the target container with the gas;
a nozzle portion for preventing the gas in the object container from flowing out to the outside by being in close contact with the outer edge of the port portion provided on one surface of the object container;
a pressing portion having a pressing surface for pressing the port portion and an injection portion for injecting the predetermined gas into the target container;
A close contact posture provided between the housing structure portion and the nozzle portion, in which the nozzle portion is in close contact with the outer edge of the port portion, and a separation posture in which the nozzle portion and the port portion are separated from the close contact posture. a first motion adjustment space that expands and contracts to move the nozzle portion therebetween;
A closed posture provided between the nozzle portion and the pressing portion, in which the port portion is closed by separating the pressing portion from the port portion, and the port portion is opened by pressing the port portion. A control method for a gas supply device comprising a second operation adjustment space that expands and contracts to operate between an open posture and an open posture,
A method of controlling a gas supply device, comprising: controlling the operations of the nozzle section and the pressing section by introducing and removing control gas into and from the first operation adjustment space and the second operation adjustment space. The control gas is directly taken in and out of the first motion adjustment space, and further comprising a communication passage that communicates the first motion adjustment space and the second motion adjustment space. 5. The method of controlling a gas supply device according to claim 4, wherein the second operation adjustment space can also be expanded or contracted. 6. The gas according to claim 5, wherein the communication passage is configured to operate the pressing portion to the open posture after the nozzle portion is moved to the close contact posture with the outer edge of the port portion. How to control the feeding device. Equipped with a plurality of gas supply devices according to any one of claims 1 to 3,
The gas atmosphere in the target container can be replaced with nitrogen or dry air in a state in which the pressing portion of the gas supply device is communicated with each of the plurality of port portions provided on the bottom surface of the target container. A load port characterized by a A load port according to claim 7, a semiconductor manufacturing apparatus main body, and a transfer chamber disposed between the load port and the semiconductor manufacturing apparatus main body,
1. A semiconductor manufacturing apparatus which receives a transported target container, and loads and unloads wafers stored in the target container through a loading/unloading port formed on the front surface of the target container.

Images