TWI327986B - Substrate absorption device - Google Patents

Substrate absorption device Download PDF

Info

Publication number
TWI327986B
TWI327986B TW093111648A TW93111648A TWI327986B TW I327986 B TWI327986 B TW I327986B TW 093111648 A TW093111648 A TW 093111648A TW 93111648 A TW93111648 A TW 93111648A TW I327986 B TWI327986 B TW I327986B
Authority
TW
Taiwan
Prior art keywords
adsorption
substrate
pad
suction
contact
Prior art date
Application number
TW093111648A
Other languages
Chinese (zh)
Other versions
TW200508125A (en
Inventor
Hayashi Takato
Hirado Koji
Kinoshita Hitoshi
Jogasaki Shuya
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW200508125A publication Critical patent/TW200508125A/en
Application granted granted Critical
Publication of TWI327986B publication Critical patent/TWI327986B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • B65G2249/045Details of suction cups suction cups

Description

1327986 五、發明說明(1) 【發明所屬之技術領域】 本發明係關於吸附支撐使用於平板顯示(flat panel display)(以下簡稱為FPD)之玻璃基板或半導體晶片等 薄板基板之基板吸附裝置。 【先前技術】 吸附支撐大型薄板狀玻璃基板時,即使玻璃基板翻過 來、或彎曲,都必須要確實地吸附。因此,吸附部必須模 仿玻璃基板的翻轉、彎曲而有高度的活動空間。特開平 1 0-8 6086號公報刊載之吸附裝置上,於吸附墊與壓框體之 間留有間隙。藉此間隙,能使吸附墊傾斜。當吸附墊的傾 斜度增大時’藉由吸附墊與壓框體之間的縫隙吸附玻璃基 板時,將會出現水平移動。吸附墊一旦水平移動,玻璃基 板的位置就移動。因此,無法高精密地決定玻璃基板位置 的同時,搬送中的玻璃基板將會搖晃且無法穩定的搬送。 為了能夠高精密地決定玻璃基板的位置、使玻璃基板在搬 送中不會搖晃,當吸附具與收納孔之間的縫隙變小,即可 限制吸附具往傾斜方向移動。因此,吸附墊很難模倣玻璃 基板的翻轉、彎曲等。 【發明内容】 依本發明主要觀點’係指提供具備有中空狀且先端部 有開口部的護殼(housing)、與設於護殼中空狀内且設有 吸取空氣之空氣吸取通路之吸附墊支撐部材、與突出護殼1327986 V. Technical Field of the Invention The present invention relates to a substrate adsorption device for adsorbing and supporting a thin plate substrate such as a glass substrate or a semiconductor wafer which is used for a flat panel display (hereinafter abbreviated as FPD). [Prior Art] When adsorbing and supporting a large-sized thin glass substrate, even if the glass substrate is turned over or bent, it must be reliably adsorbed. Therefore, the adsorption portion must simulate the inversion and bending of the glass substrate to have a high movable space. In the adsorption device disclosed in Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. With this gap, the adsorption pad can be tilted. When the inclination of the adsorption pad is increased, the horizontal movement will occur when the glass substrate is adsorbed by the gap between the adsorption pad and the pressure frame. Once the pad moves horizontally, the position of the glass substrate moves. Therefore, the position of the glass substrate cannot be determined with high precision, and the glass substrate during transportation is shaken and cannot be stably transported. In order to accurately determine the position of the glass substrate and prevent the glass substrate from being shaken during transportation, the gap between the suction tool and the housing hole is reduced, so that the movement of the suction tool in the oblique direction can be restricted. Therefore, it is difficult for the adsorption pad to mimic the inversion, bending, and the like of the glass substrate. SUMMARY OF THE INVENTION According to the present invention, the main point of view of the present invention is to provide a housing having a hollow and open-ended opening, and an adsorption pad provided in the hollow of the casing and provided with an air suction passage for sucking air. Support member, and protruding cover

1327986 五、發明說明(2) 開口部的狀態下載置於吸附墊支撐部材並至少於3點接觸 護殼開口部頭部可移動且設有與空氣吸取通路氣密連通的 空氣吸取孔之吸附墊、與將吸附墊固定於護殼開口部的吸 附墊支撐手段等基板吸附裝置。 【實施方式】 以下,就有關本發明第一實施形態,參照圖示進行說 明。 圖一為基板吸附裝置E1的構造圖。護殼(housing)l為 金屬中空狀的圓筒狀,其内部由中空部2所形成。該護殼 (housing)l的先端側上由一具有圓形端部1 a的開口部1 b戶斤 形成。該護殼(housing) 1另一端底部開口部内壁上,設有 螺絲部1 c。該護殼1底部安裝於設置在基板吸附裝置E 1用 安裝台3之組件本體4上。 組件本體4,由外徑與護殼1内徑大略一致且内部設有 空氣引導通路5之中空形狀所形成。該組件本體_4的外圍表 面上,設有螺絲部4a。如此一來,護殼1即可藉由螺絲部 1 c與螺絲部4 a鎖緊而安裝於組件本體4上,並可拆卸。組 件本體4下部設有安裝於基板吸附裝置E 1用安裝台3且突出 的螺絲部4b。該組件本體4,藉由將螺絲部4M緊於吸附 裝置E1用安裝台3的螺絲上而安裝於安裝台3上,並可拆 卸。 在該組件本體4的中空形狀内部,設有螺絲部4c。另 外,組件本體4的外圍表面上,設有螺絲部4d。該螺絲部1327986 V. INSTRUCTIONS (2) The state of the opening portion is downloaded from the adsorption pad of the air suction hole which is placed on the adsorption pad supporting member and is movable at least at the point of contact with the opening of the casing at least at 3 o'clock and provided with the air suction passage in airtight communication. And a substrate adsorption device such as a suction pad supporting means for fixing the adsorption pad to the opening of the sheath. [Embodiment] Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a structural view of the substrate adsorption device E1. The housing 1 is a hollow cylindrical shape of metal, and the inside thereof is formed by the hollow portion 2. The front end side of the housing 1 is formed by an opening portion 1b having a circular end portion 1a. The housing 1 is provided with a screw portion 1c on the inner wall of the bottom opening portion at the other end. The bottom of the casing 1 is attached to the module body 4 provided on the mounting table 3 for the substrate adsorption device E1. The module body 4 is formed by a hollow shape in which the outer diameter is substantially coincident with the inner diameter of the casing 1 and the air guiding passage 5 is provided inside. A screw portion 4a is provided on the outer surface of the unit body_4. In this way, the casing 1 can be attached to the assembly body 4 by the screw portion 1c and the screw portion 4a, and can be detached. The lower portion of the component body 4 is provided with a screw portion 4b which is attached to the mounting table 3 for the substrate suction device E1 and protrudes. The assembly main body 4 is attached to the mounting table 3 by tightening the screw portion 4M to the screw of the mounting table 3 of the suction device E1, and is detachable. Inside the hollow shape of the module body 4, a screw portion 4c is provided. Further, on the outer peripheral surface of the module body 4, a screw portion 4d is provided. The screw part

1327986 五、發明說明(3) 4d,與螺帽6緊緊鎖住。該螺帽6,藉由鎖緊於螺絲部4d 上,固定護殼1在組件本體4的安裝位置。 護殼1下部内壁面周圍方向,設有溝7。該溝7的位置 係與組件本體3的先端部相對應。該溝7内與組件本體3先 端部之間,挾著防止空氣洩漏用的0形環8。 護殼1的中空部2内且在組件本件3先端部上,設有摺 動部材9。該摺動部材9,可於護殼1中空部2内沿著中空部 2的方向摺動。該摺動部材9係由厚圓筒部1 0與薄圓筒部1 1 形成一體。1327986 V. Inventive Note (3) 4d, tightly locked with the nut 6. The nut 6 is fixed to the mounting position of the assembly body 4 by being locked to the screw portion 4d. A groove 7 is provided in the direction around the inner wall surface of the lower portion of the casing 1. The position of the groove 7 corresponds to the tip end portion of the module body 3. An O-ring 8 for preventing air leakage is interposed between the inside of the groove 7 and the leading end of the module body 3. Inside the hollow portion 2 of the casing 1 and on the tip end portion of the assembly member 3, a folding member 9 is provided. The folding member 9 can be folded in the direction of the hollow portion 2 in the hollow portion 2 of the casing 1. The folding member 9 is integrally formed of a thick cylindrical portion 10 and a thin cylindrical portion 1 1 .

厚圓筒部1 0,其直徑與護殼1中空部2内徑大略一致, 外圍表面與護殼1中空部2内面緊密貼合。厚圓筒部1 0外圍 表面上,設有溝1 2,該溝1 2内設有V形墊1 3。該V形墊1 3, 從組件本體4之空氣引導通路5行經真空引導時,V字形是 開啟的,為防止護殼1中空部2與摺動部材9之間的氣漏而 保持氣密狀態。 薄圓筒部1 1,其直徑與組件本體4之空氣引導通路5内 徑大略一致,外圍表面與組件本體4的空氣引導通路5内緊 密貼合。該薄圓筒部11,可自由插脫於空氣引導通路5 内。The thick cylindrical portion 10 has a diameter that substantially coincides with the inner diameter of the hollow portion 2 of the casing 1, and the outer peripheral surface is in close contact with the inner surface of the hollow portion 2 of the casing 1. A groove 1 2 is provided on the outer peripheral surface of the thick cylindrical portion 10, and a V-shaped pad 13 is provided in the groove 12. When the V-shaped pad 13 is vacuum guided from the air guiding passage 5 of the module body 4, the V-shape is opened, and the airtight state is maintained to prevent air leakage between the hollow portion 2 of the casing 1 and the folding member 9. . The thin cylindrical portion 1 1 has a diameter substantially identical to the inner diameter of the air guiding passage 5 of the module body 4, and the peripheral surface is tightly fitted to the air guiding passage 5 of the module body 4. The thin cylindrical portion 11 is freely detachable from the air guiding passage 5.

厚圓筒部1 0與薄圓筒部11内部,設有空氣引導通路 14。該空氣引導通路14,與組件本體4的空氣引導通路5是 相連通的。 摺動部材9上部,設有吸附墊固定部材軟管部材1 5。 該軟管部材1 5,為彈性部材形成的圓筒狀,且上部相對於An air guiding passage 14 is provided inside the thick cylindrical portion 10 and the thin cylindrical portion 11. The air guiding passage 14 is in communication with the air guiding passage 5 of the module body 4. An upper portion of the folding member 9 is provided with a suction pad fixing member hose member 15 . The hose member 15 is a cylindrical shape formed of an elastic member, and the upper portion is opposite to the upper portion

第8頁 1327986 五、發明說明(4) 吸附墊16的位置上有一蛇腹狀的屈曲部17。該軟管部材 1 5,藉由螺絲部1 8的鎖緊安裝而與摺動部材9相對。該軟 管部材1 5内部,由空氣引導通路1 9所形成。該空氣引導通 路1 9,與摺動部材9的空氣引導通路4呈氣密狀態相連通。 吸附墊1 6載置於軟管部材1 5上路。該吸附墊1 6,自護殼1 開口端1 a突出。該吸附墊1 6,由工程塑料等樹脂形成。該 吸附墊16,藉由載置於軟管部材15上而可在軟管部材15上 搖動頭部。該吸附墊16,由具有表面平面之吸附面16a、 與自該吸附部1 6 b内側表面垂下一體成形之曲面的接觸面 1 6c構成。該吸附部1 6b的中央部上設有空氣吸引孔1 6d。 吸附部1 6 b,其外徑與護殼1外徑一致。該吸附部1 6 b,當 吸附墊1 6下降至護殼1内時,内側表面外圍邊緣1 6 e將與護 殼1開口端1 a產生面接觸而停止下降。因此,護殼1開口端 1 a,除了可停止吸附墊1 6的下降之外,同時也是使吸墊16 吸附面1 6 a的傾斜維持水平的基準平面。 吸附部1 6 b,雖然與護殼1外徑大略一致即可,但如圖 二所示,從護殼1外圍表面向外延伸D之長度亦可。吸附部 1 6 b若是向外突出,則吸附面1 6 a的面積將會變大,此吸附 面1 6a的任何部分與玻璃基板接觸時,施力的作用點與吸 附部1 6 b中心位置P的距離將變長,因此,只需稍加用力, 吸附墊1 6就會在軟管部材1 5上搖動頭部。 接觸面部16c,為圓筒狀,其外圍表面上下方向的中 間部為擁有最大徑的半球面狀彎曲。該接觸面部1 6 c,其 最大外徑尺寸較護殼1中空部2 (開口端1 a)的内徑尺寸稍Page 8 1327986 V. DESCRIPTION OF THE INVENTION (4) The position of the adsorption pad 16 has a bellows-like buckling portion 17. The hose member 15 is opposed to the folding member 9 by the locking attachment of the screw portion 18. The inside of the hose member 15 is formed by an air guiding passage 19. The air guiding passage 19 communicates with the air guiding passage 4 of the folding member 9 in an airtight state. The adsorption pad 16 is placed on the hose member 15 on the road. The adsorption pad 16 6 protrudes from the open end 1 a of the sheath 1 . The adsorption pad 16 is formed of a resin such as an engineering plastic. The suction pad 16 can be rocked on the hose member 15 by being placed on the hose member 15. The adsorption pad 16 is composed of a suction surface 16a having a surface plane and a contact surface 16c having a curved surface integrally formed from the inner surface of the adsorption portion 16b. An air suction hole 16d is provided in a central portion of the adsorption portion 16b. The adsorption portion 16b has an outer diameter that coincides with the outer diameter of the sheath 1. The adsorption portion 16b, when the adsorption pad 16 is lowered into the casing 1, the outer peripheral edge 16e will be in surface contact with the open end 1a of the casing 1 to stop falling. Therefore, the open end 1 a of the casing 1 can be used as a reference plane for maintaining the inclination of the suction surface 16 a of the suction pad 16 in addition to the lowering of the suction pad 16 . The adsorption portion 16b may be substantially identical to the outer diameter of the sheath 1, but as shown in Fig. 2, the length D may extend outward from the peripheral surface of the sheath 1. If the adsorption portion 16 6 protrudes outward, the area of the adsorption surface 16 a will become large, and when any portion of the adsorption surface 16 6 is in contact with the glass substrate, the point of application of the force and the center position of the adsorption portion 16 b The distance of P will become longer, so that with a little effort, the suction pad 16 will shake the head on the hose member 15. The contact surface portion 16c has a cylindrical shape, and the intermediate portion in the up-and-down direction of the outer peripheral surface is a hemispherical curved shape having the largest diameter. The contact surface portion 16c has a maximum outer diameter smaller than the inner diameter of the hollow portion 2 (open end 1a) of the sheath 1

第9頁 1327986 五、發明說明(5) 小,可於護殼1開口部1 b内依上下方向移動。該接觸面部 1 6 c ’相對於護殼1中空部2内壁2 a,至少需要3點的點接觸 始能固定支撐住。接觸面部i 6c與護殼1中空部2内壁2a之 間的接觸,未必限於至少需要3點的點接觸’藉由吸附墊 1 6頭部的搖晃,使接觸面部1 6 c同一周方向的線上產生複 數的點接觸,或者在同周方向的線上產生線接觸。如此一 來,接觸面部1 6 c與護殼1中空部2内壁2 a之間的接觸而在 兩者之間產生的摩擦抵抗較小,且吸附墊1 6可順暢地搖動 頭部。 吸附墊1 6空氣吸引孔1 6 d内,設有環狀段差2 0。該段 差2 0上,設有圖三所示之第一固定板2卜該第一固定板21 為圓板狀’為使空氣流通,留有兩個小孔2 1 a、2 1 b。 摺動部材9空氣引導通路1 4内,設有環狀段差2 2。該 段差22上,設有形狀與第二固定板21相同的第二固定板 23° ‘這些第一固定板21與第二固定·板23之間,由細線24等 連結部材之線樣所連結。細線2 4係由抗張力且具有強力不 斷線強度的柔軟線材,例如尼龍樹脂所形成。該細線2 4 ’ 藉由軟管部材1 5使第一與第二固定板2 1、2 3的間隔維持一 定,而且藉由可解除吸附墊1 6的搖頭狀態恢復水平姿勢的 施力而賦予軟管部材1 5張力,使軟管部材1 5伸展開來。另 外’該細線2 4的張力能使軟管部材1 5的屈曲部1 7不會遠離 吸附部1 6 a,而且會隨著吸附部1 6 a的傾斜而產生搖頭動 作。該細線2 4的張力,可於第一與第二固定板2 1與2 3之間Page 9 1327986 V. Description of the invention (5) Small, it can move in the vertical direction in the opening 1 b of the casing 1 . The contact surface portion 1 6 c ' with respect to the inner wall 2 a of the hollow portion 2 of the sheath 1 requires at least 3 points of point contact to be fixedly supported. The contact between the contact face i 6c and the inner wall 2a of the hollow portion 2 of the casing 1 is not necessarily limited to a point contact requiring at least 3 points. The surface of the contact face portion 16c is in the same circumferential direction by the shaking of the head of the adsorption pad 16. Produce a complex number of point contacts, or create line contacts in the same circumferential direction. As a result, the contact between the contact face portion 16c and the inner wall 2a of the hollow portion 2 of the sheath 1 is less resistant to friction between the two, and the suction pad 16 can smoothly shake the head. The adsorption pad 16 has an annular step 20 in the air suction hole for 16 d. On the difference of 20, the first fixing plate 2 shown in Fig. 3 is provided, and the first fixing plate 21 is in the shape of a disk. For the air to flow, two small holes 2 1 a and 2 1 b are left. The folding member 9 is provided with an annular step 2 2 in the air guiding passage 14 . In the step 22, a second fixing plate 23' having the same shape as the second fixing plate 21 is provided. The first fixing plate 21 and the second fixing plate 23 are connected by a line connecting the members such as the thin wires 24. . The thin wire 24 is formed of a soft wire which is resistant to tension and has a strong unbroken strength, such as a nylon resin. The thin wire 2 4 ′ maintains the interval between the first and second fixing plates 2 1 and 2 3 by the hose member 15 , and is given by the urging force of the horizontal posture in which the shaking state of the suction pad 16 can be released. The hose member 15 tension causes the hose member 15 to extend. Further, the tension of the thin wire 24 can prevent the bent portion 17 of the hose member 15 from moving away from the adsorption portion 16a, and the shaking operation can be caused by the inclination of the adsorption portion 16a. The tension of the thin wire 24 can be between the first and second fixing plates 2 1 and 2 3

1327986 五、發明說明(6) 伸展時進行調整,例如將細線2 4綁於第一或第二固定板 21、2 3時可調整綁的緊度。第一固定板2卜第二固定板23 與細線2 4,構成吸附墊固定手段。 摺動部材9薄圓筒部1 1内的空氣引導通路1 4與組件本 體4的空氣引導通路5内部,設有彈性部材彈簧2 5。該彈簧 2 5,於護殼1中空部2内對吸附墊1 6、軟管部材1 5與摺動部 材9形成的一體,由摺動部材9向護殼1開口端1 a施力。該 彈簧2 5下側,則固定於彈簧調節部材2 6上。 彈簧調節部材2 6外圍表面上,設有螺絲部2 6 a。該簞 簧調節部材2 6,將螺絲部鎖緊於組件本體4的空氣引導通 路5的螺絲部4c上,内裝於空氣引導通路5中。該彈簀調節 部材26為環狀,其中空部設有空氣引會通路26b。該彈簧 調節部材26,可藉由螺絲部26a與螺絲部4c的鎖緊而產生 回轉使空引導通路5内上下移動,進而調整彈簧25的施 力。 護殼1中空部2内,設有吸附墊高度調整結構2 7。該吸 附墊高度調整結構2 7,擁有與形成於護殼1中空部2内之螺 絲部2 8鎖緊之調整用環狀部材2 9。該調整用環狀部材 2 9,,可藉由相對於螺絲部2 8的回轉而於護殼1中空部2内 上下移動。隨著該調整用環狀部材2 9的上下移動,吸附墊 1 6、軟管部材1 5與摺動部材9形成一體,並於護殼1中空部 2内上下移動。如此一來,可調整吸附墊1 6相對於護殼1開 口端1 a的高度位置。 其次,如上述構造之裝置E 1對玻璃基板S的吸附動1327986 V. INSTRUCTIONS (6) Adjustments are made during stretching, for example, when the thin wires 24 are attached to the first or second fixing plates 21, 2 3, the tightness of the binding can be adjusted. The first fixing plate 2 and the second fixing plate 23 and the thin wire 24 constitute a suction pad fixing means. The air guiding passage 14 in the thin cylindrical portion 1 1 of the folding member 9 and the air guiding passage 5 in the module body 4 are provided with an elastic member spring 25. The spring 25 is integrally formed with the suction pad 16 and the hose member 15 and the folding member 9 in the hollow portion 2 of the casing 1, and is biased by the folding member 9 toward the open end 1a of the casing 1. The lower side of the spring 25 is fixed to the spring regulating member 26. On the peripheral surface of the spring regulating member 26, a screw portion 26a is provided. The spring adjusting member 26, the screw portion is locked to the screw portion 4c of the air guiding passage 5 of the module body 4, and is housed in the air guiding passage 5. The magazine adjusting member 26 has an annular shape, and the hollow portion is provided with an air guiding passage 26b. The spring adjusting member 26 can be rotated by the locking of the screw portion 26a and the screw portion 4c to move the inside of the empty guide passage 5 up and down, thereby adjusting the biasing force of the spring 25. In the hollow portion 2 of the casing 1, a suction pad height adjusting structure 27 is provided. The suction pad height adjusting structure 27 has an adjustment annular member 29 that is locked to the screw portion 28 formed in the hollow portion 2 of the casing 1. The adjustment annular member 209 can be moved up and down in the hollow portion 2 of the casing 1 by the rotation of the screw portion 28. As the adjustment annular member 29 moves up and down, the suction pad 16 and the hose member 15 are integrally formed with the folding member 9, and are moved up and down in the hollow portion 2 of the casing 1. In this way, the height position of the adsorption pad 16 relative to the open end 1 a of the casing 1 can be adjusted. Next, the adsorption of the glass substrate S by the device E 1 constructed as described above

第11頁 1327986 五、發明說明(7) 作,將參照圖四A〜圖四C所示加以說明。 當玻璃基板货皮搬送到基板吸附裝置jg 1上時,該基板吸附 裝置E1’將藉由昇降結構而上昇。玻璃基板s,會因翻轉 或彎曲而傾斜。藉由基板吸附裝置的上昇,吸附墊丨6吸附 面16a的一部分,如圖四蟖示,將與產生翻轉或彎曲的玻 璃基板40内側表面相接。 吸附墊16,載置於軟管部材15上’且藉由細線24而被 拉往護殼1下方側。如此一來’吸附墊1 6將會在軟管部材 1 5上搖動頭部’且除非施以外力否則將不會有搖動頭部的 動作而恢復原來的姿勢’也就是說,對吸附墊丨6a^以恢 復水平方向姿勢的力量。 因此,吸附墊1 6 ’只要從玻璃基板s下方稍加施力, 即可接觸到玻璃基板S的内側表面,所以,如圖四b所示, 形成模倣玻璃基板S翻轉、彎曲傾斜的模樣而呈現搖頭狀 態。也就是’由於吸附墊1 6將接觸面部1 6 c插入護殼i開口 部1 b的同時也搖頭,所以·,吸附部1 6b内側表面外圍邊緣. 1 6 e最大可傾斜至與護均1端部1 a相接觸的搖頭角度。 吸附墊1 6 ’由於接觸面部1 6 c與護殼1開口部1 b内壁至 少有3處的點接觸,同時產生搖頭動作,所以,接觸面部 1 6c與護殼1開口部1 b内壁之間的摩擦抵抗較小。結果,即 使玻璃基板S的翻轉、彎曲較大,吸附塾1 6的吸附面1 6 A, 也一樣能模傲玻璃基板S的翻轉、彎曲而傾斜,並與玻璃 基板S的内側表面緊密貼合。 吸附部1 6a的外徑,與護殼1的外徑一致,所以,玻璃Page 11 1327986 V. Description of the Invention (7) The description will be made with reference to Figs. 4A to 4C. When the glass substrate skin is transported to the substrate adsorbing device jg 1, the substrate adsorbing device E1' will rise by the lifting structure. The glass substrate s is tilted by turning or bending. By the rise of the substrate adsorbing means, a part of the adsorption pad 16a of the adsorption pad 16a, as shown in Fig. 4, is brought into contact with the inner surface of the glass substrate 40 which is inverted or bent. The adsorption pad 16 is placed on the hose member 15 and pulled to the lower side of the casing 1 by the thin wire 24. In this way, the 'adsorption pad 16 will shake the head on the hose part 15' and will not return to the original position unless the external force is applied. That is, the suction pad 丨6a^ to restore the strength of the horizontal position. Therefore, the adsorption pad 16 6 can be brought into contact with the inner surface of the glass substrate S by applying a slight force from below the glass substrate s. Therefore, as shown in FIG. 4b, a pattern in which the glass substrate S is reversed and curved is formed. Presenting a state of shaking head. That is, because the adsorption pad 16 inserts the contact surface portion 16c into the opening portion 1b of the casing i, it also shakes the head, so that the outer edge of the inner surface of the adsorption portion 16b. 1 6 e can be tilted to the maximum of 1 The angle of the head that contacts the end 1 a. The adsorption pad 16 6 ' is in contact with at least three points on the inner wall of the opening portion 1 b of the casing 1 due to the contact surface portion 1 6 c, and at the same time, a shaking action is generated, so that between the contact face portion 16c and the inner wall of the opening portion 1 b of the casing 1 The friction resistance is small. As a result, even if the glass substrate S is turned upside down and bent, the adsorption surface 16 6 A of the adsorption crucible 16 can be tilted and bent obliquely, and closely adheres to the inner surface of the glass substrate S. . The outer diameter of the adsorption portion 16a is the same as the outer diameter of the sheath 1, so the glass

1327986 五、發明說明(8) 基板S於接觸吸附部1 6a外圍邊緣時,施力的作用點與 ::位置之間的距離會拉長。因此,藉由與玻璃基 觸力將會透:二附作部…外圍邊緣稍加施以接觸力,該土接 力。 知積作用而產生使吸附墊16搖頭的大回轉 材9空氣引導通^ 7組件本體4空氣引導通路5通過摺動部 塾16空氣吸弓丨孔路彳、軟管部材15空氣引導通路19與吸附 14、19斑空氣1 而吸引空氣時,這些空氣弓丨導通路5、 負壓。:時吸=夂16内’將會密閉且因真空吸引而形成 轉、弯曲,由^ 的吸附面16a,即使玻璃基板5產生翻 而緊密貼合,所該吸附面i6a能模倣玻璃基板s的内側表面 基板。 W以,也能防止氣漏並確實地真空吸引破壤 同時各空g PI 4# 因真空吸引而;1丨:二路5、14、19與空氣吸引孔16内, 摺動部材9將因/丄壓、所以…及附塾16、軟管部材與 護殼i中空部^內負壓而抵抗彈簧25的彈力,自動下降到 16e的全面,如圖一來,吸附整16内側表面外圍邊緣 觸。護殼!開將與護殼開口端U上發生面接 置吸附塾22的吸於是基準平面,故依水平方向配 向。 及附面1 6a。結果,玻璃基板S能維持水平方 、, 於觸面部1 6c與護殼1開口部内壁是接觸的,所 以吸附1 6能限制橫向移動。藉由此一限制,即使是在 吸附塾16吸附坡螭基板S内側表面的狀態下,玻璃基板1327986 V. INSTRUCTION DESCRIPTION (8) When the substrate S contacts the peripheral edge of the adsorption portion 16a, the distance between the applied point of the force applied and the :: position is elongated. Therefore, the contact force with the glass base will be transparent: the second attachment portion... the peripheral edge is slightly applied with a contact force, the soil joint. The large rotating material 9 that causes the adsorption pad 16 to shake the head to generate the air guiding passage 7 the air guiding passage 5 of the assembly body 4 through the folding portion 空气 16 air suction bow hole, the hose portion 15 air guiding passage 19 and When the air is adsorbed by 14 or 19 spots and the air is sucked, these air bows guide the passage 5 and the negative pressure. : When the suction = 夂 16 inside 'will be sealed and formed by the vacuum suction, the adsorption surface 16a can be closely adhered even if the glass substrate 5 is turned over, and the adsorption surface i6a can mimic the glass substrate s. Inner surface substrate. W, can also prevent air leakage and vacuum suction of the soil at the same time, each empty g PI 4# due to vacuum suction; 1 丨: two roads 5, 14, 19 and air suction holes 16, the folding parts 9 will be / 丄 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , touch. Shell! The opening is placed in contact with the open end U of the casing. The suction of the suction port 22 is the reference plane, so it is aligned in the horizontal direction. And the attached surface 16a. As a result, the glass substrate S can be maintained horizontally, and the contact surface portion 16c is in contact with the inner wall of the opening portion of the casing 1, so that the adsorption 16 can restrict the lateral movement. With this limitation, even in the state where the adsorption 塾16 adsorbs the inner surface of the sill substrate S, the glass substrate

第13頁 1327986 五、發明說明(9) ---- 不會移位’且保持在高精密度的定位狀態。 若依上述第一實施形態,護殼1開口部丨b内的軟管部 材1 5上載置著吸附部丨6a、以及半球面狀彎曲且接觸面部 至少有3處與護殼1開口部内壁產生點接觸的吸附墊【6,該 吸附墊1 6與摺動部材9之間張架著細線2 4,所以,吸附墊 1 6可以大角度地傾斜,而且傾斜時由於接觸面部i 6c與護 殼1開口部内壁是接觸的,故吸附墊丨6不會橫向移位。 吸附墊1 6 ’搖頭角度大,而且可稍加施力以產生微小 的摩擦抵抗,使搖頭動作更圓滑順暢,可槿 s 的大富翻轉、f曲而緊密…璃基板3内:表玻面璃貼基合板 無氣漏而確實地吸附玻璃基板S。 玻璃基板接觸時吸附部1 6b上接觸力作用點與吸附部 1 6b中心位置之間的距離因為較長,所以,僅一 ^點的接 觸力即可使吸附塾16產生搖頭動作’並可立即模倣玻璃基 板S的大富翻轉、彎曲等。 當吸附塾1 6吸附玻璃基板S時,各空氣引導通路已、 14、19與空氣吸引孔16d内的負壓將超越彈黃25的彈力, 使吸附墊16下降並與護殼1開口端U產生面接觸,將n及附 面1 6a限制於水平狀態。藉由此限制,將吸附塾丨6引起 吸附之玻璃基板S的翻轉、彎曲矯正成水平狀•離、,而且 持基準平面的高精密度。 '、 吸附墊1 6 ’由於是利用細線2 4連結的,所以,不敢 自護殼1開口端la脫離。 來 由於設有吸附墊高度調整裝置27,所以,可因應破蹲Page 13 1327986 V. Invention Description (9) ---- Will not shift ' and maintain a high-precision positioning state. According to the first embodiment, the hose portion 15 in the opening portion 丨b of the casing 1 has the adsorption portion 丨6a placed thereon, and the hemispherical shape is curved and at least three portions of the contact surface are formed on the inner wall of the opening of the casing 1. The contact pad of the point contact [6, the thin wire 24 is stretched between the adsorption pad 16 and the folding member 9, so that the adsorption pad 16 can be inclined at a large angle, and the contact surface i 6c and the sheath are inclined when tilted 1 The inner wall of the opening is in contact, so the suction pad 6 is not laterally displaced. The adsorption pad 16 6' has a large shaking angle, and can be slightly applied to generate a slight frictional resistance, so that the moving head movement is smoother and smoother, and the s s can be overturned and f-curved and tightly... The glass substrate 3: the surface glass The base plate is reliably adsorbed to the glass substrate S without air leakage. When the glass substrate is in contact, the distance between the contact force point on the adsorption portion 16b and the center position of the adsorption portion 16b is long, so that only one contact force can cause the adsorption jaw 16 to shake the head' and immediately It simulates the overturning, bending, and the like of the glass substrate S. When the adsorption 塾16 adsorbs the glass substrate S, the negative pressure in each of the air guiding passages 14, 14, 19 and the air suction hole 16d will exceed the elastic force of the elastic yellow 25, causing the adsorption pad 16 to descend and the open end U of the casing 1 Face contact is created to limit n and the boundary 16a to a horizontal state. By this limitation, the adsorption 塾丨6 causes the glass substrate S to be adsorbed to be inverted and bent to be horizontally and horizontally separated, and the high precision of the reference plane is maintained. Since the suction pad 16 6 is connected by the thin wire 24, the opening end la of the casing 1 is not detached. Since the adsorption pad height adjustment device 27 is provided, it can be broken.

1327986 五、發明說明(10) 基板維持的高度位置調整吸附墊1 6自護殼1端部1 a以上的 兩度位置。 接下來,就有關上述第一實施形態中說明的基板吸附 裝置E1適用於空氣浮上搬送裝置時之實例,參照圖五與圖 六所示之空氣浮上搬送裝置構造圖加以說明。另外,圖五 為上面圖、圖六為側面圖。 浮上搬送平檯3 〇上面,設有複數之空氣吹出孔31。從 這些空氣吹出孔31中,可依均勻的空氣壓而噴出空氣。藉 由該空氣的喷出,而於浮上搬送平檯3 0與玻璃基板S之間 形成空氣層,玻璃基板S即因此而向上浮到浮上搬送平檯 3 0上。浮上搬送平檯3 0的兩側面上,分別設有直線狀的導 軌32、33。這些導軌32、3 3上又分別設有可同時移動的搬 送部34、35。這些搬送部34、35上’透過各昇附支撐部材 3 6而設有吸附載置台37。各昇降支撐部材36’能使吸附載 置台37依上下方向(Z方向)而昇降。 該吸附載置台37上,在玻璃基板S搬送方向T相同方向 上,並設約5個上述基板吸附裝置E1。另外’基板吸附裝 置E 1的數量不僅限於5個,亦可設任意數量。這些基板吸 附裝置E 1,可分別將各吸附墊1 6的高度調整成一致。 在這樣的空氣浮上搬送裝置中,浮上搬送平檯3〇上有 空氣浮上、或載置著玻璃基板S。在此狀態下’可將各搬 送部3 4、3 5移動到破離基板s先端部的兩端。這些搬送部 3 4、3 5的各昇降支撐部材3 6,能分別使各吸附載置台3 7上 昇。如此一來,各基板吸附裝置E1的各吸附墊16,將與玻1327986 V. DESCRIPTION OF THE INVENTION (10) The height position of the substrate is adjusted to adjust the position of the adsorption pad 16 from the end of the sheath 1 at a position of 1 a or more. Next, an example in which the substrate adsorption device E1 described in the first embodiment is applied to an air floating upper transfer device will be described with reference to the structural diagrams of the air floating upper transfer device shown in Figs. 5 and 6 . In addition, FIG. 5 is a top view and FIG. 6 is a side view. On the upper surface of the floating transport platform 3, a plurality of air blowing holes 31 are provided. From these air blowing holes 31, air can be ejected in accordance with a uniform air pressure. By the ejection of the air, an air layer is formed between the floating upper transfer platform 30 and the glass substrate S, and the glass substrate S thus floats up to the floating transfer platform 30. Linear guide rails 32 and 33 are provided on both side surfaces of the floating transport platform 30. Further, these guide rails 32, 33 are provided with transporting portions 34, 35 which are movable at the same time. The conveyance units 34 and 35 are provided with an adsorption mounting table 37 through the respective attachment supporting members 36. Each of the lifting and lowering support members 36' allows the adsorption mounting table 37 to move up and down in the vertical direction (Z direction). On the adsorption mounting table 37, about five substrate adsorption devices E1 are provided in the same direction in the glass substrate S transport direction T. Further, the number of the substrate adsorbing devices E 1 is not limited to five, and may be any number. These substrate adsorbing devices E 1 can adjust the heights of the respective adsorption pads 16 to be uniform. In such an air floating upper transfer device, air is floated on the floating transport platform 3, or the glass substrate S is placed thereon. In this state, the respective conveying portions 34, 3 5 can be moved to both ends of the leading end portion of the substrate s. Each of the lifting and lowering support members 3 6 of the conveying portions 3 4 and 35 can lift the respective adsorption placing portions 37, respectively. In this way, each adsorption pad 16 of each substrate adsorption device E1 will be combined with glass

第15頁 1327986 五、發明說明(11) 基板S的内側表面接觸。這些吸附墊丨6一旦與玻璃基板s内 侧表面接觸’則與上述第一實施形態一樣,可藉由對玻璃 基板S的接觸力而使各吸附墊1 6搖動頭部,且使吸附面1 6 a 模倣玻璃基板S内側表面的傾斜。同時,以空氣真空吸引 的吸附面16a,則緊密吸附並固定於玻璃基板s的内側表面 上。 之後,當各搬送部34、35同時經由各導執32、33移動 時’藉空氣浮上的玻璃基板S’將受各搬送部34、35移動 的牵引,經由浮上搬送平檯3 0上方,高速地依搬送方向τ 藉空氣而被搬送。 如此一來,基板吸附裝置E1若適用於空氣浮上搬送裝 置的話’則產生翻轉、彎曲的玻璃基板S即使是藉由空氣 浮上而被搬送,也能模仿玻璃基板S的翻、彎曲而將各基 板吸附裝置E 1的吸附墊1 6,確實地吸附在玻璃基板S的内 側表面。吸附墊1 6,由於並未位移,所以,吸附固定玻璃 基板S内側表面時,也不會使玻璃基板s的位置移動。因 此’若將空氣浮上搬送裝置設置於液晶顯示螢幕、藉空氣 搬送液晶顯示螢幕的玻璃基板S時,位於製造線的調準部 與檢查部上,已調準的玻璃基板S的位置將不會移動且可 高精密度地吸附固定住。縱使複數之吸附墊1 6的高度位置 不一致’也能藉由各吸附墊高度調整裝置2 7將各吸附墊16 的高度位置調整成同一高度。 其次’就有關上述第一實施形態中說明的基板吸附裝 置E1適用於大型基板檢查裝置之檢查平檯時之實例,參照Page 15 1327986 V. INSTRUCTION DESCRIPTION (11) The inner surface of the substrate S is in contact. When the adsorption pad 6 is in contact with the inner surface of the glass substrate s, as in the first embodiment, the suction pad 16 can be shaken by the contact force to the glass substrate S, and the adsorption surface 16 can be made. a Simulates the inclination of the inner surface of the glass substrate S. At the same time, the adsorption surface 16a which is attracted by the air vacuum is closely adsorbed and fixed on the inner side surface of the glass substrate s. After that, when each of the conveyance units 34 and 35 moves through the respective guides 32 and 33 at the same time, the traction of the respective conveyance units 34 and 35 by the glass substrate S′ on which the air floats is transmitted through the floating transport platform 30, and the high speed is high. The ground is transported by air in the direction of transport τ. In this case, when the substrate adsorption device E1 is applied to the air-floating and transporting device, the glass substrate S that has been inverted and bent can be transported by floating the air, and the substrate can be inverted and bent. The adsorption pad 16 of the adsorption device E 1 is surely adsorbed on the inner side surface of the glass substrate S. Since the adsorption pad 16 is not displaced, the position of the glass substrate s is not moved when the inner surface of the glass substrate S is adsorbed and fixed. Therefore, when the air floating transport device is installed on the liquid crystal display screen and the glass substrate S of the liquid crystal display screen is transported by air, the position of the aligned glass substrate S will not be located in the alignment portion of the manufacturing line and the inspection portion. It moves and can be fixed and fixed with high precision. Even if the height positions of the plurality of adsorption pads 16 do not coincide with each other, the height positions of the respective adsorption pads 16 can be adjusted to the same height by the respective adsorption pad height adjusting devices 27. Next, with reference to an example in which the substrate adsorption device E1 described in the first embodiment is applied to an inspection platform of a large substrate inspection device,

第16頁 1327986 五、發明說明(12) 圖七所示之檢查平檯構造圖說明如下。 檢查平檯40,由中空構造之框型且為長方形的平檯本 體4卜與依一定間隔平行設於該平檯本體41中空部42内的 複數彎曲防止棧43所形成。平檯本體41中空部4 2内圍邊緣 部上’每隔一定間隔埋設著複數之基板吸附裝置E1。各彎 曲防止棧43上,則立設著複數支撐栓44。 該檢查平檯4 0上若載置著發生彎曲的玻璃基板s時, 各基板吸附裝置E1各吸附墊1 6將會接觸玻璃基板s内側表 面。這些吸附墊1 6,與上述第一實施形態一樣,將會產生 搖頭動作、且吸附面1 6 a狀模仿玻璃基板S内側表面藉由空 氣的真空吸引而與玻璃基板S内側表面緊密貼合,讀實地 吸附固定玻璃基板S。因此,即使將翻轉、彎曲的玻璃基 板S載置於檢查平檯4 0上,亦可確實地吸附固定玻璃基板 S。利用各吸附墊高度調整裝置27調整各吸附面1 6a高度位 置的同時’藉由增南吸附塾1 6的南度位置,即使玻璃其板 S大幅翻轉、彎曲,也能矯正這些翻·轉、彎曲,將於檢"查 平檯4 0上高度吸附固定玻璃基板S的平面度。 接著設明本發明第二實施形態。另外,與圖一之同— 部分且有相同符號的詳細說明,在此則省略不加詳述。 圖八所示為基板吸附裝置E1特徵部分的構造圖。鋼絲4 5繫 止於第一固定2 1與第二固定板23之間。該鋼絲45具有'扭曲 剛性’由金屬材料等所形成《該鋼絲45包括棒狀鋼絲本體 46、與設於該鋼絲本體46—端的鉤型第一繫止部47了與設 於鋼絲本體46另一端的J形第二繫止部48。第—躲& jJl ·§ΡPage 16 1327986 V. INSTRUCTIONS (12) The structural diagram of the inspection platform shown in Figure 7 is explained below. The inspection platform 40 is formed of a plurality of frame preventing bodies 43 which are frame-shaped and rectangular in a hollow structure and which are disposed in parallel with the plurality of bending preventing stacks 43 which are provided in the hollow portion 42 of the platform body 41 at regular intervals. A plurality of substrate adsorbing devices E1 are embedded in the inner peripheral edge portion of the hollow portion 4 2 of the platform body 41 at regular intervals. On each of the bending prevention stacks 43, a plurality of support pins 44 are erected. When the glass substrate s which is bent is placed on the inspection platform 40, the adsorption pads 16 of the respective substrate adsorption devices E1 will contact the inner surface of the glass substrate s. In the same manner as in the above-described first embodiment, the adsorption pad 16 generates a shaking action, and the adsorption surface 16 a shape mimics the inner surface of the glass substrate S by vacuum suction of air to closely adhere to the inner surface of the glass substrate S. The solid glass substrate S is fixedly adsorbed by reading. Therefore, even if the inverted and curved glass substrate S is placed on the inspection platform 40, the glass substrate S can be surely adsorbed and fixed. By adjusting the height position of each adsorption surface 16a by each adsorption pad height adjusting device 27, by increasing the south position of the adsorption 塾16, even if the glass S is greatly inverted and bent, the turn can be corrected. Bending, the flatness of the fixed glass substrate S will be highly adsorbed on the inspection platform. Next, a second embodiment of the present invention will be described. In addition, the detailed description of the same parts as those of the first embodiment and the same reference numerals will be omitted herein. Fig. 8 is a structural view showing a characteristic portion of the substrate adsorption device E1. The wire 45 is terminated between the first fixing 21 and the second fixing plate 23. The steel wire 45 has a 'twisting rigidity' formed of a metal material or the like. The wire 45 includes a bar-shaped wire body 46, and a hook-shaped first stopper portion 47 provided at the end of the wire body 46, and is provided on the wire body 46. A J-shaped second stop 48 at one end. The first - hiding & jJl · § Ρ

1327986 五、發明說明(13) 47’穿過第一固定板21之各孔21a、21b而由線等線材49綁 著。第二擊止部48,則擊止於第二固定板23之各孔21a、 21b° 例如:藉空氣將玻璃基板S浮上搬送時,利用基板吸 附裝置E1吸附翻轉、彎曲的玻璃基板s時,基板吸附裝置 E1將面向玻璃基板S吸附。此時,基板吸附裝置E丨的吸附 墊1 6僅會回轉。吸附墊1 6的回轉累積到一定程度後,固定 吸附墊1 6的裝置於第一固定板2 1與第二固定板2 3之間拉開 的細線24扭曲量將逐漸增大。於是,細線24的張力變大、 吸附墊1 6逐漸下降,護殼1端部1 a突出的吸附墊1 6的突出 量將變小。因此,吸附翻、彎曲的玻璃基板S時,吸附墊 1 6將模仿玻璃基板S内側表面的傾斜而傾斜,使得原來的 吸附動作更加困難。 若是上述第二實施形態,即使對吸附墊1 6施以回轉 力,該吸附墊1 6的回轉可藉由鋼絲4 5加以限制。因此,吸 •附墊1 6,將不會持續累積回轉,·而維持在護殼1端部1 a以 上的高度位置A上。 另外,上述第一與第二實施形態,亦可依下列方式形 成。 圖九A,為鋼絲45的變形列構造圖;該鋼絲45在鋼絲本 體4 6的第一繫止部4 7側上,設有細徑部4 9 a。該細徑部 4 9 a,較鋼絲本體4 6的直徑更細,該細徑部4 9 a上部,可稍 加外力而自由傾斜’但可抑止吸附勢1 6的回轉力。 圖九B也是鋼絲4 5的變形列構造圖。該鋼絲4 5,使第 IHI IH18 第18頁 1327986 五、發明說明(14) 一繫止部4 7與鋼絲本體4 6分離,並於該第一繫止部4 7下端 設置圓球4 9 b。鋼絲本體4 6,在與第一繫止部4 7分離的端 部上,設有圓球49b的承接部49c。該承接部49c,能使圓 球4 9 b回轉。因此,即使對鋼絲4 5施以扭曲力,圓球4 9 W乃 會在承接部49 c内回轉。如此一來,吸附墊1 6即使回轉, 鋼絲45也不會扭曲。 軟管部材15,如圖十所示,亦可使用形成蛇腹的軟管 部材1 5 a。 其次說明本發明的第三實施形態。 圖十一,為基板吸附裝置E 2的構造圖。護殼5 0,由鋁 等具有剛性的材料所形成的圓筒狀。該護殼5 0先端部上, 設有圓筒狀襯墊用固定孔51。該固定孔51内,於稍微突出 於該固定孔5 1開口端5 1 a的狀態下,使吸附墊5 2可回轉。 該吸附墊5 2,是利用樹脂形成的圓筒狀,該襯墊側面的接 觸面部5 2 a為球面狀。吸附墊5 2内部,設有下方開放的圓 筒狀中空部53。該吸附墊52上部,設有平面狀吸附面54。 該吸附面5 4上,設有稍具深度的襯墊凹部5 4 a,同時設有 連通中央中空部5 3的真空吸引用空氣吸引孔5 4 b。 護殼50的固定孔5卜其内徑較吸附墊52接觸面部52a 的尺寸稍小。固定孔5 1開口部上,設有模仿吸附墊5 2接觸 面部5 2 a球面形狀曲率而扭曲的扭曲形狀部5 5。該扭曲形 狀部5 5,構成將吸附墊5 2固定於固定孔5 1内的吸附墊固定 手段。 護殼5 0的固定孔5 1與吸附墊5 2的接觸面部5 2 a,為護1327986 V. INSTRUCTION OF THE INVENTION (13) 47' is passed through the holes 21a, 21b of the first fixing plate 21 and is tied by a wire 49 such as a wire. When the second stopper portion 48 is pressed against the respective holes 21a and 21b of the second fixing plate 23, for example, when the glass substrate S is floated and transported by air, when the glass substrate s which is inverted and curved is adsorbed by the substrate adsorption device E1, The substrate adsorption device E1 will adsorb toward the glass substrate S. At this time, the adsorption pad 16 of the substrate adsorption device E is rotated only. After the rotation of the adsorption pad 16 is accumulated to a certain extent, the amount of twist of the thin wire 24 which is pulled between the first fixing plate 21 and the second fixing plate 23 by the means for fixing the adsorption pad 16 will gradually increase. Then, the tension of the thin wire 24 becomes large, the suction pad 16 gradually descends, and the amount of protrusion of the adsorption pad 16 which protrudes from the end portion 1a of the sheath 1 becomes small. Therefore, when the folded and curved glass substrate S is adsorbed, the adsorption pad 16 is inclined to mimic the inclination of the inner surface of the glass substrate S, making the original adsorption operation more difficult. According to the second embodiment described above, even if the urging force is applied to the adsorption pad 16, the rotation of the adsorption pad 16 can be restricted by the wire 45. Therefore, the suction pad 16 will not continue to accumulate, and will remain at the height position A above the end 1a of the casing 1. Further, the first and second embodiments described above may be formed in the following manner. Fig. 9A is a structural diagram of a deformed row of the steel wire 45; the wire 45 is provided with a small diameter portion 4 9 a on the side of the first stopper portion 47 of the wire body 46. The small diameter portion 4 9 a is thinner than the diameter of the wire main body 46, and the upper portion of the small diameter portion 49a can be freely inclined with a slight external force, but the rotational force of the adsorption potential 16 can be suppressed. Fig. 9B is also a structural diagram of the deformation column of the wire 45. The wire 4 5, the first IHI IH18, page 18, 1327986. 5. The invention (14) The first portion 47 is separated from the wire body 46, and a ball 4 9 b is disposed at the lower end of the first stopping portion 47. . The wire main body 46 is provided with a receiving portion 49c of a ball 49b at an end separated from the first stopping portion 47. The receiving portion 49c can rotate the ball 4 9 b. Therefore, even if the wire 45 is subjected to a twisting force, the ball 4 9 W is rotated in the receiving portion 49c. As a result, even if the adsorption pad 16 is rotated, the wire 45 is not twisted. As shown in Fig. 10, the hose member 15, as shown in Fig. 10, can also be used to form a hose member 15a. Next, a third embodiment of the present invention will be described. Figure 11 is a structural view of the substrate adsorption device E 2 . The casing 50 is formed of a cylindrical material having a rigid material such as aluminum. A fixing hole 51 for a cylindrical spacer is provided on the tip end portion of the casing 50. In the fixing hole 51, the adsorption pad 52 is rotated in a state of slightly protruding from the opening end 51a of the fixing hole 51. The suction pad 52 is a cylindrical shape formed of a resin, and the contact surface portion 5 2 a of the side surface of the pad is spherical. Inside the adsorption pad 52, a cylindrical hollow portion 53 opened downward is provided. A flat adsorption surface 54 is provided on the upper portion of the adsorption pad 52. The suction surface 54 is provided with a cushion recess portion 5 4 a having a slight depth, and a vacuum suction air suction hole 5 4 b communicating with the central hollow portion 53 is provided. The fixing hole 5 of the casing 50 has a smaller inner diameter than the surface 52a of the suction pad 52. The opening portion of the fixing hole 51 is provided with a twisted shape portion 5 which is twisted by the curvature of the spherical surface of the face portion 5 2 a. The twisted portion 55 constitutes a suction pad fixing means for fixing the adsorption pad 52 in the fixing hole 51. The contact hole 5 1 of the casing 50 and the contact surface 5 2 a of the adsorption pad 5 2 are protected

第19頁 1327986 五、發明說明(15) 殼50固定孔51内吸附塾52可回轉的精密構造。因此,一旦 將吸附墊5 2收納於固定孔5 1内,吸附墊5 2的接觸面部5 2a 與固定孔5 1的内壁面之間至少有3處的點接觸。吸附墊5 2 的接觸面部5 2 a與固定孔5 1的内壁面之間的接觸,未必只 限於3處點接觸,尚可藉由吸附墊5 2的搖頭動作而在接觸 面部52 a上同一周方向的線上產生複數之點接觸、或在同 周方向的線上產生線接觸。藉該接觸面部52 a與固定孔51 内壁面間的接觸,使得接觸面部52 a與固定孔51内壁面之 間的摩擦抵抗極小,吸附墊5 2,在固定孔5 1内僅需稍加外 力即可沿著全周方向,如箭頭F方向維持回轉,順利地產 生搖頭動作。 護殼5 0的固定孔5 1内底部,設有承接吸附墊5 2的承接 面56。該承接面56,由設於平面部5 7與平面部5 7外圍邊緣 的錐形部5 8所形成。平面部5 7,藉由接觸吸附墊5 2底部而 限制吸附墊5 2對箭頭F方向傾斜的角度。吸附墊5 2的傾斜 角度,於吸附墊5 2傾斜時,吸附面5 4不隱藏於固定孔‘5 1内 的範圍。錐形部5 8,是模仿吸附墊5 2接觸面部5 2 a球面形 狀曲率的角度而形成的。該錐形部58,於固定孔51内接觸 下降的吸附墊5 2,並限制吸附墊5 2往下方移動。 護殼5 0中,設有中空孔5 9。該中空孔5 9,其内徑較固定孔 51的内徑小。該中空孔59内與吸附墊52的中空部53内,設 有吸附墊固定部材6 0。 該吸附墊固定部材60,是由橡膠等彈性部材所形成的 中空狀,其内部設有空氣引導通路。該吸附墊固定部材60Page 19 1327986 V. INSTRUCTION OF THE INVENTION (15) The precision structure in which the suction 塾 52 can be rotated in the fixing hole 51 of the casing 50. Therefore, once the adsorption pad 52 is housed in the fixing hole 51, at least three points of contact between the contact surface portion 52a of the adsorption pad 52 and the inner wall surface of the fixing hole 51 are made. The contact between the contact surface portion 52 2 a of the adsorption pad 5 2 and the inner wall surface of the fixing hole 51 is not necessarily limited to three point contacts, but may be the same on the contact surface portion 52 a by the shaking action of the adsorption pad 52. A plurality of point contacts are generated on the line in the circumferential direction, or a line contact is generated on the line in the same circumferential direction. By the contact between the contact surface portion 52a and the inner wall surface of the fixing hole 51, the frictional resistance between the contact surface portion 52a and the inner wall surface of the fixing hole 51 is extremely small, and the adsorption pad 52 has only a small external force in the fixing hole 51. It is possible to maintain the rotation in the direction of the entire circumference, as in the direction of the arrow F, and smoothly generate the shaking action. The bottom of the fixing hole 5 1 of the casing 50 is provided with a receiving surface 56 for receiving the adsorption pad 52. The receiving surface 56 is formed by a tapered portion 58 provided at the peripheral edge of the flat portion 57 and the flat portion 57. The flat portion 57, by contacting the bottom of the adsorption pad 52, limits the angle at which the adsorption pad 52 is inclined in the direction of the arrow F. When the adsorption pad 52 is inclined, the adsorption surface 54 is not hidden in the range of the fixing hole '5 1 when the adsorption pad 52 is inclined. The tapered portion 58 is formed by mimicking the angle at which the adsorption pad 52 touches the spherical curvature of the face 5 2 a. The tapered portion 58 contacts the descending adsorption pad 52 in the fixing hole 51, and restricts the adsorption pad 52 from moving downward. In the casing 50, a hollow hole 59 is provided. The hollow hole 5.9 has an inner diameter smaller than the inner diameter of the fixing hole 51. Inside the hollow hole 59 and the hollow portion 53 of the adsorption pad 52, a suction pad fixing member 60 is provided. The suction pad fixing member 60 is formed in a hollow shape made of an elastic member such as rubber, and is provided with an air guiding passage therein. The adsorption pad fixing member 60

第20頁 1327986 五、發明說明(16) 的先Μ部上’形成獲得較小彈力的風箱6〇^該風箱6〇 3的 先*ft 4 ’其厚度較底部薄,且形成蛇腹狀而可伸縮。該風 箱60,與吸附塾52的空氣吸引孔54b呈氣密式貼合。吸附 墊固定部材6 0的底部,與組件本體62的先端面氣密式連 結。Page 20 1327986 V. Invention description (16) on the shackle 'forms a bellows that obtains less elasticity 6 〇 ^ The first * ft 4 ' of the bellows 6 〇 3 is thinner than the bottom and forms a bellows And scalable. The bellows 60 is airtightly bonded to the air suction hole 54b of the suction weir 52. The bottom of the adsorption pad fixing member 60 is hermetically connected to the front end surface of the module body 62.

護殼5 0 ’面對組件本體6 2透過螺絲部6 3而鎖緊密合。 護殼50,可面對組件本體62回轉,並變化風箱6〇a的伸縮 莖、調整吸附塾52的回轉力。該調整於吸附塾52接觸玻璃 基板S時’承受作用外力的吸附墊52會在可回轉的範圍内 實施微調。 護设5 0 ’藉由面對組件本體6 2的回轉,可調整吸附墊 5 2的高度位置。如此調整風箱6 0 a的伸縮量(彈力)、或 吸附塾5 2的高度位置時’護殼5 0將透過鎖在螺絲部6 3的防 鬆螺母而固定於組件本體6 2上。 組件本體62上,設有空氣引導通路65。該空氣引導通 路65,與吸附墊固‘定部材60的空氣引導通路連通的。 空氣吸附孔54b、各空氣引導通路6卜65,形成了真空吸 引流路。The casing 50' faces the assembly body 62 and is locked by the screw portion 63. The casing 50 is rotatable facing the unit body 62, and changes the telescopic stem of the bellows 6a, and adjusts the turning force of the suction weir 52. This adjustment is made when the adsorption 塾 52 contacts the glass substrate S, and the adsorption pad 52 which is subjected to an external force is finely adjusted in a rotatable range. The protective member 50' can adjust the height position of the adsorption pad 52 by facing the rotation of the assembly body 62. When the amount of expansion and contraction (elastic force) of the bellows 60 a or the height position of the suction port 5 2 is adjusted in this way, the casing 50 is fixed to the module body 62 by the lock nut locked to the screw portion 63. An air guiding passage 65 is provided on the module body 62. The air guiding passage 65 communicates with the air guiding passage of the suction fixing member 60. The air suction holes 54b and the air guiding passages 65 are formed to form a vacuum suction flow path.

接下來,就有關對上述之基板吸附裝置E2玻璃基板s 的吸附動作,參照圖十二A〜圖十二C說明如下。 圖十二撕示為玻璃基板被搬送到基板吸附带置E2上方的 狀態。吸附塾5 2 ’於護殼5 0的固定孔5 1内傾斜,破壞吸附 面54對玻璃基板S内側表面的平行狀態。在此狀態了,基 板吸附裝置E 2藉由昇降裝置而上昇’傾钭的吸附墊5 2吸附Next, the adsorption operation of the glass substrate s of the substrate adsorption device E2 described above will be described below with reference to FIGS. 12A to 12C. Fig. 12 is a state in which the glass substrate is conveyed to the upper side of the substrate adsorption belt E2. The adsorption 塾 5 2 ' is inclined in the fixing hole 5 1 of the casing 50, and the parallel state of the adsorption surface 54 to the inner surface of the glass substrate S is broken. In this state, the substrate adsorption device E 2 is raised by the lifting device, and the adsorption pad 5 2 is adsorbed.

第21頁 1327986 五、發明說明(17) 面5 4上形成頂點的部分將接觸玻璃基板S内側表面。 以 只需要對 玻璃基板S内側表面稍加施以接觸力,即可在固定 J 箭頭F方向回轉。 疋内依 吸附墊5 2,由於與護殼5 0的固定孔5 1内部維持點接觸, ••與固定孔51的内壁面之間的摩擦抵抗極,】、‘·’ ’所 因此’當基板吸附裝置E2藉由來自玻螭基板s下方的 一點點接觸力而與玻璃基板S内側表面接觸時,吸附塾5 2 將會回轉,且如圖二B所示,吸附面54將與玻璃基板s内側 表面的方向一致。此時,即使吸附墊52傾斜、或者玻璃基 板s同時翻轉、或彎曲,吸附墊52仍會回轉且吸附面54會 與玻璃基板S内侧表面緊密貼合。 在此狀態下,透過各空氣引導通路6卜6 5與空氣吸引 孔54b而真空吸引空氣時,吸附墊52的襯墊凹部54a、空氣 吸引孔5 4 b與各空氣引導通路6卜6 5内,將因氣密狀態下 的真空吸引而形成負壓。如此一來,吸附墊5 2的吸附面 5 4 ’將會吸附在玻璃基板s内側表面上。該吸·附面5 4,即 使玻璃基板S產生翻轉、或彎曲,吸附墊5 2也能模仿玻璃 基板S内側表面而緊密貼合’所以能毫無氣漏且確實地真 空吸引玻璃基板S。Page 21 1327986 V. INSTRUCTION DESCRIPTION (17) The portion of the face 504 that forms the apex will contact the inside surface of the glass substrate S. It is only necessary to apply a contact force to the inner surface of the glass substrate S, and it is possible to rotate in the direction of the fixed J arrow F. The inside of the suction pad 5 2 is maintained in point contact with the inside of the fixing hole 5 1 of the casing 50, and the friction between the inner wall surface of the fixing hole 51 and the inner wall surface of the fixing hole 51 is extremely resistant, so that '·' When the substrate adsorption device E2 is in contact with the inner surface of the glass substrate S by a little contact force from under the glass substrate s, the adsorption 塾 5 2 will rotate, and as shown in FIG. 2B, the adsorption surface 54 will be combined with the glass substrate. The direction of the inside surface of s is the same. At this time, even if the adsorption pad 52 is inclined or the glass substrate s is simultaneously inverted or bent, the adsorption pad 52 is rotated and the adsorption surface 54 is in close contact with the inner surface of the glass substrate S. In this state, when the air is sucked by the air through the air guiding passages 6 and 65 and the air suction holes 54b, the gasket recess 54a of the suction pad 52, the air suction hole 504b, and each of the air guiding passages 6 The negative pressure is formed by vacuum suction in an airtight state. As a result, the adsorption surface 5 4 ' of the adsorption pad 52 will be adsorbed on the inner surface of the glass substrate s. Even if the glass substrate S is reversed or bent, the suction/attachment surface 5 4 can closely adhere to the inner surface of the glass substrate S, so that the glass substrate S can be surely sucked without any air leakage.

同時,襯墊凹部54a、空氣吸引孔541)與各空氣引導通 路6卜6 5内一旦形成負壓’彈性部材形成的吸附墊固定部 材6 0的主要部分風箱6 〇 a將會縮小。吸附墊5 2,由於風箱 Θ 0 a的縮小而在固定孔5 1内下降,如圖十二c所示,其底部 與錐形部58接觸而停止。如此一來,吸附塾52將固定於固At the same time, the main portion of the bellows 6a, which is formed by the pad recess 54a, the air suction hole 541) and the respective air guiding passages 6 and which form the negative pressure 'elastic member'. The suction pad 52 is lowered in the fixing hole 51 by the reduction of the bellows a 0 a , and the bottom thereof comes into contact with the tapered portion 58 to stop as shown in Fig. 12 c. As a result, the adsorption 塾52 will be fixed to the solid

第22頁 1327986Page 22 1327986

定孔5 1内。 若依上述第三實施形態,擁有球面狀接觸面部52a的 吸附墊52,藉由精密的嵌合構造而於護殼5〇的固定孔51内 以點接觸固定,使吸附墊52能夠在固定孔51内沿著全周方 向回轉,所以,吸附墊52,,固定孔5丨内的摩擦抵抗極小 且只要稍加施以外力即可沿著全周方向而回轉。因此,來 自玻璃基板S下方的微小接觸力而接觸玻璃基板s内側表 面,能使吸附墊5 2模仿玻璃基板S内側表面的傾斜方向而 無氣漏進行真空吸引’且能確實地吸附玻璃基板S内側表 面。如此一來,即使玻璃基板S發生翻轉、或彎曲,吸附 墊5 2也能模仿這些狀況而確實地吸附。 吸附墊52’藉由護殼50固定孔51内的嵌合構造固定 住,所以,吸附墊5 2在固定孔5 1内的位移極小。如此一 來’吸附固定玻璃基板S時,即可高精密地進行定位。 吸附墊5 1吸附玻璃基板S内側表面時,由於吸附塾固定部 材6 0内的負壓而造成風箱60 a縮小’使吸’附墊5 2接觸錐形 部5 8 ’進而限制往下方移動,所以,在吸附玻璃基板$的 狀態下,能正確地固定高度。 使護殼50面對組件本體62回轉,可調整風箱6〇3的伸 縮量’所以,在將吸附墊52對玻璃基板S的接觸力調整成 最適值的同時,亦可調整吸附墊52的高度位置。 5蔓设5 0上s又有扭曲形狀邹5 5 ’所以,球狀吸附塾5 2不會從 固定孔5 1彈跳出來。 上述基板吸附裝置Ε2,可取代上述圖五與圖六所示之Fixed hole 5 1 inside. According to the third embodiment, the adsorption pad 52 having the spherical contact surface portion 52a is fixed in a point contact manner in the fixing hole 51 of the casing 5〇 by a precise fitting structure, so that the adsorption pad 52 can be fixed in the hole. Since the inside of the 51 is rotated in the entire circumferential direction, the frictional resistance in the adsorption pad 52 and the fixing hole 5 is extremely small, and it is possible to rotate in the entire circumferential direction as long as the force is slightly applied. Therefore, the small contact force from under the glass substrate S contacts the inner surface of the glass substrate s, so that the adsorption pad 52 can simulate the oblique direction of the inner surface of the glass substrate S without vacuum leakage, and can reliably adsorb the glass substrate S. Inside surface. As a result, even if the glass substrate S is turned over or bent, the adsorption pad 52 can be surely adsorbed by mimicking these conditions. The suction pad 52' is fixed by the fitting structure in the fixing hole 51 of the casing 50, so that the displacement of the adsorption pad 52 in the fixing hole 51 is extremely small. In this way, when the glass substrate S is fixedly adsorbed, positioning can be performed with high precision. When the adsorption pad 5 1 adsorbs the inner surface of the glass substrate S, the bellows 60 a is reduced by the negative pressure in the adsorption 塾 fixing member 60, and the suction pad 5 2 is brought into contact with the tapered portion 58 8' to restrict the movement downward. Therefore, in the state in which the glass substrate $ is adsorbed, the height can be accurately fixed. The casing 50 is rotated toward the module body 62, and the amount of expansion and contraction of the bellows 6〇3 can be adjusted. Therefore, the contact force of the adsorption pad 52 to the glass substrate S can be adjusted to an optimum value, and the adsorption pad 52 can be adjusted. Height position. 5 vines set 50 s and have a twisted shape Zou 5 5 ' Therefore, the spherical adsorption 塾 5 2 does not bounce out of the fixing hole 5 1 . The substrate adsorption device Ε2 may be replaced by the above-mentioned FIG. 5 and FIG.

1327986 五、發明說明(19) 空氣浮上搬送裝置的基板吸附裝置E1。基板吸附裝置E 2若 適用於空氣浮上搬送裝置,與上述第一實施形態一樣,可 模仿玻璃基板S的翻轉、彎曲而使各基板吸附裝置E2的吸 附墊5 2破實地吸附在玻璃基板S内側表面上,而且玻璃基 板S也不會發生位移。 其次,說明本發明第四實施形態。另外,與圖Η--之 同一部分且有相同符號的詳細說明,在此則省略不加詳 述。 圖十三,為基板吸附裝置Ε3的結構圖。該基板吸附裝 置Ε3,可取代圖七所示之大型基板檢查裝置檢查平檯上基 板吸附裝置Ε 1。護殼5 0鎖緊於各凹部7 0底部的螺絲部7卜 藉由安裝在防鬆螺帽7 2的螺絲部71而固定住。若能使護殼 5 0對螺絲部7 1回轉,則可調整風箱6 0的伸縮量。該調整狀 態’可藉由鎖緊安裝防鬆螺帽72而固定。平檯本體4 1與各 彎曲防止棧4 3的各基座7 3上,設有連通吸附墊固定部材6 0 内空·氣引導通路61的空氣吸引通路74。 如果是設置基板吸附裝置Ε3的檢查平檯,則可確實吸 附固定翻轉、彎曲的玻璃基板S,而且可藉由調整吸附墊 52的高度位置矯正翻轉或彎曲,並高度地吸附固定玻璃基 板S的平面度》 基板吸附裝置Ε3,亦可適用於圖十四所示之大型基板 搬送用機器手臂R。該機器手臂R的手臂固定部8 0上,設有 複數,例如四支手臂8 1,並依一定間隔平行排列。這些手 臂8 1上’設有複數之基板吸附裝置Ε 3。1327986 V. INSTRUCTION OF THE INVENTION (19) The substrate adsorption device E1 of the air floating transport device. When the substrate adsorption device E 2 is applied to the air floating upper transfer device, as in the first embodiment, the adsorption pad 5 2 of each substrate adsorption device E2 can be loosely adsorbed on the inner side of the glass substrate S by the inversion and bending of the glass substrate S. On the surface, the glass substrate S does not shift. Next, a fourth embodiment of the present invention will be described. In addition, the detailed description of the same parts as those of the drawings and the same reference numerals will be omitted herein. Figure 13 is a structural view of the substrate adsorption device Ε3. The substrate adsorbing device Ε3 can replace the substrate adsorbing device Ε 1 on the large substrate inspection device inspection platform shown in Fig. 7. The screw portion 7 of the casing 50 locked to the bottom of each recess 70 is fixed by the screw portion 71 attached to the lock nut 72. If the casing 50 is rotated by the screw portion 7, the amount of expansion and contraction of the bellows 60 can be adjusted. This adjustment state can be fixed by locking the lock nut 72. An air suction passage 74 that communicates with the air/air guiding passage 61 in the suction pad fixing member 60 is provided on each of the base body 411 of each of the platform main body 41 and each of the bending prevention stacks 4 3 . If the inspection platform of the substrate adsorption device Ε3 is provided, the inverted and curved glass substrate S can be surely adsorbed, and the inverted or curved shape can be corrected by adjusting the height position of the adsorption pad 52, and the glass substrate S can be highly adsorbed and fixed. The flatness "substrate adsorption device" 3 can also be applied to the large substrate transfer robot R shown in FIG. The arm fixing portion 80 of the robot arm R is provided with plural numbers, for example, four arms 181, and arranged in parallel at regular intervals. These arms 8 1 are provided with a plurality of substrate adsorbing devices Ε 3 .

1327986 五、發明說明(20) 該大型基板搬送用機器手臂,將手臂固定部8〇插入收 納部’並取出大型玻璃基板S’搬送至檢查器平檯、或搬 送線上。各手臂81上若載置著玻璃基板s,玻璃基板就會 產生彎曲。此時吸附墊5 2 ’吸附面5 4將模仿玻璃基板S内 侧表面的傾斜而藉由空氣真空吸引緊密與玻璃基板S内側 表面貼合,確實地吸附固定玻璃基板。 若依上述第四實施形態,可調低護殼5 〇的高度使之小 型化’並適用於大型基板檢查裝置檢查平檯、大型基板搬 送用機器手臂的手臂部等,使玻璃基板不致於移位,能模 仿玻璃基板S的翻轉、彎曲,確實地吸附固定住。 其次’說明本發明第五實施形態。另外,與圖一、圖 十一、圖五與圖六之同一部分且有相同符號的詳細說明, 在此則省略不加詳述。 該第五實施形態,圖五與圖六所示之空氣浮上搬送裝 置,適用上述第一實施形態之基板吸附裝置(以下簡稱為 第一基板·吸附裝置)E卜與上述第三實施形態之基板吸附 裝置(以下簡稱為第二基板吸附裝置)E2。 圖十五所示為設於各吸附載置台5 7上之第一實施形態 之基板吸附裝置E卜與第二實施形態之基板吸附裝置E2。 另外’同圖中若加註符號則顯得煩雜不已,故僅於必要部 分附上符號。第一與第二基板吸附裝置E卜E2,乃是依玻 璃基板S搬送方向τ之同一方向而複數並設的。第一基板吸 附裝置E1 ’沿著玻璃基板激送方向T於玻璃基板S先端部 側設置複數個,例如2個。第二基板吸附裝置E 2,則於第1327986 V. OBJECT OF THE INVENTION (20) The large-sized substrate transporting robot arm inserts the arm fixing portion 8A into the receiving portion' and takes out the large-sized glass substrate S' and transports it to the inspector platform or the transport line. When the glass substrate s is placed on each arm 81, the glass substrate is bent. At this time, the adsorption pad 5 2 'adsorption surface 54 mimics the inclination of the inner surface of the glass substrate S, and is closely adhered to the inner surface of the glass substrate S by vacuum suction, thereby reliably adsorbing and fixing the glass substrate. According to the fourth embodiment, the height of the low-profile case 5 可调 can be reduced to be small, and the glass substrate can be prevented from being moved to the large substrate inspection device inspection platform or the arm portion of the large substrate transfer robot. The position can simulate the inversion and bending of the glass substrate S, and is surely adsorbed and fixed. Next, a fifth embodiment of the present invention will be described. In addition, detailed descriptions of the same portions as those of the first, the eleventh, the fifth, and the sixth, and the same reference numerals will be omitted herein. In the fifth embodiment, the air-floating and transporting apparatus shown in FIG. 5 and FIG. 6 is applied to the substrate adsorbing apparatus (hereinafter simply referred to as the first substrate/adsorbing apparatus) E of the first embodiment and the substrate of the third embodiment. An adsorption device (hereinafter simply referred to as a second substrate adsorption device) E2. Fig. 15 shows a substrate adsorption device E of the first embodiment provided on each adsorption mounting table 57, and a substrate adsorption device E2 of the second embodiment. In addition, it is cumbersome to add a symbol to the same figure, so the symbol is attached only to the necessary part. The first and second substrate adsorption devices E, E2, are plurally arranged in the same direction as the glass substrate S transport direction τ. The first substrate adsorbing device E1' is provided in plural, for example, two at the tip end side of the glass substrate S along the glass substrate direction T. The second substrate adsorption device E 2 is in the first

第25頁 1327986 五、發明說明(21) 一基板吸附裝置E1稍後端側設置複數個,例如6個。這些 第一與第二基板吸附裝置E1、E 2在吸附玻璃基板S的狀態 下,將各吸附塾16、52的各吸附面16a、54的高度位置調 整成與基準平面Η—致。各第一基板吸附裝置E1,其吸附 塾16下降至護殼1内而與端部la面接觸時之吸附面16a的高 度位置’則調整成與基準平面H—致。第一與第二基板吸 附裝置E卜E 2 ’由於尚度皆不相同,故於吸附載置台上設 有段差G。 圖十六,為空氣真空吸引系統。相對於玻璃基板s的 搬送方向τ之左側各第一基板吸附裝置E1,透過各其他系 統的各空氣別引路而與各調節器(regulat〇r)9〇、91接 續’而右側的各第一基板吸附裝置E丨,則與各調節器 (^舀111&1;〇1')92、9 3接續。這些調節器(1^811131:〇1^9〇、 9 1、…、9 3 ’個別控制著第一基板吸附裝置E丨預設的各空 氣吸引力。 另一方面,相對於玻璃基板S的搬送方向τ之左側各第 二基板吸附裝置E2,分別與各調節器(regulat〇r)94_卜 94- 2 ..... 94-n接續,而右侧的各第二基板吸附裝置£2也 與各調節器(regulator) 95-1、95-2..... 95 -η接續。這 些調節器(regulator) 94-1、 94-2、…、94-η、 95-1、 95- 2、…、95-η,個別控制著各第二基板吸附裝置Ε2預設 的各空氣吸引力。 相對於玻璃基板S的搬送方向Τ之左側各調節 (1^811131:〇1')90、91’與真空管9 6共通接續;同樣地,左Page 25 1327986 V. INSTRUCTION DESCRIPTION (21) A plurality of substrate adsorption devices E1 are provided on the rear end side, for example, six. The first and second substrate adsorbing devices E1, E2 adjust the height positions of the respective adsorption faces 16a, 54 of the respective adsorption ports 16, 52 in a state where the glass substrate S is adsorbed to be aligned with the reference plane. In each of the first substrate adsorption devices E1, the height position of the adsorption surface 16a when the adsorption crucible 16 is lowered into the casing 1 and brought into contact with the end portion la is adjusted to be equal to the reference plane H. Since the first and second substrate adsorbing devices E, E 2 ' are different in degree, a step G is provided on the adsorption mounting table. Figure 16. is an air vacuum suction system. The first substrate adsorption device E1 on the left side with respect to the transport direction τ of the glass substrate s passes through the respective air guides of the other systems, and is connected to the respective regulators (regulat〇r) 9〇, 91, and the first one on the right side. The substrate adsorption device E is connected to each of the regulators (^舀111&1;〇1') 92, 93. These regulators (1^811131: 〇1^9〇, 9 1 , ..., 9 3 ' individually control the preset air attraction forces of the first substrate adsorption device E 。. On the other hand, relative to the glass substrate S The second substrate adsorption device E2 on the left side of the transport direction τ is respectively connected to each regulator (regulat〇r) 94_b 94- 2 ..... 94-n, and the second substrate adsorption device on the right side is £ 2 is also connected to each of the regulators 95-1, 95-2..... 95 - η. These regulators 94-1, 94-2, ..., 94-η, 95-1, 95- 2, ..., 95-η, individually control the respective air suction forces preset by the respective second substrate adsorption devices 。2. Adjustments to the left side of the transport direction Τ of the glass substrate S (1^811131: 〇1') 90, 91' and vacuum tube 96 are connected in common; similarly, left

第26頁 1327986 五、發明說明(22) 側各調節器(regulator) 941、94_2..... 94-11也與真空 管97共通接續。另外,各真空管96、9 7之各調節器、 (regulator) 90、9卜 94-卜 94-2 ……94-n側上,分別 設有各空氣壓力計98、99。 空氣壓力計98,測量來自各調節器(regulat〇r) 9〇、 9 1的空氣吸引力,該空氣吸引力不低於設定吸引力時則 對真空管9 6發出錯誤信號,進而遮斷該真空管96。空氣壓 力计99,測量來自各調節器(regUiat〇r) 94-卜 94-2 ..... 94-n的空氣吸引力,該空氣吸引力不低於設定 吸引力時’則對真空管97發出錯誤信號,進而遮斷該真空 管97。同樣地,相對於玻璃基板s的搬送方向τ之右侧各調 節器(regulator) 92' 93,與真空管1〇〇共通接續;同樣 地 9 5 - η也 右側各調節器(regulator) 95-1、95-2 與真空管101共通接續。這些真空管1〇0、1〇1之各調節器 (regulator) 92、93、95-卜 95-2 ..... 95-n側上,分別 設有各空氣壓力計102、103。這些空氣壓力計1〇2、1〇3, 分別測量來自各調節器(regulator) 92、93、95-1、 95-2..... 95_n的各空氣別引力,該空氣吸引力不低於設 定吸引力時’則對真空管9發出錯誤信號後加以遮斷。 各第一基板吸附裝置E1側的各真空管96、100,與主 調節器(regulator)104a共通接續,接著主調節器 (regulator) 104a再與空氣吸引源1〇5接續。同樣地,各第 二基板吸附裝置E1側的各真空管9 7、1 0 1,與主調節器 (regulator)104b共通接續,接著主調節器Page 26 1327986 V. INSTRUCTIONS (22) Side regulators 941, 94_2..... 94-11 are also commonly connected to vacuum tube 97. Further, on the respective regulators 90, 9 94, 94, 94, ..., 94-n sides of the respective vacuum tubes 96, 97, respective air pressure gauges 98, 99 are provided. The air pressure gauge 98 measures the air attraction force from each regulator (regulat〇r) 9〇, 9 1 , and when the air suction force is not lower than the set attraction force, an error signal is sent to the vacuum tube 96 to interrupt the vacuum tube. 96. The air pressure gauge 99 measures the air attraction force from each regulator (regUiat〇r) 94-b 94-2 ..... 94-n, and the air attraction force is not lower than the set attraction force' An error signal is issued to interrupt the vacuum tube 97. Similarly, the regulator 92' 93 on the right side with respect to the transport direction τ of the glass substrate s is connected to the vacuum tube 1 ;; similarly, 9 5 - η is also the right regulator 95-1 95-2 is connected to the vacuum tube 101 in common. Each of the vacuum tubes 1〇0, 1〇1 regulators 92, 93, 95-b 95-2 ..... 95-n side is provided with respective air pressure gauges 102, 103. These air pressure gauges 1〇2, 1〇3, respectively measure the air gravitational forces from the regulators 92, 93, 95-1, 95-2..... 95_n, which are not low in air attractiveness. When setting the attraction force, the vacuum tube 9 is sent an error signal and then blocked. Each of the vacuum tubes 96, 100 on the side of each of the first substrate adsorption devices E1 is connected in common to a main regulator 104a, and then the main regulator 104a is connected to the air suction source 1A5. Similarly, each of the vacuum tubes 707 and 010 on the side of each of the second substrate adsorbing devices E1 is connected in common to the main regulator 104b, and then the main regulator

第27頁 1327986 五、發明說明(23) (regulator )1 0 4b再與空氣吸引源1()5接續。另外,各主調 節器(regulator) 104a 、l〇4b的各真空管 96、97、100、 1 0 1側上’則接續著空氣壓力計1 〇 6 a、1 0 6 b。 接下來’說明上述構造之裝置對玻璃基板S的吸附動 作。Page 27 1327986 V. Inventive Note (23) (regulator) 1 0 4b is connected to the air suction source 1 () 5 again. Further, the respective vacuum tubes 96, 97, 100, and 1 0 1 side of the main regulators 104a and 104b are connected to the air pressure gauges 1 〇 6 a and 1 0 6 b. Next, the adsorption operation of the apparatus of the above configuration on the glass substrate S will be described.

浮上搬送平檯3 0上’浮上或載置著玻璃基板s的狀態 下’當各吸附載置台57上升時,第一與第二各基板吸附裝 置E1、E 2之各吸附塾1 6、5 2將如圖十五所示地向玻璃基板 S的内側表面上升。相對於玻璃基板S的搬送方向T,先端 部側若產生翻轉、彎曲時,首先位於第一基板吸附裝置E 1 的吸附墊1 6之一端’將接觸玻璃基板s内側表面。玻璃基 板S ’相對於搬送方向T之先端側翻轉、彎曲量雖然會變 大,但在面對搬送方向T的先端部側上配置可調整各吸附 墊1 6高度的第一基板吸附裝置E1,可使各吸附塾1 6接觸發 生翻轉、彎曲的玻璃基板S内側表面。這些吸附塾1 6,僅 需小’小的接觸力即可自玻璃基板S下·方接觸玻璃基板S的内 側表面,並且模仿玻璃基板S的翻轉、弯曲產生的傾斜而 搖動頭部,吸附面3 6則將緊密地貼合玻璃基板§内側表 面。In the state in which the glass substrate s is floated or placed on the floating transport platform 30, when the respective adsorption mounting tables 57 are raised, the respective adsorption ports of the first and second substrate adsorption devices E1 and E2 are 16 and 5 2 will rise toward the inner side surface of the glass substrate S as shown in FIG. When the tip end side is reversed or bent with respect to the conveyance direction T of the glass substrate S, first, one end of the adsorption pad 16 of the first substrate adsorption device E 1 will contact the inner surface of the glass substrate s. The glass substrate S' is reversed with respect to the tip end side of the transport direction T, and the amount of warpage is increased. However, the first substrate adsorbing device E1 that can adjust the height of each of the adsorption pads 16 is disposed on the tip end side facing the transport direction T, Each of the adsorption crucibles 16 can be brought into contact with the inner surface of the glass substrate S which is turned over and bent. These adsorption 塾16 can only contact the inner side surface of the glass substrate S from the glass substrate S under a small 'small contact force, and shake the head by mimicking the inclination caused by the inversion and bending of the glass substrate S, and the adsorption surface 3 6 will closely fit the inner surface of the glass substrate.

在此狀態下’當空氣吸引源1 0 5開始實施空氣吸引動 作時,相對於各第一與第二基板吸附裝置El、E 2之各調節 器(regulator)90、91、…、93與各調節器 P (regulator)94-l、94_2、…、94-n、95-1、95-2、...、 95 -η將透過主各真空管96、97、1〇〇、ι〇1、主調節器In this state, when the air suction source 105 starts the air suction operation, the regulators 90, 91, ..., 93 and the respective first and second substrate adsorption devices E1, E2 are Regulators 94-1, 94_2, ..., 94-n, 95-1, 95-2, ..., 95-η will pass through the main vacuum tubes 96, 97, 1〇〇, ι〇1. Main regulator

1327986 五、發明說明(24) (regulator)l〇4而進行空氣吸引。如此 附裝置E1’將與上述第一實施形態一樣,吸布 ''基板吸 1 6 a將模仿翻轉、彎曲的玻璃基板S内側表面附髮* 1 6吸附面 無氣漏且確實地真空吸引玻璃基板S»同時,而緊密附著, 側表面外圍邊緣1 6 e,將停止對護殼1端部i吸附墊1 6内 玻璃基板S的翻轉、彎曲加以矯正成平面狀7的面接觸,將 此時玻璃基板S的内側表面會向複數之^ _ 裝置E 2之各吸附墊5 2接近。這些第二基板吸糾一^基板吸附 需 “- 側 第一 ^ in 土 u “tsc 4 ,心 tsr 牙》 一 iG nTi 八久 小小的接觸力即可自玻璃基板S下方接趨 、置E2,僅 面方向將 表面,進而使各吸附墊5 2回轉,且吸附面 基板S的 模仿玻璃基板S内侧表面的方向而一致。 5 4的面t ^ 在此狀態下,若透過襯墊凹部54a、— >· ^ 工氧吸弓| 内 各空氣引導通路6卜65而真空吸引空氣的久Ή孔5 4b與 活,吸附塾52之 與此同 在固定孔51内下降並停止接觸錐形部58 ·· °及附塾52將 吸附面5 4將會吸附在玻璃基板S的内側表面i 時,風箱6 0將因空氣真空吸引而縮小,所以 板S内側表面藉由第一與第二基板吸附裝置El、备坡璃基 固定的話,玻璃基板S的翻轉、彎曲將夸钊妹τ E 2而吸附 又到頌正 '且維 水平在基準平面Η上。 ¥ @ 然後’當各搬送部34、35同時在各導轨32、33上移動 時’空氣浮上的玻璃基板s將受到各搬送部34、35移動的 牽引’於浮上搬送平檯30上依搬送方向τ被高速地藉空氣 搬送。 S二八 若依上述第五實施形態’在破璃基板S搬送方向τ的先1327986 V. Inventive Note (24) (regulator) l〇4 for air suction. The apparatus E1' thus attached will be the same as the first embodiment described above, and the suction cloth ''substrate suction 1 6 a will be attached to the inner surface of the glass substrate S which is mimicked and bent. * 16 6 adsorption surface without air leakage and vacuum suction glass Simultaneously, the substrate S» is closely attached, and the peripheral edge of the side surface 16 6 e stops the surface contact of the glass substrate S in the adsorption pad 16 at the end 1 of the casing 1 and is corrected to be planar contact 7 . The inner surface of the glass substrate S is approached to the respective adsorption pads 52 of the plurality of devices E2. These second substrates absorb and correct a substrate to be adsorbed by "- side first ^ in soil u "tsc 4 , heart tsr teeth" - iG nTi eight long small contact force can be connected from the bottom of the glass substrate S, set E2 The surface is moved in the surface direction, and the respective adsorption pads 52 are rotated, and the direction of the inner surface of the glass substrate S of the adsorption surface substrate S is uniform. In this state, if the air is immersed in the recesses 54a, _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ With the 塾52 falling in the fixing hole 51 and stopping the contact with the tapered portion 58··° and the attachment 52, the suction surface 5 4 will be adsorbed on the inner surface i of the glass substrate S, and the bellows 60 will be The air is vacuumed and contracted, so that the inner surface of the plate S is fixed by the first and second substrate adsorption devices E1 and the surface of the slab, and the inversion and bending of the glass substrate S will be adsorbed to the τE2 'And the dimension level is on the reference plane Η. ¥ @ Then, when the respective conveying portions 34 and 35 move on the respective guide rails 32 and 33 simultaneously, the glass substrate s on which the air floats is transported by the respective transporting portions 34 and 35, and is transported on the floating transport platform 30. The direction τ is carried by air at a high speed. S 二八 According to the fifth embodiment described above, the first direction of the glass substrate S transport direction τ

11

第29頁 Ϊ327986 五、發明說明(25) 端側上即使產生大量的翻轉、彎曲,也能藉由吸附墊1 6而 確實地吸附固定該玻璃基板S内側表面。大量翻轉、彎曲 的破璃基板S先端側,可藉由各第一基板吸附裝置E 1而吸 附固定,並且向基準平面Η下降,所以,玻璃基板S内側表 面可逐漸地接近各第二基板吸附裝置Ε2,並藉由各第二基 板吸附裝置Ε 2 ’確實地吸附固定玻璃基板s内側表面。 第一與第二基板吸附裝置Ε1、Ε 2,分別透過其他系統 的各調節器〇6运111&1:〇]:)90、91一..、95-11實施空氣的吸 W ,所以,即使1處吸附墊1 6或5 2未吸附玻璃基板S而氣 漏,只會停止對相對於該氣漏的吸附墊1 6或5 2之第一基板 吸附裝置Ε1或第二基板吸附裝置E2的空氣供給,在處理終 了之前仍會藉由各吸附1 6或5 2,維持與其他第一基板吸附 裝置Ε1與第二基板吸附裝置E2之間的吸附動作。如此一 來’玻璃基板S的吸附固定不會中途停止且可提高安全 性,而且可修理氣漏的吸附墊1 6或5 1之第一或第二基板吸 附裝置El、E2系統’亦有利於維修保養。此外,藉由對各. 第—基板吸附裝置E1與各第二基板吸附裝置ε 2供給空氣的 2個系統,儘官一邊的主調節器(regUiat〇r)i〇4a或1 04b故 障’另一邊的主調節器(^舀11131:〇〇104诚1043仍會繼續 動作,所以’所有各第一基板吸附裝置A與各第二基板吸 附裝置B上無法空氣吸引的問題即可解決。 上述第五實施形態中,雖然使用的是第一與第二基板 吸附裝置£1、E2’但也可全部使用第一基板吸附裝置。此 時’各第一基板吸附裝置E1吸附墊16的高度,可藉由調整Page 29 Ϊ 327986 V. SUMMARY OF THE INVENTION (25) Even if a large amount of inversion and bending occurs on the end side, the inner surface of the glass substrate S can be surely adsorbed and fixed by the adsorption pad 16. The tip end side of the glass substrate S which is inverted and bent in a large amount can be adsorbed and fixed by the respective first substrate adsorption devices E1, and can be lowered toward the reference plane, so that the inner surface of the glass substrate S can be gradually approached to the adsorption of the respective second substrates. The device Ε 2 is fixedly fixed to the inner surface of the glass substrate s by the respective second substrate adsorption devices Ε 2 '. The first and second substrate adsorbing devices Ε1 and Ε2 are respectively passed through the regulators 其他6 of the other systems, and the air suction W is performed by 111&1:〇::) 90, 91-., 95-11, respectively, Even if one of the adsorption pads 16 or 52 does not adsorb the glass substrate S and leaks, only the first substrate adsorption device 1 or the second substrate adsorption device E2 with respect to the adsorption pad 16 or 52 relative to the air leakage is stopped. The air supply maintains the adsorption operation with the other first substrate adsorption device Ε1 and the second substrate adsorption device E2 by the respective adsorptions 16 or 5 2 before the end of the treatment. In this way, the adsorption and fixation of the glass substrate S does not stop midway and the safety can be improved, and the first or second substrate adsorption device El, E2 system of the adsorption pad 16 or 51 that can repair the air leakage is also advantageous. Maintenance. Further, by the two systems that supply air to each of the first substrate adsorbing device E1 and each of the second substrate adsorbing devices ε 2, the main regulator (regUiat〇r) i〇4a or 104b fails. The main regulator on one side (^舀11131:〇〇104诚1043 will continue to operate, so the problem that all the first substrate adsorption device A and each of the second substrate adsorption devices B cannot be attracted by air can be solved. In the fifth embodiment, the first substrate adsorbing devices £1 and E2' are used, but the first substrate adsorbing device may be used in all. In this case, the height of each of the first substrate adsorbing devices E1 adsorbing the pad 16 may be By adjusting

第30頁 1327986 五 、發明說明 (26) 裝 置 2 7調 整 吸 附 墊16的 高度,而依玻璃基板s的搬送方向Τ 逐 漸 增 〇 其 次 說 明 本發明 之第六實施形態。另外’與圖五、 圖 六 之 同 一— 部 分 且有相 同符號的詳細說明,在此則省略不 加 詳 述 〇 圖 十 七 為 可 當成檢 查平檯使用之空氣浮上搬送裝置的 結 構 圖 設 有 複 數,例 如3個吸附載置台37a、37b、37c。 這 些 吸 附 載 置 台 37a、37b、37 c安裝於相對於玻璃基板汹 搬 送 方 向 T上的先端部側與後端部側與中間部。這些吸附 載 置 台 37a' 3 7b、3 7c上,分別並列設置著複數之第一或 第 二 基 板 吸 附 裝 置Eh E2。這些第一或第二基板吸附裝置 E] 、 Ε2, 在 吸 附 玻璃基 板S的狀態下’將各吸附墊1 6、5 2 的 各 吸 附 面 1( 3a' ‘ 54的高度位置,調整成與基準乎面Η— 致 〇 這 些 第 一 或 第二基 板吸附裝置E卜E2,與上述第五實 施 形 態 一 樣 分 別透過 其他系統之各空氣吸引路而與各調 Arfr 即 器 接 續 例 如 :1個·第一或第二基板吸附裝置以、Ε2即 使 出 現 氣 漏 其 他第一 或第二基板吸附裝置E卜E2仍可保 持 吸 附 動 作 玻 璃基板 S的吸附固定不會中途停土 ’並可 提 高 安 全 性 〇 對 這 些 第 或第二 基板吸附裝置E卜E2的吸附控制方 法 首 先 , 是 對 設於中 央部的吸附載置台37c上各第一或 第 二 基 板 吸 附 裝 置Ε1或 E2,開始實施吸附動作。接下是對 δ又 於 先 端 部 或 後 端部的 吸附載置台37 a或37 b上各第一或第 二 基 板 吸 附 裝 置 Ε1或Ε2,開始實施吸附動作。Page 30 1327986 V. INSTRUCTIONS (26) Apparatus 2 7 adjusts the height of the suction pad 16 and gradually increases in accordance with the transport direction of the glass substrate s. Next, a sixth embodiment of the present invention will be described. In addition, the detailed descriptions of the same parts as those in the figures of FIG. 5 and FIG. 6 are omitted here, and the detailed description of the air floating upper conveying device which can be used as an inspection platform is provided with plural numbers. For example, three adsorption mounts 37a, 37b, 37c. These suction mounts 37a, 37b, 37c are attached to the tip end side and the rear end side and the intermediate portion with respect to the glass substrate 搬 transport direction T. On the adsorption loading stages 37a' 3 7b, 3 7c, a plurality of first or second substrate suction means Eh E2 are arranged side by side. The first or second substrate adsorption devices E] and Ε2 adjust the height position of each adsorption surface 1 (3a'' 54 of each adsorption pad 16 and 5 2 to a reference in a state in which the glass substrate S is adsorbed. Η Η 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 Or the second substrate adsorption device can prevent the adsorption and fixation of the adsorption operation glass substrate S from being stopped even if the first or second substrate adsorption device E E2 is present, and the safety can be improved. The adsorption control method of the first or second substrate adsorption device Eb E2 first starts the adsorption operation on each of the first or second substrate adsorption devices Ε1 or E2 on the adsorption mounting table 37c provided at the center portion. δ is further applied to each of the first or second substrate adsorption devices Ε1 or Ε2 on the adsorption stage 37a or 37b at the tip end or the rear end portion Adsorption started operation.

第31頁 1327986Page 31 1327986

五、發明說明(27) 若是這樣的吸附控也丨士、、t ^V. Description of invention (27) If such adsorption control is also gentleman, t ^

吸附固定於浮上搬送平檯3 〇上.Γ軋汙上的玻璃基板S 間部上的吸附載置台37e上&時於翻轉較小的中 或E2開始實施的吸附^各/殖一其或基板吸附裝置E1 ^ 町助作’玻璃基板S中央部將藉由各第 一或第二基板吸附裝置£1或£2而被確實地吸附固定著。此 時玻璃基板S中央部將藉由各第一或第二基板吸附裝置E1 或E2的吸附固定,而降低玻璃基板的翻轉、彎曲。 其次’設於先端部或後端部的吸附載置台37£1或371)上 各第一或第二基板吸附裝置E丨或E2將開始實施吸附動作。 如此一來’先端部個第一或第二基板吸附裝置£1或£2,將 從中央部側往先端部側依序接觸、吸附固定玻璃基板S的 内侧表面。Adsorption is fixed on the floating transfer platform 3 Γ. 吸附 吸附 的 的 的 的 的 的 的 的 的 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 37 The substrate adsorption device E1 ^ machi's central portion of the glass substrate S is surely adsorbed and fixed by each of the first or second substrate adsorption devices £1 or £2. At this time, the central portion of the glass substrate S is fixed by adsorption of each of the first or second substrate adsorption devices E1 or E2, thereby reducing the inversion and bending of the glass substrate. Next, the adsorption operation is performed on each of the first or second substrate adsorption devices E? or E2 on the adsorption mounting table 37*1 or 371) provided at the tip end portion or the rear end portion. In this way, the first or second substrate adsorbing device of the first end portion has a thickness of 1 or 2, and the inner surface of the glass substrate S is sequentially contacted and adsorbed from the center portion side toward the tip end portion side.

從翻轉較小的中間部開始依序向翻轉較大的先端部或 後端部吸附’不僅能橋正玻璃基板S的翻轉、畺曲,也能 確實地吸附固定。另外,吸附載置台不限於中央部、先端 部、後端部3處,可依玻璃基板S的尺寸而增加,’而且也可 從中央部以外翻轉較小的部分往翻轉較大的區域進行配 置。 接下來,說明本發明第七實施形態。另外,與圖五、 圖六之同一部分且有相同符號的詳細說明,在此則省略不 加詳述。 圖十八,是空氣浮上搬送裝置的構造圖。浮上搬送平 檯1的兩側面上,分別設置著1台吸附載置台3 7。該吸附載 置台37上,依玻璃基板S的搬送方向T之同一方向上’並列From the intermediate portion where the reversal is small, the adsorption to the tip end portion or the rear end portion which is largely reversed can not only be reversed or twisted by the glass substrate S, but also can be surely adsorbed and fixed. Further, the adsorption mounting table is not limited to the center portion, the tip end portion, and the rear end portion 3, and may be increased depending on the size of the glass substrate S, and may be disposed from a portion where the center portion is not turned over to a region where the turnover is large. . Next, a seventh embodiment of the present invention will be described. In addition, the detailed description of the same portions as those in FIGS. 5 and 6 is omitted here. Fig. 18 is a structural view of the air floating upper conveying device. On both sides of the floating transport platform 1, one adsorption mount 37 is provided. The adsorption mounting table 37 is juxtaposed in the same direction as the transport direction T of the glass substrate S.

第32頁 1327986 五 、發明說明 (28) 設 置著 複 數 之 第 一 或 第二基板吸附裝置E1或E2。這些 第一 或 墙 一 乐一 基 板 吸 附 裝 置 E1或E2,與上述第五實施形態一 樣, 分 別透 過 其 他 系 統 之 各空氣吸引路而與各調節器接續 〇 對 這 些 第 一 或 第 二基板吸附裝置E1或E 2的吸附控 制方 法 ,是 對 各 第 一 或 第 二基板吸附裝置E1或E2,從玻璃 基板 S翻轉較d 、的中央部側往翻轉較大的端部側,依序開始實 施 吸附 動 作 0 這 樣 的 吸 附 控 制 方法,’於空氣浮上的玻璃基板 S吸 附 固定 於 浮 上 搬 送 平 檯3 0上時’各第一或第二基板吸 附裝 置 E1或 > 將 從 玻 璃 基板S中間部侧往先端部侧依序接觸 玻 璃基 板 S内側表面 '並且吸附固定之。藉由該吸附固 定 ,玻 璃 基 板 S的翻轉’將從中間側往端部側依序獲得橋 正 ,而 各 第 一 或 第 二 基板吸附裝置E 1或E 2則將從中間 部往 端 部側 確 實 地 吸 附 固 定玻璃基板S。 另 外 各 第 一 或 第二基板吸附裝置E1或E 2即使同 時動 作 ,也 會 從 玻 璃 基 板 S翻轉較小的部分往翻轉較大部分依 序 開始 吸 附 藉 此 可 依基準平面取冬破璃基板s的翻轉 、彎 曲 矯正 成 水 平 〇 若 依 上 述 第 七 實 施形態’也能確實地吸附固定吸 附墊 5 2的突 出 度 較 小 的 第二基板吸附裝置E2、眾所周知 的基 板 裝置 上 大 幅 翻 轉 的 玻璃基板S。 再 者, 本 發 明 並 不 限 於上述各實施形態,亦可作以下 之變 形 〇 例 如 上 述 各 實 施形態,雖然是使用於玻璃基板 S的Page 32 1327986 V. INSTRUCTIONS (28) A plurality of first or second substrate adsorption devices E1 or E2 are provided. The first or wall-one substrate-adsorbing device E1 or E2 is connected to each of the regulators to the first or second substrate adsorbing devices E1 through the respective air suction paths of the other systems, as in the fifth embodiment. In the adsorption control method of the E 2 or the second substrate adsorption device E1 or E2, the glass substrate S is turned over from the center portion side of the d to the larger end portion, and the adsorption operation is sequentially performed. 0 such an adsorption control method, 'when the glass substrate S floating on the air is adsorbed and fixed on the floating transfer platform 30', each of the first or second substrate adsorption devices E1 or > from the intermediate portion side of the glass substrate S to the apex The side portions sequentially contact the inner surface ' of the glass substrate S and are adsorbed and fixed. By the adsorption fixing, the inversion of the glass substrate S is sequentially obtained from the intermediate side to the end side, and the first or second substrate adsorption devices E 1 or E 2 are from the intermediate portion to the end side. The glass substrate S is fixedly adsorbed. In addition, even if the first or second substrate adsorption devices E1 or E2 are operated at the same time, the glass substrate S is turned over from a small portion to a large portion to be sequentially adsorbed, thereby taking the winter glass substrate s according to the reference plane. The second substrate adsorption device E2 having a small degree of protrusion of the adsorption pad 52 can be surely adsorbed and fixed, and the glass substrate S which is greatly inverted on the well-known substrate device can be surely adsorbed and fixed according to the seventh embodiment described above. . Furthermore, the present invention is not limited to the above embodiments, and the following modifications may be made, for example, in the above embodiments, although they are used for the glass substrate S.

第33頁 !327986 五、發明說明(29) 空氣浮上搬送,但也適用於在玻璃基板嫌查部上將玻璃 基板S吸附固定於檢查平檯上。 如圖十九所示,以複數個基板吸附裝置E1或£2為1組 的區塊(1)1〇〇1〇111〜114’同時各區塊(131〇〇1〇111〜114亦可形 成個別的空氣真空引導系統。各第一基板吸附裝置群Η1〜 Η4 ’分別沿著玻璃基板S的搬送方向Τ配列著複數之基板吸 附裝置群Ε1。其中各第一基板吸附裝置群m、Η2相鄰接, 而各第一基板吸附裝置群H3、H4相鄰接。此外,這些第一 基板吸附裝置群H1〜H4,亦可用於第二基板吸附裝置E2。 這些第一基板吸附裝置群Η1〜Η4中的各第一基板吸附裝置 Ε1’與各調節器110接續,接著各第一基板吸附裝置群Η1 〜Η 4又與其他共通接續的各真空管1 1 1〜1 1 4接續。對應於 第一基板吸附裝置群Η 1與Η 3的各真空管in、11 3是共通接 續的,且又與主調節器1 1 5a接續。另外,對應於第一基板 吸附裝置群H2與H4的各真空管112、114是共通接續的,且 又與主調節器115b接續。 · 若是這樣的空氣真空引導系統,與上述第五實施形態 樣,1個第一或第二基板吸附裝置、E丨、E 2即使產生氣 漏,也能對玻璃基板S#續保持吸附的動作且可提高安全 性。另外,第一基板吸附裝置群^與H2、”與“是鄰接設 置的,其中一邊的第一基板吸附裝置群Η卜與另一邊第 一基板吸附裝置群Η 2、Η 4分別構成個別的空氣真空引導系 統,即使一邊鄰接的第一基板吸附裝置群Hb Η3無法吸 引,也藉由其他鄰接的基板吸附裝置Η2/Β|實地吸附固定玻Page 33 !327986 V. INSTRUCTIONS (29) The air floats and transports, but it is also suitable for adsorbing and fixing the glass substrate S on the inspection platform on the glass substrate inspection unit. As shown in FIG. 19, a plurality of substrate adsorption devices E1 or £2 are a group of blocks (1) 1〇〇1〇111~114' and each block (131〇〇1〇111~114 may also be used). An individual air vacuum guiding system is formed. Each of the first substrate adsorbing device groups Η1 to Η4' is arranged with a plurality of substrate adsorbing device groups 沿着1 along the transport direction of the glass substrate S. Each of the first substrate adsorbing device groups m and Η2 Adjacent to each other, each of the first substrate adsorption device groups H3 and H4 is adjacent to each other. Further, the first substrate adsorption device groups H1 to H4 may be used for the second substrate adsorption device E2. Each of the first substrate adsorption devices Ε1' in the Η4 is connected to each of the regulators 110, and then the first substrate adsorption device groups Η1 to Η4 are connected to the other common vacuum tubes 1 1 1 to 1 1 4 . The first substrate adsorption device group Η 1 and the vacuum tubes in and 11 3 of the crucible 3 are connected in common, and are connected to the main regulator 1 15 5 . In addition, the vacuum tubes corresponding to the first substrate adsorption device groups H2 and H4 112, 114 are commonly connected, and in turn with the main regulator 115b According to the fifth embodiment, the first or second substrate adsorption device, E丨, and E2 can continue to adsorb the glass substrate S# even if air leakage occurs. In addition, the first substrate adsorption device group and H2, "and" are disposed adjacent to each other, wherein one of the first substrate adsorption device group and the other side of the first substrate adsorption device group 2 And Η 4 respectively constitute an individual air vacuum guiding system, and even if the adjacent first substrate adsorption device group Hb Η3 cannot be attracted, the adjacent adjacent substrate adsorption device Η2/Β|

1327986 五、發明說明(30) 璃基板S。例如:第一基板吸附裝置群Η 1之全體,即使發 生氣漏,也能藉由鄰接的第一基板吸附裝置群Η2持續吸附 固定玻璃基板S。1327986 V. INSTRUCTIONS (30) Glass substrate S. For example, the entire first substrate adsorption device group Η 1 can continuously adsorb and fix the glass substrate S by the adjacent first substrate adsorption device group 2 even if the gas is leaked.

另外,上述第一實施形態中吸附墊1 6的接觸面部1 6 c 的形狀,如圖二十Α〜圖二十D所示的部分剖面圖、與圖二 十E所示之上面圖亦可變形。圖二十A所示之接觸面部 16c,與各傾斜面120、121交差,形成有鈍角的頂點122。 該頂點122,形成於接觸面部16 c的全周方向上。若是這樣 的吸附墊1 6接觸面部1 6 c,接觸面部1 6 c的頂點1 2 2,對護 殼1内壁2a在全周方向上是產生線接觸。 圖二十B所示之接觸面部1 6 c,則形成擁有鈍角頂點 1 2 3的凸狀體1 2 4。該接觸面部1 6 c,凸狀體1 2 4頂點1 2 3也 在全周方向上對護殼1内壁2 a產生線接觸。 圖二十C所示之接觸面部16c,在筒狀曲面本體125上形成 半球狀的凸狀體126。若是該接觸面部16c,凸狀體12 6也 會在’全周方向上對護殼1内壁2 a產生‘線接觸。 圖二十D所示之接觸面部16c,在筒狀曲面本體12 5上 形成突起帶體127。若是該接觸面部16c,突起帶體12 7也 會在全周方向上對護殼1内壁2a產生線接觸。Further, in the first embodiment, the shape of the contact surface portion 16c of the suction pad 16 may be a partial cross-sectional view as shown in Figs. 20A and 20D, and the top view shown in Fig. 20E. Deformation. The contact surface portion 16c shown in Fig. 20A intersects the inclined surfaces 120 and 121 to form an apex 122 having an obtuse angle. This vertex 122 is formed in the entire circumferential direction of the contact surface portion 16c. If such a suction pad 16 contacts the face portion 16c, the vertex 1 2 2 of the face portion 16c is contacted, and the inner wall 2a of the casing 1 is in line contact in the entire circumferential direction. The contact face 1 6 c shown in Fig. 20B forms a convex body 1 2 4 having an obtuse angle vertex 1 2 3 . The contact face portion 16c, the apex 1 2 3 of the convex body 1 2 4 also makes line contact with the inner wall 2 a of the sheath 1 in the entire circumferential direction. The contact surface portion 16c shown in Fig. 20C forms a hemispherical convex body 126 on the cylindrical curved surface body 125. In the case of the contact surface portion 16c, the convex body 12 6 also produces 'line contact with the inner wall 2a of the casing 1 in the 'peripheral direction'. The contact surface portion 16c shown in Fig. 20D is formed with a protruding strip body 127 on the cylindrical curved body 125. In the contact surface portion 16c, the protruding strip body 12 7 also makes line contact with the inner wall 2a of the sheath 1 in the entire circumferential direction.

圖二十E所示之接觸面部16c,在筒狀曲面本體12 5外 圍表面上至少會形成3個以上,例如4個突起1 2 8。若是該 接觸面部16c,各突起體12 8將會對護殼1内壁2 a產生各點 接觸。 上述各實施形態,雖然說明的是有關藉空氣浮上搬送In the contact surface portion 16c shown in Fig. 20E, at least three or more, for example, four protrusions 1 28 are formed on the outer peripheral surface of the cylindrical curved body 125. In the case of the contact surface portion 16c, each of the projections 12 will have a point contact with the inner wall 2a of the casing 1. In the above embodiments, it is described that the air is transported by air.

第35頁 1327986 五、發明說明(31) 玻璃基 音波浮 以 第 數基板 前述各 的第一 正前述 述玻璃 板吸附 基板吸 第 施前述 基板吸 第三之 基板吸 動作為 第 之基板 對應於 應於前 吸附動 第 之基板 靜電浮上 板S的情況,但不僅限於空氣浮上 上等亦適用於玻璃基板S的搬送。 下將說明本發明其他特徵。 之本發明特徵’在利用沿著基板側緣部配列之複 吸附裝置吸附固定前述基板之基板吸附方法中,於 基板吸附裝置中前述基板先端側上使用突出高度大 基板吸附裝置、吸附固定前述各基板吸附裝置、 基板成水平狀離、妥丨丨田@ Λ ^ ^狀·“利用則述第一基板吸附裝置將前 基扳矯正成水平狀態後使用突出高度較Page 35 1327986 V. INSTRUCTION OF THE INVENTION (31) The glass substrate is suspended by the first substrate of the first substrate, and the substrate is sucked by the substrate. In the case where the substrate on which the substrate is first adsorbed is electrostatically floated on the upper surface S, it is not limited to the air floating and the like, and is also applicable to the transport of the glass substrate S. Other features of the invention will be described below. According to a feature of the present invention, in a substrate adsorption method in which a substrate is adsorbed and fixed by a double adsorption device arranged along a side edge portion of a substrate, a substrate having a large projection height is used on the substrate tip end side of the substrate adsorption device, and the respective substrates are adsorbed and fixed. The substrate adsorption device and the substrate are horizontally separated, and the substrate is in the shape of a @ 丨丨 @ “ “ “ “ “ “ “ “ “ 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一 第一

=行吸附固定前述玻璃基板’以上述為;= 二之本發明特徵,於第一之本發明特徵中, 第:基板吸附裝置之吸附動作,實施前:。貫 附裝置之吸附動為特微的基板吸附方法。 第一 本發明特徵,於第一之本發明特徵中,以 附裝置與前述第二基板吸附裝置同時二— 特徵的基板吸附方法。 ]始實她吸附= Adsorption and fixation of the glass substrate 'in the above-mentioned; = two features of the present invention. In the first feature of the present invention, the adsorption operation of the substrate adsorption device is performed before: The adsorption of the attached device is an ultra-fine substrate adsorption method. According to a first aspect of the present invention, in the feature of the first aspect of the present invention, the substrate adsorption method is characterized by the attachment of the device and the second substrate adsorption device. She started to absorb her

四之本發明特徵,利用沿著基板側緣 吸附裝置吸附@定前述基板之基板吸附方2複數 前述基板翻轉較小部分的前述基板吸附裝中/從 述基板翻轉較大部分的前述基板吸附心 2 作’以上述為特徵的基板吸附方法。 Q % 五之本發明特徵’利用沿著基板側緣部 吸附裝置吸附固定前述基板之基板吸附方法7複,According to a fourth aspect of the present invention, the substrate adsorbing side of the substrate is adsorbed by the adsorption device of the substrate along the side edge of the substrate, and the substrate is adsorbed by the substrate in a smaller portion of the substrate. 2 For the substrate adsorption method characterized by the above. Q% V. The present invention features a substrate adsorption method 7 for adsorbing and fixing the substrate along the side edge of the substrate.

MilMil

第36頁 1327986 五、發明說明(32) 述基板吸附裝置之1個或複數之每一區塊(block)上設有各 空氣真空引導系統,使前述各空氣真空引導系統同時動 作,並由前述基板翻轉較小部分往較大部分,使前述各基 板吸附裝置依序對前述基板進行吸附,且藉此矯正前述基 板的翻轉,以上述特徵的基板吸附方法。 產業上利用的可能性 本發明適用於LCD製造線上液晶螢幕之玻璃基板的搬 送、及半導體製造線上半導體晶片與各種部材之搬送等。Page 36 1327986 V. Description of the Invention (32) Each of the plurality of substrate adsorption devices is provided with an air vacuum guiding system for each of the above air vacuum guiding systems to operate simultaneously. The substrate is flipped to a larger portion, and the substrate adsorption device sequentially adsorbs the substrate, thereby correcting the inversion of the substrate, and the substrate adsorption method of the above feature. Industrial Applicability The present invention is applicable to the transportation of a glass substrate of a liquid crystal screen on an LCD manufacturing line, and the transfer of a semiconductor wafer and various parts on a semiconductor manufacturing line.

第37頁 1327986 圖式簡單說明 圖式的簡單說明 圖一係本發明基板吸附裝置的第一實施例構成圖。 圖二係本發明基板吸附裝置吸附墊的吸附部的另一實例的 構成圖。 圖三係基板吸附裝置的第一及第二支持板的構成圖。 圖四A係基板吸附裝置的吸附墊開始模擬產生彎曲的玻璃 基板狀態的表示圖。 圖四B係基板吸附裝置的吸附墊與產生彎曲的玻璃基板的 吸附狀態的表示圖。 圖四C係基板吸附裝置的吸附墊與產生彎曲的玻璃基板吸 附時矯正動作表示圖。 圖五係適用本發明基板吸附裝置的空氣浮上搬送裝置的上 視構成圖。 圖六係適用本發明基板吸附裝置的空氣浮上搬送裝置的側 視構成圖。 圖七係適用本發明基板〜及附裝置的大型基板檢查裝置檢查 步驟的構成圖。 圖八係本發明基板吸附裝置的第二實施例特徵部份的構成 圖。 圖九A係本發明基板吸附裝置所使用鋼線的變形例的構成 圖。 圖九B係本發明基板吸附裝置所使用鋼線的另一變形例的 構成圖。 圖十係本發明基板吸附裝置所之吸附墊的變形例的構成Page 37 1327986 Brief Description of the Drawings Brief Description of the Drawings Fig. 1 is a configuration diagram of a first embodiment of the substrate adsorption apparatus of the present invention. Fig. 2 is a configuration diagram showing another example of the adsorption portion of the adsorption pad of the substrate adsorption device of the present invention. Figure 3 is a configuration diagram of the first and second support plates of the substrate adsorption device. Fig. 4A is a view showing a state in which the adsorption pad of the substrate adsorption device starts to simulate a curved glass substrate. Fig. 4B is a view showing the state of adsorption of the adsorption pad of the substrate adsorption device and the glass substrate which is bent. Fig. 4 is a diagram showing the corrective action when the adsorption pad of the substrate adsorption device and the glass substrate for bending are adsorbed. Fig. 5 is a top view showing the configuration of an air floating upper transfer device to which the substrate adsorption device of the present invention is applied. Fig. 6 is a side view showing the configuration of an air floating upper transfer device to which the substrate adsorption device of the present invention is applied. Fig. 7 is a view showing the configuration of an inspection procedure of a large-sized substrate inspection apparatus to which the substrate to the present invention and the attached device are applied. Fig. 8 is a view showing the configuration of a characteristic portion of a second embodiment of the substrate adsorbing device of the present invention. Fig. 9A is a configuration diagram showing a modification of a steel wire used in the substrate adsorption apparatus of the present invention. Fig. 9B is a configuration diagram showing another modification of the steel wire used in the substrate adsorption apparatus of the present invention. Figure 10 is a configuration of a modification of the adsorption pad of the substrate adsorption device of the present invention.

第38頁 1327986 圖式簡單說明 圖。 圖十一係本發明基板吸附裝置所的第三實施例的構成圖。 圖十二A係基板吸附裝置的吸附墊與玻璃基板開始吸附狀 態的表示圖。 圖十二B係基板吸附裝置的吸附墊與玻璃基板正當接觸狀 態的表示圖。 圖十二C係基板吸附裝置的吸附墊與玻璃基板吸附狀態的 表示圖。Page 38 1327986 Schematic description of the diagram. Figure 11 is a configuration diagram of a third embodiment of the substrate adsorption device of the present invention. Fig. 12 is a view showing the state in which the adsorption pad and the glass substrate of the substrate adsorption device start to be adsorbed. Fig. 12 is a view showing a state in which the adsorption pad of the substrate adsorption device and the glass substrate are in proper contact with each other. Fig. 12 is a view showing the state of adsorption of the adsorption pad and the glass substrate of the substrate adsorption device of the C system.

圖十三係本發明基板吸附裝置的第四實施例特徵部份的構 成圖。 圖十四係適用本發明基板吸附裝置的大型基板搬送用機械 手臂的構成圖。 圖十五係本發明第五實施例中適用第一及第二基板吸附裝 置的空氣浮上搬送裝置的構成圖。 圖十六係表示本發明基板吸附裝置使用的空氣真空吸引系 統圖。· . 圖十七係適用於本發明第六實施例中基板吸附裝置的空氣 浮上搬送裝置的構成圖。Figure 13 is a view showing the configuration of a characteristic portion of a fourth embodiment of the substrate adsorbing device of the present invention. Fig. 14 is a view showing the configuration of a large-sized substrate transfer robot to which the substrate adsorption device of the present invention is applied. Fig. 15 is a view showing the configuration of an air floating upper conveying device to which the first and second substrate adsorbing devices are applied in the fifth embodiment of the present invention. Fig. 16 is a view showing an air vacuum suction system used in the substrate adsorption apparatus of the present invention. Fig. 17 is a configuration diagram of an air floating upper transfer device applied to a substrate adsorption device in a sixth embodiment of the present invention.

圖十八係適用於本發明第六實施例中基板吸附裝置的空氣 浮上搬送裝置的另一構成圖。 圖十九係表示本發明基板吸附裝置使用的空氣真空吸引系 統的另一變形例。 圖二十A係表示吸附墊的接觸面形狀的變形圖。 圖二十B係表示吸附墊的接觸面形狀的另一變形圖。Fig. 18 is another configuration diagram of an air floating upper conveying device which is applied to the substrate adsorbing device in the sixth embodiment of the present invention. Fig. 19 is a view showing another modification of the air vacuum suction system used in the substrate adsorption device of the present invention. Fig. 20A is a deformation diagram showing the shape of the contact surface of the adsorption pad. Figure 20B is another deformation diagram showing the shape of the contact surface of the adsorption pad.

第39頁 1327986 圖式簡單說明 圖二十c係表示吸附墊的接觸面形狀的又一變形圖。 圖二十D係表示吸附墊的接觸面形狀的再一變形圖。 圖二十E係表示吸附墊的接觸面形狀的其他變形圖。 符號說明 1 ...................護殼 2 ...................中空部 3 ...................安裝台 4 ...................本體 5 ...................空氣引導通路 鲁 6 ...................螺帽 7 ...................溝 8 .................. . 0形ί裒 9 ....................摺動部材 10 ...................厚圓筒部 11···.................薄圓筒部 . 12 ...................溝Page 39 1327986 BRIEF DESCRIPTION OF THE DRAWINGS Figure 20c shows still another variation of the shape of the contact surface of the adsorption pad. Figure 20D shows still another modification of the shape of the contact surface of the adsorption pad. Fig. 20E shows another deformation diagram of the shape of the contact surface of the adsorption pad. DESCRIPTION OF SYMBOLS 1...................Shell 2 ................... Hollow part 3 ... ................Installation table 4........................ Body 5 .......... .........Air Guide Path Lu 6........................Nuts 7 .............. .....Ditch 8 .................. 0-shaped 裒9................... .Folding member 10 ................... Thick cylindrical portion 11···...................... Cylinder. 12 ...................

13 .................. . V形 I 14 .................. •空氣引導通路 15 ...................軟管部材 鲁 16 ...................吸附墊 16c...................接觸面部 16d...................空氣吸引孔 17 ...................屈曲部13 .................. V-shaped I 14 .................. Air guiding path 15 ... ................Hose parts Lu 16........................Adsorption pad 16c....... ............Contact face 16d...................Air suction hole 17............ .......flexion

第40頁 1327986 圖式簡單說明 18 ...................螺絲部 19 ...................空氣引導通路 20 ...................環狀段差 21 ...................第一固定板 22 ...................環狀段差 23 ...................第二固定板 24 ...................網路 25 ...................彈簧 26 ...................彈簧調節部材 27 ...................高度調整結構 籲 28 ...................螺絲部 29 ...................環狀部材 30 ...................浮上搬送平檯 31 ...................空氣吹出孔 32 .................. •導轨 33 ...................導軌 · 34 ...................搬送部 3 5...................搬送部 36 ...................支撐部材 37 ...................吸附裝置台 鲁 37a...................吸附裝置台 37b...................吸附裝置台 37c...................吸附裝置台 4 0...................彎曲的玻璃基板Page 40 1327986 Simple illustration of the figure 18 ................... Screw part 19 ................... Air guiding passage 20 . . ....... ring segment difference 21 ................... first fixing plate 22 ................... Annular section difference 23........................Second fixing plate 24 .. .................Network 25 ...................Spring 26 ......... ..........Spring adjustment member 27 ................... Height adjustment structure calls 28 ............ .......screws 29 ...................annular parts 30 ................. .. floating on the transport platform 31...................air blowout hole 32.................. Rail 33 ................... Guide rail 34 ...................Transportation section 3 5... ................Transporting section 36...................Supporting material 37 ......... ..........Adsorption device Tailu 37a...................Adsorption device table 37b............ .......Adsorption device table 37c...................Adsorption device table 4 0............... ....curved glass substrate

第41頁 1327986 圖式簡單說明 41...................平台本體 4 2.................. •中空部 43 ...................彎曲防止棧 44 ...................支撐栓 45 ...................綱絲 46 ...................鋼絲本體 47 ...................第一繫止部 48 ...................第二繫止部 49 ...................線材 4 9b...................圓球· 49c.................. •承接部 50 ...................護殼 51 ...................固定孔 5 2...................吸附墊 52a..................接觸面部 53...................中空部· · 5 4.................. •吸附面 54a..................襯墊凹部 54b..................空氣吸引孔 55...................扭曲形狀部 Φ 5 6...................承接面 5 7...................平面部 58...................錐形部 5 9...................中空部Page 41 1327986 Schematic description 41.................. Platform body 4 2.................. • Hollow portion 43........................ Bending prevention stack 44................... Support bolt 45. ..................Thread 46...................Wire body 47....... ............first stop 48...................second stop 49....... ............Wire 4 9b...................sphere · 49c............ ...... • Receiving part 50 ...................Shell 51 .................. .Fixed hole 5 2...................Adsorption pad 52a..................Contact face 53.. ................. Hollow part · · 5 4.................. • Adsorption surface 54a..... .............pad recess 54b..................air suction hole 55........... ........Twisted shape part Φ 5 6................... Accepting surface 5 7............. ...planar portion 58...................Conical portion 5 9................ .. hollow

第42頁 1327986 圖式簡單說明 60......... 60a........ 61......... 62......... 63......... 65......... 70 ......... 71 ......... 72 ......... 73 ......... 7 4......... 80......... 81......... 90 ......... 91 ......... 92 ......... 93 ......... 94-1…… 94-2…… 94- 3…… 9 4 - η...... 95- 1…… 95-2…… 95-3…… .固定部材 風箱 .空氣引導通路 組件本體 螺絲部 空氣引導通路 凹部 螺絲部 防鬆螺帽 基座 氣臂臂節 空手手調 路 通部 引定 吸固 器 § 々卩 々卩 々卩 同同同 0¾ σ<σ 口ts& B1s0ttt\D"0Bf\&"0"° 節節節節節節節 周 同同 同 同 同 同Page 42 1327986 Schematic description 60......... 60a........ 61......... 62......... 63.. ....... 65.........70 .........71 .........72 ......... 73 .. ....... 7 4......... 80......... 81......... 90 ......... 91 . ........ 92 ......... 93 ......... 94-1... 94-2... 94- 3... 9 4 - η... ... 95- 1...... 95-2... 95-3...... .Fixed material bellows. Air guide passage assembly body screw part air guide passage recessed screw anti-loose nut base air arm arm manual hand adjustment The road junction reference squirt § 々卩々卩々卩 is the same with the same 03⁄4 σ<σ mouth ts&B1s0ttt\D"0Bf\&"0"° section of the same week

第43頁 1327986 圖式簡單說明 9 5 - η................調節器 96 ...................真空管 97 ...................真空管 98 ...................空氣壓力計 99 ...................空氣壓力計 100 .................. 真空管 101 .................. 真空管 102 ...................空氣壓力計 103 ...................空氣壓力計 104 .................. •主調節器 鲁 104a·.· . ·.............主調節器 104b..................主調節器 105 ...................空氣吸引源 106a............... •空氣壓力計 106b................空氣壓力計 110 ..................••調節器 111 .................. 真空管 112 .................. 真空管 114.................. 真空管 1 15a...................主調節器 籲 1 15a...................主調節器 120 .................. •傾斜面 121 .................. •傾斜面 122 ...................頂點Page 43 1327986 Schematic description 9 5 - η................ Regulator 96 ................... Vacuum tube 97 ...................vacuum tube 98 ...................air pressure gauge 99 .... ...............air pressure gauge 100 ..................vacuum tube 101 ........... ....... vacuum tube 102...................air pressure gauge 103 .................. Air Pressure Gauge 104 .................. • Main Regulator Lu 104a·.· . . . ....... Master Regulator 104b..................main regulator 105...................air suction source 106a.... ........... • Air pressure gauge 106b................air pressure gauge 110 .............. ....••Regulator 111 .................. Vacuum tube 112.................. Vacuum tube 114. ................. Vacuum tube 1 15a...................Main regulator called 1 15a..... ..............Main regulator 120 .................. • Inclined surface 121 .......... ........ • Inclined surface 122 ................... vertex

第44頁 1327986 圖式簡單說明 123 ...................頓角頂點 124 .................. •凸狀體 125 ...................筒狀曲面本體 126 .................. •凸狀體 127 ...................突起帶體 128 ...................突起 ΙΙΙΙΙ··ΙΙΙΙΙ 第45頁Page 44 1327986 Schematic description 123......................................................................................................................................................................... • convex body 125 ................... cylindrical curved body 126 .................. • convex Body 127 ...................protrusion band 128 ...................protrusion ΙΙΙΙΙ··ΙΙΙΙΙ 45 pages

Claims (1)

13279861327986 第93111648號申請專利範面修正本 1· 一種基板吸附裝置,其具備: 96/4/21Patent No. 93111648 Patent Application Revision 1 1. A substrate adsorption device having: 96/4/21 ΜΜ 護殼:筒狀的中空形成;及 吸附墊:設於前述護殼之中空狀内可上下移動,且可於與護殼軸十字交 叉的方向能搖動頭部;及 吸附墊支撐部材:在前述護殼内,且設有與前述空氣引導通路用以彈性 支持吸附墊;及 吸引裝置:進行上述吸附墊支撐部材的空氣引導通路的連結以進行吸引 動作;及 停止杯.依吸引裝置的吸引動作來限制上述吸附塾的下降; 由以上各元件所構成為其特徵者。 2.如申請專利範圍第丨.項所述之基板吸附裝置,其中所述依吸引裝置的吸引 動作來限制上舰_的下降時,亦矯正吸__斜成水平狀態為其特 徵者。 3·如申請專利範圍第丨項所述之基板吸附裝置,其巾所述之靖墊具有一外 徑較護殼的開d部大的觸部.,因該韻部兼作停止桿用,故吸引裝置的 吸引動作進行_時,上述護殼關口端亦絲關騎墊的下降吸附 部利用與護殼開口端的面接觸橋正吸附塾的傾斜成水平狀態為其特徵者, 4.如申請專利範圍第丨項所述之基板吸附裝置,其中所述之停止桿在護殼内a casing: a hollow hollow body; and an adsorption pad: disposed in a hollow shape of the casing to move up and down, and can swing the head in a direction crossing the casing axis; and the adsorption pad supporting member: in the foregoing The air guiding passage is provided in the casing for elastically supporting the adsorption pad; and the suction device is configured to perform the suction of the air guiding passage of the adsorption pad supporting member to perform the suction operation; and stopping the cup. The suction action of the suction device To limit the decrease of the above adsorption enthalpy; the above components are characterized as being characteristic. 2. The substrate adsorbing device according to claim </RTI> wherein the suctioning action of the suction device restricts the lowering of the upper ship _, and the slanting horizontal state is also corrected. 3. The substrate adsorption device according to claim 2, wherein the lining pad has a contact portion having an outer diameter larger than that of the opening d of the sheath, and the rhyme portion serves as a stop rod, When the suction action of the suction device is performed, the descending adsorption portion of the cover of the sheath is also characterized by the horizontal contact with the surface of the open end of the sheath. The substrate adsorption device of the above aspect, wherein the stop rod is inside the sheath 的吸附墊的底部設有具平面狀吸附面的吸附部,吸引裝置的吸引動作進行 的同時用吸附面限制上述吸附墊的下降’吸附部的底部利用與吸附面的接 觸矯正吸附墊的傾斜成水平狀態為其特徵者。 .如申請專利細第1項所述之基板吸附裝置,其中所述之賴塾係由具有 較5蔓设的前端更突出的平面狀上形成吸著面的吸附部;及與吸附部一體 成形與羞贿端部的内壁面至少有3點支持接觸的接觸面部所成為其特徵 者。 如申4專利範圍第5項所述之基板吸附裝置,其中所述之接觸面部,其係 由與護殼的内壁面的圓周方向的接觸曲面所形成為其特徵者。 .如申請專利範D第5項所述之基板吸附裝置,其情述之接觸面,其在護 殼的内壁面對應·方向的線接觸剖面形成三角形的突起部為其特徵者。 .如申請專概_ 5項所述之基板吸附裝置,其中所述之接觸面部,其在 護殼的内壁面對應周圍方向的線接觸剖面形成半球狀的突起部為其特徵 者。 如申请專利範園第i項所述之基板吸附裝置,其中所述之接觸面,為在護 殼的内壁面對應周圍方向具有三個以上的點接觸所形成突起部為其特徵 者。 如申請專利範@第8項所述之基板吸附裝置,其情述之筒塾,係保 持吸附墊不自遵殼的前端中空部拔出而利用吸附塾固定部材將之保持在 前端中空部為其特徵者。 %斗4 •如申請專利範圍第10項所導之基板吸附裝置,其中所述吸附墊固定部 材’係由設在吸附墊的第一支撐部,及設於護殼内吸附墊固定部材的空氣 引導通路的第二支撐部,及連結第一、第二支撐部間的線狀連結部材所構 成為其特徵者。 L如申請專利範圍第10項所述之基板吸附裝置,其中所述連結部材係由 吸附墊往復水平地調整對吸附墊支撐部的所施力的細繩所成,藉該細繩缚 綁的情況來調整產生的力量為其特徵者。 丨.如申請專利範圍第10項所述之基板吸附裝置,其中所述之連結部材,· 係由具有有扭曲剛性可防止吸附墊回轉的鋼絲所構成,該鋼絲的兩端固定 在第一及第二支撐部為其特徵者。 .如申明專利範圍第1項所述之基板吸附裝置,其中上述護殼上吸附塾及 附塾支擇部-體沿著護殼内面移動’可調整自前端面突出的吸瞻的吸附 面高度的具有較護殼的前端更突出的平面狀上形成吸附面的吸附部;及 與吸附部-體卿與護殼前端部_壁面至少有3點支持接觸的測面部_ 所成設有吸_,而吸定部材與前舰_峡手㈣成一體並使 之在刖述漠殼之刖述中空形狀·内移動,調整相對於前述護殼端部之吸附墊 的吸附面南度調整裝置為其特徵者。 如申請專利範圍第14項所述之基板吸附裝置,其中所述之高度調整裝 置係由護殼中空部内壁面内所形成的螺絲部、及藉由螺合於該螺絲且可回 轉的吸_支#料無謂钱—体的可顧糾上下鶴的環狀部 _*· ....- ~構成為其特徵者 如申請專利範圍第1項所述之基板吸附裝置,其中所述之吸附塾支撐部 村係由密貼於吸附墊的内面的蛇腹屈曲部上部所形成的橡㈣軟管部材 所構成、及 利用上述吸引裝置的吸引動作時的負壓,因為蛇腹狀屈曲部的收縮, 吸附在吸附對象基板的吸附墊在護殼内下降來決定吸附對象基板在基準 平面的位置為其特徵者。The bottom of the adsorption pad is provided with an adsorption portion having a planar adsorption surface, and the suction operation of the suction device is performed while restricting the lowering of the adsorption pad by the adsorption surface. The bottom of the adsorption portion corrects the inclination of the adsorption pad by the contact with the adsorption surface. The horizontal state is its characteristic. The substrate adsorption device according to the first aspect of the invention, wherein the lining is formed by an adsorption portion having a absorbing surface formed in a plane protruding more than a front end of the vine; and integrally formed with the adsorption portion A contact surface having at least three points of support contact with the inner wall surface of the brittle end is a feature. The substrate adsorption device according to claim 5, wherein the contact surface portion is characterized by a contact curved surface with a circumferential direction of an inner wall surface of the sheath. The substrate adsorption device according to claim 5, wherein the contact surface of the substrate is characterized in that a triangular contact portion is formed in a line contact cross section corresponding to the inner wall surface of the casing. The substrate adsorbing device according to the above aspect, wherein the contact surface portion is characterized in that a line-shaped contact portion corresponding to a peripheral direction of the inner wall surface of the sheath forms a hemispherical projection. The substrate adsorbing device according to the invention, wherein the contact surface is characterized in that the inner surface of the casing has three or more point contacts formed corresponding to the peripheral direction of the inner wall surface of the casing. For example, in the substrate adsorption device described in the above-mentioned patent application, the cartridge is configured such that the adsorption pad is not pulled out from the hollow end of the front end of the casing, and is held in the hollow portion of the front end by the adsorption 塾 fixing member. Its characteristics. The substrate adsorption device according to claim 10, wherein the adsorption pad fixing member is composed of a first support portion provided on the adsorption pad, and an air provided in the adsorption pad fixing portion of the sheath. The second support portion of the guide passage and the linear connecting member connecting the first and second support portions are characterized by the configuration. The substrate adsorption device according to claim 10, wherein the connecting member is formed by reciprocating horizontally adjusting a force applied to the support portion of the adsorption pad by the adsorption pad, by which the string is tied The situation to adjust the power generated is its characteristic. The substrate adsorption device according to claim 10, wherein the connecting member is composed of a steel wire having a twisting rigidity to prevent the adsorption pad from rotating, and both ends of the steel wire are fixed at the first and The second support portion is characterized by it. The substrate adsorption device according to claim 1, wherein the adsorption enthalpy on the sheath and the movement of the attachment portion-body along the inner surface of the sheath can adjust the height of the suction surface protruding from the front end surface. An adsorption portion having an adsorption surface formed on a flat surface having a more protruding front end; and a measuring surface having at least three points of contact with the adsorption portion-body and the front end portion of the sheath _ the wall is provided with suction _ And the suction member is integrated with the front ship _ Xia Shou (4) and moves inside the hollow shape and the inside of the hollow shell, and the south side adjusting device for adjusting the adsorption surface of the adsorption pad at the end of the protective shell is Its characteristics. The substrate adsorption device according to claim 14, wherein the height adjustment device is a screw portion formed in an inner wall surface of the hollow portion of the sheath, and a retractable suction rod screwed to the screw The material adsorption device described in claim 1, wherein the adsorption device is The support portion is composed of an aluminum (four) hose member formed on the upper portion of the bellows buckling portion adhered to the inner surface of the adsorption pad, and a negative pressure at the time of suction operation by the suction device, because of the contraction of the bellows-shaped buckling portion, adsorption The adsorption pad of the substrate to be adsorbed is lowered in the casing to determine the position of the substrate to be adsorbed on the reference plane.
TW093111648A 2003-05-06 2004-04-26 Substrate absorption device TWI327986B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003128054 2003-05-06
JP2003192141 2003-07-04
JP2003192188 2003-07-04

Publications (2)

Publication Number Publication Date
TW200508125A TW200508125A (en) 2005-03-01
TWI327986B true TWI327986B (en) 2010-08-01

Family

ID=33436989

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111648A TWI327986B (en) 2003-05-06 2004-04-26 Substrate absorption device

Country Status (4)

Country Link
JP (1) JP4553841B2 (en)
KR (1) KR101055911B1 (en)
TW (1) TWI327986B (en)
WO (1) WO2004100254A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI380944B (en) * 2004-11-24 2013-01-01 Ckd Corp A floating unit having a tilting function, and a floating device
JP4895518B2 (en) * 2005-03-22 2012-03-14 オリンパス株式会社 Substrate holding device and substrate holding method
JP4899357B2 (en) * 2005-07-01 2012-03-21 株式会社Ihi Substrate adsorption device
JP4920209B2 (en) * 2005-07-15 2012-04-18 シーケーディ株式会社 Plate workpiece transfer equipment
JP2007048828A (en) * 2005-08-08 2007-02-22 Murata Mfg Co Ltd Deformation processing apparatus and deformation processing method of plate-shaped structure
JP4655272B2 (en) * 2005-08-19 2011-03-23 株式会社安川電機 Substrate adsorption device and substrate transfer device using the same
JP4790395B2 (en) * 2005-12-02 2011-10-12 オリンパス株式会社 Substrate adsorption mechanism and substrate inspection device
JP2008302487A (en) * 2007-06-11 2008-12-18 Olympus Corp Substrate sucking device, substrate transporting device, and outside appearance inspecting device
JP4787872B2 (en) * 2008-10-16 2011-10-05 東京エレクトロン株式会社 Substrate transfer processing equipment
JP5815959B2 (en) * 2011-02-08 2015-11-17 近藤工業株式会社 Nozzle unit in N2 gas purge device
KR101841534B1 (en) 2011-11-21 2018-03-23 한화테크윈 주식회사 Panel Stransfer Apparatus
KR101610215B1 (en) * 2012-04-26 2016-04-07 가부시키가이샤 아이에이치아이 Conveyance device
JP6135066B2 (en) * 2012-08-10 2017-05-31 シンフォニアテクノロジー株式会社 Purge nozzle unit, purge device, load port
JP6218395B2 (en) * 2013-03-05 2017-10-25 日置電機株式会社 Adsorption mechanism and adsorption device
CN103646905A (en) * 2013-12-11 2014-03-19 中国电子科技集团公司第二研究所 Wafer identification, rotation and positioning adsorption table
JP2015153970A (en) * 2014-02-18 2015-08-24 キヤノン株式会社 Substrate holding mechanism, substrate transport apparatus and substrate transport method
JP6316181B2 (en) * 2014-12-18 2018-04-25 東京エレクトロン株式会社 Substrate holding stage
CN104708461B (en) * 2015-03-03 2017-07-07 西北工业大学 A kind of simple holding unit of large-scale wallboard
TWI630059B (en) * 2015-12-25 2018-07-21 日商三星鑽石工業股份有限公司 Substrate adsorption device and workbench
JP6655514B2 (en) * 2016-09-21 2020-02-26 東京エレクトロン株式会社 Substrate inspection method and substrate inspection device
JP6327374B2 (en) * 2017-02-21 2018-05-23 シンフォニアテクノロジー株式会社 Purge nozzle unit, load port
JP6804155B2 (en) * 2017-03-13 2020-12-23 東レエンジニアリング株式会社 Board floating transfer device
JP6519897B2 (en) * 2018-04-10 2019-05-29 シンフォニアテクノロジー株式会社 Purge nozzle unit, load port
JP7210896B2 (en) * 2018-04-23 2023-01-24 東京エレクトロン株式会社 SUBSTRATE PLACEMENT DEVICE AND SUBSTRATE PLACEMENT METHOD
JP6882698B2 (en) * 2019-04-24 2021-06-02 シンフォニアテクノロジー株式会社 Purge nozzle unit, load port
WO2022225074A1 (en) * 2021-04-20 2022-10-27 주식회사 윈텍오토메이션 Vacuum gripper device for separating superhard insert product from cvd coating tray

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6094487U (en) * 1983-11-30 1985-06-27 東芝機械株式会社 Wafer adsorption device
JPS63136636U (en) * 1987-02-27 1988-09-08
JPH05318368A (en) * 1992-05-18 1993-12-03 Tokyo Electron Yamanashi Kk Suction conveying device
JP3122590B2 (en) * 1994-12-28 2001-01-09 株式会社三協精機製作所 Suction pad
JPH08236597A (en) * 1995-02-27 1996-09-13 Hitachi Ltd Transfer device
JP4106450B2 (en) * 2001-02-07 2008-06-25 日産自動車株式会社 Adsorption holding device

Also Published As

Publication number Publication date
JPWO2004100254A1 (en) 2006-07-13
JP4553841B2 (en) 2010-09-29
WO2004100254A1 (en) 2004-11-18
TW200508125A (en) 2005-03-01
KR20060008319A (en) 2006-01-26
KR101055911B1 (en) 2011-08-10

Similar Documents

Publication Publication Date Title
TWI327986B (en) Substrate absorption device
CN1882425A (en) Vacuum suction head, and vacuum suction device and table using the same
US7314344B2 (en) Substrate-transporting device
US20160243707A1 (en) Conveying hand and lithography apparatus
JP2016526299A (en) Apparatus and method for bonding substrates
TW200823535A (en) Apparatus for attaching substrates
JP2020122222A (en) Film forming apparatus and method of manufacturing organic EL display device using the same
KR20040086365A (en) Substrate sucking device
CN102870204A (en) Transfer device for plate-like member, and suction pad
US7918640B2 (en) Position correcting apparatus, vacuum processing equipment and position correcting method
CN109143642A (en) Holding meanss, positioning device and laminating apparatus
EP3306377A2 (en) Method and apparatus for assembling multilayer microlens array elements
KR102177156B1 (en) robot and substrate processing apparatus including the same
US20060219688A1 (en) Substrate transfer apparatus, method of transferring substrate, and method of manufacturing electro-optical device
KR20140041819A (en) Contact exposure device and contact exposure method
CN100362643C (en) Substrate suction device
JP2007083322A (en) Substrate suction device, substrate support, substrate conveying device, and glass substrate conveying robot
KR101838681B1 (en) Support chuck and apparatus for treating substrate
KR20080051604A (en) Lift pin and supporting pin
US20210159468A1 (en) Display panel and method of manufacturing the same
CN106695859A (en) Suction nozzle structure
US9653329B2 (en) Semiconductor treating device and method
KR20210005371A (en) Substrate align unit and substrate processing apparatus
JP6142214B2 (en) Proximity exposure apparatus and proximity exposure method
JP2010118480A (en) Substrate chucking device and substrate inspecting apparatus

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees