TWI763773B - Gas supply apparatus, control method of gas supply apparatus, loading port, and semiconductor manufacturing apparatus - Google Patents

Abstract

An object of the present invention is to provide a gas supply device capable of reliably supplying a predetermined gas to the inside of a target container, a loading port and a semiconductor manufacturing apparatus provided with the gas supply device. The unit (1) of the gas introduction device according to the solution of the present invention is characterized by having a casing (3) through which the gas can pass through by replacing the inside of the FOUP (100) with a predetermined gas, and is closely attached to the FOUP (100). 100) near the port (101) and push the nozzle (2) that will open the port (101), so that the nozzle (2) can spray the specified gas into the target container through the port (101). The use posture and the action adjustment space (5) between the standby postures where the designated gas can be sprayed into the target container through the port (101) cannot be expanded or contracted, and the compressed air is injected into the action adjustment space (5) by the action adjustment space (5). The gas introduction part (4) is discharged to control the operation of the nozzle (2).

Description

Gas supply apparatus, control method of gas supply apparatus, loading port, and semiconductor manufacturing apparatus

The present invention relates to a gas supply device for supplying a specified gas to a target container having a target space, a control method of the gas supply device, a loading port, and a semiconductor manufacturing apparatus.

In the past, in the semiconductor manufacturing process, in order to improve productivity or quality, wafer processing was performed in a clean room. In recent years, a container for storage called FOUP (Front-Opening Unified Pod), which satisfies the target container for transferring and storing wafers in a high-clean environment, and a wafer in the FOUP between the semiconductor manufacturing equipment and the The load port of the interface device that takes out and puts in and delivers FOUP to and from the transfer device is an important device for improving the cleanliness only for the local space around the wafer.

However, although the inside of the semiconductor manufacturing apparatus is maintained in a designated gas atmosphere suitable for the handling or processing of the wafer, the internal space of the FOUP and the internal space of the semiconductor manufacturing apparatus when the wafer is sent out from the FOUP to the semiconductor manufacturing apparatus are interconnected. Therefore, when the cleanliness of the environment in the FOUP is lower than that in the semiconductor manufacturing apparatus, the gas in the FOUP enters the semiconductor manufacturing apparatus and adversely affects the gas atmosphere in the semiconductor manufacturing apparatus.

As a technique for dealing with such problems, a loading port has been disclosed, which is equipped with a predetermined gas (for example, nitrogen or dry air, an inert gas, etc.) in a state where a FOUP containing a wafer is placed on a mounting table of the loading port. Gas etc.) is injected from the bottom side of the FOUP to fill the inside, and a flushing device that replaces the inside of the FOUP with a specified gas atmosphere. Such a so-called bottom purge method in which a specified gas such as nitrogen, dry air, and inert gas is injected into the FOUP from the bottom side of the FOUP, and the FOUP is replaced with a specified gas atmosphere. The advantage of the flushing device of the Front purge method is that the reaching concentration of the specified gas atmosphere is relatively high.

Therefore, Patent Document 1 discloses that, in order to blow a predetermined gas (for example, nitrogen, an inert gas, etc.) into the FOUP, a valve having a configuration in which the FOUP provided in the target container is operated with a gas other than the predetermined gas (compressed air, etc.) The loading port of the flushing device. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2015-88500

[The problem to be solved by the invention]

However, in the conventional flushing device, in order to open the opening of the FOUP, the valve of the FOUP provided in the target container is operated by the pressure of the specified gas. The supply amount varies, and as a result, it is difficult to maintain a high concentration of the designated gas atmosphere in the FOUP within the designated operation time, and there is a disadvantage that the concentration of the designated gas atmosphere is low.

The present invention has been made in view of such problems, and the main object of the present invention is to provide a gas supply device capable of exchanging the inside of the object container of the above-mentioned FOUP with a predetermined gas with higher efficiency, a control method thereof, and a gas supply device provided with the same. load ports and semiconductor manufacturing equipment. [Means for solving problems]

The present invention takes the following measures in view of the above-mentioned problems.

That is, the gas supply device according to the present invention is characterized by comprising: a casing structure part which allows the gas to pass through when a predetermined gas is supplied to the inside of the target container; The nozzle part of the port part and the nozzle structure part of the pressing part that opens the opening and closing mechanism; and the use posture for the nozzle part to supply the specified gas into the target container through the port part, and the use posture between the The port shall not allow the movement adjustment space to expand or contract between the standby postures in which the specified gas is supplied into the target container.

According to such a device, the predetermined gas can be appropriately introduced into the target container in order to operate the nozzle structure without being limited by the pressure of the predetermined gas supplied into the target container. In addition, the nozzle structure part not only opens the port, but also effectively avoids leakage of the specified gas to the outside by being closely attached to the vicinity of the port, so that the specified gas can be efficiently introduced into the target container. As a result, according to the present invention, the inside of the target container can be replaced with a predetermined gas with higher efficiency.

As a specific configuration that can efficiently replace the inside of the target container with the specified gas, there is a nozzle part that prevents the target by being closely attached to the outer edge of the port provided on one side of the target container. The gas in the container flows out to the outside; the pressing part is composed of a pressing surface for pressing the opening and closing mechanism and a spraying part for spraying the specified gas to be supplied into the target container.

In addition, as the structure of the operation adjustment space for efficiently replacing the gas in the target container with the specified gas, the operation adjustment space is provided between the casing structure part and the nozzle part and the nozzle part is in close contact with the operation adjustment space. The first movement adjustment space for expanding and contracting the movement of the nozzle portion between the close contact posture of the outer edge of the port portion and the separation posture of separating the nozzle portion from the port portion from the close contact posture; Between the pressing parts, the second movement adjustment to make the pressing part move between the closed position in which the port is closed by moving away from the port and the open position in which the port is opened by pressing the port. space.

Next, as a control method of a specific gas supply device for replacing the gas in the target container with the specified gas more efficiently, there is provided an outer casing structure that allows the gas to pass through by replacing the inside of the target container with the specified gas a nozzle part for preventing the gas in the target container from flowing out to the outside by closely adhering to the outer edge of the port provided on one side of the target container; The pressing part of the injection part for injecting the specified gas inside is provided between the casing structure part and the nozzle part, and the nozzle part is brought into close contact with the outer edge of the port part in a close contact posture and from the close contact posture, the nozzle part is brought into contact with the nozzle part. The first movement adjustment space for expanding and contracting the operation of the nozzle part is provided between the nozzle part and the pressing part so that the pressing part is separated from the port part. A control method of a gas supply device for adjusting a space by a second movement between a closed position in which the port is closed and an open position in which the port is opened by pushing the port to expand and contract is characterized by using the control The gas is injected and discharged into the first movement adjustment space and the second movement adjustment space to control the operation of the nozzle part and the pressing part.

Furthermore, in order to control the operation of the nozzle part and the pressing part with a simpler structure, it is preferable that the control gas is directly injected and discharged into the first operation adjustment space; The communication path of the second action adjustment space can expand and contract the second action adjustment space.

Next, in order to more effectively control the operations of the nozzle portion and the pressing portion, it is preferable that the communication path is formed so that the pressing portion is in the open position after the nozzle portion is moved to the aforementioned close contact position in which the outer edge of the port portion is in close contact. The composition of action.

In addition, as an example of effectively utilizing the above-mentioned gas supply device, there can be mentioned a loading port characterized by including a plurality of the above-mentioned gas supply devices, and a plurality of the above-mentioned gas supply devices are provided to communicate with the pressing portion of the gas supply device to the bottom surface of the target container. In the state of each port, the gas atmosphere in the target container can be replaced with nitrogen or dry air.

Furthermore, in the case where the loading port is provided, the target container to be transported is received, and the wafers contained in the target container are taken out and loaded through an unloading and loading port formed in front of the target container. The characteristic semiconductor manufacturing apparatus can also obtain the aforementioned effects. [Effect of invention]

As described above, according to the present invention described above, it is possible to provide a gas supply device capable of efficiently replacing the inside of a target container with a specific gas, a control method thereof, a loading port including the gas supply device, and a semiconductor manufacturing apparatus.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

The flushing nozzle unit 1 of the gas supply device of the present embodiment is a unit that can be attached to the flushing device P applied to the loading port X as shown in FIGS. 1 and 2 , for example. The load port X is mounted on a semiconductor manufacturing apparatus used in a semiconductor manufacturing process. In FIG. 11 , the configuration of the semiconductor manufacturing apparatus M is schematically illustrated. The semiconductor manufacturing apparatus M is arranged and used in a clean room, and includes a semiconductor manufacturing apparatus main body 71, a transfer chamber 72 arranged adjacent to the semiconductor manufacturing apparatus main body 71, and one or more arranged adjacent to the transfer chamber 72 (in the example shown in the figure, 3) of the load port X. In the semiconductor manufacturing apparatus M, the FOUP 100 shown in FIG. 2 which is an example of the container to be rinsed according to the present invention is placed on the loading port X. As shown in FIG. Next, the door 112 of the FOUP 100 is brought into close contact with the door part D of the loading port X, and the door 112 and the door part D are moved together to open and close them, whereby the accommodated object accommodated in the FOUP 100 is schematically illustrated as The wafer W is an apparatus for loading and unloading the wafer W into the semiconductor manufacturing apparatus M.

The FOUP 100 to which this embodiment is applied, as shown in FIG. 2 , is a known device that accommodates a plurality of wafers W in the interior, and constitutes a transfer port 111 formed on the front so that the wafers W can be interposed therebetween. It is provided with the door 112 which can open and close the carry-out port 111 for taking out and putting in, so the detailed description is omitted. In addition, in this embodiment, the front surface of the FOUP 100 means the surface on the side opposite to the door D of the load port X when it is mounted on the load port X. On the bottom surface of the FOUP 100, a port 101 for flushing is provided at a designated position, as shown by a virtual dotted line in FIGS. 5, 7, and 9 to be described later. The port 101 is formed, for example, with a hollow cylindrical gasket (grommet seal) inserted into an opening formed on the bottom surface of the FOUP 100 as a main body.

For example, as shown in FIG. 11 , the semiconductor manufacturing apparatus M is provided with a loading port X, a semiconductor manufacturing apparatus body 71 arranged at a position relatively far from the loading port X, and a transfer device arranged between the semiconductor manufacturing apparatus body 71 and the loading port X. Chamber 72 ; In the transfer chamber 72 , for example, wafers W placed in the FOUP 100 of each load port X are provided, and each wafer W is transferred one by one between the inside of the FOUP 100 and the inside of the transfer chamber 72 , and in the transfer chamber 72 The transfer machine 721 between the body 71 of the semiconductor manufacturing apparatus. Further, cassettes for accommodating a plurality of wafers W may be transferred in a cassette between the FOUP 100 and the transfer chamber 72 and between the transfer chamber 72 and the semiconductor manufacturing apparatus main body 71 . With such a configuration, in the clean room, the inside of the semiconductor manufacturing apparatus main body 71 , the inside of the transfer chamber 72 , and the inside of the FOUP 100 can be maintained at high cleanliness.

The loading port X, as shown in FIG. 1, is provided with a frame F which is arranged in an upright posture and has a door D which can open and close an opening to communicate with the unloading and importing port 111 of the FOUP 100, and the frame F is in a slightly horizontal position away from the semiconductor manufacturing. The mounting table B extending in the direction of the device 71 and the flushing device P which injects flushing gas into the FOUP 100 and can replace the gas atmosphere in the FOUP 100 with a flushing gas such as nitrogen.

The door D provided on the frame F can open the door 12 to open the opening position of the unloading and importing entrance 111 when the FOUP 100 is placed on the mounting table B and the door 112 provided in close contact with the front of the FOUP 100. The movement between the closed positions of the unloading and unloading entrance 111 is closed. A known mechanism can be applied as a door lift mechanism (illustration omitted) for at least moving up and down the door portion D between the open position and the closed position.

The mounting table B is a mounting table which is arranged at a position slightly upward in the frame F from the center portion in the height direction in a substantially horizontal posture, and has a plurality of positioning protrusions (Kinematic Pins) 81 protruding upward. Then, the positioning of the FOUP 100 on the mounting table B is achieved by engaging the positioning protrusions 81 with the positioning recesses (not shown) formed on the bottom surface of the FOUP 100 . In addition, the seating sensing device 82 shown in the drawing is provided on the mounting table B to detect whether or not the FOUP 100 is placed at a predetermined position on the mounting table B, which is not shown. The structure or arrangement of the positioning protrusions 81 and the seating sensing device 82 can be set/changed as appropriate according to different specifications and the like.

The flushing device P is provided with a plurality of flushing nozzle units 1 arranged in a predetermined position on the mounting table B in a state where the upper end portion is exposed.

The plurality of flushing nozzle units 1 are installed at appropriate positions on the stage B corresponding to the positions of the ports 101 provided on the bottom surface of the FOUP 100 , and can contact the unit of the ports 101 provided on the bottom of the FOUP 100 . In addition, in this embodiment, the exhaust valve is appropriately arranged anywhere corresponding to the port 101 outside each flushing nozzle unit 1, so that the gas in the FOUP 100 can be discharged when the pressure in the FOUP 100 becomes high. The configuration of the exhaust valve is based on the existing configuration, and thus the detailed description is omitted.

In addition, here, the structure provided in the port 101 of the FOUP100 is demonstrated concretely. The port 101, which is arranged corresponding to the flushing nozzle unit 1 as described above, is shown enlarged, for example, in part A of FIG. 2, and includes a base 103, which is provided on the base 103 and has a gas inflow port 104 through which a predetermined gas flows. A check valve 105, a valve chamber 106 accommodated in such a way that the check valve 105 can move, pushes the check valve 105 to a compression spring 107 on the gas inflow port 104 side, a communication port 108, and supports the compression spring 107 The supporting plate 109, the filter 110 and so on. The port 101 configured in this way is an existing configuration, so detailed description is omitted. The conventional general state of introducing the flushing gas into the inside of the FOUP 100 through the existing port 101 is as follows. That is, the flushing gas of the predetermined gas flows into the gas inflow port 104 , and the compression spring 107 is compressed by the pressure according to the flow rate of the flushing gas, so that a gap is generated between the check valve 105 and the base 103 . Thereby, the flushed gas passes through the valve chamber 106 and the communication port 108 from the gap, passes through the filter 110 , and is introduced into the FOUP 100 .

Next, the opening and closing mechanism of the present invention is constituted by the gas inflow port 104, the check valve 105, and the compression spring 107 constituting the above-mentioned port 101.

As shown in FIGS. 3 to 9 , each flushing nozzle unit 1 includes a nozzle 2 as a nozzle structure, a casing 3 as a casing structure for holding the nozzle 2 in a liftable state, and a casing for the casing. 3. To operate the nozzle 2, the compressed air is injected into the gas introduction part 4 for discharge. In addition, in this specification, the gas introduction part 4 is shown schematically.

Here, the flushing nozzle unit 1 as a gas supply device according to the present embodiment is characterized by having a casing 3 that allows the gas to pass through when a predetermined gas is supplied to the inside of the FOUP 100 , and a surface provided on the FOUP 100 . And contact the nozzle 2 of the first nozzle 21 as the nozzle part and the second nozzle 22 as the pressing part for opening and closing the opening and closing mechanism in the vicinity of the port 101 with the opening and closing mechanism; Nozzle 2. To make the nozzle 2 operate between the use posture in which the specified gas can be supplied into the target container through the port 101 and the standby posture in which the specified gas cannot be supplied into the target container through the port 101. space 5. In addition, the flushing nozzle unit 1 according to the present embodiment further includes a gas introduction part 4 for controlling the operation of the nozzle 2 by injecting compressed air for discharging the control gas into the operation adjustment space 5 .

Hereinafter, each constituent element of the flushing nozzle unit 1 as a gas supply device will be described.

The casing 3 is for allowing the gas to pass through by replacing the inside of the FOUP 100 of the target container with a predetermined gas. The casing 3 has a casing body 31 in the shape of a roughly rectangular parallelepiped, a pair of outer rings 32 arranged on the inner wall 35 of the casing body 31 and spliced with the outer peripheral surface of the nozzle 2 , and a pair of outer rings 32 formed from the outer wall 34 of the casing body 31 . The introduction port 33 communicates with the nozzle 2 and is used to introduce the compressed air to the nozzle 2 side. Specifically, the introduction port 33 penetrates from the outer wall 34 to the inner wall 35 of the casing body 31 , and communicates with the movement adjustment space 5 formed between the casing 3 and the nozzle 2 .

The nozzle 2 has a first nozzle 21 for preventing the gas in the FOUP 100 from flowing out by being closely attached to the outer edge 102 of the port 101 provided on one side of the target container, and a pressing surface having the pressing port 101 and the second nozzle 22 of the injection part of the injection part that injects the specified gas into the target container. The first nozzle 21 has a contact surface 23 that can be closely attached to the outer edge 102 of the port 101 , and an inner ring 24 of a gasket for supporting the second nozzle 22 without clearance. The second nozzle 22 has a gas introduction port 25 for introducing a predetermined gas, and guides a gas that penetrates in the height direction in order to guide the predetermined gas introduced from the gas introduction port 25, that is, nitrogen gas, at the axial center portion. The channel 26 is formed from the pressing surface 27 toward the proximal end side of the push surface 27 of the check valve 105 ( FIG. 2 ) that presses to open the port 101 of the target container at the tip end in contact with the port 101 of the target container. A slit-shaped gas injection port 28 for introducing nitrogen gas into the FOUP 100 . Therefore, in this embodiment, the second flow path 25a of the flushing gas that guides the predetermined gas in the horizontal direction from the gas introduction port 25 is continuous with the second flow path 25a and the flushing gas is guided in the vertical direction. The first flow path 26a for gas is integrally formed in a state where the relative position is fixed. However, the present invention does not prevent the aspect in which the relative positions of the first and second flow paths 26a and 25a can be changed.

The movement adjustment space 5 is provided between the casing 3 and the first nozzle 21 and has a close contact posture ( P1 ) in which the first nozzle 21 is in close contact with the outer edge 102 of the port 101 , and a contact posture ( P1 ) from the close contact posture ( P1 ) The first movement adjustment space 51 for expanding and contracting the movement of the first nozzle 21 between the separation posture (P2) in which the first nozzle 21 is separated from the port 101, and the first movement adjustment space 51 provided between the first nozzle 21 and the second nozzle 22, The second nozzle 22 is to be in the closed position (Q2) in which the port 101 is closed by leaving the port 101 (specifically, the check valve 105 ) and the port 101 by pressing the port 101 (specifically, the check valve 105 ). The second movement adjustment space 52 that expands and contracts between the open open postures (Q1) and the communication path 53 that communicates with the first movement adjustment space 51 and the second movement adjustment space 52.

The first movement adjustment space 51 is in a separated posture (P2) in which the contact surface 23 of the first nozzle 21 is separated from the outer edge 102 of the port 101 after the introduction of the gas, that is, compressed air, from the introduction port 33 of the casing 3. A space for changing the posture of the sticking posture (P1) that is stuck to the outer edge 102 of the port 101.

The second movement adjustment space 52 is for supplying compressed air through the communication passage 53 after the gas is introduced into the first movement adjustment space 51 and the first nozzle 21 is brought into the close contact position (P1), and the second nozzle 22 From the closed position (Q2) in which the port 101 is closed by leaving the port 101 (specifically, the check valve 105), to the open position in which the port 101 is opened by pressing the port 101 (specifically, the check valve 105) (Q1) Space for changing posture.

The communication passage 53 is formed so as to bring the first nozzle 21 into a close contact posture by supplying the control gas to the first operation adjustment space 51 and introducing compressed air, which is gas, into the first and second operation adjustment spaces 51 and 52 (P1). Then, the second nozzle 22 is moved to the open position (Q1), and the compressed air of the control gas in the first and second operation adjustment spaces 51 and 52 is sucked to form the second nozzle 22 into the closed position (Q2) and The first nozzle 21 has a configuration in a separated posture (P2). The communication passages 53 are shown by dotted lines in FIGS. 4 , 5 , 7 , and 9 , and one or a plurality of the communication passages 53 are provided in the circumferential direction of the first and second nozzles 22 . Then, the communication passage 53 is set so that the first nozzle 21 can be changed to the close contact position ( P1 ) in the first movement adjustment space 51 when the compressed air is introduced by adjusting the length, position, and number of the communication passage 53 . After the posture, compressed air is introduced into the second movement adjustment space 52 to change the posture of the second nozzle 22 to the open posture (Q1).

The gas introduction part 4 is for controlling the operation of the first nozzle 21 and the second nozzle 22 by injecting and discharging compressed air, which is an example of a gas other than nitrogen gas, into the first operation adjustment space 51 and the second operation adjustment space 52 part. The gas introduction part 4 injects and discharges the control gas into the first operation adjustment space 51 , and the second operation adjustment can also be expanded or contracted through the communication passage 53 connecting the first operation adjustment space 51 and the second operation adjustment space 52 . Space 52.

In this embodiment, compressed air can be introduced into the movement adjustment space 5 from the standby position shown in FIGS. 3 to 5 , that is, the first nozzle 21 is in the open position ( P2 ) and the second nozzle 22 is closed. In the state of the posture (Q2), as shown in FIGS. 6 and 7, the second nozzle 22 is in the closed position (Q2) while the first nozzle 21 is in the close contact posture (P1) and is closely attached to the outer edge 102 of the port 101. The outer edge 102 attached to the port 101 is also in a state where the port 101 is not opened, and is then controlled to the use position as shown in FIG. 8 and FIG. The pressing surface 27 pushes the port 101 (specifically, the check valve 105 ) up to open the port 101 in an open posture (Q1).

In addition, as a matter of course, if the compressed air is sucked through the control gas introduction part 4 from the state (P1, Q1) shown in FIGS. 8 and 9, the state (P1, Q2) shown in the above-mentioned FIG. 6 and FIG. It will return to the state shown in Figure 3 to Figure 5 (P2, Q2). That is, according to the present embodiment, by injecting and discharging compressed air other than nitrogen gas as a predetermined gas from the gas introduction part 4, each of the first nozzle 21 and the second nozzle 22 constituting the nozzle 2 can be smoothly and appropriately performed. The up-and-down movement.

The flushing nozzle unit 1 of the present embodiment described in detail above is installed at a plurality of designated places on the mounting table B of the loading port X in a unitized state (in the vicinity of the four corners of the mounting table B in this embodiment) , the function as a flushing device P that can replace the gas atmosphere in the FOUP 100 placed on the mounting table B with flushing gas can be realized.

Moreover, as a modification of this embodiment, the flushing nozzle unit 1 as a gas introduction means shown in FIG. 10 can be mentioned. In this modification, the same reference numerals are attached to the constituent elements corresponding to the above-described embodiment, and detailed descriptions thereof are omitted.

Specifically, the flushing nozzle unit 1 of this modification is different from the shape of the second nozzle 22 described above. The second nozzle 22 is provided with an opening 29 at a position separated from the pressing surface 27 , and the opening 29 corresponds to the gas injection port 28 . Even with such a nozzle, the same effect as the above-mentioned embodiment can be exhibited.

As described above, the gas supply device according to the present embodiment is characterized by including the casing 3 through which the predetermined gas is allowed to pass by replacing the inside of the target container with the gas, and the port 101 provided in close contact with one surface of the target container. The nozzle 2 whose port 101 will be opened by pressing it nearby, is set to extend to the casing 3 and the nozzle 2, and the nozzle 2 can supply the specified gas into the target container through the port 101. The motion adjustment space 5 that operates to expand and contract between the standby positions for supplying the specified gas into the target container, and the gas introduction portion 4 that controls the operation of the nozzle 2 by injecting and discharging air into the motion adjustment space 5 .

With this configuration, the predetermined gas can be appropriately introduced into the FOUP 100 as the target container in order to operate the nozzle 2 without depending on the pressure of the specified gas to be supplied into the target container. In addition, the nozzle 2 not only opens the port 101, but also effectively avoids leakage of the specified gas to the outside by being closely attached to the vicinity of the port 101, so that the specified gas can be efficiently introduced into the target container. As a result, according to the present embodiment, it is possible to provide the flushing nozzle unit 1 capable of supplying the inside of the target container to the specified gas with higher efficiency, and the flushing device P and the loading port X provided with the flushing nozzle unit 1 , and a semiconductor manufacturing apparatus M having the loading port X.

In the present embodiment, which is a specific structure that can efficiently replace the inside of the target container with a predetermined gas, the nozzle 2 is configured to have an outer edge through a port 101 provided in close contact with one surface of the target container. 102 to prevent the gas in the target container from flowing out to the outside, the first nozzle 21 serving as a nozzle part, and the second nozzle 21 serving as a pressing part having a pressing surface 27 having a pressing port 101 and a spraying part for spraying gas into the target container. Two nozzles 22 .

In addition, in the present embodiment, which is an example of the configuration of the operation adjustment space 5 for efficiently replacing the gas in the target container with the specified gas, the operation adjustment space 5 is applicable to the configuration having the following: Between the nozzles 21 and in the close contact posture ( P1 ) in which the first nozzle 21 is in close contact with the outer edge 102 of the port 101 , and the separation posture ( P2 ) in which the first nozzle 21 is separated from the port 101 from the close contact posture ( P1 ) ) between the first movement adjustment space 51 to make the first nozzle 21 move to expand and contract, and the first movement adjustment space 51 provided between the first nozzle 21 and the second nozzle 22 to allow the second nozzle 22 to move away from the port 101 The second movement adjustment space 52 for expanding and contracting the movement between the closed posture ( Q2 ) in which the port 101 is closed and the open posture ( Q1 ) in which the port 101 is opened by pressing the port 101 .

Next, regarding the control method of the flushing nozzle unit 1 of the present embodiment, the present embodiment, which is a specific configuration for replacing the gas in the FOUP 100 with the specified gas more efficiently, has: Between the casing 3 and the first nozzle 21 and in the close contact position ( P1 ) in which the first nozzle 21 is in close contact with the outer edge 102 of the port 101 and the first nozzle 21 is separated from the port 101 from the close contact position ( P1 ) The first movement adjustment space 51 for expanding and contracting the first nozzle 21 between the separated postures (P2), and the first movement adjustment space 51 provided between the first nozzle 21 and the second nozzle 22 so that the second nozzle 22 can be The flushing nozzle unit of the flushing nozzle unit of the space 52 for the second movement to expand and contract between the closed posture (Q2) in which the port 101 is closed by leaving the port 101 and the open posture (Q1) in which the port 101 is opened by pressing the port 101 1. The applicable control method is characterized by using the gas introduction part 4 to inject and discharge compressed air into the first operation adjustment space 51 and the second operation adjustment space 52.

Furthermore, in order to control the operations of the first nozzle 21 and the second nozzle 22 with a simpler structure, in this embodiment, the control gas introduction device is designed to inject and discharge the control gas into the first operation adjustment space 51 . ; By further providing a communication path 53 that communicates with the first movement adjustment space 51 and the second movement adjustment space 52, the second movement adjustment space 52 can also be expanded and contracted.

Next, in order to control the operations of the first nozzle 21 and the second nozzle 22 more effectively, in the present embodiment, the communication path 53 is formed so as to make the first nozzle 21 operate so as to closely adhere to the outer edge 102 of the port 101. A configuration in which the second nozzle 22 is moved to the open posture (Q1) after the sticking posture (P1).

In addition, the semiconductor manufacturing apparatus M of the present embodiment is characterized in that the FOUP 100 which is disposed adjacent to the load port X and receives the conveyed cleaning object container, and the wafer W contained in the FOUP 100 is placed in the FOUP 100 with the FOUP 100. The inside of the FOUP 100 is taken in and out through the carry-out and carry-out port 111 formed on the front surface of the FOUP 100 .

The embodiments of the present invention have been described above, but the present invention is not limited to the configurations of the above embodiments. In the above-described embodiment, the gas introduction part 4 is shown in a state where compressed air, which is an example of a gas different from nitrogen gas, is injected and discharged into the first operation adjustment space 51 and the second operation adjustment space 52, and of course, as a control gas. Not limited to compressed air, nitrogen or other inert gas, or dry air can also be used.

In the above-mentioned embodiment, the movement adjustment space for the upward movement of the nozzle mechanism is formed by introducing the compressed air into the first movement adjustment space. The lowering adjusts the space with the motion. Similarly, not only the movement adjustment space for raising, but also the movement adjustment space for lowering may be provided for the second movement adjustment space. In addition, it is also possible to form any movement adjustment space for ascending and descending by combining with elastic urging such as a spring.

Therefore, in the above-described embodiment, the second nozzle 22 serving as the pressing portion constituting the first flow path (26a) is used to open the port 101 that is the valve, but other than the member forming the first flow path (26a), the A pushing portion of the opening port 101 may be provided. In addition, in the above-described embodiment, the member forming the second flow path 25a is adapted to move relatively with respect to the casing 3, but the second flow path may be fixed to the casing and relatively movable with respect to the first flow path. constitute.

In addition, for example, in the above-described embodiment, the operation adjustment spaces 51 and 52 and the ventilation holes are formed in a one-to-one relationship, but it is also possible to form a plurality of ventilation holes that communicate with one operation adjustment space. constitute. In addition, in the above-mentioned embodiment, the mode of controlling the nozzle 2 only by the control compressed air of the gas introduction part 4 is disclosed, but the mode that the nozzle can be operated by elastically pushing the nozzle is not denied.

Other configurations can be variously changed without departing from the gist of the present invention.

1‧‧‧Gas supply device (purge nozzle unit) 2‧‧‧Nozzle structure part (nozzle) 21‧‧‧Nozzle part (first nozzle) 22‧‧‧Pushing part (second nozzle) 3‧‧‧Shell structure part (casing) 4‧‧‧Gas introduction part 5‧‧‧Operation adjustment space 51‧‧‧First operation adjustment space 52‧‧‧Second operation adjustment space 53‧‧‧Communication path X‧ ‧‧Loading Port P‧‧‧Flushing Device 100‧‧‧Object Container (FOUP)

FIG. 1 is an external view of an embodiment of the present invention. Fig. 2 is a side sectional view of the mode of the same embodiment. Figure 3 is an external view of an important part of the same embodiment. FIG. 4 is a cross-sectional view of the pattern of FIG. 3. FIG. Fig. 5 is a side sectional view of the center of Fig. 3 . Fig. 6 is an explanatory diagram of the operation of Fig. 3 . Fig. 7 is an explanatory diagram of the operation of Fig. 5 . Fig. 8 is an explanatory diagram of the operation of Fig. 3 . Fig. 9 is an explanatory diagram of the operation of Fig. 5 . Fig. 10 is an external view corresponding to Fig. 8 concerning a modification of the same embodiment. Fig. 11 is a schematic plan view of the semiconductor manufacturing apparatus of the embodiment.

1‧‧‧Gas supply device (purge nozzle unit)

2‧‧‧Nozzle structure (nozzle)

3‧‧‧Shell Structure (Shell)

4‧‧‧Gas inlet

21‧‧‧Nozzle (First Nozzle)

22‧‧‧Pushing part (second nozzle)

23‧‧‧contact surface

26‧‧‧Gas guide

27‧‧‧Pushing surface

28‧‧‧Gas injection port

31‧‧‧Enclosure body

33‧‧‧Inlet port

34‧‧‧External Wall

P1‧‧‧Close Posture

Q1‧‧‧Open posture

Claims (8)

A gas supply device, comprising: a casing structure part through which a predetermined gas is supplied into a target container to allow the gas to pass; and a nozzle provided on one surface of the target container and in contact with a port having an opening and closing mechanism inside part, a nozzle structure part of a pressing part that is provided in the nozzle part so as to be able to be raised and lowered, and is pressed and opened by the opening and closing mechanism; the nozzle part is used to supply the specified gas into the target container through the port part. The movement adjustment space in which the movement between the posture and the standby posture in which the specified gas cannot be supplied into the target container through the port portion cannot be expanded or contracted. The gas supply device according to claim 1, wherein the nozzle portion is closely attached to the outer edge of the port portion provided on one side of the target container to prevent the gas in the target container from flowing out to the outside; The said pressing part has a pressing surface which presses the said opening and closing mechanism, and the injection part which injects the said predetermined gas into the said object container. The gas supply device according to claim 2, wherein the operation adjustment space is provided between the housing structure portion and the nozzle portion and is configured to allow the nozzle The first movement adjustment space for expanding and contracting the movement of the nozzle portion between the close contact posture in which the mouth portion is closely attached to the outer edge of the port portion and the separation posture in which the nozzle portion is separated from the port portion from the close contact posture ; and being provided between the nozzle portion and the pressing portion, the pressing portion is to be in a closed posture in which the port portion is closed by moving away from the port portion, and the port portion is opened by pressing the port portion. The second action to adjust the space for expansion and contraction between the open postures. A control method of a gas supply device, comprising: a casing structure part through which a predetermined gas is allowed to pass by replacing the inside of a target container with a predetermined gas; A nozzle portion for preventing the gas in the target container from flowing out to the outside has a pressing surface for pressing the port portion and a pressing portion for a spray portion for spraying the specified gas into the target container, and is provided on the housing structure portion and the The nozzle parts are operated between the nozzle parts and between the close contact posture in which the nozzle part is brought into close contact with the outer edge of the port part and the separation posture in which the nozzle part and the port part are separated from the close contact posture. The first movement adjustment space for expanding and contracting is provided between the nozzle portion and the pressing portion, and the pressing portion is to be in a closed posture in which the port portion is closed by moving away from the port portion, and the pressing portion is pressed. A control method of a gas supply device for a second action adjusting space in which the port portion is pressed to open the port portion to move between the opening positions to expand and contract, which is characterized by: The operation of the nozzle part and the pressing part is controlled by injecting and discharging the control gas into the first operation adjustment space and the second operation adjustment space. The control method of the gas supply device according to the claim 4 of the scope of application, wherein the gas for control is directly injected and discharged into the first operation adjustment space; by further comprising the communication between the first operation adjustment space and the first operation adjustment space The communication path between the two movement adjustment spaces can expand and contract the second movement adjustment space. The control method of a gas supply device according to claim 5, wherein the communication path is formed so that the pressing portion is moved after the nozzle portion is moved into the close contact posture in which it is in close contact with the outer edge of the port portion. The composition of the movement to the above-mentioned open posture. A loading port comprising a plurality of gas supply devices according to any one of claims 1 to 3 of the scope of application, wherein a plurality of the gas supply devices are provided to communicate the pressing portion of the gas supply device to the bottom surface of the target container In the state of the port, the gas atmosphere in the target container can be replaced with nitrogen or dry air. A semiconductor manufacturing apparatus, characterized by comprising: a loading port as described in item 7 of the scope of application, a semiconductor manufacturing apparatus body, a transfer chamber disposed between the loading port and the semiconductor manufacturing apparatus body; A container for taking out and inserting the wafers accommodated in the target container through an unloading and carrying port formed on the front surface of the target container.

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